KR101058185B1 - Chamfering machine for flat panel display and processing method - Google Patents

Abstract

Disclosed are a chamfering machine for a flat panel display and a chamfering processing method thereof. The chamfering device for a flat panel display of the present invention includes a chamfering processing unit provided between a substrate loading unit and a substrate unloading unit to chamfer the corners and sides of the substrate. At least one stage, the substrate is seated and supported on the upper surface; And a first chamfering wheel for chamfering the edge of the first side of the substrate, and a second chamfering machine for chamfering the corners of both sides of the first surface of the substrate and mutually spaced from the first chamfering wheel. It characterized in that it comprises a grinder having a wheel. According to the present invention, it is possible to further reduce the tact time required for the chamfering operation than in the prior art, thereby improving productivity.

Description

Chamfering machine for flat panel display and its chamfering method {GRINDING APPARATUS AND METHOD FOR GLASS}

The present invention relates to a flat display chamfering machine and a chamfering processing method thereof, and more particularly, a flat surface that can further reduce the tact time required during the chamfering operation compared to the prior art to improve productivity Chamfering for display and chamfering processing method thereof.

Recently, the flat panel display (FPD) has begun to emerge as the electronic display industry is rapidly developing among the semiconductor industry.

A flat panel display (FPD) is an image display device that is thinner and lighter than a cathode ray tube (CRT), which has been mainly used as a display for a TV or a computer monitor, and includes a liquid crystal display (LCD, liquid). crystal displays, plasma display panels (PDPs), organic light emitting diodes (OLEDs), and the like.

Hereinafter, a flat panel display (FPD) including an LCD, a PDP, an OLED, and the like will be described as a substrate.

The substrate is usually rectangular in shape and made of glass. Thus, corner cuts on four corners (edges) of the substrate and edge cuts and edge cuts on the short and long edges of the substrate, i.e. the corners and sides of the substrate Only the chamfering process of the chamfering process can remove the sharpness of the glass itself, thus facilitating the transfer and operation between processes and preventing safety accidents. Chamfering machine is used for this chamfering process.

In the conventional chamfering machine, there is an example in which all four corners, short edges, and long sides of the substrate are processed through one chamfering wheel. However, when machining all four corners, short edges and long edges by using one chamfering wheel as described above, there was a problem in that it takes a lot of tact time because continuous operation cannot be performed.

In view of this problem, a chamfering machine capable of continuously processing four corners, short edges, and long edges of a substrate has been disclosed.

1 is a schematic configuration diagram of a conventional chamfering machine.

As shown in this figure, the conventional chamfering machine, the substrate loading unit 10 and the substrate unloading unit which are disposed on both sides with the chamfering processing unit 20 in which the chamfering processing on the substrate (G) proceeds, 40.

Chamfering processing unit 20, the substrate (G) is seated, the first stage 21 is disposed in series along a virtual work line connecting the substrate loading unit 10 and the substrate unloading unit 40 and First alignment camera 25a and second alignment for aligning the second stage 22 and the substrate G seated on the first stage 21 and the second stage 22. The camera 25b, the 1st chamfering wheel 26a, and the 2nd chamfering wheel 26b are provided.

The first alignment camera 25a and the first chamfering wheel 26a perform corner processing on both sides of the front surface of the substrate G, short edge processing, and corner processing on both sides of the rear surface in the direction in which the substrate G travels. The 2nd alignment camera 25b and the 2nd chamfering wheel 26b are in charge of the long side edge process of the board | substrate G. As shown in FIG.

With this configuration, when the substrate G to be chamfered is seated from the substrate loading unit 10 to the first stage 21, firstly, based on the image information photographed by the first alignment camera 25a, The substrate G is aligned to the right position by the first stage 21. Subsequently, the substrate G is based on an operation in which the first stage 21 moves toward the first chamfering wheel 26a or the first chamfering wheel 26a moves with respect to the first stage 21. The corners on both sides of the front side, the short side edges, and the corners on the rear side of the substrate G are sequentially processed with respect to the traveling direction of.

Then, a separate pick up robot (not shown) picks up the substrate G on the first stage 21, rotates it substantially 90 degrees, and moves it onto the second stage 22. Thereafter, after the alignment of the substrate G is performed on the second stage 22 again, the long side edge of the substrate G is processed by the second chamfering wheel 26b. The completed substrate G is taken out to the substrate unloading unit 40.

Such conventional chamfering machine processes the front side both corners, the short side edges, and the rear both side corners of the substrate G in the first stage 21 when processing the long side edge of the substrate G on the second stage 22. As a result, the tact time can be reduced compared to a chamfer (not shown) provided with one chamfering wheel (not shown). In other words, by implementing the first stage 21 and the second stage 22 in series on the chamfering processing unit 20, it is possible to inline the chamfering operation to reduce the tact time.

By the way, in the conventional chamfering machine, when transferring the substrate (G) from the first stage 21 to the second stage 22, a pickup robot must be used to the substrate (G) on the second stage (22) There is a problem in that the alignment operation for the substrate has to be performed again, and it is rather inefficient to reduce the tact time due to the transfer time by the pick-up robot and the alignment operation time for the substrate G on the second stage 22. .

In the conventional chamfering machine, since the first stage 21 and the second stage 22 and the first chamfering wheel 26a and the second chamfering wheel 26b have mutually arranged arrangement structures, If a failure occurs in one, there is a problem that the entire equipment can not be operated is a factor that reduces the productivity.

Accordingly, the present applicant has not been disclosed yet, but by arranging a plurality of stages spaced apart from each other in a direction crossing the virtual work line connecting the substrate loading unit and the substrate unloading unit, when the chamfering process for the substrate (G) Tact time can be reduced compared to the prior art, and furthermore, the problem of the conventional chamfer that the entire equipment can not be operated in the event of failure of any one of a plurality of stages (not shown) and a plurality of chamfering wheels (not shown) Has been filed with the Korean Patent Office for the flat surface chamfering device that can improve the productivity by improving the.

By the way, in the case of the technique filed last time, the tact time can be significantly reduced compared to the conventional technique shown in Fig. 1, but chamfered for corner processing, short side edge processing and long side edge processing for four corners of the substrate. There is an unavoidable time for the substrate to wait in the course of operating the machining wheel.

In other words, the chamfering process for the substrate proceeds in the order of corner processing on both sides of the front surface of the substrate, short edge processing of the substrate, corner processing on both sides of the rear surface of the substrate, and long side edge processing of the substrate after the rotation of the substrate. There is a need to further reduce the tact time by reducing such waiting time as there is a time during which the substrate has to wait for the time that the chamfering wheel is to be aligned when switching to and vice versa.

An object of the present invention is to provide a flat display chamfering machine and a chamfering processing method that can reduce the tact time required during the chamfering operation can improve the productivity.

The object includes, according to the present invention, a chamfering processing unit provided between a substrate loading unit and a substrate unloading unit to chamfer the corners and sides of the substrate. The processing unit includes at least one stage on which a substrate is seated and supported by an upper surface thereof; And a first chamfering wheel for chamfering the edge of the first side of the substrate and a first chamfering wheel and a first chamfering process for chamfering the corners on both sides of the first surface of the substrate. It is achieved by a chamfering machine for a flat display comprising a grinder having a wheel for chamfering.

Here, the first chamfering wheel and the second chamfering wheel may be spaced apart from each other along a virtual work line connecting the substrate loading unit and the substrate unloading unit.

The second chamfering wheel is moved so that the second chamfering wheel moves to a working position for chamfering of corners on both sides of the first surface of the substrate when chamfering the first edge of the edge by the first chamfering wheel. The control unit may further include a control unit.

The first chamfering wheel may be chamfered to the corners on both sides of the second surface of the substrate, and the second chamfering wheel may be chamfered to the edges of the second sides of the substrate. The second chamfering wheel may be controlled to move the second chamfering wheel to a working position for chamfering of the second side edge when chamfering the corners of both sides of the second surface by the first chamfering wheel. Can be.

The first and second sides of the substrate may be both short sides and both long sides of the substrate, and the first and second sides of the substrate may be front and side corners and rear and rear corners of the substrate, respectively. Each of the first chamfering wheel and the two second chamfering wheels is disposed such that one region of the outer circumferential surface overlaps each other along the Z-axis so that both front corners of the front surface of the substrate, rear corners of the rear surface of the substrate, short edges of the substrate, and the It may be provided by a plurality of multi wheels for processing all the long edges of the substrate.

The control unit may control the second chamfering wheel to move to a work position for chamfering of corners on both sides of the first surface of the substrate when chamfering the first side edge by the first chamfering wheel. have.

The controller may control the first chamfering wheel to move to a work position for chamfering the first side edges when chamfering the corners of both sides of the first surface by the second chamfering wheel.

The grinder may further include an alignment camera for aligning the substrate mounted on the stage, and the at least one stage may be configured to connect the substrate loading unit and the substrate unloading unit. May be two first and second stages disposed along a virtual Y axis arranged horizontally on an X axis, which is a work line of the work line, and the grinder may be a shared grinder shared by each of the first and second stages. The alignment camera, the first chamfering wheel, and the second chamfering wheel may be provided two by one for the stage.

The grinder may include: a camera moving support unit movably supporting the two alignment cameras such that the two alignment cameras can be moved individually or collectively along the Y axis; A first wheel movement support part for movably supporting the two first chamfering wheels so that the two first chamfering wheels can be moved individually or collectively along the Y axis; And a second wheel moving support part for movably supporting the two second chamfering wheels so that the two second chamfering wheels can be moved individually or collectively along the Y axis.

The grinder may include: a first wheel elevating unit coupled to the first wheel moving support and configured to elevate the two first chamfering wheels on a Z axis; And a second wheel elevating unit coupled to the second wheel moving support unit for elevating the two second chamfering wheels on the Z axis.

The stage includes: at least one turntable for sucking and rotating the substrate; And a plurality of variable tables disposed at an outer side of the turntable to adsorb and support the substrate together with the turntable, and accessible and spaced apart from the turntable so as to correspond to the substrate size.

Four variable tables may be provided symmetrically with each other at an outer surface of the turntable having a circular shape, and a side of the variable table may have an incision that prevents the variable table from colliding with the turntable when approaching the turntable. The turntable and the variable table may have a plurality of vacuum holes for vacuum adsorption of the substrate, and a plurality of vacuum holes provided around the plurality of vacuum holes, and may have a predetermined depth downward from the surfaces of the turntable and the variable table. A vacuum suction line groove may be formed by forming a line having a predetermined shape in the recessed state to double the vacuum suction area of the substrate.

The substrate loading unit and the chamfering processing unit, and the chamfering processing unit and the substrate unloading unit, respectively provided in the region of the X-axis, Y-axis and Z-axis transfer to transfer the substrate may be further included. The transfer device includes: a plurality of basic gripping units holding the substrate by partially supporting a lower surface of the substrate in contact with both side surfaces of the substrate; And a safety gripping unit provided around the basic gripping unit to prevent the substrate from being separated from the basic gripping unit during the transfer of the substrate.

The plurality of basic gripping units may be provided in two on each side of the substrate so as to be accessible and spaced apart from each other, the safety gripping unit is to support the front and bottom of one side of the substrate in the direction in which the substrate is transported. It can be provided so that it can be rotated at the position.

It may further include a chamfering measurement unit provided in the substrate unloading unit for measuring the chamfering amount for the substrate chamfering is completed.

Controlling the first chamfering wheel to move the first chamfering wheel to a working position for chamfering of the first side edge when chamfering the corners of both sides of the first surface by the second chamfering wheel; The control unit may further include.

On the other hand, the above object, according to the present invention, the step of the first side edge of the substrate is chamfered by the first chamfering wheel; And a step of chamfering the corners of both sides of the first surface of the substrate by the second chamfering wheels spaced apart from each other with respect to the first chamfering wheels. do.

Here, the method may further include chamfering the corners on both sides of the second surface of the substrate by the first chamfering wheel.

Rotating the substrate; And chamfering the second side edge of the substrate by the second chamfering wheel.

The first side and the second side may be both short sides and both long sides of the substrate, and the first and second surfaces may be front corners and rear corners of the substrate.

The second chamfering wheel may be moved to a work position for chamfering of corners on both sides of the first surface of the substrate when chamfering the first side edge by the first chamfering wheel. .

The first chamfering wheel may be moved to a work position for chamfering the first edge of the first chamfered edge when the chamfering process is performed on both side corners of the first surface by the second chamfering wheel.

According to the present invention, it is possible to further reduce the tact time required during the chamfering operation than in the prior art can improve the productivity.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

2 is a perspective view of a substrate for explaining a portion to be chamfered.

Prior to the description with reference to the drawings, the substrate to be described below means a TFT-LCD (Thin Film Transistor-Liquid Crystal Display) substrate, but since the scope of the present invention is not limited to the plasma display substrate (PDP, Plasma) It can also be applied to flat panel displays (FPDs) such as display panels, organic light emitting diodes (EL), and solar cells. However, hereinafter, the TFT-LCD substrate will be described as an example for convenience of description.

For reference, the TFT-LCD substrate G1 is made of two layers in which a top plate and a bottom plate are bonded together with a liquid crystal interposed therebetween, and a section in which the top plate does not overlap is usually present on the top surface of the bottom plate. However, in FIG. 2, the TFT-LCD substrate G1 is schematically illustrated in an approximately rectangular plate shape for convenience of illustration and description.

Referring to this figure, through the chamfering of the present embodiment, the substrate G1 has four corners, namely, both front corners (see enlarged A) and rear both corners (see enlarged B), and both short side edges (see enlarged C). And both long side edges (see enlarged D) are chamfered.

As will be described later in detail, the chamfering method in the present embodiment, the short edge edge processing of the substrate G1, the front side corner processing of the front surface of the substrate G1, the both sides corner processing of the rear surface of the substrate G1, and the long side of the substrate G1 Follow the order of edge machining. However, since the scope of the present invention is not limited thereto, the order of chamfering may be sufficiently changed according to the manufacturing process of the manufacturer as long as it can reduce the tact time.

3 is a schematic plan view of a chamfering device for a flat display according to an embodiment of the present invention, FIGS. 4 and 5 are partially enlarged perspective views of FIG. 3, and FIG. 6 is a planar display according to an embodiment of the present invention. It is a flowchart of the chamfering processing method, and FIG. 7 (a)-(f) are the block diagrams which showed the chamfering processing method for a flat display step by step.

3 to 5, the planar display chamfering device according to an embodiment of the present invention includes a substrate loading unit 210 on which a substrate G1 of a chamfering processing object is loaded. , A chamfering processing unit 220 in which chamfering is performed on the substrate G1, and a substrate unloading unit 240 in which the chamfering processing is completed, and the substrate G2 is unloaded.

Since both the substrate loading unit 210 and the substrate unloading unit 240 serve to transfer the substrates G1 and G2, the substrate loading unit 210 and the substrate unloading unit 240 may be applied as a roller type. That is, the substrate loading unit 210 and the substrate unloading unit 240 may have a structure in which a plurality of rollers 212 and 242 rotatably supporting the substrates G1 and G2 are respectively coupled to the plurality of rotation shafts 211 and 241. Can be.

However, since the scope of the present invention is not limited thereto, the substrate loading unit 210 and the substrate unloading unit 240 may be replaced with a conventional conveyor type or a stage type. Do. As such, when the substrate loading unit 210 and the substrate unloading unit 240 are applied as a conveyor type or a stage type, an air floating module (not shown) for applying up the substrates G1 and G2 is applied together. Would be advantageous.

The plurality of rollers 212 and 242 is preferably made of a flexible material so that scratches do not occur on the substrates G1 and G2. The plurality of rotating shafts 211 and 241 may be rotated together by a single motor to facilitate the control of the rotational speed. However, the plurality of rotating shafts 211 and 241 each rotate by the individual motor separately. You can also

The substrate loading unit 210 is provided with an alignment unit 215 for performing an alignment operation on the substrate G1 to be entered. The alignment unit 215 serves to align the substrate G1 correctly by pressing both sides of the substrate G1 by an operation of approaching and separating each other.

Unlike the substrate unloading unit 240, the substrate loading unit 210 further includes a plurality of entrance detection sensors 214 along the direction in which the substrate G1 enters. The plurality of entrance detection sensors 214 generates a detection signal for reducing or stopping the speed of the rotation shaft 211 based on the entry position of the substrate G1.

The substrate unloading unit 240 is further provided with a chamfering measurement unit 250. Chamfering measurement unit 250 serves to measure the chamfering for the substrate (G2) is completed chamfering processing through the chamfering processing unit 220.

With respect to the substrate G2 whose chamfering amount is measured by the chamfering measuring unit 250, if the chamfering is erroneously or if the chamfering amount is less than the reference value, the substrate is destroyed or The chamfering amount is fed back toward the chamfering wheels 225 and 227 so that the machining may proceed. In the present exemplary embodiment, the chamfering measurement unit 250 is provided in the substrate unloading unit 240, but in some cases, the chamfering measurement unit 250 may be provided in the chamfering processing unit 220.

In the substrate loading unit 210 and the substrate unloading unit 240, a plurality of lift pins 213 and 243 for raising a predetermined height up the substrates G1 and G2 with respect to the plurality of rollers 212 and 242 are provided with a plurality of rollers ( It is further provided between 212 and 242.

The lift pins 213 and 243 are provided in an area between the substrate loading unit 210 and the chamfering processing unit 220, and an area between the chamfering processing unit 220 and the substrate unloading unit 240. G2) is operated in conjunction with the operation of the transfer (280a, 280b) for feeding. That is, the lift pins 213 and 243 may have transfers 280a and 280b from the substrate loading unit 210 to the chamfering processing unit 220 or from the chamfering processing unit 220 to the substrate unloading unit 240. When the G2) is transferred, the operation is up.

Prior to the description of the chamfering processing unit 220, the transfer (280a, 280b) will be described first.

As described above, the transfers 280a and 280b are provided in the region between the substrate loading unit 210 and the chamfering processing unit 220 and the region between the chamfering processing unit 220 and the substrate unloading unit 240. The substrate G1 on the 210 is transferred to the first and second stages 260a and 260b and the substrate G2 on the first and second stages 260a and 260b to the substrate unloading unit 240. Play a role.

In this embodiment, the structure of the transfer (280a, 280b) provided in the region between the substrate loading unit 210 and the chamfering processing unit 220, and the region between the chamfering processing unit 220 and the substrate unloading unit 240 and The operations are all the same. Accordingly, for the convenience of illustration and description, the same reference numerals are given to detailed configurations of the transfers 280a and 280b.

The transfer members 280a and 280b partially support the lower surfaces of the substrates G1 and G2 while being in contact with both sides of the substrates G1 and G2 to hold the substrates G1 and G2. And a safety gripping unit 285 provided around the basic gripping unit 281 and preventing the substrates G1 and G2 from being separated from the basic gripping unit 281 during the transfer process of the substrates G1 and G2. Equipped.

In the present exemplary embodiment, four basic gripping units 281 are provided on both sides of the substrates G1 and G2, and the safety gripping units 285 are provided with the substrates G1 and G2 in the direction in which the substrates G1 and G2 are transferred. One side of the G2) is rotatably provided at the position to support the front and lower surfaces. However, the scope of the present invention is not limited thereto.

In addition, in order to hold all substrates of various sizes, the basic gripping units 281 are provided to be accessible and spaced apart from each other. In addition, the transfers 280a and 280b themselves are substrates on the substrate loading unit 210. X-axis, Y to transfer G1 to the first and second stages 260a and 260b and the substrate G2 on the first and second stages 260a and 260b to the substrate unloading unit 240. It is provided so that a movement to an axis and a Z axis is possible. To this end, the transfers 280a and 280b further include an X-axis driver 291, a Y-axis driver 293, and a Z-axis driver 294. The X-axis driver 291, the Y-axis driver 293, and the Z-axis driver 294 may be implemented by a structure such as a linear motor, a cylinder, or a combination of a motor and a ball screw, but a detailed description thereof will be omitted. do.

On the other hand, the chamfering processing unit 220 substantially chamfers the four corners of the substrate G1 provided from the substrate loading unit 10, the short side edges of the substrate G1, and the long side edges of the substrate G1. (See FIG. 2).

As described above, in the present embodiment, both side short edge edge processing of the substrate G1, both sides corner processing of the front surface of the substrate G1, both sides corner processing of the rear surface of the substrate G1, and both side long edges of the substrate G1. Since the chamfering process proceeds in the order of processing will be described based on the order thereof.

As described above, in the chamfering processing method, there is a situation in which the corner processing is switched from edge processing to vice versa or vice versa, in which case the chamfering wheel (not shown) must be aligned as in the prior art. If the board | substrate G1 does not continue to chamfer continuously and needs to wait for a while, the tact time will inevitably increase by that much. Thus, in the present embodiment, even though a short time, the chamfering processing is not continuously progressed, and by fundamentally blocking the time loss generation that the substrate G1 has to wait, the tact time can be further reduced and the productivity can be improved. I'm doing it.

To this end, the chamfering processing unit 220 of the present embodiment, the first and second stages 260a and 260b on which the substrate G1 is seated and supported on the upper surface, and the first and second spaced apart along the X axis. And a grinder 221 having second chamfering wheels 225 and 227.

In the present embodiment, two first and second stages 260a and 260b are provided along the Y axis. Since the first and second stages 260a and 260b respectively proceed in the chamfering operation in parallel, the tact time can be reduced, thereby improving productivity.

However, since the scope of the present invention is not limited thereto, only one stay may be provided, or three or more stages may be provided. However, when three or more stages are provided, it is sufficient if they have a parallel arrangement along the Y axis.

Like the transfers 280a and 280b described above, the first and second stages 260a and 260b have the same structure and operation, but only in their positions. Accordingly, for the convenience of illustration and description, the same reference numerals are given to detailed configurations of the first and second stages 260a and 260b.

Briefly referring to the first and second stages 260a and 260b, the first and second stages 260a and 260b of the present exemplary embodiment may have a structure that may be mixedly applied to substrates of various sizes.

That is, each of the first and second stages 260a and 260b is disposed at an outer side of the turntable 261 and one turntable 261 for attracting and rotating the substrate G1 and the substrate together with the turntable 261. Four variable tables 263 are provided to adsorb and support G1 and to be accessible and spaced apart from the turntable 261 so as to correspond to all substrates of various sizes.

With respect to the turntable 261 having an approximately square shape and having one at the center, four variable tables 263 are provided symmetrically with respect to the outside of the turntable 261. However, since the scope of the present invention is not limited thereto, the top surface shape of the turntable 261 may be circular or elliptical in addition to the polygonal shape, and the variable table 263 may be symmetrical to each other at the outside of the turntable 261. May be arranged.

If the substrate size of the chamfering target is large, four variable tables 263 should be spaced apart from the turntable 261 so that the entire adsorption area of the turntable 261 and the variable table 263 can be widened. If the substrate size to be processed is small, four variable tables 263 should be approached to the turntable 261. At this time, when the four variable tables 263 are approached with respect to the turntable 261, the sides of the four variable tables 263 should not be collided with the turntable 261, so the sides of the variable tables 263 are cut out. The part 264 is formed. The cutout 264 may have an arc shape, but is not necessarily so.

In addition, a plurality of vacuum holes (not shown) are formed on the surfaces of the turntable 261 and the variable table 263 for vacuum suction of the substrate G1. The vacuum hole is a vacuum suction line groove (not shown) that doubles the vacuum suction area of the substrate G1 by forming a line having a predetermined shape in a state of being recessed downward from the surfaces of the turntable 261 and the variable table 263. It is formed one by one. In this embodiment, the vacuum adsorption line groove (not shown) formed in the turntable 261 is, for example, a pizza (pizza) shape, and the vacuum adsorption line groove (not shown) formed in the variable table 263 has a Korean letter 'A' shape. It may be formed as, but the scope of the present invention is not limited thereto.

On the other hand, the grinder 221 is a part which performs substantial chamfering process with respect to the board | substrate G1 adsorbed and supported by the 1st and 2nd stage 260a, 260b.

In the present embodiment, since two first and second stages 260a and 260b are provided along the Y axis, the grinder 221 is applied as a shared grinder to simplify the equipment. As the grinder 221 is applied as a shared grinder, the two alignment cameras 223, the first chamfering wheel 225, and the second chamfering wheel 227 provided in the grinder 221 are first and first. While selectively moving toward the second stage 260a and 260b, the chamfering operation of the substrate G1 is performed along with the first and second stages 260a and 260b.

However, since the scope of the present invention is not limited thereto, the grinder 221 does not necessarily need to be a shared grinder. That is, the two alignment cameras 223, the first chamfering wheels 225, and the second ones corresponding to the first and second stages 260a and 260b for each of the first and second stages 260a and 260b, respectively. The chamfering wheel 227 may be configured to be provided exclusively.

The grinder 221 includes an alignment camera 223 for aligning the substrate G1 seated on the first and second stages 260a and 260b, and a first and second stage 260a, The first and second chamfering wheels 225 and 227 are disposed to be chamfered with respect to the substrate G1 seated on the 260b, and are spaced apart from each other along the X axis.

Two alignment cameras 223 are provided to photograph two alignment marks formed on one side of the substrate G1. That is, alignment of the substrate G1 is possible only by photographing at least two alignment marks, and intervals of the first chamfering wheel 225 and the second chamfering wheel 227 may be determined based on the alignment work on the substrate G1. In this embodiment, two alignment cameras 223 are provided.

The first chamfering wheel 225 performs chamfering on both side short edges of the substrate G1 and the rear corner processing of the substrate G1, and the second chamfering wheel 227 has a front corner of the substrate G1. Since the process and the chamfering process with respect to the long side edge of both sides of the board | substrate G1 are performed, it arrange | positions two by the same as the aligning camera 223. As shown in FIG.

Looking at the structure of the first and second chamfering wheels (225, 227), as shown in Figure 5, the first and second chamfering wheels (225,227) are arranged so that one region of the outer peripheral surface overlap each other along the Z axis With a plurality of first to fourth multi-wheels 225a to 225d, 227a to 227d, multi wheels for processing all four corners of the substrate G1, the short side edge of the substrate G1, and the long side edge of the substrate G1. Apply. In other words, the first chamfering wheel 225 is formed by a combination of four first to fourth multi wheels 225a to 225d, and the second chamfering wheel 227 is four first to fourth multi wheels. It is provided by the combination of (227a-227d). The first and second chamfering wheels 225 and 227 are rotatably coupled by the wheel rotating housings 231 and 232, respectively. The wheel rotating housings 231 and 232 serve to rotate the first and second chamfering wheels 225 and 227 using a motor, etc. in addition to supporting the first and second chamfering wheels 225 and 227.

In this configuration, the chamfering of the short side edge of the substrate G1 is performed by the first and third multi wheels 225a and 225c of the first chamfering wheel 225 and the second and fourth multi wheels 225b and 225d. ), And the rear corner processing of the substrate G1 is performed in the inclined surface regions of the third and fourth multi-wheels 225c and 225d of the first chamfering wheel 225. And the front corner processing of the board | substrate G1 progresses in the inclined surface area | region of the 3rd and 4th multi-wheels 227c and 227d of the 2nd chamfering wheel 227, and chamfers with respect to the long side edge of the board | substrate G1. Is performed in the region between the first and third multi wheels 227a and 227c of the second chamfering wheel 227 and the second and fourth multi wheels 227b and 227d.

On the other hand, since the grinder 221 of the present embodiment is a shared grinder, the alignment camera 223, the first chamfering wheel 225, and the second chamfering wheel 227 are together with the first stage 260a and the first stage. The chamfering work with respect to the board | substrate on 260a should also be progressed, and the chamfering work with respect to the board | substrate on the 2nd stage 260b must also progress with the 2nd stage 260b.

Accordingly, the alignment camera 223, the first chamfering wheel 225, and the second chamfering wheel 227 should be movable along the Y axis. To this end, a camera movement support 224, a first wheel movement support 226, and a second wheel movement support 228 are provided.

The camera movement supporter 224 supports the two alignment cameras 223 to be movable so that the two alignment cameras 223 can move individually or collectively along the Y axis, and the first wheel movement supporter 226 Two first chamfering wheels 225 are movably supported so that the two first chamfering wheels 225 can be moved individually or collectively along the Y axis, and the second wheel moving support 228 is made of two The two second chamfering wheels 227 are movably supported so that the two chamfering wheels 227 can move individually or collectively along the Y axis.

In this embodiment, the camera movement support 224, the first wheel movement support 226 and the second wheel movement support 228 may be implemented as a linear motor, but is not necessarily so. In addition, although the camera movement support 224, the first wheel movement support 226, and the second wheel movement support 228 are shown separately in the drawings, they may be interconnected in one body.

The two alignment cameras 223 are sufficient if they are moved to the Y axis by the camera moving support 224. However, the first and second chamfering wheels 225 and 227 are not only moved in the Y axis by the first and second wheel moving supports 226 and 228, but also four corners of the substrate G1 and short and long edges. In order to move up and down on the Z axis, it must be possible.

To this end, the grinder 221 of the present embodiment is coupled to the first wheel moving support 226, the first wheel lifting portion 226a for raising and lowering the two first chamfering wheels 225 on the Z axis, and A second wheel elevating portion 228a is further provided to be coupled to the two wheel moving support 228 to elevate the two second chamfering wheels 227 to the Z axis. The first wheel lifting unit 226a and the second wheel lifting unit 228a may be applied as a cylinder, but this may also be applied by a linear motor or a motor and ball screw combination.

On the other hand, in the present embodiment, when the four corner processing of the substrate G1, the short side edge processing of the substrate G1 and the long side edge processing of the substrate G1 through the chamfering processing unit 220, the substrate G1 A control unit (not shown) for controlling the operation of the grinder 221 so that the four corner processing of the (), the short edge processing of the substrate G1 and the long edge processing of the substrate G1 can proceed continuously without waiting time. ) Is further provided.

In other words, when one of the first and second chamfering wheels 225 and 227 performs the edge machining operation of the substrate G1, the controller controls the other of the first and second chamfering wheels 225 and 227 to the substrate G1. The first and second chamfering wheels 225, 227 to the working position for the two-side corner machining operation or when one of the first and second chamfering wheels 225, 227 performs the both-side corner machining of the substrate G1. Control the X-axis, Y-axis and Z-axis motions of the first and second chamfering wheels 225 and 227 so that the other one of them may move in advance to the working position for the edge machining operation of the substrate G1. This series of control operations will be described together with the chamfering processing method below.

A series of methods for chamfering the substrate G1 using a chamfer having such a configuration will be described with reference to FIGS. 6 and 7.

First, the substrate G1 to be chamfered is transferred through the roller 212 on the substrate loading unit 210. The substrate G1 transferred by the rotation of the roller 212 is stopped at the working position as the operation of the rotation shaft 211 is stopped based on the signal of the entry sensor 214. Subsequently, after the alignment unit 215 presses both sides of the substrate G1 to align the substrate G1, the lift pins 213 up the substrate G1.

When the substrate G1 is up, the transfer 280a moves along the X, Y, and Z axes, and the substrate G1 is held by the basic holding unit 281 and the safety holding unit 285 to hold the substrate ( G1) is moved to the upper surface of the first stage 260a. The substrate G1 raised onto the upper surface of the first stage 260a is provided with a vacuum suction force through a vacuum hole formed in the surfaces of the turntable 261 and the variable table 263 constituting the first stage 260a. 261 and on the surface of the variable table 263.

After the substrate G1 is adsorbed and supported on the upper surface of the first stage 260a, the first stage 260a moves in the X-axis direction. The alignment operation is performed on the substrate moved in the X-axis direction while the alignment mark is captured by the alignment camera 223 as shown in FIG. 7A (S11). While the alignment operation is in progress, the first chamfering wheel 225 moves in advance to a work position for processing both side short edges of the substrate G1 and waits. In this case, the second chamfering wheel 227 is considered to be chamfering to another substrate on the second stage 260b side, and the dotted line is processed in FIG.

When the alignment operation is completed, as shown in FIG. 7B, the first stage 260a advances the substrate G1 toward the first chamfering wheel 225. At this time, since the first chamfering wheel 225 is moved to the working position for both short side edge processing of the substrate G1 in advance and is waiting, the substrate G1 is not stopped by the first stage 260a. Continue to advance through the area between the first and third multi-wheels 225a and 225c and the second and fourth multi-wheels 225b and 225d to form the first chamfering wheel 225, thereby providing a substrate G1. Chamfering processing for both short-side edges of is completed (S12).

As described above, while the chamfering processing of both short side edges of the substrate G1 is performed by the first chamfering wheel 225, the second chamfering wheel 227 moves on the movement path of the first stage 260a. In this case, the second chamfering wheel 227 is moved in advance to the working position for the front side corner processing of the substrate G1 to stand by.

Therefore, the board | substrate G1 on which the both short side edge processing was completed past the 1st chamfering wheel 225 is continued continuously by the 1st stage 260a without stopping, and waits in advance in a working position as shown in FIG.7 (c). By contacting the 3rd and 4th multi-wheels 227c and 227d of the 2nd chamfering wheel 227 which existed, chamfering process advances with respect to the front both sides corner (S13).

As described above, while the chamfering process is performed on both front corners of the substrate G1, the first chamfering wheel 225 moves in advance to a work position for processing both corners of the rear surface of the substrate G1.

The board | substrate G1 with which chamfering process was completed with respect to the front both sides corners does not stop, but reverses by the 1st stage 260a, and the 1st chamfering wheel 225 previously waited at the working position as shown in FIG.7 (d). By contacting the third and fourth multi-wheels 225c and 225d, the chamfering process is performed on both rear corners of the rear surface (S14).

Next, in order to chamfer the long side edges of both sides of the substrate G1, the substrate G1 is rotated on the first stage 260a as shown in FIG. 7E (S15). The rotation of the substrate G1 is performed by the turntable 261 forming the first stage 260a. In this case, it is assumed that the first chamfering wheel 225 is chamfering the other substrate on the second stage 260b side, and the dotted lines are processed in FIGS. 7E and 7F.

As described above, while the substrate G1 is rotated for chamfering on both long side edges, the second chamfering wheel 227 moves to a working position for both long side edges of the substrate G1 and waits in advance.

Subsequently, the substrate G1, which has been rotated, is immediately moved by the first stage 260a to form the second chamfering wheel 227 as shown in FIG. 7 (f). 227a and 227c and the area between the second and fourth multi-wheels 227b and 227d are passed, thereby completing the chamfering of the long side edges of both sides of the substrate G1 (S16).

As described above, before any one of the short side edge machining of the substrate G1, the front corner machining of the substrate G1, the back corner machining of the substrate G1, and the long side machining operation of the both sides of the substrate G1, Since the first and second chamfering wheels 225 and 227 are moved to a work position in advance and wait to be spaced apart from each other along the X axis, the substrate G1 stops and waits inevitably as in the related art. That is, according to the present exemplary embodiment, the first and second stages 260a and 260b supporting the substrate G1 are continuously moved along the inlined work line without stopping for a predetermined time as in the prior art. Since the chamfering operation for the substrate G1 can be performed, productivity can be improved by further reducing the tact time than before.

8 is a flowchart of a chamfering processing method for a flat panel display according to another embodiment of the present invention.

Chamfering processing method, unlike the above-described embodiment, may follow the order shown in FIG. That is, after the aligning operation is performed (S21), first the chamfering processing for the front side both corners of the substrate G1 by the first chamfering wheel 225 (S22), and then the second chamfering wheel Chamfering (S23) for both short sides of the substrate G1 by 227, and chamfering for both sides corners of the rear surface of the substrate G1 by the first chamfering wheel 225 (S24), After the substrate G1 is rotated (S25), the chamfering process for both long sides of the substrate G1 may be finally performed (S26).

In the above embodiment, the short side of the substrate is first processed and the long side is processed, but the long side may be processed first, and the substrate may be rotated to form the short side.

In the above-described embodiment, the first and second chamfering wheels are spaced apart from each other along a virtual work line connecting the substrate loading unit and the substrate unloading unit. The substrate unloading unit may be spaced apart from each other in a direction crossing the virtual work line.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

1 is a schematic configuration diagram of a conventional chamfering machine.

2 is a perspective view of a substrate for explaining a portion to be chamfered.

3 is a schematic plan view of a chamfering device for a flat panel display according to an embodiment of the present invention.

4 and 5 are partially enlarged perspective views of FIG. 3, respectively.

6 is a flowchart of a chamfering processing method for a flat panel display according to an embodiment of the present invention.

7 (a) to 7 (f) are configuration diagrams showing step by step chamfering processing for flat panel displays.

8 is a flowchart of a chamfering processing method for a flat panel display according to another embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

210: substrate loading unit 220: chamfering processing unit

221: Grinder 223: Align Camera

225: first chamfering wheel 227: second chamfering wheel

240: substrate unloading unit 250: chamfering measurement unit

260a, 260b: stage 280a, 280b: transfer

Claims (20)

A chamfering processing unit provided between a substrate loading unit and a substrate unloading unit to chamfer the corners and sides of the substrate, The chamfering processing unit, At least one stage on which the substrate is seated and supported by an upper surface; And A first chamfering wheel for chamfering the first side edge of the substrate and a second chamfering process with respect to the first chamfering wheel, and a second chamfering process for both corners of the first surface of the substrate; It includes a grinder having a wheel for chamfering, The second chamfering wheel is moved so that the second chamfering wheel moves to a working position for chamfering of corners on both sides of the first surface of the substrate when chamfering the first edge of the edge by the first chamfering wheel. Chamfering device for a flat panel display comprising a control unit for controlling. The method of claim 1, And the first chamfering wheel and the second chamfering wheel are spaced apart from each other along a virtual work line connecting the substrate loading unit and the substrate unloading unit. delete The method of claim 1, The first chamfering wheel performs a chamfering process for both corners of the second surface of the substrate, the second chamfering wheel performs a chamfering process for the edge of the second side of the substrate, The control unit may be used for the second chamfering processing so that the second chamfering wheel moves to a working position for chamfering of the second side edge when chamfering the corners of both sides of the second surface by the first chamfering wheel. Chamfering device for flat panel display, characterized in that for controlling the wheel. 5. The method of claim 4, The first side and the second side of the substrate are both short sides and both long sides of the substrate, and the first and second sides of the substrate are both front corners and rear corners of the substrate, Each of the first chamfering wheel and the second chamfering wheel is disposed such that an area of an outer circumferential surface thereof overlaps each other along a Z axis such that both front corners of the front surface of the substrate, both rear corners of the rear surface of the substrate, short edges of the substrate, and the Chamfering device for a flat panel display, characterized in that provided by a plurality of multi wheels for processing all the long edges of the substrate. The method of claim 1, The grinder further includes an alignment camera for aligning the substrate seated on the stage, The at least one stage is two first and second stages provided along a virtual Y axis arranged horizontally on an X axis, which is a virtual work line connecting the substrate loading unit and the substrate unloading unit, The grinder is a shared grinder shared between each of the first and second stages, The aligning camera, the first chamfering wheel, and the second chamfering wheel are provided for each of the two stages, flat display chamfering device. The method of claim 6, The grinder, A camera movement support unit movably supporting the two alignment cameras such that the two alignment cameras can be individually or collectively moved along the Y axis; A first wheel movement support for movably supporting the two first chamfering wheels such that the two first chamfering wheels can be moved individually or collectively along the Y axis; And And a second wheel moving support for movably supporting the two second chamfering wheels so that the two second chamfering wheels can be moved individually or collectively along the Y axis. Chamfering machine. The method of claim 7, wherein The grinder, A first wheel elevating unit coupled to the first wheel moving support unit for elevating the two first chamfering wheels on a Z axis; And And a second wheel elevating unit coupled to the second wheel moving support unit to raise and lower the two second chamfering wheels on the Z axis. The method of claim 1, The stage, At least one turntable for sucking and rotating the substrate; And And a plurality of variable tables disposed at an outer side of the turntable to adsorb and support the substrate together with the turntable and to be accessible and spaced apart from the turntable so as to correspond to the substrate size. . 10. The method of claim 9, The variable table is provided with four symmetrical mutually at the outer side of the turntable having a circular top surface, A side portion of the variable table is formed with a cutout that prevents the variable table from colliding with the turntable when approaching the turntable. On the surfaces of the turntable and the variable table, a plurality of vacuum holes for vacuum suction of the substrate, and a plurality of vacuum holes are provided around the plurality of vacuum holes, and are recessed downward from the surfaces of the turntable and the variable table to vacuum suction to the substrate. Chamfering device for flat panel display, characterized in that the vacuum suction line groove is formed to double the area. The method of claim 1, Further provided in the area between the substrate loading unit and the chamfering processing unit, and the area between the chamfering processing unit and the substrate unloading unit, the transfer to transfer the substrate while moving in the X-axis, Y-axis and Z-axis, The transfer, A plurality of basic gripping units holding the substrate by partially supporting the bottom surface of the substrate in contact with both side surfaces of the substrate; And And a safety gripping unit provided around the basic gripping unit and preventing the substrate from being separated from the basic gripping unit during the transfer process of the substrate. The method of claim 11, The plurality of basic gripping units are provided on each of the two on both sides of the substrate so as to be accessible and spaced apart from each other, The safety gripping unit is a flat display chamfering device, characterized in that it is provided to be rotatable in the position to support the front side and the lower surface of the substrate with respect to the transfer direction. The method of claim 1, Chamfering flat surface display unit further comprises a chamfering measurement unit for measuring the chamfering amount of the substrate provided in the substrate unloading unit is completed chamfering. The method of claim 1, Controlling the first chamfering wheel to move the first chamfering wheel to a working position for chamfering of the first side edge when chamfering the corners of both sides of the first surface by the second chamfering wheel; Chamfering device for a flat panel display further comprising a control unit. Chamfering the first side edge of the substrate by the first chamfering wheel; Chamfering the corners of both sides of the first surface of the substrate by the second chamfering wheels spaced apart from each other with respect to the first chamfering wheel; And And moving the second chamfering wheel to a working position for chamfering of corners on both sides of the first surface of the substrate when chamfering the first edge of the edge by the first chamfering wheel. Chamfering processing method for flat panel display. The method of claim 15, Chamfering processing method for a flat display further comprising the step of chamfering the corners on both sides of the second surface of the substrate by the first chamfering wheel. The method of claim 16, Rotating the substrate; And And chamfering the second side edge of the substrate by the second chamfering wheel. The method of claim 17, The first side and the second side are both short sides and both long sides of the substrate, and the first and second surfaces are chamfered for flat display, characterized in that the front both sides corner and the rear both sides corner of the substrate. Way. delete The method of claim 15, And when the first chamfering wheel moves to a working position for chamfering of the first side edge when chamfering the corners of both sides of the first surface by the second chamfering wheel. Chamfering method for flat panel display.

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