KR101078033B1 - Light emitting device package and backlight unit having same - Google Patents

Abstract

The present invention provides a lead frame including at least one lead for a light emitting device package and a backlight unit having the same, which can emit light having a uniform brightness and can implement a high performance backlight unit with a small number, and the lead frame And a light emitting element coupled to the lead frame, a molding material having a reflection portion to emit light generated by the light emitting element, and a lens portion disposed on a traveling path of light to be emitted from the light emitting element. Is the distance from the optical axis of x and the distance from the plane where the light emitting element is disposed at the point where the distance from the optical axis of the light emitting element is x is f (x) and is the angle from the plane perpendicular to the optical axis. _{When r} is 10 ° to 35 °, at least a part of the outer surface of the lens unit, not the surface facing the light emitting element, is represented by the following equation. Provided is a light emitting device package defined by 1 and a backlight unit having the same.
[Equation 1]
f '(x) = tan {45 ° + θ _r / 2-0.5 × tan ^-1 (x / f (x))}

Description

Light emitting device package and backlight unit comprising the same

The present invention relates to a light emitting device package and a backlight unit having the same, and more particularly, to a light emitting device package capable of emitting light having a uniform brightness and implementing a high performance backlight unit with a small number, and a backlight having the same. It is about a unit.

In general, the light emitting device is used as a light source of the backlight unit in an electronic device, such as a display device. Such a light emitting device may be packaged in various forms before coupling to the backlight unit.

When constructing a backlight unit using a plurality of packaged light emitting device packages, the backlight unit is preferably more uniform in brightness over its entire surface. In order to make the luminance uniform in the front of the backlight unit, it is necessary to uniformly arrange the plurality of light emitting device packages.

However, when a light source having high linearity in a specific direction of light is used as a light emitting device of a light emitting device package, a luminance difference may occur between a portion where the light emitting device packages are disposed and a portion between the light emitting device packages. As a result, when manufacturing a backlight unit using such light emitting device packages, there may be a problem that it is impossible to ensure the uniformity of luminance across the entire back light unit. In order to solve this problem, it may be considered to reduce the arrangement interval of the light emitting device packages when manufacturing the backlight unit, but in this case, the number of light emitting device packages required for manufacturing the backlight unit is rapidly increased, thereby increasing the manufacturing cost. May occur.

The present invention is to solve the various problems including the above problems, the light emitting device package which can emit light of uniform brightness and can implement a high-performance backlight unit with a small number and a backlight unit having the same It aims to provide.

The present invention provides a lead frame including at least one lead, a light emitting device on the lead frame, a molding material coupled to the lead frame and configured to emit light generated by the light emitting device, and the light emitting device emits light. A lens unit disposed on a traveling path of light to be used, wherein a distance from an optical axis of the light emitting device is x and a distance from a plane where the light emitting device is disposed at a point where the distance from the optical axis of the light emitting device is x; (x) and when θ _{r, which} is an angle from a plane perpendicular to the optical axis, is 10 ° to 35 °, at least a part of the outer surface of the lens unit, not the surface facing the light emitting element, is represented by Equation 1 below. Provided is a light emitting device package.

According to another aspect of the present invention, the surface defined by Equation 1 of the lens unit may include a portion through which the optical axis of the light emitting element of the outer surface of the lens unit passes.

According to another feature of the invention, the optical axis of the light emitting device may be perpendicular to the surface on which the light emitting device of the lead frame is disposed.

The present invention also includes at least one of a reflective sheet, a light guide plate disposed on or on the reflective sheet, and at least one of the light emitting device packages as described above arranged to irradiate light to the light guide plate. Provide a backlight unit.

According to the light emitting device package and the backlight unit having the same of the present invention made as described above, the light emitting device package and the backlight having the same can emit a light of a uniform brightness and implement a high-performance backlight unit with a small number Units can be implemented.

1 is a cross-sectional view schematically showing a light emitting device package according to an embodiment of the present invention.
FIG. 2 is a schematic perspective view illustrating a lens unit of the light emitting device package of FIG. 1.
FIG. 3 is a conceptual diagram for describing an optical path on a portion of an outer surface of a lens unit of the light emitting device package of FIG. 1 and a surface shape of a portion of the outer surface.
4 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.
5 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.
6 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.
7 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention.
8 is a side conceptual view schematically illustrating a backlight unit according to another exemplary embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various forms, and the following embodiments are intended to complete the disclosure of the present invention, the scope of the invention to those skilled in the art It is provided to inform you completely. In addition, the components may be exaggerated or reduced in size in the drawings for convenience of description.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, and can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

1 is a cross-sectional view schematically illustrating a light emitting device package according to an embodiment of the present invention, and FIG. 2 is a cutaway perspective view schematically illustrating a lens unit 70 of the light emitting device package of FIG. 1. 1 and 2, the light emitting device package according to the present exemplary embodiment includes a lead frame 10, a light emitting device 20, a molding material 40, and a lens unit 70.

The light emitting device 20 may be used as a light source of various electronic devices as a device emitting light by receiving an electric signal. For example, the light emitting device 20 may be composed of a diode of a compound semiconductor, and the light emitting device 20 may be referred to as a light emitting diode (LED). Such light emitting diodes may emit light of various colors depending on the material of the compound semiconductor.

The leadframe 10 includes at least one lead 14, in which the leadframe 10 includes leads 14 arranged in the + y and -y directions about the light emitting device 20. The case is shown. The light emitting device 20 may be disposed on the lead frame 10. For example, the light emitting device 20 may be bonded onto the lead frame 10 using a suitable adhesive member. Furthermore, the light emitting device 20 may be electrically connected to the lead frame 10 using a suitable connector, for example, a bonding wire (not shown).

The lead frame 10 may further include a die pad 12 in addition to the lead 14 as shown in the drawing. The light emitting device 20 disposed on the lead frame 10 is particularly a die pad 12. It may be disposed on. In this case, the die pad 12 may be bent to have the groove 13, and the light emitting device 20 may be bonded onto the die pad 12 in the groove 13. The depth of the groove 13 may be greater than the height of the light emitting device 20 so that the light emitting device 2 may be seated in the groove 13.

The leads 14 may serve to mediate electrical signal transmission between the light emitting device 20 and an external device. The number of leads 14 may be appropriately selected according to the light emitting element 20, for example, in the case of a light emitting diode, a pair of leads may be provided as shown. The die pad 12 may be separated from the leads 14 or may be connected to one of the leads 14 in that the die pad 12 may not directly participate in the electrical signal transmission of the light emitting device 20. In the figure, the lead 14 arranged in the + y direction around the light emitting element 20 is shown integrally with the die pad 12. As shown in FIG. Of course, the lead 14 disposed in the + y direction with respect to the light emitting device 20 is spaced apart from the die pad 12, but various modifications may be made such that both may be electrically connected through wiring (wiring) or the like. This is possible. Of course, the wiring is not made between the lead 14 and the die pad 12, but may be made between the lead 14 and the light emitting device 20. Of course, the lead 14 and the light emitting device 20 arranged in the -y direction with respect to the light emitting device 20 may also be electrically connected through wiring (not shown).

The die pad 12 and the lid 14 may be made of the same material or different materials. When the die pad 12 and the lead 14 are made of the same material, the lead frame 10 may be formed by patterning a conductive plate using a punching technique or the like. When there is a concern that the die pad 12 may be separated from the lead frame 10 during the packaging operation, the die pad 12 may be integrally formed with one of the plurality of leads 14.

The molding material 40 may be coupled to the lead frame 10 to form an overall appearance of the side-emitting light emitting device package. The molding material 40 has a reflector 50 for emitting light generated in the light emitting device 20 in one direction. The reflector 50 may be understood to define an opening 52 in a direction (+ x direction) in which light generated by the light emitting device 20 is to be emitted. Accordingly, the light emitting device 20 may be exposed in the molding material 40 through the opening 52. Of course, in order to protect the light emitting device 20 from external moisture or the like, a light-transmitting filler (not shown) covering the light emitting device 20 exposed by the molding material 40 is required so that the light emitting device 20 is not exposed to the outside. Of course, it can also be formed.

Such fillers may incorporate phosphors to fill the grooves 13 and / or the openings 52 in whole or in part. Phosphors may be used in various colors independently or in combination. For example, the phosphor may implement white color by using one or a combination of yellow phosphor, green phosphor, and red phosphor, but the present embodiment is not limited thereto. The filler may be filled only in the groove 13 or may be filled together in the groove 13 and the opening 52. For example, the groove 13 may be filled with a filler mixed with phosphors, and the opening 52 may be separately filled with a phosphor-free (transparent) filler.

The reflector 50 is disposed to face the light guide plate when mounted in the backlight module (see FIG. 8). The reflector 50 may reflect light emitted from the light emitting device 20 to increase the luminous efficiency of the light emitting device 20. For example, the opening 52 may be formed to have an inclined surface, and the angle of the inclined surface may be appropriately selected in consideration of light reflection efficiency and formability.

The molding material 40 may be formed on the lead frame 10 by using a suitable molding method such as an injection molding method or a transfer molding method. The molding material 40 may comprise a suitable resin, such as an epoxy molding resin. The reflector 50 may refer to a portion of the molding material 40 including the opening 52.

The lens unit 70 is disposed on a traveling path of light to be emitted from the light emitting device 20. In FIG. 1, since the traveling path of the light to be emitted from the light emitting device 20 is approximately + x, the light emitting device 20 is disposed in the + x direction from the light emitting device 20. Of course, as shown, the lens unit 70 may be in contact with the reflector 50, which may be a part of the molding material 40. The lens unit 70 is referred to as a distance from the optical axis AL of the light emitting device 20 as x (the distance is not in the + x direction but in the + y direction or the -y direction) and the optical axis of the light emitting device 20 ( When the distance from the plane where the light emitting device 20 is disposed at the point where the distance from AL is x is f (x), the outer surface of the light emitting device 20, not the surface facing the light emitting device 20 (outer surface in the + x direction) At least a portion of may be defined by Equation 1 below.

[Equation 1]

f '(x) = tan {45 ° + θ _r / 2-0.5 × tan ^-1 (x / f (x))}

Herein, the plane on which the light emitting device 20 is disposed may mean the upper surface of a portion where the light emitting device 20 of the die pad 12 is disposed. FIG. 2 is a cutaway perspective view schematically illustrating the lens unit 70 of the light emitting device package of FIG. 1, in FIGS. 1 and 2, from the optical axis AL of the light emitting device 20 to the portion indicated by the distance x in FIG. 1. In the part, the outer surface of the lens unit 70 is shown to be the surface defined by the above equation (1). That is, in FIG. 2, at least some surfaces of the center portion concave around the optical axis AL of the light emitting device 20 are described again. It can be understood that the part including the part passing through is defined by the above equation (1). The optical axis AL of the light emitting device 20 may be perpendicular to a surface on which the light emitting device 20 of the lead frame 10 is disposed, that is, an upper surface of the die pad 14.

The meaning of the plane defined by Equation 1 will be described below with reference to FIG. 3.

In FIG. 3, a point defined as (x, f (x)) means a point on the outer surface of the lens unit 70. It is assumed that the light emitting device 20 is a point light source located at the origin O. If the incident light Li of the light emitted from the light emitting element 20 is reflected at the corresponding point and becomes the reflected light Lr, the plane tl contacting the lens part 70 at the corresponding point and a straight line perpendicular thereto vl may be defined as shown in FIG. 3. If the angle formed by the incident light Li with the plane tl is θ, the angle formed by the incident light Li with a straight line parallel to the y axis is θ _i , and the angle formed by the plane tl with the x axis is α, and the reflected light ( When the angle formed by Lr) with the x-axis becomes θ _r , α may be expressed by Equation 2 below.

On the other hand, the slope of the plane (tl) with respect to the x-axis can be expressed as the derivative value of the function at the point (x, f (x)), that is, f '(x). At this time, if the slope is taken into account the geometry as shown in Figure 3, since α = θ + θ _r, can be expressed as in the following equation (3).

Here, θ _r is an angle formed by the reflected light Lr with the x-axis (ie, a plane perpendicular to the optical axis), and may be 10 ° to 35 °. As a result of computer simulation, when θ _r is smaller than 10 °, that is, the case where the reflected light Lr has an angle smaller than 10 ° with respect to the horizontal, the refractive index of the material constituting the lens portion 70 is 1.3 to In consideration of 1.6, in some cases, the incident angle of the incident light Li may be smaller than the critical angle (39 ° to 50 °) determined by the refractive index, so that total reflection may not occur. Further, given that the minimum light spread angle in front of the light emitting device package, which is generally required, is 110 °, computer simulation results indicate that θ _r is greater than 35 °, that is, the reflected light Lr is greater than 35 ° with respect to the horizontal. Assuming a large angle, the light spreading angle in front of the light emitting device package is smaller than 110 ° (= (90 ° -35 °) × 2), resulting in a decrease in luminance uniformity in front of the light emitting device package. Therefore, in the above-described crystal determination, it is preferable that θ _r , which is the angle at which the reflected light Lr forms with the x-axis, is 10 ° to 35 °.

In addition, by using the relationship between Equation 2 and α = θ + θ _r , θ can be expressed as shown in Equation 4 below.

Therefore, math period 3 can be expressed as Equation 5 below.

Considering the geometry of FIG. 3, since θ _i = tan ⁻¹ (x / f (x)), Equation 5 may be expressed as Equation 1 as described above.

[Equation 1]

f '(x) = tan {45 ° + θ _r / 2-0.5 × tan ^-1 (x / f (x))}

The function of y = f (x) defined by Equation 1 may be uniquely determined through computer simulation, and FIG. 2 rotates the determined function about the y-axis when θ _r = 12.5 °. The case where a part of the curved surface acquired by making it become the part containing the part which the optical axis AL of the light emitting element 20 of the outer surface of the lens part 70 passes is shown.

When the lens part 70 has such a surface, the incident light to the surface is totally reflected. When the lens unit 70 is formed of silicon, the refractive index of general silicon is about 1.42, so the critical angle for total reflection occurs is 44.7 °. According to the computer simulation results, the incident angle of incident light Li is always larger than this critical angle in the geometry as shown in FIG. 3. Therefore, all of the light emitted from the light emitting element 20 and incident on the outer surface defined as the corresponding function of the lens unit 70 is totally reflected and proceeds at an angle of θ _r with respect to the horizontal (see FIG. 3). On the other hand, since the refractive index of the material constituting the lens unit 70 is usually in the range of 1.3 to 1.6, as described above, even if the refractive index of the material constituting the lens unit 70 is in the range of 1.3 to 1.6, it will be described later. As shown in FIG. 3, the incident angle of the incident light Li is always larger than the critical angle determined by the corresponding refractive index. Therefore, all of the light emitted from the light emitting element 20 and incident on the outer surface defined as the corresponding function of the lens unit 70 is totally reflected and proceeds at an angle of θ _r with respect to the horizontal (see FIG. 3).

In this case, when the light emitting device package is viewed from the front of the light emitting device package (that is, when the light emitting device package is viewed in the -x direction), the light emitting device package is closer to the center of the light emitting device package than the conventional light emitting device package. The luminance in the vicinity of the device 20, that is, near the optical axis AL, is relatively low, while the luminance in the outer portion of the light emitting device package is relatively high. This can be understood as the area where the luminance is uniform in the front of the light emitting device package, that is, the region having a specific luminance or more.

When the backlight unit is manufactured using the light emitting device packages according to the present exemplary embodiment, even if the distance between the light emitting device packages increases, the luminance difference between the portion where the light emitting device packages are disposed and the part between the light emitting device packages is different. Can be reduced. As a result, when manufacturing the backlight unit using such light emitting device packages, it is possible to increase the uniformity of brightness across the entire backing unit, and in particular, by reducing the number of light emitting device packages used when manufacturing the backlight unit, the backlight unit manufacturing cost is significantly reduced. Can be saved. Such an effect may be further increased when a light source LED having a high linearity in a specific direction of the light emitting device 20 is used as the light emitting device 20 of the light emitting device package.

4 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention. The light emitting device package according to the present embodiment, unlike the light emitting device package according to the above-described embodiment, further includes a translucent filler 60 filling the recesses of the molding material 40. The filler 60 may be selected such that the refractive index of the material included in the lens unit 70 is smaller than the refractive index of the filler 60.

In the light emitting device package having the filler 60, the light emitted from the light emitting device 20 passes through a boundary between the filler 60 and the lens unit 70, and the refractive index of the filler 60 is increased by the lens unit ( Unlike the case where the refractive index of the material 70 is included, the light is refracted in the outer direction of the light emitting device package. As a result, when looking at the light emitting device package from the front of the light emitting device package (that is, when looking at the light emitting device package in the -x direction), there is no filler 60 or no lens 70 Compared with the case, the luminance in the vicinity of the center of the light emitting device package (near the light emitting device 20 is located) is relatively low, while the luminance in the outer portion of the light emitting device package is relatively high. This can be understood as the area where the luminance is uniform in the front of the light emitting device package, that is, the region having a specific luminance or more.

When the backlight unit is manufactured using the light emitting device packages according to the present exemplary embodiment, even if the distance between the light emitting device packages increases, the luminance difference between the portion where the light emitting device packages are disposed and the part between the light emitting device packages is different. Can be reduced. As a result, when manufacturing the backlight unit using such light emitting device packages, it is possible to increase the uniformity of brightness across the entire backing unit, and in particular, by reducing the number of light emitting device packages used when manufacturing the backlight unit, the backlight unit manufacturing cost is significantly reduced. Can be saved. Such an effect may be further increased when a light source LED having a high linearity in a specific direction of the light emitting device 20 is used as the light emitting device 20 of the light emitting device package.

In addition to increasing the luminance uniformity of the light emitting device package, the filler 60 may also serve to prevent the light emitting device 20 from being exposed to the outside in order to protect the light emitting device 20 from external moisture as described above. . The filler 60 may be a mixture of phosphors. Of course, unlike shown in the figure, the groove 13 may be filled with a filler in which phosphors are mixed, and the opening 52 may be separately filled with a phosphor-free (transparent) filler.

Meanwhile, although FIG. 4 shows that the filler 60 and the lens unit 70 are different components from each other, the filler as in the light emitting device package according to another embodiment of the present invention as shown in FIG. It goes without saying that various modifications are possible, such as the 60 and the lens unit 70 may be integral.

6 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention. In the light emitting device package according to the present embodiment, unlike the light emitting device package according to the above-described embodiment, the upper surface of the transparent filler 60 filling the recess of the molding material 40 has a concave shape. The filler 60 may be selected such that the refractive index of the material included in the lens unit 70 is smaller than the refractive index of the filler 60.

In the case of the light emitting device package having the filler 60, since the filler 60 has an effect similar to that of the concave lens, the light emitted from the light emitting device 20 is a boundary between the filler 60 and the lens unit 70. It is refracted in the outer direction of the light emitting device package while passing through. In this case, when light passes through the boundary between the filler 60 and the lens unit 70, the light is refracted in the outer direction more than the case shown in FIG. 4.

As a result, when looking at the light emitting device package from the front of the light emitting device package (that is, when looking at the light emitting device package in the -x direction), there is no filler 60 or no lens 70 When compared with the case of course, even if there is a filler 60 and the lens unit 70, the interface between the filler 60 and the lens unit 70 is flat, when compared, near the center of the light emitting device package (light emitting device 20) The luminance in the vicinity of the () is relatively low while the luminance in the outer portion of the light emitting device package is relatively increased. This can be understood as the area where the luminance is uniform in the front of the light emitting device package, that is, the region having a specific luminance or more.

When the backlight unit is manufactured using the light emitting device packages according to the present exemplary embodiment, even if the distance between the light emitting device packages increases, the luminance difference between the portion where the light emitting device packages are disposed and the part between the light emitting device packages is different. Can be reduced. As a result, when manufacturing the backlight unit using such light emitting device packages, it is possible to increase the uniformity of brightness across the entire backing unit, and in particular, by reducing the number of light emitting device packages used when manufacturing the backlight unit, the backlight unit manufacturing cost is significantly reduced. Can be saved. Such an effect may be further increased when a light source LED having a high linearity in a specific direction of the light emitting device 20 is used as the light emitting device 20 of the light emitting device package.

The method of making the top surface of the filler 60 concave as shown in FIG. 6 may be various. For example, after the filler 60 is injected into the top surface of the light emitting device 20, the filler as shown in FIG. The upper surface of the filler material 60 can be pressed against the lower surface of the lens portion 70 to be concave by using the convex lens portion 70 in contact with the 60. Of course, when dispensing the filler 60 can be used a variety of methods, such as under-dottling (dispensing by reducing the amount of the mixture of the liquid resin and the phosphor) to concave the upper surface of the filler 60, of course. to be. In the latter case, the lower surface of the lens unit 70 may be flat as shown in FIG. 4 without being convex as shown in FIG. 6, in this case, the lower surface of the lens unit 70 and the upper surface of the filler 60. You may not encounter this.

7 is a cross-sectional view schematically showing a light emitting device package according to another embodiment of the present invention. In FIG. 7, the concave lens 62 is further provided in addition to the filler 60, unlike the above-described embodiments. The concave lens 62 having a concave upper surface may be provided with at least a portion of the groove 13 formed to arrange the light emitting device 20. In this case, the light emitted from the light emitting device 20 is refracted in the outer direction of the light emitting device package while passing through the boundary between the concave lens 62 and the filler 60.

As a result, when the light emitting device package is viewed from the front of the light emitting device package (that is, when the light emitting device package is viewed in the -x direction), the light emission when the concave lens 62 is absent, While the luminance in the vicinity of the center of the device package (near the light emitting device 20 is located) is relatively low, the luminance in the outer portion of the light emitting device package is relatively high. This can be understood as the area where the luminance is uniform in the front of the light emitting device package, that is, the region having a specific luminance or more.

Of course, in this case, the concave lens 62 may include a phosphor, and the filler 60 may be formed of a simple transparent resin. In some cases, the filler 60 may be omitted. The concave lens 62 may use various methods such as under-dotting (dispensing by reducing the amount of the mixture of the liquid resin and the phosphor) when dispensing the filler material so that the upper surface becomes concave concave lens 62. Can be. It is a matter of course that the concave lens 62 having the concave upper surface already formed may be mounted in the groove 13.

FIG. 8 is a conceptual view schematically illustrating a backlight unit according to another embodiment of the present invention, and specifically, a so-called direct backlight unit in which the light emitting device package 130 is disposed below the light guide plate 120. As shown in FIG. 8, in the backlight unit according to the present exemplary embodiment, a plurality of light emitting device packages 130 are disposed on a frame 110, and a light guide plate 120 is disposed on the light emitting device package 130. The light emitting device packages 130 irradiate light toward the light guide plate 120 thereon (in the + z direction). The light emitting device packages 130 may of course be two-dimensionally disposed over the xy plane. Of course, if necessary, the reflective sheet 115 may be further provided to cover the frame 110. For example, the reflective sheet 115 covers the frame 110 and light emitted from the light emitting device package 130 is transferred to the frame 110. When it is directed to reflect it to proceed to the light guide plate (120). The reflective sheet 115 may have a through hole so that the light emitting device package 130 may be disposed in the through hole.

In the case of the backlight unit according to the present exemplary embodiment, the luminance uniformity in front of the light emitting device package 130 is improved, so that even if a small number of the light emitting device packages 130 are arranged, the backlight unit having high luminance uniformity can be realized. have. In addition, when the brightness of the front of the light emitting device package 130 is high, when the backlight unit is viewed from the front (that is, when looking at the xy plane in the -z direction), the light emitting device is disposed two-dimensionally over the xy plane Bright spots having a relatively high luminance may be recognized at the package 130 location. However, in the backlight unit according to the present exemplary embodiment, since the uniformity of the luminance in front of the light emitting device package 130 is improved, such defects may be caused. Can be effectively prevented from occurring.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

10: lead frame 12: die pad
14: lead 20: light emitting element
40: molding material 50: reflecting portion
52: opening 60: filler
70: lens unit

Claims (4)

A leadframe including at least one lead;
A light emitting device on the lead frame;
A molding material coupled to the lead frame and having a reflector configured to emit light generated by the light emitting device; And
The distance from the plane where the light emitting device is disposed on the traveling path of the light to be emitted from the light emitting device, the distance from the optical axis of the light emitting device being x and the distance from the optical axis of the light emitting device being x. When f (x) and θ _{r, which} is an angle from a plane perpendicular to the optical axis, is 10 ° to 35 °, at least a part of the outer surface, not the surface facing the light emitting device, is defined by Equation 1 below. A light emitting device package having a lens unit;
[Equation 1]
f '(x) = tan {45 ° + θ _r / 2-0.5 × tan ^-1 (x / f (x))} The method of claim 1,
The surface defined by Equation 1 of the lens unit includes a portion through which the optical axis of the light emitting element of the outer surface of the lens unit passes. The method of claim 1,
The optical axis of the light emitting device is perpendicular to the surface on which the light emitting device of the lead frame is disposed, the light emitting device package. Reflective sheet;
A light guide plate disposed on the reflective sheet or disposed on the reflective sheet; And
And a light emitting device package according to any one of claims 1 to 3 arranged to irradiate light to the light guide plate.

Images