KR101426841B1 - Monitoring for edge of wafer and its monitoring method - Google Patents

Abstract

The present invention relates to an edge monitoring apparatus for a wafer, comprising: a spinner for rotating a wafer; A camera for photographing an edge portion of the wafer rotated by the spinner and outputting image data; An image processing unit for performing a polygonalization process on the image data output from the camera; And a determination unit for determining whether there is an abnormality by discriminating the data processed by the image processing unit. Therefore, it is possible to minimize the amount of calculation and to reduce the storage space by minimizing the capacity of the image data of the wafer edge portion, So that it is possible to improve the efficiency of the calculation and reduce the load of the system even when analyzing a high-resolution image or analyzing a special expression.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a monitoring apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a monitoring device and a monitoring method for edge portions of a wafer, and more particularly to a monitoring device and a method for monitoring edge portions of wafers which can realize a minimum calculation amount, Monitoring method.

In general, a semiconductor device is formed by selectively or sequentially performing various processes such as diffusion, etching, exposure, and ion implantation on a wafer.

Such a semiconductor device manufacturing process is a process of fabricating an integrated circuit by patterning a material layer constituting each layer while depositing a conductive layer and an insulating layer on the entire surface of the semiconductor wafer in multiple layers. In this case, the semiconductor integrated circuit is generally composed of semiconductor chips, and a plurality of semiconductor chips over the entire wafer are completed in the same step through the same process.

Therefore, after the uppermost material layer of each semiconductor chip is formed, the semiconductor wafer is diced in chip units, and unnecessary portions of the wafer are discarded.

However, the material layer formed on the chip portion of the wafer is formed equally in the edge portion of the wafer due to the fact that the manufacturing process of the semiconductor element is performed in the same manner over the entire surface of the wafer, but the edge portion of the wafer has crystallographic, Which causes various types of defects in the manufacturing process of the semiconductor device. That is, as the semiconductor integrated circuit is highly integrated, the material layers accumulated in the multi-layered area of the wafer edge region are expanded by the thermal budget during the deposition of the subsequent material layer, lifted by the thermal budget, There are various types of defects such as incomplete removal due to difference, residual of polymer, etc. These defects act as defective factors such as causing particles.

Therefore, in order to solve such a problem, it is necessary to periodically remove the material layers accumulated in the edge portion of the wafer, and the edge portion monitoring device of the wafer inspects whether or not the removed edge portions are normally stripped.

The idea of the present invention is to provide a monitoring device and a monitoring method of a wafer edge portion that can reduce the amount of calculation, reduce storage space, and perform arithmetic processing at a high speed by converting the image data of a high- .

According to an aspect of the present invention, there is provided an apparatus for monitoring a rim of a wafer, comprising: a spinner for rotating a wafer; A camera for photographing an edge portion of the wafer rotated by the spinner and outputting image data; An image processing unit for performing a polygonalization process on the image data output from the camera; And a discrimination unit discriminating the processed data in the image processing unit and discriminating the abnormality.

According to an aspect of the present invention, the image processing unit may include: a decompres- sion converter unit for generalizing binary decompressed original BMP image files; A cleanser for preprocessing the polygonalized image data; A sampling unit for sampling the preprocessed image data; And a measurement unit for measuring a length or an area of a necessary part of the preprocessed or sampled polygonalized image data and outputting statistical data.

The image processing unit may further include a decompression unit decompressing the compressed BMP image file into a BMP original file.

Also, according to an aspect of the present invention, the polygonization converter unit may convert any one of binarization, quadrature, octal, and more generalized binary.
According to an aspect of the present invention, the polygonalized image data may include EBR (edge bead remove) cut data, image voltage sag data, bright field data, and dark field data .

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According to an aspect of the present invention, the cleanser portion performs smoothing to smoothly connect lines of image data including EBR (edge bead remove) cut data, image voltage sag data, Can be processed.

According to an aspect of the present invention, the cleanser unit exposes a certain area of image data including bright field data and dark field data according to a morphological sampling theorem. An area larger than a predetermined size can be detected and the position of the image data can be converted to the X-axis and Y-axis coordinates.

According to an aspect of the present invention, the sampling unit may sample a partial area of image data including bright field data and dark field data according to morphological sampling, Can be detected.

Further, according to the idea of the present invention, the measuring unit can calculate and return a length corresponding to each brightness according to the angle and position of a given line of the edge bead remove (EBR) cut data, the image voltage sag data .

Further, according to the idea of the present invention, the surveying unit may detect errors based on coordinates of an error having an area equal to or larger than a predetermined size of bright field data, dark field data, and smoothed image It can be judged.

According to another aspect of the present invention, there is provided a method for monitoring a border of a wafer, the method comprising the steps of: capturing a border of a wafer to process an image, A decompression step of decompressing the decompressed image into a decompressed image; A decompresed converter step of generalizing binary decompressed original BMP image files; A cleanser step of preprocessing the polygonalized image data; A sampling step of sampling preprocessed image data; And a measurement step of measuring statistical data by measuring a length or an area of a necessary part of the preprocessed or sampled multiresolution image data.

According to an aspect of the present invention, the cleansing step may include edge bead removal (EBR) cut data, smoothing to smoothly connect lines of image data including image voltage sag data, ) Or by opening a part of the area of the image data including bright field data and dark field data according to morphological sampling and the like to detect an area of a predetermined size or more, Wherein the sampling step includes sampling a partial area of the image data including bright field data and dark field data according to morphological sampling and calculating an area over a predetermined size Wherein the step of measuring includes the steps of: edge bead removal (EBR) cut data, image data voltage sag data The measuring unit may calculate and return a length corresponding to each brightness according to the angle and position of the true line or if the area has an area over a certain size of bright field data and dark field data, It may be a step of judging.

The apparatus and method for monitoring the edge of a wafer according to the teachings of the present invention minimize the amount of computation, reduce the storage space, and enable high-speed computation processing to analyze high-resolution images or analyze special expressions The efficiency of calculation can be improved and the load of the system can be reduced. Therefore, it is possible to improve usability, understanding, compatibility, future compatibility, and economical efficiency in applications such as Internet, TV, and smartphone .

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a device for monitoring the edge of a wafer according to some embodiments of the present invention; Fig.
2 is a plan view showing a part of a wafer edge portion taken by the camera of FIG.
3 is a view illustrating an original BMP image file photographed by the camera of FIG.
4 is a diagram showing an example of a binarized file obtained by subjecting an original BMP image file of Fig.
5 is a diagram illustrating an example of a quaternary file obtained by subjecting an original BMP image file of FIG.
6 is a diagram showing an example of an 8-ary file obtained by performing poly-transformation on the original BMP image file of Fig.
FIG. 7 is a diagram illustrating a binarization file according to another embodiment of FIG. 4; FIG.
8 is a block diagram showing a part of an embodiment of the image processing unit of FIG.
FIG. 9 is a flowchart showing a method of monitoring the edge of a wafer according to some embodiments of the present invention.
FIGS. 10 to 20 are views of screens displayed on the monitor of the edge monitoring apparatus of the wafer according to some embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

It is to be understood that throughout the specification, when an element such as a film, an area, or a substrate is referred to as being "on", "connected" or "coupled to" another element, May be interpreted as being "on", "connected" or "coupled" to an element, or there may be other elements intervening therebetween. On the other hand, when one element is referred to as being "directly on", "directly connected", or "directly coupled" to another element, it is interpreted that there are no other components intervening therebetween do. Like numbers refer to like elements. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

Also, relative terms such as "top" or "above" and "under" or "below" can be used herein to describe the relationship of certain elements to other elements as illustrated in the Figures. Relative terms are intended to include different orientations of the device in addition to those depicted in the Figures. For example, in the figures the elements are turned over so that the elements depicted as being on the top surface of the other elements are oriented on the bottom surface of the other elements. Thus, the example "top" may include both "under" and "top" directions depending on the particular orientation of the figure. If the elements are oriented in different directions (rotated 90 degrees with respect to the other direction), the relative descriptions used herein can be interpreted accordingly.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

Fig. 1 is a schematic view showing a wafer edge monitoring apparatus 100 according to some embodiments of the present invention. Fig. 2 is a schematic view showing a portion P of a wafer edge portion B taken in the camera C of Fig. Fig.

FIG. 3 is a diagram illustrating an original BMP image file 2 photographed by the camera C of FIG.

1 to 3, the apparatus for monitoring the edge of a wafer according to some embodiments of the present invention includes a spinner S, a camera C, an image processing unit 10, And a determination unit 20.

1, the spinner S rotates the wafer W by a motor M, and if the rotation speed of the motor M is too fast beyond the reference value, the thickness of the formed material layer And if it is too slow, the thickness of the formed material layer may become thick. Such a bad phenomenon can be discriminated based on the image data photographed by the image discrimination unit 20, which will be described later.

The camera C photographs a part P of the edge portion B of the wafer W rotated by the spinner S and outputs it as image data. The camera C may be a CCTV camera or an infrared / ultraviolet / Various sensors such as ultrasonic cameras and various level sensors can be applied. 3, the photographed BMP original file 2 will be described as an example. The wafer W includes a wafer chip portion A on which semiconductor elements are formed and a wafer edge portion B). The wafer edge portion (B) is removed by an etching method or the like through an EBR (edge bead removal) process for a subsequent process. In order to determine whether the etching is properly performed in the removed state And the camera C picks up the edge portion B of the wafer. Here, the BMP original file 2, which is generally photographed, can be compressed by various compression programs in order to reduce the throughput of data.

8, the image processing unit 10 performs a polygonalization process on the image data output from the camera C, and includes a decompression unit 11, a decompression converter unit A cleanser section 13, a sampling section 14 and a measurement section 15 (16).

Here, the decompression unit 11 decompresses the compressed BMP image file (1) into the BMP original file (2).

The multinary conversion converter unit 12 performs generalized binary decompression of the decompressed original BMP image file 2 shown in FIG. 3, for example, a binarized file 3a ), The quinary file 3b of FIG. 5, the octree file 3c of FIG. 6, and the generalized binary file of FIG. Here, for example, as shown in Fig. 7, a foreign matter F or a defect D of the wafer W may appear in the binarized file 3a1.

8, the cleanser 13 preprocesses the polygonalized image data 3, 4, 5, and 6. The polygonalized image data 3 (5) and (6) show EBR (edge bead remove) cut data 3, image voltage sag data 4 in which a data voltage of a specific part is instantaneously dropped in the image data, Bright field data 5 indicating the dark portion of the image data, and dark field data 6 indicating the dark portion of the image data.

The cleanser unit 13 further includes a smoothing unit 7 for smoothly connecting lines of image data including EBR (edge bead remove) cut data 3, image voltage sag data 4, (smoothing).

The cleanser unit 13 also stores a part of image data including bright field data 5 and dark field data 6 according to a morphological sampling theorem The X-axis and Y-axis coordinates can be converted by detecting an area over a predetermined size.

The sampling unit 14 samples the preprocessed image data 7 and records bright field data 5, dark field data 6, and the like in accordance with morphological sampling. The area of a predetermined size or more can be detected by sampling a part of the area of the image data.

The measurement unit 15 measures statistical data 9 by measuring a length or an area of a necessary part of the preprocessed or sampled polygonal image data 8 and outputs an EBR ) cut data 3 and the image voltage sag data 4 can be calculated and returned.

If the bright area or the dark area of the bright field data 5 and the dark field data 6 are included in an area of more than a predetermined area, the measuring unit 16 may determine that the area is an error have.

1, the discrimination unit 20 discriminates the statistical data 9 processed by the image processing unit 10 and discriminates an abnormality. Here, when the statistical data 9 exceeds the normal range, it can be determined as an abnormal state.

A method of monitoring the edge of a wafer using the apparatus for monitoring the edge of a wafer according to some embodiments of the present invention will now be described in more detail. The edge portion of the wafer W rotated by the spinner S B of the present invention, the method for monitoring the edge of a wafer for processing an image comprises: a decompressing step (S1) of decompressing a compressed BMP image file into a BMP original file as shown in FIG. 9; A multiresolution converter step S2 for generalizing the BMP image file, a cleanser step S3 for preprocessing the multiresolution image data, a sampling step for sampling the preprocessed image data, S4), and a measurement step (S5) of measuring the length or area of a necessary portion of the preprocessed or sampled polygonalized image data and outputting statistical data.

Here, the cleansing step S3 may include smoothing processing of lines of image data including EBR (edge bead remove) cut data and image voltage sag data to remove variations in the length to be measured, A step of opening an area of a part of image data including bright field data and dark field data according to morphological sampling and rearranging to detect an area of a predetermined size or more and transforming coordinates to be.

In addition, the sampling step S4 may include sampling a part of the area of the image data including bright field data and dark field data according to morphological sampling, .

Alternatively, the measurement step S5 may calculate and return a length corresponding to each brightness according to the angle and position of a given line of edge bead remove (EBR) cut data, image voltage sag data, It is determined as an error based on coordinates of an error having an area equal to or larger than a predetermined size of bright field data and dark field data and a smooth image.

Therefore, by using the edge monitoring apparatus and monitoring method of the present invention, it is possible to miniaturize the image data by minimizing the capacity of the image data, thereby reducing the amount of calculation, reducing the storage space, Even when analyzing images or analyzing special expressions, it is possible to improve the efficiency of calculation and reduce the load of the system.

FIGS. 10 to 20 are examples of screens displayed on the monitor 30 of the edge monitoring apparatus 100 of the wafer according to some embodiments of the present invention.

That is, the edge monitoring apparatus 100 of the wafer according to some embodiments of the present invention may further include a monitor 30 for displaying the image discriminated by the discriminating unit 20, As shown in the figure, the discriminating unit 20 converts the discriminated image into a circular dart graph together with a live image or a chart graph in a state in which the dart graph is laid out, Can be displayed.

In addition, as shown in FIG. 15, the determination unit 20 may display the boundary surfaces of the wafer edge portion on the monitor 30 so as to overlap the live image.

As illustrated in FIGS. 10 to 20, when the user first executes the program, the login window is activated as shown in FIG. 10, the user inputs the ID and Password, and clicks the OK button to execute the main screen .

At this time, as shown in FIG. 11, when a corresponding input window is double-clicked so that input can be performed without any keyboard, all the input windows can be activated by the touch pad method by activating the keyboard window. Of course, it is also possible to use a separate keyboard or mouse.

Next, as shown in Fig. 12, a main page (when a "MAIN" button is clicked) may be activated. Here, the title bar (speech balloon 1) displays the main screen such as "RUN (<-> STOP switchable)" button for displaying the system message or the current time or for converting into the Auto Run state, and "EXIT" And a navigation button for switching.

In addition, the "Wafer" button (speech balloon 2) can indicate the presence or absence of the wafer W on the spinner S, and the live image window (speech balloon 3) can display the image captured by the current camera C, In the measurement data accumulation table and the graph window (speech balloon 4), if the "Wafer" button is selected according to the check of the check box (bubble 7 and bubble 8), the measurement result of the previous wafer is displayed as data or Dart graph and Chart If it is displayed in the form of a graph, or if the "Day" button is selected, average data of the last 24 hours can be displayed.

In addition, these data can be displayed for each model of the "Recipe" selection window (speech bubble 5) and the "live" button of the manual function button (speech bubble 6) The state of the currently selected camera can be converted and the image of the currently selected camera can be saved as a picture file (for example, JPG file) by selecting the "Capture" button, or can be saved as a movie by selecting the "Record" button.

For example, as shown in Fig. 13, if a screen under measurement is clicked by clicking the "Open" button, the dpt value measured in the live image window (speech balloon 1) is displayed as a red dot, A multi-evolved Gray Scale can be displayed as a reference. Then, at the time when the measurement is completed, a gold notch line may be displayed on the Dart graph (upper speech ball 1) and the Chart graph (lower speech ball 1) as shown in Fig.

Further, as shown in Fig. 15, a recipe (when the "RECIPE" button is clicked) page can be activated. Here, the model can be selected using the "Recipe" selection window (speech balloon 1), and the live image window (speech balloon 2) can display the image photographed by the current camera C, Reference Pos, Measuring Pos, Meas. Tolerance, Save AVI, Measure Angle, Threshold, Threshold, Radius, Minimum Edge, And setting the effective minimum edge value of the parameter).

In the specification parameter area (speech bubble 4), limits can be set for measurement values such as Upper Warning Limit, Upper Error Limit, Lower Warning Limit, and Lower Error Limit.

In addition, by clicking the manual test button (speech bubble 5), it is possible to perform the edge inspection of the currently displayed image, and in the measurement parameter window (speech bubble 6), the delay time (the time ), Measuring Time (time until one turn), and Capture Time (image sampling period during cycling).

It is also possible to set the amount of light to be used for measurement, that is, Contrast, Brightness, etc., using the light amount setting window (speech balloon 7) IMG Load "," Save "(to save the entered value for Recipe setting)," Reset "(Recipe to save the setting data before saving) ), And so on.

Also, as shown in FIG. 16, the user can activate the page of data (when the "DATAE" button is clicked) to confirm previously measured data. Here, if you click the date button on the data selection area (speech bubble 1), the calendar screen appears as shown in the figure, and you can easily select the date range. In addition, data selected from the list on the left side can be displayed in the lower left list using the result data area (List, Dart and Chart Graph), and simultaneously displayed in the Dart and Chart graphs.

You can also use the Show Options area to display the "Dart" (Dart display of the selected data: display according to mode (Wafer / Value / Day) in the center of the screen), "Image" Display: position can be moved according to selection of list), "AVI" (confirmation of saved AVI file).

Also, by clicking the video file playback button (speech bubble 4), the user can arbitrarily select and play the video file. At this time, "Show Options" can be selected as "AVI".

Here, as shown in FIG. 17, the notch or list found on the wafer W measured with reference to the position line indicating the current position of the speech balloon 1, and the position of the corresponding image can be searched.

18, the mode of the center of the screen is selected as "Value " and confirmed by the Dart graph or the Chart graph, or the mode of the center of the screen is selected as" Day " It is also possible to display data corresponding to the date of the selected breakdown in the upper list (where the red dotted line is the error threshold and the green dotted line is the warning threshold).

On the other hand, as shown in FIG. 20, the user can set a setting of the equipment by activating a setting setting (when the "CONFIGE" button is clicked).

Here, the User ID can be registered / modified / deleted by using the "User" button (speech bubble 1). In the "Video" area, the Video Pixel Size, Image Gain, Exposure Time Abs Can be set.

You can also set the Model and Port settings and Baud Rate in the "Light" area (speech bubble 3), set the Log management: Log and data lifetime in the "How Long to keep Data and Log" area (bubble 5) Image and AVI files You can set the default directory for saving images and AVI files in the management area (bubble 6). Other, and Alarm List (7). In addition, various user information, login information, and the like can be stored.

It is needless to say that the present invention is not limited to the above-described embodiment, and can be modified by those skilled in the art without departing from the spirit of the present invention.

Accordingly, the scope of claim of the present invention is not limited within the scope of the detailed description, but will be defined by the following claims and technical ideas thereof.

100: Monitoring device W: Wafer
A: chip portion B: rim portion
P: Part S: Spinner
C: camera 10: image processor
20: discrimination unit 11: decompression unit
12: multi-evolution converter section 13: cleanser section
14: Sampling unit 15, 16:
1: Compressed BMP image file 2: Original BMP image file
3: edge bead remove (EBR) cut data 4: video voltage sag data
5: Bright field data
6: dark field data 7: preprocessed image data
8: Multivariate image data 9: Statistical data
3a, 3a1: Binarization file 3b: Quaternion file
3c: octal file F: foreign matter
D: Defect S1: Decompression step
S2: Multiresolution converter step S4: Sampling step
S5: Survey Step 30: Monitor

Claims (14)

A spinner for rotating the wafer;
A camera for photographing an edge portion of the wafer rotated by the spinner and outputting image data;
An image processing unit for processing image data output from the camera; And
A discrimination unit for discriminating data processed by the image processing unit;
/ RTI &gt;
The image processing unit
A polygonalizing converter unit for generalizing binary image data;
A cleanser for preprocessing the polygonalized image data; And
By sampling the preprocessed image data, bright field data for displaying a bright part in the image in accordance with morphological sampling, and image data including dark field data for displaying a dark part in the image A sampling unit for sampling an area of a predetermined size or more and detecting an area over a predetermined size; Wherein the wafer edge monitoring device comprises: The method according to claim 1,
Wherein the image processing unit comprises:
And a measuring unit for measuring a length or an area of a necessary part of the preprocessed or sampled polygonalized image data and outputting statistical data. 3. The method of claim 2,
Wherein the image processing unit comprises: a decompression unit decompressing the compressed BMP image file into a BMP original file;
Further comprising a wafer edge monitoring device for monitoring the edge of the wafer. 3. The method of claim 2,
Wherein the polygonization converter unit selects and converts any one of binarize, quadrature, octal, and more generalized binary. 3. The method of claim 2,
The polygonalized image data includes EBR (edge bead remove) cut data, image voltage sag data in which a data voltage of a specific part is instantaneously dropped in the image data, bright field data indicating a bright part in the image, And dark field data indicative of a dark portion in the wafer. 3. The method of claim 2,
The cleanser portion smoothly connects edge lines of image data including edge bead remove (EBR) cut data, image voltage sag data in which a data voltage of a specific portion drops instantaneously in order to eliminate variability in length to be measured Wherein the wafer is subjected to a smoothing process. 3. The method of claim 2,
The cleanser unit may include bright field data for displaying a bright portion in an image according to a morphological sampling theorem, image data including dark field data for displaying a dark portion in the image, And the position of the image data is converted into X-axis and Y-axis coordinates by detecting an area of a predetermined size or more. delete 3. The method of claim 2,
The measurement unit calculates and outputs an edge bead length corresponding to each brightness according to the position of the image voltage sag data in which a data voltage of a specific part is instantaneously dropped in EBR (edge bead remove) cut data and image data Of the wafer. 3. The method of claim 2,
Wherein the measurement unit measures bright field data representing a bright portion in an image and dark field data representing a dark portion in the image. The method according to claim 1,
And a monitor for displaying the image discriminated by the discriminating unit,
Wherein the discriminator converts the discriminated image into a dart graph or a chart graph and displays it on the monitor. 12. The method of claim 11,
Wherein the determination unit displays the boundary surfaces of the wafer edge portion on the monitor so as to overlap the live image. A method of monitoring a border of a wafer for processing an image by photographing an edge portion of the wafer rotated by the spinner,
A decompressing step of decompressing the compressed BMP image file photographed with the foreign substance of the wafer into a BMP original file;
A decompresed converter step of generalizing binary decompressed original BMP image files;
In order to eliminate variability in the length to be measured, preprocessing of the polygonalized image data requires EBR (edge bead remove) cut data, image data including image voltage sag data in which the data voltage of a specific part is instantaneously dropped in the image data Bright field data for displaying a bright portion in an image in accordance with morphological sampling, or dark field data for displaying a dark portion in an image. A cleanser step of exposing a part of the area of the image data to detect an area of a predetermined size or more and converting the coordinates of the X and Y axes;
By sampling the preprocessed image data, a part of the area of the image data including the bright field data and the dark field data is sampled according to the morphological sampling and the sampling, a sampling step; And
The EBR (edge bead remove) cut data, the image voltage sag data and the angles and positions of the given lines of the sag data are measured by measuring the length or area of the necessary portion of the preprocessed or sampled polygonal image data. A measurement step of calculating and returning an outline length corresponding to brightness;
Wherein the edge portion of the wafer includes a plurality of wafers. delete

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