KR101453115B1 - Reduction of the entrance mark and exit mark left by the substrate-processing meniscus - Google Patents

Abstract

A proximity head for generating and maintaining a meniscus for processing a substrate is described. The proximity head includes a plurality of meniscus nozzles formed on one side of the proximity head and configured to supply liquid to the meniscus, a plurality of meniscus nozzles formed on the side of the proximity head and configured to completely surround the plurality of meniscus nozzles A plurality of vacuum ports arranged and a plurality of gas nozzles formed on said face of the proximal head and at least partially surrounding the vacuum ports. The proximity head includes means for reducing the size and frequency of the entrance and / or exit marks at the leading and trailing edges on the substrate by facilitating and facilitating liquid exiting the meniscus through the gap between the substrate and the carrier .

Substrate processing, carrier, meniscus, gap, vacuum port, gap ejection gas nozzle

Description

REDUCTION OF ENTRANCE AND EXIT MARKS LEFT BY A SUBSTRATE-PROCESSING MENISCUS LEFTED BY THE SUBSTRATE-PROCESSING MENUSCUS

inventor

Robert O'Donnell, John de Larios, Mike Ravkin

Technical background

In the semiconductor chip manufacturing industry, it is necessary to clean and dry the substrate, which has unwanted residues remaining on the surface of the substrate, after the manufacturing operation is performed. Examples of such fabrication operations include plasma etching (e.g., tungsten etchback (WEB)) and chemical mechanical polishing (CMP). In CMP, the substrate is placed in a holder that pushes the opposite side substrate surface of the polishing surface. The polishing surface uses a slurry made of a chemical material and an abrasive material. Unfortunately, the CMP process tends to leave accumulations and residues of slurry particles on the substrate surface. If left on the substrate, undesired residual materials and particles may cause defects. In some cases, such defects render the device on the substrate inoperable. After the fabrication operation, the substrate is cleaned to remove unwanted residues and particles.

After the substrate has been rinsed with water, the substrate should be efficiently dried to prevent debris from remaining water or cleaning fluid (hereinafter "fluid ") and substrate. If the cleaning liquid on the substrate surface is allowed to evaporate, dirt and contaminants previously dissolved in the fluid will remain on the substrate after evaporation and form spots, such as would normally occur when droplets are formed. To prevent evaporation from occurring, the cleaning liquid must be removed as soon as possible without forming droplets on the substrate surface. In an attempt to achieve this, one of several different drying techniques is used, such as spin-drying, IPA, or Marangoni drying. Both of these drying techniques use some form of moving liquid / gas interface on the substrate surface and, if properly maintained, dry the substrate surface without forming droplets. Unfortunately, when the moving liquid / gas interface breaks, as often occurs in all of the drying methods described above, droplets are formed and evaporation occurs, resulting in leaving contaminants on the substrate surface.

In view of the foregoing, there is a need for an improved cleaning system and method that provides efficient cleaning while reducing the likelihood of marks from dried fluid drops.

summary

Broadly speaking, the present invention fulfills these needs by providing various techniques for reducing the entrance mark and / or exit mark caused by dried fluid drops left by the substrate-processing meniscus.

It is to be appreciated that the present invention may be embodied in many ways, including as a process, an apparatus, a system, a device, or a method. In the following, some inventive embodiments of the invention are described.

In one embodiment, a proximity head is provided for generating and maintaining a meniscus during processing of a substrate. The proximal head is formed on one side of the proximal head and includes a plurality of meniscus nozzles configured to supply liquid to the meniscus, a plurality of meniscus nozzles formed on the face of the proximal head, And a plurality of vacuum ports arranged to surround. A plurality of major gas nozzles may be formed on the face of the proximity head, and the major gas nozzles at least partially surround the vacuum ports. The proximity head includes means for reducing the size and frequency of the entrance and / or exit marks at the leading and trailing edges on the substrate by facilitating and facilitating liquid exiting the meniscus through the gap between the substrate and the carrier .

In another embodiment, a method of processing a substrate using a meniscus formed by an upper proximity head and a lower proximity head is provided. In this method, a substrate is disposed on a carrier passing through a meniscus generated between an upper close-up head and a lower close-up head. The carrier has an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, wherein the opening is slightly larger than the substrate and there is a gap between the substrate and the opening. Each of the upper and lower proximity heads comprises a plurality of meniscus nozzles formed on one side of the proximity head and configured to supply liquid to the meniscus; A plurality of vacuum ports formed on the surface of the proximity head and arranged to completely surround the plurality of meniscus nozzles; And a plurality of main gas nozzles formed on the surface of the proximity head and at least partially surrounding the vacuum ports. The method further includes reducing the size and frequency of at least one of the entry mark or exit mark on the substrate by facilitating the liquid from the meniscus to exit the gap using the upper and lower proximity heads .

Due to the introduction of a moving meniscus generated by the proximity head for use in cleaning, processing and drying semiconductor wafers by the assignee of the present invention, the very low risk of droplets formed on the surface of the substrate The substrate can be wetted and dried. This technique was very successful in preventing any drops from being left on the effective device area of the wafer after the meniscus was removed. However, the meniscus sometimes tends to leave small droplets on the exclusion zone of the substrate at the entry point and / or exit point when the substrate passes through the meniscus. The substrate exclusion zone is at the edge of the substrate and extends from the effective device area to the edge of the substrate where no microelectronic structure is formed. Occasionally, the entrance mark and the exit mark may be the main surface mark, especially on the hydrophilic wafer. It is therefore desirable that these examples of entrance and / or exit marks be reduced or eliminated.

The advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.

Brief Description of Drawings

The present invention will be readily understood by the following detailed description in conjunction with the accompanying drawings, in which like reference numerals designate like elements.

Figure 1 shows a perspective view of an exemplary implementation of a proximity head device.

Figure 2 shows a schematic view of the upper near-head.

Figures 3a, 3b, 3c, and 3d show substrates exiting the meniscus generated by the upper and lower proximity heads.

Figure 4 shows a perspective view of the gap between the carrier and the substrate.

Figure 5 shows a cross-sectional view of the meniscus when the meniscus is fully transferred over the carrier.

Figure 6a shows a top view of the lower proximity head with means for reducing the size and frequency of the entrance mark and the exit mark.

Figs. 6B, 6C and 6D show various meniscus projection sizes and shapes.

7 shows a top view of the carrier, the substrate, and the meniscus.

Figures 8A, 8B and 8C show an exemplary embodiment of a proximity head having means for reducing the size and frequency of the entrance and exit marks.

Figures 9a and 9b show an exemplary embodiment of a proximity head with means for reducing the size and frequency of the entrance and exit marks.

10 shows another embodiment of a proximity head having means for reducing the size and frequency of the entrance mark and the exit mark.

details

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. In other respects, well-known process steps and / or structures have not been described in detail in order not to unnecessarily obscure the present invention. As used herein, the term "meniscus" refers to the volume of liquid that is partially bound by the surface tension of the liquid and contained. In addition, the meniscus is controllable and can be moved over the surface in an included configuration. In certain embodiments, the maniscus is also maintained by delivering the fluid to the surface and also removing the fluid, the meniscus remaining controllable. In addition, the manifold shape can be controlled by a removable system that is partially interfaced with a computing system and controller that may be networked and by precise fluid delivery.

FIG. 1 is a perspective view of an exemplary implementation of a proximity head device 100. In this embodiment, the substrate 160 is disposed within the carrier 150, which passes between the upper proximity head 110 and the lower proximity head 120 in the direction of arrow 152. The upper proximity head 110 and the lower proximity head 120 form a meniscus of fluid between the heads. The carrier 150 may be connected to several devices (not shown) that cause the carrier 150 to move in the direction of the arrow 166 between the upper and lower proximity heads 110, 120. The substrate 160 is placed on the carrier 150 at a first location on one side of the proximity heads 110 and 120 and the carrier 150 is positioned on the opposite side of the proximity heads 110 and 120. In one embodiment, Lt; RTI ID = 0.0 > location < / RTI > The carrier 150 then passes again through the proximity heads 110 and 120 or above, below, or around the proximity heads 110 and 120 to form a first position , And the process is repeated.

1, the substrate is moved in the direction of the arrow 152 through the proximity heads 110 and 120 while the substrate is stationary and the proximity heads 110, 120 pass through the top and bottom of the substrate. Further, when the substrate passes between adjacent heads, the orientation of the substrate is arbitrary. That is, the substrate is not required to be oriented horizontally but instead can be oriented vertically or at any angle.

In certain embodiments, controller 130, which may be a general purpose or special purpose computer system whose functionality is determined by logic circuitry, software, or both, may be coupled to upper proximity head 110 and lower proximity head 120 Thereby controlling the flow of the fluid and the movement of the carrier 150.

2 shows a schematic view of the upper proximity head 110. Fig. The proximity head includes a plurality of central meniscus nozzles 116 formed in the face 111 of the proximity head 110 through which liquid is supplied to form the meniscus 200. The liquid may be pure water, a cleaning solution, or other liquid designed to treat, clean, or rinse the substrate 160. A plurality of vacuum ports 114 apply a vacuum around the meniscus 200. The vacuum port 114 draws liquid from the meniscus 200 and surrounding fluid such as air or other gas supplied by the nozzle 112. In certain embodiments, the nozzle 112 surrounds the vacuum port 114 and supplies isopropyl alcohol vapor, nitrogen, mixtures thereof, or other gases or gases or gas / liquid fluids. Depending on the implementation, the main gas nozzles 112 and the fluids supplied therefrom help maintain a coherent liquid / gas interface at the surface of the meniscus 200. In one embodiment, the main gas nozzle 112 is not present or not used. In another embodiment, the main gas nozzle 112 supplies a mixture of carbon dioxide (CO ₂ ) or N ₂ and isopropyl alcohol (IPA) vapor. Although not shown in FIG. 2, the lower proximity head 120 may be provided as a mirror image of the upper proximity head and may operate in a similar manner.

3A-3D illustrate a substrate 160 exiting a meniscus 200 generated by an upper proximity head 110 and a lower proximity head 120. 3A, the substrate 160 extends in four directions through the meniscus 200 such that the leading edge 162 and the trailing edge 164 are on opposite sides of the meniscus 200. Although not shown in the figures, the substrate 160 is generally circular and the carrier 150 is shown as being external to the meniscus 200, and a portion of the carrier 150 is shown on the meniscus 200, Lt; / RTI >

In FIG. 3B, the meniscus 200 is transitioned from the substrate 160 to the carrier 150. The carrier 150 may be slightly thicker in cross-section than the substrate 160. For example, the substrate 160 may be about 0.80 mm thick, while the carrier may be about 1.5 mm thick. Thus, when the meniscus 200 transitions on the carrier 150, any amount of meniscus liquid is displaced by the carrier 150.

In Fig. 3C, the meniscus 200 is completely off the substrate 160 and transitions on the carrier 150. At this time, the trailing edge 234 of the meniscus 200 is still in contact with the trailing edge 164 of the substrate 160. At this point, the force acting on the meniscus 200 will be described with reference to Fig. 5 below.

In Figure 3D, the meniscus leaves a small drop 202 of meniscus liquid on the exclusion zone of the substrate 160 at the trailing edge 164 of the substrate 160, leaving the substrate 160 It was completely deviated. If drying is allowed, the droplets 202 may leave a spot that is dissolved or in the form of a co-existing element, which is referred to herein as an exit mark. If the substrate surface is hydrophilic, the droplets 202 may migrate to an effective device region of the substrate that can cause defects in the device formed on the substrate. A number of factors are known to contribute to the size and presence of small droplets 202 at the trailing edge 164 of the substrate 160. It is noted that the entrance mark at the leading edge 162 may be formed in a manner similar to the trailing edge 162 exiting the meniscus 200.

4 shows a perspective view of a gap 158 between the carrier 150 and the substrate 160. As shown in FIG. The meniscus periphery 204 represents the contact area between the carrier 150 and the substrate 160 and meniscus. The meniscus is moved in the direction indicated by the arrow 208. As the meniscus exits the substrate 160, the edge of the meniscus sweeps the meniscus fluid in the carrier-substrate gap 158 along arrow 206 direction. When the trailing edge 210 of the meniscus periphery 204 reaches the trailing edge 164 of the substrate 160 the fluid is directed toward a point 212 in the gap adjacent to the trailing edge 164 of the substrate . With the meniscus transition on the carrier 150, the fluid in the gap 158 is recognized to flow constantly outside the gap 158. Therefore, although the fluid is not actually expected to follow the arrow 206, the vector component of the direction of flow lies on the arrow 206 resulting in the build-up of the fluid at point 212.

5 shows a cross-sectional view of the meniscus 200 at point 212 when the meniscus is fully transferred over the carrier 150. FIG. At this time, the meniscus 200 is still in contact with the rear edge 164 of the substrate 160. The carrier 150 may be somewhat thicker than the substrate 160 and prevents the flow of liquid away from the substrate 160 along arrow 214. The vacuum port 114 draws a fluid comprising the meniscus liquid and the surrounding gas and exerts a force indicated by arrow 216 against the meniscus liquid. As shown by arrow 218, further force is exerted by the fluid exiting the nozzle 112 (FIG. 2) pushing inward against the gas / liquid interface of the meniscus 200. Further, the gravitational force 221 is applied to the meniscus 200. If the substrate 160 is hydrophilic, the attraction to the meniscus liquid can cause hydrogen bonding forces to draw water back on the substrate 160, as indicated by the arrow 222.

6A shows a lower proximity head 120 having means for reducing the size and frequency of the entrance and exit marks by facilitating the flow of meniscus liquid from the carrier-substrate gap when the meniscus is off the substrate On the other hand. 2, the lower proximity head 120 includes a plurality of meniscus nozzles 116 centrally located to supply meniscus liquid, and a plurality of meniscus nozzles 116 centrally located to supply meniscus liquid. And a plurality of vacuum ports (114) arranged to surround. The vacuum port 114 sucks the meniscus liquid and the surrounding gas. Optionally, a plurality of major gas nozzles 112 at least partially surround the vacuum port 114 and provide a gas or gas / liquid mixture to help maintain the integrity of the gas / liquid interface of the meniscus . A meniscus nozzle 116, a vacuum port 114 and optionally a main gas nozzle 112 are formed in the face 121 of the proximity head 120. In one embodiment, means for reducing the size and frequency of the entrance and exit marks are provided by projections located centrally on the rear end side 122 of the meniscus. The arrangement of vacuum ports 114 determines the shape of the meniscus. Figure 6 shows a top view of the lower proximity head 120 at the center 125 by locating the vacuum port 114 farther from the axis defined by the meniscus nozzle 116 and adjacent the main gas nozzle 112 Lt; RTI ID = 0.0 > 120 < / RTI > A corresponding center protrusion is formed on the upper proximity head 110 (Fig. 1) so that all of the proximity heads generate a meniscus protrusion located at the center on the rear end side of the meniscus.

Figure 6b shows an outline of an exemplary meniscus configuration formed by the proximity head of Figure 6a. The meniscus includes a main portion 225 and a protrusion 220. The protrusions 220 may have various shapes. 6C, the protrusion 220A has a straight tip, the protrusion 220B has two convex tip edges that gently extend from the meniscus to the center point, and the protrusion 220C Has a concave leading edge, and the protrusion 220D has a complex leading edge shape. In one embodiment, the leading edge is concave as shown at 220C, which has a curvature of the same radius as the substrate 160 (FIG. 7).

In Fig. 6C, the minimum protrusion size is shown to have a protrusion extension range 224 that is equal to the distance between two adjacent vacuum ports, and a protrusion width 226 that is equal to the distance between the three adjacent vacuum ports. However, the protrusions can be of any suitable size. In one embodiment, for example, the protrusions have a width defined by an extension range equal to the length defined by the spacing of the six adjacent vacuum ports and the spacing of the twelve vacuum ports, each vacuum port having a diameter 0.06 inch and a pitch of 0.12 inches (center-to-center space).

7 shows a top view of the carrier 150, the substrate 160, and the meniscus periphery 204 at the first position 230 and the second position 232. As shown in FIG. The carrier 150 moves in the direction indicated by the arrow 166 and / or the meniscus moves in the direction indicated by the arrow 208. The carrier 150 includes a plurality of support pins 152 each having a substrate support and a centering structure (not shown) to provide a uniform substrate-carrier gap 158 between the substrate 160 and the carrier 150. [ . The carrier 150 has an angled edge at the leading end side 154 and the trailing side 156 so that as the carrier 150 enters and exits the meniscus, Avoid sudden changes. For example, the carrier 150 may include two leading edges 155, each forming a point centered at an angle &thetas; from the transverse direction, and a point located at the center, And has six sides with corresponding trailing edge 159 to form. In one embodiment, [theta] is about 15 [deg.]. It is also possible to have other shapes (e.g., trapezoidal or parallelogram) that do not result in rapid displacement of the meniscus liquid, where the leading edge and trailing edge are at angles other than perpendicular to the direction of movement of the carrier Or diagonally (i.e., not parallel) with respect to the leading and trailing edges of the meniscus.

At any point in time, the meniscus is placed in position 230 and moved in one direction 208 with respect to carrier 150. Thereafter, the meniscus is placed in position 232. In position 232, the protrusion 220 extends across the gap 158. Because of the protrusion 220, the trailing edge 210 of the meniscus periphery 204 is not a straight line tangent to the gap 158. As a result, the fluid outlet point 212 (FIG. 4) has additional time to escape from the gap 158 due to the presence of the protrusion 220. Since the fluid has an additional time to escape from the gap 158, it remains attached to the substrate 160 and is less likely to leave a mark.

In addition, the protrusions 220 may be effective to reduce the entrance mark formed at the leading edge 162 of the substrate 160. In one embodiment, a centrally located indentation is formed on the leading edge of the meniscus (not shown) to further reduce the case of the entrance mark. The shape of the protrusion 220 including the depth of the protrusion 220 which is the amount of the extension of the protrusion 220 and the width of the protrusion 220 may vary according to the implementation, but in one embodiment, Providing a sufficient extension range to improve the flow of meniscus liquid from the carrier-substrate gap.

Figures 8A, 8B and 8C illustrate a method for reducing the size and frequency of the entrance and exit marks by facilitating the flow of meniscus liquid from the carrier-substrate gap when the meniscus is off the substrate Lt; RTI ID = 0.0 > 250 < / RTI > Specifically, as shown in FIG. 8C, when the meniscus is completely deviated from the substrate 160, the proximity head 250, which may be an upper close head or a lower close head, is disposed at a center formed on the surface 251 And a gap outlet gas nozzle 252 to provide additional gas supply to push the meniscus 200. As discussed above with reference to Figure 5, the meniscus touching the substrate 160 and the substrate-carrier gap 158 includes surface tension that attracts the meniscus onto the substrate and prevents transition on the carrier, Is a subject of a competing force that includes a suction force pulling both the substrate and the carrier out, and gravity pulling the meniscus liquid into the substrate-carrier gap 158. In addition, the gas flow exerts a positive pressure on the meniscus 200, thus aiding in opposing surface tension forces that may result in an inlet mark and an outlet mark. The main gas nozzles 112 deliver carbon dioxide or nitrogen and / or isopropyl alcohol vapor to the meniscus to aid in the overall containment of the meniscus and wafer drying. However, the main gas nozzles 112 are arranged such that the main gas nozzles 112 arranged around at least a portion of the vacuum port 114 affect the actual volume of the entire meniscus or meniscus, It can not be used to facilitate mark removal. On the other hand, the one or more gap ejection gas nozzles 252 provide a localized "fan" or "curtain" of gas flow that can be controlled independently, And is selectively applied to the meniscus interface. The meniscus is not secured to the wafer so that the trailing edge of the meniscus 200 moves out of the substrate 160 or onto the substrate to reduce the size and likelihood of entrance and exit mark structures, The meniscus liquid that exits the gap 158 and returns to the meniscus is pushed back by applying additional pressure to the meniscus 200 using the gap exit gas nozzle 252 .

In certain embodiments, a plurality of central fluid port sections provide additional pressure during and immediately before the transfer by the trailing edge of the meniscus between the substrate 160 and the carrier 150. In this embodiment, one or more centrally disposed gap ejection gas nozzles 252 are surrounded by one or more additional third nozzles 254 shown in FIGS. 8A and 8B. Any number of zones may be provided and each zone is independently controlled by a controller 130 (FIG. 1) to provide gas pressure to the meniscus 200 at a suitable time during the meniscus transition. The controller 130 may include a mechanical or computer-initiated timing mechanism. For example, the mechanical timing mechanism may activate a gap ejection gas nozzle 252 (or gap ejection gas nozzle 252 and second gap ejection nozzle 254) using a proximity sensor (not shown) , Wherein the proximity sensor responds to the position of the carrier 150 relative to the upper and lower proximity heads 110, 120 (FIG. 1). The computer-initiated timing mechanism may include position information from a robotic actuating mechanism (not shown) used to carry the carrier 150 through the meniscus.

Figures 9a and 9b show a cross-sectional view of a proximity head having means for reducing the size and frequency of the entrance and exit marks by promoting the flow of meniscus liquid from the carrier-substrate gap when the meniscus is off the substrate. RTI ID = 0.0 > 260 < / RTI > In particular, the proximity head 260 includes a divided vacuum manifold to provide a plurality of vacuum port sections connected to respective independent vacuum sources. By providing a vacuum source that is independent of the center zone 262 having a vacuum port formed in the face 216 at a location corresponding to the trailing edge of the meniscus, the meniscus liquid exiting the carrier- Vacuum shunting to facilitate flow is minimized.

When some vacuum ports overrun with liquid, vacuum shunting occurs. In this case, the pressure drop across the face plate 265 (Fig. 9A) is insufficient to clean the liquid, so that fluid from the gases and meniscus may be converted to a nearby vacuum port. When a significant volume of water is trapped between the wafer and the carrier, vacuum shunting may occur when the meniscus is completely out of the substrate. This reduces the available suction force at the most precise spot (at the trailing edge of the substrate when the substrate exits the meniscus). Thus, the reduced availability of vacuum can reduce the removal of liquid from the substrate-carrier gap, which can leave the exit mark structure. At the leading edge of the substrate at which the exit mark can be formed, a similar effect can occur.

By providing an independent vacuum source in the central zone 262 of the vacuum port disposed centrally on the trailing edge of the meniscus, vacuum shunting is minimized and the flow of meniscus liquid exiting the carrier- .

9A and 9B, a plurality of meniscus nozzles 116 formed in the surface 261 provide a meniscus liquid to the meniscus 200 (FIG. 2). A vacuum port 114 surrounds the meniscus nozzle 116 and the vacuum port draws a mixture of the meniscus liquid and the surrounding gas. A main gas nozzle 112, at least partially surrounding the vacuum port 114, may be provided to provide a gas or gas / liquid mixture that may help maintain the original meniscus appearance. In one embodiment, the vacuum port 114 includes a first zone 262 centrally located along the trailing edge 204 of the proximity head 260, and at least one additional And is divided into a plurality of zones including zones 263 and 264. The additional zone (s) include a second zone 264 comprising a plurality of vacuum ports 114 on either side of the first zone 262, and a third zone 263 including the remaining vacuum port 114. [ . ≪ / RTI > Each zone 263,262 and 264 has a corresponding dedicated manifold 271,272 and 274 and each of the manifolds 271,272 and 274 has a corresponding connection 281,282,284 And is in fluid communication with the vacuum source 280.

Figure 10 shows a cross-sectional view of another embodiment of a proximity head having means for reducing the size and frequency of the entrance and exit marks by promoting the flow of meniscus liquid from the carrier-substrate gap when the meniscus is off the substrate Fig. The proximity head 290 includes a plurality of meniscus nozzles 116 formed in the surface 291 to supply meniscus liquid. On the surface 291, a plurality of vacuum ports 114 for sucking the meniscus liquid and the surrounding gas surround the meniscus nozzle 116. The vacuum port 114 is connected to a first row 293 of vacuum ports 114 that completely surround the meniscus nozzle 116 and a second row 293 of vacuum ports 114 adjacent the center of the rear edge 298 of the proximity head 290 114). ≪ / RTI > The vacuum port 114 located in the first row 293 is connected to a conventional manifold as described above to the zone 263 in FIG. 9A. The vacuum port 114 in the second row 295 is connected to one of the one or more additional manifolds. The vacuum port 114 of the second row 295 is connected to one manifold (not shown) in a zone 292 centrally located on the rear end side of the proximity head 290, The vacuum port 114 of the second row 295 is connected to another manifold (not shown). Each manifold includes a connection independent of the vacuum source described above with reference to Figure 9A.

It is noted that either or both of the upper and lower proximity heads may be controlled by a computer system such that the speed of movement of the carrier relative to the proximal head may be constant or varied with the position of the carrier relative to the proximal head . In some embodiments, for example, the moving speed of the carrier may be slower than the movement of the meniscus off of the substrate, also on the substrate, thereby resulting in additional time for the meniscus liquid to flow out of the carrier-substrate gap to provide. Further, the gas flow through the gas nozzles 112, 252 (FIG. 8C) and the vacuum supplied to the vacuum port 114 (FIGS. 9A-10) are mechanically and / or computer controlled to determine the activation / deactivation timing of the suction force Or to change the flow rate according to the relative position of the carrier with respect to the proximity head. Computer control may be implemented in conjunction with a general purpose computer processor using hardware logic or using a recorded computer program to control the application of movement and / or suction forces. In certain embodiments, the computer program also controls the composition and / or volume of the fluid supplied to the meniscus. Thus, a computer program may define a fluid recipe that is specifically tailored for each of a plurality of given applications.

With the foregoing embodiments in mind, it should be understood that the present invention may utilize a variety of computer-implemented operations, including data stored within a computer system. These operations are operations that require physical manipulation of physical quantities. Primarily, though not necessarily, these quantities have the form of electrical or magnetic signals that can be stored, transferred, combined, compared, and otherwise manipulated. In addition, operations are often referred to as terms such as generation, identification, determination, or comparison.

Any of the operations described herein that form part of the present invention are useful for machine operation. The invention also relates to a device or apparatus for performing these operations. The device may be specially configured for the required purpose, or the device may be a general purpose computer selectively activated or configured by a computer program stored in the computer. In particular, various general purpose machines may be used with computer programs recorded in accordance with the teachings of the present invention, and may be more convenient to configure more specialized devices to perform the required operations.

The invention may also be embodied as computer readable code on a computer readable medium. The computer-readable medium is any data storage device capable of storing data, after which the data can be read by the computer system. The computer readable medium also includes an electromagnetic carrier on which the computer code is stored. Examples of computer-readable media include, but are not limited to, hard drives, network attached storage (NAS), read-only memory (ROM), random-access memory (RAM), CD-ROM, CD-R, CD- Optical and non-optical data storage devices. The computer-readable medium may also be distributed on a network-coupled computer system such that the computer readable code is stored and executed in a distributed fashion.

Embodiments of the present invention may be processed on a single computer or using multiple computers or computer components interconnected. A computer as used herein may be a standalone computer system having its own process (s), its own memory, and its own storage, or distributed computing system, providing computer resources to a networked terminal . In some distributed computing systems, a user of a computer system may be actually accessing component parts shared among a plurality of users. Thus, users can access virtual machines on the network that appear to the user as one computer that is customized and dedicated for one user.

Although the foregoing invention has been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications may be practiced within the scope of the claims. Accordingly, the embodiments are to be considered as illustrative and not restrictive, and the invention is not to be limited to the details provided herein, but may be modified within the scope of the appended claims, or equivalents thereof.

Claims (23)

A proximity head for generating and maintaining a meniscus for processing a substrate, Wherein the substrate is supported by a carrier, the carrier including a frame surrounding the substrate, The near- A plurality of meniscus nozzles spaced from each other along a linear axis on one side of the proximity head, the meniscus nozzles configured to supply meniscus liquid to the meniscus; A plurality of vacuum ports spaced apart from each other on the face of the proximity head and arranged to form a suction area completely surrounding the plurality of meniscus nozzles adjacent to the plurality of meniscus nozzles, Wherein a portion of the vacuum ports of the plurality of vacuum ports are located farther from the linear axis along which the plurality of meniscus nozzles are formed than the rest of the plurality of vacuum ports located along the linear axis, Said plurality of vacuum ports, Wherein a portion of the plurality of vacuum ports located further from the linear axis at a center portion of the proximal head reduces the size and frequency of at least one of the entrance and exit marks at the leading and trailing edges on the substrate And facilitates and facilitates liquid from the meniscus exiting the gap between the substrate and the carrier. The method according to claim 1, Further comprising a plurality of gas nozzles formed on the face of the proximity head and at least partially surrounding the plurality of vacuum ports. The method according to claim 1, Wherein a portion of the plurality of vacuum ports located further away from the linear axis at a central portion of the proximal head is configured such that when the leading edge of the substrate exits the trailing edge of the meniscus, To exit the gap, thereby reducing the size and frequency of the entrance mark. The method according to claim 1, Wherein a portion of the plurality of vacuum ports located further from the linear axis at a central portion of the proximal head causes the meniscus to have protrusions on a back end side of the meniscus, Wherein the protrusions are centrally located to eject fluid at the leading edge and the trailing edge of the substrate. 5. The method of claim 4, Wherein the shape of the protrusion includes two concave edges extending from the trailing edge to a center point. The method according to claim 1, Further comprising at least one gap ejection gas nozzle disposed centrally on a rear end side of the proximity head, Wherein the at least one gap ejection gas nozzle is in fluid communication with a gas supply connection for supplying gas and provides a flow of gas exiting the substrate and exerting a force against the liquid returning back to the meniscus Wherein the proximal head comprises: The method according to claim 6, Wherein the at least one gap ejection gas nozzle is arranged adjacent to a plurality of major gas nozzles formed on the face of the proximal head, The plurality of main gas nozzles at least partially surrounding the plurality of vacuum ports, Wherein the at least one gap discharge gas nozzle is in fluid communication with a gas supply connection to supply gas independently of the plurality of major gas nozzles. The method according to claim 6, Further comprising at least one plurality of second gap discharge nozzles, Wherein each of the plurality of second gap discharge nozzles includes a plurality of second gap discharge nozzles disposed on either side of the at least one gap discharge nozzle and in fluid communication with a corresponding connection for supplying gas independently of the at least one gap discharge nozzle head. The method according to claim 1, Wherein the plurality of vacuum ports are divided into a plurality of zones, Wherein the plurality of zones include at least a central zone located on a trailing side of the face of the proximal head, Wherein each of the plurality of zones comprises a corresponding independent vacuum connection in fluid communication with the vacuum ports of the zone. 10. The method of claim 9, Wherein the plurality of zones comprises a second zone including all of the vacuum ports but not the vacuum ports of the central zone. 10. The method of claim 9, Said plurality of zones including a second zone comprising vacuum ports arranged on both sides of said central zone and a third zone comprising both vacuum zones and not vacuum zones of said central zone or said second zone , Close-up head. 10. The method of claim 9, Said central zone comprising a single column of vacuum ports, Wherein the plurality of zones further comprises a second zone comprising vacuum ports of other rows along the single row of vacuum ports of the central zone. A method of processing a substrate using a meniscus formed by an upper proximity head and a lower proximity head, Disposing the substrate on a carrier having an opening sized for receiving the substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate, Disposing the substrate with a gap between the substrate and the opening; Passing the substrate and the carrier through a meniscus generated between the upper and lower proximity heads, wherein each of the upper and lower proximity heads is formed on one side of the proximal head Wherein the plurality of meniscus nozzles are configured to supply liquid to the meniscus, wherein each of the upper and lower proximity heads is formed on the surface of the proximal head Wherein the plurality of vacuum ports are arranged to form a suction region that completely surrounds the plurality of meniscus nozzles adjacent the plurality of meniscus nozzles, Passing the substrate and the carrier through the substrate; And Reducing the size and frequency of at least one of the entry mark or exit mark on the substrates by using the upper and lower proximity heads to facilitate liquid from the meniscus to exit the gap / RTI > Wherein reducing the size and frequency of at least one of the entry mark and the exit mark on the substrates comprises generating the meniscus to have a protrusion on the back end side of the meniscus, Wherein the protrusions are centrally located to eject fluid at a leading edge and a trailing edge of the substrate. 14. The method of claim 13, Wherein decreasing the size and frequency of at least one of the entry mark or the exit mark comprises causing liquid from the meniscus to flow through the gap when the leading edge of the substrate exits the trailing edge of the meniscus. And reducing the size and frequency of the entry mark. ≪ Desc / Clms Page number 17 > 14. The method of claim 13, Wherein each of the upper and lower proximity heads includes at least one gap ejection gas nozzle disposed centrally on a rear end side of the proximal head, Wherein reducing the size and frequency of at least one of the entry mark or the exit mark comprises applying a force exerted on the meniscus out of the at least one gap exit gas nozzle to move the gap away from the substrate Further comprising: controlling the gas flow to the at least one gap ejection gas nozzle so as to exit and push the liquid back to the meniscus. ≪ Desc / Clms Page number 19 > 16. The method of claim 15, Wherein the at least one gap ejection gas nozzle is arranged adjacent a plurality of main gas nozzles formed on the face of the proximal head, The plurality of main gas nozzles at least partially surrounding the vacuum ports, Wherein the at least one gap discharge gas nozzle is in fluid communication with a gas supply connection to supply gas independently of the plurality of major gas nozzles, The method of processing a substrate using the meniscus further comprises independently controlling the at least one gap ejection nozzles to apply the force only when the trailing edge of the meniscus exits the gap Wherein the substrate is processed using a meniscus. 16. The method of claim 15, Wherein the proximity head further comprises at least one plurality of second gap discharge nozzles, Wherein each of the plurality of second gap discharge nozzles is disposed on either side of the at least one gap discharge nozzle on the upper and lower proximity heads, The method of processing with the meniscus further comprises the step of supplying a gas to the at least one second plurality of gap ejection nozzles to supply gas when the trailing edge of the meniscus transitions between the substrate and the carrier. ≪ / RTI > further comprising the step of independently controlling the gas flow into each of the plurality of processing chambers. 14. The method of claim 13, Wherein the plurality of vacuum ports are divided into a plurality of zones, Wherein decreasing the size and frequency of at least one of the entry mark and the exit mark comprises independently supplying vacuum to the plurality of zones of vacuum ports, And at least one central region located on a posterior side of the face. ≪ Desc / Clms Page number 13 > 19. The method of claim 18, Wherein the plurality of zones comprises a second zone including both vacuum ports and not vacuum ports of the central zone. 19. The method of claim 18, Said plurality of zones including a second zone comprising vacuum ports arranged on both sides of said central zone and a third zone comprising both vacuum zones and not vacuum zones of said central zone or said second zone A method for processing a substrate using a meniscus. 19. The method of claim 18, Said central zone comprising a row of vacuum ports, Said plurality of zones including a second zone comprising vacuum ports that completely surround meniscus nozzles that supply liquid to said meniscus, said second zone including a series of vacuum ports ≪ / RTI > wherein the substrate is processed using a meniscus. A proximity head for generating and maintaining a meniscus for processing a substrate, Wherein the substrate is supported by a carrier, the carrier including a frame surrounding the substrate, The near- A plurality of meniscus nozzles formed along a linear axis on one side of the proximal head and configured to supply meniscus liquid to the meniscus; A plurality of vacuum ports formed on the face of the proximity head and arranged to form a suction area completely surrounding the plurality of meniscus nozzles adjacent the plurality of meniscus nozzles, A portion of the plurality of vacuum ports is located along a linear axis such that the suction region in the central portion extends in a mirrored concave shape from the linear axis to a point on the center point of the center portion of the proximal head The plurality of vacuum ports being located farther from the linear axis along which the plurality of meniscus nozzles are formed than in the rest of the plurality of vacuum ports and at a central portion of the proximity head; A plurality of gas nozzles formed on the face of the proximity head and at least partially surrounding the plurality of vacuum ports, Wherein said enamel concave shape of said suction region at a central portion of said proximity head reduces the size and frequency of at least one of an entrance mark and an exit mark at a leading edge and a trailing edge on said substrate, To facilitate the escape of liquid in the gap between the substrate and the carrier. delete

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