KR101476445B1 - Organic electroluminescent display device - Google Patents

Abstract

According to the present invention, there is provided a semiconductor device comprising: a loader portion for loading a substrate on a transport path; An alignment unit for aligning the mask on the substrate; And a film forming chamber portion in which a plurality of source portions are disposed so as to be spaced apart from each other, wherein an organic material source from the source portion is sequentially deposited on the substrate through the open portion of the mask while the substrate moves along the transport path, The length of each of the source portions orthogonal to the moving direction is longer than the length of the substrate in the transverse direction perpendicular to the moving direction of the substrate.

Organic electroluminescence display, organic thin film layer, deposition

Description

[0001] The present invention relates to an organic light emitting display,

The present invention relates to an organic light emitting display.

The organic electroluminescent device injects electrons and holes from the electron injecting electrode and the hole injecting electrode into the light emitting layer, and excites the excited electrons and holes, And emits light when it is dropped to the ground state.

The organic electroluminescent device forms a lower electrode on a substrate and an organic light emitting layer and an upper electrode on the lower electrode. The organic light emitting layer includes a lower common layer, a light emitting layer, and an upper common layer. The lower common layer is located between the lower electrode and the light emitting layer, and the upper common layer is located between the light emitting layer and the upper electrode.

Conventionally, an apparatus for fabricating an organic light emitting display includes a substrate and a mask aligned to form an organic thin film layer such as an organic light emitting layer on a substrate, and a substrate and a mask are loaded in a vacuum chamber.

Conventionally, in order to form an organic thin film layer, a robot has to be used for transferring substrates to different vacuum chambers. However, when the size of the substrate is 5 generations (1100 × 1300 mm) or more and 6 generations (1500 × 1850 mm) It is difficult to transport the substrate by using the robot, which causes a delay in the tact time of the process and causes a difficulty in mass production. Further, in the conventional manufacturing apparatus, a vacuum chamber must be provided for each layer in order to form an organic thin film layer. Such a vacuum chamber is expensive to manufacture and maintain, and is difficult to maintain a high vacuum. In addition, in the conventional manufacturing apparatus, mask deflection occurs due to the weight of the mask and structural problems, and thus there is a problem that uniform film formation is difficult.

Therefore, in order to manufacture an organic light emitting display device in accordance with trend toward large-sized display, a manufacturing apparatus capable of solving the above-described problems must be provided.

SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus for manufacturing an organic light emitting display capable of arranging a plurality of organic source units in one chamber and forming an organic light emitting layer, To reduce the cost of operation and to simplify the apparatus, and to facilitate the maintenance and repair of the apparatus. It is also an object of the present invention to uniformly form an organic thin film layer through simplification of an apparatus and to improve a production yield of a product. It is also an object of the present invention to provide a manufacturing apparatus capable of manufacturing an organic light emitting display device in accordance with trend toward larger size.

In order to solve the above-mentioned problems, the present invention provides a semiconductor device comprising: a loader portion for loading a substrate on a transportation path; An alignment unit for aligning the mask on the substrate; And a film forming chamber portion in which a plurality of source portions are disposed so as to be spaced apart from each other, wherein an organic material source from the source portion is sequentially deposited on the substrate through the open portion of the mask while the substrate moves along the transport path, The length of each of the source portions orthogonal to the moving direction is longer than the length of the substrate in the transverse direction perpendicular to the moving direction of the substrate.

The distance disposed between the plurality of source portions may be between 80 cm and 200 cm.

The number of the plurality of source portions may be 5 to 15.

The length of the plurality of source portions may be longer than the length of the substrate in the lateral direction by 50 mm to 200 mm.

The openings of the plurality of source portions may be formed so that the longitudinal direction of the region orthogonal to the direction in which the transport path moves is long.

The size of the openings of the plurality of source portions may be formed so that the organic material source emitted from the openings of the plurality of source portions covers 300 mm to 600 mm in the moving direction of the transport path.

The sizes of the openings of the plurality of source portions may be different for each region arranged in the film forming chamber portion.

The deposition chamber portion may include a deposition portion positioned between the plurality of source portions so as to prevent mutual mixing of the organic material sources emitted from the plurality of source portions.

The organic material source can be separately loaded in a plurality of source portions so that an organic thin film layer including a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer is formed on the substrate.

The organic material source can be deposited in a stacked structure on the substrate.

The present invention provides an apparatus for manufacturing an organic electroluminescence display device capable of arranging a plurality of organic source parts in one chamber and forming an organic light emitting layer, thereby reducing the area of the device, cost for operating the device, simplifying the device, And it is also effective to provide ease of maintenance and repair of the apparatus. Further, the present invention has the effect of uniformly forming an organic thin film layer through simplification of the apparatus and improving the production yield of the product. In addition, the present invention has an effect of providing a manufacturing apparatus capable of manufacturing an organic light emitting display device in accordance with trend toward larger size.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic structural view of an apparatus for manufacturing an organic light emitting display according to an embodiment of the present invention, FIG. 2 is a partial structure view included in the "CS" region of FIG. 1, 1 is a schematic cross-sectional view of an organic light emitting display device manufactured by one embodiment.

1, an apparatus for manufacturing an organic light emitting display according to an exemplary embodiment of the present invention can be roughly divided into a loader unit 151, an alignment unit 153, and a deposition chamber unit 156 . The loader portion 151, the alignment portion 153, and the film forming chamber portion 156 may be located in the chamber.

The loader section 151 is a section for loading a substrate on a transportation path to be transported in one direction. The substrate loaded in the loader section 151 is placed on the transportation path, and the substrate placed on the transportation path is transported along the moving direction of the transportation path. The substrate loaded by the loader section 151 is transferred to the clean section 152. [

On the other hand, the transport path may be a structure that supports both edge regions of the substrate and transports the substrate placed on the transport path in the moving direction. The structure of the transport path must support both edge regions of the substrate because the organic material can be formed through the inner free region except for both edge regions of the substrate.

The clean portion 152 is a portion for cleaning the surface of the substrate. The loaded substrate may be cleaned by a high-pressure spraying method using nozzles, an ultrasonic method, an ozone method, or a general substrate cleaning method. In the clean portion 152, the substrate may be cleaned and then dried or surface treated. The substrate cleaned by the clean portion 152 is transferred to the alignment portion 153. [

The alignment unit 153 is a portion that aligns the mask with the substrate and coats the substrate and the mask in cooperation with the mask loader unit 154. [ The mask can use a structure capable of blocking other regions except the region to be formed. Here, the alignment unit 153 may align the substrate and the mask, and then reload the substrate and the mask on the transport path so that the target direction on the substrate faces the bottom surface of the transport path. The substrate and the mask bonded together by the aligning section 153 are transferred to the film forming chamber section 156.

Meanwhile, the buffer unit 155 may be positioned between the alignment unit 153 and the film deposition chamber unit 156. The buffer unit 155 may control the output time difference between the substrate and the mask, which are transferred to the film deposition chamber unit 156 through the alignment unit 153.

The film forming chamber portion 156 is a portion for forming an organic thin film layer including a hole injecting layer, a hole transporting layer, a light emitting layer, and an electron transporting layer on a substrate by using an organic material source emitted from a plurality of spaced apart source portions.

When the organic thin film layer is formed on the transport path in the state where the substrate and the mask are attached, the weight of the organic thin film layer can be supported even if the size of the substrate and the mask is large. In addition, since the transport path is provided as a base for supporting the mass of the mask, it is possible to improve the film non-uniformity due to deflection of the mask.

The plurality of source portions disposed in the film forming chamber portion 156 are located on the bottom surface of the transport path and can emit the organic material source loaded therein through the openings. The organic material source may be separately mounted on the plurality of source portions so that the organic thin film layer including the hole injecting layer, the hole transporting layer, the light emitting layer, and the electron transporting layer is formed on the substrate. Here, the emitted organic material source can be deposited on the substrate through the open portion of the mask. The film forming chamber portion 156 will be described in more detail below.

Hereinafter, after the organic thin film layer is formed on the substrate, the substrate can be transferred from the film forming chamber portion 156 to the disassembling portion 158. The disassembling portion 158 separates the mask and the substrate, which are mutually attached through the alignment portion 153. [ The disassembling portion 158 can interlock with the mask unloader portion 159 to separate the mask from the substrate and reload the substrate onto the transport path.

On the other hand, the buffer portion 157 may be positioned between the film forming chamber portion 156 and the disassembled portion 158. [ The buffer unit 157 may control the output time difference between the substrate transferred to the disassembling unit 158 and the mask through the film forming chamber unit 156.

The substrate separated from the mask through the disassembling portion 158 can be moved to the chamber for forming the metal thin film through the connecting portion 160.

Hereinafter, the film deposition chamber portion 156 will be described in more detail with reference to FIG.

2 is a longitudinal direction of the substrate 110 and a direction in which the transport path moves, a y direction is a height direction of the substrate 110, and a z direction is a lateral direction of the substrate 110.

As shown in FIG. 2, the substrate 110 and the substrate 110 and the attached mask 170 may be positioned in the deposition chamber portion. Here, the organic material source is formed on the substrate 110 in the direction in which the mask 170 is attached. However, the patterned bank layer may be positioned on the substrate 110 positioned in the film forming chamber portion such that the lower electrode is formed by the previous process and a portion of the lower electrode is exposed on the lower electrode.

The combination of the substrate 110 and the mask 170 located in the deposition chamber portion can be transported as it is scanned along the z direction. When the combined body of the substrate 110 and the mask 170 is scanned, the plurality of source portions 185a and 186a located on the bottom surface of the substrate 110 emit the organic material source S. When the combined body of the substrate 110 and the mask 170 is transported in the x direction along the transport path, the organic thin film is formed on the lower electrode of the substrate 110.

The number of the plurality of source portions 185a, 186a positioned on the bottom surface of the film forming chamber portion may be 5 to 15. The reason why the number of the plurality of source portions 185a and 186a is arranged in the range of 5 to 15 corresponds to the number of the organic thin film layers to be formed on the lower electrode of the substrate 110. [

For example, the organic thin film layer to be formed on the lower electrode is formed by stacking ten layers such as a hole injection layer, a hole transport layer, a red emission layer, an electron transport layer, a buffer layer, a hole injection layer, a hole transport layer, a green emission layer, a blue emission layer, But the order of lamination and the number of layers are not limited thereto.

On the other hand, the distance D1 between the plurality of source portions 185a and 186a located on the bottom surface of the film forming chamber portion may be 80 cm to 200 cm. This is because the organic material source S emitted through the plurality of source portions 185a and 186a is electrically connected to the substrate 170 through the open portion of the mask 170 when the combination of the substrate 110 and the mask 170 is transported by the transport path 110 and the organic material sources S emitted through the plurality of source portions 185a, 186a are prevented from mixing with each other.

The length D2 of the plurality of source portions 185a and 186a may be formed to be longer by 50 mm to 200 mm than the length of the substrate in the z direction perpendicular to the x direction which is the direction in which the transport path moves. If the length D2 of the plurality of source portions 185a and 186a is longer than the length of the substrate in the lateral direction by 50 mm to 200 mm, the uniformity of film formation and the material utilization efficiency of the organic thin film layer can be optimized.

In addition, the sizes of the openings 185b and 186b of the plurality of source portions 185a and 186a may be formed to be long in the z direction which is the longitudinal direction of the region orthogonal to the x direction in which the transport path moves. The sizes of the openings 185b and 186b of the plurality of source portions 185a and 186a may be formed such that the organic source to be emitted covers a range of 300 mm to 600 mm in the x direction in which the transport path moves. The uniformity of the film formation of the organic thin film layer can be improved by forming the openings 185b and 186b of the plurality of source parts 185a and 186a to cover 300 mm to 600 mm in the x direction which is the transportation path movement direction.

Here, the sizes of the openings 185b and 186b of the plurality of source portions 185a and 186a may be different depending on regions arranged in the film forming chamber portion. When the organic material source S to be deposited is different, the openings 185b and 186b of the plurality of source regions 185a and 186a may have different sizes depending on the region. The openings 185b and 186b of the plurality of source portions 185a and 186a may be formed in a linear shape, a line shape, or a point opening shape arranged at regular intervals.

On the other hand, in the film forming chamber portion, the film is discharged through the plurality of source portions 185a and 186a by the physical factors such as the moving time of the combined body of the substrate 110 and the mask 170, Fins 181, 182, and 183 may be disposed between the plurality of source portions to prevent mutual mixing between the organic material sources S. These fins 181, 182 and 183 can serve as a gate between the conventional chamber and the chamber.

Hereinafter, an organic light emitting display device manufactured according to an embodiment of the present invention will be schematically described with reference to FIG.

Referring to FIG. 3, a substrate 110 is shown. The substrate 110 can be selected to have excellent mechanical strength and dimensional stability as a material for forming devices. As a material of the substrate 110, a glass plate, a metal plate, a ceramic plate, or a plastic plate (polycarbonate resin, acrylic resin, vinyl chloride resin, polyethylene terephthalate resin, polyimide resin, polyester resin, Resin, etc.) and the like.

A buffer layer (not shown) may be disposed on the substrate 110. The buffer layer may be formed to protect a thin film transistor formed in a subsequent process from impurities such as alkali ions or the like, which are discharged from the substrate 110. The buffer layer may be used as the silicon oxide (SiO _2), silicon nitride (SiNx).

On the substrate 110, a lower electrode 119 is located. The lower electrode 119 may be selected as an anode or a cathode. In the following description, it is assumed that the lower electrode 119 is selected as an anode.

Meanwhile, between the lower electrode 119 and the substrate 110, a scan line and a data line to which a driving signal including a scan signal and a data signal are supplied may be positioned. And transistors and capacitors connected to the scan and data lines. Here, the transistor may include at least a switching transistor and a driving transistor. Such a transistor may include a gate, an active layer, a source and a drain, and one of the source and drain may be connected to the lower electrode 119.

The patterned bank layer 120 may be positioned on the lower electrode 119 to expose a portion of the lower electrode 119. The bank layer 120 may include an organic material such as a benzocyclobutene (BCB) resin, an acrylic resin, or a polyimide resin.

The substrate 110 formed up to the lower electrode 119 may be introduced into the above-described manufacturing apparatus and the organic thin film layer 122 may be sequentially formed in a stacked structure.

The organic thin film layer 122 is formed on the lower electrode 119 in the order of the hole injection layer 122a, the hole transport layer 122b, the red light emitting layer 122c, the electron transport layer 122d, the buffer layer 122e, Layer 122f, a hole transporting layer 122g, a green light emitting layer 122h, a blue light emitting layer 122i, and an electron transporting layer 122j. However, this is only an example, and the stack structure of the organic thin film layer 122 formed on the lower electrode 119 is not limited thereto.

In the above description, the hole injection layers 122a and 122f can play a role of facilitating the injection of holes, and can be formed of CuPc (cupper phthalocyanine), PEDOT (poly (3,4) -ethylenedioxythiophene), PANI (polyaniline) (N, N-dinaphthyl-N, N'-diphenyl benzidine), but the present invention is not limited thereto.

The hole transporting layers 122b and 122g serve to smooth the transport of holes and are doped with NPD (N, N-dinaphthyl-N, N'-diphenyl benzidine), TPD (N, N, N'-bis- (phenyl) -benzidine), s-TAD and MTDATA (4,4 ', 4 "-tris But the present invention is not limited thereto.

On the other hand, the red, green, and blue light emitting layers 122c, 122h, and 122i may be formed using phosphorescent or fluorescent materials.

In the case of the red luminescent layer 122c, a host material containing CBP (carbazole biphenyl) or mCP (1,3-bis (carbazol-9-yl) ), PQIr (acac) bis (1-phenylquinoline) acetylacetonate iridium, PQIr (tris (1-phenylquinoline) iridium) and PtOEP (octaethylporphyrin platinum) , But may alternatively be made of a fluorescent material containing PBD: Eu (DBM) 3 (Phen) or Perylene, but not limited thereto.

In the case of the green light emitting layer 122h, it may be made of a phosphorescent material including a dopant material including a host material including CBP or mCP and containing Ir (ppy) 3 (fac tris (2-phenylpyridine) iridium) Alternatively, it may include, but is not limited to, a fluorescent material containing Alq3 (tris (8-hydroxyquinolino) aluminum).

In the case of the blue luminescent layer 122i, it may comprise a host material comprising CBP or mCP and a phosphorescent material comprising a dopant material comprising (4,6-F2ppy) 2Irpic. Alternatively, the fluorescent material may include any one selected from the group consisting of spiro-DPVBi, spiro-6P, distyrylbenzene (DSB), distyrylarylene (DSA), PFO polymer, and PPV polymer. It is not limited.

The electron transporting layers 122d and 122j serve to smooth the transport of electrons and include at least one selected from the group consisting of Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq and SAlq But is not limited thereto.

Though not shown, an electron injection layer may be located on the electron transporting layers 122d and 122j. The electron injection layer plays a role of facilitating the injection of electrons, and Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq or SAlq can be used.

The cathode, which is the upper electrode 140, may be located on the organic thin film layer 122. The upper electrode 140 formed on the organic thin film layer 122 may be deposited through a metal thin film deposition process after moving to a chamber for forming a metal thin film through a connection portion as described above with reference to FIG.

Meanwhile, the organic light emitting display device according to an embodiment of the present invention is a display device in which red, green, and blue light emitting layers are stacked in a stacked structure to emit white light, and is used as a backlight, a white lamp, It is possible to use.

As described above, the present invention provides an apparatus for manufacturing an organic electroluminescent display device capable of arranging a plurality of organic source parts in one chamber and forming an organic light emitting layer, thereby reducing the area of the device, cost for operating the device, and simplifying the device. And the maintenance and repair of the apparatus is facilitated. Further, the present invention has the effect of uniformly forming an organic thin film layer through simplification of the apparatus and improving the production yield of the product. In addition, the present invention has an effect of providing a manufacturing apparatus capable of manufacturing an organic light emitting display device in accordance with trend toward larger size.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. Further, the scope of the present invention is indicated by the following claims rather than the above detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

1 is a schematic view of an apparatus for manufacturing an organic light emitting display according to an embodiment of the present invention;

Fig. 2 is a partial schematic view of the "CS" region of Fig. 1. Fig.

3 is a schematic cross-sectional view of an organic light emitting display device manufactured by an embodiment of the present invention.

DESCRIPTION OF THE REFERENCE NUMERALS

110: substrate 119: lower electrode

120: bank layer 122: organic thin film layer

140: upper electrode 151:

153: alignment part 156: film forming chamber part

158: disassembly portion 170: mask

181, 182, 183: fins 185a, 186a:

Claims (10)

A loader portion for loading the substrate on the transportation path; An alignment unit for aligning the mask on the substrate; And A film forming chamber portion in which a plurality of source portions are disposed apart from each other, An organic material source from the source portion is sequentially deposited on the substrate through the open portion of the mask while the substrate moves along the transport path, Wherein the length of each of the source portions orthogonal to the moving direction of the substrate is longer than the width of the substrate in a direction perpendicular to the moving direction of the substrate. The method according to claim 1, The distance disposed between the plurality of source portions may be, Wherein the organic electroluminescent display device has a width of 80 cm to 200 cm. The method according to claim 1, Wherein the number of the plurality of source portions Wherein the organic electroluminescent display device has 5 to 15 organic electroluminescent display devices. The method according to claim 1, The lengths of the plurality of source portions may be, Wherein the first electrode is formed to be 50 mm to 200 mm longer than the length of the substrate in the transverse direction. The method according to claim 1, Wherein the openings of the plurality of source portions And the longitudinal direction of the region orthogonal to the direction in which the transport path moves is long. The method according to claim 1, The size of the opening portion of the plurality of source portions may be, Wherein organic materials emitted from the openings of the plurality of source portions are formed so as to cover a range of 300 mm to 600 mm in the moving direction of the transport path. The method according to claim 1, The size of the opening portion of the plurality of source portions may be, Wherein the organic light emitting display device is different for each region arranged in the film deposition chamber portion. The method according to claim 1, The film- And a deposition part positioned between the plurality of source parts to prevent the organic material sources emitted from the plurality of source parts from mixing with each other. The method according to claim 1, Wherein the organic material source comprises: Wherein the organic light emitting display device is divided into the plurality of source regions so that an organic thin film layer including a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer is formed on the substrate. . The method according to claim 1, Wherein the organic material source comprises: Wherein the organic light emitting layer is formed in a stacked structure on the substrate.

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