KR101563303B1 - Removable heat sink - Google Patents

Abstract

The present invention provides a detachable heat dissipating device. The detachable heat dissipating device includes: a heat dissipating unit having a plurality of heat dissipating fins formed therein and having a center hole having a predetermined inner diameter; A cooling fan disposed in the center hole and rotated by being supplied with power from the outside and flowing air to both sides of upper and lower sides of the heat dissipation unit through the radiating fins to the front side; And a detachable portion connected to the heat dissipation portion and detachably attaching the heat dissipation portion to a predetermined position. Therefore, the present invention can prevent deterioration of the high-heat-generating electronic component by selectively attaching / detaching the high-heat-generating electronic component to the external surface of the equipment corresponding to the installation position of the electronic component that generates the high heat, It is possible to suppress the local temperature rise in the equipment frame due to the failure.

Description

[0001] SEPARABLE APPARATUS FOR RADIATING HEAT [0002]

The present invention relates to a detachable heat dissipating device, and more particularly, it relates to a detachable heat dissipating device that selectively removes detachable heat dissipating device from an equipment external surface corresponding to a mounting position of the electronic component that generates high heat, And to suppress a local temperature rise in the equipment frame due to the deterioration of the temperature.

Typically, a cooling device installed in a facility is a device that cools the heat generated by the heat generating portion to a predetermined temperature or lower. That is, the cooling device is a device for discharging the high heat generated in the heat generating portion to the ambient atmosphere at room temperature.

Conventional methods of discharging high-temperature heat to the outside are classified into a conduction type and a convection type.

The conduction method is a method of transferring heat from a high temperature to a low temperature by using a temperature gradient by attaching a heat sink having a high thermal conductivity to a heat generating portion.

The convection mode is classified into a natural convection flow by the density difference obtained from the heat generating portion and a forced convection flow by forced circulation using a fan or a motor so that more fluid can flow around the heat generating portion.

Generally, the cooling apparatus used in the conventional facility uses a forced convection system using a cooling fan.

Here, a cooling fan is installed in the equipment to generate forced convection, and the outside air is injected into the closed space or sucked in.

Conventional cooling systems using forced convection should ensure a convection space above a certain level to facilitate convection. However, in recent years, due to the tendency that the facilities are becoming smaller, the space inside the equipment becomes narrower. Therefore, the cooling apparatus using the conventional forced convection has a problem that it is difficult to sufficiently secure a convection space exceeding a certain level.

In addition, the facility is provided with a high temperature heat generating portion provided at a plurality of positions and forming a high temperature. Therefore, in the case of using a conventional cooling device, there is a problem that a convection space must be ensured in each of the internal spaces of the facility in which the high-temperature heat generating portion is installed.

That is, the forced convection type cooling apparatus using the conventional cooling fan has a limitation in releasing the heat of the high temperature heat generating unit to the air to lower the equipment to a predetermined temperature.

Accordingly, when the high temperature heat generating portion can not be easily cooled at a certain position of the facility frame where the high temperature heat generating portion is located, a local temperature rise occurs in the facility frame portion, which causes a problem that the facility frame is twisted.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide an electronic component having an electronic component which generates high heat during operation, Thereby preventing degradation caused by the high heat generating electronic component and suppressing a local temperature rise in the facility frame due to the deterioration.

The present invention provides a detachable heat dissipating device for solving the above-mentioned problems.

The detachable heat dissipating device includes: a heat dissipating unit having a plurality of heat dissipating fins formed therein and having a center hole having a predetermined inner diameter; A cooling fan disposed in the center hole and rotated by being supplied with power from the outside and flowing air to both sides of upper and lower sides of the heat dissipation unit through the radiating fins to the front side; And a detachable portion connected to the heat dissipation portion and detachably attaching the heat dissipation portion to a predetermined position.

Here, a heat dissipation pad may be attached to the rear surface of the heat dissipation unit.

Further, it is preferable that protrusions are formed on the outer surface of the heat-radiating pad.

In addition, a device frame is installed on both sides of the heat dissipation unit, and a front frame is provided on the front surface of the heat dissipation unit. An exposed hole is formed in the front frame to expose the center hole to the outside, It is preferable to provide a safety cover which protects the cooling fan from the outside and has a plurality of flow holes.

It is preferable that an air filter for filtering foreign substances is installed on both sides of the heat radiating plate.

It is preferable that the detachable portion is provided in a device frame located on the rear side of the heat dissipating portion, and the detachable portion is any one of a magnet plate and an attracting plate.

In addition, the detachable portion may include a body having a plurality of flow holes formed therein, and a plurality of cooling fins may be formed at an edge portion of the body.

The height adjustment part may include height adjustment holes formed at four corners of the front frame and having a predetermined depth having threads, and one end of the height adjustment holes may be screwed into the height adjustment holes, The height adjusting rods and the support plates formed at the other ends of the height adjusting rods.

As described above, according to the present invention, in an apparatus having an electronic component which generates a high heat during operation, the deterioration due to the high heat generating electronic component can be prevented by selectively attaching / detaching the apparatus to an external surface of the apparatus corresponding to the installation position of the electronic component, And it is possible to suppress the local temperature rise in the equipment frame due to this.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detachable heat dissipating device of the present invention will be described with reference to the accompanying drawings.

1 is an exploded perspective view showing a detachable heat dissipating device of the present invention. 2 is a cross-sectional view showing another example of the heat radiation pad of FIG. 3 is a plan view showing another example of the attaching / detaching portion of Fig. 4 is a plan view showing still another example of the attaching / detaching portion of Fig. 5 is a cross-sectional view showing a heat dissipating device having a height adjusting portion according to the present invention. 6 is a schematic view showing the use state of the detachable heat dissipating device of the present invention.

Referring to FIG. 1, the detachable heat dissipating device of the present invention includes a heat dissipating unit 100, a cooling fan 300, and a detachable unit 600.

The heat dissipating unit 100 includes a plurality of heat dissipating fins 110. The front surface of the heat dissipation unit 100 is covered by the front frame 400, and both side surfaces of the heat dissipation unit 100 are covered by the apparatus frame 430. Both side surfaces of the heat dissipation unit 100 are covered with the air filter 500.

The heat dissipation unit 100 is formed with a center hole 111 having a predetermined inner diameter passing through the left and right sides. A cooling fan 300 is inserted into the center hole 111. Although not shown in the figure, a rotating shaft is disposed in the center hole 111 of the heat dissipating unit 100, and the rotating shaft is connected to the motor. The motor may receive an electrical signal from the outside and rotate the rotation shaft at a constant speed. The rotation shaft is connected to the center of the cooling fan 300.

A heat dissipation pad 200 is attached to the rear surface of the heat dissipation unit 100. Here, an opening 431 through which the heat radiation pad 200 is exposed is formed in the device frame 430 on the rear side of the heat radiation part 100.

1, the heat dissipation pad 200 may have a flat plate shape having a predetermined thickness, and may include a heat dissipation pad 210 'having concave-convex protrusions 210' formed on the outer surface thereof as shown in FIG. 2, (200 '). Here, it is preferable that the projection 210 'has an embossed shape. Here, the embossed protrusions 210 'may serve to increase the contact area with air.

The exposure hole 410 of the front frame 400 covering the front surface of the heat dissipating unit 100 is formed to have a size that exposes the center hole 111 of the heat dissipating unit 100 to the outside. In addition, the exposure hole 410 is provided with a safety cover 420 that can protect the cooling fan 300 from the outside. Here, the safety cover 420 has a plurality of flow holes 421 formed therein.

The detachable unit 600 may be installed in the apparatus frame 430 on the rear side of the heat dissipating unit 100. Here, the detachable part 600 may have a rectangular frame shape, and may be either a magnet plate or an attracting plate. Therefore, the detachable part 600 can be easily attached to the outer surface of the metal material.

In addition, as shown in FIG. 3, the detachable part 600 may further include a plurality of cooling fins 620 'protruding at a predetermined length. Here, the cooling fins 620 'may function as heat dissipation.

4, the detachable part 600 may further include flow holes 630 'through which the outer surface of the equipment and the heat radiation pad 200 are communicated with each other.

5, the front frame 430 may further include a height adjusting unit 700. [0041]

The height adjusting part 700 includes height adjusting holes 730 formed at four corners of the front frame 400 and having a predetermined depth with a thread 431 and one end of the height adjusting holes 760 Height adjusting rods 710 having screw protrusions 711 screwed with the nano-particles, and support plates 720 formed at the other ends of the height adjusting rods 710.

Next, the operation of the detachable heat-dissipating device of the present invention constructed as described above will be described.

Referring to FIG. 6, the detachable heat-dissipating device of the present invention can be selectively detached from the outer surface of the frame 900 of the facility.

The high temperature heat generating units 910 and 920 may be installed at predetermined positions in the facility frame 900. The high temperature heat generating units 910 and 920 may be formed of electronic components that generate a high temperature during operation.

Therefore, the heat dissipation device may be attached to the outer surface of the facility frame 900 where the high-temperature heat dissipation units 910 and 920 are located. In the case of a magnet plate, it can be attached to the outer surface of a facility frame made of a metal material. In the case of an attracting plate, it can be adhered to the outer surface of the facility frame 900 .

Here, the side of the facility frame 900 can be fixed in the same manner as described above.

On the other hand, in the case of the lower frame 900 of the facility, since the fixing members 930 can be provided so as to be positioned at a certain height h from the ground on which the facility is installed, .

Therefore, in this case, the heat dissipating device is attached to the lower surface of the equipment frame 900 by the detachable part 600 in the same manner as described above.

Next, the height regulating portion 700 according to the present invention is used to fix the heat dissipating device so as to be supported from the ground.

5, when the height adjusting rods 710 of the height adjusting unit 700 are rotated in one direction, the upper ends of the height adjusting rods 710 are moved along the rotating direction of the front frame 400 The height adjustment hole 730 may be formed in the height adjustment hole 730. [ Here, the support plate 720 formed at the lower end of the height adjusting rods 710 may be supported on the ground. Therefore, by rotating the height adjusting rods 710, the gap or the height difference h formed between the lower frame 900 and the ground can be compensated.

6, when the heat dissipating devices of the present invention are attached to the outer surface of the facility frame 900 where the high-temperature heat generating portions 910 and 920 of the facility are located, the power is supplied from the outside to the cooling fan 300 The cooling fan 300 can rotate at a constant speed.

Here, referring to FIGS. 1 and 6, a local temperature rise may occur at a certain position of the facility frame 900 where the high temperature heat generating units 910 and 920 are located. The heat having such an elevated temperature can flow to the heat radiation pad 200 exposed to the opening 431 of the apparatus frame 430.

Accordingly, the high-temperature heat generated from the facility can be primarily cooled through the heat-radiating pad 200. In addition, since the heat-radiating pad 200 can be formed as shown in FIG. 2, the cooling efficiency can be further increased by the embossed protrusions 210 '. 3 and 4, since the cooling fins 620 'are further provided or the flow holes 630' can be further formed at the edge of the detachable part 600, the facility frame 900 Can be further cooled by the cooling fins 620 'and can easily flow to the heat radiating pad 200 by the flow holes 630'.

The high-temperature heat that has been primarily cooled by passing through the heat-radiating pad 200 may flow into the heat-radiating fins 110 of the heat-radiating portion. Accordingly, the heat of the high temperature can be cooled by the heat radiating fins 110.

At this time, external air flows into the heat dissipating unit 100 through the upper and lower parts of the heat dissipating unit 100 by the rotation of the cooling fan 300. Here, the foreign air may be filtered by the air filter 500 disposed above and below the heat dissipating unit 100.

The outside air flowing into the heat dissipating unit 100 can be concentrated in the center hole 111 while passing through the radiating fins 110. The high temperature heat concentrated in the center hole 111 is transmitted to the cooling fan 300 And can be discharged to the outside through the flow hole 421 of the safety cover 420 installed in the exposure hole 410.

Accordingly, the secondarily cooled high-temperature heat is thirdarily cooled by the external air introduced into the radiating fins 110 and the heat dissipating unit 100 in a forced convection mode of the cooling fan 300, and is discharged to the outside .

Accordingly, in the present invention, the heat dissipating device is selectively attached to and detached from the outer surface of the frame 900 of the facility in which the high-temperature heat-radiating portions 910 and 920 composed of electronic components that generate high heat are formed, Can be prevented from being heated in a multistage manner by using the external air inflow, the heat radiation pad 200, and the heat dissipation unit 100, thereby preventing the local temperature rise of the facility frame 900 in advance.

Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. Of course.

Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined by the scope of the appended claims, as well as the appended claims.

1 is an exploded perspective view showing a detachable heat dissipating device of the present invention.

2 is a cross-sectional view showing another example of the heat radiation pad of FIG.

3 is a plan view showing another example of the attaching / detaching portion of Fig.

4 is a plan view showing still another example of the attaching / detaching portion of Fig.

5 is a cross-sectional view showing a heat dissipating device having a height adjusting portion according to the present invention.

6 is a schematic view showing the use state of the detachable heat dissipating device of the present invention.

* Drawings for key parts

100:

200: heat-radiating pad

300: cooling fan

400: front frame

500: air filter

600: detachable part

700:

Claims (8)

In order to cool at least one hot-heating unit located on one side of the facility frame, A heat dissipating unit having a plurality of heat dissipating fins and having a center hole having a predetermined inner diameter and having a flat heat dissipating pad on one side; A cooling fan disposed in the center hole and rotated by being supplied with power from the outside and flowing air to both sides of upper and lower sides of the heat dissipation unit through the radiating fins to the front side; And A detachable unit connected to the heat dissipation unit and surrounding the heat dissipation pad in a rectangular shape and detachably attaching the heat dissipation unit to a predetermined position of the facility frame; , ≪ / RTI & Wherein the detachable unit is mounted on the other surface of the fixture frame which is opposite to the one surface of the fixture frame, and the heat generating unit is positioned on the detachable unit to contact the fixation pad and the fixture frame in face- And heat exchange is performed with the heat exchanger. delete delete The method according to claim 1, The apparatus frame is installed on both sides of the left and right sides of the heat dissipation unit, and a front frame is installed on the front surface of the heat dissipation unit. Wherein the front frame is formed with an exposure hole for exposing the center hole to the outside, Wherein the exposing hole is provided with a safety cover that protects the cooling fan from the outside and has a plurality of flow holes. delete delete delete Claim 8 has been abandoned due to the setting registration fee. 5. The method of claim 4, The front frame further includes a height adjusting unit, Height adjusting holes formed at four corners of the front frame and having predetermined depths having threads, height adjusting rods one end of which is screwed to the height adjusting holes, support plates formed at the other end of the height adjusting rods, Wherein the heat dissipation device is a heat dissipation device.

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