KR101623618B1 - Photosensitive resin composition, pattern formed by using the same and display panel comprising the same - Google Patents
Photosensitive resin composition, pattern formed by using the same and display panel comprising the same Download PDFInfo
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- KR101623618B1 KR101623618B1 KR1020120056397A KR20120056397A KR101623618B1 KR 101623618 B1 KR101623618 B1 KR 101623618B1 KR 1020120056397 A KR1020120056397 A KR 1020120056397A KR 20120056397 A KR20120056397 A KR 20120056397A KR 101623618 B1 KR101623618 B1 KR 101623618B1
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- KR
- South Korea
- Prior art keywords
- parts
- weight
- photosensitive resin
- resin composition
- binder
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 claims abstract description 51
- 239000000203 mixture Substances 0.000 claims abstract description 43
- 239000003086 colorant Substances 0.000 claims abstract description 30
- 239000011230 binding agent Substances 0.000 claims description 54
- 150000001875 compounds Chemical class 0.000 claims description 28
- 239000000049 pigment Substances 0.000 claims description 23
- -1 methacryloyl Chemical group 0.000 claims description 22
- 125000004432 carbon atom Chemical group C* 0.000 claims description 17
- 239000000178 monomer Substances 0.000 claims description 16
- 239000006229 carbon black Substances 0.000 claims description 14
- 239000003999 initiator Substances 0.000 claims description 14
- 229910052793 cadmium Inorganic materials 0.000 claims description 13
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 10
- 239000006185 dispersion Substances 0.000 claims description 9
- 239000002318 adhesion promoter Substances 0.000 claims description 8
- 125000002091 cationic group Chemical group 0.000 claims description 8
- 239000002270 dispersing agent Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000004132 cross linking Methods 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 5
- 125000003342 alkenyl group Chemical group 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 125000005442 diisocyanate group Chemical group 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 230000000996 additive effect Effects 0.000 claims description 4
- 125000004450 alkenylene group Chemical group 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- 238000012719 thermal polymerization Methods 0.000 claims description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 2
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 19
- 239000006059 cover glass Substances 0.000 abstract description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 60
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 37
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 32
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- 229920005822 acrylic binder Polymers 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 14
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 13
- 238000003801 milling Methods 0.000 description 13
- 230000018109 developmental process Effects 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- 239000003513 alkali Substances 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 9
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 7
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 7
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 150000001768 cations Chemical class 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000005227 gel permeation chromatography Methods 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 5
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 5
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 5
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 5
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000002923 oximes Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- ZPVOLGVTNLDBFI-UHFFFAOYSA-N (±)-2,2,6-trimethylcyclohexanone Chemical compound CC1CCCC(C)(C)C1=O ZPVOLGVTNLDBFI-UHFFFAOYSA-N 0.000 description 2
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- HDYFAPRLDWYIBU-UHFFFAOYSA-N 1-silylprop-2-en-1-one Chemical compound [SiH3]C(=O)C=C HDYFAPRLDWYIBU-UHFFFAOYSA-N 0.000 description 2
- OISVCGZHLKNMSJ-UHFFFAOYSA-N 2,6-dimethylpyridine Chemical compound CC1=CC=CC(C)=N1 OISVCGZHLKNMSJ-UHFFFAOYSA-N 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- ZIXLDMFVRPABBX-UHFFFAOYSA-N 2-methylcyclopentan-1-one Chemical compound CC1CCCC1=O ZIXLDMFVRPABBX-UHFFFAOYSA-N 0.000 description 2
- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical compound CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 description 2
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 2
- BZCWFJMZVXHYQA-UHFFFAOYSA-N 3-dimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[SiH](OC)CCCOC(=O)C(C)=C BZCWFJMZVXHYQA-UHFFFAOYSA-N 0.000 description 2
- UJBOOUHRTQVGRU-UHFFFAOYSA-N 3-methylcyclohexan-1-one Chemical compound CC1CCCC(=O)C1 UJBOOUHRTQVGRU-UHFFFAOYSA-N 0.000 description 2
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 2
- RHLVCLIPMVJYKS-UHFFFAOYSA-N 3-octanone Chemical compound CCCCCC(=O)CC RHLVCLIPMVJYKS-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
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- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
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- 235000006708 antioxidants Nutrition 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical compound CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 2
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- OTTZHAVKAVGASB-UHFFFAOYSA-N hept-2-ene Chemical compound CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 2
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- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
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- KFJJYOKMAAQFHC-UHFFFAOYSA-N (4-methoxy-5,5-dimethylcyclohexa-1,3-dien-1-yl)-phenylmethanone Chemical compound C1C(C)(C)C(OC)=CC=C1C(=O)C1=CC=CC=C1 KFJJYOKMAAQFHC-UHFFFAOYSA-N 0.000 description 1
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- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- KPNZYDNOFDZXNR-UHFFFAOYSA-N tetratert-butyl 4-benzoylcyclohexa-3,5-diene-1,1,2,2-tetracarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1(C(=O)OOC(C)(C)C)C(C(=O)OOC(C)(C)C)(C(=O)OOC(C)(C)C)C=CC(C(=O)C=2C=CC=CC=2)=C1 KPNZYDNOFDZXNR-UHFFFAOYSA-N 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- HTSABYAWKQAHBT-UHFFFAOYSA-N trans 3-methylcyclohexanol Natural products CC1CCCC(O)C1 HTSABYAWKQAHBT-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- ROVRRJSRRSGUOL-UHFFFAOYSA-N victoria blue bo Chemical compound [Cl-].C12=CC=CC=C2C(NCC)=CC=C1C(C=1C=CC(=CC=1)N(CC)CC)=C1C=CC(=[N+](CC)CC)C=C1 ROVRRJSRRSGUOL-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
Abstract
본 출원은 착색제 조성물을 포함하는 감광성 수지 조성물을 제공한다. 본 출원에 따른 감광성 수지 조성물은 고온 공정에서의 저항값 저하를 최소화하여 내열성이 우수한 효과가 있다. 상기 조성물을 이용하여 패턴을 형성할 수 있고, 커버유리 일체용 디스플레이 패널의 개발을 가능하게 할 수 있으며, 특히 모바일용 디스플레이의 품질 향상을 기대할 수 있다.The present application provides a photosensitive resin composition comprising a colorant composition. The photosensitive resin composition according to the present application has an effect of minimizing a decrease in resistance value in a high-temperature process and having excellent heat resistance. It is possible to form a pattern using the above composition, to enable the development of a display panel for a cover glass, and in particular to improve the quality of a mobile display.
Description
본 출원은 감광성 수지 조성물, 이를 이용하여 형성된 패턴 및 상기 패턴을 포함하는 디스플레이 패널에 관한 것이다.The present invention relates to a photosensitive resin composition, a pattern formed using the same, and a display panel including the pattern.
최근 모바일 디스플레이 시장의 주류에는 터치 스크린이 자리잡고 있다. 터치 스크린은 키보드와 마우스와 같은 입력장치를 사용하지 않고 화면에 직접 사람 손이나 물체를 접촉시켜 입력해 가는 방식을 가진다. 그래서, 화면에서 대부분의 조작, 즉 인터넷 활용, 동영상, 멀티터치 등이 용이하게 이루어지므로 가장 편리한 유저인터페이스 중의 하나가 되었다. Recently, the touch screen is in the mainstream of the mobile display market. The touch screen has a method of inputting a human hand or an object directly on the screen without using an input device such as a keyboard and a mouse. Therefore, since most of the operations on the screen, that is, the use of the Internet, the moving image, and the multi-touch are easily performed, it becomes one of the most convenient user interfaces.
터치스크린은 그 구현방식의 예로, 저항막 방식, 정전용량 방식, 초음파 방식, 광학 방식, 적외선 방식 등이 있다. 저항막 방식은 내구성이 떨어지고 빛 투과율이 낮으며 멀티 터치 구현이 거의 불가능한 문제점이 있다. Examples of the touch screen include a resistance film type, a capacitive type, an ultrasonic type, an optical type, and an infrared type. The resistance film method has a problem that durability is low, light transmittance is low, and multi-touch implementation is almost impossible.
저항막 방식의 문제점을 해결하기 위한 방식으로 정전용량 방식을 들 수 있다. 정전 용량 방식은 사람의 몸에서 발생하는 미세전류를 감지해 구동하는 방식으로 정전류를 이용하므로, 터치감도가 우수하고, 특히 멀티터치기능이 가능하다. 또한, 커버로 유리를 사용하므로 내구성이 좋고, 빛 투과율도 90%이상을 가지며, 고급스런 감도를 주는 장점이 있다. 그러나, 입력방식에서 제한이 있고 제조원가가 높은 단점이 있다.The electrostatic capacity type is a method for solving the problem of the resistive film type. The electrostatic capacity method uses a constant current by sensing and driving a minute current generated in a human body, so that the touch sensitivity is excellent, and in particular, a multi-touch function is possible. In addition, since glass is used as a cover, it has good durability, light transmittance of 90% or more, and high sensitivity. However, there is a limitation in the input method and a manufacturing cost is high.
본 발명자들은 상기 문제점을 해결하기 위한 터치 스크린 개발 중 패널에서의 패턴 형성에 적합한 조성물의 개발 필요성에서 본 발명을 완성하게 되었다. The present inventors have completed the present invention in the necessity of developing a composition suitable for pattern formation in a panel during development of a touch screen to solve the above problems.
본 명세서는 디스플레이 패널의 베젤 패턴 형성시에 얇은 두께, 부드러운 테이퍼, 충분한 차광력을 가지고, 우수한 내열성을 가질 수 있는 감광성 수지 조성물을 제공한다. The present invention provides a photosensitive resin composition having a thin thickness, a smooth taper and a sufficient light diffusing power at the time of forming a bezel pattern of a display panel and having excellent heat resistance.
본 출원의 일 구현예는 착색제 조성물을 포함하는 감광성 수지 조성물로서, 상기 착색제 조성물은 착색제; 및 카도계 바인더를 포함하는 감광성 수지 조성물을 제공한다.One embodiment of the present application is a photosensitive resin composition comprising a colorant composition, wherein the colorant composition comprises a colorant; And a cadmium-based binder.
또한, 본 출원의 일 구현예는 상기 감광성 수지 조성물을 이용하여 형성된 패턴을 제공한다.Further, one embodiment of the present application provides a pattern formed using the photosensitive resin composition.
또한, 본 출원의 일 구현예는 상기 감광성 수지 조성물을 이용하여 형성된 패턴을 제공한다.Further, one embodiment of the present application provides a pattern formed using the photosensitive resin composition.
또한, 본 출원의 일 구현예는 감광성 수지 조성물을 기판에 도포하는 단계; 및 상기 도포된 감광성 수지 조성물을 노광 및 현상하는 단계를 포함하는 패턴 제조방법을 제공한다.Further, one embodiment of the present application is a method of manufacturing a light-emitting device, comprising: applying a photosensitive resin composition to a substrate; And a step of exposing and developing the applied photosensitive resin composition.
또한, 본 출원의 일 구현예는 상기 패턴을 포함하는 디스플레이 패널을 제공한다.In addition, one embodiment of the present application provides a display panel including the pattern.
본 출원의 일 구현예에 따른 감광성 수지 조성물은 고온 공정에서의 저항값 저하를 최소화하여 내열성이 우수한 효과가 있다. 본 발명의 조성물을 이용하여 패턴을 형성할 수 있고, 커버유리 일체용 디스플레이 패널의 개발을 가능하게 할 수 있으며, 특히 모바일용 디스플레이의 품질 향상을 기대할 수 있다.The photosensitive resin composition according to one embodiment of the present application has an effect of minimizing a decrease in resistance value in a high-temperature process and having excellent heat resistance. It is possible to form a pattern using the composition of the present invention, to enable the development of a cover panel monolithic display panel, and in particular to improve the quality of a mobile display.
이하, 본 출원을 상세히 설명한다.Hereinafter, the present application will be described in detail.
본 출원에서 사용되는 기술 용어 및 과학 용어에 있어서 다른 정의가 없다면, 이 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 통상적으로 이해하고 있는 의미를 가진다. Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.
본 발명자들은 정전용량방식에서의 문제점이었던 원가를 낮추기 위해, 여러 장을 적용하는 ITO(산화주석인듐: Indium Tin Oxide) 필름 센서층을 줄이거나 또는 맨 윗 층의 강화유리에 직접 터치센서를 접착하는 일체형 터치 스크린 패널을 개발하는 방법을 개발하였다. 이때, 투과율 향상과 더불어 원가 절감효과를 누릴 수 있다. 이와 같은 일체형 터치 패널은 커버유리에 차폐용 베젤 막을 코팅하고 그 위에 터치 센서층을 형성하는 방법으로 제작하였다. 이때, 종래의 베젤 막 코팅용 잉크를 사용하여 스크린 방식으로 인쇄하여 베젤 막의 두께가 대부분 6 마이크론 이상, 평균적으로 10 마이크론이었다. 그러나, 이와 같은 두께로 베젤 막 위에 센서층을 적용하게 되면 베젤층과 기판과의 단차로 인해 배선 단락이 발생하여 제대로 구동이 어렵게 되는 문제점이 있다. 그래서, 얇은 두께와 부드러운 테이퍼를 가지면서도 충분한 차광 특성을 가지는 종래의 베젤 막 코팅용 잉크를 대체할 재료가 필요하게 되었다. 특히, 터치센서를 형성하는 고온 공정에서는 저항값이 저하되기 때문에 고저항을 요구하는 터치 스크린 패널의 베젤 재료의 제품 특성을 저하하게 되는 문제점을 해결할 필요가 있었다. 그래서 본 출원의 발명자들은 고온 공정에서의 저항값 저하를 최소화하여 내열성이 우수한 터치 스크린 패널의 베젤 재료로 사용될 수 있는 감광성 수지 조성물을 개발하게 되었다. In order to reduce the cost, which has been a problem in the capacitance type, the inventors of the present invention have found that it is possible to reduce the ITO (Indium Tin Oxide) film sensor layer to which a plurality of sheets are applied or to adhere the touch sensor directly to the uppermost tempered glass And developed a method for developing an integrated touch screen panel. At this time, the transmittance can be improved and the cost reduction effect can be obtained. Such an integrated touch panel is manufactured by coating a bezel film for shielding on a cover glass and forming a touch sensor layer thereon. At this time, the thickness of the bezel film was mostly 6 microns or more, 10 microns on average, by printing using a conventional bezel film coating ink. However, when the sensor layer is applied on the bezel film with such a thickness, shorting of wiring occurs due to a step between the bezel layer and the substrate, which makes it difficult to drive the sensor layer properly. Therefore, there is a need for a material for replacing the conventional ink for coating a bezel film, which has a thin thickness and a soft taper and has a sufficient light shielding property. In particular, since the resistance value is lowered in a high-temperature process for forming a touch sensor, it has been necessary to solve the problem of deteriorating the product characteristics of the bezel material of the touch screen panel requiring high resistance. Therefore, the inventors of the present application have developed a photosensitive resin composition that can be used as a bezel material of a touch screen panel having excellent heat resistance by minimizing a decrease in resistance value in a high-temperature process.
본 출원의 일 구현예는 착색제; 및 카도계 바인더;를 포함하는 착색제 조성물을 포함하는 감광성 수지 조성물을 제공한다. One embodiment of the present application relates to a colorant; And a colorant composition comprising a cationic binder.
상기 착색제 조성물은 착색제 조성물 내에 카도계 바인더를 포함함으로써, 상기 착색제 조성물을 포함하는 감광성 수지 조성물이 고온 공정에서의 저항값 저하를 최소화할 수 있게 하여 내열성을 우수하게 하는 효과가 있다.The colorant composition contains a cadmium binder in the colorant composition, so that the photosensitive resin composition containing the colorant composition can minimize a decrease in resistance value in a high-temperature process, thereby excelling in heat resistance.
카도계는 환상 구조를 구성하는 4급 탄소 원자에 2개의 환상 구조가 결합한 골격 구조를 갖는 수지이다. The cation system is a resin having a skeleton structure in which two cyclic structures are bonded to quaternary carbon atoms constituting the cyclic structure.
본 출원의 일 구현예에서, 상기 카도계 바인더는 하기 화학식 1로 표시되는 반복단위를 포함하는 것일 수 있다.In one embodiment of the present application, the cation binder may include a repeating unit represented by the following formula (1).
[화학식 1][Chemical Formula 1]
상기 화학식 1의 치환기들을 보다 구체적으로 설명하면 아래와 같다.The substituents of Formula 1 will be described in more detail as follows.
상기 Rx는 하기 5원 고리의 카르복실산 무수물 또는 디이소시아네이트가 반응하여 형성된 구조일 수 있으나, 이에만 한정되는 것은 아니다. The Rx may be a structure formed by reacting a carboxylic acid anhydride or a diisocyanate of the following five-membered ring, but is not limited thereto.
상기 5원고리의 카르복실산 무수물은, 예를 들어, 숙신산무수물, 메틸숙신산무수물, 2,2-디메틸숙신산무수물, 이소부테닐숙신산무수물, 1,2-시클로헥산디카르본산 무수물, 헥사히드로-4-메틸 프탈산 무수물, 이타콘산 무수물, 테트라히드로 프탈산 무수물, 5-노보넨-2,3-디카르본산 무수물, 메텔-5-노보넨-2,3-디카르본산 무수물, 1,2,3,4-시클로 부탄테트라카르본산 디무수물, 말레인산 무수물, 시트라콘산 무수물, 2,3,-디메틸말레인산 무수물, 1-시클로펜텐-1,2-디카르본산 디무수물, 3,4,5,6-테트라히드로프탈산 무수물, 프탈산무수물, 비스프탈산무수물, 4-메틸프탈산 무수물, 3,6-디클로로프탈산무수물, 3-히드로프탈산무수물, 1,2,4-벤젠트리카르복산 무수물, 4-니트로프탈산무수물 및 디에틸렌글리콜-1,2-비스트리멜릭산 무수물로 이루어지는 군에서 선택되는 것일 수 있으나 이들에만 한정되는 것은 아니다. The carboxylic acid anhydrides of the five-membered ring include, for example, succinic anhydride, methylsuccinic anhydride, 2,2-dimethyl succinic anhydride, isobutenyl succinic anhydride, 1,2-cyclohexanedicarboxylic anhydride, hexahydro- -Methyl phthalic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, mell-5-norbornene-2,3-dicarboxylic anhydride, 4-cyclobutane tetracarboxylic dianhydride, maleic anhydride, citraconic anhydride, 2,3, -dimethyl maleic anhydride, 1-cyclopentene-1,2-dicarboxylic dianhydride, 3,4,5,6- But are not limited to, tetrahydrophthalic anhydride, phthalic anhydride, bisphthalic anhydride, 4-methylphthalic anhydride, 3,6-dichlorophthalic anhydride, 3-hydrophthalic anhydride, 1,2,4-benzenetricarboxylic anhydride, Diethylene glycol-1,2-bistrimelic acid anhydride. Be, but is not limited to these.
또는, 상기 디이소시아네이트는 예를 들어, 트리메틸렌디이소시아네이트, 테트라메틸렌디이소시아네이트, 헥사메틸렌디이소시아네이트, 펜타메틸렌디이소시아네이트, 1,2-프로필렌디이소시아네이트, 2,3-부틸렌디이소시아네이트, 1,3-부틸렌디이소시아네이트, 도데카메틸렌디이소시아네이트, 2,4,4-트리메틸 헥사메틸렌 디이소시아네이트, w,w'-디이소시아네이트-1,3-디메틸벤젠, w,w'-디이소시아네이트-1,4-디메틸벤젠, w,w'-디이소시아네이트-1,3-디에틸벤젠, 1,4-테트라 메틸 크실렌 디이소시아네이트, 1,3-테트라메틸 크실렌 디이소시아네이트, 이소포론디이소시아네이트, 1,3-시클로펜탄디이소시아네이트, 1,3-시클로헥산디이소시아네이트, 1,4-시클로헥산디이소시아네이트, 메틸-2,4-시클로헥산디이소시아네이트, 메틸-2,6-시클로헥산 디이소시아네이트, 4,4'-메틸렌 비스이소시아네이트 메틸시클로헥산, 2,5-이소시아네이트메틸 비시클로[2,2,2]헵탄 및 2,6-이소시아네이트메틸 비시클로[2,2,1]헵탄으로 이루어지는 군에서 선택되는 것일 수 있으나 이들에만 한정되는 것은 아니다. Alternatively, the diisocyanate may be, for example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, Butylene diisocyanate, dodecamethylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, w, w'-diisocyanate-1,3-dimethylbenzene, w, w'-diisocyanate- Benzene, w, w'-diisocyanate-1,3-diethylbenzene, 1,4-tetramethylxylene diisocyanate, 1,3-tetramethylxylene diisocyanate, isophorone diisocyanate, 1,3- 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, Isocyanate methyl bicyclo [2,2,2] heptane and 2,6-isocyanate methylbicyclo [2,2,1] heptane, but they may be selected from the group consisting of The present invention is not limited thereto.
상기 Ry는 수소, 아크릴로일 및 메타아크릴로일로 이루어진 군에서 선택되는 것일 수 있으나, 이에만 한정되는 것은 아니다.The Ry may be selected from the group consisting of hydrogen, acryloyl and methacryloyl, but is not limited thereto.
상기 R1 내지 R3은 각각 독립적으로, 수소; 할로겐기; 치환 또는 비치환된 탄소수 1 내지 5의 알킬기; 치환 또는 비치환된 탄소수 1 내지 5의 알콕시기; 및 치환 또는 비치환된 탄소수 2 내지 5의 알케닐기; 로 이루어진 군에서 선택되는 것일 수 있다.Each of R 1 to R 3 is independently hydrogen; A halogen group; A substituted or unsubstituted alkyl group having 1 to 5 carbon atoms; A substituted or unsubstituted C1-C5 alkoxy group; And a substituted or unsubstituted C2 to C5 alkenyl group; ≪ / RTI >
상기 R4 내지 R7은 각각 독립적으로, 치환 또는 비치환된 탄소수 1 내지 5의 알킬렌기; 치환 또는 비치환된 탄소수 1 내지 5의 알콕실렌기;및 치환 또는 비치환된 탄소수 2 내지 5의 알케닐렌기; 로 이루어진 군에서 선택되는 것일 수 있다. Each of R 4 to R 7 independently represents a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms; A substituted or unsubstituted alkoxysilyl group having 1 to 5 carbon atoms and a substituted or unsubstituted alkenylene group having 2 to 5 carbon atoms; ≪ / RTI >
상기 할로겐기는 불소, 염소, 브롬 또는 요오드가 될 수 있다.The halogen group may be fluorine, chlorine, bromine or iodine.
상기 알킬기는 직쇄 또는 분지쇄일 수 있고, 치환 또는 비치환된 것일 수 있으며, 탄소수는 특별히 한정되지 않으나 1 내지 5 일 수 있다. 상기 일킬기의 구체적인 예로는 메틸, 에틸, 프로필, 이소프로필, 부틸, t-부틸 등이 있으나, 이에만 한정되는 것은 아니다.The alkyl group may be linear or branched and may be substituted or unsubstituted. The number of carbon atoms is not particularly limited, but may be 1 to 5. Specific examples of the monovalent group include, but are not limited to, methyl, ethyl, propyl, isopropyl, butyl, t-butyl and the like.
상기 알킬렌기는 직쇄 또는 분지쇄일 수 있고, 치환 또는 비치환된 것일 수 있으며, 탄소수는 특별히 한정되지 않으나 1 내지 5 일 수 있다. 상기 알킬렌기의 구체적인 예로는 메틸렌, 에틸렌, 프로필렌, 이소프로필렌, 부틸렌, t-부틸렌 등이 있으나, 이에만 한정되는 것은 아니다. The alkylene group may be linear or branched and may be substituted or unsubstituted. The number of carbon atoms is not particularly limited but may be 1 to 5. Specific examples of the alkylene group include, but are not limited to, methylene, ethylene, propylene, isopropylene, butylene, and t-butylene.
상기 알콕시기는 직쇄 또는 분지쇄일 수 있고, 치환 또는 비치환된 것일 수 있으며, 탄소수는 특별히 한정되지 않으나 1 내지 5일 수 있다. 상기 알콕시기 의 구체적인 예로는 메톡시, 에톡시, 이소프로필옥시 등을 들 수 있으나, 이에만 한정되는 것은 아니다. The alkoxy group may be straight-chain or branched, and may be substituted or unsubstituted. The number of carbon atoms is not particularly limited, but may be 1 to 5. Specific examples of the alkoxy group include, but are not limited to, methoxy, ethoxy, isopropyloxy, and the like.
상기 알콕실렌기는 직쇄 또는 분지쇄일 수 있고, 치환 또는 비치환된 것일 수 있으며, 탄소수 1 내지 5일 수 있다. 상기 알콕실렌기 의 구체적인 예로는 메톡실렌, 에톡실렌, 이소프로필옥실렌 등을 들 수 있으나, 이에만 한정되는 것은 아니다.The alkoxylene group may be straight-chain or branched and may be substituted or unsubstituted, and may have 1 to 5 carbon atoms. Specific examples of the alkoxylene group include, but are not limited to, methoxylene, ethoxylene, and isopropyloxylene.
상기 알케닐기는 직쇄 또는 분지쇄일 수 있고, 치환 또는 비치환된 것일 수 있으며, 탄소수는 특별히 한정되지 않으나 1 내지 5일 수 있다. 상기 알케닐기의 구체적인 예로는 에테닐, 프로페닐, 부테닐, 펜테닐 등을 들 수 있으나, 이에만 한정되는 것은 아니다. The alkenyl group may be linear or branched, and may be substituted or unsubstituted. The number of carbon atoms is not particularly limited, but may be 1 to 5. Specific examples of the alkenyl group include, but are not limited to, ethenyl, propenyl, butenyl, pentenyl, and the like.
상기 알케닐렌기는 직쇄 또는 분지쇄일 수 있고, 치환 또는 비치환된 것일 수 있으며, 탄소수는 특별히 한정되지 않으나 1 내지 5일 수 있다. 상기 알케닐렌기의 구체적인 예로는 에테닐렌, 프로페닐렌, 부테닐렌, 펜테닐렌 등을 들 수 있으나, 이에만 한정되는 것은 아니다.The alkenylene group may be linear or branched, and may be substituted or unsubstituted. The number of carbon atoms is not particularly limited, but may be 1 to 5. Specific examples of the alkenylene group include, but are not limited to, ethenylene, propenylene, butenylene, pentenylene, and the like.
상기 치환기는 할로겐기, 탄소수 1 내지 5의 알킬기, 탄소수 1 내지 5의 알콕시기, 탄소수 2 내지 5의 알케닐기일 수 있다.The substituent may be a halogen group, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or an alkenyl group having 2 to 5 carbon atoms.
상기 l은 1~4의 정수이며, 상기 m은 1~8의 정수이고, 상기 n은 화학식 1로 표시되는 것이 반복단위임을 나타낸다.Wherein l is an integer of 1 to 4, m is an integer of 1 to 8, and n represents a repeating unit represented by the formula (1).
상기 카도계 바인더는 에폭시 아크릴레이트계 수지를 이용하여 제조한 것일 수 있다. The cadmium binder may be one prepared by using an epoxy acrylate resin.
본 출원의 일 구현예에서, 상기 카도계 바인더는 구체적으로, 산가가 10 ~ 200 KOH mg/g 인 것일 수 있고, 더욱 구체적으로 산가가 30 ~ 150 KOH mg/g 인 것일 수 있다. In one embodiment of the present application, the cation binder may specifically be an acid value of 10 to 200 KOH mg / g, more specifically an acid value of 30 to 150 KOH mg / g.
또한, 상기 카도계 바인더 수지의 중량평균분자량(겔 투과 크로마토그래피 즉, GPC에 의해 측정된 값)은 구체적으로, 1,000 내지 30,000, 더욱 구체적으로, 1,500 내지 10,000인 것일 수 있다. 분자량이 1,000 내지 30,000이면 밀링 기능이 좋고, 내열성 및 내화학성 등의 물성을 만족시킬 수 있다. In addition, the weight average molecular weight (measured by gel permeation chromatography, i.e., GPC) of the cationic binder resin may be specifically 1,000 to 30,000, more specifically 1,500 to 10,000. When the molecular weight is 1,000 to 30,000, the milling function is good and the physical properties such as heat resistance and chemical resistance can be satisfied.
본 출원의 일 구현예에서, 상기 카도계 바인더의 함량은 착색제 조성물 100 중량부를 기준으로 0.1 ~ 10 중량부일 수 있다. 0.1 ~ 10 중량부일 때 밀링 효과가 좋다. 0.1 중량부 미만이면 밀링 효과가 미미하고, 10 중량부 초과이면 바인더의 증가량에 비하여 밀링 효과의 증가가 거의 없다.In one embodiment of the present application, the content of the cationic binder may be 0.1 to 10 parts by weight based on 100 parts by weight of the colorant composition. The milling effect is good when it is 0.1 to 10 parts by weight. If the amount is less than 0.1 part by weight, the milling effect is insignificant. If the amount is more than 10 parts by weight, the milling effect is hardly increased compared with the increase amount of the binder.
본 출원의 일 구현예에서, 상기 카도계 바인더의 함량은 착색제 조성물 중의 바인더 100 중량부를 기준으로 50 ~ 100 중량부일 수 있다. 상기 바인더로 아크릴계 바인더를 더 포함할 수 있다. 상기 착색제 조성물 중에 카도계 바인더: 아크릴계 바인더의 혼합 비율은 50~100: 0~50 일 수 있다. In one embodiment of the present application, the content of the cationic binder may be 50 to 100 parts by weight based on 100 parts by weight of the binder in the colorant composition. The binder may further include an acrylic binder. The mixing ratio of the photocatalyst binder: acrylic binder in the colorant composition may be 50 to 100: 0 to 50.
상기 카도계 바인더와 아크릴계 바인더는 착색제 조성물 내에서 밀링 기능을 할 수 있다. 밀링(milling)이란 하나의 성분 입자 표면을 다른 성분으로 덮어 싸는 것을 말한다. 착색제 조성물 내의 바인더 중 카도계 바인더가 포함됨으로써, 카본 블랙을 밀링하는 기능이 더욱 높아지고, 고온 공정에서의 저항값 저하를 최소화하게 할 수 있는 효과가 있다. The cationic binder and the acrylic binder may function as a milling agent in the colorant composition. Milling refers to covering one component particle surface with another component. The incorporation of a cadmium binder among the binders in the colorant composition further enhances the function of milling the carbon black and has the effect of minimizing a decrease in resistance value in a high temperature process.
상기 착색제 조성물은 용매 및 분산제 중 1종 이상을 더 포함할 수 있다.The colorant composition may further include at least one of a solvent and a dispersant.
본 출원의 일 구현예에서, 상기 착색제 조성물은 흑색 안료를 포함하는 착색제를 포함할 수 있다. 상기 착색제는 흑색 안료만을 사용하거나, 흑색 안료와 컬러 착색 안료를 혼합하여 사용할 수 있다. In one embodiment of the present application, the colorant composition may comprise a colorant comprising a black pigment. The colorant may be a black pigment alone or a mixture of a black pigment and a color pigment.
상기 흑색 안료는 카본 블랙을 고저항 처리하여 표면저항 값이 1011Ωcm 이상인 카본 블랙일 수 있고, 상기 카본 블랙과 유기블랙안료의 혼합물일 수 있다. 유기 블랙 안료를 혼합하면 평균 광학 밀도를 높일 뿐만 아니라 각 단위 파장별로 평균 광학 밀도(OD)를 균일하게 조정하여 높은 차광성을 갖게 하는 효과가 있다.The black pigment may be carbon black having a surface resistance value of 10 11 ? Cm or more by subjecting the carbon black to high resistance treatment, and may be a mixture of the carbon black and the organic black pigment. The mixing of the organic black pigment not only raises the average optical density but also has an effect of uniformly adjusting the average optical density (OD) for each unit wavelength to have a high light shielding property.
상기 카본 블랙으로는 동해카본(주)의 시스토 5HIISAF-HS, 시스토 KH, 시스토 3HHAF-HS, 시스토 NH, 시스토 3M, 시스토 300HAF-LS, 시스토 116HMMAF-HS, 시스토 116MAF, 시스토 FMFEF-HS, 시스토 SOFEF, 시스토 VGPF, 시스토 SVHSRF-HS, 및 시스토 SSRF; 토쿠시키사 BK_8132; 미쯔비시화학(주)의 다이어그램 블랙 Ⅱ, 다이어그램 블랙 N339, 다이어그램 블랙 SH, 다이어그램 블랙 H, 다이어그램 LH, 다이어그램 HA, 다이어그램 SF, 다이어그램 N550M, 다이어그램 M, 다이어그램 E, 다이어그램 G, 다이어그램 R, 다이어그램 N760M, 다이어그램 LR, #2700, #2600, #2400, #2350, #2300, #2200, #1000, #980, #900, MCF88, #52, #50, #47, #45, #45L, #25, #CF9, #95, #3030, #3050, MA7, MA77, MA8, MA11, OIL7B, OIL9B, OIL11B, OIL30B, 및 OIL31B; 대구사(주)의 PRINTEX-U, PRINTEX-V, PRINTEX-140U, PRINTEX-140V, PRINTEX-95, PRINTEX-85, PRINTEX-75, PRINTEX-55, PRINTEX-45, PRINTEX-300, PRINTEX-35, PRINTEX-25, PRINTEX-200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A, SPECIAL BLACK-550, SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100, 및 LAMP BLACK-101; 콜롬비아 카본(주)의 RAVEN-1100ULTRA, RAVEN-1080ULTRA, RAVEN-1060ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN-1000, RAVEN-890H, RAVEN-890, RAVEN-880ULTRA, RAVEN-860ULTRA, RAVEN-850, RAVEN-820, RAVEN-790ULTRA, RAVEN-780ULTRA, RAVEN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN-450, RAVEN-430ULTRA, RAVEN-420, RAVEN-410, RAVEN-2500ULTRA, RAVEN-2000, RAVEN-1500, RAVEN-1255, RAVEN-1250, RAVEN-1200, RAVEN-1190ULTRA, 및 RAVEN-1170 등을 단독 또는 혼합하여 사용한다.Examples of the carbon black include CISTO 5HIISAF-HS, CISTO KH, CISTO 3HHAF-HS, CISTO NH, CISTO 3M, CISTO 300HAF-LS, CISTO 116HMMAF-HS, CISTO 116MAF , Cysto FMFEF-HS, Cysto SOFEF, Cysto VGPF, Cysto SVHSRF-HS, and Cysto SSRF; Tokushikisha BK_8132; Diagram Black II, Diagram Black N339, Diagram Black SH, Diagram Black H, Diagram LH, Diagram HA, Diagram SF, Diagram N550M, Diagram M, Diagram E, Diagram G, Diagram R, Diagram N760M, Diagram LR, # 2700, # 2600, # 2400, # 2350, # 2300, # 2200, # 1000, # 980, # 900, MCF88, # 52, # 50, # 47, # 45, # 45L, CF9, # 95, # 3030, # 3050, MA7, MA77, MA8, MA11, OIL7B, OIL9B, OIL11B, OIL30B, and OIL31B; PRINTEX-55, PRINTEX-55, PRINTEX-45, PRINTEX-35, PRINTEX-55, PRINTEX-85, PRINTEX-75, PRINTEX- SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100, and LAMP BLACK-101; PRINTEX-25, PRINTEX-200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A; SPECIAL BLACK-550; RAVEN-1080 ULTRA, RAVEN-1060ULTRA, RAVEN-1060ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN-1000, RAVEN-890H, RAVEN-890, RAVEN- 420, RAVEN-410, RAVEN-850, RAVEN-820, RAVEN-790ULTRA, RAVEN-780ULTRA, RAVEN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN- RAVEN-1250, RAVEN-1200, RAVEN-1190ULTRA, and RAVEN-1170 may be used alone or in combination.
상기 유기블랙안료로는 표면저항 값이 1011Ωcm 이상인 것이 효과가 좋고, 예를 들어, 락탐 블랙, 아닐린 블랙 또는 퍼릴렌 블랙 등을 사용할 수 있다.As the organic black pigment, it is effective that the surface resistance value is 10 11 ? Cm or more. For example, lactam black, aniline black or perylene black can be used.
상기 카본 블랙은 전체 착색제 조성물 100 중량부를 기준으로 5 내지 30 중량부의 함량으로 포함되는 것이 효과가 좋다.It is effective that the carbon black is contained in an amount of 5 to 30 parts by weight based on 100 parts by weight of the total colorant composition.
카본 블랙의 함량이 5 중량부 미만이면 형성된 필름의 광학밀도가 낮아 충분한 차광성을 갖지 못할 수 있고, 30 중량부 초과이면 현상성에 문제를 있거나 잔사가 발생할 수 있다.When the content of the carbon black is less than 5 parts by weight, the optical density of the formed film is low, so that it may not have sufficient light shielding property. If the content is more than 30 parts by weight, there is a problem in development or residue.
상기 카본 블랙과 혼합하여 사용 가능한 컬러 착색 안료로는 카민 6B(C.I.12490), 프탈로시아닌 그린(C.I. 74260), 프탈로시아닌 블루(C.I. 74160), 리놀옐로우(C.I.21090), 리놀 옐로우GRO(C.I. 21090), 벤지딘 옐로우4T-564D, 빅토리아 퓨어 블루(C.I.42595), C.I. PIGMENT RED97, 122, 149, 168, 177, 180, 192, 215, C.I. PIGMENT GREEN 7, 36, C.I. PIGMENT 15:1, 15:4, 15:6, 22, 60, 64, C.I. PIGMENT 83, 139 C.I. PIGMENT VIOLET 23 등이 있으며, 이 밖에 백색 안료, 형광안료 등을 사용할 수도 있다.Examples of coloring pigments usable in combination with the carbon black include carmine 6B (CI12490), phthalocyanine green (CI 74260), phthalocyanine blue (CI 74160), linool yellow (CI 21090), lino yellow yellow GRO (CI 21090) Yellow 4T-564D, Victoria Pure Blue (CI42595), CI PIGMENT RED97, 122, 149, 168, 177, 180, 192, 215, C.I. PIGMENT GREEN 7, 36, C.I. PIGMENT 15: 1, 15: 4, 15: 6, 22, 60, 64, C.I. PIGMENT 83, 139 C.I. PIGMENT VIOLET 23, etc. In addition, white pigments, fluorescent pigments, etc. may be used.
본 출원의 일 구현예에서, 상기 감광성 수지 조성물은 착색제 조성물에 추가하여 알칼리 가용성 바인더 수지; 가교성 화합물; 광중합 개시제; 밀착 촉진제; 및 용매로 이루어진 군에서 선택되는 1종 또는 2종 이상을 더 포함할 수 있다. In one embodiment of the present application, the photosensitive resin composition further comprises, in addition to the colorant composition, an alkali-soluble binder resin; A crosslinkable compound; A photopolymerization initiator; Adhesion promoters; And a solvent may be further included.
본 출원의 일 구현예에서, 상기 감광성 수지 조성물은 착색제 조성물; 알칼리 가용성 바인더; 가교성 화합물; 광중합 개시제; 및 용매를 모두 포함할 수 있다.In one embodiment of the present application, the photosensitive resin composition comprises a colorant composition; An alkali soluble binder; A crosslinkable compound; A photopolymerization initiator; And a solvent.
본 출원의 일 구현예에서, 상기 착색제 조성물의 함량은 감광성 수지 조성물 100 중량부를 기준으로 30 내지 60 중량부일 수 있다.In one embodiment of the present invention, the content of the colorant composition may be 30 to 60 parts by weight based on 100 parts by weight of the photosensitive resin composition.
본 출원의 일 구현예에서, 상기 알칼리 가용성 바인더는 아크릴계 바인더 및 카도계 바인더 중에서 1종 이상을 포함할 수 있다. 혼합하여 사용할 경우 아크릴계 바인더: 카도계 바인더의 혼합 비율은 구체적으로, 1~99: 99~1일 수 있고, 더욱 구체적으로 50:50일 수 있다. In one embodiment of the present application, the alkali soluble binder may include at least one of an acrylic binder and a cadmium binder. When used in combination, the mixing ratio of the acrylic binder: caustic binder may be specifically from 1 to 99:99 to 1, more specifically, 50:50.
상기 감광성 수지 조성물에서 바인더로 사용되는 아크릴계 바인더 또는 카도계 바인더는 기판 접착력에서 우수한 효과를 보여준다.The acrylic binder or the cadmium-based binder used as the binder in the photosensitive resin composition shows excellent effects on the substrate adhesion.
상기 알칼리 가용성 바인더에서 포함할 수 있는 카도계 바인더는 상기 화학식 1로 표시되는 반복단위를 포함하는 것일 수 있다.The cation binder which may be contained in the alkali-soluble binder may include the repeating unit represented by the formula (1).
상기 카도계 바인더는 구체적으로, 산가가 10 ~ 200 KOH mg/g 인 것일 수 있고, 더욱 구체적으로 산가가 30 ~ 150 KOH mg/g 인 것일 수 있다. 산가가 10 KOH mg/g 이상이면 알칼리 현상액에 대한 용해도가 좋아서 현상 시간을 단축해주고, 기판상에 잔사가 남지 않게 하는 효과가 있고, 200 KOH mg/g 이하이면 패턴의 탈착을 방지하고 패턴의 직진성을 확보할 수 있게 한다. Specifically, the cation binder may have an acid value of 10 to 200 KOH mg / g, and more specifically, an acid value of 30 to 150 KOH mg / g. When the acid value is more than 10 KOH mg / g, the solubility in the alkaline developer is good, shortening the development time and preventing the residue from remaining on the substrate. When the acid value is less than 200 KOH mg / g, .
또한, 상기 카도계 바인더의 중량평균분자량(겔 투과 크로마토그래피 즉, GPC에 의해 측정된 값)은 구체적으로, 1,000 내지 30,000, 더욱 구체적으로, 1,500 ~ 10,000인 것일 수 있다. 분자량이 1,000 이상이면 바인딩 기능이 좋고, 현상시의 물리적 외력에 견딜 수 있어 패턴이 소실되지 않으며, 기본적인 내열성 및 내화학성 등의 물성을 만족시킬 수 있다. 또한, 분자량이 30,000이하이면 알칼리 현상액에 대한 현상성이 적어서 현상이 불가능해질 수 있는 문제를 방지하고, 흐름성이 나빠져서 코팅 두께의 제어나 두께의 균일성의 확보가 어려워질 수 있는 문제를 방지한다. In addition, the weight average molecular weight (gel permeation chromatography, that is, the value measured by GPC) of the cation binder may specifically be 1,000 to 30,000, more specifically 1,500 to 10,000. When the molecular weight is 1,000 or more, the binding function is good, and it can withstand the physical external force at the time of development, the pattern is not lost, and the physical properties such as basic heat resistance and chemical resistance can be satisfied. Further, when the molecular weight is 30,000 or less, the problem that the developability with respect to the alkali developer is small and the development can not be made is prevented, and the flowability is deteriorated to prevent the control of the coating thickness and the uniformity of the thickness.
상기 아크릴계 바인더는 막의 기계적 강도를 부여하는 모노머와 알칼리 용해성을 부여하는 모노머로 구성된 것을 사용할 수 있고, 동시에 패턴의 테이퍼 각도를 낮게 형성할 수 있는 것을 사용하는 것이 좋다.The acrylic binder may be composed of a monomer which imparts mechanical strength to the film and a monomer which imparts alkali solubility, and at the same time, a taper angle of the pattern can be reduced.
상기 막의 기계적 강도와 테이퍼 각도 조절에 사용가능한 모노머로는 예를 들어, 벤질(메타)아크릴레이트, 메틸(메타)아크릴레이트, 에틸(메타) 아크릴레이트, 부틸(메타)아크릴레이트, 디메틸아미노에틸(메타)아크릴레이트, 이소부틸(메타)아크릴레이트, t-부틸(메타)아크릴레이트, 시클로헥실(메타) 아크릴레이트, 이소보닐(메타)아크릴레이트, 에틸헥실(메타)아크릴레이트, 2-페녹시에틸(메타)아크릴레이트, 테트라히드로퍼프릴(메타)아크릴레이트, 히드록시에틸(메타)아크릴레이트, 2-히드록시프로필(메타)아크릴레이트, 2-히드록시-3-클로로프로필(메타)아크릴레이트, 4-히드록시부틸(메타)아크릴레이트, 글리세롤(메타)아크릴레이트, 2-메톡시에틸(메타)아크릴레이트, 3-메톡시부틸(메타)아크릴레이트, 에톡시디에틸렌글리콜(메타)아크릴레이트, 메톡시트리에틸렌글리콜(메타) 아크릴레이트, 메톡시트리프로필렌글리콜(메타)아크릴레이트, 폴리(에틸렌 글리콜)메틸에테르(메타)아크릴레이트, 페녹시디에틸렌글리콜(메타)아크릴레이트, p-노닐페녹시폴리에틸렌글리콜(메타)아크릴레이트, p-노닐페녹시폴리프로필렌글리콜(메타)아크릴레이트, 글리시딜(메타)아크릴레이트, 디시클로펜타닐(메타)아크릴레이트, 디시클로펜테닐(메타)아크릴레이트, 디시클로펜테닐옥시에틸(메타)아크릴레이트, 이소보닐(메타)아크릴레이트, 아다멘틸(메타)아크릴레이트, 스테아릴(메타)아크릴레이트, 헥실(메타)아크릴레이트, 헵틸(메타)아크릴레이트, 옥실(메타)아크릴레이트, 노닐(메타) 아크릴레이트, 데실(메타)아크릴레이트, 라우릴메타아크릴레이트, 메틸 α-히드록시메틸 아크릴레이트, 에틸 α-히드록시메틸 아크릴레이트, 프로필 α-히드록시메틸 아크릴레이트, 부틸 α-히드록시메틸 아크릴레이트와 같은 불포화 카르복시산 에스테르류; 스티렌, α-메틸스티렌, (o,m,p)-비닐 톨루엔, (o,m,p)-메톡시 스티렌, (o,m,p)-클로로 스티렌과 같은 방향족 비닐류; 비닐 메틸 에테르, 비닐 에틸 에테르, 알릴 글리시딜 에테르와 같은 불포화 에테르류; N-페닐 말레이미드, N-(4-클로로페닐) 말레이미드, N-(4-히드록시페닐) 말레이미드, N-시클로헥실 말레이미드와 같은 불포화 이미드류; 및 무수 말레인산, 무수 메틸 말레인산과 같은 무수 말레산류로 이루어진 군으로부터 선택되는 1종을 사용할 수 있고, 2종 이상을 사용하는 것이 효과가 좋다. 특히 치환된 사슬길이가 6 ~ 18인 모노머를 1 내지 30 몰 당량 혼합 사용하는 것이 바람직하나, 이들에만 한정되는 것은 아니다. Examples of the monomer that can be used for adjusting the mechanical strength and taper angle of the film include benzyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, dimethylaminoethyl (Meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, cyclohexyl Hydroxypropyl (meth) acrylate, ethyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, hydroxyethyl (meth) acrylate, 2- (Meth) acrylate, 2-methoxyethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, ethoxydiethylene glycol (meth) Late, meth (Meth) acrylate, p-nonylphenoxypolyethylene glycol (meth) acrylate, pentaerythritol tri (meth) acrylate, (Meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentanyl (meth) acrylate, p-nonylphenoxypolypropylene glycol (Meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, oxyl (meth) acrylate, (Meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl methacrylate, methyl a- hydroxymethylacrylate, ethyl a- Unsaturated carboxylic acid esters such as acrylate, propyl α- hydroxymethyl acrylate, butyl α- hydroxymethyl acrylate; Aromatic vinyls such as styrene,? -Methylstyrene, (o, m, p) -vinyltoluene, (o, m, p) -methoxystyrene and (o, m, p) -chlorostyrene; Unsaturated ethers such as vinyl methyl ether, vinyl ethyl ether and allyl glycidyl ether; Unsaturated imides such as N-phenylmaleimide, N- (4-chlorophenyl) maleimide, N- (4-hydroxyphenyl) maleimide and N-cyclohexylmaleimide; Maleic anhydride and maleic anhydride such as maleic anhydride and methylmaleic anhydride, and it is effective to use two or more kinds thereof. In particular, it is preferable to use 1 to 30 molar equivalents of monomers having a substituted chain length of 6 to 18, but not limited thereto.
알칼리 용해성을 부여하는 모노머로는 예를 들어, (메타)아크릴산, 크로톤산, 이타콘산, 말레인산, 푸마르산, 모노메틸 말레인산, 5-노보넨-2-카복실산, 모노-2-((메타)아크릴로일옥시)에틸 프탈레이트, 모노-2-((메타)아크릴로일옥시)에틸 숙시네이트, ω-카르복시 폴리카프로락톤 모노(메타)아크릴레이트로 이루어지는 군으로부터 선택되는 1 종 이상을 사용하는 것이 효과가 좋으나, 이들에만 한정되는 것은 아니다.Examples of the monomer which imparts alkali solubility include (meth) acrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, monomethyl maleic acid, 5-norbornene-2-carboxylic acid, mono- It is effective to use at least one member selected from the group consisting of (meth) acrylic acid mono (meth) acrylate mono (meth) acrylate mono (meth) acrylate mono But are not limited to these.
본 출원의 일 구현예에서, 상기 아크릴계 바인더는 구체적으로, 산가가 10 ~ 200 KOH mg/g 인 것일 수 있고, 더욱 구체적으로 산가가 30 ~ 150 KOH mg/g 인 것일 수 있다. 산가가 10 KOH mg/g 이상이면 알칼리 현상액에 대한 용해도가 좋아서 현상 시간을 단축해주고, 기판상에 잔사가 남지 않게 하는 효과가 있고, 200 KOH mg/g 이하이면 패턴의 탈착을 방지하고 패턴의 직진성을 확보할 수 있게 하고 패턴의 테이퍼각이 90°를 넘는 역페이퍼가 생기지 않게 한다. In one embodiment of the present application, the acrylic binder may specifically have an acid value of 10 to 200 KOH mg / g, more specifically, an acid value of 30 to 150 KOH mg / g. When the acid value is more than 10 KOH mg / g, the solubility in the alkaline developer is good, shortening the development time and preventing the residue from remaining on the substrate. When the acid value is less than 200 KOH mg / g, So that reverse paper having a taper angle of the pattern exceeding 90 degrees is not generated.
또한, 상기 아크릴계 바인더의 중량평균분자량(겔 투과 크로마토그래피 즉, GPC에 의해 측정된 값)은 구체적으로, 1,000 ~ 50,000, 더욱 구체적으로, 2,000 ~ 30,000인 것일 수 있다. 분자량이 1,000이상이면 바인딩 기능이 좋고, 현상시의 물리적 외력에 견딜 수 있어 패턴이 소실되지 않으며, 기본적인 내열성 및 내화학성 등의 물성을 만족시킬 수 있다. 또한, 분자량이 50,000이하이면 알칼리 현상액에 대한 현상성이 적어서 현상이 불가능해질 수 있는 문제를 방지하고, 흐름성이 나빠져서 코팅 두께의 제어나 두께의 균일성의 확보가 어려워질 수 있는 문제를 방지한다. The weight average molecular weight (measured by gel permeation chromatography, i.e., GPC) of the acrylic binder may be specifically from 1,000 to 50,000, more specifically from 2,000 to 30,000. When the molecular weight is 1,000 or more, the binding function is good, and it can withstand the physical external force at the time of development, the pattern is not lost, and the physical properties such as basic heat resistance and chemical resistance can be satisfied. In addition, when the molecular weight is 50,000 or less, the problem that the developability with respect to the alkali developer is small and the development is impossible is prevented, and the flowability is deteriorated, thereby preventing the control of the thickness of the coating and the uniformity of the thickness.
상기 감광성 수지 조성물은 전체 조성물 100 중량부를 기준으로, 알칼리 가용성 바인더 1 내지 20 중량부, 구체적으로 1 내지 10 중량부를 포함하면 효과가 좋다. 알칼리 가용성 바인더의 함량이 1 중량부 미만이면 형성된 패턴의 접착성이 저하될 수 있거나 알칼리 수용액을 이용한 패터닝이 어렵게 될 수 있고, 20 중량부 초과이면 형성된 화상의 강도 및 감도가 저하되거나 현상시에 패턴이 유실될 수도 있다.The above-mentioned photosensitive resin composition is effective when it contains 1 to 20 parts by weight, specifically 1 to 10 parts by weight, of an alkali-soluble binder based on 100 parts by weight of the total composition. If the content of the alkali soluble binder is less than 1 part by weight, the adhesion of the formed pattern may be deteriorated or the patterning using the alkali aqueous solution may be difficult. If the content is more than 20 parts by weight, the strength and sensitivity of the formed image may be deteriorated, May be lost.
본 출원의 일 구현예에서, 상기 가교성 화합물은 구체적으로 에틸렌성 불포화 이중결합을 가지는 다관능성 모노머일 수 있고, 더욱 구체적으로 분자 중에 1 개 이상의 부가중합 가능한 불포화기를 갖는 비등점이 100 ℃ 이상인 화합물 및 카프로락톤을 도입한 다관능성 모노머 중에서 1종 이상인 것일 수 있다. In one embodiment of the present application, the crosslinkable compound may specifically be a polyfunctional monomer having an ethylenically unsaturated double bond, more specifically, a compound having a boiling point of not lower than 100 占 폚 having at least one unsaturated group capable of addition- But may be one or more of the polyfunctional monomers into which caprolactone is introduced.
상기 분자 중에 적어도 1 개 이상의 부가중합 가능한 불포화기를 갖는 비등점이 100 ℃ 이상인 화합물로는 폴리에틸렌글리콜 모노(메타)아크릴레이트, 폴리프로필렌글리콜 모노(메타)아크릴레이트, 페녹시에틸(메타)아크릴레이트 등의 단관능성 모노머; 폴리에틸렌글리콜 (메타)아크릴레이트, 폴리프로필렌글리콜 (메타)아크릴레이트, 트리메틸올 에탄 트리아크릴레이트, 트리메틸롤 프로판 트리아크릴레이트, 네오펜틸글리콜 (메타)아크릴레이트, 펜타에리트리톨 테트라아크릴레이트, 펜타에리트리톨 트리아크릴레이트, 디펜타에리트리톨 펜타아크릴레이트, 디펜타에리트리톨 헥사아크릴레이트 등의 다관능성 모노머;로 이루어진 군으로부터 선택되는 1종 이상을 사용할 수 있으나 이들에만 한정되는 것은 아니다.Examples of the compound having at least one addition polymerizable unsaturated group in the molecule and having a boiling point of 100 ° C or higher include polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate and phenoxyethyl (meth) Monofunctional monomers; (Meth) acrylates such as polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, trimethylol ethane triacrylate, trimethylolpropane triacrylate, neopentyl glycol (meth) acrylate, pentaerythritol tetraacrylate, Polyfunctional monomers such as triacrylate, dipentaerythritol pentaacrylate, and dipentaerythritol hexaacrylate; and the like, but are not limited thereto.
상기 카프로락톤을 도입한 다관능성 모노머로는 디펜타에리트리톨에 도입한 KAYARAD DPCA-20,30,60,120, 테트라히드로퓨릴 아크릴레이트에 도입한 KAYARAD TC-110S, 네오펜틸글리콜 히드록시피발레이트에 도입한 KAYARAD HX-220, KAYARAD HK-620 등; 공영사 제품으로 에폭시 에스터 200PA, 에폭시 에스터 3002M, 에폭시 에스터 3002A, 에폭시 에스터 3000M; 및 우레탄 아크릴레이트 계열로서 UA306H, UA306T, UA306I, UA510H, UF8001, 및 U-324A, U15HA, U-4HA;로 이루어진 군으로부터 선택되는 1종 이상을 사용할 수 있으나 이들에만 한정되는 것은 아니다.The caprolactone-introduced polyfunctional monomer was KAYARAD DPCA-20, 30, 60, 120 introduced into dipentaerythritol, KAYARAD TC-110S introduced into tetrahydrofuryl acrylate, and neopentyl glycol hydroxypivalate KAYARAD HX-220, KAYARAD HK-620, etc .; Epoxy ester 200PA, epoxy ester 3002M, epoxy ester 3002A, epoxy ester 3000M; And UA306H, UA306T, UA306I, UA510H, UF8001, and U-324A, U15HA, and U-4HA as the urethane acrylate series, but the present invention is not limited thereto.
상기 가교성 화합물은 전체 감광성 수지 조성물 100 중량부를 기준으로 1 내지 10 중량부의 함량으로 포함되는 것이 효과가 좋다. 그 함량이 1 중량부 이상이면 광감도나 코팅 필름의 강도가 저하를 방지하는 효과가 있고, 10 중량부 이하이면 감광성층의 점착성이 과잉 현상을 방지하여 필름의 강도를 충분하게 하고, 현상시 패턴의 손실을 방지하는 효과가 있다. It is effective that the crosslinkable compound is contained in an amount of 1 to 10 parts by weight based on 100 parts by weight of the entire photosensitive resin composition. When the amount is less than 10 parts by weight, the tackiness of the photosensitive layer prevents the excessively toughness of the film, so that the strength of the film is sufficient, There is an effect of preventing loss.
본 출원의 일 구현예에서, 상기 광중합 개시제는 아세토페논계 화합물, 비이미다졸계 화합물, 트리아진계 화합물 및 옥심계 화합물로 이루어진 군으로부터 선택되는 1종 이상인 것일 수 있다. In one embodiment of the present application, the photopolymerization initiator may be one or more selected from the group consisting of an acetophenone-based compound, a nonimidazole-based compound, a triazine-based compound, and a oxime-based compound.
상기 아세토페논계 화합물로는 예를 들어, 2-히드록시-2-메틸-1-페닐프로판-1-온, 1-(4-이소프로필페닐)-2-히드록시-2-메틸프로판-1-온, 4-(2-히드록시에톡시)-페닐-(2-히드록시-2-프로필)케톤, 1-히드록시시클로헥실페닐케톤, 벤조인메틸 에테르, 벤조인에틸 에테르, 벤조인이소부틸 에테르, 벤조인부틸 에테르, 2,2-디메톡시-2-페닐아세토페논, 2-메틸-(4-메틸티오)페닐-2-몰폴리노-1-프로판-1-온, 2-벤질-2-디메틸아미노-1-(4-몰폴리노페닐)-부탄-1-온, 2-(4-브로모-벤질-2-디메틸아미노-1-(4-몰폴리노페닐)-부탄-1-온 및 2-메틸-1-[4-(메틸티오)페닐]-2-몰폴리노프로판-1-온으로 이루어진 군에서 선택되는 1종 이상인 것일 수 있으나, 이에 제한되지 않는다. Examples of the acetophenone compound include 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1- (4-isopropylphenyl) -2- (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexyl phenyl ketone, benzoin methyl ether, benzoin ethyl ether, benzoin iso Butyl ether, benzoin butyl ether, 2,2-dimethoxy-2-phenylacetophenone, 2-methyl- (4-methylthio) phenyl- 2-dimethylamino-1- (4-morpholinophenyl) -butane, 2- (4-bromo- 1-one and 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one.
상기 비이미다졸계 화합물로는 예를 들어, 2,2-비스(2-클로로페닐)-4,4',5,5'-테트라페닐 비이미다졸, 2,2'-비스(o-클로로페닐)-4,4',5,5'-테트라키스(3,4,5-트리메톡시페닐)-1,2'-비이미다졸, 2,2'-비스(2,3-디클로로페닐)-4,4',5,5'-테트라페닐 비이미다졸 및 2,2'-비스(o-클로로페닐)-4,4',5,5'-테트라페닐-1,2'-비이미다졸로 이루어진 군에서 선택되는 1종 이상인 것일 수 있으나, 이에 제한되지 않는다. Examples of the imidazole-based compound include 2,2-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole, 2,2'-bis Phenyl) -4,4 ', 5,5'-tetrakis (3,4,5-trimethoxyphenyl) -1,2'-biimidazole, 2,2'-bis (2,3-dichlorophenyl ) -4,4 ', 5,5'-tetraphenylbiimidazole and 2,2'-bis (o-chlorophenyl) -4,4', 5,5'-tetraphenyl- But are not limited to, at least one selected from the group consisting of imidazoles.
상기 트리아진계 화합물로는 예를 들어, 3-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}프로피오닉산, 1,1,1,3,3,3-헥사플로로이소프로필-3-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}프로피오네이트, 에틸-2-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}아세테이트, 2-에폭시에틸-2-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}아세테이트, 시클로헥실-2-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}아세테이트, 벤질-2-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}아세테이트, 3-{클로로-4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}프로피오닉산, 3-{4-[2,4-비스(트리클로로메틸)-s-트리아진-6-일]페닐티오}프로피온아미드, 2,4-비스(트리클로로메틸)-6-p-메톡시스티릴-s-트리아진, 2,4-비스(트리클로로메틸)-6-(1-p-디메틸아미노페닐)-1,3,-부타디에닐-s-트리아진 및 2-트리클로로메틸-4-아미노-6-p-메톡시스티릴-s-트리아진으로 이루어진 군에서 선택되는 1종 이상인 것일 수 있으나, 이에 제한되지 않는다. Examples of the triazine-based compound include 3- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} propionic acid, 1,1,1,3 , 3,3-hexafluoroisopropyl-3- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} propionate, ethyl 2- { - [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} acetate, 2- Yl] phenylthio} acetate, cyclohexyl-2- {4- [2,4-bis (trichloromethyl) -s-triazine- - {4- [2,4-bis (trichloromethyl) -s-triazine-6-yl] phenylthio} acetate, 3- { -Triazin-6-yl] phenylthio} propionic acid, 3- {4- [2,4-bis (trichloromethyl) -Bis (trichloromethyl) -6- p-methoxystyryl-s-triazine, 2,4-bis (trichloro Methyl-6- (1-p-dimethylaminophenyl) -1,3, -butadienyl-s-triazine and 2-trichloromethyl- And triazine. However, the present invention is not limited thereto.
상기 옥심계 화합물로는 예를 들어, 1,2-옥타디온,-1-(4-페닐치오)페닐,-2-(o-벤조일옥심)(시바가이기사, 시지아이124), 에타논,-1-(9-에틸)-6-(2-메틸벤조일-3-일)-,1-(O-아세틸옥심)(씨지아이242) 및 N-1919(아데카사) 로 이루어진 군에서 선택되는 1종 이상인 것일 수 있으나, 이에 제한되지 않는다. Examples of the oxime compounds include 1,2-octadione, -1- (4-phenylthio) phenyl, 2- (o-benzoyloxime) (Ciba Geigy, Shisei 124) (O-acetyloxime) (Cajai 242) and N-1919 (Adeca), which is a compound selected from the group consisting of But it is not limited thereto.
본 출원의 일 구현예에서, 상기 광중합 개시제는 전체 감광성 수지 조성물 100 중량부를 기준으로 0.1 내지 10중량부의 함량으로 포함되는 것이 효과가 좋다. 0.1중량부 미만이면, 첨가의 효과가 미미하고, 10 중량부 초과이면 증가량에 비하여 효과에 차이가 없다.In one embodiment of the present invention, it is effective that the photopolymerization initiator is contained in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the entire photosensitive resin composition. If the amount is less than 0.1 part by weight, the effect of addition is insignificant. If the amount is more than 10 parts by weight, there is no difference in the effect compared with the increase amount.
상기 광중합 개시제는 감광성 수지 조성물 중 상기 에틸렌성 불포화 이중결합을 가지는 다관능성 모노머와 바인더 수지의 합 100 중량부를 기준으로 1 ~ 300 중량부로 사용하는 것이 좋다. 구체적으로 아세토페논계 화합물, 비이미다졸계 화합물, 트리아진계 화합물 및 옥심계 화합물 중에 1종 또는 2종 이상을 혼합하여 사용할 수 있다. 아세토페논계 화합물은 구체적으로 1 ~ 300 중량부, 더욱 구체적으로 1 ~ 200 중량부를 사용할 때 효과가 좋고, 비이미다졸계 화합물은 구체적으로 1 ~ 300 중량부, 더욱 구체적으로 1 ~ 100 중량부를 사용할 때 효과가 좋으며, 트리아진계 화합물은 구체적으로 1 ~ 300 중량부, 더욱 구체적으로 1 ~ 100 중량부를 사용할 때 효과가 좋고, 옥심계 화합물은 구체적으로 1 ~ 300 중량부, 더욱 구체적으로 1 ~ 50 중량부를 사용하는 것이 효과가 좋다.The photopolymerization initiator is preferably used in an amount of 1 to 300 parts by weight based on 100 parts by weight of the sum of the multifunctional monomer having an ethylenically unsaturated double bond and the binder resin in the photosensitive resin composition. Specifically, one or more of acetophenone-based compounds, nonimidazole-based compounds, triazine-based compounds and oxime-based compounds may be used in combination. Specifically, the acetophenone-based compound is preferably used in an amount of 1 to 300 parts by weight, more specifically 1 to 200 parts by weight, and the non-imidazole-based compound is specifically used in an amount of 1 to 300 parts by weight, more specifically 1 to 100 parts by weight 1 to 300 parts by weight, more specifically 1 to 100 parts by weight, of the triazine-based compound is effective, and the oxime-based compound is specifically 1 to 300 parts by weight, more specifically 1 to 50 parts by weight It is effective to use the part.
본 출원의 일 구현예에서, 상기 광중합 개시제는, 보조성분으로 라디칼의 발생을 촉진시키는 광가교증감제 또는 경화를 촉진시키는 경화촉진제를 포함할 수 있고, 가교 증감제와 경화촉진제 모두를 포함할 수 있다. 상기 광가교증감제 또는 경화촉진제의 함량은 광중합 개시제 100 중량부를 기준으로 각각 0.01 내지 10 중량부로 포함될 수 있다. 0.01 중량부 미만이면, 첨가의 효과가 미미하고, 10 중량부 초과이면 증가량에 비하여 효과에 차이가 없다.In one embodiment of the present application, the photopolymerization initiator may include a photo-crosslinking sensitizer for accelerating generation of radicals as an auxiliary component or a curing accelerator for promoting curing, and may include both a crosslinking sensitizer and a curing accelerator have. The content of the photo-crosslinking sensitizer or the curing accelerator may be 0.01 to 10 parts by weight based on 100 parts by weight of the photopolymerization initiator. If the amount is less than 0.01 part by weight, the effect of addition is insignificant. If the amount is more than 10 parts by weight, the effect is not different from the increase amount.
상기 광가교증감제는 예를 들어, 벤조페논, 4,4-비스(디메틸아미노)벤조페논, 4,4-비스(디에틸아미노)벤조페논, 2,4,6-트리메틸아미노벤조페논, 메틸-o-벤조일벤조에이트, 3,3-디메틸-4-메톡시벤조페논, 3,3,4,4-테트라(t-부틸퍼옥시카보닐)벤조페논 등의 벤조페논계 화합물; 9-플로레논, 2-크로로-9-프로레논, 2-메틸-9-플로레논 등의 플로레논계 화합물; 티옥산톤, 2,4-디에틸 티옥산톤, 2-클로로 티옥산톤, 1-클로로-4-프로필옥시 티옥산톤, 이소프로필티옥산톤, 디이소프로필티옥산톤 등의 티옥산톤계 화합물; 크산톤, 2-메틸크산톤 등의 크산톤계 화합물; 안트라퀴논, 2-메틸 안트라퀴논, 2-에틸 안트라퀴논, t-부틸 안트라퀴논, 2,6-디클로로-9,10- 안트라퀴논 등의 안트라퀴논계 화합물; 9-페닐아크리딘, 1,7-비스(9-아크리디닐)헵탄, 1,5-비스(9-아크리디닐펜탄), 1,3-비스(9-아크리디닐)프로판 등의 아크리딘계 화합물; 벤질, 1,7,7-트리메틸-비시클로[2,2,1]헵탄-2,3-디온, 9,10-펜안트렌퀴논 등의 디카보닐 화합물; 2,4,6-트리메틸벤조일 디페닐포스핀 옥사이드, 비스(2,6-디메톡시벤조일)-2,4,4-트리메틸펜틸 포스핀 옥사이드 등의 포스핀 옥사이드계 화합물; 메틸-4-(디메틸아미노)벤조에이트, 에틸-4-(디메틸아미노)벤조에이트, 2-n-부톡시에틸-4-(디메틸아미노)벤조에이트 등의 벤조에이트계 화합물; 2,5-비스(4-디에틸아미노벤잘)시클로펜타논, 2,6-비스(4-디에틸아미노벤잘)시클로헥사논, 2,6-비스(4-디에틸아미노벤잘)-4-메틸-시클로펜타논 등의 아미노 시너지스트; 3,3-카본닐비닐-7-(디에틸아미노)쿠마린, 3-(2-벤조티아졸일)-7-(디에틸아미노)쿠마린, 3-벤조일-7-(디에틸아미노)쿠마린, 3-벤조일-7-메톡시-쿠마린, 10,10-카르보닐비스[1,1,7,7-테트라메틸-2,3,6,7-테트라히드로-1H,5H,11H-C1]-벤조피라노[6,7,8-ij]-퀴놀리진-11-온 등의 쿠마린계 화합물; 4-디에틸아미노 칼콘, 4-아지드벤잘아세토페논 등의 칼콘 화합물; 2-벤조일메틸렌, 3-메틸-b-나프토티아졸린;으로 이루어진 군으로부터 선택되는 1종 이상을 사용할 수 있으나, 이에 제한되지 않는다. Examples of the photo-crosslinking sensitizer include benzophenone, 4,4-bis (dimethylamino) benzophenone, 4,4-bis (diethylamino) benzophenone, 2,4,6-trimethylaminobenzophenone, methyl -benzoyl benzoate, 3,3-dimethyl-4-methoxybenzophenone, and 3,3,4,4-tetra (t-butylperoxycarbonyl) benzophenone; Fluorene-based compounds such as 9-fluorenone, 2-chloro-9-proprenone and 2-methyl-9-fluorenone; Thioxanthone systems such as thioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 1-chloro-4-propyloxytioxanthone, isopropylthioxanthone and diisopropylthioxanthone compound; Xanthone compounds such as xanthone and 2-methylxanthone; Anthraquinone compounds such as anthraquinone, 2-methyl anthraquinone, 2-ethyl anthraquinone, t-butyl anthraquinone, and 2,6-dichloro-9,10-anthraquinone; (9-acridinylpentane), 1,3-bis (9-acridinyl) propane, and the like Acridine-based compounds; Dicarbonyl compounds such as benzyl, 1,7,7-trimethyl-bicyclo [2,2,1] heptane-2,3-dione, and 9,10-phenanthrenequinone; Phosphine oxide-based compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide; Benzoate-based compounds such as methyl-4- (dimethylamino) benzoate, ethyl-4- (dimethylamino) benzoate and 2-n-butoxyethyl-4- (dimethylamino) benzoate; (4-diethylaminobenzal) cyclopentanone, 2,6-bis (4-diethylaminobenzal) cyclohexanone, 2,6-bis Amino-synergists such as methyl-cyclopentanone; (Diethylamino) coumarin, 3- (2-benzothiazolyl) -7- (diethylamino) coumarin, 3-benzoyl- -Benzoyl-7-methoxy-coumarin, 10,10-carbonylbis [1,1,7,7-tetramethyl-2,3,6,7-tetrahydro-1H, 5H, 11H- Pyran o [6,7,8-ij] -quinolizine-11-one; Chalcone compounds such as 4-diethylaminokalone and 4-azidobenzalacetophenone; 2-benzoylmethylene, and 3-methyl-b-naphthothiazoline; however, the present invention is not limited thereto.
상기 경화촉진제로는 예를 들어, 2-머캅토벤조이미다졸, 2-머캅토벤조티아졸, 2-머캅토벤조옥사졸, 2,5-디머캅토-1,3,4-티아디아졸, 2-머캅토-4,6-디메틸아미노피리딘, 펜타에리스리톨-테트라키스(3-머캅토프로피오네이트), 펜타에리스리톨-트리스(3-머캅토프로피오네이트), 펜타에리스리톨-테트라키스(2-머캅토아세테이트), 펜타에리스리톨-트리스(2-머캅토아세테이트), 트리메틸올프로판-트리스(2-머캅토아세테이트), 및 트리메틸올프로판-트리스(3-머캅토프로피오네이트)로 이루어진 군으로부터 선택되는 1종 이상을 사용할 수 있으나, 이에 제한되지 않는다. Examples of the curing accelerator include 2-mercaptobenzoimidazole, 2-mercaptobenzothiazole, 2-mercaptobenzoxazole, 2,5-dimercapto-1,3,4-thiadiazole, (2-mercapto-4,6-dimethylaminopyridine, pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol-tris Mercaptoacetate), pentaerythritol-tris (2-mercaptoacetate), trimethylolpropane-tris (2-mercaptoacetate), and trimethylolpropane-tris (3-mercaptopropionate) , But is not limited thereto.
본 출원의 일 구현예에서, 상기 감광성 수지 조성물은 밀착촉진제를 더 포함할 수 있다. In one embodiment of the present application, the photosensitive resin composition may further include an adhesion promoter.
본 출원의 일 구현예에서, 상기 밀착촉진제는 아크릴로일 실란 커플링제 또는 알킬 트리메톡시 실란을 사용할 수 있다. 상기 아크릴로일 실란 커플링제는 예를 들어, 메타아크릴로일옥시 프로필트리메톡시 실란, 메타아크릴로일옥시 프로필디메톡시 실란, 메타아크릴로일옥시 프로필트리에톡시 실란 및 메타아크릴로일옥시 프로필디메톡시실란으로 이루어지는 군에서 선택되는 1종 이상일 수 있고, 상기 알킬 트리메톡시 실란은 예를 들어, 옥틸트리메톡시 실란, 도데실트리메톡시 실란, 옥타데실트리메톡시 실란으로 이루어지는 군에서 선택되는 1종 이상일 수 있다.In one embodiment of the present application, the adhesion promoter may be an acryloyl silane coupling agent or alkyl trimethoxysilane. The acryloylsilane coupling agent may be, for example, methacryloyloxypropyltrimethoxysilane, methacryloyloxypropyldimethoxysilane, methacryloyloxypropyltriethoxysilane, and methacryloyloxypropyl Dimethoxysilane, and the alkyltrimethoxysilane may be selected from the group consisting of, for example, octyltrimethoxysilane, dodecyltrimethoxysilane, and octadecyltrimethoxysilane. Or more.
본 출원의 일 구현예에서, 상기 밀착촉진제의 함량은 전체 조성물 100 중량부를 기준으로 0.01 내지 1 중량부로 사용할 수 있다. 함량이 0.01중량부 미만이면, 첨가의 효과가 미미하고, 1 중량부 초과이면 증가량에 비하여 효과에 차이가 없다.In one embodiment of the present application, the content of the adhesion promoter may be 0.01 to 1 part by weight based on 100 parts by weight of the total composition. If the content is less than 0.01 part by weight, the effect of addition is insignificant. If the content is more than 1 part by weight, there is no difference in the effect compared with the increase.
본 출원의 일 구현예에서, 상기 용매는 용해성, 안료분산성, 도포성 등을 고려하여 사용할 수 있다. 예를 들어, 메틸-3-메톡시 프로피오네이트(144℃), 에틸렌글리콜 메틸에테르(125℃), 에틸렌글리콜 에틸에테르(135℃), 에틸렌글리콜 디에틸에테르(121℃), 디부틸에테르(140℃), 에틸피루베이트(144℃) 프로필렌글리콜 메틸에테르(121℃), 프로필렌글리콜 메틸에테르 아세테이트(146℃), n-부틸아세테이트(125℃), 이소부틸아세테이트(116℃), 아밀아세테이트(149℃), 이소아밀아세테이트(143℃), 부틸프로피오네이트(146℃), 이소아밀프로피오네이트(156℃), 에틸부티레이트(120℃), 프로필 부티레이트(143℃), 메틸-3-메톡시이소부티레이트(148℃), 메틸글리콜레이트(150℃), 메틸 락테이트(145℃), 에틸 락테이트(154℃), 메틸-2-히드록시이소부틸레이트(137℃), 에틸에톡시아세테이트(156℃), 2-메톡시에틸아세테이트(145℃), 에틸렌글리콜메틸에테르아세테이트(145℃), 2-에톡시에틸아세테이트(156℃), 디부틸에테르(140℃), 시클로펜타논(131℃), 시클로헥사논(155℃), 2-헥사논(127℃), 3-헥사논(123℃), 5-메틸-2-헥사논(145℃), 2-헵타논(150℃), 3-헵타논(148℃), 4-헵타논(145℃), 2-메틸-3-헵타논(159℃), 1-메톡시-2-프로판올(118℃), 에틸-2-히드록시-프로피오네이트(154℃), 및 에틸-3-메톡시프로피오네이트(158℃), 2-메톡시 에틸에테르(162℃), 3-메톡시부틸아세테이트(170℃), 2-에톡시에틸 에테르(185℃), 2-부톡시에탄올(171℃), 3-에톡시-프로판올(161℃), 디에틸렌글리콜도데실에테르(169℃), 디프로필렌글리콜메틸에테르(188℃), 2,6-디메틸-4-헵타논(169℃), 2-옥타논(173℃), 3-옥타논(168℃), 3-노나논(188℃), 5-노나논(187℃), 4-히드록시-4-메틸-2-펜타논(166℃), 2-메틸시클로헥사논(163℃), 3-메틸시클로헥사논(170℃), 4-메틸시클로헥사논(170℃), 2,6-디메틸시클로헥사논(175℃), 2,2,6-트리메틸시클로헥사논(179℃), 시클로햅타논(179℃), 헥실아세테이트(169℃), 아밀부티레이트(185℃), 이소프로필 락테이트(167℃), 부틸락테이트(186℃), 에틸-3-히드록시부티레이트(170℃), 에틸-3-에톡시프로피오네이트(170℃), 에틸-3-히드록시 부티레이트(180℃), 프로필-2-히드록시-프로피오네이트(169℃), 프로필렌글리콜디아세테이트(186℃), 프로필렌글리콜부틸에테르(170℃), 프로필렌글리콜 메틸에테르 프로피오네이트(160℃), 디에틸렌글리콜 디메틸 에테르(162℃), 디에틸렌글리콜 디메틸 에테르 아세테이트(165℃), 디프로필렌글리콜메틸에테르(188℃), 디프로필렌글리콜디메틸에테르(171℃), 에틸렌글리콜부틸에테르(171℃), 디에틸렌글리콜메틸에틸에테르(176℃), 디에틸렌글리콜메틸이소프로필에테르(179℃), 디에틸렌글리콜디에틸에테르(189℃), 부틸부티레이트(165℃), 에틸-3-에톡시프로피오네이트(170℃), 디에틸렌글리콜모노메틸에테르(194℃), 4-에틸시클로헥사논(193℃), 및 2-부톡시에틸아세테이트(192℃), 디에틸렌글리콜모노에틸에테르(202℃), 부티롤락톤(204℃), 헥실부틸레이트(205℃), 디에틸렌글리콜메틸에테르아세테이트(209℃), 디에틸렌글리콜부틸 메틸 에테르(212℃), 트리프로필글리콜디메틸 에테르(215℃), 트리에틸렌글리콜디메틸에테르(216℃), 디에틸렌글리콜에틸에테르아세테이트(217℃), 디에틸렌글리콜부틸에테르아세테이트(245℃), 3-에폭시-1,2-프로판디올 (222℃), 에틸-4-아세틸부티레이트(222℃), 디에틸렌글리콜 모노부틸에테르(231℃), 트리프로필글리콜메틸 에테르(242℃), 디에틸렌글리콜(245℃), 2-(2-부톡시에톡시)에틸아세테이트(245℃), 카테콜(245℃), 트리에틸렌글리콜 메틸에테르(249℃), 디에틸렌글리콜디부틸에테르(256℃), 트리에틸렌글리콜 에틸에테르(256℃), 디에틸렌글리콜모노헥틸에테르(260℃), 트리에틸렌글리콜 부틸 메틸 에테르(261℃), 트리에틸렌글리콜브틸에테르(271℃), 트리프로필글리콜(273℃) 및 테트라에틸렌글리콜디메틸에테르(276℃)로 이루어진 군에서 선택되는 1종 또는 2종 이상일 수 있고, 2종 이상인 것이 더욱 효과가 좋다.In one embodiment of the present application, the solvent may be used in consideration of solubility, pigment dispersibility, coating properties, and the like. For example, a mixture of methyl-3-methoxypropionate (144 占 폚), ethylene glycol methyl ether (125 占 폚), ethylene glycol ethyl ether (135 占 폚), ethylene glycol diethyl ether Propyleneglycol methyl ether acetate (146 占 폚), n-butyl acetate (125 占 폚), isobutyl acetate (116 占 폚), amyl acetate (140 占 폚), ethyl pyruvate 149 DEG C), isoamyl acetate (143 DEG C), butyl propionate (146 DEG C), isoamyl propionate (156 DEG C), ethyl butyrate (120 DEG C), propyl butyrate Methyl methoxyacetate (150 占 폚), methyl lactate (145 占 폚), ethyl lactate (154 占 폚), methyl-2-hydroxyisobutyrate (156 DEG C), 2-methoxyethyl acetate (145 DEG C), ethylene glycol methyl ether acetate (145 DEG C), 2-ethoxy Cyclohexanone (155 占 폚), 2-hexanone (127 占 폚), 3-hexanone (123 占 폚), 5 Heptanone (145 占 폚), 2-methyl-3-heptanone (159 占 폚) ), 1-methoxy-2-propanol (118 占 폚), ethyl-2-hydroxypropionate (154 占 폚), and ethyl-3-methoxypropionate Ethoxy-propanol (161 占 폚), di (3-methoxybutyl acetate) at 170 占 폚, 2-ethoxyethyl ether at 185 占 폚, (169 ° C), 2-octanone (173 ° C), 3-octanone (168 ° C), ethylene glycol dodecyl ether (169 ° C), dipropylene glycol methyl ether Methylene-2-pentanone (166 占 폚), 2-methylcyclohexanone (163 占 폚), 3-nonanoanone (188 占 폚) 3-methylcyclohexanone (170 DEG C), 4-methylcyclohexanone (170 DEG C), 2,6-dimethylcyclohexane (175 DEG C), 2,2,6-trimethylcyclohexanone (179 DEG C), cycloheptanone (179 DEG C), hexyl acetate (169 DEG C), amyl butyrate (185 DEG C), isopropyl lactate (167 DEG C) , Butyl lactate (186 ° C), ethyl-3-hydroxybutyrate (170 ° C), ethyl-3-ethoxypropionate Propylene glycol diethyl ether (162 DEG C), propylene glycol diisopropyl ether (170 DEG C), propylene glycol methyl ether propionate (160 DEG C), and diethylene glycol dimethyl ether ), Diethylene glycol dimethyl ether acetate (165 DEG C), dipropylene glycol methyl ether (188 DEG C), dipropylene glycol dimethyl ether (171 DEG C), ethylene glycol butyl ether (171 DEG C), diethylene glycol methyl ethyl ether ° C.), diethylene glycol methyl isopropyl ether (179 ° C.), diethylene glycol diethyl ether (189 ° C.) Butyl acrylate (194 占 폚), 4-ethylcyclohexanone (193 占 폚), and 2-butoxyethyl acetate Diethylene glycol monoethyl ether (202 占 폚), butyrolactone (204 占 폚), hexyl butyrate (205 占 폚), diethylene glycol methyl ether acetate (209 占 폚), diethylene glycol butyl methyl ether 212 ° C), tripropyl glycol dimethyl ether (215 ° C), triethylene glycol dimethyl ether (216 ° C), diethylene glycol ethyl ether acetate (217 ° C), diethylene glycol butyl ether acetate (245 ° C) Diethyleneglycol monobutyl ether (231 占 폚), tripropylglycol methyl ether (242 占 폚), diethylene glycol (245 占 폚), 1,2-propanediol (222 占 폚) (245 占 폚), catechol (245 占 폚), triethylene glycol methyl ether (2 (2-butoxyethoxy) ethyl acetate 49 DEG C), diethylene glycol dibutyl ether (256 DEG C), triethylene glycol ethyl ether (256 DEG C), diethylene glycol monohexyl ether (260 DEG C), triethylene glycol butyl methyl ether (261 DEG C) (271 ° C), tripropyl glycol (273 ° C) and tetraethylene glycol dimethyl ether (276 ° C), and more preferably two or more.
본 출원의 일 구현예에서, 상기 용매의 함량은 전체 조성물 100 중량부를 기준으로 40 내지 90 중량부로 포함되는 것이 효과가 좋다. In one embodiment of the present application, it is effective that the content of the solvent is 40 to 90 parts by weight based on 100 parts by weight of the total composition.
본 출원의 일 구현예에서, 상기 감광성 수지 조성물은 계면활성제, 분산제, 산화방지제, 자외선흡수제, 열중합방지제, 및 레벨링제로 이루어진 군에서 선택되는 1종 이상의 1차 첨가제를 더 포함할 수 있다. 이들은 해당 기술 분야에서 알려져 있는 물질이면 사용할 수 있다.In one embodiment of the present application, the photosensitive resin composition may further include at least one primary additive selected from the group consisting of a surfactant, a dispersant, an antioxidant, an ultraviolet absorber, a thermal polymerization inhibitor, and a leveling agent. These can be used as long as they are known in the art.
상기 계면 활성제로는 MCF 350SF, F-475, F-488, F-552(이하 DIC 사)등을 포함할 수 있으나, 이들에만 한정하는 것은 아니다.Examples of the surfactant include, but are not limited to, MCF 350SF, F-475, F-488 and F-552 (hereinafter referred to as DIC).
상기 분산제는 미리 안료를 표면 처리하는 형태로 안료에 내부 첨가시키는 방법 또는 안료에 외부 첨가시키는 방법으로 사용할 수 있다.The dispersing agent may be used either in a manner of internally adding the pigment to the pigment in the form of surface-treating the pigment in advance or in a method of externally adding the pigment.
상기 분산제로는 고분자형, 비이온성, 음이온성, 또는 양이온성 분산제를 사용할 수 있다. 이러한 분산제의 비제한적인 예로는 폴리알킬렌글리콜 및 이의 에스테르, 폴리옥시알킬렌 다가알콜, 에스테르알킬렌 옥사이드 부가물, 알코올알킬렌옥사이드 부가물, 설폰산 에스테르, 설폰산염, 카르복실산에스테르, 카르복실산염, 알킬아미드 알킬렌옥사이드 부가물, 알킬아민 등을 포함할 수 있으며, 이들 중에서 선택된 1종 또는 2종 이상의 혼합물을 사용할 수 있으나, 이들에만 한정하는 것은 아니다.As the dispersing agent, a polymer type, nonionic, anionic, or cationic dispersing agent may be used. Non-limiting examples of such dispersants include polyalkylene glycols and esters thereof, polyoxyalkylene polyhydric alcohols, ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, Alkyl amide alkylene oxide adducts, alkyl amines, and the like, and may be used alone or in admixture of two or more selected from them, but is not limited thereto.
상기 산화방지제의 비제한적인 예로는 2,2-티오비스(4-메틸-6-t-부틸페놀), 2,6-g,t-부틸페놀 등 중에서 선택된 1종 이상을 포함할 수 있으나, 이들에만 한정하는 것은 아니다.Non-limiting examples of the antioxidant may include at least one selected from 2,2-thiobis (4-methyl-6-t-butylphenol), 2,6-g, t- The present invention is not limited thereto.
상기 자외선흡수제의 비제한적인 예로는 2-(3-t-부틸-5-메틸-2-히드록시페닐)-5-클로로-벤조트리아졸, 알콕시 벤조페논 등 중에서 선택된 1종 이상을 포함할 수 있으나, 이들에만 한정하는 것은 아니다.Non-limiting examples of the ultraviolet absorber may include at least one selected from 2- (3-t-butyl-5-methyl-2-hydroxyphenyl) -5-chloro-benzotriazole, However, the present invention is not limited to these.
상기 열중합방지제의 비제한적인 예로는 히드로퀴논, p-메톡시페놀, 디-t-부틸-p-크레졸, 피로가롤, t-부틸카테콜, 벤조퀴논, 4,4-티오비스(3-메틸-6-t-부틸페놀), 2,2-메틸렌비스(4-메틸-6-t-부틸페놀), 2-머캅토이미다졸 등을 포함할 수 있으며, 이들 중에서 선택된 1종 또는 2종 이상의 혼합물을 포함할 수 있으나, 이들에만 한정하는 것은 아니다.Nonlimiting examples of the thermal polymerization inhibitor include hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol, t- butyl catechol, benzoquinone, 4,4- Methyl-6-t-butylphenol), 2,2-methylenebis (4-methyl-6-t-butylphenol), 2-mercaptoimidazole, and the like. But are not limited thereto.
또한, 상기 감광성 수지 조성물은 카본블랙 분산물, 기능성을 가지는 수지 바인더, 모노머, 감방사선성 화합물 및 그 밖의 첨가제로 이루어진 군에서 선택되는 1종 이상의 2차 첨가제를 더 포함할 수 있다. The photosensitive resin composition may further comprise at least one secondary additive selected from the group consisting of a carbon black dispersion, a functional resin binder, a monomer, a radiation-sensitive compound, and other additives.
본 출원의 일 구현예에서, 상기 첨가제의 함량은 전체 조성물 100 중량부를 기준으로 0 초과 내지 5 중량부 이하로 포함될 수 있으나, 이에 제한되지 않는다.In one embodiment of the present application, the content of the additive may be in the range of more than 0 to 5 parts by weight based on 100 parts by weight of the total composition, but is not limited thereto.
본 출원의 일 구현예는 상기 감광성 수지 조성물을 이용하여 형성되는 패턴을 제공한다. 구체적으로, 상기 패턴은 베젤 패턴일 수 있고, 더욱 구체적으로 디스플레이 패널에 형성되는 베젤 패턴일 수 있으며, 더욱 더 구체적으로 터치 패널에 형성되는 베젤 패턴일 수 있다.One embodiment of the present application provides a pattern formed using the photosensitive resin composition. Specifically, the pattern may be a bezel pattern, more specifically, a bezel pattern formed on a display panel, and more specifically, a bezel pattern formed on a touch panel.
상기 패턴은 층 두께가 구체적으로, 0.3 ~ 5 ㎛인 것이 효과가 좋고, 더욱 구체적으로 0.8 ~ 3 ㎛인 것이 효과가 좋다. 0.3 ㎛ ~ 5 ㎛ 이면 금속 배선의 단락을 방지하는 효과가 있다. It is effective that the pattern has a layer thickness of 0.3 to 5 mu m, more specifically 0.8 to 3 mu m. 0.3 占 퐉 to 5 占 퐉 has an effect of preventing short-circuiting of the metal wiring.
상기 감광성 수지 조성물을 이용하여 형성한 패턴은 가시광선 파장(380~780nm)에서 광학 밀도(optical density: OD)가 구체적으로 3 이상, 더욱 구체적으로 3.5 이상, 더욱 더 구체적으로 4 이상으로 나타나므로 양호한 직진성을 가지는 효과가 있다. Since the pattern formed using the photosensitive resin composition exhibits an optical density (OD) of 3 or more, more specifically 3.5 or more, and more specifically 4 or more at a visible light wavelength (380 to 780 nm) There is an effect of having straightness.
본 출원의 일 구현예는 상기 감광성 수지 조성물을 기판에 도포하는 단계; 및 상기 도포된 감광성 수지 조성물을 노광 및 현상하는 단계를 포함하는 방법으로 형성되는 패턴을 제공한다. One embodiment of the present application includes the steps of applying the photosensitive resin composition to a substrate; And a step of exposing and developing the applied photosensitive resin composition.
본 출원의 일 구현예는 상기 감광성 수지 조성물을 기판에 도포하는 단계; 및 상기 도포된 감광성 수지 조성물을 노광 및 현상하는 단계를 포함하는 방법으로 형성되는 패턴 제조방법을 제공한다. One embodiment of the present application includes the steps of applying the photosensitive resin composition to a substrate; And a step of exposing and developing the applied photosensitive resin composition.
상기 도포하는 단계에서 도포는 스프레이(spray)법, 롤(roll)코팅법, 회전(spin)코팅법, 바(bar)코팅법, 스핀((spin) 코팅법 또는 슬릿(slit)코팅법 등의 방법을 사용할 수 있다.In the coating step, the coating may be carried out by a spraying method, a roll coating method, a spin coating method, a bar coating method, a spin coating method or a slit coating method Method can be used.
상기 도포하는 단계 후에 프리베이크(pre-bake)에 의해 용매를 제거함으로써 막을 형성할 수 있다. 프리베이크의 조건은 예를 들어, 70~150℃에서 0.5~30분간 시행할 수 있다.After the applying step, the film can be formed by removing the solvent by pre-bake. The prebaking conditions can be, for example, from 70 to 150 DEG C for 0.5 to 30 minutes.
프리베이크 후에, 도포된 감광성층에 원하는 패턴을 갖는 포토마스크(photomask) 등의 방법을 통해 노광을 진행한 후, 노광된 감광성층을 적절한 현상액으로 현상함으로써 패턴이 제조된다.After the pre-baking, the exposed photosensitive layer is exposed to light through a method such as a photomask having a desired pattern, and then the exposed photosensitive layer is developed with an appropriate developer to form a pattern.
현상방법으로는 디핑(dipping)법, 샤워(shower)법, 분무(spray)법, 패들(paddle)법 등을 제한 없이 적용할 수 있다. 현상시간은 예를 들어, 30~180초 정도 일 수 있다. As the developing method, a dipping method, a shower method, a spraying method, a paddle method, or the like can be applied without limitation. The development time may be, for example, about 30 to 180 seconds.
상기 현상액으로는 알칼리 수용액으로서 수산화나트륨, 수산화칼륨, 규산나트륨, 메트규산나트륨, 암모니아 등의 무기 알칼리류; 에틸아민, N-프로필아민 등의 1급 아민류; 디에틸아민, 디-n-프로필아민 등의 2급 아민류; 트리메닐아민, 메틸디에틸아민, 디메틸에틸아민 등의 3급 아민류; 디메틸에탄올아민, 메틸디에탄올아민, 트리에탄올아민 등의 3급 알코올 아민류; 피롤, 피페리딘, n-메틸피페리딘, n-메틸피롤리딘, 1,8-디아자비시클로[5.4.0]-7-운데센, 1,5-디아자비시클로[4.3.0]-5-노넨 등의 환상 3급 아민류; 피리딘, 코리진, 루티딘, 퀴롤린 등의 방향족 3급 아민류; 또는 테트라메틸암모늄히드록시드, 테트라에틸암모늄히드록시드 등의 4급 암모늄염의 수용액 등을 사용할 수 있다.Examples of the developer include aqueous alkaline solutions such as sodium hydroxide, potassium hydroxide, sodium silicate, sodium metasilicate and ammonia; Primary amines such as ethylamine and N-propylamine; Secondary amines such as diethylamine and di-n-propylamine; Tertiary amines such as trimethylamine, methyldiethylamine and dimethylethylamine; Tertiary alcohol amines such as dimethylethanolamine, methyldiethanolamine and triethanolamine; Diazabicyclo [4.3.0] hept-2-ene, 1,1-diazabicyclo [5.4.0] Cyclic tertiary amines such as cyclohexane-5-nonene; Aromatic tertiary amines such as pyridine, coridine, lutidine and quinoline; Or an aqueous solution of a quaternary ammonium salt such as tetramethylammonium hydroxide or tetraethylammonium hydroxide.
현상 후 유수세정을 약 30~90초간 행하고 공기 또는 질소로 건조시킴으로써 패턴을 형성한다. 이 패턴을 핫플레이트(hot plate), 오븐(oven) 등의 가열장치를 이용하여 포스트베이크(post-bake)을 통해 완성된 베젤층을 얻을 수 있다.After development, washing with water is carried out for about 30 to 90 seconds, followed by drying with air or nitrogen to form a pattern. This pattern can be obtained through a post-bake by using a heating device such as a hot plate or an oven to obtain a completed bezel layer.
본 출원의 일 구현예는 상기 패턴을 포함하는 디스플레이 패널을 제공한다. 상기 디스플레이 패널은 구체적으로 상기 베젤 패턴을 포함하는 디스플레이 패널일 수 있고, 더욱 구체적으로 상기 베젤 패턴을 포함하는 터치 패널일 수 있다.One embodiment of the present application provides a display panel including the pattern. The display panel may be a display panel including the bezel pattern, more specifically, a touch panel including the bezel pattern.
이하, 하기의 실시예, 비교예 및 시험예를 통하여 본 출원을 보다 구체적으로 설명한다. 그러나 하기의 실시예, 비교예 및 시험예는 본 출원에 대한 이해를 돕기 위해 예시의 목적으로만 제공된 것일 뿐, 본 출원의 범주 및 범위가 이에 한정되지 않는다.
Hereinafter, the present application will be described in more detail through the following examples, comparative examples and test examples. However, the following examples, comparative examples and test examples are provided for illustrative purposes only in order to facilitate understanding of the present application, and the scope and scope of the present application are not limited thereto.
<실시예 1> ≪ Example 1 >
착색제 조성물로서 카본 분산액(타코마사K_1064 함량 25%) 600중량부, 상기 카본 분산액 중 밀링용 바인더로 카도계 바인더 수지(B1) 8 중량부, 알칼리 가용성 아크릴계 바인더 1로 벤질메타아크릴레이트/N-페닐말레이미드/스티렌/글리시딜 메타아크릴레이트가 부가된 메타아크릴산/ 메타아크릴산 {(몰비 38/7/7/21/27, Mw = 9000, 105 KOH ㎎/g), 고형분 함량 30%} 70 중량부, 아크릴계 바인더 2 로 벤질메타아크릴레이트/N-페닐말레이미드/스티렌/라우릴메타아크릴레이트/메타아크릴산{(몰비 40/7/8/14/31, Mw = 19000, 124 KOH ㎎/g), 고형분 함량 30%} 130 중량부, 다관능성 모노머로 디펜타에리트리톨 헥사 아크릴레이트 35중량부, 광중합 개시제로 N-1919(아데카사) 20 중량부, 밀착촉진제로 3-메타아크릴옥시프로필트리메톡시실란 5 중량부 및 레벨링제로 F-475(dic사) 1 중량부, 용매로 프로필렌글리콜모노메틸에테르아세테이트 530 중량부, 3-메톡시부틸아세테이트 100중량부를 혼합하였다. 600 parts by weight of a carbon dispersion (25% by weight Tacoma K. 1064) as a colorant composition, 8 parts by weight of a cadmium-based binder resin (B1) as a milling binder in the above carbon dispersion and 1 part by weight of a benzylmethacrylate / Methacrylic acid / methacrylic acid (molar ratio 38/7/7/21/27, Mw = 9000, 105 KOH mg / g) having a maleimide / styrene / glycidyl methacrylate added thereto, and a solid content of 30% (Mw = 19000, 124 KOH mg / g) as the acrylic binder 2, benzyl methacrylate / N-phenylmaleimide / styrene / laurylmethacrylate / methacrylic acid (molar ratio 40/7/8/14/31, , Solid content 30%}, 35 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer, 20 parts by weight of N-1919 (Adeca) as a photopolymerization initiator, 3 parts by weight of 3-methacryloxypropyltrimethoxysilane 5 parts by weight of ethoxysilane and 1 part by weight of F-475 (dic Co.) as a leveling agent, Propylene glycol monomethyl ether acetate were mixed with 530 parts by weight of 3-methoxybutyl acetate to 100 parts by weight.
그 다음, 상기 혼합물을 5시간 동안 교반하여 감광성 수지 조성물을 제조하였다.Then, the mixture was stirred for 5 hours to prepare a photosensitive resin composition.
상기와 같이 제조한 감광성 수지 조성물 용액을 유리에 스핀코팅을 이용하여 코팅한 후, 약 100 ℃로 2분 동안 전열 처리하여 약 1.44 ㎛ 두께의 도막을 형성하였다. 그 다음, 실온에서 냉각한 후, 포토마스크를 이용하여 고압수은 램프 하에서 100 mJ/㎠의 에너지로 노광시켰다. 상기 노광된 기판을 25 ℃의 온도로 0.04 %의 KOH 수용액에서 스프레이 방식으로 현상한 후, 순수로 세정하고 건조시켜 230 ℃의 컨벡션 오븐에서 20 분간 포스트베이크(post-bake)하였다. The photosensitive resin composition solution thus prepared was coated on glass by spin coating and then heat treated at about 100 캜 for 2 minutes to form a coating film having a thickness of about 1.44 탆. Then, after cooling at room temperature, exposure was performed at a energy of 100 mJ / cm 2 under a high-pressure mercury lamp using a photomask. The exposed substrate was developed in a 0.04% aqueous solution of KOH at a temperature of 25 ° C by a spray method, washed with pure water, and dried, post-baked in a convection oven at 230 ° C for 20 minutes.
상기와 같이 수득한 필름은 각 공정에 따른 표면 결점이 전혀 없는 깨끗한 도막으로 얻어졌으며, 막 두께가 1.31㎛, OD 는 5.0으로 양호한 직진성을 가지는 베젤 패턴막을 확보 할 수 있었다.
The obtained film was obtained as a clean coating film having no surface defects according to each process, and a film thickness of 1.31 탆 and an OD of 5.0 was obtained, and a bezel pattern film having good linearity could be obtained.
<실시예 2> ≪ Example 2 >
카본 분산액(토쿠시키사BK_8132 함량 20%) 600중량부, 상기 카본 분산액 중 밀링용 바인더로 카도계 바인더 수지(X-15) 3 중량부, 알칼리 가용성 아크릴계 바인더 1로 벤질메타아크릴레이트/N-페닐말레이미드/스티렌/글리시딜 메타아크릴레이트가 부가된 메타아크릴산/ 메타아크릴산 {(몰비 38/7/7/21/27, Mw = 9000, 105 KOH ㎎/g), 고형분 함량 30%} 70 중량부, 아크릴계 바인더 2 로 벤질메타아크릴레이트/N-페닐말레이미드/스티렌/라우릴메타아크릴레이트/메타아크릴산{(몰비40/7/8/14/31, Mw = 19000, 124 KOH ㎎/g), 고형분 함량 30%} 130 중량부, 다관능성 모노머로 디펜타에리트리톨 헥사 아크릴레이트 35중량부, 광중합 개시제로 N-1919(아데카사) 20 중량부, 밀착촉진제로 3-메타아크릴옥시프로필트리메톡시실란 5 중량부 및 레벨링제로 F-475(dic사) 1 중량부, 용매로 프로필렌글리콜모노메틸에테르아세테이트 530 중량부, 3-메톡시부틸아세테이트 100중량부를 혼합하였다. 600 parts by weight of a carbon dispersion (TOKUSHIKISA BK_8132 content 20%), 3 parts by weight of a cadmium-based binder resin (X-15) as a milling binder in the carbon dispersion, 3 parts by weight of benzyl methacrylate / Methacrylic acid / methacrylic acid (molar ratio 38/7/7/21/27, Mw = 9000, 105 KOH mg / g) having a maleimide / styrene / glycidyl methacrylate added thereto, and a solid content of 30% (Mw = 19000, 124 KOH mg / g) as the acrylic binder 2, benzyl methacrylate / N-phenylmaleimide / styrene / laurylmethacrylate / methacrylic acid (molar ratio 40/7/8/14/31, , Solid content 30%}, 35 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer, 20 parts by weight of N-1919 (Adeca) as a photopolymerization initiator, 3 parts by weight of 3-methacryloxypropyltrimethoxysilane 5 parts by weight of ethoxy silane and 1 part by weight of F-475 (dic) as leveling agent, propylene glycol moiety Ether acetate were mixed with 530 parts by weight of 3-methoxybutyl acetate to 100 parts by weight.
그 다음, 상기 혼합물을 5시간 동안 교반하여 감광성 수지 조성물을 제조하였다.Then, the mixture was stirred for 5 hours to prepare a photosensitive resin composition.
상기와 같이 제조한 감광성 수지 조성물 용액을 유리에 스핀코팅을 이용하여 코팅한 후, 약 100 ℃로 2분 동안 전열 처리하여 약 1.44 ㎛ 두께의 도막을 형성하였다. 그 다음, 실온에서 냉각한 후, 포토마스크를 이용하여 고압수은 램프 하에서 100 mJ/㎠의 에너지로 노광시켰다. 상기 노광된 기판을 25 ℃의 온도로 0.04 %의 KOH 수용액에서 스프레이 방식으로 현상한 후, 순수로 세정하고 건조시켜 230 ℃의 컨벡션 오븐에서 20 분간 포스트베이크(post-bake)하였다. The photosensitive resin composition solution thus prepared was coated on glass by spin coating and then heat treated at about 100 캜 for 2 minutes to form a coating film having a thickness of about 1.44 탆. Then, after cooling at room temperature, exposure was performed at a energy of 100 mJ / cm 2 under a high-pressure mercury lamp using a photomask. The exposed substrate was developed in a 0.04% aqueous solution of KOH at a temperature of 25 ° C by a spray method, washed with pure water, and dried, post-baked in a convection oven at 230 ° C for 20 minutes.
상기와 같이 수득한 필름은 각 공정에 따른 표면 결점이 전혀 없는 깨끗한 도막으로 얻어졌으며, 막 두께가 1.31 ㎛, OD 는 5.0으로 양호한 직진성을 가지는 베젤 패턴막을 확보 할 수 있었다.
The thus obtained film was obtained as a clean coating film having no surface defects according to each step, and a bezel pattern film having a film thickness of 1.31 탆 and an OD of 5.0 was obtained with good linearity.
<실시예 3> ≪ Example 3 >
카본 분산액(토쿠시키사BK_4622, 카본 함량 20%) 600중량부, 상기 카본 분산액 중 밀링용 바인더로 카도계 바인더 수지(X-15) 1.5 중량부 및 아크릴계 바인더 수지(T-4) 1.5중량부를 혼합하였고, 알칼리 가용성 아크릴계 바인더 1로 벤질메타아크릴레이트/N-페닐말레이미드/스티렌/글리시딜 메타아크릴레이트가 부가된 메타아크릴산/ 메타아크릴산 {(몰비 38/7/7/21/27, Mw = 9000, 105 KOH ㎎/g), 고형분 함량 30%} 70 중량부, 아크릴계 바인더 2 로 벤질메타아크릴레이트/N-페닐말레이미드/스티렌/라우릴메타아크릴레이트/메타아크릴산{(몰비 40/7/8/14/31, Mw = 19000, 124 KOH ㎎/g), 고형분 함량 30%} 130 중량부, 다관능성 모노머로 디펜타에리트리톨 헥사 아크릴레이트 35중량부, 광중합 개시제로 N-1919(아데카사) 20 중량부, 밀착촉진제로 3-메타아크릴옥시프로필트리메톡시실란 5 중량부 및 레벨링제로 F-475(dic사) 1 중량부, 용매로 프로필렌글리콜모노메틸에테르아세테이트 530 중량부, 3-메톡시부틸아세테이트 100중량부를 혼합하였다. 600 parts by weight of a carbon dispersion (TOKUSHIKISA BK_4622, 20% of carbon content), 1.5 parts by weight of a carcass binder resin (X-15) as a milling binder and 1.5 parts by weight of an acrylic binder resin (T-4) Methacrylic acid / methacrylic acid {(molar ratio 38/7/7/21/27, Mw = 1/2) to which benzyl methacrylate / N-phenylmaleimide / styrene / glycidyl methacrylate was added as alkali soluble acrylic binder 1, (Molar ratio of 40/7 to 9/100, KOH mg / g) and 70% by weight of a solid content of 30%}, benzyl methacrylate / N-phenylmaleimide / styrene / laurylmethacrylate / methacrylic acid { , 35 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer, N-1919 (trade name: Adeka Co., Ltd.) as a photopolymerization initiator, ), 20 parts by weight of 3-methacryloxypropyltrimethoxysilane as an adhesion promoter, 5 parts by weight And 1 part by weight of F-475 (dic) as a leveling agent, 530 parts by weight of propylene glycol monomethyl ether acetate as a solvent and 100 parts by weight of 3-methoxybutyl acetate were mixed.
그 다음, 상기 혼합물을 5시간 동안 교반하여 감광성 수지 조성물을 제조하였다.Then, the mixture was stirred for 5 hours to prepare a photosensitive resin composition.
상기와 같이 제조한 감광성 수지 조성물 용액을 유리에 스핀코팅을 이용코팅한 후, 약 100℃로 2분 동안 전열 처리하여 약 1.44 ㎛ 두께의 도막을 형성하였다. 그 다음, 실온에서 냉각한 후, 포토마스크를 이용하여 고압수은 램프 하에서 100 mJ/㎠의 에너지로 노광시켰다. 상기 노광된 기판을 25℃의 온도로 0.04 %의 KOH 수용액에서 스프레이 방식으로 현상한 후, 순수로 세정하고 건조시켜 230℃의 컨벡션 오븐에서 20 분간 포스트베이크(post-bake)하였다. The photosensitive resin composition solution prepared above was coated on glass by spin coating and then heat treated at about 100 캜 for 2 minutes to form a coating film having a thickness of about 1.44 탆. Then, after cooling at room temperature, exposure was performed at a energy of 100 mJ / cm 2 under a high-pressure mercury lamp using a photomask. The exposed substrate was developed in a 0.04% aqueous solution of KOH at a temperature of 25 ° C by a spray method, washed with pure water, and dried, post-baked in a convection oven at 230 ° C for 20 minutes.
상기와 같이 수득한 필름은 각 공정에 따른 표면 결점이 전혀 없는 깨끗한 도막으로 얻어졌으며, 막 두께가 1.31㎛, OD 는 5.0으로 양호한 직진성을 가지는 베젤 패턴막을 확보 할 수 있었다.
The obtained film was obtained as a clean coating film having no surface defects according to each process, and a film thickness of 1.31 탆 and an OD of 5.0 was obtained, and a bezel pattern film having good linearity could be obtained.
<비교예 1> ≪ Comparative Example 1 &
카본 분산액(토쿠시키사BK_8115, 카본 함량 20%) 600중량부, 상기 카본 분산액 중 밀링용 바인더로 아크릴계 바인더 수지 3 중량부, 알칼리 가용성 아크릴계 바인더로 벤질메타아크릴레이트/N-페닐말레이미드/스티렌/글리시딜 메타아크릴레이트가 부가된 메타아크릴산/ 메타아크릴산 {(몰비 38/7/7/21/27, Mw = 9000, 105 KOH ㎎/g), 고형분 함량 30%} 200중량부, 다관능성 모노머로 디펜타에리트리톨 헥사 아크릴레이트 35 중량부, 광중합 개시제로 N-1919(아데카사) 20 중량부, 밀착촉진제로 3-메타아크릴옥시프로필트리메톡시실란 5 중량부 및 레벨링제로 F-475(dic사) 1 중량부, 용매로 프로필렌글리콜모노메틸에테르아세테이트 530 중량부, 3-메톡시부틸아세테이트 100중량부를 혼합하였다. 600 parts by weight of a carbon dispersion (TOKUSHIKISA BK_8115, carbon content 20%), 3 parts by weight of an acrylic binder resin as a milling binder in the above carbon dispersion, 1 part by weight of benzyl methacrylate / N-phenylmaleimide / styrene / , 200 parts by weight of a methacrylic acid / methacrylic acid (mole ratio 38/7/7/21/27, Mw = 9000, 105 KOH mg / g) having a glycidyl methacrylate added thereto, a solid content 30% 35 parts by weight of dipentaerythritol hexaacrylate, 20 parts by weight of N-1919 (Adeka Corp.) as a photopolymerization initiator, 5 parts by weight of 3-methacryloxypropyltrimethoxysilane as an adhesion promoter, and F-475 1 part by weight), 530 parts by weight of propylene glycol monomethyl ether acetate as a solvent and 100 parts by weight of 3-methoxybutyl acetate were mixed.
그 다음, 상기 혼합물을 5시간 동안 교반하여 감광성 수지 조성물을 제조하였다.Then, the mixture was stirred for 5 hours to prepare a photosensitive resin composition.
상기와 같이 제조한 감광성 수지 조성물 용액을 실시예 1과 동일한 방법으로 공정을 진행하였다. 이때 수득한 필름은 각 공정에 따른 표면 결점이 전혀 없는 1.3㎛의 막 두께를 가지는 깨끗한 도막을 얻을 수 있었으나, 현상마진이 적고 후공정에서 금속배선 단락을 유발하는 역 테이퍼(T자형)의 테이퍼가 얻어져 베젤 패턴막으로서 사용이 불가하였다.The photosensitive resin composition solution thus prepared was processed in the same manner as in Example 1. At this time, a clear coating film having a film thickness of 1.3 탆 was obtained which had no surface defects according to each process. However, a reverse taper (T-shaped) taper which causes a short development margin and short- And it was impossible to use it as a bezel pattern film.
따라서, 본 출원의 감광성 수지 조성물을 터치 패널의 커버 글래스에 직접 적용하여 베젤 패턴을 형성하였을 때, 우수한 터치 패널을 제조할 수 있다. 또한, 구성 성분과 조성비율을 최적화한 본 출원의 감광성 수지 조성물을 이용하여 베젤 패턴을 형성하면, 고온 공정에서의 저항값 변화를 최소화하여 더욱 우수한 터치 패널을 제조할 수 있다.
Therefore, when the photosensitive resin composition of the present application is directly applied to a cover glass of a touch panel to form a bezel pattern, an excellent touch panel can be manufactured. Further, when the bezel pattern is formed by using the photosensitive resin composition of the present invention in which the composition and the composition ratio are optimized, a change in resistance value in a high-temperature process can be minimized and a more excellent touch panel can be manufactured.
<< 실험예Experimental Example > 내열성 저하 실험> Heat resistance test
실시예 1 ~ 3 및 비교예 1에서 얻어진 베젤 패턴이 형성된 기판을 추가로 250℃에서 1시간, 300℃에서 1시간 열처리 후 저항값 변화를 측정하여 하기 표 1에 나타내었다.The substrate having the bezel patterns obtained in Examples 1 to 3 and Comparative Example 1 was further heat-treated at 250 ° C for 1 hour and at 300 ° C for 1 hour, and the change in resistance value was measured.
T-4X-15
T-4
03.0
0
T-4X-15
T-4
1.51.5
1.5
T-4X-15
T-4
3.00
3.0
본 출원의 감광성 수지 조성물을 이용하여 패턴을 형성하였을 경우, 300℃ 이상의 고온에서 열처리한 경우 면저항이 1.0×106 (Ω/sq)을 초과할 수 있고, 구체적으로 1.0×107 (Ω/sq) 이상일 수 있다. 고온에서 열처리한 후 면저항이 높을수록 고온 공정에서의 저항값이 저하되지 않는 것이므로 내열성이 우수하다. When the pattern is formed using the photosensitive resin composition of the present application, the sheet resistance may exceed 1.0 × 10 6 (Ω / sq) when subjected to a heat treatment at a high temperature of 300 ° C. or higher, specifically 1.0 × 10 7 ) Or more. The higher the sheet resistance after the heat treatment at a high temperature, the less the resistance value at the high temperature process is, so the heat resistance is excellent.
상기 표 1의 결과로부터, 본 출원에 따른 감광성 수지 조성물을 이용하여 고온 공정에서 저항값 저하가 최소화되는 조성물을 제조할 수 있음을 알 수 있다. 이 효과는 착색제 조성물에 사용되는 밀링 기능을 하는 바인더의 종류 및 조성에 따른 것이다. From the results shown in Table 1, it can be seen that a composition can be produced which minimizes a decrease in resistance value in a high-temperature process using the photosensitive resin composition according to the present application. This effect depends on the type and composition of the milling binder used in the colorant composition.
특히, 본 출원에서 실시예 1과 실시예 2의 B1과 X-15 바인더와 같은 카도계 바인더가 저항값 저하를 최소화 할 수 있으며, 비교예 1의 T-4와 같은 아크릴계 바인더 수지는 저항값 저하를 막지 못하는 것으로 증명되었다.Particularly, in the present application, a cadmium binder such as B1 and X-15 binder of Example 1 and Example 2 can minimize a decrease in resistance value, and the acrylic binder resin such as T-4 of Comparative Example 1 has a lowered resistance value Of the population.
본 출원이 속한 분야에서 통상의 지식을 가진 자라면 상기 내용을 바탕으로 본 출원의 범주 내에서 다양한 응용 및 변형을 행하는 것이 가능할 것이다.It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
이상으로 본 출원의 특정한 부분을 상세히 기술하였는 바, 당업계의 통상의 지식을 가진 자에게 있어서 이러한 구체적인 기술은 단지 바람직한 구현예일 뿐이며, 이에 본 출원의 범위가 제한되는 것이 아닌 점은 명백하다. 따라서, 본 출원의 실질적인 범위는 첨부된 청구항과 그의 등가물에 의하여 정의된다고 할 것이다.Having described specific portions of the present application in detail, those skilled in the art will appreciate that these specific embodiments are merely preferred embodiments and that the scope of the present application is not limited thereto. Accordingly, the actual scope of the present application will be defined by the appended claims and their equivalents.
Claims (29)
를 포함하는 착색제 조성물을 포함하며,
패턴 형성시에 300℃ 이상의 고온에서 열처리한 경우 면저항이 1.0×107 (Ω/sq) 이상인 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.coloring agent; And cadmium binder
≪ / RTI >
When the pattern is formed at a high temperature of 300 ° C or higher, the sheet resistance is 1.0 × 10 7 (Ω / sq) Or more of the photosensitive resin composition.
상기 카도계 바인더는 하기 화학식 1로 표시되는 반복 단위를 포함하는 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴:
[화학식 1]
Rx는 5원 고리의 카르복실산 무수물 또는 디이소시아네이트가 반응하여 형성된 구조이고,
Ry는 수소, 아크릴로일 및 메타아크릴로일로 이루어진 군에서 선택되며,
R1 내지 R3은 각각 독립적으로, 수소; 할로겐기; 치환 또는 비치환된 탄소수 1 내지 5의 알킬기; 치환 또는 비치환된 탄소수 1 내지 5의 알콕시기; 및 치환 또는 비치환된 탄소수 2 내지 5의 알케닐기; 로 이루어진 군에서 선택되고,
R4 내지 R7은 각각 독립적으로, 치환 또는 비치환된 탄소수 1 내지 5의 알킬렌기; 치환 또는 비치환된 탄소수 1 내지 5의 알콕실렌기; 및 치환 또는 비치환된 탄소수 2 내지 5의 알케닐렌기; 로 이루어진 군에서 선택되며,
l은 1~4의 정수이고,
m은 1~8의 정수이며,
n은 화학식 1로 표시되는 것이 반복단위임을 나타낸다.The method according to claim 1,
Wherein the cadmium binder comprises a repeating unit represented by the following formula (1): < EMI ID =
[Chemical Formula 1]
Rx is a structure formed by reacting a carboxylic acid anhydride or a diisocyanate of a 5-membered ring,
Ry is selected from the group consisting of hydrogen, acryloyl and methacryloyl,
R 1 to R 3 are each independently hydrogen; A halogen group; A substituted or unsubstituted alkyl group having 1 to 5 carbon atoms; A substituted or unsubstituted C1-C5 alkoxy group; And a substituted or unsubstituted C2 to C5 alkenyl group; , ≪ / RTI >
R 4 to R 7 each independently represent a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms; A substituted or unsubstituted alkoxysilyl group having 1 to 5 carbon atoms; And a substituted or unsubstituted C2-C5 alkenylene group; , ≪ / RTI >
l is an integer of 1 to 4,
m is an integer of 1 to 8,
n represents a repeating unit represented by the formula (1).
상기 카도계 바인더는 산가가 10 내지 200 KOH mg/g 이고, 중량평균분자량이 1,000 내지 30,000인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method according to claim 1,
Wherein the cationic binder has an acid value of 10 to 200 KOH mg / g and a weight average molecular weight of 1,000 to 30,000.
상기 카도계 바인더의 함량은 착색제 조성물 100 중량부를 기준으로 0.1 ~ 10 중량부인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴. The method according to claim 1,
Wherein the content of the cationic binder is 0.1 to 10 parts by weight based on 100 parts by weight of the colorant composition.
상기 카도계 바인더의 함량은 착색제 조성물 중의 바인더 100 중량부를 기준으로 50 ~ 100 중량부인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method according to claim 1,
Wherein the content of the cadmium-based binder is 50 to 100 parts by weight based on 100 parts by weight of the binder in the colorant composition.
상기 착색제는 카본 블랙; 또는 상기 카본 블랙과 유기블랙안료의 혼합물인 흑색 안료를 포함하는 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method according to claim 1,
The colorant may be carbon black; Or a black pigment which is a mixture of the carbon black and the organic black pigment. The bezel pattern formed by using the photosensitive resin composition.
상기 카본블랙은 표면저항 값이 1011Ωcm 이상인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method of claim 6,
Wherein the carbon black has a surface resistance value of 10 < 11 > OMEGA cm or more.
상기 카본 블랙의 함량은 착색제 조성물 100 중량부를 기준으로 5 내지 30 중량부인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method of claim 6,
Wherein the content of the carbon black is 5 to 30 parts by weight based on 100 parts by weight of the colorant composition.
상기 착색제 조성물의 함량은 감광성 수지 조성물 100 중량부를 기준으로 30 내지 60 중량부인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method according to claim 1,
Wherein the content of the colorant composition is 30 to 60 parts by weight based on 100 parts by weight of the photosensitive resin composition.
상기 감광성 수지 조성물은, 알칼리 가용성 바인더; 가교성 화합물; 광중합 개시제; 및 용매로 이루어진 군에서 1종 또는 2종 이상을 더 포함하는 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method according to claim 1,
The photosensitive resin composition comprises an alkali-soluble binder; A crosslinkable compound; A photopolymerization initiator; And a solvent. The bezel pattern is formed by using the photosensitive resin composition.
상기 알칼리 가용성 바인더의 함량은 감광성 수지 조성물 100 중량부를 기준으로 1 내지 20 중량부인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method of claim 10,
Wherein the content of the alkali-soluble binder is 1 to 20 parts by weight based on 100 parts by weight of the photosensitive resin composition.
상기 가교성 화합물의 함량은 감광성 수지 조성물 100 중량부를 기준으로 1 내지 10 중량부인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method of claim 10,
Wherein the content of the crosslinkable compound is 1 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition.
상기 광중합 개시제의 함량은 감광성 수지 조성물 100 중량부를 기준으로 0.1 내지 10 중량부인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method of claim 10,
Wherein the content of the photopolymerization initiator is 0.1 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition.
상기 용매의 함량은 감광성 수지 조성물 100 중량부를 기준으로 40 내지 90 중량부인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method of claim 10,
Wherein the content of the solvent is 40 to 90 parts by weight based on 100 parts by weight of the photosensitive resin composition.
상기 알칼리 가용성 바인더는 아크릴계 바인더 및 카도계 바인더 중에서 1종 이상을 포함하는 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method of claim 10,
Wherein the alkali-soluble binder comprises at least one of an acryl-based binder and a cadmium-based binder.
상기 감광성 수지 조성물은 광가교증감제 또는 경화촉진제를 더 포함하는 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method of claim 10,
Wherein the photosensitive resin composition further comprises a photo-crosslinking sensitizer or a curing accelerator.
상기 광가교증감제 또는 경화촉진제의 함량은 광중합 개시제 100 중량부를 기준으로 0.01 내지 10 중량부인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.18. The method of claim 16,
Wherein the content of the photo-crosslinking sensitizer or the curing accelerator is 0.01 to 10 parts by weight based on 100 parts by weight of the photopolymerization initiator.
상기 감광성 수지 조성물은 밀착촉진제를 더 포함하는 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method of claim 10,
Wherein the photosensitive resin composition further comprises an adhesion promoter.
상기 밀착촉진제의 함량은 감광성 수지 조성물 100 중량부를 기준으로 0.1 내지 1 중량부인 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.19. The method of claim 18,
Wherein the content of the adhesion promoter is 0.1 to 1 part by weight based on 100 parts by weight of the photosensitive resin composition.
상기 감광성 수지 조성물은, 계면활성제, 분산제, 산화방지제, 자외선흡수제, 열중합방지제, 레벨링제, 카본블랙 분산물, 기능성을 가지는 수지 바인더, 모노머 및 감방사선성 화합물로 이루어진 군에서 선택되는 1종 이상의 첨가제를 더 포함하는 것을 특징으로 하는 감광성 수지 조성물을 이용하여 형성된 베젤 패턴.The method according to claim 1,
The photosensitive resin composition may contain one or more kinds selected from the group consisting of a surfactant, a dispersant, an antioxidant, an ultraviolet absorber, a thermal polymerization inhibitor, a leveling agent, a carbon black dispersion, a functional resin binder, a monomer, and a radiation- The bezel pattern formed by using the photosensitive resin composition further comprising an additive.
상기 패턴은, 감광성 수지 조성물을 기판에 도포하는 단계; 및
상기 도포된 감광성 수지 조성물을 노광 및 현상하는 단계를 포함하는 방법으로 형성되는 것을 특징으로 하는 베젤 패턴.The method according to claim 1,
The pattern may include a step of applying a photosensitive resin composition to a substrate; And
And exposing and developing the applied photosensitive resin composition to form a bezel pattern.
상기 패턴은 0.3 내지 5㎛의 층 두께를 가지고, 광학 밀도(OD)가 3 이상인 것을 특징으로 하는 베젤 패턴.The method according to claim 1,
Wherein the pattern has a layer thickness of 0.3 to 5 占 퐉 and an optical density (OD) of 3 or more.
상기 디스플레이 패널은 터치 패널인 것을 특징으로 하는 디스플레이 패널. 29. The method of claim 28,
Wherein the display panel is a touch panel.
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