KR101694408B1 - Organic electroluminescent device and Method of fabricating the same - Google Patents

Abstract

The present invention provides a display device, comprising: a substrate on which a display area and a non-display area around the display area are defined; And a second portion having a second thickness smaller than the first thickness with respect to the remaining portion of the non-display region, wherein the first portion has a first thickness with respect to the entire display region and the non- A barrier layer disposed on the substrate; An organic light emitting diode (OLED) disposed on the barrier layer and corresponding to the display region; A first film covering the organic light emitting diode and the barrier layer and contacting the organic light emitting diode and made of an inorganic insulating material; a second film disposed on the first film and made of an organic insulating material; 2 film and an encapsulation film comprising a third film made of an inorganic insulating material, wherein the first and third films have discontinuous portions at the boundaries of the first and second portions An organic electroluminescent device is provided.

Description

[0001] The present invention relates to an organic electroluminescent device and a method of fabricating the same,

The present invention relates to an organic electroluminescent device, and more particularly, to an organic electroluminescent device having a small bezel area and a method of manufacturing the same.

Until recently, CRT (cathode ray tube) was mainly used as a display device. However, in recent years, flat panel display devices such as a plasma display panel (PDP), a liquid crystal display device (LCD), and an organic electroluminescent device (OELD) Have been widely studied and used.

Of the flat panel display devices as described above, the organic electroluminescent device is a self-luminous device and can be lightweight and thin because it does not require a backlight used in a liquid crystal display device which is a non-light emitting device.

In addition, it has a better viewing angle and contrast ratio than liquid crystal display devices, is advantageous in terms of power consumption, can be driven by DC low voltage, has a fast response speed, is resistant to external impacts due to its solid internal components, It has advantages.

Particularly, since the manufacturing process is simple, it is advantageous in that the production cost can be saved more than the conventional liquid crystal display device.

Organic electroluminescent devices having such characteristics are classified into a passive matrix type and an active matrix type. Active matrix type organic electroluminescent devices capable of realizing a high resolution and a large screen are actively studied .

1 is a schematic cross-sectional view of a conventional active matrix type organic electroluminescent device.

1, the organic electroluminescent device 10 includes a first substrate 1 and a second substrate 2 facing the first substrate 1, and the first and second substrates 1 and 2 Are segregated from each other so that the marginal portions thereof are sealed together through a seal pattern (20).

In more detail, a switching thin film transistor and a driving thin film transistor DTr are formed in each pixel region on the first substrate 1, a first electrode 3 connected to each driving thin film transistor DTr, An organic light emitting layer 5 for emitting light of a specific color on the first electrode 3 and a second electrode 7 on the organic light emitting layer 5. The first and second electrodes 3 and 7 and the organic light emitting layer 5 formed therebetween form an organic light emitting diode.

The organic light emitting layer 5 displays red, green, and blue colors. As a general method, separate organic materials 5a, 5b, and 5c emitting red, green, and blue light are patterned for each pixel.

In this case, when the first electrode 3 is transparent and the second electrode 7 is opaque, the light emitted from the organic light emitting layer 5 passes through the first electrode 3 ), Which is referred to as a bottom emission type. Alternatively, when the first electrode 3 is opaque and the second electrode 7 is transparent, light emitted from the organic light emitting layer 5 may be transmitted through the second electrode 7 to the second substrate 2 ), Which is referred to as an upper emission type.

On the other hand, on the inner surface of the second substrate 2, a moisture absorbent 13 for blocking moisture from the outside is formed.

Since the general organic electroluminescent device 10 is encapsulated by using the second substrate 2 made of glass or the like, the overall thickness of the organic electroluminescent device 10 is increased. In addition, the first substrate 1 and the second substrate 2 are bonded together by the seal pattern 20, which makes it easy to infiltrate with external moisture or gas.

In order to prevent such a problem, an organic electroluminescent device to which a film type of encapsulation is applied has been proposed.

2 is a schematic cross-sectional view of a portion of an organic electroluminescent device having a conventional film-type encapsulation structure.

As shown in the figure, the organic EL device 30 having a conventional film-type encapsulation structure includes a display area DA for displaying an image, a non-display area for surrounding the display area, (EN) An encapsulation film for encapsulation of an organic light emitting diode (E) is provided on a substrate (31) (40). The encapsulation film 40 covers not only the display area DA but also a part of the non-display area NDA to prevent moisture penetration into the display area DA.

1, the organic light emitting diode E includes an organic light emitting layer 5 that emits light of a specific color on the first electrode 3 and the first electrode 3, an organic light emitting layer 5 A driving thin film transistor DTr and a switching thin film transistor (not shown) for controlling the organic electroluminescent diode E are disposed.

The encapsulation film 40 includes a first film 41, a third film 43 and a fifth film 45 made of an inorganic insulating material, a second film 42 made of an organic insulating material, And a fourth film (44). The first film 41 is in contact with the organic electroluminescent diode E and the second film 42 is positioned between the first film 41 and the third film 43. The fourth film 44 is located on the third film 43 and is located between the third film 43 and the fifth film 45.

That is, the encapsulation film 40 has the first film 41 and the fifth film 45 made of an inorganic insulating material as the lowest and upper layers, respectively, and the second film 42 to the fourth film 45 (44) is laminated between the first film (41) and the fifth film (45). Wherein the second film 42 and the fourth film 44 are made of an organic insulating material and the third film 43 is made of an inorganic insulating material and the second film 42 and the fourth film 44 44). In other words, the encapsulation film 40 is formed by alternately laminating an inorganic insulating material film and an organic insulating material film, and the lowermost layer and the uppermost layer are made of an inorganic insulating material.

The inorganic insulating material film serves to shield moisture and the like, and the organic insulating material film does not have a function of blocking moisture, but functions as an impact mitigation for the inorganic insulating material film. Therefore, the fifth film 45 made of an inorganic insulating material is positioned on the uppermost layer of the encapsulation film 40 to block moisture from the outside, and a first film 41 made of an inorganic insulating material is formed on the organic light- (E) to minimize the damage of the organic electroluminescent diode (E) due to moisture. The ends of the second and fourth films 42 and 44 made of an organic insulating material are covered with the first film 41, the third film 43 and the fifth film 45.

The organic electroluminescent device 30 is obtained by scribing the substrate 31 as shown in FIGS. 3A and 3B.

3A, when scribing is performed on the first film 41, the third film 43, and the fifth film 45 made of an inorganic insulating material, cracks generated in the scribing process As the inorganic insulating material film rides on it, a problem arises in blocking the moisture caused by the inorganic insulating material film. That is, external moisture causes damages to the organic electroluminescent diode (E), which causes problems such as a reduction in the life of the organic electroluminescent element (30).

In order to prevent such a problem, as shown in Fig. 3B, scribing is performed at the outsides of the ends of the first film 41, the third film 43 and the fifth film 45 made of an inorganic insulating material In this case, the size of the bezel (BZ) is increased.

Particularly, when the forming error of the inorganic insulating material film is generated, the size of the bezel BZ is further increased. 4, which is a schematic plan view of the organic electroluminescent device after scribing, the organic electroluminescent diode E is covered with the organic insulating material film 47 and the inorganic insulating material film 49, The organic electroluminescent diode E may not be located at the center of the inorganic insulating material film 49 due to the error. In this case, if scribing is performed at a certain distance from the inorganic insulating material film 49, the size of the bezel BZ is further increased. That is, the area of the bezel BZ defined from the end of the organic electroluminescent diode E to the scribing line SL increases, thereby increasing the overall size of the device.

More specifically, when the outermost inorganic insulating material film 49 is formed with a different distance from the display area DA (a ≠ b ≠ c ≠ d), the scribing line SL is formed of inorganic insulating material Since the film 49 has the same distance, the size of the bezel BZ increases.

As a result, in the organic EL device of the conventional film type encapsulation structure, when the scribing is performed on the inorganic insulating material film, there arises a problem in the moisture blocking ability. On the other hand, When the scribing is performed, the bezel increases in size.

Disclosure of the Invention The present invention aims at solving the problem that the film type organic electroluminescent device can only be generated at any one of the moisture barrier capability and the bezel size.

That is, it is an object of the present invention to provide a film-type organic electroluminescent device capable of efficiently blocking moisture while at the same time preventing an increase in size of a bezel.

In order to solve the above problems, the present invention provides a display device, comprising: a substrate on which a display area and a non-display area around the display area are defined; And a second portion having a second thickness smaller than the first thickness with respect to the remaining portion of the non-display region, wherein the first portion has a first thickness with respect to the entire display region and the non- A barrier layer disposed on the substrate; An organic light emitting diode (OLED) disposed on the barrier layer and corresponding to the display region; A first film covering the organic light emitting diode and the barrier layer and contacting the organic light emitting diode and made of an inorganic insulating material; a second film disposed on the first film and made of an organic insulating material; 2 film and an encapsulation film comprising a third film made of an inorganic insulating material, wherein the first and third films have discontinuous portions at the boundaries of the first and second portions An organic electroluminescent device is provided.

According to another aspect of the present invention, there is provided a display device including a first portion having a display region and a non-display region defined around the display region, the first portion having a first thickness with respect to the entire display region and a non- A second portion having a second thickness that is less than the first thickness with respect to the first portion; An organic light emitting diode (OLED) disposed on the substrate and corresponding to the display region; A first film covering the organic light emitting diode and the substrate and contacting the organic light emitting diode and made of an inorganic insulating material; a second film disposed on the first film and made of an organic insulating material; Characterized in that it comprises an encapsulation film consisting of a third film which is located on the film and which is made of an inorganic insulating material and in which the first and third films have discontinuous portions at the boundaries of the first and second parts An electroluminescent device is provided.

Wherein the encapsulation film comprises a fourth film made of an inorganic insulating material and disposed between the second and third films and a fifth film disposed between the fourth and third films and made of an organic insulating material Feature.

And the end of the second film is covered with the third film.

The organic electroluminescent diode includes first and second electrodes facing each other and an organic light emitting layer disposed between the first and second electrodes.

The barrier layer is formed of an inorganic insulating material.

And the difference between the first thickness and the second thickness is larger than the thickness of each of the first film and the second film.

According to another aspect of the present invention, there is provided a liquid crystal display device including a first portion having a display region and a non-display region around the display region, the first portion having a first thickness with respect to the entire display region and a non- Forming a barrier layer having a second portion having a second thickness smaller than the first thickness with respect to the remainder of the display region; Forming an organic light emitting diode corresponding to the display region on the barrier layer; A first film covering the organic light emitting diode and the barrier layer and contacting the organic light emitting diode and made of an inorganic insulating material; a second film disposed on the first film and made of an organic insulating material; Forming an encapsulation film on the second film, the encapsulation film being made of a third film made of an inorganic insulating material; And scribing corresponding to the first and third films located in the second portion, wherein the first and third films have discontinuous portions at the boundaries of the first and second portions A method of manufacturing an organic electroluminescent device is provided.

According to another aspect of the present invention, there is provided a liquid crystal display device including a first portion having a display region and a non-display region defined around the display region, the first portion having a first thickness with respect to the entire display region and a non- Forming a second portion of the substrate having a second thickness smaller than the first thickness with respect to the remaining portion; Forming an organic light emitting diode corresponding to the display region on the substrate; A first film covering the organic light emitting diode and the substrate and contacting the organic light emitting diode and made of an inorganic insulating material; a second film disposed on the first film and made of an organic insulating material; Forming an encapsulation film of a third film, which is located on the film and made of an inorganic insulating material, wherein the first and third films have a discontinuous portion at the boundary of the first and second portions And a method of manufacturing an organic electroluminescent device.

Wherein the step of forming the encapsulation film comprises the steps of: forming a fourth film made of an inorganic insulating material and located between the second and third films; and a fifth film disposed between the fourth film and the third film, And forming the second electrode layer.

And the end of the second film is covered with the third film.

The organic electroluminescent diode includes first and second electrodes facing each other and an organic light emitting layer disposed between the first and second electrodes.

The barrier layer is formed of an inorganic insulating material.

And the difference between the first thickness and the second thickness is larger than the thickness of each of the first film and the second film.

Since the organic electroluminescent device of the present invention has a film-type encapsulation structure, the thickness thereof is reduced.

Further, even if the inorganic insulating material film is scribed, the cracks are blocked by the barrier pattern, so that the moisture blocking ability is not deteriorated.

Further, since the inorganic insulating material film is scribed, an increase in the size of the bezel can be prevented.

1 is a schematic cross-sectional view of a conventional active matrix type organic electroluminescent device.
2 is a schematic cross-sectional view of a portion of an organic electroluminescent device having a conventional film-type encapsulation structure.
3A and 3B are schematic cross-sectional views showing a conventional scribing process.
4 is a schematic plan view of an organic electroluminescent device after scribing.
5 is a schematic cross-sectional view of an organic electroluminescent device according to a first embodiment of the present invention.
6 is an enlarged view of an organic light emitting diode of an organic electroluminescent device according to a first embodiment of the present invention.
7A and 7B are a schematic cross-sectional view and a plan view showing an organic electroluminescent device according to the first embodiment of the present invention after scribing, respectively.
8 is a schematic cross-sectional view of an organic electroluminescent device according to a second embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 5 is a schematic cross-sectional view of an organic electroluminescent device according to a first embodiment of the present invention, and FIG. 6 is an enlarged view of an organic electroluminescent device of an organic electroluminescent device according to the first embodiment of the present invention.

As shown, the OLED 100 according to the first embodiment of the present invention includes a display area DA, which is an area for displaying an image, and a non-display area, a barrier layer 110 located on the substrate 101 and having a thickness different from that of the barrier layer 110 and a barrier layer 110 formed on the barrier layer 110 corresponding to the display area DA, And an encapsulation film 140 for encapsulation of the organic electroluminescent diode E, as shown in FIG. The encapsulation film 140 covers not only the display area DA but also a part of the non-display area NDA to prevent moisture penetration into the display area DA.

Referring to FIG. 6, a driving thin film transistor DTr is formed on the barrier layer 110 and the driving thin film transistor DTr is connected to the organic light emitting diode E. The organic light emitting diode E includes a first electrode 132 connected to the driving thin film transistor DTr and an organic light emitting layer 134 positioned above the first electrode 132 and emitting light of a specific color, And a second electrode 136 located above the organic light emitting layer 134. The organic light emitting layer 134 displays red, green, and blue colors. In general, the organic light emitting layer 134 has separate organic materials 134a, 134b, 134c are used in a pattern. One of the first electrode 132 and the second electrode 136 is transparent and the light emitted from the organic light emitting layer 134 is displayed to the outside through a transparent electrode. Although not shown, a switching thin film transistor connected to the driving thin film transistor DTr is formed on the barrier layer 110.

For example, the driving thin film transistor DTr and the switching thin film transistor may include a gate electrode, a semiconductor layer, a source electrode, and a drain electrode. The gate electrode of the switching thin film transistor is connected to the gate wiring, the source electrode of the switching thin film transistor is connected to the data line, and the drain electrode of the switching thin film transistor is connected to the gate electrode of the driving thin film transistor DTr. The switching thin film transistor is controlled by a signal applied through the gate line, and a signal applied through the data line is transmitted to a gate electrode of the driving thin film transistor DTr to control the driving thin film transistor DTr .

The source electrode of the driving thin film transistor DTr is connected to the power supply wiring and the drain electrode of the driving thin film transistor DTr is connected to the first electrode 132 of the organic light emitting diode E. Therefore, the organic light emitting diode E is operated under the control of the driving thin film transistor DTr.

The encapsulation film 140 may be formed of the first film 141 and the fifth film 145 formed of an inorganic insulating material as the lowest and upper layers respectively and the second film 142 to the fourth film 144 ) Are laminated between the first film 141 and the fifth film 145. The second film 142 and the fourth film 144 are made of an organic insulating material and the third film 143 is made of an inorganic insulating material and the second film 142 and the fourth film 144 144). In other words, the encapsulation film 140 includes an inorganic insulating material layer and an organic insulating material layer alternately stacked, and the lowermost layer and the uppermost layer are made of an inorganic insulating material. The first film 141 which is the lowest layer is brought into contact with the second electrode 136 of the organic electroluminescent diode E.

The first film 141, the third film 143 and the fifth film 145 have a thickness of about 1000 and the second film 142 and the fourth film 144 have a thickness of about 5000 .

The inorganic insulating material film serves to shield moisture and the like, and the organic insulating material film does not have a function of blocking moisture, but functions as an impact mitigation for the inorganic insulating material film. Therefore, the fifth film 145 made of an inorganic insulating material is positioned on the uppermost layer of the encapsulation film 140 to block moisture from the outside, and a first film 141 made of an inorganic insulating material is formed on the organic light- (E) to minimize the damage of the organic electroluminescent diode (E) due to moisture. The ends of the second and fourth films 142 and 144 made of an organic insulating material are covered with the first film 141, the third film 143 and the fifth film 145.

The barrier layer 110 has a hat shape. That is, the barrier layer 110 includes a first portion 110a having a first thickness t1 corresponding to the entire display region DA and a portion of the non-display region NDA, And a second portion 110b having a second thickness t2 that is less than the first thickness t1.

The difference (t1-t2) between the thicknesses of the first portion 110a and the second portion 110b is greater than the difference between the thicknesses of the first film 141, the third film 143 and the fifth film 145, Respectively. For example, when each of the first film 141, the third film 143, and the fifth film 145 has a thickness of 1000, the first portion 110a and the second portion 110b may have a thickness The thickness difference (t1-t2) may be about 1 탆 or more.

Although the side surface of the first portion 110a and the upper surface of the second portion 110b meet vertically in the drawing, the first portion 110a and the second portion 110b are tapered . For example, the first portion 110a and the second portion 110b may have a taper shape of about 45 ° and the first film 141, the third film 143, The first portion 110a and the second portion 110b may have a thickness difference of about 3 mu m or more when each of the first portion 110 and the second portion 145 has a thickness of 1000. [

The barrier layer 110 is made of an inorganic insulating material and can prevent external moisture from penetrating into the organic electroluminescent diode E. The substrate 101 is made of glass or plastic. In particular, in order to obtain flexible characteristics, the substrate 101 penetrates through the substrate 101 made of plastic and damages the organic light emitting diode E do. Accordingly, by forming the barrier layer 110 made of an inorganic insulating material between the substrate 101 and the organic electroluminescent diode E, it is possible to prevent the above problems.

In addition, the barrier layer 110 includes first and second portions 110a and 110b having different thicknesses, thereby reducing the size of the bezel without causing cracks.

That is, the inorganic insulating material can be deposited by sputtering, which is affected by the lower step. In this case, the thickness of the barrier layer 110 varies in the non-display area NDA by the first and second portions 110a and 110b, and the first film 141, The third film 143 and the fifth film 145 have discontinuous portions at the boundaries of the first portion 110a and the second portion 110b.

Therefore, even if scribing is performed on the second portion 110b of the barrier layer 110 where the first film 141, the third film 143, and the fifth film 145 are located, The crack does not transfer to the display area DA due to the presence of the cracks.

7A and 7B, which are a schematic cross-sectional view and a plan view showing an organic electroluminescent device according to a first embodiment of the present invention after scribing, the organic electroluminescent device 100 of the present invention includes a substrate 101, A first portion 110a having a first thickness t1 and a second portion 110b having a first thickness t1 with respect to a portion of the bezel BZ which is located on the substrate 101 and entirely of the display region DA and the non- And a second portion 110b having a second thickness t2 that is smaller than the first thickness t1 with respect to the remainder of the barrier layer 110. The barrier layer 110 is formed on the barrier layer 110, And an encapsulation film 140 covering the organic electroluminescent diode E. The end of the encapsulation film 140 is electrically connected to the barrier layer 110 < / RTI >

That is, as shown in FIG. 5, the second portion 110b of the barrier layer 110 where the first film 141, the third film 143, and the fifth film 145, which are made of an inorganic insulating material, Since the scribing is performed, the size of the bezel BZ is reduced.

In addition, since the barrier layer 110 is composed of the first and second portions 100a and 110b having different thicknesses and has a hat shape, the barrier layer 110 is formed at the boundary of the first and second portions 100a and 110b, The first film 141, the third film 143 and the fifth film 145 which are made of the inorganic insulating material are formed in the first film 141, the third film 143, The cracks do not transfer to the display area DA even if the fifth film 145 and the fifth film 145 are scribed. Therefore, the moisture blocking ability of the encapsulation film 140 is not lowered.

In addition, even if an alignment error of the inorganic insulating material film is generated, the size of the bezel BZ does not increase. That is, the organic electroluminescent diode E is covered with the organic insulating material layer 147 and the inorganic insulating material layer 149, and the organic electroluminescent layer E is covered with the inorganic insulating material layer 149 It may not be located in the center. However, in the present invention, since the scribing lines SL are located in the inorganic insulating film 149, the scribing lines SL have the same distance from the display area DA. (a = b = c = d) Therefore, the size of the bezel BZ does not increase.

8 is a schematic cross-sectional view of an organic electroluminescent device according to a second embodiment of the present invention.

As shown in the figure, the OLED 200 according to the second embodiment of the present invention includes a display area DA, which is an area for displaying an image, and a non-display area, an organic electroluminescent diode E disposed on the substrate 201 in correspondence with the display area DA and a substrate 201 on which the organic electroluminescent device E is formed, And an encapsulation film 240 for encapsulation. The encapsulation film 240 covers not only the display area DA but also a part of the non-display area NDA to prevent moisture penetration into the display area DA.

Although not shown, a driving thin film transistor is formed on the substrate 201, and the organic light emitting diode (E) is connected to the driving thin film transistor. The organic electroluminescent diode E includes a first electrode connected to the driving thin film transistor, an organic light emitting layer disposed on the first electrode and emitting light of a specific color, and a second electrode disposed on the organic light emitting layer do. The organic light emitting layer displays red, green, and blue colors. As a general method, a separate organic material emitting red, green, and blue light is patterned for each pixel. Although not shown, a switching thin film transistor connected to the driving thin film transistor is formed on the substrate 201.

For example, the driving thin film transistor and the switching thin film transistor may include a gate electrode, a semiconductor layer, a source electrode, and a drain electrode. The gate electrode of the switching thin film transistor is connected to the gate wiring, the source electrode of the switching thin film transistor is connected to the data line, and the drain electrode of the switching thin film transistor is connected to the gate electrode of the driving thin film transistor. The switching thin film transistor is controlled by a signal applied through the gate wiring, and a signal applied through the data wiring is transferred to a gate electrode of the driving thin film transistor to control the driving thin film transistor.

A source electrode of the driving thin film transistor is connected to a power supply line, and a drain electrode of the driving thin film transistor is connected to a first electrode of the organic light emitting diode (E). Accordingly, the organic light emitting diode E operates under the control of the driving thin film transistor.

The encapsulation film 240 may be formed by forming the first film 241 and the third film 243 made of an inorganic insulating material as the lowest and upper layers respectively and the second film 242 as the first film 241, 241) and the third film (243). The second film 242 is made of an organic insulating material. In other words, the encapsulation film 240 is formed by alternately laminating an inorganic insulating material film and an organic insulating material film, and the lowermost layer and the uppermost layer are made of an inorganic insulating material. The first film 241 of the lowest layer is brought into contact with the second electrode of the organic electroluminescent diode E.

The first film 241 and the third film 243 have a thickness of about 1000 and the second film 242 has a thickness of about 5,000.

The inorganic insulating material film serves to shield moisture and the like, and the organic insulating material film does not have a function of blocking moisture, but functions as an impact mitigation for the inorganic insulating material film. Accordingly, the third film 243 made of an inorganic insulating material is positioned on the uppermost layer of the encapsulation film 240 to block moisture from the outside, and the first film 241 made of an inorganic insulating material is formed on the organic light- (E) to minimize the damage of the organic electroluminescent diode (E) due to moisture. In addition, the end of the second film 242 made of an organic insulating material is covered by the first film 241 and the third film 243.

The substrate 201 has a hat shape. That is, the substrate 201 includes a first portion 201a having a first thickness t1 corresponding to the entire display region DA and a portion of the non-display region NDA, And a second portion 201b having a second thickness t2 that is less than the first thickness t1. The substrate 201 may have different thicknesses by etching the edge portions.

The thickness difference t1-t2 between the first portion 201a and the second portion 201b is greater than the thickness of each of the first film 141 and the second film 142 made of an inorganic insulating material. For example, when each of the first film 141 and the second film 142 has a thickness of 1000, the difference t1-t2 (t1-t2) between the first portion 201a and the second portion 201b ) May be about 1 탆 or more.

Although the side surface of the first portion 201a and the upper surface of the second portion 201b meet vertically in the drawing, the first portion 201a and the second portion 201b are tapered . For example, if the first portion 201a and the second portion 201b have a taper shape of about 45 ° and the first film 141 and the second film 142 each have a taper shape of 1000 The first portion 201a and the second portion 201b may have a thickness difference of about 3 mu m or more.

Since the substrate 201 is made of glass, external moisture can be prevented from penetrating into the organic light emitting diode E. The substrate 201 is composed of first and second portions 201a and 201b having different thicknesses, thereby reducing the size of the bezel without causing cracks.

That is, the inorganic insulating material can be deposited by sputtering, which is affected by the lower step. At this time, the thickness of the substrate 201 is different by the first and second portions 201a and 201b in the non-display region NDA, and the first film 241 made of an inorganic insulating material, 3 film 243 has a discontinuous portion at the boundary between the first portion 201a and the second portion 201b.

Therefore, even if scribing is performed on the second portion 201b of the substrate 201 on which the first film 241 and the third film 243 are located, a crack is generated by the discontinuous portion, (DA).

Further, since the scribing is performed on the first and third films 241 and 243 made of an inorganic insulating material, the bezel size does not increase as in the first embodiment.

Although a triple-layer encapsulation film 240 is shown in the second embodiment, it may have a five-layer structure as in the first embodiment. Also, in the first embodiment, the encapsulation film 140 may have a triple-layer structure.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It can be understood that

101, 201: substrate
110: barrier layer
E: Organic light emitting diode
140, 240: encapsulation film

Claims (16)

A substrate having a display region and a non-display region around the display region;
And a second portion having a second thickness smaller than the first thickness with respect to the remaining portion of the non-display region, wherein the first portion has a first thickness with respect to the entire display region and the non- A barrier layer disposed on the substrate;
An organic light emitting diode (OLED) disposed on the barrier layer and corresponding to the display region;
A first film covering the organic light emitting diode and the barrier layer and contacting the organic light emitting diode and made of an inorganic insulating material; a second film disposed on the first film and made of an organic insulating material; 2 film, and an encapsulation film made of a third film made of an inorganic insulating material,
The first and third films having discontinuous portions at the boundaries of the first and second portions,
Wherein the second film has a planar area smaller than the first portion and is located inside the first portion.
A first portion having a display region and a non-display region around the display region, the first portion having a first thickness with respect to the entire display region and a portion of the non-display region; A second portion having a second thickness smaller than the first portion;
An organic light emitting diode (OLED) disposed on the substrate and corresponding to the display region;
A first film covering the organic light emitting diode and the substrate and contacting the organic light emitting diode and made of an inorganic insulating material; a second film disposed on the first film and made of an organic insulating material; And an encapsulation film formed on the film and made of a third film made of an inorganic insulating material,
Wherein the first and third films have discontinuous portions at the boundaries of the first and second portions.
3. The method according to claim 1 or 2,
Wherein the encapsulation film comprises a fourth film made of an inorganic insulating material and disposed between the second and third films and a fifth film disposed between the fourth and third films and made of an organic insulating material Organic electroluminescent device.
3. The method according to claim 1 or 2,
And an end of the second film is covered with the third film.
3. The method according to claim 1 or 2,
Wherein the organic electroluminescent diode comprises first and second electrodes facing each other and an organic light emitting layer disposed between the first and second electrodes.
The method according to claim 1,
Wherein the barrier layer is made of an inorganic insulating material.
3. The method according to claim 1 or 2,
Wherein a difference between the first thickness and the second thickness is larger than a thickness of each of the first film and the second film.
A first portion having a first thickness with respect to the entire display region and a portion of the non-display region on a substrate on which a display region and a non-display region around the display region are defined; Forming a barrier layer comprising a second portion having a second thickness less than the first thickness;
Forming an organic light emitting diode corresponding to the display region on the barrier layer;
A first film covering the organic light emitting diode and the barrier layer and contacting the organic light emitting diode and made of an inorganic insulating material; a second film disposed on the first film and made of an organic insulating material; Forming an encapsulation film on the second film, the encapsulation film being made of a third film made of an inorganic insulating material;
And scribing corresponding to the first and third films located in the second portion,
The first and third films having discontinuous portions at the boundaries of the first and second portions,
Wherein the second film has a planar area smaller than the first portion and is located inside the first portion.
A first portion having a display region and a non-display region around the display region, the first portion having a first thickness with respect to the entire display region and a portion of the non-display region; Forming a substrate comprising a second portion having a second thickness less than the first portion;
Forming an organic light emitting diode corresponding to the display region on the substrate;
A first film covering the organic light emitting diode and the substrate and contacting the organic light emitting diode and made of an inorganic insulating material; a second film disposed on the first film and made of an organic insulating material; Forming an encapsulation film of a third film, which is located on the film and is made of an inorganic insulating material,
Wherein the first and third films have discontinuous portions at the boundaries of the first and second portions.
Claim 10 has been abandoned due to the setting registration fee. 10. The method according to claim 8 or 9,
Wherein the step of forming the encapsulation film comprises the steps of: forming a fourth film made of an inorganic insulating material and located between the second and third films; and a fifth film disposed between the fourth film and the third film, And forming a second electrode on the second electrode.
Claim 11 has been abandoned due to the set registration fee. 10. The method according to claim 8 or 9,
And the end of the second film is covered with the third film.
Claim 12 is abandoned in setting registration fee. 10. The method according to claim 8 or 9,
Wherein the organic electroluminescent diode comprises first and second electrodes facing each other and an organic light emitting layer disposed between the first and second electrodes.
Claim 13 has been abandoned due to the set registration fee. 9. The method of claim 8,
Wherein the barrier layer is made of an inorganic insulating material.
Claim 14 has been abandoned due to the setting registration fee. 10. The method according to claim 8 or 9,
Wherein the difference between the first thickness and the second thickness is greater than the thickness of each of the first film and the second film. A substrate having a display region and a non-display region around the display region;
And a second portion having a second thickness smaller than the first thickness with respect to the remaining portion of the non-display region, wherein the first portion has a first thickness with respect to the entire display region and the non- A barrier layer disposed on the substrate;
An organic light emitting diode (OLED) disposed on the barrier layer and corresponding to the display region;
A first film covering the organic light emitting diode and the barrier layer and contacting the organic light emitting diode and made of an inorganic insulating material; a second film disposed on the first film and made of an organic insulating material; 2 film, and an encapsulation film made of a third film made of an inorganic insulating material,
The first and third films having discontinuous portions at the boundaries of the first and second portions,
Wherein a difference between the first thickness and the second thickness is larger than a thickness of each of the first film and the second film.
A first portion having a first thickness with respect to the entire display region and a portion of the non-display region on a substrate on which a display region and a non-display region around the display region are defined; Forming a barrier layer comprising a second portion having a second thickness less than the first thickness;
Forming an organic light emitting diode corresponding to the display region on the barrier layer;
A first film covering the organic light emitting diode and the barrier layer and contacting the organic light emitting diode and made of an inorganic insulating material; a second film disposed on the first film and made of an organic insulating material; Forming an encapsulation film on the second film, the encapsulation film being made of a third film made of an inorganic insulating material;
And scribing corresponding to the first and third films located in the second portion,
The first and third films having discontinuous portions at the boundaries of the first and second portions,
Wherein a difference between the first thickness and the second thickness is greater than a thickness of each of the first film and the second film.

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