KR101763619B1 - Array Test Device - Google Patents

Abstract

The present invention relates to an array test apparatus for testing a defect in a substrate, comprising: a test module including a modulator having a first surface facing the substrate; And a gap measuring unit including a reference surface disposed so as to face the first surface at a position where the test module is movable and a gap measuring unit measuring a gap between the first surface and the reference surface, , An array test apparatus having a simple structure test module can be provided.

Description

Array Test Device < RTI ID = 0.0 >

The present invention relates to an array test apparatus.

In recent years, a liquid crystal display (LCD), a plasma display panel (PDP), an electro luminescent display (ELD), a VFD (Vacuum Fluorescent Display) have been researched and developed.

Among them, the liquid crystal display device which is improved in performance by the semiconductor technology which has been rapidly developing has excellent image quality, has advantages such as miniaturization, light weight, and low power consumption, it can replace the existing cathode ray tube (CRT) It is widely used.

Therefore, the liquid crystal display device, which is one of the flat panel display devices, can be used as a small-sized product such as portable cellular phone, PDA (Personal Digital Assistant) and PMP (Portable Multimedia Player) And so on.

The liquid crystal display device is a display device that can display a desired image by individually supplying data signals according to image information to liquid crystal cells arranged in a matrix form to adjust the light transmittance of the liquid crystal cells.

Such a liquid crystal display device determines whether or not light is transmitted as an electrical signal is applied between a thin film transistor (hereinafter referred to as a TFT) substrate on which a plurality of pixel patterns are formed and a color filter substrate on which a color filter layer is formed And a liquid crystal layer.

In a method of manufacturing a liquid crystal display device, first, a plurality of gate lines arranged in one direction, a plurality of data lines arranged in a direction perpendicular to the gate lines, and pixel regions And a plurality of TFTs which are switched by the signals of the gate lines and transmit the signals of the data lines to the pixel electrodes are formed.

On the color filter substrate, a black matrix for blocking light in a portion excluding the pixel region, an RGB color filter layer for expressing color hue, and a common electrode for implementing an image are formed.

Then, after the alignment film is applied to the TFT substrate and the color filter substrate, the alignment film is rubbed to provide a pre-tilt angle and alignment direction to the liquid crystal molecules in the liquid crystal layer to be formed between the TFT substrate and the color filter substrate rubbing.

Then, a paste pattern is formed by applying a paste to at least one of the substrates in a predetermined pattern so as to maintain a gap between the substrates while preventing the liquid crystal from leaking to the outside and to seal between the substrates, Thereby forming a liquid crystal panel.

During the manufacturing process of such a liquid crystal display device, a step of testing for defects such as disconnection of a gate line or a data line formed on the TFT substrate or circuit failure on an open other TFT substrate is performed.

In order to test a substrate, an array test apparatus having a test module provided with a modulator and a probe module provided with a plurality of probe pins is used.

The array test apparatus has a structure in which a plurality of probe pins are brought into contact with electrodes disposed on a substrate to be tested and then an electric signal is applied to the electrodes to form an electric field between the modulator and the substrate, Test.

Next, the test module is moved to another area of the substrate, and the above-described test is repeated to test the entire substrate.

At this time, it is necessary to accurately set the gap between the substrate and the test module for a reliable test result. Conventionally, the gap between the substrate and the test module is measured and set through the displacement measuring means formed on the test module.

However, since the displacement measuring means is formed in the test module, the structure of the test module becomes complicated. This causes a problem that the test module that needs to be moved on the substrate at a high speed and needs precise control is burdened.

It is an object of the present invention to provide an array test apparatus having a simple test module.

According to another aspect of the present invention, there is provided an array test apparatus for testing defects of a substrate, the array test apparatus comprising: a test module including a modulator having a first surface facing the substrate; And a gap measuring unit including a reference surface disposed at a position where the test module is movable so as to face the first surface, and a displacement measuring unit measuring a gap between the first surface and the reference surface .

The apparatus further includes a control unit for controlling the gap between the first surface and the substrate by driving the elevation unit using the gap data measured by the gap measuring unit, .

On the other hand, an array test apparatus of the present invention includes: a test module including a frame having a second surface facing the substrate and supporting the modulator; And a gap measuring unit including a reference surface disposed so as to face the second surface at a position where the test module is movable and a gap measuring unit measuring a gap between the second surface and the reference surface .

The apparatus further includes a control unit for controlling the gap between the second surface and the substrate by driving the elevation unit using the gap data measured by the gap measuring unit, further comprising an elevating unit for moving the test module .

Further, the apparatus may include a test section on which the substrate is mounted, and the gap measuring section may be disposed adjacent to one side of the test section.

In addition, it is preferable that the reference plane is flush with the surface on which the substrate of the test unit is mounted.

According to the array test apparatus of the present invention, since the displacement measuring means is formed not in the test module but in the gap measuring portion, which is a separate member, it is possible to provide a test module with a simple structure and relieve the burden imposed on the test module, There is an advantage of providing high test results.

Further, in the present invention, since the gap between the substrate and the modulator block is determined by measuring the gap between the gap measuring unit and the modulator block, problems such as contamination of the substrate surface, scratches or breakage due to contact or collision between the substrate and the modulator block There is an effect that can be removed.

1 is a perspective view schematically showing an example of an array testing apparatus according to a preferred embodiment of the present invention,
2 is an exploded perspective view showing a fixing block and a modulator block constituting a test module for an array test apparatus according to the present invention,
FIG. 3 is a perspective view illustrating a combined state of the fixed block and the modulator block of FIG. 2,
Figs. 4 and 5 are cross-sectional views for explaining a structure in which the modulator block of Fig. 2 is combined to be movable up and down with respect to the fixed block,
6 and 7 are sectional views for explaining a method of measuring a gap between the modulator block and the gap measuring unit of the array testing apparatus according to the present invention,
8 is a sectional view for explaining the reference plane of the gap measuring unit and the position of the testing unit of the array testing apparatus according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the embodiments of the present invention described below are provided so that those skilled in the art can understand the present invention more easily, and the scope of the present invention is not limited to the embodiments described.

Hereinafter, an array test apparatus according to the present invention will be described in detail with reference to FIGS. 1 to 5. FIG.

FIG. 1 is a perspective view schematically showing an example of an array testing apparatus according to a preferred embodiment of the present invention. FIG. 2 is a perspective view of a fixing block constituting a test module for an array testing apparatus according to the present invention, 3 is a perspective view showing a combination of a fixed block and a modulator block of FIG. 2, and FIGS. 4 and 5 are views showing an assembled state in which the modulator block of FIG. Sectional view for explaining the structure.

The array test apparatus 10 is an apparatus for testing electrical defects such as circuit defects formed on the substrate S.

Here, the substrate S may be a single substrate provided in the flat panel display device, for example, a TFT substrate of a liquid crystal display device.

The array test apparatus 10 may include a loading unit 600, a test unit 300, a test module 200, a gap measuring unit 400, and an unloading unit 700.

The loading unit 600 may include at least two loading plates 610. [ The loading plates 510 are spaced apart from each other by a predetermined distance so that the substrate S to be tested is supported thereon and moved to the test unit 300.

The test portion 300 is disposed at one side of the loading portion 600 and at least a portion of the substrate S transferred along the loading plate 610 is seated where the electrical defects of the substrate S are tested .

At this time, in order to test an electrical defect of the substrate S, an electrode to which an electric signal is applied is formed on the substrate S. The electrode of the substrate S is divided into a number And position are different.

A probe module 900 for applying an electric signal to the electrode of the substrate S is disposed to test whether the substrate S placed on the test unit 300 is electrically coupled. The probe module 900 includes a probe head (not shown) and a probe pin (not shown) provided corresponding to the number and positions of the electrodes on the substrate.

The test module 200 is arranged to face the test unit 300 and the substrate S transferred to the upper part of the test unit 300 to detect a defect of the substrate S, Axis direction to a support 800 extending in a direction (X-axis direction) perpendicular to the conveying direction. A linear feed mechanism such as a linear motor may be applied to the support table 800.

The test module 200 may be provided in plurality along the extension direction (X-axis direction) of the support frame 800 and may include a modulator block 220, a fixed block 210, a photographing device 230, ).

The modulator block 220 is adjacent to the substrate S placed on the test unit 300 and is movably coupled to the lower side of the fixed block 210 and includes a moving block 221, a modulator 225 And a frame 223 (see Fig. 2). A photographing device 230 for photographing whether a modulator (see FIG. 2) included in the modulator block 220, or more precisely, the modulator block 220, has passed through the fixed block 210 may be further provided.

The test module 200 may further include an elevating unit 250 for elevating and lowering the fixed block 210. The elevating and lowering unit 250 may include an electromagnetic interconnection between a cylinder or a mover, A linear motor or the like, which is operated by the action of the fixed block 210, can be used.

A controller (not shown) for controlling the elevating unit 250 may be included in the array testing apparatus according to the present invention to adjust the gap between the modulator block 220 and the substrate S.

The array test apparatus can be divided into a reflection type and a transmission type. In the case of the reflection type, a light source is disposed together with the test module 200, and a reflective layer is provided on the modulator 225 of the test module 200, It is detected whether or not the substrate S is defective by measuring the amount of light reflected when the emitted light is incident on the modulator 225 and then reflected from the reflective layer of the modulator 225. [

On the other hand, in the case of the transmission method, a light source is provided on the lower side of the test unit 300, and the light amount of the light emitted from the light source and transmitted through the modulator 225 is measured.

The array test apparatus according to the present invention can be applied to both the reflection method and the transmission method.

The gap measuring unit 400 is disposed adjacent to one side of the test unit 300 and is disposed between the gap measuring unit 400 and the modulator block 220 through the displacement measuring unit 500 formed on the gap measuring unit 400. [ Is measured.

The gap between the gap measuring unit 400 and the modulator block 220 is measured in order to set the gap between the substrate S and the modulator block 220. This is because the gap between the substrate and the modulator block 220 And to eliminate problems such as surface contamination, scratches and breakage of the substrate due to contact or collision. A method of measuring the gap between the gap measuring unit 400 and the modulator block 220 will be described later.

The gap measuring unit 500 may be formed at a predetermined position of the gap measuring unit 400 as many as necessary and the gap measurement between the gap measuring unit 400 and the modulator block 220 may be accurate as the number of the measuring units 500 increases .

The test module 200 moves to the upper side of the gap measuring unit 400 to measure the gap between the gap measuring unit 400 and the modulator block 220 and then moves along the support axis 800 along the X axis, By controlling the gap between the substrate S and the modulator block 220 by driving the elevation unit 250 using the gap data measured by the gap measuring unit 400 on the upper side of the test unit 300 The defect of the substrate S is tested.

The unloading unit 700 is disposed at one side of the test unit 300 and the tested substrate S is transferred from the test unit 300 to the unloading unit 700 and moved to the outside. In this case, the unloading unit 700 may be provided with an unloading plate 710 that supports the tested substrate S and is spaced apart at a predetermined interval.

An air hole (not shown) for supplying a predetermined pressure of air to the loading plate 610 of the loading unit 600 and the unloading plate 710 of the unloading unit 700 to move the substrate S 620, and 720, and these air holes 620 and 720 may be connected to a constant-pressure source for supplying air. The loading unit 600 and the unloading unit 700 may include an adsorption plate 630 for adsorbing the lower surface of the substrate S.

When the substrate S is loaded onto the loading plate 610, air is injected into the air holes 620, and the attracting plate 630 rises in a floating state of the substrate S The substrate S is moved to the test unit 300 by moving in the Y direction while the lower surface of the substrate S is being attracted and supported. A suction hole through which air passes can be formed in the suction plate 630, and a negative pressure source that sucks air can be connected to the suction hole.

In this manner, the substrate S is transferred to the test unit 300, the air is blown from the air holes 620 of the loading plate 610, and the probe pins (not shown) When the substrate S is aligned, a test for defectiveness of the substrate S in the test portion 300 is performed.

The fixing block 210 is lowered by driving the elevating unit 250 to form a proper gap between the modulator block 220 and the substrate S and the modulator (see FIG. 2) A voltage is applied to the electrode of the modulator 225 in a state adjacent to the upper side.

At this time, an electric field is generated between the substrate S and the modulator 225, the amount of light reflected or transmitted from the light source to the modulator is changed by the generated electric field, and the image of the modulator 225 taken by the imaging device 230 The magnitude of the electric field generated between the substrate S and the modulator 225 can be detected.

The defects on the substrate S can be measured using the magnitude of the detected electric field. That is, when there is no defect on the substrate S, a normal electric field within a predetermined range is formed between the substrate S and the modulator 225. However, if there is a defect on the substrate S, an electric field is not formed An abnormal electric field is formed.

After the at least a portion of the substrate S to be tested is tested as described above, the fixing block 210 is raised by the driving of the elevating unit 250 to move between the modulator block 220 and the substrate S Forming a suitable gap (a gap larger than the gap formed during testing). Next, the test module 200 moves in the X axis direction along the supporter 800 on the test portion 300 to move to another portion of the substrate S, or the substrate S moves in the Y axis direction, Another portion of the substrate S is moved onto the test portion 300 and another portion of the substrate S is tested. This process is performed sequentially and repeatedly until a test is performed on the entire area of the substrate S. [

The substrate S is conveyed in the Y axis direction through the loading unit 600, the test unit 300 and the unloading unit 700. The test module 200 is moved along the X axis It is possible to test at least a part of the defects of the substrate to be tested by appropriately moving the test module 200 and the substrate S in the X axis or the Y axis.

However, the array test apparatus 10 applicable to the present invention is not limited to Fig. The substrate S is fixed to a fixed support plate and the defect of the substrate S may be tested while the test module 200 is moved in the X and Y axes and the test module 200 is fixed in the horizontal direction, S may be tested for defects in the substrate while moving in the X and Y axes.

Subsequently, the tested substrate S is transferred to the outside through the unloading plate 710.

Referring to FIG. 2, the test module 200 shown in FIG. 1 may include a fixed block 210 and a modulator block 220.

The fixed block 210 may be formed into a hollow tube so that the modulator block 220 may be exposed to the photographing apparatus 230 disposed above the fixed block 210. [

The modulator block 220 is movably coupled to the fixed block 210 so as to be movable up and down and forms an electric field with the substrate S to test the defect of the substrate S according to the intensity of the electric field A modulator 225, a frame 223 fixed around the modulator 225 to support the modulator 225, and a moving block 221 for vacuum-sucking the frame.

The modulator 225 is provided with a modulator 225 for changing the amount of light reflected (in the case of the reflection method) or the amount of light transmitted in the case of the transmission method an optical material layer and an electrode. The entire mineral layer is made of a material whose specific physical properties are changed by an electric field generated when a voltage is applied to the substrate S and the modulator 225 to change the light amount of light incident on the entire mineral layer. The precursor layer may be formed of a liquid crystal having a property of being arranged in a predetermined direction according to the magnitude of the electric field.

When the constant voltage is applied to the electrode of the modulator 225 included in the modulator block 220 and the substrate electrode formed on the substrate S while the modulator block 220 approaches the substrate S, An electric field is generated between them.

At this time, the magnitude of the electric field between the defective portion and the non-defective portion on the substrate S is changed, and the defect is detected through the difference.

The modulator 225 has a first surface 225-1 facing the substrate S, the test portion 300 or the gap measuring portion 400. [

The modulator 225 and the frame 223 are vacuum-sucked and fixed to the moving block 221. The moving block 221 is coupled to the fixed block 210 so as to be freely movable up and down Such a combined form is shown in Fig.

The frame 223 also has a second surface 223-1 facing the substrate S, the test portion 300, or the gap measuring portion 400.

Referring to FIG. 3, a part of the engaging member 222 fixed to the moving block 221 is inserted into the engaging groove 215 formed in the fixing block 210.

4 and 5, the lower portion of the engaging member 222 may be connected to the moving block (not shown). In this case, 221 and the upper side portion is inserted so as to be freely movable in the coupling groove 215 of the fixing block 210.

The engaging protrusion 211 is formed in the engaging groove 215 so that the moving block 221 is not separated from the fixed block 210 and the upper portion of the engaging member 222 is threaded over the engaging protrusion 211 Respectively.

When the movable block 221 is not separated from the fixed block 210 and the upper portion of the engaging member 222 freely ascends and descends along the engaging groove 215, 221 may be adjusted (K1, K2)

The engaging groove 215 is formed on at least three sides of the four sides of the fixed block 210 so that the movable block 221 can be stably engaged with the fixed block 210, And a coupling member 222 may be provided corresponding to the coupling member 222. [

An air bearing (not shown) may be installed between the fixing block 210 and the modulator block 220 to prevent the modulator block 220 from being rocked to the left or right while the test module 200 is moving.

On the other hand, it is important to set a gap between the modulator block of the array test apparatus and the substrate in order to test defects of the substrate through the array test apparatus.

The smaller the gap between the modulator block 220 and the substrate S is, the more sufficient electric field is formed between the electrode of the modulator 225 and the electrode on the substrate S to more accurately detect defects on the substrate S, The surface of the modulator 225 and / or the substrate S may be contaminated due to contact or collision between the modulator 225 and the substrate S, scratches or damage may occur.

Conversely, the larger the gap between the modulator block 220 and the substrate S, the less the problem of contact or collision of the modulator 225 and the substrate S, but the accuracy of defect detection on the substrate S is reduced.

That is, a sufficient electric field is formed between the electrode of the modulator 225 and the electrode on the substrate S during the testing of the substrate for defects, and the problem of contact or collision of the modulator 225 and the substrate S is prevented The gap between the substrate S and the modulator 225 should be set to several mu m to several tens mu m.

The gap between the substrate S and the modulator block 220 is tested during the upward / downward or left / right movement of the modulator block 220 relative to the substrate S in order to test another part of the substrate S It should be bigger than during the process.

For example, if the gap between the substrate S and the modulator block 220 is set to about 20 to 40 mu m during the test, while the modulator block 220 is moving to the left and right with respect to the substrate S, The gap between the modulator block S and the modulator block 220 is preferably set to about 80 to 100 mu m.

In order to adjust the gap between the substrate S and the modulator block 220, the modulator block 220 is provided with an ejection unit (not shown) for ejecting air of a certain pressure toward the substrate, A spray hole 224a and a spray passage 224b are formed in the frame 223 of the modulator block 220 (see FIG. 2).

The ejection unit can alternately be arranged with a low-pressure ejection unit for ejecting relatively low-pressure air and a high-pressure ejection unit for ejecting relatively high-pressure air.

Therefore, while the modulator block 220 moves vertically or horizontally with respect to the substrate S, the low-pressure ejection unit and the high-pressure ejection unit simultaneously operate to increase the gap between the substrate and the modulator block 220, Only the low-pressure ejection unit can be actuated to minimize the gap between the substrate and the modulator block 220. [0050] The operation example of the ejection unit is not limited to the above.

In this way, since the air pressure is used to set the gap between the modulator block 220 and the substrate S, it is necessary to maintain the gap during the test and the gap during the movement of the modulator block 220, It is necessary to measure the air pressure in advance.

Referring to FIG. 6, FIG. 6 is a cross-sectional view illustrating a method of measuring a gap between a modulator block and a gap measuring unit of the array testing apparatus according to the present invention.

The test module 200 is first moved on the gap measuring unit 400 to set the required air pressure for the gap to be set between the modulator block 220 and the substrate S, The pressure of the air corresponding to the desired gap value is obtained by moving the fixed block 210 up and down by driving the lifting unit 250 of the lifting unit 200 and measuring the gap therebetween by the displacement measuring unit 500.

The gap measuring unit 400 includes a reference surface 410 disposed to face the first surface 225-1 of the modulator 225 and includes displacement measuring means 500 formed on the gap measuring unit 400 The gap between the reference surface 410 of the gap measuring unit 400 and the first surface 225-1 of the modulator 225 is measured. At this time, the air pressure corresponding to the desired gap value is stored together with the gap value.

By controlling the gap between the first surface 225-1 of the modulator 225 and the substrate S by driving the elevation unit 250 using the gap data measured by the gap measuring unit 400, S) of the defect.

That is, the gap between the modulator block 220 and the substrate S (not shown) is measured by jetting the air pressure measured by the gap measuring unit 400 to form a gap during the test and a gap during the movement of the modulator block 220, Can appropriately be set and maintained.

The displacement measuring unit 500 is formed at a position of the gap measuring unit 400 facing the modulator 225 of the modulator block 220 and preferably includes a gap measuring unit 400, respectively.

In order to measure the pressure of the air for forming a proper gap between the modulator block 220 and the substrate S, the gap measuring unit 400 is provided with displacement measuring means 500, The gap between the reference plane 410 of the measuring unit 400 and the second surface 223-1 of the frame 223 can be measured. At this time, the air pressure corresponding to the desired gap value is stored together with the gap value.

Here, the reference plane 410 of the gap measuring unit 400 is arranged to face the second surface 223-1 of the frame 223.

By controlling the gap between the second surface 223-1 of the frame 223 and the substrate S by driving the elevation unit 250 using the gap data measured by the gap measuring unit 400, (S).

The displacement measuring means 500 is formed at a position of the gap measuring unit 400 facing the frame 223 of the modulator block 220 because the displacement measuring means 500 measures a gap This is to avoid possible damage to the surface of the modulator 225 in the process of measuring the gap when the measurement unit 400 is formed.

The displacement measuring means used in the array testing apparatus according to the present invention is not limited to the specific displacement measuring means but may be applied to both the contact displacement measuring means and the non-contact displacement measuring means. For example, the displacement measuring means may be an LVDT (Linear Variable Differential Transformer) , A laser sensor, a sensor capable of measuring a displacement such as a load cell, and a mechanical device can all be applied.

The reason for measuring the gap between the modulator block 220 and the gap measuring unit 400 in order to set the gap between the modulator block 220 and the substrate S is that the fixing block 210 Scratches or breakage of the surface of the modulator block 220 and / or the substrate S due to contact or collision between the modulator block 220 and the substrate S as it moves upward and downward .

Further, in the array testing apparatus according to the present invention, the displacement measuring means is formed in the gap measuring unit, which is not a test module, but a separate member, so that a test module having a simple structure can be provided. Further, according to the array test apparatus of the present invention, since the structure of the test module which needs to move vertically or horizontally on the substrate at a high speed is simplified, the burden imposed on the test module is relaxed so that a reliable test result can be provided do.

Referring to FIG. 8, FIG. 8 is a cross-sectional view illustrating a reference plane of a gap measuring unit and a position of a testing unit of the array testing apparatus according to the present invention.

The gap measuring unit 400 may be disposed adjacent to one side of the test unit 300 and the reference plane 410 of the gap measuring unit 400 may be disposed on the test unit 300, (S) is placed on the same plane as the surface (310) on which the substrate (S) is placed.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments of the present invention are not intended to limit the scope of the present invention but to limit the scope of the present invention. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents thereof should be construed as being included in the scope of the present invention.

10: Array test apparatus 200: Test module
210: fixed block 220: modulator block
221: Moving block 223: Frame
225: Modulator 300: Test section
400: gap measuring unit 500: displacement measuring means
600: loading section 700: unloading section

Claims (6)

1. An array test apparatus for testing a defect in a substrate,
A test unit on which the substrate is placed;
A test module including a modulator having a first side facing the substrate; And
A gap measuring unit disposed adjacent to the test unit and configured to measure a gap between the reference plane and the reference plane disposed to face the first plane at a position where the test module is movable; ≪ / RTI &
Wherein the plane on which the substrate is mounted and the reference plane of the test unit are flush with each other.
The method according to claim 1,
Further comprising a lift unit for moving the test module,
Further comprising a control unit for driving the elevation unit using the gap data measured by the gap measuring unit to adjust a gap between the first surface and the substrate.
1. An array test apparatus for testing a defect in a substrate,
A test unit on which the substrate is placed;
A test module having a second face opposite to the substrate and comprising a frame for supporting the modulator; And
A gap measuring unit disposed adjacent to the test unit and configured to measure a gap between the reference plane and the reference plane disposed opposite to the second plane at a position where the test module is movable; ≪ / RTI &
Wherein the plane on which the substrate is mounted and the reference plane of the test unit are flush with each other.
The method of claim 3,
Further comprising a lift unit for moving the test module,
Further comprising a control unit for driving the elevation unit using the gap data measured by the gap measuring unit to adjust a gap between the second surface and the substrate.
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