KR101859457B1 - Lighting device - Google Patents

Abstract

An embodiment of the present invention relates to a lighting apparatus.
An illumination device according to an embodiment of the present invention includes: a clad metal layer; A light emitting module including a substrate disposed on the clad metal layer and a plurality of light emitting elements disposed on an upper surface of the substrate; A lens that is disposed on the plurality of light emitting elements and optically controls light emitted from the plurality of light emitting elements and an outer frame surrounding the outer peripheral surface of the substrate and spaced apart from the lens and the light emitting element by a predetermined distance, ; A case covering the lens structure, coupled with the clad metal layer, and having an opening through which light passing through the lens structure is emitted; An insulating structure disposed on the clad metal layer and disposed between the outer circumference of the outer frame of the lens structure and the case; And a packing structure disposed between the case and an upper surface of the outer frame of the lens structure, wherein the clad metal layer is coupled to at least two or more different metal layers.

Description

LIGHTING DEVICE

An embodiment of the present invention relates to a lighting apparatus.

Light emitting diodes (LEDs) are a type of semiconductor devices that convert electrical energy into light. The light emitting diode has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness compared with conventional light sources such as fluorescent lamps and incandescent lamps. Accordingly, much research has been carried out to replace an existing light source with a light emitting diode, and a light emitting diode has been increasingly used as a light source for lighting devices such as various liquid crystal displays, electric sign boards, and street lights used in indoor and outdoor.

However, in order for light emitting diodes to completely replace existing light sources, it is necessary to overcome problems such as high price, vulnerability to heat and humidity, low color rendering, and low luminance.

Embodiments of the present invention provide a lighting device with improved heat dissipation efficiency.

Further, an illumination device capable of downsizing is provided.

An illumination device according to an embodiment of the present invention includes a light emitting module; And a clad metal layer disposed under the light emitting module, wherein at least two or more different metal layers are bonded to the clad metal layer.

On the other hand, a lighting apparatus according to an embodiment of the present invention includes: a light emitting module having a substrate and a plurality of light emitting elements disposed on the substrate; An insulating structure surrounding an outer circumferential surface of the substrate of the light emitting module; And a case disposed on the light emitting module and covering the light emitting module and the insulating structure.

The lighting apparatus according to the embodiment of the present invention can improve the heat radiation efficiency.

In addition, the thickness and weight of the entire apparatus can be reduced, thereby enabling miniaturization.

1 is a perspective view of a lighting apparatus according to an embodiment of the present invention,
FIG. 2 is a perspective view of the lighting apparatus shown in FIG. 1,
3 is a cross-sectional view of the illumination device shown in Fig. 1,
Fig. 4 is an exploded perspective view of the illumination device shown in Fig. 1,
5 is a cross-sectional view of the illumination device shown in Fig. 4, taken along line A-A ';

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size.

In the description of the embodiments according to the present invention, in the case where an element is described as being formed on "on or under" another element, the upper (upper) or lower (lower) (On or under) all include that the two elements are in direct contact with each other or that one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

Hereinafter, a lighting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.

Fig. 1 is a perspective view from above of a lighting apparatus according to an embodiment of the present invention, Fig. 2 is a perspective view from below of the lighting apparatus shown in Fig. 1, Fig. 3 is a sectional view of the lighting apparatus shown in Fig. 4 is an exploded perspective view of the illumination device shown in Fig. 1, and Fig. 5 is a sectional view taken along line A-A 'in Fig.

1 to 4, a lighting apparatus according to an embodiment of the present invention includes a case 100, a packing structure 200, a lens structure 300, a light emitting module 400, and an insulating structure 500 . Further, a clad metal layer 600 may be further included.

The case 100 may be coupled to and fixed to the clad metal layer 600 by fastening means such as a coupling screw or the like to form the body of the lighting apparatus according to the embodiment of the present invention. Specifically, when the coupling screw is inserted through the through hole H1 of the case 100 and inserted into the coupling groove H2 of the clad metal layer 600, the case 100 and the clad metal layer 600 are connected to each other Bonded and fixed.

Since the case 100 can be coupled with the clad metal layer 600 or can be separated from the clad metal layer 600 by a coupling screw, when a failure occurs in the lighting device, Or repair.

The case 100 may have a circular body. The case 100 houses the packing structure 200, the lens structure 300, the light emitting module 400, and the insulation structure 500 to house the packing structure 200, the lens structure 300, Thereby protecting the structure 500.

The case 100 has an opening G through which light that has passed through the lens structure 300 is emitted to the outside. Accordingly, the lens structure 300 is exposed to the outside through the opening G. [

In order to dissipate heat from the light emitting module 400, the case 100 is preferably a thermally conductive material. For example, the case 100 is preferably made of a metal, and may be at least one of aluminum (Al), nickel (Ni), copper (Cu), silver (Au), and tin (Sn). Here, the case 100 may have a plurality of heat dissipation fins 110 for dissipating heat from the light emitting module 400 on the outer surface. The surface area of the case 100 is widened by the radiating fin 110, which is advantageous in that heat radiation is more effective.

The packing structure 200 is disposed between the case 100 and the lens structure 300 to prevent moisture and foreign matter from penetrating into the light emitting module 400. The packing structure 200 is not permeable to moisture and can use an elastic material. For example waterproof rubber or silicone material.

A circular ring shape is used so that the packing structure 200 is disposed on the outer frame 330 of the lens structure 300. Of course, various shapes can be used depending on the shape of the lens structure. When the packing structure 200 is placed on the lens structure 300, the case 100 presses the packing structure 200. Accordingly, the packing structure 200 fills the space between the case 100 and the lens structure 300, thereby preventing moisture and foreign matter from penetrating into the light emitting module 400 through the opening G of the case 100 . Therefore, the reliability of the lighting apparatus according to the embodiment of the present invention can be improved.

The lens structure 300 is disposed on the light emitting module 400 to optically adjust the light emitted from the light emitting module 400. The lens structure 300 may include a lens 310 and an outer frame 330.

The lens structure 300 may be injection molded using a light-transmitting material. The lens structure 300 may be formed of a plastic material such as glass, poly methyl methacrylate (PMMA), or polycarbonate (PC).

The lens structure 300 is shown in the form of a plurality of dome-shaped lenses 310, but is not limited thereto. If necessary, it can be deformed into various shapes such as hemispherical, concave and convex. Although not shown in the drawings, when the lens structure 300 is hemispherical, irregularities and prisms are formed on the bottom surface of the hemispherical lens structure 300, that is, on the incident surface in order to increase the light extraction efficiency and obtain a desired light distribution. .

A plurality of lenses 310 are disposed on the upper surface of the lens structure 300. The lens 310 may be in a dome shape.

The lens 310 adjusts the light incident on the light emitting module 400. Here, the term 'light control' means that the light incident from the light emitting module 400 is diffused or condensed. The lens 310 preferably diffuses the light from the light emitting device 430 when the light emitting device 430 of the light emitting module 400 is a light emitting diode. However, the lens 310 can condense light without diffusing the light from the light emitting module 400.

The lens 310 preferably corresponds one-to-one with the light emitting device 430 of the light emitting module 400. That is, the number of the lenses 310 is preferably equal to the number of the light emitting devices 430. For example, as shown in FIG. 3, when eight light emitting devices 430 are disposed on the substrate 410, the eight lenses 310 are disposed in a one-to-one correspondence with the eight light emitting devices 430 .

The lens 310 may include a phosphor (not shown). The phosphor may include at least one or more of a yellow-based, green-based, or red-based phosphor. In particular, when the light emitting device 430 of the light emitting module 400 is a blue light emitting diode, the lens 310 preferably includes at least one or more of yellow, green, and red phosphors. When the phosphor 310 is included in the lens 310, the color rendering index of the light emitted from the light emitting device 430 can be improved.

The outer frame 330 can separate the lens 310 and the light emitting device 430 of the light emitting module 400 by a predetermined distance. A predetermined space may be formed between the lens 310 and the light emitting device 430 by the outer frame 330. When the light emitting device 430 of the light emitting module 400 is a light emitting diode, the light emitting angle of the light emitted from the light emitting diode 430 is approximately 120 degrees. In order to obtain a desired light distribution by using the light, This is because the predetermined interval is required between the light emitting module 400 and the lens 310.

A packing structure 200 is disposed on the outer frame 330. To this end, the outer frame 330 may have a flat shape such that the packing structure 200 is fully seated. However, the present invention is not limited thereto, and the outer frame 330 may not be flat, but may be inclined inward or outward. In addition, when the packing structure 200 has a predetermined groove, the outer frame 330 may have a protrusion (not shown) that can be fitted to the predetermined groove. As such, the outer frame 330 includes various forms of embodiments in which the packing structure 200 can be easily mounted.

The light emitting module 400 is disposed over the cladding metal layer 600 and below the lens structure 300. The light emitting module 400 may include a substrate 410 and a plurality of light emitting devices 430 disposed on the substrate 410.

The substrate 410 may be in the form of a disc, as shown in the figure, but is not limited thereto.

The substrate 410 may be an aluminum substrate, a ceramic substrate, a metal-core PCB, or a general PCB printed with a circuit on an insulator.

A plurality of light emitting devices 430 are disposed on one surface of the substrate 410. One side of the substrate 410 may be formed in a color, for example white, in which light is efficiently reflected.

A plurality of light emitting devices 430 are disposed on the substrate 410. Here, the plurality of light emitting devices 430 may be mounted on the substrate 410 in an array form, and the shape and number of the plurality of light emitting devices 430 may be variously modified as needed.

The light emitting device 430 may be a light emitting diode (LED). The light emitting device 430 may selectively use at least one of a red LED, a blue LED, a green LED, and a white LED.

The substrate 410 may further include a direct current (DC) converter for converting an alternating current into direct current and supplying the alternating current to the direct current, and a protective device for protecting the lighting device from electrostatic discharge (ESD) or surge.

A heat sink (not shown) may be attached to the bottom surface of the substrate 410. The heat sink (not shown) can efficiently transfer the heat generated from the light emitting module 400 to the cladding metal layer 600. The heat radiating plate (not shown) may be made of a thermally conductive material, for example, a thermally conductive silicon pad or a thermally conductive tape.

The insulating structure 500 surrounds the outer peripheral surface of the light emitting module 400. For this purpose, the insulating structure 500 uses a ring shape according to the circular light emitting module 400 of the circular shape. Although shown in the form of a ring of the insulating structure 500 in the drawing, it is not limited thereto.

The insulating structure 500 is preferably made of an insulating material. For example, the insulating structure 500 is preferably made of a rubber material or a silicon material. Such an insulating structure 500 can electrically protect the light emitting module 400. FIG. That is, the insulating structure 500 electrically insulates the side surface of the light emitting module 400 from the clad metal layer 600, and electrically insulates the side surface of the light emitting module 400 from the metallic case 100. Therefore, it is possible to improve the withstand voltage of the lighting apparatus according to the embodiment of the present invention, and it is advantageous in that the reliability can be improved. In addition, the insulating structure 500 has an advantage that moisture and foreign substances can be prevented from flowing into the light emitting module 400.

The clad metal layer 600 is disposed under the light emitting module 400 and can be coupled to the case 100. Accordingly, the heat from the light emitting module 400 can be dissipated by itself or delivered to the case 100. Here, it is preferable that the clad metal layer 600 directly or indirectly contacts the bottom surface of the light emitting module 400. The meaning of the clad metal layer 600 indirectly contacting the bottom surface of the substrate 410 of the light emitting module 400 may mean that a heat sink (not shown) is disposed on the bottom surface of the substrate 410.

The clad metal layer 600 is a layer in which a plurality of different types of metal layers are bonded to each other. Here, the clamp metal layer 600 may be replaced with a heat-radiating layer containing a material having an electrically insulating property and a thermally excellent heat-radiating property, or a supporting layer made of a non-metallic fluorine material. This will be described in detail with reference to FIG.

5 is a cross-sectional view taken along the line A-A 'of the clad metal layer 600 shown in FIG.

Referring to FIG. 5, the clad metal layer 600 may include a first metal layer 610 and a second metal layer 630. The first metal layer 610 and the second metal layer 630 are different metallic materials. Therefore, the clad metal layer 600 can exhibit the inherent advantages of the first metal layer 610 and the second metal layer 630 at the same time.

In FIG. 5, two metal layers of the clad metal layer 600 are shown as being combined, but not limited thereto, and three or more metal layers may be combined. The clad metal layer 600 may be formed by using heat and pressure between the first metal layer 610 and the second metal layer 630.

In the clad metal layer 610, the thermal conductivity of the second metal layer 630 is preferably higher than that of the first metal layer 610. For example, it is preferable that the first metal layer 610 is made of aluminum (Al) and the second metal layer 630 is made of copper (Cu).

Generally, copper has better thermal conductivity than aluminum, but the heat release rate is not good. The heat emitted from the light emitting module 400 must be quickly moved away from the light emitting module 400. So that the lifetime of the light emitting module 400 can be extended.

For example, when the first metal layer 610 is aluminum (Al) and the second metal layer 630 is copper (Cu), the second metal layer 630 may contact the case 100 and the light emitting module 400, ≪ / RTI > In this case, when the illumination device according to the embodiment of the present invention operates, heat is generated from the light emitting module 400. The initial heat generated from the light emitting module 400 is emitted to the outside through the first metal layer 610 almost at the same time as the temperatures of the second metal layer 630 and the first metal layer 610 are increased. However, since the temperature difference between the first metal layer 610 and the case 100 becomes larger when the light emitting module 400 emits more heat after a certain period of time, .

Therefore, the illumination device according to the embodiment of the present invention can quickly dissipate the heat radiated to the light emitting module 400 to the outside, and the life of the light emitting module 400 can be prolonged.

Further, since the cladding metal layer 600 is used in the lighting apparatus according to the embodiment of the present invention, there is an advantage that the thickness and weight of the lighting apparatus can be reduced.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

100: Case
200: packing structure
300: lens structure
400: light emitting module
500: Insulation structure
600: Clad metal layer

Claims (13)

A clad metal layer;
A light emitting module including a substrate disposed on the clad metal layer and a plurality of light emitting elements disposed on an upper surface of the substrate;
A lens that is disposed on the plurality of light emitting elements and optically controls light emitted from the plurality of light emitting elements and an outer frame surrounding the outer peripheral surface of the substrate and spaced apart from the lens and the light emitting element by a predetermined distance, ;
A case covering the lens structure, coupled with the clad metal layer, and having an opening through which light passing through the lens structure is emitted;
An insulating structure disposed on the clad metal layer and disposed between the outer circumference of the outer frame of the lens structure and the case; And
And a packing structure disposed between the case and an upper surface of an outer frame portion of the lens structure,
Wherein the clad metal layer is coupled to at least two or more different metal layers.
The semiconductor device according to claim 1, wherein the clad metal layer
A first metal layer; And
A second metal layer disposed between the first metal layer and the light emitting module;
Wherein the thermal conductivity of the second metal layer is higher than the thermal conductivity of the first metal layer.
3. The method of claim 2,
Wherein the first metal layer is aluminum and the second metal layer is copper.
The method according to claim 1,
Wherein the insulating structure electrically isolates the substrate from the clad metal layer.
delete The method according to claim 1,
And a heat sink disposed between the light emitting module and the clad metal layer.
A support layer comprising an upper surface;
A light emitting module having a substrate disposed on an upper surface of the support layer and a plurality of light emitting elements arranged on an upper surface of the substrate;
A lens disposed on the plurality of light emitting devices, and an outer frame surrounding the outer circumferential surface of the substrate and spaced apart from the lens and the light emitting device by a predetermined distance;
An insulating structure disposed on the support layer and surrounding an outer circumferential surface of the outer frame portion of the lens structure;
A packing structure disposed on an upper surface of the outer frame of the lens structure; And
A case covering the packing structure and the insulating structure, and engaging with the supporting layer;
≪ / RTI >
8. The method of claim 1 or 7,
Wherein the packing structure protects the light emitting module from moisture and foreign matter.
8. The method of claim 7,
Wherein the insulating structure electrically isolates the substrate from the support layer.
8. The method of claim 1 or 7,
And the lens includes a plurality of lenses corresponding one-to-one with the plurality of light emitting elements.
8. The method of claim 1 or 7,
Wherein the packing structure is an elastic material and is pressed between the case and the lens structure.
8. The method of claim 1 or 7,
Wherein the lens comprises a phosphor.
8. The method of claim 7,
Wherein the support layer is a heat dissipation layer including a metal or an electrically insulating material and a material having thermal radiation properties.

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