KR101910912B1 - Mask unit for fabricating of organic light emitting diodes - Google Patents

Abstract

The present invention relates to a mask unit for an organic light emitting element, and more particularly to a mask unit for an organic light emitting element capable of minimizing morphological deformation of the mask unit.
A feature of the present invention is that the mask unit for forming the organic light emitting layer of the organic light emitting element is integrally formed with the first frame and the second frame defining the first opening region of the mask frame and the mask frame as a second opening portion in the form of a matrix .
This makes it possible to prevent the gap between the first frame for supporting the metal mask and the metal mask from being present, thereby preventing the displacement of the metal mask in the process of fixing the metal mask to the first frame .
Therefore, it is possible to minimize the occurrence of deformation of the mask unit due to the fixation of the metal mask and the first frame, thereby minimizing the reduction in deposition accuracy and uniformity of the organic thin film on the substrate. Finally, Thereby improving the service life and reliability.

Description

[0001] The present invention relates to a mask unit for fabricating organic light emitting diodes,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mask unit for manufacturing an organic light emitting device, and more particularly, to a mask unit for manufacturing an organic light emitting device capable of minimizing morphological deformation of a mask unit.

Until recently, CRT (cathode ray tube) was mainly used as a display device. However, a flat panel display device such as a plasma display panel (PDP), a liquid crystal display device (LCD), and an organic light emitting diode (OLED) Have been widely studied and used.

Among the above flat panel display devices, an organic light emitting element (hereinafter referred to as OLED) is a self-light emitting element, and a backlight used in a liquid crystal display device which is a non-light emitting element is not required.

In addition, it has a better viewing angle and contrast ratio than liquid crystal display devices, is advantageous in terms of power consumption, can be driven by DC low voltage, has a fast response speed, is resistant to external impacts due to its solid internal components, It has advantages.

Particularly, since the manufacturing process is simple, it is advantageous in that the production cost can be saved more than the conventional liquid crystal display device.

The OLED is a self-luminous element that emits light through the organic electroluminescent diode, and the organic electroluminescent diode emits light through the organic electroluminescent phenomenon.

FIG. 1 is a band diagram of an organic light emitting diode having an emission principle based on a general organic light emitting phenomenon, and FIG. 2 is a schematic view illustrating a displacement of a metal mask.

1, the organic light emitting diode 10 includes anode and cathode electrodes 21 and 25, a hole transport layer (HTL) 33 and an electron transport film transport layer 35 and an emission material layer 40 interposed between the hole transporting layer 33 and the electron transporting layer 35.

A hole injecting layer (HIL) 37 is interposed between the anode electrode 21 and the hole transporting layer 33 to improve the luminous efficiency. The cathode electrode 25 and the electron transporting layer 35 are interposed between the anode electrode 21 and the hole transporting layer 33, An electron injection layer (EIL) 39 is interposed therebetween.

When the positive and negative voltages are applied to the anode electrode 21 and the cathode electrode 25, the organic light emitting diode 10 has the positive holes of the anode electrode 21 and the positive electrode of the cathode electrode 25, Electrons are transported to the light emitting material layer 40 to form excitons. When the excitons are transited from the excited state to the ground state, light is generated and is emitted in the form of a visible light beam by the light emitting material layer 40.

The organic electroluminescent diode 10 having the structure described above has the hole injecting film 37, the hole transporting film 33, the light emitting material film 40, and the like, which are the remaining components except for the anode and the cathode electrodes 21 and 25. [ ), The electron transport film 35, and the electron injection film 39 are formed through a vacuum thermal deposition method.

In the vacuum thermal deposition method, heat is applied to a crucible (not shown) in which an organic material (not shown) is contained in a powder state in a vacuum chamber (not shown), and the organic material (not shown)

At this time, a thermal evaporation method using a mask (not shown) having a plurality of openings (not shown) when a plurality of organic light emitting layers having a desired pattern is used is known.

A mask (not shown) having a plurality of openings (not shown) is placed close to a substrate (not shown), and then an organic light emitting material is deposited on a substrate (not shown) through a mask Thereby forming an organic light emitting layer having a plurality of spacing patterns.

Here, the mask (not shown) is composed of a mask frame (not shown) located at a large edge portion and a metal mask 20 which is seated on a mask frame (not shown) and has a plurality of openings (not shown) The size of the mask (not shown) is also increased in accordance with the tendency of the size of the OLED to be large in recent years. In the mask frame (not shown), a large number of supports The frame 30 is constituted.

That is, the metal mask 20 is fixed on the support frame 30 of the mask frame (not shown) through a fixing method such as welding.

However, the support frame 30 and the metal mask 20 are spaced apart from each other by a certain distance due to the assembly tolerance between the support frame 30 and the mask frame (not shown).

When the support frame 30 and the metal mask 20 are fixed through a fixing method such as welding in a state where the support frame 30 and the metal mask 20 are spaced apart from each other by a predetermined distance, As shown in the drawing, the metal mask 20 is displaced in the x-axis direction and the z-axis direction defined in the drawing.

This means that shape deformation of the mask (not shown) occurs. The shape of the mask (not shown) is deformed to lower the deposition accuracy and uniformity of the organic light emitting layer on the substrate (not shown) Thereby causing a problem of lowering the lifetime and reliability of the light emitting diode 10.

SUMMARY OF THE INVENTION It is a first object of the present invention to minimize the deformation of a mask.

The second object of the present invention is to improve the accuracy and uniformity of deposition of the organic thin film and to improve the lifetime and reliability of the OLED.

In order to achieve the above object, the present invention provides a mask unit for manufacturing an organic light emitting device including an organic emission pattern positioned on a substrate having a plurality of pixel regions, A mask frame comprising a rectangular frame having a fourth edge and a first frame connecting the first and third edges facing each other across the aperture region; And a plurality of metal masks fixed on the first frame and including an opening and a shielding portion, wherein the first frame and the plurality of metal masks are in close contact with each other.

Here, the mask frame includes a second frame which is perpendicular to the first frame and is located between neighboring portions of the plurality of metal masks, and the mask frame, the first frame, and the second frame are integral.

The first frame and the plurality of metal masks are fixed by welding, the plurality of metal masks are positioned perpendicular to the longitudinal direction of the first frame, and the second and fourth edges are provided on both sides The edges are fixed.

In addition, an alignment mask is positioned on the first and third edge sides.

As described above, the mask unit for forming the organic light emitting layer of the organic light emitting diode according to the present invention includes first and second frames defining a first opening area of the mask frame and the mask frame as a second opening in the form of a matrix It is possible to prevent the gap between the first frame and the metal mask for supporting the metal mask from being spaced apart from each other and prevent the displacement of the metal mask in the process of fixing the metal mask to the first frame There is an effect that can be.

Therefore, it is possible to minimize the occurrence of morphological deformation of the mask unit due to the fixation of the metal mask and the first frame, and it is possible to minimize degradation of deposition precision and uniformity of the organic thin film on the substrate, And finally the life and reliability of the organic electroluminescent diode are improved.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a band diagram of an organic light emitting diode having an emission principle by a general organic light emitting phenomenon. FIG.
2 is a schematic view showing a displacement of a metal mask;
3 schematically illustrates a cross-section of an OLED according to an embodiment of the present invention.
4 is an enlarged cross-sectional view of an organic light emitting diode of the OLED of FIG. 3;
5 is a schematic view illustrating a structure of a vacuum deposition apparatus for depositing an organic light emitting layer according to an embodiment of the present invention.
6A is a plan view schematically showing a mask unit according to an embodiment of the present invention.
6B is a cross-sectional view taken along the line VI-VI in FIG. 6A.
7 is a perspective view schematically showing a mask frame according to an embodiment of the present invention.
8 is an enlarged cross-sectional view of the metal mask and the fixing portion of the first frame.
9 is a simulation result of comparative measurement of shape deformation of a metal mask.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

FIG. 3 is a schematic cross-sectional view of an OLED according to an embodiment of the present invention, and FIG. 4 is an enlarged view of an organic light emitting diode of the OLED of FIG.

Prior to the description, the OLED 100 is divided into a top emission type and a bottom emission type according to the transmission direction of the emitted light. The bottom emission type has high stability and high degree of freedom in the process, Studies on the bottom emission type are being actively carried out. Hereinafter, the present invention will be described by way of example with reference to the lower light emitting type OLED 100.

As shown in the figure, a plurality of driving thin film transistors DTr and organic electroluminescent diodes E are formed in the pixel region P of the OLED 100 according to the present invention.

A semiconductor layer 103 is formed on the substrate 101 of the pixel region P of the OLED 100. The semiconductor layer 103 is made of silicon and the center portion thereof is an active region And source and drain regions 103a and 103c doped with impurities at high concentration on both sides of the active region 103b.

A gate insulating film 105 is formed on the semiconductor layer 103 and a gate electrode 107 corresponding to the active region 103b of the semiconductor layer 103 is formed on the gate insulating film 105, But a gate wiring extending in one direction is formed.

The first interlayer insulating film 109a and the gate insulating film 105 under the first interlayer insulating film 109a are formed on the upper surface of the gate electrode 107 and the gate wiring (not shown) And first and second semiconductor layer contact holes 111a and 111b that respectively expose source and drain regions 103a and 103c located on both sides of the semiconductor layer 103b.

Next, upper portions of the first interlayer insulating film 109a including the first and second semiconductor layer contact holes 111a and 111b are separated from each other by a source exposed through the first and second semiconductor layer contact holes 111a and 111b, And source and drain electrodes 113 and 115 which are in contact with the source and drain regions 103a and 103c, respectively.

And a drain contact hole 117 exposing the drain electrode 115 to the upper portion of the first interlayer insulating film 109a exposed between the source and drain electrodes 113 and 115 and the two electrodes 113 and 115, An insulating film 109b is formed.

At this time, the semiconductor layer 103 including the source and drain electrodes 113 and 115 and the source and drain regions 103a and 103c contacting the electrodes 113 and 115 and the gate insulating film The gate electrode 105 and the gate electrode 107 constitute a driving thin film transistor DTr.

At this time, although not shown in the drawing, data lines (not shown) are formed which cross the gate wiring (not shown) and define the pixel region P. The switching thin film transistor (not shown) has the same structure as the driving thin film transistor DTr and is connected to the driving thin film transistor DTr.

The switching and driving thin film transistor (not shown in the drawing) DTr is shown as a top gate type in which the semiconductor layer 103 is a polysilicon semiconductor layer. As a modification thereof, Or may be formed of a bottom gate type made of silicon nitride.

The first electrode 211, the organic light emitting layer 213, and the second electrode 215 constituting the organic electroluminescent diode E are sequentially formed on the second interlayer insulating film 109b, Respectively.

The first electrode 211 is connected to the drain electrode 115 of the driving thin film transistor DTr and the first electrode 211 is formed for each pixel region P. The first electrode 211 is formed for each pixel region P, A bank (bank 119) is located in the non-pixel region between the electrodes 211.

That is, the banks 119 are formed in the matrix type of the lattice structure as a whole on the substrate 101, and the banks 119 are divided into the pixel regions P by using the banks 119 as boundaries for the pixel regions P As shown in Fig.

In such a case, the first electrode 211 is preferably formed of indium-tin-oxide (ITO), which is a relatively high work function value, to serve as an anode electrode.

The second electrode 215 is made of a conductive material having a lower work function value than the first electrode 211 to serve as a cathode.

The second electrode 215 may be formed of a metal having relatively low work function as compared with the first electrode 211 such as aluminum (Al), aluminum alloy (AlNd), silver (Ag), magnesium (Mg) Gold (Au), aluminum magnesium alloy (AlMg).

The organic light emitting layer 213 includes a hole injection layer 227, a hole transporting layer 223, a light emitting material layer 230, an electron transporting layer 225, And an electron injection layer (electron injection layer) 229.

Accordingly, when a predetermined voltage is applied to the first electrode 211 and the second electrode 215 according to the selected color signal, the OLED 100 emits the positive holes injected from the first electrode 211 and the holes injected from the second electrode 215, The excited electrons are transported to the organic light emitting layer 213 to form an exciton. When the excitons transit from the excited state to the ground state, light is emitted to emit white light in the form of a visible light ray.

Since the light emitted from the organic light emitting layer 213 passes through the transparent first electrode 211 and then exits to the outside, the OLED 100 realizes an arbitrary image.

4, an organic light emitting diode 213 according to an exemplary embodiment of the present invention will be described in more detail. The organic light emitting diode E includes a first electrode 211 as an anode electrode, an organic light emitting layer 213, Emitting material layer 213 is composed of a hole transporting film 223, a light emitting material film 230 and an electron transporting film 225.

Here, a hole injection layer 227 is further formed between the first electrode 211 and the hole transport layer 223 in order to more efficiently transfer electrons and holes to the light emitting material layer 230, It is preferable to further form the electron injection film 229 between the electrode 215 and the electron transport film 225.

A hole injection film 227 is further formed between the hole transport film 223 and the first electrode 211 and an electron injection film 229 is formed between the second electrode 215 and the electron transport film 225 The hole injecting layer 227 and the electron injecting layer 229 lower the hole injecting energy and barrier of the electron injection energy to increase the luminous efficiency and lower the driving voltage.

Accordingly, when positive and negative voltages are applied to the first electrode 211 and the second electrode 215, respectively, the organic light emitting diode E is in contact with the positive holes of the first electrode 211 and the positive Electrons of the electrode 215 are transported to the light emitting material film 230 to form excitons. When the excitons are transited from the excited state to the ground state, light is generated and emitted in the form of a visible light beam by the light emitting material film 230 do.

Here, organic materials such as the hole injection film 227, the hole transport film 223, the light emitting material film 230, the electron transport film 225, and the electron injection film 229, which are components of the organic electroluminescent diode E, The emissive layer 213 is usually formed by a vacuum thermal evaporation method. The vacuum thermal evaporation method is a method in which the crucibles 220 and 220 in which the organic material 210 (see FIG. 5) are contained in powder form in the vacuum chamber 200 5) is heated to sublimate the organic material 210 (see FIG. 5).

FIG. 5 is a schematic view of a vacuum deposition apparatus for depositing an organic light emitting layer according to an embodiment of the present invention. Referring to FIG.

As shown in the figure, the vacuum deposition apparatus has a chamber 200 defining an enclosed reaction region A as an essential component, and a crucible 220 containing the organic material 210 and a first And the substrate 101 on which the electrodes (211 in Fig. 4) are formed are arranged to face each other.

A mask unit 300 having an opening (not shown) in a region corresponding to an area where the organic thin film is to be formed on the substrate 101 and a substrate (not shown) And a plate 230 is provided at a position facing the mask unit 300 with a space therebetween.

Mounting portions 240a and 240b for supporting the substrate 101 and the mask unit 300 are provided in the chamber 200 and the substrate 101 and the mask unit 300 are mounted on the outside of the chamber 200. [ A CCD camera 250 for alignment is provided.

A heater (not shown) is provided on both sides of the crucible 220 to heat the crucible 220 to heat the organic material 210 contained in the crucible 220.

The plate 230 is disposed on the rear surface of the substrate 101 so as to face the crucible 220 and defines a front surface of the substrate 101 on which the organic thin film is deposited. And the mask unit 300, as shown in FIG.

The discharge plate 260 may further include an organic material 210 that is not deposited on the substrate 101 among the organic materials 210 ejected from the crucible 220 210 from being adsorbed on the inner wall of the chamber 200.

The deposition process of the organic light emitting layer 213 shown in FIG. 4 is performed by supplying power to a heater (not shown) in a state where the organic material 210 is contained in the crucible 220, The organic material 210 is heated and sublimed into the chamber 200. The organic material 210 is heated to a temperature higher than a predetermined temperature.

The organic material 210 ejected from the crucible 220 is supplied to the substrate 101 on which the first electrode 211 of FIG. 4 is formed through an opening (not shown) formed in the mask unit 300, And is deposited.

This process is repeated to deposit an organic light emitting layer 213 (FIG. 4) on the entire surface of the substrate 101.

Meanwhile, as the size of the OLED (100 in FIG. 3) becomes larger, the size of the vacuum deposition apparatus itself becomes larger and the size of the mask unit 300 becomes larger. In the embodiment of the present invention The mask unit 300 according to the present embodiment minimizes warping and sagging even when the mask unit 300 is enlarged so that the deposition accuracy and uniformity of the organic light emitting layer 213 Can be prevented.

This improves the lifetime and reliability of the organic electroluminescent diode (E in FIG. 4).

FIG. 6A is a plan view schematically showing a mask unit according to an embodiment of the present invention, and FIG. 6B is a sectional view taken along the line VI-VI in FIG. 6A.

The mask unit 300 includes a mask frame 310 having a substantially rectangular shape and a plurality of metal masks 320 mounted on the mask frame 310 in a flat plate shape having a predetermined thickness.

The mask frame 310 includes first to fourth edges 310a, 310b, 310c, and 310d having a predetermined thickness in a square shape having a first opening area G1 in a substantially rectangular shape at the center.

The mask frame 310 includes a first frame 311 connecting the second and fourth edges 310b and 310d facing each other across the first opening area G1 and a second frame 311 perpendicular to the first frame 311 And a second frame 313 connecting the first and third edges 310a and 310c facing each other across the first opening region G1.

A plurality of divided metal masks 320 are disposed in the first opening area G1 of the mask frame 310. Each of the metal masks 320 is arranged to be parallel to the longitudinal direction of the second frame 313 Each metal mask 320 is fixed to the first and third edges 310a and 310c of the mask frame 310 at both side edges thereof.

At this time, it is preferable that each of the metal masks fixed to the mask frame is fixed by applying a tensile force so as to maintain sufficient flatness.

Each of the metal masks 320 has a predetermined size corresponding to the display area of the pattern for the organic light emitting element so that the organic material (210 in FIG. 5) that is heated and sublimated at a predetermined distance along the longitudinal direction can pass through. And a shielding portion 323 between the opening portion 321 and the opening portion 321.

Each of the metal masks 320 is preferably formed of a material having a sufficient stiffness, a low thermal expansion coefficient, and a magnetic property. Specifically, it may be made of nickel (Ni) or a nickel alloy such as a nickel-cobalt alloy (Ni-Co alloy).

At this time, each of the metal masks 320 is formed to have a width corresponding to an area between adjacent second frames 313, and the second frame 313 is positioned between the respective metal masks 320.

The second frame 313 serves to prevent a space between the metal masks 320 from being opened.

That is, the second frame 313 is disposed between neighboring metal masks 320 so that the space between the metal masks 320 is not opened, so that the pattern for the organic light emitting element on the substrate 101 (210 in FIG. 5) is deposited in a region other than the display region.

At this time, the alignment mask 330 may be fixed to both side portions corresponding to the second and fourth edges 310b and 310d of the mask frame 310 in parallel with the respective metal masks 320. [

The alignment mask 330 corresponds to the second and fourth edges 310b and 310d opposed to each other among the four edges 310a, 310b, 310c and 310d of the mask frame 310 in the first opening area G1 A part of which is overlapped with the first opening area G1 and a part of which is located above the second and fourth edges 310b and 310d.

The alignment mask 330 may have a separate alignment mark (not shown) in each of the regions overlapping the first opening region G1 and the regions located above the second and fourth edges 310b and 310d The mask frame 310 and the respective metal masks 320, as well as aligning the substrate (101 of FIG. 5) and the mask unit 300.

The alignment mask 330 may be welded to the second and fourth edges 310b and 310d of the mask frame 310 and may be fixed to be detachable with a bolt or the like.

At this time, each metal mask 320 is fixed by a fixing method such as welding on the first frame 311 which crosses the first opening area G1 of the mask frame 310 in order to fix the metal mask 320 more stably Lt; / RTI >

That is, the first frame 311 connecting the second and fourth edges 310b and 310d across the first opening area G1 of the mask frame 310 is positioned in the longitudinal direction of each metal mask 320 So as to support a part of the rear surface of each metal mask 320.

At this time, the first frame 311 is positioned corresponding to the shielding portion 323 of each metal mask 320, so that the first frame 311 does not cover the opening portion 321 of the metal mask 320 .

The first frame 311 fixes the respective metal masks 320 and minimizes warping or deflection of the metal mask 320 with respect to the gravitational direction.

At this time, one surface of each metal mask 320 is fixed so that the mask frame 310 and the first frame 311 are all flush with each other without a step. Thus, it is possible to minimize the occurrence of deformation of the mask unit 300 in the course of fixing each metal mask 320.

FIG. 7 is a perspective view schematically showing a mask frame according to an embodiment of the present invention, and FIG. 8 is an enlarged cross-sectional view of a fixing portion of the metal mask and the first frame.

As shown in the drawing, the mask frame 310 has a rectangular frame shape having a first opening area G1 in a substantially rectangular shape at the center, and has first to fourth edges 310a, 310b, 310c, and 310d And first and second frames 311 and 313 connecting the edges opposite to each other across the first opening region G1.

That is, the first frame 311 connects the second and fourth edges 310b and 310d facing each other across the first opening area G1 of the mask frame 310, and the second frame 313 The first and third edges 310a and 310c are connected to each other across the first opening area G1 perpendicularly to the first frame 311. [

Here, the first frame 311 and the second frame 313 intersect with each other to define a second opening area G2 in the form of a matrix. The number of the second opening areas G2 is equal to the number of the first and second The number of the first and second frames 311 and 313 may vary depending on the number of display regions of the organic light emitting element to be formed on the substrate 101 It can be different.

At this time, the mask frame 310 and the first and second frames 311 and 313 are integrally formed through injection molding using a metal mold.

The mask frame 310 and the first and second frames 311 and 313 serve to fix and support the plurality of metal masks 320. The plurality of metal masks 320 may be maintained in a stable state Therefore, it is preferable that it is made of a material having sufficient rigidity.

The mask frame 310 and the first and second frames 311 and 313 may be formed of a mold material or a metal material.

The mask frame 310 and the first and second frames 311 and 313 are integrally formed of the same material so that the first and second frames 311 and 313 are formed at the same ratio as the mask frame 310, The two frames 311 and 313 are expanded and contracted so that a tensile force due to a difference in thermal expansion coefficient between the mask frame 310 and the first and second frames 311 and 313 is transmitted to the first and second frames 311 and 313, So that the occurrence of warpage of the first and second frames 311 and 313 can be minimized.

As a result, the morphological deformation of the mask unit (300 in Fig. 6B) can be minimized, and the flatness can be increased.

Particularly, since the mask frame 310 and the first and second frames 311 and 313 are integrally formed, one surface of the mask frame 310 and the first and second frames 311 and 313, to which the metal mask 320 is attached, , And 313 are formed so as to be coplanar without any step.

8, each of the metal masks 320 and the first frame 311 are in close contact with each other, so that there is no gap between the metal mask 320 and the first frame 311, It is possible to minimize the occurrence of displacement of the metal mask 320 in the process of fixing each metal mask 320 to the first frame 311 through a fixing method such as welding.

This makes it possible to minimize the occurrence of deformation of the mask unit (300 in FIG. 6B) due to the fixation of the metal mask 320 and the first frame 311, The decrease in the deposition precision and uniformity of FIG. 4 (213) can be minimized, and finally the life and reliability of the organic light emitting diode (E in FIG. 4) can be improved.

9 is a simulation result of comparative measurement of morphological deformation of the metal mask.

Prior to the explanation, Sample 1 is a simulation result in which morphological deformation of a metal mask of a mask unit in which a support frame and a metal mask are spaced apart from each other by a predetermined distance is measured. Sample 2 is a mask sample, And the second frame are integrally formed, the first frame and the metal mask measure the shape deformation of the metal mask of the mask unit in close contact with each other.

Referring to FIG. 9A, it can be seen that the shape of the metal mask of Sample 1 is deformed by 30.193 μm, while the shape of the metal mask of Sample 2 is deformed by 20.197 μm.

As a result, it can be seen that the morphological deformation of the metal mask of Sample 2 is reduced by about 32% as compared with the morphological deformation of the metal mask of Sample 1.

That is, in the case where the support frame and the metal mask are spaced apart from each other by a predetermined distance, compared with the metal mask in which displacement occurs in fixing the metal mask to the support frame, The first frame and the metal mask are brought into close contact with each other so that no gap is formed between the first frame and the metal mask so that the metal having no displacement in the process of fixing the metal mask to the first frame The mask type deformation is less likely to occur.

It is understood that the morphological deformation of the metal mask is small, which means that the morphological deformation of the mask unit is small, so that the morphological deformation of the mask unit according to the embodiment of the present invention is minimized.

As described above, the mask unit (300 in FIG. 6B) for forming the organic light emitting layer (213 in FIG. 4) of the OLED of the present invention (100 in FIG. 3) 7) defining the first opening region (G1 in Fig. 7) of the second opening (310 in Fig. 7) as a second opening portion (G2 in Fig. 7) , It is possible to prevent a gap between the first frame (311 in Fig. 8) and the metal mask (320 in Fig. 8) for supporting the metal mask (320 in Fig. 8) ) Is fixed to the first frame (311 in Fig. 8), displacement of the metal mask (320 in Fig. 8) can be prevented from occurring.

This can minimize the occurrence of deformation of the mask unit (300 in Fig. 6B) due to the fixation of the metal mask (320 in Fig. 8) and the first frame (311 in Fig. 8) It is possible to minimize the decrease in the deposition accuracy and uniformity of the organic light emitting layer (213 in FIG. 4) on the organic light emitting diodes (OLEDs) 101 and ultimately to improve the lifetime and reliability of the organic electroluminescent diode (E in FIG.

The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the present invention.

310: mask frames 310a, 310b, 310c, and 310d (first to fourth edges)
311: first frame, 313: second frame
G1: first opening region, G2: second opening region

Claims (6)

A mask unit for manufacturing an organic light emitting device including an organic light emitting pattern located on a substrate having a plurality of pixel regions,
A mask frame having a rectangular frame shape comprising first to fourth edges defining an aperture region, the first frame connecting the first and third edges facing each other across the aperture region;
A plurality of metal masks fixed on the first frame,
Wherein the first frame and the plurality of metal masks are in close contact with each other,
Wherein the mask frame comprises a second frame that is perpendicular to the first frame and is located between neighboring ones of the plurality of metal masks,
The width between the neighboring second frames corresponds to the width of the metal mask so that the second frame is located between neighboring metal masks,
Wherein the mask frame, the first frame and the second frame are integrally formed, one surface of the mask frame, the first frame and the second frame are coplanar,
The first and second alignment masks are located on the first and third edge sides, respectively,
Wherein the first and second alignment masks each include a first region overlapping the first and third edges and a second region overlapping the opening region,
And the plurality of metal masks are positioned between the first and second alignment masks.
delete delete The method according to claim 1,
Wherein the first frame and the plurality of metal masks are fixed by welding.
The method according to claim 1,
Wherein the plurality of metal masks are positioned perpendicular to the longitudinal direction of the first frame, and both side edges are fixed to the second and fourth edges.
The method according to claim 1,
And the alignment marks are respectively positioned in the first and second regions.

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