KR101949672B1 - Compact mmWave power amplifier with three dimensional structure - Google Patents

Abstract

The present invention relates to an amplifier structure capable of reducing the size and weight while improving thermal efficiency by forming a high-power amplifier used in a microwave high-power transmitter including a millimeter wave used in a moving object or a moving object by using a three-dimensional structure. To this end, the present invention is configured such that an amplification unit is disposed on two opposite surfaces of a metal hexahedron, and a waveguide splitter and a coupler are provided on two surfaces perpendicularly connected to the amplification unit.

Description

[0001] The present invention relates to a compact millimeter wave power amplifier having a three-dimensional structure,

The present invention relates to a compact millimeter wave high power amplifier having a three-dimensional structure used in a very high frequency high power transmitter.

Generally, a microwave amplifier used in satellite communication can obtain a desired large output power by connecting a power divider and a coupler to a plurality of amplifier elements generating small output power in order to obtain a large power.

mmWave, that is, the spectrum of millimeter waves refers to a band between 30 GHz and 300 GHz. When the power combiner or the splitter is implemented using a circuit board (PCB substrate) used in a low frequency band because the wavelength of the millimeter wave signal is very short, it is difficult to obtain desired characteristics due to a large loss of the assembly process or the substrate itself. In order to solve such a problem, a power combiner or a divider of such a microwave amplifier is often used as a waveguide type. This type of microwave amplifier is basically implemented with a metal such as aluminum.

Also, in general, a very high frequency amplifier generates a lot of heat when it absorbs the power energy of the high frequency signal and converts it into heat. Therefore, in order to discharge the internal heat of the amplifier to the outside, a heat dissipating device such as a heat sink and a cooling fan is required.

Therefore, metal materials and heat dissipation devices increase the size and weight of high-power amplifiers. Therefore, it is necessary to develop a technology capable of solving heat / size / weight problems at the same time.

Patent Document 1 refers to a technique in which a high frequency transmitter solves the problem of heat dissipation of a high output device through structural modification of an ODU. In order to effectively dissipate heat in a region where heat is generated as in a high output device such as an amplifier, The structure is added.

Such a conventional technique has an effect of improving the heat dissipation characteristics in a region where a large amount of heat is not emitted by adding a heat dissipating structure specialized for a device that emits a large amount of heat. However, since the heat sink is provided in both the upper and lower portions, that is, the structure for discharging the heat to the upper and lower portions, there is a limitation in miniaturization and weight reduction.

Japanese Patent Application Laid-Open No. 2000-013063

SUMMARY OF THE INVENTION It is an object of the present invention to provide a millimeter-wave high-power amplifier which realizes a millimeter-wave high-power amplifier in a three-dimensional structure, thereby greatly reducing its size and weight.

Further, the present invention is to provide a millimeter wave high power amplifier which improves the space utilization and minimizes the coupling loss of component parts by realizing a high output amplifier by making maximum use of the surface of the three-dimensional structure.

Also, the present invention provides a millimeter wave high power amplifier which connects an amplifier module constituting an amplifier, a waveguide distributor, a combiner, and a heat dissipation structure by a single body to enhance a heat dispersion effect and a cooling efficiency.

The present invention relates to a compact millimeter wave high power amplifier having a three-dimensional structure, comprising: an amplifying part disposed on first and second metal plates facing each other; And a waveguide distributor and a coupler connected to the first and second metal plates, respectively, and formed on the third and fourth metal plates facing each other, respectively.

Also, the amplification unit may include one or more amplifier modules arranged in parallel on a substrate, and the amplifier module may include one or more amplifier elements.

The waveguide distributor and the coupler formed on the third metal plate are formed with a plurality of signal input ports for inputting signals and the waveguide distributor and the coupler formed on the fourth metal plate have a plurality of signal output ports formed at the center, The ends of the waveguide distributor and the coupler formed on the third and fourth metal plates are connected to the one or more amplifier modules, and the one or more amplifier modules are arranged such that a signal received through the plurality of signal input ports is transmitted to the plurality of signal output ports As shown in FIG.

Here, the millimeter wave high-power amplifier may include a heat dissipation unit, and the heat dissipation unit may be integrally formed with the inside or outside of the body formed by the first, second, third, and fourth metal plates, or the body.

The heat dissipation unit is formed on fifth and sixth plates which are perpendicularly connected to the first and second metal plates and the waveguide distributor and the third and fourth metal plates on which the coupler is formed, A plurality of cooling holes are formed in the sixth metal plate, and a cooling fan is installed in the fifth or sixth metal plate.

The millimeter wave high power amplifier may include a housing coupled to a metal plate on which the cooling fan is installed and having a plurality of holes.

The amplifier unit includes an amplifier cover formed in a hollow portion corresponding to the amplifier element and the signal line and closely coupled to the amplifier unit. The waveguide distributor and the coupler are connected to signal input and output ports of the waveguide distributor and the coupler, And a waveguide distributor and a combiner cover which are formed in a corresponding hole and are closely coupled to the metal plate on which the waveguide distributor and the coupler are formed.

The present invention can constitute a very high-frequency high-power amplifier with a relatively narrower area than the conventional high-power amplifier, thereby greatly reducing the size and weight of the amplifier.

Further, the present invention realizes a high-power amplifier by making maximum use of the surface of the three-dimensional structure, thereby improving space utilization and minimizing coupling loss of component parts.

In addition, the present invention has the effect of maximizing the heat dispersion effect and the cooling efficiency by connecting the amplifier module constituting the amplifier, the waveguide distributor, the coupler, and the heat dissipation structure with one body.

Further, according to the present invention, a plurality of holes are formed on two surfaces of a hexahedron to realize a heat dissipation structure, so that the weight of the very high frequency power amplifier can be reduced as much as possible.

FIG. 1 is a diagram showing a three-dimensional diagram of a compact millimeter wave power amplifier having a three-dimensional structure according to an embodiment of the present invention.
FIG. 2 is a perspective view of a compact millimeter wave high-power amplifier having a three-dimensional structure according to an embodiment of the present invention in a state in which a protective cover is removed. FIG.
3 is a view showing a state in which each side of a compact millimeter wave power amplifier having a three-dimensional structure according to an embodiment of the present invention is opened.
4 is a diagram illustrating a signal flow of a compact millimeter wave power amplifier having a three-dimensional structure according to an embodiment of the present invention.
5 is a view illustrating an amplifier unit and an amplifier cover of a compact millimeter wave high-power amplifier having a three-dimensional structure according to an embodiment of the present invention.
6 is a view showing a waveguide splitter and a coupler and a cover of a compact millimeter wave power amplifier having a three-dimensional structure according to an embodiment of the present invention.
7 is a view illustrating a structure of a heat dissipation unit of a compact millimeter wave high power amplifier having a three-dimensional structure according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

Accordingly, it is to be understood that the invention is capable of numerous changes, has various embodiments, and includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown.

The terms first, second, etc. may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may be referred to as a first component.

And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

The terms used in the present invention are used only to describe specific embodiments and are not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present invention, the terms "comprising" or "having ", and the like, specify that the presence of stated features, integers, steps, operations, elements, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries should be construed as meaning consistent with meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present invention Do not.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms and the inventor may appropriately define the concept of the term in order to best describe its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

The millimeter wave high power amplifier of the present invention can be implemented as a body vertically connected to four metal plates 130, 230, 310 and 410 in which the amplifiers 100 and 200 and the waveguide distributor and couplers 300 and 400 are formed. When the body of the amplifier is implemented, various types of heat dissipation structures can be applied, such as adding a metal heat dissipating plate, which has a basic heat dissipating effect, and which is formed inside and / or outside the body.

In the present invention, a configuration in which the metal plate is configured as a hexahedron and the amplification unit, the waveguide splitter, the coupler, and the heat dissipation unit are both implemented in the hexahedron will be described.

1 to 3, a millimeter wave amplifier 10 according to the present invention includes amplifiers 100 and 200, a waveguide splitter and combiner 300 and 400, and a heat dissipation Structures 500, 510, 520, 530, 600, 610 are all included on the hexahedron.

The hexahedron may be formed by integrally connecting metal plates 130, 230, 310, 410, 500, and 600 having a predetermined thermal conductivity, such as aluminum.

Referring to FIGS. 2 and 3, the amplifying units 100 and 200 may be disposed on the top plate 130 and the bottom plate 230 of the hexahedron. At the top, one or more amplifier modules 110 and 120 may be arranged in parallel. Similarly, one or more amplifier modules 210 and 220 may be arranged in parallel at the bottom. Each of the amplifier modules 110, 120, 210, and 220 includes one or more amplifier elements, and each amplifier element is connected through a signal line on a PCB (Printed Circuit Board) substrate.

2 and 3, the waveguide distributor and couplers 300 and 400 may include a plate vertically connected to the upper plate 130 and the lower plate 230 on which the amplifiers 100 and 200 are disposed, May be formed on the left and right plates 310 and 410 of the hexahedron. By implementing the amplification units 100 and 200 and the waveguide splitter 300 and the combiner 300 in one body, it is possible to minimize coupling loss between the components of the high-power amplifier without mutual seams.

The waveguide distributor and the couplers 300 and 400 are connected to a part for inputting or outputting a signal and are connected to the metal plates (110, 120, 210 and 220) 310, and 410, respectively.

Referring to FIGS. 2 to 4 and 6, a millimeter wave signal may be input to or output from the waveguide distributor and the couplers 300 and 400 through a plurality of signal input holes formed in the waveguide distributor and the coupler covers 320 and 420 have.

3, through the signal input ports Pin1 to Pin4 of the waveguide distributor and combiner 300 located between the upper first amplifying unit 100 and the second amplifying unit 200 in FIG. 4, When a millimeter wave signal is input, the signal is input to each of the amplifier modules 110, 120, 210, and 220 of the amplifiers 100 and 200 along the waveguide distributor and the combiner 300. Accordingly, the waveguide distributor and combiner 300 may serve as a signal distributor.

The millimeter wave signal amplified by the amplification units 100 and 200 enters a waveguide distributor and a coupler 400 connected to the ends of the amplifier modules 110, 120, 210 and 220 and is connected to signal output ports Pout to Pout4. . Accordingly, the waveguide splitter and combiner 400 may serve as a signal combiner.

Meanwhile, a lot of heat is generated in the process of amplifying the millimeter wave signal. Therefore, a heat dissipation structure for efficiently cooling the heat in the very high frequency high power amplifier may be necessary. Referring to FIGS. 2, 3 and 7, a plurality of cooling holes 510 and 610 are formed in the front and rear plates 500 and 600 of the microwave amplifier 10 of FIG. Since the cooling holes formed in the hexahedron are connected to the amplification units 100 and 200 formed on the other surface and the waveguide distributor and the couplers 300 and 400 through a single body, a natural heat dispersion effect is obtained. Further, as shown in the drawing, if a plurality of cooling holes are formed in a long bar shape, the cooling efficiency can be further increased.

Referring to FIGS. 1 and 2, a cooling fan 520 may be installed on a plate 500 having a cooling hole 510 on the front surface of the amplifier 10. The amplifier 10 is coupled to a front edge portion of the plate 500 or the upper and lower amplifying parts 100 and 200 and the left and right waveguide distributors 300 and 400 having the cooling fan 520, The housing 530 may be formed of a metal material. The housing 530 is also made of a metal plate, and can disperse heat generated in the amplifier, the waveguide distributor, and the coupler. Here, a cooling hole may be selectively added to the side surface of the housing 530 as occasion demands. Accordingly, the cooling air is continuously circulated by the cooling fan 160, thereby further improving the cooling efficiency of the hexahedral millimeter wave amplifier of the present invention.

Referring to FIGS. 5 and 6, the amplifiers 100 and 200 and the waveguide distributor and couplers 300 and 400 have covers 140, 240, 310 and 410, and are covered by the cover. The cover is made of a metal such as aluminum and can serve to shield electromagnetic waves. Millimeter waves and other very high frequencies can have a large influence on the circuit elements.

Therefore, the covers 140, 240, 310, and 410 of the amplifiers 100 and 200 and the waveguide distributor 300 and the couplers 300 and 400 can be completely attached to the plate on which the waveguide distributor and coupler are formed.

The covers 113 and 114 of the amplification units 100 and 200 are connected to amplifiers in the amplification unit cover in order to completely shield the electromagnetic waves generated from the amplifier modules 110, 120, 210 and 220, A hollow corresponding to the device and the signal line may be formed. The portion other than the hollow portion is closely contacted so as to shield the electromagnetic wave.

In FIGS. 5 and 6, the plurality of holes formed in each cover can be tightened by combining the covers using screws or the like.

10: Three-Dimensional Small Millimeter Wave Power Amplifier
100:
110: first amplifier module
120: second amplifier module
130: first metal plate
140: First amplification section cover
200:
210: third amplifier module
220: fourth amplifier module
230: second metal plate
240: Second amplifier cover
300: First waveguide splitter and combiner
310: third metal plate
320: first waveguide splitter and coupler cover
Pin1 ~ Pin4: Input port
400: second waveguide splitter and combiner
410: fourth metal plate
420: second waveguide splitter and coupler cover
Pout1 to Pout4: output port
500: fifth metal plate
510: cooling hole
520: Cooling fan
530: Housing
600: Sixth metal plate
610: cooling hole

Claims (7)

An amplification unit disposed on the first and second metal plates facing each other; And
A waveguide distributor and a coupler connected perpendicularly to the first and second metal plates and respectively formed on third and fourth metal plates facing each other; And
And a heat dissipation unit formed integrally with the inside or outside of the body formed by the first, second, third, and fourth metal plates,
The heat dissipation unit is formed on fifth and sixth plates which are perpendicularly connected to the first and second metal plates and the waveguide distributor and the third and fourth metal plates on which the coupler is formed, A plurality of cooling holes are formed in the sixth metal plate, and a cooling fan is installed in the fifth or sixth metal plate, respectively. The method according to claim 1,
Wherein the amplifying unit includes one or more amplifier modules arranged in parallel on a substrate, and the amplifier module includes one or more amplifier elements. 3. The method of claim 2,
The waveguide distributor and the coupler formed on the third metal plate are formed with a plurality of signal input ports for inputting signals,
The waveguide distributor and the coupler formed on the fourth metal plate have a plurality of signal output ports formed at the center thereof,
The ends of the waveguide distributor and combiner formed on the third and fourth metal plates are connected to the one or more amplifier modules,
Wherein the at least one amplifier module is arranged such that a signal input through the plurality of signal input ports is outputted through the plurality of signal output ports. delete delete The method according to claim 1,
The millimeter wave high power amplifier
And a housing coupled to the metal plate on which the cooling fan is installed and having a plurality of holes formed therein. 3. The method of claim 2,
The amplifier unit includes an amplifier cover formed in a hollow portion corresponding to the amplifier element and the signal line and closely coupled to the amplifier unit. The waveguide distributor and the coupler are connected to signal input and output ports of the waveguide distributor and the coupler, And a waveguide splitter and a combiner cover which are formed on the waveguide splitter and the waveguide splitter and are coupled to the waveguide splitter and the metal plate on which the waveguide splitter is formed.

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