KR101956061B1 - Display device - Google Patents

Abstract

A display device is started. The display device comprises: a first circuit substrate; A second circuit board disposed on the first circuit board; A plurality of first light emitting parts interposed between the first circuit board and the second circuit board and connected to the first circuit board; And a plurality of second light emitting portions interposed between the first circuit substrate and the second circuit substrate, the second light emitting portions being connected to the second circuit substrate and disposed between the first light emitting portions.

Description

Display device {DISPLAY DEVICE}

The embodiment relates to a display device.

Recently, flat panel display devices such as a liquid crystal display (LCD), a plasma display panel (PDP), and an organic light emitting diode (OLED) have been developed in place of the conventional CRT.

The liquid crystal display device includes a thin film transistor substrate, a color filter substrate, and a liquid crystal display panel in which liquid crystal is injected between both substrates. Since the liquid crystal display panel is a non-light emitting device, a backlight unit for supplying light to the bottom surface of the thin film transistor substrate is positioned. The amount of light irradiated from the backlight unit is adjusted according to the alignment state of the liquid crystal.

The backlight unit is divided into edge type and direct type according to the position of the light source. The edge type is a structure in which a light source is provided on a side surface of the light guide plate.

The direct type is a structure that is mainly developed with the size of a liquid crystal display device being enlarged. One or more light sources are arranged on the lower surface of the liquid crystal display panel to supply light to the liquid crystal display panel.

The direct-type backlight unit has advantages in that it can utilize a larger number of light sources than the edge-type backlight unit and can secure a high luminance, but has a disadvantage that the thickness becomes thicker than the edge type in order to ensure uniformity of brightness have.

In order to overcome this problem, a quantum dot bar in which a plurality of quantum dots dispersed in a red wavelength or a green wavelength is dispersed is provided in front of a blue LED emitting blue light constituting a backlight unit, Thus, light mixed with blue light, red light and green light by a plurality of quantum dots dispersed in the quantum dot bar is incident on the light guide plate to provide white light.

At this time, when white light is provided to the light guide plate using the quantum dot bar, high color reproduction can be realized.

The backlight unit may include an FPCB (Flexible Printed Circuits Board) for transmitting and supplying LEDs and signals to one side of a blue LED emitting blue light, and an adhesive member may be further provided on the lower surface of the FPCB.

As such, when a light emitted from a blue LED is leaked, a display device for displaying an image in various forms using white light provided to the light guide plate through the quantum dot bar is widely used.

A display device to which such a quantum dot is applied is disclosed in Korean Patent Laid-Open Publication No. 10-2011-0068110.

The embodiment intends to provide a display device having improved luminance and reliability.

A display device according to an embodiment includes a first circuit substrate; A second circuit board disposed on the first circuit board; A plurality of first light emitting parts interposed between the first circuit board and the second circuit board and connected to the first circuit board; And a plurality of second light emitting portions interposed between the first circuit substrate and the second circuit substrate, the second light emitting portions being connected to the second circuit substrate and disposed between the first light emitting portions.

The display device according to the embodiment connects the first light emitting portions and the second light emitting portions to the first circuit substrate and the second circuit substrate arranged up and down, and alternately arranges the first light emitting portions and the second light emitting portions.

Accordingly, the first light emitting units and the second light emitting units can be arranged closely to one another. In particular, the first light emitting portion is connected to the first circuit board, and the second light emitting portions are connected to the second circuit board. Further, the first light emitting portion and the second light emitting portion are alternately arranged.

Accordingly, the gap between the first light emitting portions in the first circuit board can be sufficiently spaced. Accordingly, the first light emitting units can be connected to the first circuit board in a margin. Likewise, the interval between the second light emitting portions in the second circuit board can be sufficiently spaced. Accordingly, the second light emitting units can be connected to the second circuit board in a margin.

Therefore, the first light emitting portions and the second light emitting portions can be arranged closely to each other without being restricted by the first circuit substrate and the second circuit substrate. Therefore, the first light emitting portions and the second light emitting portions can cause light to be incident on the light guide plate with high luminance. The display device according to the embodiment can have an improved luminance.

1 is an exploded perspective view showing a liquid crystal display device according to an embodiment.
2 is an exploded perspective view showing a light guide plate, a wavelength converting member, light emitting diodes, a fixing member, and the like.
FIG. 3 is a cross-sectional view showing a section cut along AA 'in FIG. 2. FIG.
4 is a perspective view showing a wavelength conversion member according to an embodiment.
FIG. 5 is a cross-sectional view showing a section cut along BB 'in FIG.
6 is a cross-sectional view illustrating one side of a light guide plate, a light emitting diode, and a wavelength conversion member according to an embodiment.
7 is a view showing a process of folding a flexible printed circuit board.

In the description of the embodiments, it is described that each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, In this case, "on" and "under " all include being formed either directly or indirectly through another element. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view showing a liquid crystal display device according to an embodiment. 2 is an exploded perspective view showing a light guide plate, a wavelength converting member, light emitting diodes, a fixing member, and the like. 3 is a cross-sectional view showing a section taken along line A-A in Fig. 4 is a perspective view showing a wavelength conversion member according to an embodiment. 5 is a cross-sectional view showing a section taken along the line B-B 'in FIG. 6 is a cross-sectional view illustrating one side of a light guide plate, a light emitting diode, and a wavelength conversion member according to an embodiment. 7 is a view showing a process of folding a flexible printed circuit board.

1 to 7, a liquid crystal display according to an embodiment includes a backlight unit 10 and a liquid crystal panel 20.

The backlight unit 10 emits light to the liquid crystal panel 20. The backlight unit 10 is a surface light source and can uniformly irradiate the bottom surface of the liquid crystal panel 20 with light.

The backlight unit 10 is disposed under the liquid crystal panel 20. The backlight unit 10 includes a bottom cover 100, a light guide plate 200, a reflective sheet 201, a light source such as a plurality of light emitting diodes 300, a printed circuit board 400, ), A housing (600), a wavelength converting member (700), and a plurality of optical sheets (800).

The bottom cover 100 has a top opened shape. The bottom cover 100 may include the light guide plate 200, the light emitting diodes 300, the printed circuit board 400, the fixing unit 500, the housing 600, the reflective sheet 201, And accommodates the optical sheets 800.

The light guide plate 200 is disposed in the bottom cover 100. The light guide plate 200 is disposed on the reflective sheet 201. The light guide plate 200 emits light upward from the light emitting diodes 300 through total reflection, refraction, and scattering.

The reflective sheet 201 is disposed under the light guide plate 200. More specifically, the reflective sheet 201 is disposed between the light guide plate 200 and the bottom surface of the bottom cover 100. The reflective sheet 201 reflects light emitted from the lower surface of the light guide plate 200 upward.

The light emitting diodes 300 are light sources for generating light. The light emitting diodes 300 are disposed on one side of the light guide plate 200. The light emitting diodes 300 generate light to be incident on the light guide plate 200 through the side surface of the light guide plate 200.

The light emitting diodes 300 may be a blue light emitting diode for generating blue light or a UV light emitting diode for generating ultraviolet light. That is, the light emitting diodes 300 may generate blue light having a wavelength range of about 430 nm to about 470 nm or ultraviolet light having a wavelength range of about 300 nm to about 400 nm.

The light emitting diodes 300 are mounted on the printed circuit board 400. The light emitting diodes 300 are disposed below the printed circuit board 400. The light emitting diodes 300 are driven by receiving driving signals through the printed circuit board 400.

The printed circuit board 400 is electrically connected to the light emitting diodes 300. The printed circuit board 400 may mount the light emitting diodes 300. The printed circuit board 400 is disposed inside the bottom cover 100. In more detail, the printed circuit board 400 is disposed within the housing 600.

The printed circuit board 400 is flexible. The printed circuit board 400 may be a flexible printed circuit board (FPCB). That is, the printed circuit board 400 can be bent easily. The printed circuit board 400 includes a first printed circuit board 410, a second printed circuit board 420, and a connecting board 430.

The first printed circuit board 410 is opposed to the second printed circuit board 420. More specifically, the first printed circuit board 410 faces the second printed circuit board 420. The first printed circuit board 410 may have a shape extending in one direction.

The second printed circuit board 420 is opposed to the first printed circuit board 410. The second printed circuit board 420 is disposed on the first printed circuit board 410. The second printed circuit board 420 may be substantially parallel to the first printed circuit board 410. In addition, the second printed circuit board 420 may be entirely overlapped with the first printed circuit board 410.

The connection board 430 is connected to the first printed circuit board 410 and the second printed circuit board 420. That is, the connection board 430 electrically connects the first printed circuit board 410 and the second printed circuit board 420.

In addition, the connection board 430 physically connects the first printed circuit board 410 and the second printed circuit board 420. The connecting board 430 is bent from the first printed circuit board 410 and extends to the second printed circuit board 420. More specifically, the connection board 430 is bent from an end of the first printed circuit board 410 and extends to an end of the second printed circuit board 420.

In addition, the first printed circuit board 410, the second printed circuit board 420, and the connection board 430 may be integrally formed. That is, the first printed circuit board 410, the second printed circuit board 420, and the connecting board 430 may be separated by bending a single flexible printed circuit board.

The light emitting diodes 300 may be divided into first light emitting diodes 310 and second light emitting diodes 320.

The first light emitting diodes 310 are connected to the first printed circuit board 410. More specifically, the first light emitting diodes 310 are mounted on the first printed circuit board 410. That is, the first light emitting diodes 310 may be connected to the first printed circuit board 410 by solder or the like.

The second light emitting diodes 320 are connected to the second printed circuit board 420. In more detail, the second light emitting diodes 320 are mounted on the second printed circuit board 420. That is, the second light emitting diodes 320 may be connected to the second printed circuit board 420 by solder or the like.

In addition, the printed circuit board 400 may include a terminal portion 440 to be connected to an external main board or the like. The terminal portion 440 may be connected to the second printed circuit board 420. The first light emitting diodes 310 may be connected to the terminal unit 440 through the first printed circuit board 410, the connecting board 430 and the second printed circuit board 420.

The first light emitting diodes 310 may be disposed between the second light emitting diodes 320. That is, the first light emitting diodes 310 and the second light emitting diodes 320 may be alternately arranged.

The first light emitting diodes 310 may be bonded to the second printed circuit board 420 by a first adhesive layer 311. The second light emitting diodes 320 may be bonded to the first printed circuit board 410 by a second adhesive layer 312. Accordingly, even if the printed circuit board 400 is flexible, the first light emitting diode and the second light emitting diode can be effectively fixed by the first adhesive layer 311 and the second adhesive layer 312.

Referring to FIGS. 2 and 3, the fixing unit 500 may fix the light emitting diodes 300. That is, the fixing unit 500 can fix the light emitting diodes 300 so that they do not mutually interfere with each other. In addition, the fixing unit 500 may perform a function of emitting heat generated in the light emitting diodes 300. FIG.

The fixing part 500 includes a plurality of guides 510 and a supporting part 520. The fixing unit 500 may include a heat dissipation unit connected to the supporter 520. The heat dissipation unit may be exposed to outside air and may include heat dissipation fins. More specifically, the heat dissipation fins may be disposed directly on the supporter 520.

The guides 510 are disposed between the first light emitting diodes 310 and the second light emitting diodes 320. The guides 510 may be in direct contact with the first light emitting diodes 310 and the second light emitting diodes 320. The first light emitting diodes 310 and the second light emitting diodes 320 are alternately arranged and a space between the first light emitting diodes 310 and the second light emitting diodes 320 Guides 510 are disposed.

That is, the first light emitting diodes 310 and the second light emitting diodes 320 may be alternately arranged in spaces between the guides 510. [

The guides 510 guide the first light emitting diodes 310 and the second light emitting diodes 320. That is, the guides 510 accurately align the first light emitting diodes 310 and the second light emitting diodes 320, thereby minimizing optical loss due to the distortion.

In addition, the guides 510 can easily radiate heat generated from the first light emitting diodes 310 and the second light emitting diodes to the outside through the support 520 and the heat dissipation unit.

In addition, the guides 510 may include an insulator. More specifically, the guides 510 may isolate the first light emitting diodes and the second light emitting diodes 320, respectively. Accordingly, shorting of the first light emitting diodes 310 and the second light emitting diodes 320 can be prevented by the guides 510.

The supports 520 are connected to the guides 510. The support 520 and the guides 510 may be integrally formed with each other. Examples of the material used for the supporter 520 include plastic, glass, and ceramics.

The housing 600 houses the printed circuit board 400 and the light emitting diodes 300. That is, the housing 600 receives the first printed circuit board 410, the second printed circuit board 420, the first light emitting diodes 310, and the second light emitting diodes 320 . In addition, the housing 600 receives a part of the light guide plate 200. More specifically, the housing 600 may receive the light-incoming portion of the light guide plate 200. In addition, the housing 600 may temporarily fix the light guide plate 200.

As the housing 600, a metal such as aluminum or an alloy thereof may be used.

The wavelength converting member 700 may be disposed on the light path between the light source and the liquid crystal panel 20. [ More specifically, the wavelength conversion member 700 is interposed between the light emitting diodes 300 and the light guide plate 200. More specifically, the wavelength conversion member 700 may be adhered to the light guide plate 200. In more detail, the wavelength converting member 700 may be adhered to the light guide plate 200 and the light emitting diodes 300.

The wavelength conversion member 700 may have a shape elongated in one direction. More specifically, the wavelength conversion member 700 may have a shape extending along the incident surface of the light guide plate 200.

The wavelength converting member 700 may convert light emitted from the light emitting diodes 300 and output the light to the light guide plate 200.

For example, when the light emitting diodes 300 are a blue light emitting diode, the wavelength converting member 700 may convert blue light emitted upward from the light guide plate 200 into green light and red light. That is, the wavelength converting member 700 converts a part of the blue light into green light having a wavelength range of about 520 nm to about 560 nm, and transmits the other part of the blue light to a wavelength band of about 630 nm to about 660 nm Can be converted into red light.

In addition, when the light emitting diodes 300 are UV light emitting diodes, the wavelength converting member 700 may convert ultraviolet light emitted from the upper surface of the light guide plate 200 into blue light, green light, and red light. That is, the wavelength converting member 700 converts a part of the ultraviolet ray into blue light having a wavelength range of about 430 nm to about 470 nm, and converts another part of the ultraviolet light to a wavelength band of about 520 nm to about 560 nm Can be converted into green light and another part of the ultraviolet light can be converted into red light having a wavelength band between about 630 nm and about 660 nm.

Accordingly, light passing through the wavelength conversion member 700 without conversion and light converted by the wavelength conversion member 700 can form white light. That is, blue light, green light, and red light may be combined to allow white light to be incident on the liquid crystal panel 20.

4 and 6, the wavelength conversion member 700 includes a lower substrate 710, an upper substrate 720, a wavelength conversion layer 730, and a side protection unit 740.

The lower substrate 710 is disposed under the wavelength conversion layer 730. The lower substrate 710 is transparent and flexible. The lower substrate 710 may be in close contact with the lower surface of the wavelength conversion layer 730.

Examples of materials used for the lower substrate 710 include transparent polymers such as polyethylene terephthalate (PET).

The upper substrate 720 is disposed on the wavelength conversion layer 730. The upper substrate 720 is transparent and flexible. The upper substrate 720 may be in close contact with the upper surface of the wavelength conversion layer 730.

Examples of materials used for the upper substrate 720 include transparent polymers such as polyethylene terephthalate.

The lower substrate 710 and the upper substrate 720 sandwich the wavelength conversion layer 730. The lower substrate 710 and the upper substrate 720 support the wavelength conversion layer 730. The lower substrate 710 and the upper substrate 720 protect the wavelength conversion layer 730 from external physical impacts. The lower substrate 710 and the upper substrate 720 may be in direct contact with the wavelength conversion layer 730.

In addition, the lower substrate 710 and the upper substrate 720 have low oxygen permeability and moisture permeability. Accordingly, the lower substrate 710 and the upper substrate 720 can protect the wavelength conversion layer 730 from external chemical impacts such as moisture and / or oxygen.

The wavelength conversion layer 730 is interposed between the lower substrate 710 and the upper substrate 720. The wavelength conversion layer 730 may be in close contact with the upper surface of the lower substrate 710 and may be in close contact with the lower surface of the upper substrate 720.

The wavelength conversion layer 730 includes a plurality of wavelength conversion particles 731 and a host layer 732.

The wavelength conversion particles 731 are disposed between the lower substrate 710 and the upper substrate 720. More specifically, the wavelength conversion particles 731 are uniformly dispersed in the host layer 732, and the host layer 732 is disposed between the lower substrate 710 and the upper substrate 720.

The wavelength converting particles 731 convert the wavelength of the light emitted from the light emitting diodes 300. The wavelength conversion particles 731 receive the light emitted from the light emitting diodes 300 and convert the wavelength. For example, the wavelength converting particles 731 may convert blue light emitted from the light emitting diodes 300 into green light and red light. That is, some of the wavelength converting particles 731 convert the blue light into green light having a wavelength band of about 520 nm to about 560 nm, and another part of the wavelength converting particles 731 converts the blue light Can be converted to red light having a wavelength band between about 630 nm and about 660 nm.

Alternatively, the wavelength conversion particles 731 may convert ultraviolet light emitted from the light emitting diodes 300 into blue light, green light, and red light. That is, some of the wavelength converting particles 731 convert the ultraviolet light into blue light having a wavelength range of about 430 nm to about 470 nm, and another part of the wavelength converting particles 731 converts the ultraviolet light to weak light It can be converted into green light having a wavelength range of 520 nm to 560 nm. Further, another part of the wavelength converting particles 731 may convert the ultraviolet ray into red light having a wavelength range of about 630 nm to about 660 nm.

That is, when the light emitting diodes 300 are blue light emitting diodes that generate blue light, wavelength conversion particles 731 that convert blue light into green light and red light, respectively, may be used. Alternatively, when the light emitting diodes 300 are UV light emitting diodes that generate ultraviolet rays, the wavelength conversion particles 731 that convert ultraviolet light into blue light, green light, and red light, respectively, may be used.

The wavelength conversion particles 731 may be a quantum dot (QD). The quantum dot may include core nanocrystals and shell nanocrystals surrounding the core nanocrystals. In addition, the quantum dot may include an organic ligand bound to the shell nanocrystal. In addition, the quantum dot may include an organic coating layer surrounding the shell nanocrystals.

The shell nanocrystals may be formed of two or more layers. The shell nanocrystals are formed on the surface of the core nanocrystals. The quantum dot may convert the wavelength of the light incident on the core core crystal into a long wavelength through the shell nanocrystals forming the shell layer and increase the light efficiency.

The quantum dot may include at least one of a group II compound semiconductor, a group III compound semiconductor, a group V compound semiconductor, and a group VI compound semiconductor. More specifically, the core nanocrystals may include Cdse, InGaP, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The shell nanocrystals may include CuZnS, CdSe, CdTe, CdS, ZnSe, ZnTe, ZnS, HgTe or HgS. The diameter of the quantum dot may be 1 nm to 10 nm.

The wavelength of the light emitted from the quantum dot can be adjusted according to the size of the quantum dot. The organic ligand may include pyridine, mercapto alcohol, thiol, phosphine, phosphine oxide, and the like. The organic ligands serve to stabilize unstable quantum dots after synthesis. After synthesis, a dangling bond is formed on the outer periphery, and the quantum dots may become unstable due to the dangling bonds. However, one end of the organic ligand is in an unbonded state, and one end of the unbound organic ligand bonds with the dangling bond, thereby stabilizing the quantum dot.

Particularly, when the quantum dot has a size smaller than the Bohr radius of an exciton formed by electrons and holes excited by light, electricity or the like, a quantum confinement effect is generated to have a staggering energy level and an energy gap The size of the image is changed. Further, the charge is confined within the quantum dots, so that it has a high luminous efficiency.

Unlike general fluorescent dyes, the quantum dots vary in fluorescence wavelength depending on the particle size. That is, as the size of the particle becomes smaller, it emits light having a shorter wavelength, and the particle size can be adjusted to produce fluorescence in a visible light region of a desired wavelength. In addition, since the extinction coefficient is 100 to 1000 times higher than that of a general dye, and the quantum yield is also high, it produces very high fluorescence.

The quantum dot can be synthesized by a chemical wet process. Here, the chemical wet method is a method of growing particles by adding a precursor material to an organic solvent, and the quantum dots can be synthesized by a chemical wet method.

The host layer 732 surrounds the wavelength converting particles 731. That is, the host layer 732 uniformly disperses the wavelength converting particles 731 therein. The host layer 732 may be comprised of a polymer. The host layer 732 is transparent. That is, the host layer 732 may be formed of a transparent polymer.

The host layer 732 is disposed between the lower substrate 710 and the upper substrate 720. The host layer 732 may be in close contact with the upper surface of the lower substrate 710 and the lower surface of the upper substrate 720.

The side protective portion 740 is disposed on a side surface of the host layer 732. More specifically, the side surface protection portion 740 covers the side surface of the host layer 732. In more detail, the side protection portion 740 is disposed on the side surfaces of the lower substrate 710 and the upper substrate 720. More specifically, the side surface protection portion 740 covers the side surfaces of the lower substrate 710 and the upper substrate 720.

The side protective portion 740 may be adhered to the side surfaces of the host layer 732, the lower substrate 710, and the upper substrate 720. The side protective portion 740 is in close contact with the side surfaces of the host layer 732, the lower substrate 710, and the upper substrate 720.

Accordingly, the side surface protection portion 740 can seal the side surface of the host layer 732. That is, the side surface protection part 740 is a protection part that protects the host layer 732 from external chemical impact.

Examples of the material used for the side protective portion 740 include inorganic materials such as silicon oxide and organic materials such as silicone resins, acrylic resins and epoxy resins. In addition, aluminum, silver, or the like may be used for the side protection portion 740.

In addition, the side protective portion 740 may function as a reflective layer for reflecting light from the wavelength conversion layer 730.

In addition, the wavelength conversion member 700 may further include a first inorganic protective film and a second inorganic protective film. The first inorganic protective film may be coated on the lower surface of the lower substrate 710 and the second inorganic protective film may be coated on the upper surface of the upper substrate 720. Examples of the material used as the first inorganic protective film and the second inorganic protective film include silicon oxide and the like.

The optical sheets 800 are disposed on the light guide plate 200. The optical sheets 800 change or enhance the characteristics of light emitted from the upper surface of the light guide plate 200 and supply the light to the liquid crystal panel 20. [

The optical sheets 800 may be a diffusion sheet 801, a first prism sheet 802, and a second prism sheet 803.

The diffusion sheet 801 is disposed on the wavelength conversion member 700. The diffusion sheet 801 improves the uniformity of the transmitted light. The diffusion sheet 502 may include a plurality of beads.

The first prism sheet 802 is disposed on the diffusion sheet 801. The second prism sheet 803 is disposed on the first prism sheet 802. The first prism sheet 802 and the second prism sheet 803 increase the straightness of light passing therethrough.

The liquid crystal panel 20 is disposed on the optical sheets 800. Further, the liquid crystal panel 20 is disposed on the panel guide 23. The liquid crystal panel 20 may be guided by the panel guide 23.

The liquid crystal panel 20 displays an image by adjusting the intensity of light passing through the liquid crystal panel 20. That is, the liquid crystal panel 20 is a display panel for displaying an image using light emitted from the backlight unit 10. [ The liquid crystal panel 20 includes a TFT substrate 21, a color filter substrate 22, and a liquid crystal layer interposed between the two substrates. In addition, the liquid crystal panel 20 includes polarizing filters.

Although not shown in detail in the drawings, the TFT substrate 21 and the color filter substrate 22 will be described in detail. The TFT substrate 21 defines pixels by intersecting a plurality of gate lines and data lines, A thin film transistor (TFT) is provided for each region and is connected in a one-to-one correspondence with the pixel electrodes mounted on the respective pixels. The color filter substrate 22 includes color filters of R, G and B colors corresponding to the respective pixels, a black matrix for covering the gate lines, the data lines, the thin film transistors, etc., .

A driving PCB 25 for supplying a driving signal to the gate line and the data line is provided at the edge of the liquid crystal panel 20.

The drive PCB 25 is electrically connected to the liquid crystal panel 20 by a chip on film (COF) 24. Here, the COF 24 may be changed to a TCP (Tape Carrier Package).

As described above, the liquid crystal display according to the embodiment includes the first light emitting diodes 310 and the second light emitting diodes 320 as the first printed circuit board 410 and the second printed circuit board 410, Connected to the printed circuit board 420, and arranged alternately with each other.

Accordingly, the first light emitting diodes 310 and the second light emitting diodes 320 may be arranged closely to each other. Particularly, the first light emitting diodes 310 are connected to the first printed circuit board 410 and the second light emitting diodes 320 are connected to the second printed circuit board 420. Further, the first light emitting diode and the second light emitting diode are alternately arranged.

Accordingly, the interval between the first light emitting diodes 310 in the first printed circuit board 410 can be sufficiently spaced. Accordingly, the first light emitting diodes 310 can be connected to the first printed circuit board 410 in a margin. Similarly, the spacing between the second light emitting diodes 320 in the second printed circuit board 420 may be sufficiently spaced. Accordingly, the second light emitting diodes 320 can be connected to the second printed circuit board 420 in a margin.

Therefore, the first light emitting diodes 310 and the second light emitting diodes 320 are not restricted to the first printed circuit board 410 and the second printed circuit board 420, . Therefore, the first light emitting diodes 310 and the second light emitting diodes 320 can cause light to be incident on the light guide plate 200 with high luminance. The liquid crystal display according to the embodiment can have improved luminance.

7, the printed circuit board 400 may be bent so that the first light emitting diodes 310 may be inserted between the second light emitting diodes 320, respectively. As described above, the liquid crystal display device according to the embodiment can be easily manufactured.

In addition, the features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (8)

Backlight unit;
A housing for receiving the backlight unit; And
And a liquid crystal panel disposed on the backlight unit,
The backlight unit
A light guide plate;
A light emitting portion disposed on a side surface of the light guide plate;
A circuit board electrically connected to the light emitting unit; And
And a wavelength conversion member disposed between the light emitting portion and the light guide plate,
The circuit board
A first circuit board;
A second circuit board disposed on the first circuit board and facing the first circuit board; And
And a connection board connected to the first circuit board and the second circuit board,
The light-
A plurality of first light emitting parts interposed between the first circuit board and the second circuit board and connected to the first circuit board;
A plurality of second light emitting units interposed between the first circuit board and the second circuit board, the second light emitting units being connected to the second circuit board and disposed between the first light emitting units; And
A plurality of guides interposed between the first light emitting units and the second light emitting units; And
And a support connected to the guides and fixing the guides,
The housing accommodates the light-incoming portion of the light guide plate, the first circuit board, the second circuit board, the first light emitting portions, the second light emitting portions, and the wavelength converting member,
Wherein the housing comprises a metal,
Wherein the first circuit board, the second circuit board, and the connection board are integrally formed,
Wherein one surface of the first light emitting portions is in contact with the first printed circuit board and the other surface opposite to the first surface of the first light emitting portions is in contact with the second printed circuit board via an adhesive layer,
One surface of the second light emitting portions is in contact with the second printed circuit board and the other surface opposite to the one surface of the second light emitting portions is in contact with the first printed circuit board through an adhesive layer,
Both side surfaces of the first light emitting portions are in direct contact with the guide,
Both side surfaces of the second light emitting portions are in direct contact with the guide,
Wherein the wavelength conversion member comprises:
A lower substrate;
An upper substrate on the lower substrate;
A wavelength conversion layer between the lower substrate and the upper substrate; And
And a side protective portion disposed on a side surface of the wavelength conversion layer,
Wherein the wavelength conversion layer comprises a host; And a quantum dot dispersed in the host,
Wherein the host is surrounded by the lower substrate, the upper substrate, and the side protection portion,
Wherein the host is in direct contact with the lower substrate, the upper substrate, and the side protective portion. The display device according to claim 1, wherein the first light emitting portions and the second light emitting portions are alternately arranged. delete 2. The display device according to claim 1, wherein the connecting board is bent from the first circuit board and extends to the second circuit board. delete The display device according to claim 1, further comprising a heat dissipation unit connected to the support. delete delete

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