KR102089637B1 - Transparent electrical conductive film comprising metal nano wire and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a transparent conductive adhesive film that can be applied to a touch sensor and a method of manufacturing the same.
The present invention comprises the steps of forming a separation layer on a substrate, forming a conductive pattern portion comprising a metal nanowire on a separation layer, and transferring a conductive pattern portion comprising a metal nanowire to at least one surface of a transparent dielectric layer having adhesion. Includes steps.
According to the present invention, the ITO used as the transparent electrode material of the touch sensor can be replaced with a metal nanowire to overcome the resource limitations and suppress the increase in resistance, thereby increasing the area, improving the thin film properties and flexible properties, The manufacturing process is simplified to reduce manufacturing cost and manufacturing time and improve product yield.

Description

TRANSPARENT ELECTRICAL CONDUCTIVE FILM COMPRISING METAL NANO WIRE AND MANUFACTURING METHOD THEREOF}

The present invention relates to a transparent conductive adhesive film comprising a metal nanowire and a method of manufacturing the same. More specifically, the present invention can replace the ITO (Indium Tin Oxide), which was used as a transparent electrode material of the touch sensor, with a metal nanowire to overcome the resource limitation and suppress the increase in resistance, thereby making it possible to make a large area, thin film characteristics and flexible The present invention relates to a transparent conductive adhesive film and a method of manufacturing the same, comprising a metal nanowire that can improve properties, simplify manufacturing processes, reduce manufacturing cost and manufacturing time, and improve product yield.

Various types of input devices are used for the operation of computing systems. For example, input devices such as buttons, keys, joysticks and touch screens are used. Due to the easy and simple operation of the touch sensor, the use of the touch sensor is increasing during operation of the computing system.

The touch sensor may constitute a touch surface of a touch input device including a touch sensor panel, which may be a transparent panel having a touch-sensitive surface. This touch sensor panel is attached to the front of the display screen so that the touch-sensitive surface can cover the visible side of the display screen. It allows the user to operate the computing system by simply touching the touch screen with a finger or the like. In general, a computing system can perform operations accordingly by recognizing touches and touch locations on a touch screen and interpreting these touches.

Recently, a so-called force touch sensor, which recognizes the level of touch pressure, has been introduced as a touch sensor technology, beyond simple two-dimensional coordinate recognition.

However, according to the prior art, since ITO (Indium Tin Oxide) is mainly used as the transparent electrode material of the touch sensor, there are limitations in terms of resources and large area of the touch sensor is difficult due to increased resistance, and thin film characteristics and flexible characteristics There was a falling issue.

In addition, according to the prior art, there is a problem in that the manufacturing process related to the formation of the ITO transparent electrode is complicated, resulting in an increase in manufacturing cost and manufacturing time and a decrease in product yield.

Republic of Korea Registered Patent Publication No. 10-1482780 (Registration date: January 08, 2015, name: conductive nano-wire film manufacturing method and a touch panel comprising a conductive nano-wire film produced by the manufacturing method)

The present invention replaces ITO (Indium Tin Oxide), which was used as a transparent electrode material for a touch sensor, with a metal nanowire, overcomes resource limitations, and can increase the area while suppressing an increase in resistance, and improve thin film properties and flexible properties. It is a technical problem to provide a transparent conductive adhesive film applicable to a touch sensor that can be applied and a manufacturing method thereof.

In addition, the present invention is to provide a transparent conductive adhesive film that can be applied to a touch sensor that simplifies the manufacturing process to reduce manufacturing cost and manufacturing time and improves product yield, and a manufacturing method thereof.

The method for manufacturing a transparent conductive adhesive film according to the present invention for solving this technical problem is a separation layer forming step of forming a separation layer on a substrate, a conductive pattern portion forming a conductive pattern portion including metal nanowires on the separation layer And a conductive pattern portion transfer step of transferring the conductive pattern portion including the metal nanowires to at least one surface of the transparent dielectric layer having adhesive force.

The method for manufacturing a transparent conductive adhesive film according to the present invention is further characterized by further comprising a substrate separation step of separating and separating the substrate.

In the method for manufacturing a transparent conductive adhesive film according to the present invention, the transparent dielectric layer is characterized by being OCA (Optically Clear Adhesive).

In the method for manufacturing a transparent conductive adhesive film according to the present invention, the modulus of the transparent dielectric layer is characterized in that it is 0.10-5 MPa.

In the method for manufacturing a transparent conductive adhesive film according to the present invention, the thickness recovery force of the transparent dielectric layer is characterized in that 90-100% / sec.

In the method for manufacturing a transparent conductive adhesive film according to the present invention, the transparent dielectric layer is characterized by having a modulus of 0.10-5 MPa in a temperature range of -40-+80 degrees.

In the method for manufacturing a transparent conductive adhesive film according to the present invention, the transparent dielectric layer is characterized by having a thickness recovery power of 90-100% / sec in a temperature range of -40-+80 degrees.

In the method of manufacturing the transparent conductive adhesive film according to the present invention, the thickness of the transparent dielectric layer is characterized in that 10-150um.

In the method for manufacturing a transparent conductive adhesive film according to the present invention, the dielectric constant of the transparent dielectric layer is 1-15.

In the method for manufacturing a transparent conductive adhesive film according to the present invention, the metal nanowire is characterized by comprising silver (Ag) or copper (Cu).

In the method for manufacturing a transparent conductive adhesive film according to the present invention, the diameter of the metal nanowire is 1-100 nm.

In the method for manufacturing a transparent conductive adhesive film according to the present invention, the length of the metal nanowire is 1-100 μm.

In the method for manufacturing a transparent conductive adhesive film according to the present invention, the bonding force between the conductive pattern portion and the separation layer is greater than that between the substrate and the separation layer.

The transparent conductive adhesive film according to the present invention includes a conductive pattern portion including a transparent dielectric layer having adhesive force and a metal nanowire adhered to at least one surface of both surfaces of the transparent dielectric layer.

In the transparent conductive adhesive film according to the present invention, the transparent dielectric layer is characterized in that it is OCA (Optically Clear Adhesive).

The transparent conductive film according to the present invention is characterized in that it further comprises a separation layer formed on the opposite side of the surface adhered to the transparent dielectric layer from both sides of the conductive pattern portion.

In the transparent conductive film according to the present invention, a first substrate is formed on a first surface among both surfaces of the transparent dielectric layer.

In the transparent conductive film according to the present invention, a second substrate is formed on a second surface opposite to the first surface from both surfaces of the transparent dielectric layer.

In the transparent conductive film according to the present invention, the modulus of the transparent dielectric layer is characterized in that 0.10-5MPa.

In the transparent conductive film according to the present invention, the thickness recovery force of the transparent dielectric layer is characterized in that 90-100% / sec.

In the transparent conductive film according to the present invention, the transparent dielectric layer is characterized by having a modulus of 0.10-5 MPa in a temperature range of -40-+80 degrees.

In the transparent conductive film according to the present invention, the transparent dielectric layer is characterized by having a thickness recovery power of 90-100% / sec in a temperature range of -40-+80 degrees.

In the transparent conductive film according to the present invention, the thickness of the transparent dielectric layer is characterized in that 10-150um.

In the transparent conductive film according to the present invention, the dielectric constant of the transparent dielectric layer is 1-15.

In the transparent conductive film according to the present invention, the metal nanowire is characterized in that it comprises silver (Ag) or copper (Cu).

In the transparent conductive film according to the present invention, the diameter of the metal nanowire is 1-100 nm.

In the transparent conductive film according to the present invention, the length of the metal nanowire is characterized in that 1-100um.

According to the present invention, by replacing the ITO used as a transparent electrode material of the touch sensor with a metal nanowire, it is possible to overcome the resource limitation and suppress the increase in resistance while making a large area, and to improve the thin film properties and flexible properties. There is an effect that a transparent conductive adhesive film applicable to a sensor and a method of manufacturing the same are provided.

In addition, there is an effect that a transparent conductive adhesive film and a method of manufacturing the same can be applied to a touch sensor that simplifies the manufacturing process to reduce manufacturing cost and manufacturing time and improve product yield.

1 is a process flow chart of a method of manufacturing a transparent conductive adhesive film comprising metal nanowires according to an embodiment of the present invention,
2 to 8 are exemplary process cross-sectional views of a method for manufacturing a transparent conductive adhesive film including metal nanowires according to an embodiment of the present invention.

Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in this specification are exemplified only for the purpose of explaining the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention It can be implemented in various forms and is not limited to the embodiments described herein.

Embodiments according to the concept of the present invention can be applied to various changes and can have various forms, so the embodiments will be illustrated in the drawings and described in detail herein. However, this is not intended to limit the embodiments according to the concept of the present invention to specific disclosure forms, and includes all changes, equivalents, or substitutes included in the spirit and scope of the present invention.

Terms such as first or second may be used to describe various components, but the components should not be limited by the terms. The above terms are only for the purpose of distinguishing one component from other components, for example, without departing from the scope of rights according to the concept of the present invention, the first component can be referred to as the second component and similarly the second The component may also be referred to as a first component.

When a component is said to be "connected" or "connected" to another component, it is understood that other components may be directly connected to or connected to the other component, but other components may exist in the middle. It should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that no other component exists in the middle. Other expressions describing the relationship between the components, such as "between" and "immediately between" or "adjacent to" and "directly neighboring to," should be interpreted similarly.

The terms used in this specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as “include” or “have” are intended to indicate that a feature, number, step, operation, component, part, or combination thereof described herein exists, one or more other features. It should be understood that the presence or addition possibilities of fields or numbers, steps, actions, components, parts or combinations thereof are not excluded in advance.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person skilled in the art to which the present invention pertains. Terms such as those defined in a commonly used dictionary should be interpreted as having meanings consistent with meanings in the context of related technologies, and should not be interpreted as ideal or excessively formal meanings unless explicitly defined herein. Does not.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a process flow diagram of a method of manufacturing a transparent conductive adhesive film including a metal nanowire according to an embodiment of the present invention, and FIGS. 2 to 8 are transparent conductive materials including a metal nanowire according to an embodiment of the present invention Here are exemplary process cross-sections of the adhesive film manufacturing method.

1 to 8, a method of manufacturing a transparent conductive adhesive film including a metal nanowire according to an embodiment of the present invention includes a separation layer forming step (S10), a conductive pattern portion forming step (S20), and a conductive pattern portion It includes a transfer step (S30) and a substrate separation step (S40).

As will be described later, the first conductive pattern portion 31 and the second conductive pattern portion 32 functioning as electrodes of the touch sensor may be transferred to both surfaces of the transparent dielectric layer 40, and the first conductive pattern portion 31 may be transferred. ) And the processes performed to transfer the second conductive pattern portion 32 to the transparent dielectric layer 40 are the same. Therefore, hereinafter, in order to avoid overlapping descriptions, a method of manufacturing a transparent conductive adhesive film according to an embodiment of the present invention is focused on the process of transferring the first conductive pattern portion 31 to the transparent dielectric layer 40. Explain. The description of the first substrate 11, the first separation layer 21, and the first conductive pattern portion 31 is the same as the second substrate 12, the second separation layer 22, and the second conductive pattern portion 32 ).

First, referring to FIGS. 1 and 2, in the separation layer forming step S10, a process of forming the first separation layer 21 on the first substrate 11 is performed.

The first substrate 11 functions as a base on which components of the transparent conductive adhesive film are formed. In the final process step, the first substrate 11 may be peeled off and separated, or may remain as one of the components of the transparent conductive adhesive film. When the first substrate 11 remains, the first substrate 11 may be used as a means for securing optical properties and durability of the transparent conductive adhesive film.

For example, as the first substrate 11, an appropriate strength is provided so that it can be fixed easily without warping or twisting during the process, and any material having little influence on heat or chemical treatment may be used without particular limitation.

As a specific example, hard materials such as glass, quartz, silicon wafer, and sus (SUS) may be used as the first substrate 11.

As another specific example, the first substrate 11 may be a transparent optical film, and a film having excellent transparency, mechanical strength, and thermal stability may be used. As a more specific example, the transparent optical film includes cellulose-based resins such as diacetyl cellulose and triacetyl cellulose; Polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; Polycarbonate resins; Acrylic resins such as polymethyl (meth) acrylate and polyethyl (meth) acrylate; Styrene resins such as polystyrene and acrylonitrile-styrene copolymers; Polyolefin resins such as polyethylene, polypropylene, cycloolefin or polyolefin having a norbornene structure, and ethylene-propylene copolymer; Vinyl chloride resin; Amide resins such as nylon and aromatic polyamides; Imide resin; Polyethersulfone-based resins; Sulfone resins; Polyether ether ketone-based resins; Polyphenylene sulfide resins; Vinyl alcohol-based resins; Vinylidene chloride-based resins; Vinyl butyral resins; Allylate resins; Polyoxymethylene resins; And films composed of thermoplastic resins such as epoxy resins, and films composed of blends of the thermoplastic resins can also be used. Further, a film made of a thermosetting resin such as (meth) acrylic, urethane, acrylic urethane, epoxy, or silicone or a UV curable resin can also be used. The thickness of the transparent optical film may be appropriately determined, but generally, it may be determined to be 1 to 500 μm in consideration of workability such as strength, handling properties, thinness, and the like. In particular, 1 to 300 µm is preferable, and 5 to 200 µm is more preferable.

The transparent optical film may contain one or more suitable additives. Examples of the additives include ultraviolet absorbers, antioxidants, lubricants, plasticizers, mold release agents, coloring inhibitors, flame retardants, nucleating agents, antistatic agents, pigments, coloring agents and the like. The transparent optical film may have a structure including various functional layers such as a hard coating layer, an anti-reflection layer, and a gas barrier layer on one or both sides of the film, and the functional layer is not limited to the above, and various functional layers may be used depending on the application. It can contain.

In addition, if necessary, the transparent optical film may be surface-treated. Examples of the surface treatment include dry treatment such as plasma treatment, corona treatment, and primer treatment, and chemical treatment such as alkali treatment including saponification treatment.

In addition, the transparent optical film may be an isotropic film, a retardation film or a protective film (Protective Film).

In the case of an isotropic film, the in-plane retardation (Ro, Ro = [(nx-ny) ⅹd], nx, ny is the main refractive index in the film plane, d is the film thickness) is 40 nm or less, preferably 15 nm or less, and the thickness direction The phase difference (Rth, Rth = [(nx + ny) / 2-nz] ⅹd, nx, ny is the main refractive index in the film plane, nz is the refractive index in the film thickness direction, d is the film thickness) is -90nm to + 75nm And preferably -80 nm to +60 nm, particularly -70 nm to +45 nm.

The retardation film is a film produced by a method of uniaxial stretching, biaxial stretching, polymer coating, or liquid crystal coating of a polymer film, and is generally used to improve and adjust optical properties such as compensation for viewing angle of a display, improvement in color, improvement in light leakage, and adjustment of color taste. do. Types of retardation films include 1/2 or 1/4 wave plate, positive C plate, negative C plate, positive A plate, negative A plate, and biaxial wave plate.

The protective film may be a film including an adhesive layer on at least one side of a film made of a polymer resin or a film having self-adhesive properties such as polypropylene, and may be used to protect the touch sensor surface and improve processability.

The first separation layer 21 in the process of manufacturing a transparent conductive adhesive film according to an embodiment of the present invention, the first conductive pattern portion 31 formed on the first separation layer 21, the first substrate 11 ).

For example, the first separation layer 21 and the first substrate 11 are a combination of one or more of physical methods (light, heat, etc.), chemical methods (chemical reactions), and mechanical methods (forces and vibrations). It can be separated through one method.

More specifically, the first separation layer 21 is a substrate separation step (S40) performed after the conductive pattern portion transfer step (S30), which will be described later, so that the difference in adhesion between the components to be separated can occur. Performs a function of adjusting, for example, the bonding force between the first conductive pattern portion 31 and the first separation layer 21 is configured to be greater than the bonding force between the first substrate 11 and the first separation layer 21 Can be. With this configuration, the first base material 11 can be stably peeled from the first separation layer 21 without affecting the coupling between the first conductive pattern portion 31 and the first separation layer 21.

Exemplary materials for the first separation layer 21 include polyimide-based polymers, polyvinyl alcohol-based polymers, polyamic acid-based polymers, polyamide-based polymers, Polyethylene-based polymer, polystylene-based polymer, polynorbornene-based polymer, phenylmaleimide copolymer-based polymer, polyazobenzene-based polymer, polyphenylenephthalamide ( polyphenylenephthalamide) polymer, polyester polymer, polymethyl methacrylate polymer, polyarylate polymer, cinnamate polymer, coumarin polymer, phthalate It may be made of polymers such as phthalimidine-based polymers, chalcone-based polymers, aromatic acetylene-based polymers, etc. It may be used alone or in combination of two or more.

The peeling force of the first separation layer 21 is not particularly limited, but may be, for example, 0.01 N / 25 mm or more and 1 N / 25 mm or less, and preferably 0.01 N / 25 mm or more and 0.1 N / 25 mm or less. In the case of satisfying the above range, in the manufacturing process of the transparent conductive adhesive film, the first substrate 11 is provided with a first separation layer 21 in which the first conductive pattern portion 31 or the first conductive pattern portion 31 is formed. ) Can be easily peeled off without any residue, and curl and cracks due to tension generated during peeling can be reduced.

The thickness of the first separation layer 21 is not particularly limited, but may be, for example, 10 to 1,000 nm, and preferably 50 to 500 nm. When the above range is satisfied, the peeling force is stable and a uniform pattern can be formed.

Although not illustrated in the drawing, a first protective layer may be formed on the first separation layer 21.

The first protective layer is an optional component that can be omitted if necessary, and the first separation layer 21 forms the first conductive pattern portion 31 including the metal nanowires during the process of manufacturing the transparent conductive adhesive film It can be prevented from being damaged by exposure to process chemicals or developer solutions that may be used in the process, and cleaning solutions generated between processes.

As a material of the first protective layer, a polymer known in the art may be used without limitation, for example, an organic insulating film may be applied, and among them, as a curable composition comprising a polyol and a melamine curing agent It may be formed, but is not limited thereto.

Specific types of polyols include, but are not limited to, polyether glycol derivatives, polyester glycol derivatives, polycaprolactone glycol derivatives, and the like.

Specific types of melamine curing agents include methoxy methyl melamine derivatives, methyl melamine derivatives, butyl melamine derivatives, isobutoxy melamine derivatives and butoxy melamine Derivatives, and the like, but are not limited thereto.

As another example, the first protective layer may be formed of an organic-inorganic hybrid curable composition, and when using an organic compound and an inorganic compound at the same time, it is preferable in that cracks generated when peeling can be reduced.

As the organic compound, the aforementioned components may be used, and examples of the inorganic material include silica-based nanoparticles, silicon-based nanoparticles, and glass nanofibers, but are not limited thereto.

Next, referring to FIGS. 1 and 3, in the forming of the conductive pattern portion (S20), a process of forming the first conductive pattern portion 31 including the metal nanowires on the first separation layer 21 is performed. Is performed.

For example, the metal nanowire may include silver (Ag) or copper (Cu), the diameter of the metal nanowire may be 1 to 100 nm, and the length of the metal nanowire may be 1 to 100 μm. When the metal nanowire is configured as described above, it is possible to obtain a transparent conductive adhesive film that can be applied to a large area touch sensor while suppressing an increase in resistance.

Next, referring to FIGS. 1, 4 and 5, in the step of transferring the conductive pattern portion (S30), one surface of the transparent dielectric layer 40 having the adhesive force to the first conductive pattern portion 31 including the metal nanowires The process of transcription is performed.

When the conductive pattern portion transfer step (S30) is performed, one surface of the transparent dielectric layer 40 has a structure in which the first conductive pattern portion 31 including metal nanowires is adhered.

For example, the transparent dielectric layer 40 may be OCA (Optically Clear Adhesive).

Meanwhile, as disclosed in FIG. 5, the second conductive pattern portion 32 may be transferred and adhered to the other surface of the transparent dielectric layer 40. In this case, the first conductive pattern portion 31 and the second conductive pattern portion 32 adhered to and transferred to both surfaces of the transparent dielectric function as upper and lower electrodes of the touch sensor.

For example, the modulus of the transparent dielectric layer 40 may be 0.10-5 Mpa, and more specifically, the transparent dielectric layer 40 is configured to have a modulus of 0.10-5 Mpa at a temperature of -40-80 degrees. Can be.

Table 1 below shows experimental data on the modulus change according to the temperature of the transparent dielectric layer 40.

Temperature (℃) Modulus (Mpa) -40 2.34 0 0.30 25 0.19 60 0.14 80 0.13 100 0.11

Referring to Table 1, the modulus of the transparent dielectric layer 40 has a property inversely proportional to temperature, and if the transparent dielectric layer 40 is not configured to have a modulus of 0.10 to 5 Mpa at a temperature of -40 to 80 degrees, the transparent dielectric layer 40 Since the recovery force of) decreases and the thickness needs to be changed in order to maintain the modulus characteristics, it becomes difficult to thin and maintain the flexible characteristics of the touch sensor to which the transparent conductive adhesive film is applied.

For example, in order to maintain the performance of an electronic device to which a touch sensor including touch recognition input by a user is applied, the thickness recovery force of the transparent dielectric layer 40 may be 90-100% / sec, and more specifically, The transparent dielectric layer 40 may be configured to have a thickness recovery force of 90-100% / sec in a temperature range of -40-+80 degrees.

This will be described in more detail as follows.

The optically clear adhesive (OCA) applied to the transparent dielectric layer 40 is an optical adhesive having a light transmittance of 90% or more, and when directly transferring a metal nanowire to an OCA, the OCA surface is pressed by the metal nanowire and In order to prevent damage to the electrical properties of the metal nanowire, OCA having a thickness recovery power of 90-100% / sec is suitable.

Depth recovery (DR) can be expressed by the following equation.

[Equation 1]

DR = ((hmax-hp) / hmax) * 100

In Equation 1, hmax is the depth at the maximum load, and hp is the normal depth after removing the load.

For example, the thickness of the transparent dielectric layer 40 may be 10-150um, and the dielectric constant of the transparent dielectric layer 40 may be 1-15. When configured in this way, it is possible to detect a level of change in capacitance corresponding to various levels of change in thickness of the transparent dielectric layer 40, and use this level of change in capacitance as an input value to detect the size of a user's touch force. Therefore, a force touch sensor can be implemented by sensing the level of touch force beyond two-dimensional coordinate recognition.

When the thickness of the transparent dielectric layer 40 is less than 10 um, the number of detectable capacitance change levels decreases, so the number of size levels of the user's touch force decreases, and when the thickness of the transparent dielectric layer 40 exceeds 150 um, the touch time point The time required to recover to the previous thickness increases, and it is difficult to thin, and thus optical properties such as light transmission and flexible properties are deteriorated.

Next, referring to FIGS. 1 and 6 to 8, in the substrate separation step (S40), a process of separating and separating the first substrate 11 is performed.

In FIG. 8, only the first substrate 11 is peeled off and the separated structure is disclosed. However, as required, as shown in FIG. 6, both the first substrate 11 and the second substrate 12 are separated and separated. Alternatively, as illustrated in FIG. 7, only the second substrate 12 may be separated and separated.

For example, the bonding force between the first conductive pattern portion 31 and the first separation layer 21 may be configured to be greater than the bonding force between the first substrate 11 and the first separation layer 21. With this configuration, the first base material 11 can be stably peeled from the first separation layer 21 without affecting the coupling between the first conductive pattern portion 31 and the first separation layer 21.

6 to 8 show the final results of a method of manufacturing a transparent conductive adhesive film according to an embodiment of the present invention, and these results are transparent conductive adhesive films according to an embodiment of the present invention.

Description of the components of the transparent conductive adhesive film according to an embodiment of the present invention has been described in detail in the process of explaining the manufacturing method, a duplicate description will be omitted.

As described in detail above, according to the present invention, the ITO used as the transparent electrode material of the touch sensor can be replaced with a metal nanowire to overcome the resource limitation and suppress the increase in resistance, thereby increasing the area, thin film properties and flexible properties There is an effect that is provided with a transparent conductive adhesive film that can be applied to a touch sensor capable of improving the manufacturing method.

In addition, there is an effect that a transparent conductive adhesive film and a method of manufacturing the same can be applied to a touch sensor that simplifies the manufacturing process to reduce manufacturing cost and manufacturing time and improve product yield.

11: First description
12: second description
21: first separation layer
22: second separation layer
31: first conductive pattern portion
32: second conductive pattern portion
40: transparent dielectric layer
S10: separation layer forming step
S20: conductive pattern portion forming step
S30: conductive pattern portion transfer step
S40: substrate separation step

Claims (27)

As a method of manufacturing a transparent conductive adhesive film,
A separation layer forming step of forming a separation layer on the substrate;
Forming a conductive pattern portion including a metal nanowire on the separation layer; And
And a conductive pattern portion transfer step of transferring the conductive pattern portion including the metal nanowires to at least one surface of a transparent dielectric layer having adhesive force,
The transparent dielectric layer is OCA (Optically Clear Adhesive),
The bonding force between the conductive pattern portion and the separation layer is characterized in that greater than the bonding force between the substrate and the separation layer, a transparent conductive adhesive film manufacturing method. According to claim 1,
A method of manufacturing a transparent conductive adhesive film, further comprising a step of separating the substrate by separating the substrate. delete According to claim 1,
The modulus of the transparent dielectric layer is characterized in that 0.10-5MPa, transparent conductive adhesive film manufacturing method. According to claim 1,
A method of manufacturing a transparent conductive adhesive film, characterized in that the thickness of the transparent dielectric layer is 90-100% / sec. According to claim 1,
The transparent dielectric layer is characterized in that it has a modulus of 0.10-5MPa in a temperature range of -40-+80 degrees, a method of manufacturing a transparent conductive adhesive film. According to claim 1,
The transparent dielectric layer is characterized in that it has a thickness recovery power of 90-100% / sec in a temperature range of -40-+80 degrees, a method of manufacturing a transparent conductive adhesive film. According to claim 1,
The thickness of the transparent dielectric layer is characterized in that 10-150um, transparent conductive adhesive film manufacturing method. According to claim 1,
A method of manufacturing a transparent conductive adhesive film, characterized in that the dielectric constant of the transparent dielectric layer is 1-15. According to claim 1,
The metal nanowire is characterized in that it comprises silver (Ag) or copper (Cu), a transparent conductive adhesive film production method. According to claim 1,
The diameter of the metal nano-wire is characterized in that 1 to 100nm, transparent conductive adhesive film production method. According to claim 1,
The length of the metal nanowire is characterized in that the 1-100um, transparent conductive adhesive film manufacturing method. delete A transparent dielectric layer having adhesive strength;
A conductive pattern portion including metal nanowires attached to at least one side of both surfaces of the transparent dielectric layer; And
It includes a separation layer formed on the opposite side of the surface bonded to the transparent dielectric layer from both sides of the conductive pattern portion,
The transparent dielectric layer is OCA (Optically Clear Adhesive),
The bonding force between the conductive pattern portion and the separation layer is characterized in that greater than the bonding force between the substrate and the separation layer, a transparent conductive adhesive film. delete delete The method of claim 14,
A first conductive pattern portion is adhered to the first surface of both surfaces of the transparent dielectric layer,
A first separation layer is formed on the first conductive pattern portion,
A transparent conductive adhesive film, characterized in that a first substrate is formed on the first separation layer. The method of claim 17,
A second conductive pattern portion is adhered to a second surface opposite to the first surface from both surfaces of the transparent dielectric layer,
A second separation layer is formed on the second conductive pattern portion,
A transparent conductive adhesive film, characterized in that a second substrate is formed on the second separation layer. The method of claim 14,
The modulus of the transparent dielectric layer is characterized in that 0.10-5MPa, a transparent conductive adhesive film. The method of claim 14,
The thickness of the transparent dielectric layer, the recovery power is characterized in that 90 to 100% / sec, a transparent conductive adhesive film. The method of claim 14,
The transparent dielectric layer is characterized in that it has a modulus of 0.10-5 MPa in a temperature range of -40-+80 degrees, a transparent conductive adhesive film. The method of claim 14,
The transparent dielectric layer is characterized in that it has a thickness recovery power of 90-100% / sec in a temperature range of -40-+80 degrees, a transparent conductive adhesive film. The method of claim 14,
The thickness of the transparent dielectric layer is characterized in that 10-150um, transparent conductive adhesive film. The method of claim 14,
The dielectric constant of the transparent dielectric layer is characterized in that 1 to 15, a transparent conductive adhesive film. The method of claim 14,
The metal nanowire is characterized in that it comprises silver (Ag) or copper (Cu), a transparent conductive adhesive film. The method of claim 14,
The diameter of the metal nanowire is characterized in that 1 to 100nm, a transparent conductive adhesive film. The method of claim 14,
The length of the metal nanowire is characterized in that 1-100um, a transparent conductive adhesive film.

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