KR102169470B1 - Stretchable wiring board device, method of manufacturing the stretchable wiring board device, Electronic device including the stretchable wiring board device - Google Patents

Abstract

Disclosed are a substrate device for wiring having elasticity, a method for manufacturing the same, and an electronic device including the substrate device for wiring. The disclosed wiring board apparatus includes: a plurality of substrates stacked and disposed; A plurality of conductive structures inserted into each of the plurality of substrates; A plurality of conductive vias electrically connecting the plurality of electric elements disposed on the outer surface of the wiring board device to the plurality of conductive structures through via holes formed in each of the plurality of substrates, wherein the plurality of conductive structures Each has a deformable structure.

Description

TECHNICAL FIELD [0001] A stretchable wiring board device, method of manufacturing the stretchable wiring board device, electronic device including the stretchable wiring board device, and a method of manufacturing the same, and a stretchable wiring board device

Embodiments of the present invention relate to a wiring board device and a method of manufacturing the same, which can integrate wires in three dimensions and have stretchability, and to electronic devices such as a stretchable display device including the wiring board device.

The present invention is a patent filed as part of a basic research project conducted with the support of the Korea Research Foundation with the funding of the government (Ministry of Science and Technology Information and Communication) in 2018.

Related 1

[Task identification number] 2016R1A5A1938472

[Ministry Name] Ministry of Science and Technology Information and Communication

[Research Management Organization] Korea Research Foundation

[Research Project Name] (Basic Research Project in Science and Engineering) Leading Research Center Support Project

[Research Title] Human-Centered Soft Robot Technology Research Center

[Contribution rate] 1/2

[Organization] Seoul National University

[Research Period] 2018.01.01~2018.12.31

Related matter 2

[Task identification number] NRF 2015R1A2A2A04006933

[Ministry Name] Ministry of Science and Technology Information and Communication

[Research Management Organization] Korea Research Foundation

[Research project name] Individual research support project (middle research)

[Research Title] Fractal Cut-based Hyperform Structure Implementation: Aesthetics of Structural Transform

[Contribution rate] 1/2

[Organization] Seoul National University

[Research Period] 2015.05.01~2018.04.30

Recently, as the demand for a large screen in portable electronic devices increases, display technologies such as foldable electronic devices, rollable electronic devices, and stretchable electronic devices are being developed and commercialized. The above-described electronic devices do not deform an element susceptible to deformation, but provide mechanical operation by replacing parts such as wirings, substrates, and the like with little influence on electrical performance with deformable materials.

In particular, the stretchable electronic device according to the prior art is designed so as not to be affected by mechanical deformation by imparting deformability to metal wiring through a folded structure pattern in a form that can be stretched, and by placing electrical elements on the substrate like islands. I can. At this time, a space for placing a deformable wiring pattern on the substrate is necessary, so there must be a gap between the elements. Due to the nature of the elastic substrate, where the Poisson's ratio is a positive value, the shrinkage of the substrate in a direction perpendicular to the tensile direction is Therefore, an additional spacing between the devices to prevent collision of the devices is required.

However, due to the above-described spacing between devices, the stretchable electronic device according to the prior art has a problem in that the area is increased and the resolution is decreased.

In order to solve the problems of the prior art as described above, the present invention proposes an electronic device including a wiring board device, a method of manufacturing the same, and a wiring board device capable of integrating wires in three dimensions and having elasticity.

Other objects of the present invention may be derived by those skilled in the art through the following examples.

In order to achieve the above object, according to a preferred embodiment of the present invention, there is provided a wiring board apparatus comprising: a plurality of substrates stacked and disposed; A plurality of conductive structures inserted into each of the plurality of substrates; And a plurality of conductive vias electrically connecting the plurality of electric elements disposed on the outer surface of the wiring board device and the plurality of conductive structures through via holes formed in each of the plurality of substrates, but the plurality of conductive structures. Each of the structures has a deformable structure, and there is provided a substrate device for wiring.

The conductive structure may include an oxetic structure.

The conductive structure is an elastic material and may have a zero or negative Poisson's ratio.

The substrate may be made of an elastic material.

Each of the plurality of substrates may reduce Poisson's ratio due to the insertion of the conductive structure, and the plurality of conductive structures may transmit electrical signals together with the plurality of conductive vias.

Each of the plurality of conductive structures has a form in which a plurality of unit structures are connected, the unit structure has a border made of a conductive material, and a material forming the substrate may be present inside the border.

Based on a plan view, for each of the plurality of conductive structures, each of the plurality of unit structures in one conductive structure may be disposed so as not to overlap with each of the plurality of unit structures in at least one other conductive structure.

The shape of the unit structure may include a re-entrant shape including a hinge in the edge, a rotating shape in which the edge rotates, and a chiral shape.

The plurality of electrical elements are disposed on an upper surface of an uppermost substrate among the plurality of substrates, and each of the plurality of conductive vias is electrically connected to the conductive structure inserted into any one of the plurality of substrates, It may penetrate through at least one substrate disposed above any one of the substrates.

The conductive via may penetrate into an edge of at least one of the plurality of unit structures.

The plurality of electric elements may be arranged in a matrix form, and each of the plurality of electric elements may be disposed in contact with other adjacent electric elements or disposed at predetermined intervals.

In addition, according to another embodiment of the present invention, there is provided an electronic device comprising: a plurality of substrates stacked and arranged; A plurality of conductive structures inserted into each of the plurality of substrates; A plurality of electrical elements disposed on an uppermost substrate among the plurality of substrates; And a plurality of conductive vias electrically connecting the plurality of electric elements and the plurality of conductive structures through via holes formed in each of the plurality of substrates, wherein each of the plurality of conductive structures has a deformable structure. An electronic device is provided.

In addition, according to another embodiment of the present invention, inserting a conductive structure having a deformable structure into each of a plurality of substrates; Stacking a plurality of substrates into which the conductive structures are inserted; Forming a plurality of via holes in each of the plurality of substrates into which the conductive structure is inserted; And inserting a plurality of conductive vias into the plurality of via holes; including, wherein an upper surface of the plurality of conductive vias is electrically connected to a plurality of electrical elements, and a lower surface of the plurality of conductive vias is the plurality of substrates There is provided a method of manufacturing a wiring board device, characterized in that it is electrically connected to a conductive structure inserted into each.

According to the present invention, since the wiring can be integrated in three dimensions, the degree of integration of the wiring board device and the electronic device can be improved, and when the electronic device is a stretchable display device, the resolution can be increased.

In addition, the effects of the present invention are not limited to the above effects, and should be understood to include all effects that can be deduced from the configuration of the invention described in the detailed description or claims of the present invention.

1 is a diagram illustrating a perspective view of an electronic device according to an embodiment of the present invention.
2 is a diagram illustrating a plan view of an electronic device according to an embodiment of the present invention.
3 is a diagram illustrating a cross-sectional view of an electronic device according to an embodiment of the present invention.
4 is an exploded perspective view of an electronic device according to an embodiment of the present invention.
5 is a diagram for explaining the concept of a non-oxetic structure and an oxetic structure.
6 is a view showing an example of a hinge included in the unit structure of the conductive structure according to the present invention.
7 to 10 are views showing examples of the shape of the unit structure of the conductive structure according to the present invention.
11 is a diagram showing an example in which an electronic device is deformed by an external force according to the present invention.
12 is a view showing a flowchart of a method of manufacturing a wiring board according to an embodiment of the present invention.

Singular expressions used in the present specification include plural expressions unless the context clearly indicates otherwise. In the present specification, terms such as “consisting of” or “comprising” should not be construed as necessarily including all of the various elements or various steps described in the specification, and some of the elements or some steps It may not be included, or it should be interpreted that it may further include additional elements or steps. In addition, terms such as "... unit" and "module" described in the specification mean units that process at least one function or operation, which may be implemented as hardware or software, or as a combination of hardware and software. .

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing a perspective view of an electronic device according to an embodiment of the present invention, Figure 2 is a view showing a plan view of the electronic device according to an embodiment of the present invention, and Figure 3 is an embodiment of the present invention A diagram showing a cross-sectional view of an electronic device according to an example, and FIG. 4 is a diagram illustrating an exploded perspective view (excluding a substrate) of the electronic device according to an embodiment of the present invention.

1 to 4, the electronic device is an electronic device having elasticity, and may include a wiring board device 110 and a plurality of electrical elements 120. As an example, the electronic device may be a stretchable display device in which the electric element 120 is a pixel element, but the present invention is not limited thereto.

The wiring substrate device 110 is a substrate device having elasticity and includes a plurality of substrates 111, a plurality of conductive structures 112, and a plurality of conductive vias 113.

The plurality of substrates 111 are stacked and disposed, and is preferably made of an elastic material in order to secure flexibility and elasticity. As an example, the substrate 111 is an elastic material, and the Poisson's ratio, which means the ratio between the horizontal deformation and the vertical deformation due to the stress generated inside the material, is a positive value (for example, a value of about 0.47 to 0.52). ).

Meanwhile, in FIGS. 1 to 4, an example in which two substrates 111 are stacked is illustrated, but the present invention is not limited thereto, and three or more substrates 111 may be stacked.

In addition, each of the plurality of conductive structures 112 is inserted into the plurality of substrates 111.

In this case, each of the plurality of conductive structures 112 has a deformable structure, and the deformable structure may include an auxetic structure. In this case, the Poisson's ratio of each of the plurality of conductive structures 112 may have a value of 0 or negative. In addition, each of the plurality of conductive structures 112 may be made of an elastic material, and when applied to an external force, the conductive structure 112 expands, and when the external force disappears, the shape of the conductive structure 112 is restored to its original shape. As an example, the elastic conductive structure 112 may have a material of a metal wire or a carbon nanotube (for example, a conductive carbon nanostructure).

On the other hand, the meaning of inserting the conductive structure 112 into the substrate 111 means that the substrate 111 and the conductive structure 112 are manufactured, respectively, and then the conductive structure 112 is inserted into the substrate 111. In addition to that, it should be understood to include forming the conductive structure 112 so as to be buried inside the substrate 111 in the process of forming the substrate 111. In addition, the conductive structure 112 may be made of a material having higher strength than the substrate 111, and accordingly. The deformation of the substrate 111 may be greatly influenced. In addition, the shape of each of the plurality of conductive structures 112 inserted into the plurality of substrates 111 is preferably the same, but the present invention is not limited thereto.

Through the insertion of the plurality of conductive structures 112, the present invention can reduce the Poisson's ratio of each of the plurality of substrates 111 and improve elasticity. This is described in more detail below.

The plurality of conductive vias 113 are inserted into via holes formed in each of the plurality of substrates 111, and a plurality of electrical elements 120 and a plurality of conductive structures 112 disposed on the outer surface of the wiring board device 110 Connect electrically.

In addition, the plurality of electric elements 120 may preferably be disposed on an upper surface of the uppermost substrate among the plurality of substrates 111, and may be disposed in a matrix form. In this case, each of the plurality of electric elements 120 may be disposed in contact with other adjacent electric elements 120 or may be disposed apart at predetermined intervals.

In short, the wiring board device 110 of the present invention stacks a plurality of substrates 111 into which a conductive structure 112 is inserted, and connects the plurality of conductive vias 113 with the plurality of conductive structures 112. Electrical wiring can be formed in the dimensional space. In addition, by using the conductive structure 112 having a deformable structure including an oxetic structure, it is possible to prevent the electronic device or the wiring board device 110 from shrinking in a direction perpendicular to the external force when a force is applied from the outside. .

Hereinafter, the structure of the wiring board device 110 will be described in more detail with reference to FIGS. 5 to 9.

5 is a view for explaining the concept of a non-auxetic structure and an oxetic structure

Referring to the left drawing of FIG. 5, in the non-oxetic structure, when a force is applied to the outside of the material, the material expands in the direction in which the force is applied, and the material contracts in a direction perpendicular to the direction in which the force is applied. That is, the non-oxetic structure is a structure of a conventional general material, and the Poisson's ratio has a positive value.

However, referring to the right drawing of FIG. 5, the oxetic structure is that when a force is applied to the outside of the material, the material is elongated in the direction in which the force is applied, and at the same time, the material is elongated or maintained in a direction perpendicular to the direction in which the force is applied. do. Thus, the Poisson's ratio of a substance having an oxetic structure has a value of zero or negative. Examples of the oxetic structure will be described in more detail below.

Accordingly, in order to implement the aforementioned oxetic structure, the conductive structure 112 according to the present invention has a form in which a plurality of unit structures 112A are connected as shown in FIGS. 1 to 4. At this time, the unit structure 112A has an edge made of a material having elasticity and conductivity, and a material forming the substrate 111 exists inside the edge, and the adjacent unit structures 112A are connected to each other through a connection line. do. In addition, the conductive structure 112 is preferably formed to have a thin plane width and a thick thickness direction so that deformation in the plane direction occurs.

Meanwhile, the shape of the unit structure 112A shown in FIGS. 1 to 4 is only an example of the present invention, and if the Poisson's ratio of the conductive structure 112 is a structure having a value of 0 or a negative value, the unit structure according to the present invention Applicable to (112A). As an example of the present invention, the shape of the unit structure 112A may be a re-entrant shape in which a hinge exists at an edge, a rotating shape in which the edge rotates, and a chiral shape. In this case, the hinge has a structure that expands while the folded part is unfolded, and includes all of a curved straight line, a rounded curve, and a curved curve as shown in FIG. 6, and the hinge can be located at the vertex of the polygon of the unit structure. have.

7 to 10 illustrate examples of the shape of the unit structure 112A.

In FIG. 7, a unit structure 112A having a re-entrant shape including a hinge and having a negative Poisson's ratio is shown. Referring to FIG. 7, when an external force is applied in the vertical direction of the unit structure 112A, stress acts in the left and right directions of the unit structure 112A, and through this, the conductive structure 112 has a negative Poisson's ratio.

In FIG. 8, a unit structure 112A of a rotating shape with a rotating edge and a negative Poisson's ratio is shown. Referring to FIG. 8, when an external force is applied in the vertical direction of the unit structure 112A, the unit structure 112A rotates in a clockwise or counterclockwise direction, through which the conductive structure 112 has a negative Poisson's ratio. .

In FIG. 9, a chiral-shaped unit structure 112A having a negative Poisson's ratio is shown. Referring to FIG. 9, when an external force is applied in the vertical direction of the unit structure 112A, the unit structure 112A rotates in a clockwise or counterclockwise direction, and the connection line wound around the unit structure 112A is released. Through the conductive structure 112 has a negative Poisson's ratio.

In FIG. 10, a unit structure 112A of a re-entrant shape including a hinge and having a Poisson's ratio of 0 is shown. Referring to FIG. 9, the unit structure 112A has a shape in which two sub-unit structures are connected through a connection line, and through this structure, the conductive structure 112 has a Poisson's ratio of zero.

Meanwhile, as mentioned above, the plurality of unit structures 112A are electrically connected to the plurality of conductive vias 113 to transmit electrical signals. That is, each of the plurality of conductive vias 113 is electrically connected to the conductive structure 112 inserted into any one of the plurality of substrates 111 and is disposed above any one of the substrates. Penetrates at least one substrate.

As an example, referring to FIGS. 1 to 4, of the plurality of conductive vias 113, the conductive via A (113A) and the conductive via B (113B) are electrically connected to the edges of one or more unit structures of the conductive structure inserted into the first substrate. The conductive vias C (113C) and the conductive vias D (113D) among the plurality of conductive vias 113 penetrate into the rim of at least one unit structure of the conductive structure.

At this time, according to an embodiment of the present invention, the conductive via 113 electrically connected to the conductive structure 112 is connected to the rim of one or more unit structures among the plurality of unit structures, and preferably The conductive via 113 may be connected to portions other than the contact point. Since the portions other than the contact point are not involved in deformation, the reliability of the deformation structure can be improved.

In addition, according to an embodiment of the present invention, the conductive via 113 penetrating through the substrate 111 may penetrate into an edge of at least one unit structure among the plurality of unit structures. And, based on the plan view, for each of the plurality of conductive structures 112, each of the plurality of unit structures in the conductive structure 112 is disposed so as not to overlap with each of the plurality of unit structures in at least one other conductive structure 112 Can be.

In particular, as shown in FIGS. 1 to 4, when the unit structure includes a hinge and a plurality of unit structures are connected in a matrix form, based on the plan view, the rows of the plurality of conductive structures 112 are arranged identically. The hinges are formed on the same axis, and the rows of the plurality of conductive structures 112 may be disposed to be separated by a predetermined interval. Even in this case, the unit structures of each of the plurality of conductive structures 112 may be disposed so as not to overlap each other.

Through this, even if deformation occurs, the conductive via 113 may be disposed in a vertical direction, and a short circuit between the conductive via 113 and the conductive structure 112 does not occur.

Meanwhile, for stability of the conductive vias 113 across multiple layers, the deformation of the conductive structure 112 is analyzed and the deformation is designed to occur even if the conductive structure 112 is positioned in a different direction.

In summary, the wiring substrate device 110 of the present invention is a flexible substrate device, and includes a plurality of conductive structures 112 made of an elastic body and having an oxetic structure in a plurality of substrates 111 made of an elastic body that are stacked and arranged. Then, the plurality of conductive structures 112 are connected to the outside through the plurality of conductive vias 113. Accordingly, by inserting the conductive structure 112 serving as a wiring into the multi-layered substrate 111, the wiring can be constructed in three dimensions. In addition, as shown in FIG. 11, by using the conductive structure 112 of an oxetic structure having a zero or negative Poisson's ratio, even when an external force is applied, contraction in the planar direction does not occur, so that the electrical element 120 Minimize the separation of

Accordingly, it is possible to improve the degree of integration of the electric device, and when the wiring board device 110 is used in a foldable electronic device, a rollable electronic device, a stretchable electronic device, or the like, the resolution may be increased. In addition, by disposing the conductive structure 112 inside the substrate 111 so that the deformation occurring in the multiple layers is the same for each layer, stress generated in the conductive via 113 can be minimized.

In addition, since each layer is arranged in an independent structure, driving of each electric element 120 can be independently controlled. In addition, since the conductive via 113 is connected to a portion of the unit structure 112A except for a portion connected to the other unit structure 112A, reliability may be improved. In addition, since the conductive via 113 penetrates inside the edge of the unit structure 112A, a short circuit between the conductive via 113 and the conductive structure 112 does not occur.

12 is a view showing a flowchart of a method of manufacturing a wiring board according to an embodiment of the present invention. Hereinafter, a process performed for each step will be described.

First, in step 1210, a plurality of substrates and a conductive structure are formed. In this case, the plurality of substrates and the conductive structure may be made of an elastic material, and the conductive structure has a deformable structure including an oxetic structure.

Next, in step 1220, a conductive structure is inserted into each of the plurality of substrates.

In this case, inserting the conductive structure into the substrate means not only inserting the conductive structure into the substrate after manufacturing the substrate and the conductive structure, but also inserting the conductive structure into the substrate in the process of forming the substrate. It should be understood in the sense of including forming to be buried. As an example, after disposing a conductive structure on the glass, a solution in which a base material of a substrate and a curing agent are mixed in 10:1 is applied on the glass and the conductive structure, and then the substrate and the conductive structure can be integrally formed through curing. have.

Subsequently, in step 1230, a plurality of substrates having a conductive structure inserted therein are stacked.

Thereafter, in step 1240, a plurality of via holes are formed in each of the plurality of substrates into which the conductive structure is inserted.

Finally, in step 1250, a plurality of conductive vias are inserted into the plurality of via holes.

In this case, the upper surfaces of the plurality of conductive vias are electrically connected to a plurality of external electrical elements, and the lower surfaces of the plurality of conductive vias are electrically connected to the conductive structure inserted into each of the plurality of substrates.

Up to now, embodiments of a method of manufacturing a wiring board device according to the present invention have been described, and the configuration of the wiring board device 110 described in FIGS. 1 to 11 may be applied to this embodiment as it is. Accordingly, a more detailed description will be omitted.

As described above, in the present invention, specific matters such as specific components, etc., and limited embodiments and drawings have been described, but these are provided only to help the general understanding of the present invention, and the present invention is not limited to the above embodiments Anyone of ordinary skill in the field to which the present invention belongs can make various modifications and variations from this description. Therefore, the spirit of the present invention is limited to the described embodiments and should not be defined, and all things that are equivalent or equivalent to the claims as well as the claims to be described later fall within the scope of the spirit of the present invention. .

Claims (13)

In the wiring board device,
A plurality of substrates that are stacked and disposed and each formed with a plurality of via holes;
A plurality of conductive structures inserted into each of the plurality of substrates and having a deformable structure; And
A plurality of via holes inserted into the plurality of via holes and disposed on the outer surface of the wiring board device
A plurality of conductive vias electrically connecting the electric element and the plurality of conductive structures, wherein each of the plurality of conductive vias is inserted into any one of the plurality of substrates.
The substrate device for wiring, characterized in that the conductive structure and the electrical signal is transmitted by being electrically connected only between any one of the plurality of electrical elements. The method of claim 1,
The conductive structure is a substrate device for wiring, characterized in that it comprises an oxetic structure. The method of claim 1,
The conductive structure is an elastic material and has a zero or negative Poisson's ratio. The method of claim 3,
The substrate device for wiring, characterized in that the elastic material. The method of claim 3,
Each of the plurality of substrates is characterized in that the Poisson's ratio is reduced due to the insertion of the conductive structure. The method of claim 1,
Each of the plurality of conductive structures has a form in which a plurality of unit structures are connected, the unit structure has a border made of a conductive material, and a material forming the substrate is present inside the border. Device. The method of claim 6,
Based on a plan view, for each of the plurality of conductive structures, each of the plurality of unit structures in one conductive structure is disposed so as not to overlap with each of the plurality of unit structures in at least one other conductive structure. Substrate device. The method of claim 6,
The shape of the unit structure includes a re-entrant shape including a hinge at the edge, a rotating shape in which the edge rotates, and a chiral shape. The method of claim 6,
The plurality of electrical elements are disposed on an upper surface of an uppermost substrate among the plurality of substrates,
The substrate device for wiring, characterized in that penetrating through at least one substrate disposed above any one of the substrates. The method of claim 9,
The substrate device for wiring, wherein the conductive via penetrates into an edge of at least one unit structure among the plurality of unit structures. The method of claim 1,
The plurality of electric elements are arranged in a matrix form, wherein each of the plurality of electric elements is disposed in contact with other adjacent electric elements or disposed at predetermined intervals. In an electronic device,
A plurality of substrates that are stacked and disposed and formed with a plurality of via holes;
A plurality of conductive structures inserted into each of the plurality of substrates and having a deformable structure;
A plurality of electrical elements disposed on an uppermost substrate among the plurality of substrates; And
The plurality of electric elements and the plurality of conductive structures are connected through the plurality of via holes.
A plurality of conductive vias electrically connected to each other, wherein each of the plurality of conductive vias is inserted into any one of the plurality of substrates.
Electronic device, characterized in that the electrical signal is transmitted by being electrically connected only between the conductive structure and any one of the plurality of electrical elements. Inserting a conductive structure having a deformable structure into each of a plurality of substrates;
Stacking a plurality of substrates into which the conductive structures are inserted;
Forming a plurality of via holes in each of the plurality of substrates into which the conductive structure is inserted; And
Including, inserting a plurality of conductive vias into the plurality of via holes,
Top surfaces of the plurality of conductive vias are electrically connected to a plurality of electrical elements, and the
The lower surfaces of the plurality of conductive vias are electrically connected to a conductive structure inserted into each of the plurality of substrates, and each of the plurality of conductive vias is inserted into any one of the plurality of substrates.
A method of manufacturing a wiring board device, characterized in that it is electrically connected only between the conductive structure and any one of the plurality of electric elements to transmit an electric signal.

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