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KR102196378B1 - Semiconductor parts mounting apparatus - Google Patents

Semiconductor parts mounting apparatus Download PDF

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Publication number
KR102196378B1
KR102196378B1 KR1020200044531A KR20200044531A KR102196378B1 KR 102196378 B1 KR102196378 B1 KR 102196378B1 KR 1020200044531 A KR1020200044531 A KR 1020200044531A KR 20200044531 A KR20200044531 A KR 20200044531A KR 102196378 B1 KR102196378 B1 KR 102196378B1
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KR
South Korea
Prior art keywords
semiconductor
unit
semiconductor component
adhesive
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
KR1020200044531A
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Korean (ko)
Inventor
최윤화
박정민
김영훈
조정훈
Original Assignee
제엠제코(주)
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Application filed by 제엠제코(주) filed Critical 제엠제코(주)
Priority to KR1020200044531A priority Critical patent/KR102196378B1/en
Priority to US17/124,475 priority patent/US11823920B2/en
Priority to CN202011585355.3A priority patent/CN113539883B/en
Application granted granted Critical
Publication of KR102196378B1 publication Critical patent/KR102196378B1/en
Priority to TW110108649A priority patent/TWI781551B/en
Priority to JP2021040016A priority patent/JP7090194B2/en
Priority to EP21167082.3A priority patent/EP3896721B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/90—Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
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    • B23K1/012—Soldering with the use of hot gas
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    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
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Abstract

본 발명은, 반도체 유닛(11)이 배열된 기판(10)을 공급하는 기판 로딩부(110)와, 반도체 부품을 공급하는 한 개 이상의 반도체 부품 로더와, 반도체 유닛(11)의 정렬상태를 검사하는 제1 비전검사부(130)와, 반도체 부품을 반도체 유닛(11)에 실장하는 한 개 이상의 반도체 부품 픽커와, 반도체 유닛(11)과 반도체 부품 사이에 개재된 접착제를 경화시켜 부착하는 한 개 이상의 접착제 경화부(150)와, 반도체 부품이 실장된 기판(10)을 인출하는 기판 언로딩부(160)로 구성되어, 접착제 경화부(150)는 경화시키고자 하는 한 개 이상의 반도체 유닛(11)으로만 열원을 제한적으로 전달하여 기판(10) 상에서 열원이 공급되는 반도체 유닛(11)과 열원이 공급되지 않는 반도체 유닛(11) 별로 온도차가 발생하도록 하여서 경화시 전달되는 열원에 의한 제품특성에 대한 영향을 최소화할 수 있는, 반도체 부품 부착 장비를 개시한다.In the present invention, the substrate loading unit 110 for supplying the substrate 10 on which the semiconductor units 11 are arranged, at least one semiconductor component loader for supplying semiconductor components, and the alignment of the semiconductor unit 11 are checked. The first vision inspection unit 130 to perform, at least one semiconductor component picker for mounting the semiconductor component on the semiconductor unit 11, and at least one for hardening and attaching the adhesive interposed between the semiconductor unit 11 and the semiconductor component. Consisting of an adhesive curing unit 150 and a substrate unloading unit 160 for drawing out the substrate 10 on which the semiconductor component is mounted, the adhesive curing unit 150 is one or more semiconductor units 11 to be cured The heat source is limitedly transmitted to the substrate 10 so that a temperature difference occurs between the semiconductor unit 11 supplied with the heat source and the semiconductor unit 11 not supplied with the heat source. Disclosed is an equipment for attaching semiconductor components that can minimize the impact.

Description

반도체 부품 부착 장비{SEMICONDUCTOR PARTS MOUNTING APPARATUS}Equipment for attaching semiconductor parts{SEMICONDUCTOR PARTS MOUNTING APPARATUS}

본 발명은 반도체 유닛을 개별적으로 경화시켜서 경화시 전달되는 열원에 의한 제품특성에 대한 영향을 최소화하고, 반도체 장비를 인라인화시켜 후속 공정 장비와 연속적으로 연결할 수 있는, 반도체 부품 부착 장비에 관한 것이다.The present invention relates to an equipment for attaching semiconductor components that can individually cure a semiconductor unit to minimize the effect on product characteristics due to a heat source transmitted during curing, and to continuously connect semiconductor equipment to subsequent process equipment by inline.

일반적으로, 클립 마운트(clip mount) 장치는 반도체 칩과 클립을 부착하기 위해 열원을 필요로 하는 신터링이나 솔더링을 사용하여 반도체를 제조한다.In general, a clip mount device manufactures a semiconductor using sintering or soldering that requires a heat source to attach a semiconductor chip and a clip.

이와 관련한 다중클립 장비는 전도성 접착제가 도트된 리드프레임에 한꺼번에 복수의 클립을 커팅하여 실장하고, 리플로 노(reflow furnace)에서 일괄적으로 신터링이나 솔더링을 수행한다.The related multi-clip equipment cuts and mounts a plurality of clips at once on a lead frame with a conductive adhesive dot, and performs sintering or soldering in a batch in a reflow furnace.

예컨대, 오븐(oven)이나 리플로 노에 반도체 칩과 클립이 부착된 기판 전체를 넣어서 동시에 열을 가해 접착제를 경화시켜 양산하는데, 대량 생산에서는 용이할 수 있으나, 모든 반도체 부품에 동일한 온도가 인가되어 그 온도가 필요하지 않은 부품이나 기판 부분까지도 온도가 함께 올라가 제품의 특성에 악영향을 줄 수 있다.For example, it is mass-produced by putting the entire substrate on which the semiconductor chip and the clip is attached to an oven or reflow furnace and simultaneously applying heat to cure the adhesive.It can be easy in mass production, but the same temperature is applied to all semiconductor parts. Even parts or parts of the substrate that do not need the temperature may increase in temperature and adversely affect the characteristics of the product.

또한, 종래의 오븐이나 리플로 노를 사용해서 솔더링할 경우, 솔더가 녹을 때 솔더가 물처럼 용융되어 육안으로는 식별이 안되지만 20㎛ 내지 30㎛ 범위에서 무작위로 유동하고, 특정 유동 위치에서 경화되어 클립을 정위치에 실장한다하더라도 리플로 과정에서 재유동하기 때문에 일반적인 리플로 공정에서는 50㎛ 전후의 정렬오차를 감안해야 한다.In addition, in the case of soldering using a conventional oven or reflow furnace, when the solder melts, the solder melts like water and cannot be identified with the naked eye, but it randomly flows in the range of 20 µm to 30 µm and is cured at a specific flow position. Even if the clip is mounted in the correct position, it reflows during the reflow process, so alignment errors of around 50㎛ must be considered in the general reflow process.

한편, 클립이 올라가 솔더링되는 영역, 즉, 반도체 칩 상의 금속 패드는 50㎛ 전후의 실장 허용오차(mount tolerance)를 가지는데, 금속 패드가 작으면, 한 개의 클립을 실장할 때는 비전검사로 인식하면서 부착할 수 있지만, 여러 개를 동시에 실장할 때는 반도체 칩 자체가 이미 이전 공정인 반도체 칩 실장 공정에서 정중앙에 정렬되지 않은 경우도 있어 오차를 가지고 실장되기 때문에, 금속 패드가 작으면 결과적으로 클립을 정확하게 실장했더라도 금속 패드를 벗어나는 문제점도 있다.On the other hand, the region where the clip is raised and soldered, that is, the metal pad on the semiconductor chip, has a mount tolerance of around 50 μm. If the metal pad is small, it is recognized as a vision inspection when mounting one clip. Although it can be attached, when mounting several at the same time, the semiconductor chip itself may not be aligned in the center in the previous semiconductor chip mounting process, so it is mounted with an error. Even if it is mounted, there is also a problem of getting out of the metal pad.

이에, 오븐 또는 노를 통해 기판 전체에 열을 가해 동시에 경화시켜 모든 반도체 부품에 동일한 열이 인가되는 기존의 방식과 달리, 특정 반도체 유닛만을 제한적 또는 개별적으로 경화시켜서, 열원이 필요하지 않은 반도체 부품이나 기판 부분에는 열원에 의한 특성변화가 최소화되도록 할 수 있는 기술이 요구된다.Thus, unlike the conventional method in which heat is applied to the entire substrate through an oven or furnace to cure the same heat to all semiconductor parts at the same time, only specific semiconductor units are limited or individually cured, and thus semiconductor parts that do not require a heat source or A technology capable of minimizing change in characteristics due to a heat source is required for the substrate portion.

한국 등록특허공보 제1949334호 (반도체 패키지의 클립 본딩 장치 및 클립픽커, 2019.02.18)Korean Patent Publication No. 1949334 (Clip bonding device and clip picker for semiconductor package, 2019.02.18) 한국 등록특허공보 제1544086호 (반도체 패키지의 클립 부착 방법, 및 이에 사용되는 다중 클립 부착 장비, 2015.08.12)Korean Patent Publication No. 1544086 (A method of attaching a clip of a semiconductor package, and a multi-clip attaching equipment used therein, 2015.08.12) 한국 등록특허공보 제1612730호 (반도체 패키지의 클립 부착 방법 및 이를 위한 다중 클립 부착 장치, 2016.04.26)Korean Patent Publication No. 1612730 (A method for attaching a clip of a semiconductor package and a device for attaching multiple clips therefor, 2016.04.26)

본 발명의 사상이 이루고자 하는 기술적 과제는, 반도체 유닛을 개별적으로 경화시켜서 경화시 전달되는 열원에 의한 제품특성에 대한 영향을 최소화하고, 반도체 장비를 인라인화시켜 후속 공정 장비와 연속적으로 연결할 수 있는, 반도체 부품 부착 장비를 제공하는 데 있다.The technical problem to be achieved by the idea of the present invention is that the semiconductor unit is individually cured to minimize the effect on the product characteristics due to the heat source transmitted during curing, and the semiconductor equipment can be inlined to be continuously connected to the subsequent process equipment. It is to provide equipment for attaching semiconductor components.

전술한 목적을 달성하고자, 본 발명은, 반도체 패키지의 전기적 연결을 수행하는 반도체 부품 부착 장비에 있어서, 한 개 이상의 반도체 패키지를 제조할 수 있는 한 개 이상의 반도체 유닛이 배열된 기판을 공급하는 기판 로딩부; 반도체 부품을 공급하는 한 개 이상의 반도체 부품 로더; 상기 기판 상에서 상기 반도체 유닛의 정렬상태, 접착제 도포위치 및 접착제 도포유무 중 어느 하나 이상을 검사하는 제1 비전검사부; 상기 반도체 부품을 상기 기판으로 이송하여 상기 반도체 유닛에 실장하는 한 개 이상의 반도체 부품 픽커; 상기 반도체 유닛과 상기 반도체 부품 사이에 개재된 접착제를 경화시켜 부착하는 한 개 이상의 접착제 경화부; 및 상기 반도체 유닛에 상기 반도체 부품이 상기 접착제에 의해 경화되어 실장된 상기 기판을 인출하는 기판 언로딩부;를 포함하고, 상기 접착제 경화부는 경화시키고자 하는 한 개 이상의 상기 반도체 유닛으로 열원을 제한적으로 전달하여 상기 기판 상에서 열원이 공급되는 상기 반도체 유닛과 열원이 공급되지 않는 상기 반도체 유닛 별로 온도차가 발생하도록 하는, 반도체 부품 부착 장비를 제공한다.In order to achieve the above object, the present invention is a semiconductor component attaching equipment for performing electrical connection of a semiconductor package, a substrate loading for supplying a substrate on which one or more semiconductor units capable of manufacturing one or more semiconductor packages are arranged. part; One or more semiconductor component loaders for supplying semiconductor components; A first vision inspection unit for inspecting at least one of an alignment state of the semiconductor unit, an adhesive application position, and an adhesive application on the substrate; At least one semiconductor component picker for transporting the semiconductor component to the substrate and mounting the semiconductor component on the semiconductor unit; At least one adhesive curing unit for hardening and attaching an adhesive interposed between the semiconductor unit and the semiconductor component; And a substrate unloading unit for drawing out the substrate on which the semiconductor component is cured and mounted on the semiconductor unit by the adhesive, wherein the adhesive curing unit restricts a heat source to one or more semiconductor units to be cured. A semiconductor component attachment device is provided so that a temperature difference occurs between the semiconductor unit to which a heat source is supplied and the semiconductor unit to which a heat source is not supplied on the substrate.

여기서, 상기 반도체 유닛에 상기 반도체 부품을 접착하기 위한 상기 접착제를 공급하는 한 개 이상의 접착제 공급부를 더 포함할 수 있다.Here, it may further include at least one adhesive supply unit for supplying the adhesive for bonding the semiconductor component to the semiconductor unit.

또한, 상기 기판은 Cu 함량이 60% 이상일 수 있다.In addition, the substrate may have a Cu content of 60% or more.

또한, 상기 기판은 절연제를 포함할 수 있다.In addition, the substrate may include an insulating material.

이때, 상기 기판은 밀폐 반도체 패키지용일 수 있다.In this case, the substrate may be for a sealed semiconductor package.

또한, 상기 반도체 부품 로더는 반도체 칩을 공급할 수 있다.In addition, the semiconductor component loader may supply semiconductor chips.

여기서, 상기 반도체 칩은 IGBT, Diode, MOSFET, GaN소자 및 SiC 소자 중 어느 하나 이상일 수 있다.Here, the semiconductor chip may be at least one of an IGBT, a diode, a MOSFET, a GaN device, and a SiC device.

또한, 상기 반도체 부품 로더는 반도체 칩과 전기적으로 연결하는 금속 클립을 공급할 수 있다.In addition, the semiconductor component loader may supply a metal clip electrically connected to the semiconductor chip.

또한, 상기 접착제 공급부는 니들을 통해 상기 반도체 유닛으로 상기 접착제를 도팅하여 공급하거나, 상기 반도체 유닛 상부에서 상기 접착제를 분사하여 공급할 수 있다.In addition, the adhesive supply unit may supply by dotting the adhesive to the semiconductor unit through a needle or by spraying the adhesive from an upper portion of the semiconductor unit.

여기서, 상기 접착제는 솔더 합금일 수 있다.Here, the adhesive may be a solder alloy.

또한, 상기 접착제는 Ag 또는 Cu가 포함된 신터 소재일 수 있다.In addition, the adhesive may be a sinter material containing Ag or Cu.

이때, 상기 솔더 합금은 페이스트 상태이고, 상기 페이스트 내에 포함된 솔더 파티클 크기는 25㎛ 이하일 수 있다.In this case, the solder alloy is in a paste state, and the size of solder particles included in the paste may be 25 μm or less.

또한, 상기 솔더 합금은 소정 비율로 혼합된 Au 및 Sn을 포함할 수 있다.In addition, the solder alloy may include Au and Sn mixed in a predetermined ratio.

또한, 상기 반도체 부품 픽커는 60℃ 이상의 열원을 공급할 수 있다.In addition, the semiconductor component picker may supply a heat source of 60°C or higher.

또한, 상기 접착제 경화부는, 상기 반도체 부품 픽커에 의해 상기 접착체 상부에 상기 반도체 부품을 실장하면서 동시에 상기 접착제를 경화할 수 있다.In addition, the adhesive curing unit may harden the adhesive while mounting the semiconductor component on the adhesive body by the semiconductor component picker.

또한, 상기 접착제 경화부는, 상기 반도체 부품 픽커에 의해 상기 접착체 상부에 상기 반도체 부품을 실장한 후에 상기 접착제를 경화할 수 있다.In addition, the adhesive curing unit may cure the adhesive after mounting the semiconductor component on the adhesive body by the semiconductor component picker.

여기서, 상기 접착제 경화부는 솔더링 또는 신터링 방식에 의해 상기 접착제를 경화시킬 수 있다.Here, the adhesive curing unit may cure the adhesive by soldering or sintering.

또한, 상기 접착제 경화부는 레이저 가열에 의해 상기 접착제를 경화시킬 수 있다.In addition, the adhesive curing unit may cure the adhesive by laser heating.

또한, 상기 접착제 경화부는 히터에 의해 상기 반도체 유닛에 직접 접촉하여 상기 접착제를 경화시킬 수 있다.In addition, the adhesive curing unit may directly contact the semiconductor unit by a heater to cure the adhesive.

또한, 상기 접착제 경화부는 열풍(hot air)에 의해 상기 반도체 유닛에 직접 접촉하지 않고 상기 접착제를 경화시킬 수 있다.In addition, the adhesive curing unit may cure the adhesive without directly contacting the semiconductor unit by hot air.

여기서, 상기 열풍의 온도는 50℃ 내지 450℃이며, 상기 열풍에는 소정 비율(%)의 질소 또는 수소가 포함될 수 있다.Here, the temperature of the hot air is 50°C to 450°C, and the hot air may contain nitrogen or hydrogen in a predetermined ratio (%).

또한, 상기 접착제 경화부는 상기 기판 상에서 상기 반도체 유닛별로 순차적으로 상기 접착제를 경화시킬 수 있다.In addition, the adhesive curing unit may sequentially cure the adhesive for each semiconductor unit on the substrate.

또한, 상기 접착제 경화부는 상기 기판 상에서 두 개 이상으로 상기 반도체 유닛으로 구성된 반도체 유닛 블록별로 순차적으로 상기 접착제를 경화시킬 수 있다.In addition, the adhesive curing unit may sequentially cure the adhesive for each semiconductor unit block composed of two or more semiconductor units on the substrate.

여기서, 상기 접착제 경화부는 두 개 이상의 상기 반도체 유닛 블록별로 순차적으로 상기 접착제를 경화시킬 수 있다.Here, the adhesive curing unit may sequentially cure the adhesive for each of two or more semiconductor unit blocks.

또한, 상기 접착제 경화부는 상기 기판 상에서 한 개 이상의 행 또는 열로 그룹핑되어 배열된 반도체 유닛 그룹별로 순차적으로 상기 접착제를 경화시킬 수 있다.In addition, the adhesive curing unit may sequentially cure the adhesive for each semiconductor unit group arranged in one or more rows or columns on the substrate.

또한, 상기 기판 로딩부에 의해 상기 기판을 공급하는 단계와, 상기 반도체 부품 픽커에 의해 상기 반도체 유닛에 상기 반도체 부품을 실장하는 단계와, 상기 접착제 경화부에 의해 상기 반도체 유닛과 상기 반도체 부품 사이에 개재된 접착제를 경화시키는 단계와, 상기 기판 언로딩부에 의해 상기 반도체 유닛에 상기 반도체 부품이 부착된 상기 기판을 인출하는 단계를 수행하여 반도체 부품 부착 공정을 수행할 수 있다.In addition, supplying the substrate by the substrate loading unit, mounting the semiconductor component on the semiconductor unit by the semiconductor component picker, and between the semiconductor unit and the semiconductor component by the adhesive curing unit A process of attaching a semiconductor component may be performed by curing the intervening adhesive and by performing the step of removing the substrate to which the semiconductor component is attached to the semiconductor unit by the substrate unloading unit.

또한, 상기 기판 로딩부에 의해 상기 기판을 공급하는 단계와, 상기 반도체 부품 픽커에 의해 상기 반도체 유닛에 제1 반도체 부품을 실장하는 단계와, 상기 반도체 부품 픽커에 의해 상기 반도체 유닛에 제2 반도체 부품을 실장하는 단계와, 상기 접착제 경화부에 의해 상기 반도체 유닛과 상기 제1 반도체 부품 사이에 개재된 접착제와 상기 제1 반도체 부품과 상기 제2 반도체 부품 사이에 개재된 접착제를 경화시키는 단계와, 상기 기판 언로딩부에 의해 상기 반도체 유닛에 상기 제1 반도체 부품 및 제2 반도체 부품이 적층되어 부착된 상기 기판을 인출하는 단계를 수행하여 반도체 부품 부착 공정을 수행할 수 있다.Further, supplying the substrate by the substrate loading unit, mounting a first semiconductor component on the semiconductor unit by the semiconductor component picker, and a second semiconductor component on the semiconductor unit by the semiconductor component picker Mounting, and curing the adhesive interposed between the semiconductor unit and the first semiconductor component by the adhesive curing unit and the adhesive interposed between the first semiconductor component and the second semiconductor component, and the The semiconductor component attaching process may be performed by performing the step of pulling out the attached substrate by stacking the first semiconductor component and the second semiconductor component on the semiconductor unit by a substrate unloading unit.

또한, 상기 기판 로딩부에 의해 상기 기판을 공급하는 단계와, 상기 반도체 부품 픽커에 의해 상기 반도체 유닛에 제1 반도체 부품을 실장하는 단계와, 상기 접착제 경화부에 의해 상기 반도체 유닛과 상기 제1 반도체 부품 사이에 개재된 접착제를 1차 경화시키는 단계와, 상기 반도체 부품 픽커에 의해 상기 반도체 유닛에 제2 반도체 부품을 실장하는 단계와, 상기 접착제 경화부에 의해 상기 제1 반도체 부품과 상기 제2 반도체 부품 사이에 개재된 접착제를 2차 경화시키는 단계와, 상기 기판 언로딩부에 의해 상기 반도체 유닛에 상기 제1 반도체 부품 및 제2 반도체 부품이 적층되어 부착된 상기 기판을 인출하는 단계를 수행하여 반도체 부품 부착 공정을 수행할 수 있다.In addition, the steps of supplying the substrate by the substrate loading unit, mounting a first semiconductor component on the semiconductor unit by the semiconductor component picker, and the semiconductor unit and the first semiconductor by the adhesive curing unit Primary curing of an adhesive interposed between components, mounting a second semiconductor component on the semiconductor unit by the semiconductor component picker, and the first semiconductor component and the second semiconductor by the adhesive curing unit Performing secondary curing of the adhesive interposed between components, and pulling out the substrate on which the first semiconductor component and the second semiconductor component are stacked and attached to the semiconductor unit by the substrate unloading unit. Part attachment process can be performed.

여기서, 상기 반도체 부품은 반도체 칩 또는 금속 클립일 수 있다.Here, the semiconductor component may be a semiconductor chip or a metal clip.

또한, 상기 반도체 부품 로더는 반도체 부품 정렬버퍼를 더 포함하고, 상기 반도체 부품 픽커는 상기 반도체 부품 로더로부터 상기 반도체 부품 정렬버퍼로 이송된 상기 반도체 부품을 상기 반도체 유닛으로 이송할 수 있다.In addition, the semiconductor component loader may further include a semiconductor component alignment buffer, and the semiconductor component picker may transfer the semiconductor component transferred from the semiconductor component loader to the semiconductor component alignment buffer to the semiconductor unit.

또한, 상기 반도체 유닛으로의 상기 반도체 부품의 부착위치를 검사하는 제2 비전검사부를 더 포함할 수 있다.In addition, a second vision inspection unit for inspecting the attachment position of the semiconductor component to the semiconductor unit may be further included.

또한, 상기 반도체 유닛에 상기 반도체 부품이 상기 접착제에 의해 경화되어 실장된 상기 기판을 플라즈마 세정하여 상기 기판 언로딩부로 이송하는 플라즈마 세정부를 더 포함할 수 있다.In addition, the semiconductor unit may further include a plasma cleaning unit for plasma cleaning the substrate mounted by curing the semiconductor component by the adhesive and transferring the substrate to the substrate unloading unit.

본 발명에 의하면, 오븐 또는 노를 통해 기판 전체에 열을 가해 동시에 경화시켜 모든 반도체 부품에 동일한 열이 인가되는 기존의 방식과 달리, 경화시키고자 하는 한 개 이상의 반도체 유닛으로만 열원을 제한적으로 전달하여 기판 상에서 열원이 공급되는 반도체 유닛과 열원이 공급되지 않는 반도체 유닛 별로 온도차가 발생하도록 하여 경화시 전달되는 열원에 의한 제품특성에 대한 영향을 최소화할 수 있는 효과가 있다.According to the present invention, heat source is limitedly transmitted to only one or more semiconductor units to be cured, unlike the conventional method in which heat is applied to the entire substrate through an oven or furnace to cure at the same time and the same heat is applied to all semiconductor components. Thus, there is an effect of minimizing the effect on product characteristics due to the heat source transmitted during curing by causing a temperature difference between the semiconductor unit supplied with the heat source and the semiconductor unit not supplied with the heat source on the substrate.

또한, 반도체 부품 부착 공정별로 접착제 경화를 개별적으로 수행하여 해당 장비들을 인라인화하여 또 다른 후속 공정을 위한 장비와의 연결이 용이해져서 장비 운영 효율을 향상시킬 수 있다.In addition, by individually performing adhesive curing for each semiconductor component attaching process, corresponding equipment is inlined to facilitate connection with equipment for another subsequent process, thereby improving equipment operation efficiency.

도 1은 본 발명의 실시예에 의한 반도체 부품 부착 장비의 전체구성에 대한 평면도를 도시한 것이다.
도 2는 도 1의 반도체 부품 부착 장비에 투입되는 기판을 분리 도시한 것이다.
도 3 및 도 4는 도 1의 반도체 부품 부착 장비를 공정순서에 따라 분리 도시한 것이다.
도 5는 다른 예의 반도체 부품 부착 장비의 전체구성에 대한 평면도를 도시한 것이다.
도 6 내지 도 8은 도 5의 반도체 부품 부착 장비를 공정순서에 따라 분리 도시한 것이다.
도 9는 또 다른 예의 반도체 부품 부착 장비의 전체구성에 대한 평면도를 도시한 것이다.
도 10 내지 도 12는 도 9의 반도체 부품 부착 장비를 공정순서에 따라 분리 도시한 것이다.1 is a plan view showing the overall configuration of a semiconductor component attaching equipment according to an embodiment of the present invention.
FIG. 2 is a separate diagram illustrating a substrate input to the semiconductor component attachment equipment of FIG. 1.
3 and 4 are views showing the semiconductor component attachment equipment of FIG. 1 separated according to a process sequence.
5 is a plan view showing the overall configuration of another example of a semiconductor component attaching equipment.
6 to 8 are views showing the semiconductor component attachment equipment of FIG. 5 separated according to a process sequence.
9 is a plan view showing an overall configuration of another example of the semiconductor component attaching equipment.
10 to 12 are views showing the semiconductor component attachment equipment of FIG. 9 separated according to a process sequence.

이하, 첨부한 도면을 참고로 하여 본 발명의 실시예에 대하여 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 상세히 설명한다. 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며 여기에서 설명하는 실시예에 한정되지 않는다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art may easily implement the present invention. The present invention may be implemented in various different forms, and is not limited to the embodiments described herein.

본 발명의 실시예에 의한 반도체 부품 부착 장비는, 전체적으로, 반도체 유닛(11)이 배열된 기판(10)을 공급하는 기판 로딩부(110)와, 반도체 부품을 공급하는 한 개 이상의 반도체 부품 로더와, 반도체 유닛(11)의 정렬상태를 검사하는 제1 비전검사부(130)와, 반도체 부품을 반도체 유닛(11)에 실장하는 한 개 이상의 반도체 부품 픽커와, 반도체 유닛(11)과 반도체 부품 사이에 개재된 접착제를 경화시켜 부착하는 한 개 이상의 접착제 경화부(150)와, 반도체 부품이 실장된 기판(10)을 인출하는 기판 언로딩부(160)로 구성되어, 접착제 경화부(150)는 경화시키고자 하는 한 개 이상의 반도체 유닛(11)으로만 열원을 제한적으로 전달하여 기판(10) 상에서 열원이 공급되는 반도체 유닛(11)과 열원이 공급되지 않는 반도체 유닛(11) 별로 온도차가 발생하도록 하여서 경화시 전달되는 열원에 의한 제품특성에 대한 영향을 최소화하는 것을 요지로 한다.The semiconductor component attaching equipment according to an embodiment of the present invention includes, as a whole, a substrate loading unit 110 for supplying a substrate 10 on which the semiconductor units 11 are arranged, at least one semiconductor component loader for supplying semiconductor components, and , Between the first vision inspection unit 130 for inspecting the alignment of the semiconductor unit 11, at least one semiconductor component picker for mounting the semiconductor component on the semiconductor unit 11, and the semiconductor unit 11 and the semiconductor component It consists of at least one adhesive curing unit 150 for curing and attaching the interposed adhesive and a substrate unloading unit 160 for drawing out the substrate 10 on which the semiconductor component is mounted, and the adhesive curing unit 150 is cured. The heat source is limitedly transmitted to only one or more semiconductor units 11 to be determined, so that a temperature difference occurs between the semiconductor unit 11 supplied with the heat source and the semiconductor unit 11 not supplied with the heat source on the substrate 10. The main point is to minimize the effect on the product characteristics caused by the heat source transmitted during curing.

이하, 도 1 내지 도 12를 참조하여, 앞서 언급한 반도체 패키지의 전기적 연결을 수행하는 반도체 부품 부착 장비의 구성을 상세히 후술하고자 한다.Hereinafter, with reference to FIGS. 1 to 12, a configuration of a semiconductor component attachment device for performing electrical connection of the aforementioned semiconductor package will be described in detail later.

우선, 기판 로딩부(110)는 한 개 이상의 반도체 패키지를 제조할 수 있는 한 개 이상의 반도체 유닛(11)이 배열된 기판(10)을 제1 비전검사부(130)로 이송하여 공급한다.First, the substrate loading unit 110 transfers and supplies the substrate 10 on which one or more semiconductor units 11 capable of manufacturing one or more semiconductor packages are arranged to the first vision inspection unit 130.

여기서, 기판 로딩부(110)는 복수로 적층된 기판(10)을 순차적으로 제1 비전검사부(130)로 이송하는 매거진(magazine)(도 3의 (a), 도 6의 (a), 도 10의 (a) 참조)으로 구성되거나, 트레이(tray)에 얹혀 순차적으로 제1 비전검사부(130)로 이송하거나, 캐리어 테이프(carrier tape)에 접착하여 순차적으로 제1 비전검사부(130)로 이송하도록 구성될 수 있다. Here, the substrate loading unit 110 is a magazine for sequentially transferring the plurality of stacked substrates 10 to the first vision inspection unit 130 (Fig. 3 (a), Fig. 6 (a), Fig. 10(a)), placed on a tray and sequentially transferred to the first vision inspection unit 130, or adhered to a carrier tape and sequentially transferred to the first vision inspection unit 130 Can be configured to

참고로, 도시되지는 않았으나, 매거진은 전후진 슬라이딩하는 푸셔(pusher)에 의해 기판(10)의 후단을 밀어 제1 비전검사부(130)로 순차적으로 이송할 수 있다.For reference, although not shown, the magazine may be sequentially transferred to the first vision inspection unit 130 by pushing the rear end of the substrate 10 by a pusher that slides back and forth.

한편, 도 2의 (a)에 도시된 바와 같이, 기판(10)에는 한 개 이상의 반도체 유닛(11)이 연결더미(12)에 의해 상호 연결된 행과 열의 매트릭스 형태로 배열될 수 있다.Meanwhile, as shown in (a) of FIG. 2, one or more semiconductor units 11 may be arranged in a matrix form of rows and columns interconnected by a connection dummy 12 on the substrate 10.

또한, 기판(10)은 Cu 함량이 60% 이상일 수 있으며, 절연제를 포함할 수 있고, 밀폐(hemetic) 반도체 패키지용일 수 있다.In addition, the substrate 10 may have a Cu content of 60% or more, may include an insulating material, and may be for a hemetic semiconductor package.

다음, 반도체 부품 로더는 한 개 이상으로 구성되어, 반도체 칩(21) 또는 금속 클립(22)의 반도체 부품을 공급하는데, 도 1, 도 5 및 도 9에 도시된 바와 같이, 웨이퍼 로더(120A)에 의해 이송된 웨이퍼(23) 상에서 반도체 칩(21)을 픽업하여 공급하는 반도체 칩 로더(120B)와, 반도체 칩(21)을 전기적으로 연결하는 금속 클립(22)을 픽업하여 공급하는 금속 클립 로더(120C)로 구성될 수 있다.Next, the semiconductor component loader is composed of one or more, to supply the semiconductor component of the semiconductor chip 21 or the metal clip 22, as shown in Figs. 1, 5 and 9, the wafer loader (120A) A semiconductor chip loader 120B that picks up and supplies the semiconductor chip 21 on the wafer 23 transferred by the semiconductor chip 21 and a metal clip loader that picks up and supplies a metal clip 22 that electrically connects the semiconductor chip 21 (120C) can be configured.

여기서, 반도체 칩(21)은 IGBT, Diode, MOSFET, GaN소자 및 SiC 소자 중 어느 하나 이상일 수 있다.Here, the semiconductor chip 21 may be at least one of an IGBT, a diode, a MOSFET, a GaN device, and a SiC device.

한편, 반도체 부품 로더는 반도체 부품 정렬버퍼(121a,b)를 더 포함하고, 반도체 부품 픽커는 반도체 부품 로더로부터 반도체 부품 정렬버퍼(121a,b)로 이송된 반도체 부품을 반도체 유닛(11)으로 이송할 수 있다.Meanwhile, the semiconductor component loader further includes semiconductor component alignment buffers 121a and b, and the semiconductor component picker transfers the semiconductor components transferred from the semiconductor component loader to the semiconductor component alignment buffers 121a and b to the semiconductor unit 11 can do.

예컨대, 반도체 칩(21)인 경우에는, 반도체 칩 로더(120B)에 의해 웨이퍼(23)로부터 반도체 칩(21)을 반도체 칩 정렬버퍼(121a)로 이송하여 정렬한 후, 반도체 부품 픽커에 의해 반도체 칩 정렬버퍼(121a)로부터 반도체 칩(21)을 반도체 유닛(11)으로 이송하고, 금속 클립(22)인 경우에는, 금속 클립 로더(120C)에 의해 클립어레이(미도시)로부터 커팅된 금속 클립(22)을 금속 클립 정렬버퍼(121b)로 이송하여 정렬한 후, 반도체 부품 픽커에 의해 금속 클립 정렬버퍼(121b)로부터 금속 클립(22)을 반도체 유닛(11)으로 이송할 수 있다.For example, in the case of the semiconductor chip 21, the semiconductor chip 21 is transferred from the wafer 23 to the semiconductor chip alignment buffer 121a by the semiconductor chip loader 120B and aligned, and then the semiconductor chip is aligned by a semiconductor component picker. The semiconductor chip 21 is transferred from the chip alignment buffer 121a to the semiconductor unit 11, and in the case of a metal clip 22, a metal clip cut from a clip array (not shown) by a metal clip loader 120C After (22) is transferred to the metal clip alignment buffer 121b and aligned, the metal clip 22 may be transferred to the semiconductor unit 11 from the metal clip alignment buffer 121b by a semiconductor component picker.

다음, 제1 비전검사부(130)는 기판(10) 상부에 이격 형성된 XYR축 스테이지(미도시)에 결합 형성되어 기판(10) 상에서 반도체 유닛(11)의 정렬상태, 접착제의 도포위치, 접착제의 도포유무 등을 검사 및 확인한다. 일 실시예로서, 제1 비전검사부(130)는 기판(10) 상에서의 반도체 유닛(11)을 개별적으로 촬영하고 반도체 유닛(11)의 정렬상태를 검사하여 접착제 도포위치를 확인하고, 접착제 공급부(170)에 의한 반도체 유닛(11)으로의 접착제의 도포 결과를 검사한다.Next, the first vision inspection unit 130 is bonded to an XYR-axis stage (not shown) formed on the upper portion of the substrate 10, and the alignment of the semiconductor unit 11 on the substrate 10, the application position of the adhesive, and the adhesive Inspect and confirm the application or not. As an embodiment, the first vision inspection unit 130 individually photographs the semiconductor units 11 on the substrate 10 and inspects the alignment of the semiconductor units 11 to check the adhesive application position, and the adhesive supply unit ( The result of applying the adhesive to the semiconductor unit 11 by 170) is inspected.

여기서, 앞서 언급한 접착제는 기판 로딩 공정 이전에 기판(10)의 반도체 유닛(11)에 미리 도포될 수 있거나, 기판 로딩 공정 이후에 한 개 이상의 접착제 공급부(170)를 통해 반도체 유닛(11)에 반도체 부품을 접착하기 위한 접착제를 공급할 수도 있다.Here, the aforementioned adhesive may be previously applied to the semiconductor unit 11 of the substrate 10 before the substrate loading process, or the semiconductor unit 11 through one or more adhesive supply units 170 after the substrate loading process. It is also possible to supply an adhesive for bonding semiconductor components.

다음, 반도체 부품 픽커는 한 개 이상으로 구성되어, 웨이퍼(23)로부터 직접 반도체 부품을 기판(10)으로 이송하여 반도체 유닛(11)에 실장하거나, 반도체 부품 정렬버퍼(121a,b)로부터 반도체 부품을 기판(10)으로 이송하여 반도체 유닛(11)에 실장한다.Next, the semiconductor component picker consists of one or more, and transfers the semiconductor component directly from the wafer 23 to the substrate 10 and mounts it on the semiconductor unit 11, or the semiconductor component from the semiconductor component alignment buffers 121a and b. Is transferred to the substrate 10 and mounted on the semiconductor unit 11.

예컨대, 반도체 부품 픽커는 반도체 칩 정렬버퍼(121a)로 반도체 칩(21)을 픽업하는 반도체 칩 픽커(140A)(도 3의 (c), 도 6의 (c), 도 10의 (c) 참조)와, 금속 클립 정렬버퍼(121b)로 금속 클립(22)을 픽업하는 금속 클립 픽커(140B)(도 7의 (f), 도 11의 (f) 참조)로 구성될 수 있다.For example, the semiconductor component picker is a semiconductor chip picker 140A that picks up the semiconductor chip 21 with the semiconductor chip alignment buffer 121a (see Figs. 3(c), 6(c), and 10(c)). ), and a metal clip picker 140B (refer to FIG. 7(f) and FIG. 11(f)) to pick up the metal clip 22 with the metal clip alignment buffer 121b.

여기서, 반도체 부품 픽커는 60℃ 이상의 열원을 공급하여서, 픽업된 반도체 부품을 예열하여 접착제 경화부(150)에 의한 접착제 경화를 보다 신속하게 수행하도록 할 수도 있다.Here, the semiconductor component picker may supply a heat source of 60° C. or higher to preheat the picked up semiconductor component so that the adhesive curing by the adhesive curing unit 150 is performed more quickly.

다음, 접착제 경화부(150)는 한 개 이상으로 구성되어, 반도체 유닛(11)과 반도체 칩(21) 및 금속 클립(22)의 반도체 부품 사이에 개재된 접착제를 열원에 의해 경화시켜 부착한다.Next, the adhesive curing unit 150 is composed of one or more, and the adhesive interposed between the semiconductor unit 11 and the semiconductor chip 21 and the semiconductor component of the metal clip 22 is hardened by a heat source and attached thereto.

한편, 접착제 경화부(150)는 경화시키고자 하는 한 개 이상의 반도체 유닛(11)으로만 열원을 제한적으로 전달하여 기판(10) 상에서 열원이 공급되는 반도체 유닛(11)과 열원이 공급되지 않는 반도체 유닛(11) 별로 온도차가 발생하도록 하여 경화시 전달되는 열원에 의한 제품특성에 대한 영향을 최소화할 수 있다.On the other hand, the adhesive curing unit 150 limitedly transfers a heat source to only one or more semiconductor units 11 to be cured, so that the semiconductor unit 11 supplied with the heat source on the substrate 10 and the semiconductor unit not supplied with the heat source By allowing a temperature difference to occur for each unit 11, it is possible to minimize the effect on product characteristics caused by a heat source transmitted during curing.

즉, 오븐(oven) 또는 노(furnace)를 통해 기판 전체에 열을 가해 동시에 경화시켜 모든 반도체 부품에 동일한 열이 인가되는 기존의 방식과 달리, 반도체 유닛(11)만을 제한적으로 경화시켜서, 열원이 필요하지 않은 반도체 부품이나 기판 부분에는 열원에 의한 특성변화가 최소화되도록 할 수 있다.In other words, unlike the conventional method in which heat is applied to the entire substrate through an oven or a furnace and cured at the same time and the same heat is applied to all semiconductor components, only the semiconductor unit 11 is limitedly cured, thereby reducing the heat source. It is possible to minimize the change in characteristics due to a heat source in a semiconductor component or substrate that is not required.

또한, 접착제 경화부(150)는, 반도체 부품의 특성에 따라 선택적으로, 반도체 부품 픽커에 의해 접착체 상부에 반도체 부품을 실장하면서 동시에 접착제를 경화하거나, 반도체 부품 픽커에 의해 접착체 상부에 반도체 부품을 실장한 후에 접착제를 경화할 수도 있다.In addition, the adhesive curing unit 150 may selectively mount a semiconductor component on the adhesive body by a semiconductor component picker and cure the adhesive at the same time according to the characteristics of the semiconductor component, or a semiconductor component on the adhesive body by a semiconductor component picker. The adhesive may be cured after mounting.

예컨대, 접착제 경화부(150)는 솔더링(soldering) 또는 신터링(sintering) 방식에 의해 접착제를 경화시킬 수 있다.For example, the adhesive curing unit 150 may cure the adhesive by soldering or sintering.

또한, 접착제 경화부(150)는 레이저 가열에 의해 비접촉 방식으로 접착제를 경화시키거나, 히터(151)에 의해 반도체 유닛(11)에 직접 접촉하는 접촉 방식으로 접착제를 경화시킬 수 있다.In addition, the adhesive curing unit 150 may cure the adhesive in a non-contact method by laser heating, or may cure the adhesive in a contact method in which the heater 151 directly contacts the semiconductor unit 11.

예컨대, 도 4의 (d)에 도시된 바와 같이, 접착제 경화부(150)는 히터(151)를 상승시키고 반도체 유닛(11)의 하단에 접촉시켜 반도체 유닛(11)과 반도체 칩(21) 사이에 개재된 접착제를 경화시키도록 하여, 반도체 부품 로더와 반도체 부품 픽커와 접착제 경화부를 포함하는 개별 장비로 구성할 수 있다.For example, as shown in (d) of FIG. 4, the adhesive curing unit 150 raises the heater 151 and makes contact with the lower end of the semiconductor unit 11 so that between the semiconductor unit 11 and the semiconductor chip 21 By curing the adhesive interposed in the semiconductor component loader, the semiconductor component picker, and can be composed of individual equipment including an adhesive curing unit.

또는, 도면에 도시하지는 않았으나, 접착제 경화부는 열풍(hot air)에 의해 상기 반도체 유닛에 직접 접촉하지 않고, 간접적 접촉에 의해 접착제를 경화시킬 수 있다. 이때, 열풍의 온도는 50℃ 내지 450℃일 수 있으며, 열풍에는 기 설정된 비율(%) 즉, 소정 비율의 질소 또는 수소가 포함될 수 있다.Alternatively, although not shown in the drawings, the adhesive curing unit may not directly contact the semiconductor unit by hot air, but may cure the adhesive by indirect contact. In this case, the temperature of the hot air may be 50°C to 450°C, and the hot air may include a predetermined ratio (%), that is, a predetermined ratio of nitrogen or hydrogen.

또는, 도 7의 (d)에 도시된 바와 같이, 접착제 경화부(150)는 히터(151)를 상승시키고 반도체 유닛(11)의 하단에 접촉시켜 반도체 유닛(11)과 반도체 칩(21) 사이에 개재된 접착제를 경화시키고, 도 8의 (g)에 도시된 바와 같이 접착제 경화부(150)는 히터(151)를 상승시키고 반도체 유닛(11)의 하단에 접촉시켜 반도체 칩(21)과 금속 클립(22) 사이에 개재된 접착제를 개별적으로 경화시켜, 반도체 칩(21) 및 금속 클립(22) 부착 공정별로 접착제 경화를 개별적으로 수행하여서, 반도체 칩의 부착을 수행하는 1차 장비 및 금속 클립의 부착을 수행하는 2차 장비를 인라인화하여(inline) 또 다른 후속 공정을 위한 장비와의 연결이 용이해지도록 할 수 있다.Alternatively, as shown in (d) of FIG. 7, the adhesive curing unit 150 raises the heater 151 and makes contact with the lower end of the semiconductor unit 11 so that between the semiconductor unit 11 and the semiconductor chip 21 Curing the adhesive interposed in the adhesive, as shown in Figure 8 (g), the adhesive curing unit 150 raises the heater 151 and makes contact with the lower end of the semiconductor unit 11 so that the semiconductor chip 21 and the metal Primary equipment and metal clips for attaching semiconductor chips by individually curing the adhesive interposed between the clips 22 to individually cure the adhesive for each process of attaching the semiconductor chip 21 and the metal clip 22 The secondary equipment that performs the attachment of can be inlined to facilitate connection with equipment for another subsequent process.

즉, 기존의 오븐, 노 또는 리플로(reflow)에 의한 일괄적인 접착제 경화시에는 다른 장비와의 연결이 불가능하여 인라인화하기 어려운 반면에, 반도체 칩과 금속 클립의 반도체 부품의 부착 후에 개별적으로 경화시켜서 후속 공정 장비와 연속적으로 인라인화할 수 있는 효과를 구현할 수 있다.In other words, in the case of batch curing of adhesive by conventional oven, furnace or reflow, it is difficult to inline because connection with other equipment is impossible, while it is hardened separately after attaching semiconductor parts of semiconductor chips and metal clips. By doing so, the effect of being able to be continuously inlined with the subsequent process equipment can be realized.

또는, 도 12의 (h)에 도시된 바와 같이, 접착제 경화부(150)는 히터(151)를 상승시키고 반도체 유닛(11)의 하단에 접촉시켜 반도체 유닛(11)과 반도체 칩(21) 및 반도체 칩(21) 및 금속 클립(22) 사이에 각각 개재된 접착제를 동시에 경화시켜, 금속 클립(22) 부착 공정 후에 접착제 경화를 일괄적으로 수행할 수도 있다.Alternatively, as shown in (h) of FIG. 12, the adhesive curing unit 150 raises the heater 151 and makes contact with the lower end of the semiconductor unit 11 so that the semiconductor unit 11 and the semiconductor chip 21 and The adhesives interposed between the semiconductor chip 21 and the metal clip 22 may be cured at the same time, and the adhesive curing may be performed collectively after the attaching process of the metal clip 22.

여기서, 반도체 칩의 부착을 수행하는 1차 장비 및 금속 클립의 부착을 수행하는 2차 장비를 예시하였으나, 이에 한정되지 않고 다른 반도체 부품을 부착을 수행하는 N차 장비를 연속적으로 인라인화시킬 수도 있다.Here, the primary equipment for attaching the semiconductor chip and the secondary equipment for attaching the metal clip have been exemplified, but are not limited thereto, and the N-th equipment for attaching other semiconductor components may be continuously inlined. .

한편, 접착제 경화부(150)는 기판(10)을 다양한 방식으로 경화시킬 수 있는데, 예컨대, 도 2의 (b1)에 도시된 바와 같이, 접착제 경화부(150)는 기판(10) 상에서 반도체 유닛(11)별로 순차적으로 접착제를 경화시키거나, 도 2의 (b2)에 도시된 바와 같이, 기판(10) 상에서 두 개 이상으로 반도체 유닛(11)으로 구성된 반도체 유닛 블록별로 순차적으로 접착제를 경화시키거나, 도 2의 (b3)에 도시된 바와 같이, 두 개 이상의 반도체 유닛 블록별로 순차적으로 접착제를 경화시키거나, 도 2의 (b4,b5,b6)에 도시된 바와 같이, 기판(10) 상에서 한 개 이상의 행 또는 열로 그룹핑되어 배열된 반도체 유닛 그룹별로 순차적으로 접착제를 경화시킬 수 있다.On the other hand, the adhesive curing unit 150 may cure the substrate 10 in various ways. For example, as shown in (b1) of FIG. 2, the adhesive curing unit 150 is a semiconductor unit on the substrate 10 The adhesive is sequentially cured for each (11), or the adhesive is sequentially cured for each semiconductor unit block composed of two or more semiconductor units 11 on the substrate 10, as shown in FIG. 2(b2). Or, as shown in (b3) of FIG. 2, the adhesive is sequentially cured for each of two or more semiconductor unit blocks, or on the substrate 10, as shown in (b4, b5, and b6) of FIG. 2 The adhesive may be sequentially cured for each group of semiconductor units grouped and arranged in one or more rows or columns.

다음, 기판 언로딩부(160)는 반도체 유닛(11)에 반도체 부품이 접착제에 의해 경화되어 실장된 기판(10)을 인출하여 후속 공정으로 제공한다.Next, the substrate unloading unit 160 pulls out the substrate 10 on which the semiconductor component is mounted on the semiconductor unit 11 by curing it with an adhesive and provides it to a subsequent process.

한편, 접착제 공급부(170)는 니들(needle)(171)을 통해 반도체 유닛(11)으로 접착제를 도팅하여(dotting) 공급하거나(도 3의 (b) 참조), 반도체 유닛(11) 상부에서 분사노즐(미도시)을 접착제를 분사하여 공급할 수 있다.On the other hand, the adhesive supply unit 170 is supplied by dotting the adhesive to the semiconductor unit 11 through a needle (171) (see Fig. 3 (b)), or sprayed from the top of the semiconductor unit 11 A nozzle (not shown) may be supplied by spraying an adhesive.

여기서, 접착제는 솔더 합금이거나, Ag 또는 Cu가 포함된 신터 소재일 수 있고, 솔더 합금은 기 설정된 소정 비율로 혼합된 Au 및 Sn을 포함할 수 있다.Here, the adhesive may be a solder alloy or a sinter material including Ag or Cu, and the solder alloy may include Au and Sn mixed at a predetermined ratio.

또한, 솔더 합금은 페이스트 상태이고, 페이스트 내에 포함된 솔더 파티클 크기는 25㎛ 이하일 수 있다.In addition, the solder alloy is in a paste state, and the size of solder particles included in the paste may be 25 μm or less.

한편, 앞서 언급한 바와 같이, 반도체 부품 로더와 반도체 부품 픽커와 접착제 경화부를 포함하는 개별 장비로 구성하여 반도체 부품 부착 공정을 수행할 수 있는데, 도 3 및 도 4에 도시된 바와 같이, 기판 로딩부(110)에 의해 기판(10)을 공급하는 단계(a)와, 접착제 공급부(170)에 의해 반도체 유닛(11)에 접착제를 도포하는 단계(b)와, 반도체 부품 픽커인 반도체 칩 픽커(140A)에 의해 반도체 유닛(11)에 반도체 부품인 반도체 칩(21)을 실장하는 단계(c)와, 접착제 경화부(150)에 의해 접착제를 경화시키는 단계(d)와, 기판 언로딩부(160)에 의해 반도체 유닛(11)에 반도체 부품이 부착된 기판(10)을 인출하는 단계를 수행하여 반도체 부품 부착 공정을 수행할 수 있다(e).Meanwhile, as mentioned above, a semiconductor component attachment process can be performed by configuring a semiconductor component loader, a semiconductor component picker, and individual equipment including an adhesive curing section. As shown in FIGS. 3 and 4, the substrate loading section The step (a) of supplying the substrate 10 by 110, the step (b) of applying an adhesive to the semiconductor unit 11 by the adhesive supply unit 170, and a semiconductor chip picker 140A, which is a semiconductor component picker. ) Mounting the semiconductor chip 21 as a semiconductor component on the semiconductor unit 11 (c), curing the adhesive by the adhesive curing unit 150 (d), and the substrate unloading unit 160 ), the semiconductor component attaching process may be performed by performing the step of pulling out the substrate 10 on which the semiconductor component is attached to the semiconductor unit 11 (e).

또는, 반도체 칩의 부착을 수행하는 1차 장비 및 금속 클립의 부착을 수행하는 2차 장비를 인라인화하여 반도체 부품 부착 공정을 수행할 수 있는데, 도 6 내지 도 8에 도시된 바와 같이, 기판 로딩부(110)에 의해 기판(10)을 공급하는 단계(a)와, 접착제 공급부(170)에 의해 반도체 유닛(11)에 접착제를 도포하는 단계(b)와, 반도체 부품 픽커인 반도체 칩 픽커(140A)에 의해 반도체 유닛(11)에 제1 반도체 부품인 반도체 칩(21)을 실장하는 단계(c)와, 접착제 경화부(150)에 의해 접착제를 1차 경화시켜 반도체 유닛(11)에 반도체 칩(21)을 부착하는 단계(d)와, 접착제 공급부(170)에 의해 제1 반도체 부품에 접착제를 도포하는 단계(e)와, 반도체 부품 픽커인 금속 클립 픽커(140B)에 의해 반도체 유닛(11)에 제2 반도체 부품인 금속 클립(22)을 실장하는 단계(f)와, 접착제 경화부(150)에 의해 접착제를 2차 경화시켜 반도체 칩(21)에 금속 클립(22)을 부착하는 단계(g)와, 기판 언로딩부(160)에 의해 반도체 유닛(11)에 제1 반도체 부품 및 제2 반도체 부품이 적층되어 부착된 기판(10)을 인출하는 단계(h)를 수행하여 반도체 부품 부착 공정을 수행할 수 있다.Alternatively, the semiconductor component attachment process may be performed by inline the primary equipment for attaching the semiconductor chip and the secondary equipment for attaching the metal clip. As shown in Figs. 6 to 8, substrate loading The step (a) of supplying the substrate 10 by the unit 110, the step (b) of applying an adhesive to the semiconductor unit 11 by the adhesive supply unit 170, and a semiconductor chip picker (a semiconductor component picker) ( Step (c) of mounting the semiconductor chip 21, which is a first semiconductor component, on the semiconductor unit 11 by 140A), and the first curing of the adhesive by the adhesive curing unit 150 is applied to the semiconductor unit 11 The semiconductor unit (d) attaching the chip 21, the step (e) of applying an adhesive to the first semiconductor component by the adhesive supply unit 170, and a metal clip picker 140B, which is a semiconductor component picker, Step (f) of mounting the metal clip 22 as a second semiconductor component to 11), and attaching the metal clip 22 to the semiconductor chip 21 by secondary curing the adhesive by the adhesive curing unit 150 Perform step (g) and step (h) of pulling out the attached substrate 10 by stacking the first semiconductor component and the second semiconductor component on the semiconductor unit 11 by the substrate unloading unit 160. Part attachment process can be performed.

또는, 반도체 유닛(11)과 반도체 칩(21) 및 반도체 칩(21) 및 금속 클립(22) 사이에 각각 개재된 접착제를 동시에 경화시켜 반도체 부품 부착 공정을 수행할 수 있는데, 도 10 내지 도 12에 도시된 바와 같이, 기판 로딩부(110)에 의해 기판(10)을 공급하는 단계(a)와, 접착제 공급부(170)에 의해 반도체 유닛(11)에 접착제를 도포하는 단계(b)와, 반도체 부품 픽커인 반도체 칩 픽커(140A)에 의해 반도체 유닛(11)에 제1 반도체 부품인 반도체 칩(21)을 실장하는 단계(c,d)와, 접착제 공급부(170)에 의해 제1 반도체 부품에 접착제를 도포하는 단계(e)와, 반도체 부품 픽커인 금속 클립 픽커(140B)에 의해 반도체 유닛(11)에 제2 반도체 부품인 금속 클립(22)을 실장하는 단계(f,g)와, 접착제 경화부(150)에 의해 접착제를 경화시키는 단계(h)와, 기판 언로딩부(160)에 의해 반도체 유닛(11)에 제1 반도체 부품 및 제2 반도체 부품이 적층되어 부착된 기판(10)을 인출하는 단계(i)를 수행하여 반도체 부품 부착 공정을 수행할 수 있다.Alternatively, a semiconductor component attachment process may be performed by simultaneously curing the adhesives interposed between the semiconductor unit 11 and the semiconductor chip 21 and the semiconductor chip 21 and the metal clip 22, respectively. FIGS. 10 to 12 As shown in the step (a) of supplying the substrate 10 by the substrate loading unit 110, the step (b) of applying an adhesive to the semiconductor unit 11 by the adhesive supply unit 170, Steps (c, d) of mounting the semiconductor chip 21 as the first semiconductor component on the semiconductor unit 11 by the semiconductor chip picker 140A, which is a semiconductor component picker, and the first semiconductor component by the adhesive supply unit 170 A step (e) of applying an adhesive to the semiconductor unit, and a step (f,g) of mounting the second semiconductor component metal clip 22 on the semiconductor unit 11 by the metal clip picker 140B, which is a semiconductor component picker, The step (h) of curing the adhesive by the adhesive curing unit 150, and the substrate 10 to which the first semiconductor component and the second semiconductor component are stacked and attached to the semiconductor unit 11 by the substrate unloading unit 160 A process of attaching a semiconductor component may be performed by performing the step (i) of withdrawing ).

한편, 도 3의 (c), 도 6의 (c), 도 7의 (f), 도 10의 (c) 및 도 11의 (f)에 도시된 바와 같이, 반도체 유닛(11)으로의 반도체 부품의 부착위치를 검사하는 제2 비전검사부(180)를 더 포함할 수 있는데, 제2 비전검사부(180)는, 상향으로 반도체 칩 픽커(140A)에 의한 반도체 칩(21) 및 금속 클립 픽커(140B)에 의한 금속 클립(22)의 정렬위치를 각각 검사하고 하향으로 반도체 유닛(11) 상의 반도체 칩(21) 및 금속 클립(22)의 실장위치를 각각 검사하는 상하 정렬 비전 카메라(top/bottom align vision camera)로 구성될 수 있다.On the other hand, as shown in Figure 3 (c), Figure 6 (c), Figure 7 (f), Figure 10 (c) and Figure 11 (f), the semiconductor to the semiconductor unit 11 It may further include a second vision inspection unit 180 for inspecting the attachment position of the component, the second vision inspection unit 180, the semiconductor chip 21 and the metal clip picker by the semiconductor chip picker 140A upward ( 140B), a vertical alignment vision camera (top/bottom) that inspects each of the alignment positions of the metal clips 22 and downwardly checks the mounting positions of the semiconductor chips 21 and the metal clips 22 on the semiconductor unit 11, respectively. align vision camera).

또한, 반도체 유닛(11)에 반도체 부품이 접착제에 의해 경화되어 실장된 기판(10)을 플라즈마 세정하여(plasma cleaning) 반도체 칩(21) 또는 금속 클립(22)에 흡착된 불순물을 기체화시켜 제거한 후 기판 언로딩부(160)로 이송하는 플라즈마 세정부(미도시)를 더 포함할 수 있다.In addition, the substrate 10 on which the semiconductor component is cured with an adhesive on the semiconductor unit 11 is plasma cleaned to remove impurities adsorbed on the semiconductor chip 21 or the metal clip 22 by gasification. A plasma cleaning unit (not shown) that is transferred to the substrate unloading unit 160 may be further included.

따라서, 전술한 바와 같은 반도체 부품 부착 장비의 구성에 의해서, 오븐 또는 노를 통해 기판 전체에 열을 가해 동시에 경화시켜 모든 반도체 부품에 동일한 열이 인가되는 기존의 방식과 달리, 경화시키고자 하는 한 개 이상의 반도체 유닛으로만 열원을 제한적으로 전달하여 기판 상에서 열원이 공급되는 반도체 유닛과 열원이 공급되지 않는 반도체 유닛 별로 온도차가 발생하도록 하여 경화시 전달되는 열원에 의한 제품특성에 대한 영향을 최소화할 수 있고, 반도체 부품 부착 공정별로 접착제 경화를 개별적으로 수행하여 해당 장비들을 인라인화하여 또 다른 후속 공정을 위한 장비와의 연결이 용이해질 수 있다.Therefore, unlike the conventional method in which heat is applied to the entire substrate through an oven or furnace and cured at the same time, the same heat is applied to all semiconductor parts by the configuration of the semiconductor component attaching equipment as described above. The heat source is limitedly transferred to only the above semiconductor units, so that a temperature difference occurs between the semiconductor unit supplied with the heat source and the semiconductor unit not supplied with the heat source on the substrate, thereby minimizing the effect on the product characteristics caused by the heat source transferred during curing. , By individually performing adhesive curing for each semiconductor component attachment process, corresponding equipment is inlined, so that connection with equipment for another subsequent process can be facilitated.

이상, 본 발명을 도면에 도시된 실시예를 참조하여 설명하였다. 그러나, 본 발명은 이에 한정되지 않고 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 본 발명과 균등한 범위에 속하는 다양한 변형예 또는 다른 실시예가 가능하다. 따라서, 본 발명의 진정한 보호범위는 이어지는 특허청구범위에 의해 정해져야 할 것이다.In the above, the present invention has been described with reference to the embodiments shown in the drawings. However, the present invention is not limited thereto, and various modifications or other embodiments falling within the scope equivalent to the present invention are possible by those of ordinary skill in the art. Therefore, the true scope of protection of the present invention should be determined by the following claims.

110 : 기판 로딩부 120A : 웨이퍼 로더
120B : 반도체 칩 로더 120C : 금속 클립 로더
121a : 반도체 칩 정렬버퍼 121b : 금속 클립 정렬버퍼
130 : 제1 비전검사부 140A : 반도체 칩 픽커
140B : 금속 클립 픽커 150 : 접착제 경화부
151 : 히터 160 : 기판 언로딩부
170 : 접착제 공급부 171 : 니들
180 : 제2 비전검사부 10 : 기판
11 : 반도체 유닛 12 : 연결더미
21 : 반도체 칩 22 : 금속 클립110: substrate loading unit 120A: wafer loader
120B: semiconductor chip loader 120C: metal clip loader
121a: semiconductor chip alignment buffer 121b: metal clip alignment buffer
130: first vision inspection unit 140A: semiconductor chip picker
140B: metal clip picker 150: adhesive cured portion
151: heater 160: substrate unloading unit
170: adhesive supply unit 171: needle
180: second vision inspection unit 10: substrate
11: semiconductor unit 12: connection pile
21: semiconductor chip 22: metal clip

Claims (32)

반도체 패키지의 전기적 연결을 수행하는 반도체 부품 부착 장비에 있어서,
한 개 이상의 반도체 패키지를 제조할 수 있는 한 개 이상의 반도체 유닛이 배열된 기판을 공급하는 기판 로딩부;
반도체 부품을 공급하는 한 개 이상의 반도체 부품 로더;
상기 기판 상에서 상기 반도체 유닛의 정렬상태, 접착제 도포위치 및 접착제 도포유무 중 어느 하나 이상을 검사하는 제1 비전검사부;
상기 반도체 부품을 상기 기판으로 이송하여 상기 반도체 유닛에 실장하는 한 개 이상의 반도체 부품 픽커;
상기 반도체 유닛과 상기 반도체 부품 사이에 개재된 접착제를 경화시켜 부착하는 한 개 이상의 접착제 경화부; 및
상기 반도체 유닛에 상기 반도체 부품이 상기 접착제에 의해 경화되어 실장된 상기 기판을 인출하는 기판 언로딩부;를 포함하고,
상기 접착제 경화부는 경화시키고자 하는 한 개 이상의 상기 반도체 유닛으로 열원을 제한적으로 전달하여 상기 기판 상에서 열원이 공급되는 상기 반도체 유닛과 열원이 공급되지 않는 상기 반도체 유닛 별로 온도차가 발생하도록 하며,
상기 접착제 경화부는, 상기 반도체 부품 픽커에 의해 상기 접착체 상부에 상기 반도체 부품을 실장하면서 동시에 상기 접착제를 경화하거나, 또는
상기 접착제 경화부는, 상기 반도체 부품 픽커에 의해 상기 접착체 상부에 상기 반도체 부품을 실장한 후에 상기 접착제를 경화하고,
상기 접착제 경화부는 히터를 포함하며, 상기 히터는 상기 반도체 부품이 실장되는 상기 반도체 유닛의 저부에 배치되고 상기 접착제의 경화시 상승하여 상기 반도체 유닛에 직접 접촉하여 상기 접착제를 경화시키는 것을 특징으로 하는, 반도체 부품 부착 장비.In the semiconductor component attachment equipment for performing electrical connection of a semiconductor package,
A substrate loading unit that supplies a substrate on which one or more semiconductor units capable of manufacturing one or more semiconductor packages are arranged;
One or more semiconductor component loaders for supplying semiconductor components;
A first vision inspection unit for inspecting at least one of an alignment state of the semiconductor unit on the substrate, an adhesive application position, and an adhesive application;
At least one semiconductor component picker for transporting the semiconductor component to the substrate and mounting the semiconductor component on the semiconductor unit;
At least one adhesive curing unit for hardening and attaching an adhesive interposed between the semiconductor unit and the semiconductor component; And
A substrate unloading unit for drawing out the substrate on which the semiconductor component is cured and mounted on the semiconductor unit by the adhesive; and
The adhesive curing unit limitedly transmits a heat source to one or more semiconductor units to be cured so that a temperature difference occurs between the semiconductor unit supplied with a heat source and the semiconductor unit not supplied with a heat source on the substrate,
The adhesive curing unit may cure the adhesive while mounting the semiconductor component on the adhesive body by the semiconductor component picker, or
The adhesive curing unit cures the adhesive after mounting the semiconductor component on the adhesive body by the semiconductor component picker,
The adhesive curing unit comprises a heater, wherein the heater is disposed at the bottom of the semiconductor unit on which the semiconductor component is mounted and rises when the adhesive is cured to directly contact the semiconductor unit to cure the adhesive. Equipment for attaching semiconductor parts. 제 1 항에 있어서,
상기 반도체 유닛에 상기 반도체 부품을 접착하기 위한 상기 접착제를 공급하는 한 개 이상의 접착제 공급부를 더 포함하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
At least one adhesive supply unit for supplying the adhesive for adhering the semiconductor component to the semiconductor unit, the semiconductor component attachment equipment. 제 1 항에 있어서,
상기 기판은 Cu 함량이 60% 이상인 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
The substrate is characterized in that the Cu content of 60% or more, semiconductor component attachment equipment. 제 1 항에 있어서,
상기 기판은 절연제를 포함하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
The equipment for attaching a semiconductor component, characterized in that the substrate comprises an insulation. 제 4 항에 있어서,
상기 기판은 밀폐 반도체 패키지용인 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 4,
The substrate is characterized in that for a sealed semiconductor package, semiconductor component attachment equipment. 제 1 항에 있어서,
상기 반도체 부품 로더는 반도체 칩을 공급하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
The semiconductor component loader is characterized in that for supplying a semiconductor chip, semiconductor component attachment equipment. 제 6 항에 있어서,
상기 반도체 칩은 IGBT, Diode, MOSFET, GaN소자 및 SiC 소자 중 어느 하나 이상인 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 6,
The semiconductor chip is characterized in that at least one of IGBT, Diode, MOSFET, GaN device and SiC device, semiconductor component attachment equipment. 제 1 항에 있어서,
상기 반도체 부품 로더는 반도체 칩과 전기적으로 연결하는 금속 클립을 공급하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
The semiconductor component loader is characterized in that supplying a metal clip electrically connected to the semiconductor chip, semiconductor component attachment equipment. 제 2 항에 있어서,
상기 접착제 공급부는 니들을 통해 상기 반도체 유닛으로 상기 접착제를 도팅하여 공급하거나, 상기 반도체 유닛 상부에서 상기 접착제를 분사하여 공급하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 2,
The adhesive supply unit, characterized in that for supplying by dotting the adhesive to the semiconductor unit through a needle, or supplying by spraying the adhesive from the upper portion of the semiconductor unit. 제 9 항에 있어서,
상기 접착제는 솔더 합금인 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 9,
Device for attaching semiconductor components, characterized in that the adhesive is a solder alloy. 제 9 항에 있어서,
상기 접착제는 Ag 또는 Cu가 포함된 신터 소재인 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 9,
The adhesive is characterized in that the sinter material containing Ag or Cu, semiconductor component attachment equipment. 제 10 항에 있어서,
상기 솔더 합금은 페이스트 상태이고, 상기 페이스트 내에 포함된 솔더 파티클 크기는 25㎛ 이하인 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 10,
The solder alloy is in a paste state, and the solder particle size included in the paste is 25 μm or less. 제 10 항에 있어서,
상기 솔더 합금은 소정 비율로 혼합된 Au 및 Sn을 포함하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 10,
The solder alloy is characterized in that containing Au and Sn mixed in a predetermined ratio, semiconductor component attachment equipment. 제 1 항에 있어서,
상기 반도체 부품 픽커는 60℃ 이상의 열원을 공급하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
The semiconductor component picker, characterized in that supplying a heat source of 60°C or higher. 삭제delete 삭제delete 제 1 항에 있어서,
상기 접착제 경화부는 솔더링 또는 신터링 방식에 의해 상기 접착제를 경화시키는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
The adhesive curing unit, characterized in that curing the adhesive by soldering or sintering method, semiconductor component attachment equipment. 삭제delete 삭제delete 삭제delete 삭제delete 제 1 항에 있어서,
상기 접착제 경화부는 상기 기판 상에서 상기 반도체 유닛별로 순차적으로 상기 접착제를 경화시키는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
The adhesive curing unit sequentially cures the adhesive for each of the semiconductor units on the substrate. 제 1 항에 있어서,
상기 접착제 경화부는 상기 기판 상에서 두 개 이상으로 상기 반도체 유닛으로 구성된 반도체 유닛 블록별로 순차적으로 상기 접착제를 경화시키는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
Wherein the adhesive curing unit sequentially cures the adhesive for each semiconductor unit block composed of two or more semiconductor units on the substrate. 제 23 항에 있어서,
상기 접착제 경화부는 두 개 이상의 상기 반도체 유닛 블록별로 순차적으로 상기 접착제를 경화시키는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 23,
The adhesive curing unit sequentially cures the adhesive for each of two or more semiconductor unit blocks. 제 1 항에 있어서,
상기 접착제 경화부는 상기 기판 상에서 한 개 이상의 행 또는 열로 그룹핑되어 배열된 반도체 유닛 그룹별로 순차적으로 상기 접착제를 경화시키는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
The adhesive curing unit sequentially cures the adhesive for each semiconductor unit group arranged in one or more rows or columns on the substrate. 제 1 항에 있어서,
상기 기판 로딩부에 의해 상기 기판을 공급하는 단계와, 상기 반도체 부품 픽커에 의해 상기 반도체 유닛에 상기 반도체 부품을 실장하는 단계와, 상기 접착제 경화부에 의해 상기 반도체 유닛과 상기 반도체 부품 사이에 개재된 접착제를 경화시키는 단계와, 상기 기판 언로딩부에 의해 상기 반도체 유닛에 상기 반도체 부품이 부착된 상기 기판을 인출하는 단계를 수행하여 반도체 부품 부착 공정을 수행하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
Supplying the substrate by the substrate loading unit, mounting the semiconductor component on the semiconductor unit by the semiconductor component picker, and interposed between the semiconductor unit and the semiconductor component by the adhesive curing unit A semiconductor component attaching process, characterized in that performing a step of curing an adhesive and removing the substrate to which the semiconductor component is attached to the semiconductor unit by the substrate unloading unit. 제 1 항에 있어서,
상기 기판 로딩부에 의해 상기 기판을 공급하는 단계와, 상기 반도체 부품 픽커에 의해 상기 반도체 유닛에 제1 반도체 부품을 실장하는 단계와, 상기 반도체 부품 픽커에 의해 상기 반도체 유닛에 제2 반도체 부품을 실장하는 단계와, 상기 접착제 경화부에 의해 상기 반도체 유닛과 상기 제1 반도체 부품 사이에 개재된 접착제와 상기 제1 반도체 부품과 상기 제2 반도체 부품 사이에 개재된 접착제를 경화시키는 단계와, 상기 기판 언로딩부에 의해 상기 반도체 유닛에 상기 제1 반도체 부품 및 제2 반도체 부품이 적층되어 부착된 상기 기판을 인출하는 단계를 수행하여 반도체 부품 부착 공정을 수행하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
Supplying the substrate by the substrate loading unit, mounting a first semiconductor component on the semiconductor unit by the semiconductor component picker, and mounting a second semiconductor component on the semiconductor unit by the semiconductor component picker Curing the adhesive interposed between the semiconductor unit and the first semiconductor component and the adhesive interposed between the first semiconductor component and the second semiconductor component by the adhesive curing unit; and A semiconductor component attachment process, characterized in that performing the step of pulling out the substrate to which the first semiconductor component and the second semiconductor component are stacked and attached to the semiconductor unit by a loading unit. 제 1 항에 있어서,
상기 기판 로딩부에 의해 상기 기판을 공급하는 단계와, 상기 반도체 부품 픽커에 의해 상기 반도체 유닛에 제1 반도체 부품을 실장하는 단계와, 상기 접착제 경화부에 의해 상기 반도체 유닛과 상기 제1 반도체 부품 사이에 개재된 접착제를 1차 경화시키는 단계와, 상기 반도체 부품 픽커에 의해 상기 반도체 유닛에 제2 반도체 부품을 실장하는 단계와, 상기 접착제 경화부에 의해 상기 제1 반도체 부품과 상기 제2 반도체 부품 사이에 개재된 접착제를 2차 경화시키는 단계와, 상기 기판 언로딩부에 의해 상기 반도체 유닛에 상기 제1 반도체 부품 및 제2 반도체 부품이 적층되어 부착된 상기 기판을 인출하는 단계를 수행하여 반도체 부품 부착 공정을 수행하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
Supplying the substrate by the substrate loading unit, mounting a first semiconductor component on the semiconductor unit by the semiconductor component picker, and between the semiconductor unit and the first semiconductor component by the adhesive curing unit Primary curing the adhesive interposed in the, mounting a second semiconductor component on the semiconductor unit by the semiconductor component picker, and between the first semiconductor component and the second semiconductor component by the adhesive curing unit Attaching the semiconductor component by performing the step of secondary curing the adhesive interposed in the substrate and pulling out the substrate to which the first semiconductor component and the second semiconductor component are stacked and attached to the semiconductor unit by the substrate unloading unit Equipment for attaching semiconductor components, characterized in that to perform a process. 제 26 항 내지 제 28 항 중 어느 한 항에 있어서,
상기 반도체 부품은 반도체 칩 또는 금속 클립인 것을 특징으로 하는, 반도체 부품 부착 장비.The method according to any one of claims 26 to 28,
The semiconductor component attachment equipment, characterized in that the semiconductor component is a semiconductor chip or a metal clip. 제 1 항에 있어서,
상기 반도체 부품 로더는 반도체 부품 정렬버퍼를 더 포함하고,
상기 반도체 부품 픽커는 상기 반도체 부품 로더로부터 상기 반도체 부품 정렬버퍼로 이송된 상기 반도체 부품을 상기 반도체 유닛으로 이송하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
The semiconductor component loader further comprises a semiconductor component alignment buffer,
Wherein the semiconductor component picker transfers the semiconductor component transferred from the semiconductor component loader to the semiconductor component alignment buffer to the semiconductor unit. 제 1 항에 있어서,
상기 반도체 유닛으로의 상기 반도체 부품의 부착위치를 검사하는 제2 비전검사부를 더 포함하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
And a second vision inspection unit for inspecting the attachment position of the semiconductor component to the semiconductor unit. 제 1 항에 있어서,
상기 반도체 유닛에 상기 반도체 부품이 상기 접착제에 의해 경화되어 실장된 상기 기판을 플라즈마 세정하여 상기 기판 언로딩부로 이송하는 플라즈마 세정부를 더 포함하는 것을 특징으로 하는, 반도체 부품 부착 장비.The method of claim 1,
And a plasma cleaning unit for plasma cleaning the substrate on which the semiconductor component is cured by the adhesive and mounted on the semiconductor unit, and transferring the substrate to the substrate unloading unit.
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