KR102202295B1 - Different shape spring assembly for test socket and test socket having the same - Google Patents

Abstract

Provided is a deformed spring assembly for a test socket capable of having the effect of greatly reducing manufacturing costs due to a simple structure and improving electrical properties, comprising: a deformed spring including a tension spring part winding conductive wires having the same diameter in contact with each other and a compression spring part integrally formed with the tension spring part and winding the conductive wires spaced apart from each other, wherein the tension and compression spring parts have the same inner diameter and outer diameter; and a step forming member formed in the tension spring part to be spaced apart from the end of the tension spring part by a length shorter than that of the entire length of the tension spring part to prevent separation of the deformed spring from the test socket.

Description

Deformed spring assembly for test socket and test socket having same {DIFFERENT SHAPE SPRING ASSEMBLY FOR TEST SOCKET AND TEST SOCKET HAVING THE SAME}

The present invention relates to a release spring assembly for a test socket and a test socket having the same, and in particular, the present invention is a release spring assembly for a test socket having features that can reduce electrical resistance while preventing separation from the test socket and a simple manufacturing process, and It relates to a test socket having it.

In general, a test socket is a test device that tests the electrical characteristics of various electrical and electronic components and determines the good or bad of electrical and electronic products.

The process of testing an electrical and electronic component using a test socket includes a process of transmitting a test signal generated from a circuit board to the electrical and electronic component and a process of providing a signal generated from the electrical and electronic component to the circuit board.

In general, a terminal of an electrical and electronic component is very small in size and has a very narrow pitch. In general, a test signal is applied to the connector while the electrical and electronic component is in contact with the connector.

In general, a spring is widely used in a test socket to prevent electrical shorts from occurring due to physically spaced apart connectors and terminals during a test.

U.S. Patent No. 9,312,610, Stepped spring contact, (Registration date: April 12, 2016) discloses a spring having a step, in particular Stepped spring contact is the diameter of the first part 120 is the second part 122 A technique for a release spring formed larger than the diameter of is described.

However, in the case of U.S. Patent No. 9,312,610, since springs must be manufactured to have different diameters to form a stepped step, many processes are required for manufacturing, and in particular, mass manufacturing is difficult.

In particular, the spring used for the test socket has a very small size, with a total size of only a few mm. In order to form a step on a part of the spring having such a small size, it is difficult to manufacture and the manufacturing cost is very expensive. The production cost of the test socket using the test socket is also greatly increased.

U.S. Patent No. 9,312,610, Stepped spring contact, (Registration date: April 12, 2016)

The present invention has a simple structure by preventing separation from the test socket without forming a step through a complex manufacturing process on a spring having a very small size, and a test socket that greatly shortens the manufacturing cost and improves electrical characteristics according to the simple structure. It provides a release spring assembly and a test socket having the same.

In one embodiment, the release spring assembly for the test socket includes a tension spring part in which conductive wires having the same diameter are wound in contact with each other, and a compression spring part formed integrally with the tension spring part and winding the conductive wires to be spaced apart from each other. And the tension and compression spring portions are a release spring formed with the same inner diameter and outer diameter; And a stepped member formed in the tension spring part at a position spaced apart from the end of the tension spring part to a length shorter than the entire length of the tension spring part to prevent the release spring from being separated from the test socket.

The stepped member of the release spring assembly for the test socket includes any one of a synthetic resin tube, a synthetic resin heat shrinkable tube, and a metal ring coupled to an outer surface of the tension spring part.

The release spring of the release spring assembly for the test socket is integrally formed at the end of the compression spring part and includes an additional tension spring part winding the conductive wires to be in contact with each other.

In one embodiment, the release spring assembly for the test socket includes a tension spring part in which conductive wires having the same diameter are wound in contact with each other, and a compression spring part formed integrally with the tension spring part and winding the conductive wires to be spaced apart from each other. And the tension and compression spring portions are a release spring formed with the same inner diameter and outer diameter; And a stepped forming member surrounding the compression spring, wherein an inner diameter formed by the stepped forming member is the same as an inner diameter of the tension spring, and an outer diameter formed by the stepped forming member is larger than an outer diameter of the tension spring.

The stepped member of the release spring assembly for the test socket includes any one of a plating layer and a synthetic resin film.

In one embodiment, the test socket includes a tension spring portion winding conductive wires having the same diameter to be in contact with each other, and a compression spring portion integrally formed on the tension spring portion and winding the conductive wires apart from each other, and the tension and Compression spring portions are formed in a release spring formed with the same inner diameter and outer diameter, and a length shorter than the entire length of the tension spring portion in the tension spring portion and are formed at a position spaced apart from the end of the tension spring portion to prevent separation of the release spring from the test socket A release spring assembly including a stepped forming member; A test body having a mounting hole through which the tension spring part passes and the separation preventing member is formed with a stepped portion; A circuit board having a terminal electrically connected to the tension spring protruding from the test body; And a connector electrically connected to the compression spring part and connected to a terminal of the test object.

A metal barrel that is disposed above the stepped member in the through hole of the test socket and is electrically connected to the outer surface of the compression spring part to which a test signal applied to the tension spring part is applied from a circuit board, the The electrical resistance of the metal barrel is formed of a metal material lower than that of the release spring.

The release spring assembly for the test socket and the test socket having the same according to the present invention have a simple structure by preventing separation from the test socket without forming a step through a complicated manufacturing process on a spring having a very small size, It has the effect of greatly shortening the manufacturing cost and improving the electrical properties.

1 is a cross-sectional view showing a release spring assembly for a test socket according to an embodiment of the present invention.
2 is an enlarged view of a portion'A' of FIG. 1.
3 is a cross-sectional view showing a stepped member according to another embodiment.
4 is a cross-sectional view showing a release spring assembly for a test socket according to an embodiment of the present invention.
5 is an enlarged view of a portion'B' of FIG. 4.
6 is a cross-sectional view showing a test socket including a release spring assembly according to an embodiment of the present invention.

The present invention described below may apply various transformations and may have various embodiments, and specific embodiments will be illustrated in the drawings and described in detail in the detailed description.

However, this is not intended to limit the present invention to a specific embodiment, it is to be understood to include all conversions, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the present invention, when it is determined that a detailed description of a related known technology may obscure the subject matter of the present invention, a detailed description thereof will be omitted.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance.

In addition, terms such as first and second may be used to classify and describe various components, but the components should not be limited by the terms. These terms are used only for the purpose of distinguishing one component from another component.

1 is a cross-sectional view showing a release spring assembly for a test socket according to an embodiment of the present invention.

The release spring assembly 300 for the test socket includes a release spring 100 and a stepped member 200.

The release spring 100 includes a tension spring part 110 and a compression spring part 120.

The tension spring part 110 has a characteristic that its length is increased by an externally applied load, and the tension spring part 110 is formed by winding conductive wires in contact with each other.

The compression spring unit 120 is integrally formed with the tension spring unit 110, and the compression spring unit 120 is integrally formed at the upper end of the tension spring unit 110.

In one embodiment of the present invention, the compression spring portion 120 and the tension spring portion 110 are formed using a conductive wire having the same diameter.

The compression spring unit 120 has a characteristic that the length is reduced by a load applied from the outside, and the compression spring unit 110 is formed by winding conductivity to be spaced apart from each other.

The compression spring unit 120 is integrally formed at the end of the tension spring unit 110.

The compression spring portion 120 and the tension spring portion 110 are formed with the same inner diameter and the same outer diameter.

In one embodiment of the present invention, since the tension spring portion 110 of the release spring 100 is formed in a state of contact with each other, it plays the same role as a hard terminal, and the compression spring portion 120 is applied to the load applied from the outside. As well as absorbing the shock caused by it, it prevents electrical shorts from occurring to the external terminals.

In one embodiment of the present invention, in a state in which the inner and outer diameters of the tension spring part 110 and the compression spring part 120 of the release spring 100 are formed identically, the release spring 100 has a stepped on the test socket. When inserted into the mounting hole, since the release spring 100 is not caught in the step formed inside the test socket, the release spring 100 is separated from the test socket or the release spring 100 moves or moves inside the test socket.

In order to prevent this, a stepped member 200 is formed in the tension spring 120 in an embodiment of the present invention.

2 is an enlarged view of a portion'A' of FIG. 1.

1 and 2, the stepped forming member 200 has a release spring 100 including a tension spring unit 110 and a compression spring unit 120 having the same inner diameter and outer diameter in the mounting hole of the test socket. It prevents the release spring 100 from moving or being separated from the mounting hole by being caught on the formed step.

In particular, in one embodiment of the present invention, since the stepped step is indirectly formed through the stepped member 200 without directly forming the stepped spring 100, the structure of the release spring 100 can be simplified. It has the advantage of greatly reducing the production cost because it can greatly shorten the manufacturing process.

In one embodiment of the present invention, the stepped forming member 200, for example, is formed with a length (L2) shorter than the total length (L1) of the tension spring (110).

The stepped member 200 formed with a length of L2 is in close contact with the outer surface of the tension spring unit 110 so that the stepped member 200 is not moved or separated from the tension spring unit 110.

In particular, the stepped forming member 200 is formed at a position spaced apart from the lower end 110a of the tension spring unit 110 by a specified length L3.

At this time, a portion of the tension spring 110 in which the stepped member 200 is not formed protrudes from the mounting hole of the test socket and is electrically connected to the terminal of the circuit board.

In one embodiment of the present invention, the stepped forming member 200 may include a tube made of a synthetic resin material that is fitted and coupled to the outer surface of the tension spring unit 110, and the tube made of the synthetic resin material is a tension spring in a semi-melted state. After being coupled to the outer surface of the part 110, it may be formed by cooling.

Unlike this, the stepped forming member 200 may include a heat shrinkable tube that is loosely fitted to the outer surface of the tension spring unit 110 and then contracted by hot air, and is firmly coupled to the outer surface of the tension spring unit 110.

In addition, the stepped forming member 200 inserts the heated and expanded metal ring into the outer surface of the tension spring unit 110, and then contracts while the metal ring cools so that it is firmly coupled to the outer surface of the tension spring unit 110. It is also okay.

In addition, the stepped forming member 200 may include a synthetic resin film cured by volatilizing a volatile solvent after applying a synthetic resin material melted by a volatile solvent to the outer surface of the tension spring unit 110.

In addition, the stepped forming member 200 is made to expose only the portion of the tension spring portion 110 in which the stepped forming member 200 is formed in view of that the tension spring part 110 is a metal material, and then the stepped forming member 200 It may include a plating film formed by selectively performing a plating process only on the formed portion.

In the case of a method of forming a stepped member 200 by combining a pre-fabricated member to a designated position of the tension spring unit 110, the inner surface is partially on the surface of the tension spring unit 110 as shown in FIG. It is coupled in an uneven coupling method, and the outer surface of the stepped forming member 200 may be formed smoothly.

On the other hand, in the case of forming the stepped member 200 at a designated position of the tension spring unit 110 in the same manner as a synthetic resin film or a plated film, the inner surface of the stepped forming member 200 as shown in FIG. 3 is It is coupled to the surface of the tension spring unit 110 without gap, and the outer surface of the stepped member 200 may be formed in the same uneven shape as the surface of the tension spring unit 110.

On the other hand, the end of the compression spring portion 120 formed in the release spring 100 is again integrally formed with an additional tension spring portion 130 using the conductive wire, the additional tension spring portion 130 is a connector formed in the test socket It should be able to be reliably coupled to the back.

4 is a cross-sectional view showing a release spring assembly for a test socket according to an embodiment of the present invention. 5 is an enlarged view of a portion'B' of FIG. 4. The configuration of the release spring of the release spring assembly for the test socket shown in FIG. 4 is substantially the same as the configuration of the release spring shown in FIGS. 1 to 3. Accordingly, the same names and the same reference numerals are assigned to the same configuration.

4 and 5, a release spring assembly 300 for a test socket includes a release spring 100 and a stepped forming member 250.

The release spring 100 includes a tension spring portion 110 and a compression spring portion 120, and the tension spring portion 110 and the compression spring portion 120 are the same as those shown and described in FIG. 1.

Stepped forming member 250 is formed on the compression spring portion 120 of the release spring 100, the stepped forming member 250 does not wrap the tension spring portion 110, only the outer surface of the compression spring portion 120 is selective Is formed by wrapping. For example, the stepped forming member 250 is selectively coated only on the surface of the compression spring unit 120.

The stepped member 250 formed surrounding the outer surface of the compression spring part 120 may include, for example, a plated film formed surrounding the outer surface of the compression spring part 120. Unlike this, the stepped forming member 250 may include a synthetic resin film formed of a synthetic resin material surrounding the outer surface of the compression spring unit 120.

In an embodiment of the present invention, the inner diameter formed by the stepped member 250 including either a plated film or a synthetic resin film is the same as the inner diameter of the tension spring portion 110, whereas the stepped member 250 The formed outer diameter is formed larger than the outer diameter of the tension spring portion (110).

Specifically, the outer diameter formed by the stepped member 250 is formed as large as twice (2t) the thickness t of the stepped member 250 compared to the outer diameter of the tension spring portion 110.

In one embodiment of the present invention, since the outer diameter of the stepped member 250 is formed larger than the outer diameter of the tension spring portion 110, the stepped member 250 can be caught by the stepped jaw formed in the mounting hole of the test socket. .

In one embodiment of the present invention, the release spring 100 on which the stepped forming member 250 is formed is a rod having the same diameter after forming a plated film or a synthetic resin film in advance in a portion corresponding to the compression spring part 120 of the conductive wire. By winding the conductive wire to the same, it is possible to easily manufacture the release spring 100 having the same inner diameter and different outer diameter.

6 is a cross-sectional view showing a test socket including a release spring assembly according to an embodiment of the present invention. The release spring assembly 300 shown in FIG. 6 has substantially the same configuration as the release spring assembly shown in FIGS. 1 to 5, and therefore, the same names and the same reference numerals are given to the same components.

Referring to FIG. 6, the test socket 700 includes a release spring assembly 300, a test body 400, a circuit board 500, and a connector 600.

The test body 400 serves to fix the release spring assembly 300 to a designated position, and serves to fix the circuit board 500 and the connector 600.

A mounting hole 410 in which a plurality of release spring assemblies 300 are accommodated is formed in the test body 400, and a through hole is formed in the bottom surface of the mounting hole 410.

The release spring assembly 300 is accommodated inside the mounting hole 410, and the end of the tension spring part 110 of the release spring assembly 300 is outside the test body 400 through the through hole of the test body 400. And the end of the compression spring 120 also protrudes to the outside of the test body 400 through the upper end of the test body 400.

The circuit board 500 is disposed under the test body 400 to face the end of the tension spring unit 110.

The circuit board 500 includes a substrate portion 510 for generating a test signal or the like in a plate shape, and a terminal 520 formed on the substrate portion 510 and electrically connected to the tension spring portion 110.

The connector 600 is disposed to face the additional tension spring 130 exposed on the upper portion of the test body 400, and the connector 600 is electrically connected to the additional tension spring 130.

Therefore, the test signal generated from the circuit board 500 is transmitted to the connector 500 through the release spring 100, and the terminal of the product to be tested is electrically coupled to the connector 500.

On the other hand, the test signal generated from the circuit board 500 should be transmitted to the connector 600 without loss. When the test signal is applied to the release spring 100 wound around a very thin and long conductive wire, the test signal is lost. Can occur.

To prevent this, a metal barrel 650 may be disposed inside the mounting hole 410 of the test body 400.

The metal barrel 650 is disposed on the stepped member 200 and has a pipe shape into which the release spring assembly 100 is inserted.

The metal barrel 650 is, for example, electrically connected to the outer surface of the compression spring unit 120, and thus the test signal provided to the tension spring unit 110 is not applied to the compression spring unit 120 and is After passing through the barrel 650, it is provided as a connector 600.

In order to implement this, it is preferable that the electrical resistance of the metal material forming the metal barrel 650 is formed of a metal material lower than the electrical resistance of the conductive line forming the release spring 100.

As described in detail above, according to the present invention, the spring having a very small size is not separated from the test socket without forming a step through a complicated manufacturing process, thereby having a simple structure and greatly increasing the manufacturing cost according to the simple structure. It can shorten and improve electrical properties.

On the other hand, the embodiments disclosed in the drawings are merely presented specific examples to aid understanding, and are not intended to limit the scope of the present invention. It is apparent to those of ordinary skill in the art that other modifications based on the technical idea of the present invention may be implemented in addition to the embodiments disclosed herein.

100...release spring 200...step forming member
300...release spring assembly 400...test body
500...circuit board 600...connector
700...test socket

Claims (7)

delete delete delete A tension spring part winding conductive wires having the same diameter in contact with each other, and a compression spring part integrally formed in the tension spring part and winding the conductive wire apart from each other, and the tension and compression spring parts have the same inner diameter and outer diameter A release spring formed by And
It includes a stepped forming member surrounding the compression spring,
An inner diameter formed by the stepped member is the same as the inner diameter of the tension spring, and an outer diameter formed by the stepped member is larger than an outer diameter of the tension spring. The method of claim 4,
The stepped forming member is a release spring assembly for a test socket including any one of a plating layer and a synthetic resin film. delete delete

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