KR102237083B1 - Back Up Integrated Main Bonding Stage Having theta Alignment Function - Google Patents

Abstract

The present invention provides a structure capable of theta alignment when bonding films and chips to a flexible panel or a rigid panel to effectively prevent the sagging phenomenon of the film. In the main bonding stage that is located corresponding to the bonding equipment and supports the thermal compression of the bonding head while supporting the panel on which the film is pre-mounted, the base frame is located on the upper side of the base frame and the panel is supported on the upper surface in a vacuum adsorption state. A main stage unit configured to include a main stage and a main driving unit installed on the base frame and configured to move the main stage in a θ-axis direction; A backup stage unit installed to be positioned to correspond to the front of the main stage unit, and for supporting direct thermal compression of the bonding head toward the bonding area on which the film is attached on the panel, wherein the main stage unit includes the main Backup-integrated main bonding having theta alignment function including an integrated turntable that is rotatably installed on the upper part of the driving unit and supports and fixes the main stage, but extends forward to integrally fix the backup stage so that the θ-axis alignment is possible. Provide a stage.

Description

Back Up Integrated Main Bonding Stage Having theta Alignment Function

The present invention relates to a backup-integrated main bonding stage having a theta alignment function, and more specifically, a structure capable of theta alignment when bonding films and chips to a flexible panel or a rigid panel. It relates to a backup-integrated main bonding stage having a theta alignment function capable of efficiently preventing a film from sagging.

In general, a display screen is driven in portable electronic products such as mobile phones, notebook computers, PDAs, and navigation devices, but various types of flexible circuit boards (FPCBs; Flexivle Printed Circuit) inside to realize features such as low voltage driving, low power consumption, and full color realization. Board) is applied.

As a technology for manufacturing a display module in which a flexible circuit board is applied to a panel, COF (chip on) is used to compress the electrode of the panel and the electrode of the chip or tab using an anisotropic conductive film after activating the bonding surface and removing organic substances by atmospheric pressure plasma treatment. film) bonding method and COP (chip on plastic panel) bonding method are used, and further, after attaching an anisotropic conductive film to the electrode of the panel, the FPC film is placed on the anisotropic conductive film of the panel and then pressurized by applying appropriate pressure. A film on flex (FOF) bonding method and a film on glass (FOG) bonding method are used to realize conduction by contacting the pattern and the electrode.

Here, in the COF method and the COP method, a bonding process is performed to mount a chip on a flexible polyimide film or thin plastic in order to respond to the trend of light, thin, and short display semiconductor packages. Furthermore, in the FOG method, the bonding process is carried out by applying a rigid type panel (glass), which has the characteristic that the panel as a bonding target for mounting the FPC film is hard and does not bend well, whereas the FOF method has a thinner thickness and As a technology developed in response to the demand for the development of light and flexible parts, the bonding process is carried out by applying a flexible type panel that has a flexible, flexible panel to which the FPC film will be bonded. At this time, all bonding processes are configured to use a bonding device that bonds the film to the panel with heat and pressure so that the film is finally mounted.

As a prior art disclosed in connection with the bonding apparatus as described above, Korean Patent Publication No. 632378 (2006.09.28.) discloses a loading unit consisting of a width-division variable type conveyor on which glass is loaded, and a loading unit supplied from the loading unit. The main body part which automatically attaches the ACF to the glass, centers the FPC, supplies the FPC to the glass by a rotary method, aligns, performs pre-bonding, and performs main bonding, and the FPC supplied from the main body. As the unloading unit consisting of a conveyor that discharges the mounted glass to the outside, and a control unit that controls the loading unit, the main unit, and the unloading unit are included, the working time according to the automatic progress of the process is shortened and work efficiency An in-line automatic FOG bonding device that can improve the is known.

In addition, Patent Publication No. 1776859 (2017.09.04.) includes an FPC supply unit for supplying an FPC film to be mounted on a panel; A panel ACF bonding unit configured to selectively attach an anisotropic conductive film to one surface of a flexible or rigid panel loaded in the previous process; A pre-bonding unit that is supplied with an FPC film from the FPC supply unit, and bonds the FPC film to the pre-mounted panel on the panel transferred through the panel ACF bonding unit; A main bonding unit for bonding the FPC film to be finally mounted on the panel supplied with the FPC film pre-mounted from the pre-bonding unit; A panel transfer unit that sequentially supplies panels to the panel ACF bonding unit, pre-bonding unit, and main bonding unit, and is provided to enable pickup and transfer of the panel; A reversing part provided to enable the panel to be supplied among the transfer path of the panel transfer part and rotate the panel 180°; The FPC supply unit, the panel ACF bonding unit, the pre-bonding unit, the main bonding unit, the panel transfer unit, and the inverting unit are controlled by applying a driving control signal to each of the FPC supply unit and the panel by setting a process type among the FOF process or the FOG process. And a control unit for applying a selective control signal to the ACF bonding unit, the panel transfer unit, and the inverting unit, wherein the main bonding unit supports the panel on which the FPC film is pre-mounted in the pre-bonding unit, and is in the front and rear Y axis directions. The main bonding stage is provided so as to be reciprocated to supply the panel, and the main bonding stage is installed so as to be reciprocated up and down corresponding to the upper side of the main bonding stage, and a bonding tip capable of thermally pressing the FPC film is provided at the bottom. In-line automatic FOF/FOG common bonding that can improve production quality by increasing the precision of the bonding process as it includes a head and a sheet supply unit that drives to supply a Teflon sheet between the main bonding head and the main bonding stage. Devices are known.

However, in the prior art described above, the theta axis cannot be aligned with the panel transferred in the previous process by the bonding process.In the bonding process, the theta axis is corrected after the main stage supporting the panel is raised, and then the back stage is vacuumed after the main stage is lowered. Since the panel is adsorbed by using the panel, there is a problem that time is delayed, resulting in a decrease in productivity.

Accordingly, the main stage was improved to be able to align the theta axis by itself, but as a result of the occurrence of structural backlash in the CAM, a sagging phenomenon occurs on the backup stage that supports the bonding compression of the bonding head, resulting in the precision of the bonding operation. There was a problem that the product was dropped and the quality of the product was deteriorated.

KR Registered Patent Publication No. 10-0632378 (2006.09.28.) KR Registered Patent Publication No. 10-1776859 (2017.09.04.)

The present invention is to solve the above problems, and since the panel transferred in the entire process is self-aligned at the main stage and the theta axis aligned at the back-up stage, the panel and film are sagged when crimping from the bonding machine. It is an object to provide a backup-integrated main bonding stage having a theta alignment function that can increase productivity and precision of work while preventing a phenomenon.

In the main bonding stage of the integrated backup having theta alignment function proposed by the present invention is located in correspondence with the bonding equipment among display manufacturing equipment and supports the thermal compression of the bonding head while supporting the panel on which the film is pre-mounted, Including a base frame, a main stage positioned on the upper side of the base frame and supporting a panel on the upper surface in a vacuum suction state, and a main driving unit installed on the base frame and driving the main stage to flow in the θ-axis direction. A main stage to configure; A backup stage unit installed to be positioned to correspond to the front of the main stage unit, and for supporting direct thermal compression of the bonding head toward the bonding area on which the film is attached on the panel, wherein the main stage unit includes the main It includes an integrated turntable that is rotatably installed on the upper part of the driving unit and supports and fixes the main stage, but extends forward and integrally fixes the backup stage so that the θ-axis alignment is possible.

The backup stage unit includes a backup stage mounted on an upper part of the integrated turntable and supporting a panel in contact, and a backup stage located below the integrated turntable, but fixedly installed on the base frame of the main stage part, and supporting a load applied to the backup stage. A backup frame formed to be possible, an LM guide rail fixedly installed on an upper portion of the backup frame and forming a curved path around the θ axis of the main stage, and provided under the integrated turntable corresponding to the LM guide rail, and the The LM block is formed to be flowable on the LM guide rail to guide the θ-axis alignment.

In addition, it is possible to further include a rolling guide means installed on the backup frame in the backup stage and configured to be symmetrically arranged horizontally and symmetrically with respect to the LM guide rail, and supporting the integrated turntable in rolling contact.

The rolling guide means comprises a support frame fixedly installed on the backup frame and vertically extended, and a guide roller rotatably installed on the support frame and rolling in contact with a lower portion of the integrated turntable.

According to the backup-integrated main bonding stage having the theta alignment function according to the present invention, the theta axis alignment of the backup stage with the main stage is configured in an integrated structure so that the theta axis alignment of the backup stage is performed by collective driving, and the curved flow path of the backup stage is guided In addition, it maximizes the productivity of the product by reducing the tact time of the process, and improves the quality of the product by increasing the working precision of the process through the efficient alignment of the theta axis in the backup stage.

In addition, since the backup-integrated main bonding stage having the theta alignment function according to the present invention is configured to support the lower portion of the backup stage, which is the bonding compression position, fine sagging according to the repeated pressing and pressing process by reinforcing the support in the vertical direction. There is an effect of improving the quality by increasing the precision of the process while preventing the phenomenon.

1 is a bottom perspective view showing an embodiment according to the present invention.
Figure 2 is a side view showing an embodiment according to the present invention.
3 is a plan view showing an embodiment according to the present invention.
4 is a plan view showing an LM guide rail and an LM block of a backup stage in an embodiment according to the present invention.
Figure 5 is a front view showing another embodiment of the backup stage in one embodiment according to the present invention.

The present invention is a main bonding stage that is positioned to correspond to the bonding equipment of display manufacturing equipment and supports thermal compression of a bonding head while supporting a panel on which a film is pre-mounted, comprising a base frame and a panel located on the upper surface of the base frame. A main stage unit configured to support a main stage in a vacuum adsorption state, and a main driving unit installed on the base frame and configured to move the main stage in a θ-axis direction; A backup stage unit installed to be positioned to correspond to the front of the main stage unit, and for supporting direct thermal compression of the bonding head toward the bonding area on which the film is attached on the panel, wherein the main stage unit includes the main Backup-integrated main bonding having theta alignment function including an integrated turntable that is rotatably installed on the upper part of the driving unit and supports and fixes the main stage, but extends forward to integrally fix the backup stage so that the θ-axis alignment is possible. The stage is a feature of the technical composition.

Next, a preferred embodiment of a backup-integrated main bonding stage having a theta alignment function according to the present invention will be described in detail with reference to the drawings.

First, an embodiment of a backup-integrated main bonding stage having a theta alignment function according to the present invention is located corresponding to the bonding equipment (not shown in the drawing) among display manufacturing equipment, as shown in FIGS. 1 and 2. In the main bonding stage supporting thermal compression of the bonding head while supporting the panel on which the film is pre-mounted, the main bonding stage includes a main stage unit 10 and a backup stage unit 30.

The main stage unit 10 basically performs a function of supporting the panel transferred in the previous process so that it can be compressed from the bonding equipment.

As shown in FIGS. 1 and 2, the main stage unit 10 includes a base frame 11 forming the most basic support surface at the bottom, a main stage 13 for supporting and driving a panel, and a main driving unit. Construct (15).

The main stage 13 is positioned on the upper side of the base frame 11 and is configured to support the panel on the upper surface in a vacuum adsorption state. That is, the main stage 13 has a flat top surface to perform a support function for supporting the panel in a horizontal state, and at the same time, the main stage 13 is configured to perform a vacuum adsorption function for adsorbing the panel in a vacuum state.

As shown in Fig. 3, the main stage 13 is connected with a pneumatic line for supplying compressed air so that the panel can be adsorbed in a vacuum state, and a plurality of pneumatic lines are evenly arranged on the top surface at regular intervals. An adsorption hole 14 for generating an adsorption force is formed.

The main driving unit 15 has a lower portion fixedly installed on the base frame 11 and the main stage 13 installed at an upper portion.

The main driving unit 15 drives the main stage 13 to flow in the θ-axis direction. That is, the main driving unit 15 corrects and aligns the panel located on the main stage 13 while moving the main stage 13 in the θ-axis direction.

As shown in FIG. 2, the main drive unit 15 is fixedly installed on the base frame 11 and installed on one side of the external reducer 16 and the rotation shaft and the reduction gear installed therein. And a drive motor 17 that applies rotational power for driving the θ axis of the main stage 13.

As shown in FIGS. 1 and 2, the main stage unit 10 includes an integrated turntable 20 that integrally fixes the backup stage unit 30 together with the main stage 13.

The integrated turntable 20 supports and fixes the main stage 13 but extends forward to support and fix the upper configuration of the backup stage part 30 (the backup stage 31 below).

The integrated turntable 20 configures the backup stage 31 of the backup stage unit 30 together with the main stage 13 to be θ-axis aligned. That is, the integrated turntable 20 is rotatably installed on the top of the main driving unit 15 so as to rotate for alignment of the θ axis of the main stage 13 as well as the backup stage unit 30 at once. It is configured to be able to align the θ axis.

The backup stage part 30 functions to support direct thermal compression of the bonding head toward the bonding area on which the film is attached while partially supporting the panel.

The backup stage unit 30 is installed and configured to be positioned to correspond to the front of the main stage unit 10.

As shown in FIGS. 1 and 2, the backup stage unit 30 includes a backup stage 31 mounted on an upper portion of the integrated turntable 20 and a lower portion of the integrated turntable 20 as a reference. A backup frame 33, an LM guide rail 35, and an LM block 37 are configured to be provided.

The backup stage 31 is mounted on the top of the integrated turntable 20 and supports the panel in contact.

In the backup stage 31, the panel is vacuum-adsorbed and the bonding process is configured to be performed in a completely close state pulled.

The backup frame 33 is located under the integrated turntable 20, but the lower part is fixedly installed on the base frame 11 of the main stage unit 10.

The backup frame 33 supports the integrated turntable 20 with the assembly structure composed of the LM guide rail 35 and the LM block 37 interposed therebetween, so that the repetitive It is formed to support the load.

The LM guide rail 35 is fixedly installed on the backup frame 33.

The LM guide rail 35 is formed to form a curved path around the θ axis of the main stage 10 as shown in FIG. 4. That is, when the integrated turntable 20 rotates finely in the θ-axis direction by driving the main driving unit 15 in the main stage 10, the integrated turntable at the position of the backup stage 30 Guide the θ-axis flow path for (20).

The LM blocks 37 are configured to form a pair of two left and right under the integrated turntable 20 corresponding to the LM guide rail 35.

The LM block 37 is meshed on the LM guide rail 35 so as to be fluidly coupled, and guides the θ-axis alignment of the integrated turntable 20.

In addition, as shown in FIG. 5, the backup stage unit 30 may further include a rolling guide means 40 for supporting the integrated turntable 20 in rolling contact.

The rolling guide means 40 is installed on the backup frame 33, but is disposed in a symmetrical position with respect to the LM guide rail 35, and is configured to form a symmetrical structure.

The rolling guide means 40 includes a support frame 41 fixedly installed on the backup frame 33 and vertically extended, and rotatably installed on the support frame 41, and the integral turntable 20 It constitutes a guide roller 43 in rolling contact with the lower part.

When the rolling guide means 40 is configured in the backup stage part 30 as described above, it is possible to increase the support area of the integrated turntable in the bonding process for the panels of medium and large sizes, and to improve the load-bearing efficiency against the bonding pressure. It is possible.

That is, according to the backup-integrated main bonding stage having the theta-alignment function according to the present invention configured as described above, the curve of the backup stage is configured as an integrated structure so that the theta axis alignment of the backup stage together with the main stage is driven collectively. Since it is configured to guide the flow path, it is possible to maximize the productivity of the product by reducing the tact time of the process, and to improve the quality of the product by increasing the working precision of the process through efficient theta axis alignment in the backup stage.

In addition, since the present invention is configured to support the lower part of the backup stage, which is the bonding compression position, the support in the vertical direction is reinforced to prevent micro-sagging caused by the repeated pressing and pressing process, while increasing the precision of the process to further improve the quality. It is possible to let.

In the above, a preferred embodiment of the backup-integrated main bonding stage having the theta alignment function according to the present invention has been described, but the present invention is not limited thereto, and within the scope of the claims, the specification of the invention, and the accompanying drawings. It is possible to change and implement, and this also belongs to the scope of the present invention.

10: main stage part 11: base frame
13: main stage 15: main drive unit
16: external reducer 17: drive motor
20: integrated turntable 30: backup stage part
31: backup stage 33: backup frame
35: LM guide rail 37: LM block
40: rolling guide means 41: support frame
43: guide roller

Claims (4)

In the main bonding stage that supports the thermal compression bonding of the bonding head while supporting the panel on which the film is pre-mounted, located in correspondence with the bonding equipment among display manufacturing equipment,
Including a base frame, a main stage positioned on the upper side of the base frame and supporting the panel in a vacuum suction state, and a main driving unit installed on the base frame and driving the main stage to flow in the θ-axis direction. A main stage to configure;
Including; a backup stage installed so as to be positioned to correspond to the front of the main stage unit and for supporting direct thermal compression of the bonding head toward the bonding area on which the film is attached on the panel,
The main stage part includes an integrated turntable that is rotatably installed on the upper part of the main driving unit and supports and fixes the main stage, but extends forward and integrally fixes the backup stage part so as to be θ-axis aligned. ,
The backup stage unit includes a backup stage mounted on an upper portion of the integrated turntable and supporting a panel in contact, and a backup stage located under the integrated turntable, but fixedly installed on the base frame of the main stage unit, and supporting a load applied to the backup stage. A backup frame formed to be possible; an LM guide rail fixedly installed on the upper portion of the backup frame and forming a curved path around the θ axis of the main stage; and provided at the lower portion of the integrated turntable corresponding to the LM guide rail, and the A backup-integrated main bonding stage having theta alignment function, which includes an LM block formed on the LM guide rail so as to be flowable to guide the θ-axis alignment.
delete The method according to claim 1,
The backup stage unit further comprises a rolling guide means installed on the backup frame and configured to be symmetrically arranged horizontally and symmetrically with respect to the LM guide rail, and supporting the integrated turntable in rolling contact with the backup having a theta alignment function. Integral main bonding stage.
The method of claim 3,
The rolling guide means includes a support frame fixedly installed on the backup frame and vertically extended, and a guide roller rotatably installed on the support frame and rolling in contact with the lower portion of the integrated turntable. Back-up integrated main bonding stage with function.

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