KR102324501B1 - Cutting apparatus for optical film and method for cutting optical film - Google Patents

Abstract

The present application relates to an optical film cutter, a method for cutting an optical film, an optical film, an organic electronic device including the same, and a method for manufacturing an organic electronic device using the same. A cutting machine for an optical film that can be maintained and a method for cutting the optical film are provided.

Description

Optical film cutter and optical film cutting method {CUTTING APPARATUS FOR OPTICAL FILM AND METHOD FOR CUTTING OPTICAL FILM}

The present application relates to an optical film cutter, a method for cutting an optical film, an optical film, an organic electronic device including the same, and a method for manufacturing an organic electronic device using the same.

An organic electronic device (OED) refers to a device including an organic material layer that generates an exchange of charges using holes and electrons, and examples thereof include a photovoltaic device, a rectifier, and a transmitter and an organic light emitting diode (OLED).

Among the organic electronic devices, an organic light emitting diode (OLED) consumes less power, has a faster response speed, and is advantageous for thinning a display device or lighting, compared to a conventional light source. In addition, OLED is expected to be applied in various fields including various portable devices, monitors, laptops and TVs because of its excellent space utilization.

In commercialization and expansion of use of OLED, the most major problem is durability. Organic materials and metal electrodes included in OLED are very easily oxidized by external factors such as moisture. Therefore, products including OLEDs are highly sensitive to environmental factors. Accordingly, various methods have been proposed in order to effectively block the penetration of oxygen or moisture from the outside into organic electronic devices such as OLEDs.

To this end, there is a method of applying a film that encapsulates the entire surface of the OLED, and in particular, since this optical film is applied to the entire surface of an organic electronic device, it is manufactured in a multi-layer structure in consideration of device stability as well as moisture barrier properties. It is necessary to provide a highly reliable film while increasing the process efficiency in the cutting process of the structured film.

The present application provides a cutting machine for an optical film capable of maintaining process efficiency and film reliability in manufacturing an optical film, and a method of cutting the optical film.

The present application relates to a cutting machine for an optical film and a method for cutting the optical film. The optical film may be, for example, an encapsulation film applied to encapsulate or encapsulate an organic electronic device such as an OLED. In the present specification, the optical film may be used in the same sense as the encapsulation film.

As used herein, the term "organic electronic device" refers to an article or device having a structure including an organic material layer that generates an exchange of electric charges between a pair of opposite electrodes by using holes and electrons, for example, may include, but are not limited to, a photovoltaic device, a rectifier, a transmitter, and an organic light emitting diode (OLED). In one example of the present application, the organic electronic device may be an OLED.

An exemplary cutter of the present application is a cutter that cuts a polygonal-shaped optical film from a fabric sheet transferred in one direction. As shown in FIG. 1 , the cutter includes: a first cutter 100 including a first cutter 11 for cutting the first side 1 of the polygonal optical film 20; and a second cutter 200 including a second cutter 12 for cutting the second side 2 adjacent to the first side 1 . In the present specification, adjacent sides may refer to two lines making vertices in a polygon. The first cutter 11 may include a ring knife, and the second cutter 12 may include a blade cutter. The cutter of the present application may cut the first side 1 with the first cutter 100 and then cut the second side 2 with the second cutter 200 . That is, the first cutter 100 may be disposed closer to the side from which the fabric sheet is emitted than the second cutter 200 so that the first side 1 can be cut first. That is, the fabric sheet output unit, the first cutter, and the second cutter may be arranged in the order. The present application provides a cutting method excellent in process efficiency and cutting quality by providing a cutting machine having the above structure.

In the present application, the blade cutter includes an upper coat or a lower coat, and at least one of the upper and lower coats may mean a type of cutting the fabric sheet while moving vertically from the direction in which the fabric sheet is transported. In this specification, the terms "upper" and "lower" are not necessarily limited to being located at the upper or lower portion in the direction of gravity, and may mean that the cutter is present in one direction and the opposite direction, respectively. In addition, the ring knife of the present application refers to a cutter having a circular shape, and cutting a sheet into a desired shape while rotating the circular cutter.

In one example, the cutting direction of the first cutter 11 may be parallel to the distal sheet feeding direction or the traveling direction. In the present application, “parallel” means substantially parallel, and may have an error range of ±0.01°, ±0.1°, ±1°, or ±3°. The cutting direction may be a direction in which the original sheet is cut, and the original sheet may be cut in the same direction or parallel to the direction in which the original sheet is fed in one direction. According to the present application, by cutting in a direction parallel to the feed direction of the fabric sheet with the first cutter, the tension of the fabric sheet can be maintained, and the second cutter of the second cutter can be used in the state where the tension is maintained. By cutting the two sides, a highly reliable film can be provided.

In the embodiment of the present application, the first cutter and the second cutter may cut adjacent first and second sides with a time difference. The cutting does not proceed at the same time, but may mean cutting each separately with a time difference. In the above, cutting with a time difference means cutting the second side after a predetermined time after cutting the first side of the optical film, or cutting the first side after a predetermined time after cutting the second side of the optical film can do. The cutting may include cutting using a knife cutter. In addition, the time difference, that is, the predetermined time may be in the range of 0.01 seconds to 1 minute, 0.1 seconds to 30 seconds, 1 second to 10 seconds, and 2 seconds to 8 seconds. In the present application, by cutting the first side and the second side adjacent to the polygonal optical film to have the time difference, an optical film having excellent cutting quality can be cut.

1 shows an exemplary cutter for cutting an optical film having a rectangular shape, in this case, the first cutter 100 is not adjacent to the first side 1, but is adjacent to the second side 2 A third cutter 13 for cutting the third side 3 may be further included. The third cutter 13 may be a ring knife. Accordingly, the first cutter 100 may not include the second cutter 12 for cutting the second side 2 adjacent to the first side 1 . In addition, the second cutter 200 may not include the first cutter 11 for cutting the first side 1 adjacent to the second side 2 .

In the embodiments of the present application, the term “cutter” may refer to a first cutter, a second cutter, or a third cutter, and may collectively refer to all cutters included in each cutter. The cutter of the present application may include an upper coat and a lower coat, respectively.

In one example, FIG. 3 is a cross-sectional view illustrating a first cutter included in a first cutter, wherein the first cutter includes at least two ring knives, and the two ring knives are an upper cut 111 and a lower cut 112, respectively. ) may be included. The right side view of Figure 3 is an enlarged view of the blades of the upper and lower blades, and is a cross-sectional view viewed in a direction perpendicular to the left cross-sectional view.

In one example, two or more ring knives 111 and 112 included in the first cutter, as shown in FIG. The central axis may be based on a direction of gravity or an imaginary line perpendicular to the transport direction of the original sheet. The central axis of the two ring knives may be adjusted by the angle range based on the reference. In one example, the upper coat may be positioned in the direction of conveying or advancing the fabric sheet at an angle range of 1 to 10 degrees from the central axis of the lower coat. That is, as shown in the right sectional view of FIG. 2 , the lower coat is disposed close to the raw sheet exit part, and the upper coat may be positioned in the direction in which the fabric sheet is transported, and the angle range is 1 to 10 degrees (θ1). can have The present application may provide a cutting machine with increased process efficiency by using the cutting machine of the above structure.

In the embodiment of the present application, the first cutter, as shown in FIG. 4, the first cutter included in the first cutter includes at least two ring knives 111 and 112, and the two ring knives Reference numerals 111 and 112 each include an upper coat 111 and a lower coat 112 , and a fabric sheet may be transported between the upper coat and the lower coat to be cut. The raw sheet is cut into an optical film, and the optical film may include a metal layer as described below, and may further include a resin layer on the metal layer. In the cutting machine of the present application, when the cutting is performed, the metal layer 23 may be arranged in the direction of the lower coat 112 and cut, and the resin layer 22 may be arranged and cut in the direction of the upper coat 111 . According to the present application, by disposing a metal layer having a higher hardness or elastic modulus compared to the resin layer in the undercoat direction, the quality of the cut cross section can be improved.

In one example, when the upper and lower blades included in the first cutting machine of the present application are based on the direction of gravity or an imaginary line perpendicular to the transport direction of the fabric sheet, the upper blade angle (θ2) is 50 to 90 degrees or 70 to 90 degrees, and the lower angle may have a blade angle (θ3) of 50 to 90 degrees or 60 to 90 degrees. In one example, the left view of FIG. 6 is a cross-sectional view showing an example in which the blade angle of the upper blade is 90 degrees, and the blade angle of the lower blade is 90 degrees. However, it is not limited to the above, as shown in the right figure of FIG. 6 , the upper blade angle θ2 and the lower blade angle θ3 may be different from each other.

In one example, in the two ring knives included in the first cutting machine of the present application, the outer diameter size of the lower coat 112 may be greater than or equal to the outer diameter size of the upper coat 111 . The ratio of the outer diameter size of the top coat to the outer diameter size of the undercoat may be in the range of 0.3 to 1 or 0.5 to 0.85. Further, in the two ring knives, a ratio of the rotation speed of the lower coat to the rotation speed of the upper coat may be 1 to 1.5 or 1.15 to 1.35. In the above, the rotation speed of the lower coat may be faster than the rotation speed of the upper coat.

In the embodiment of the present application, as shown in FIG. 3 , the first cutter may include a cleaning unit 113 for cleaning the first cutters 111 and 112 . The cleaning unit may include oils or alcohols, but is not limited thereto, and any material capable of cleaning the cutter is not limited thereto. The type of the oil is not particularly limited, and may include silicone oil. A well-known organic solvent can be used for alcohol, for example, MEK can be used. The cleaning unit may exist in the form of oil or alcohol, for example, attached to wool, but is not limited thereto, and is not limited as long as it is a material capable of cleaning the cutter. In addition, the cleaning unit may be provided to be in contact with the ring knife blade of the first cutter. The cleaning unit may also be included in the second cutter. Like the first cutter, the cleaning unit may be provided in contact with the cutter blade of the second cutter, and may be provided on the upper coat and/or the lower coat.

As described above, the second cutter may be a blade cutter including an upper coat and a lower coat. The upper and lower blades included in the second cutter are, as shown in FIG. 6, based on the direction of gravity or an imaginary line perpendicular to the transport direction of the fabric sheet, the blade angle of the upper blade is 40 to 90 degrees or 45 to 70 degrees, the blade angle of the lower blade may be 80 to 90 degrees or 85 to 90 degrees.

As shown in FIG. 5 , the second cutter includes a top coat 121 and a bottom coat 122 , and can cut the fabric sheet 300 transferred between the top coat and the bottom coat. The upper view 121 and the lower view 122 of FIG. 5 are cross-sectional views illustrating examples in which the blade angle is 90 degrees, respectively.

Also, the second cutter of the present application may be an oscillation type cutter. Accordingly, the second cutter may cut while moving in the transport direction of the original sheet or the opposite direction, and thus process efficiency may be increased. In addition, during the process, if the original sheet is slightly twisted in the conveying direction, since it deviates from the angle of the desired polygonal shape, the second cutter can be cut at the same angle as the angle at which the original sheet is twisted. Accordingly, for example, when manufacturing a rectangular optical film, the long side can be cut with the first cutter and the short side can be cut with the second cutter, but the original sheet is transported at an angle that is not parallel to the transport direction Even so, since the second cutter is twisted at the same angle, it is possible to provide an optical film having excellent perpendicularity.

The cutter of the present application is a cutter for cutting an optical film, and the optical film may include at least a metal layer. The metal layer may have a metal deposited on a metal foil or a polymer substrate layer. The metal layer is not particularly limited as long as it is a material containing a metal. The metal layer may include any one of a metal, a metal oxide, a metal nitride, a metal carbide, a metal oxynitride, a metal oxyboride, and combinations thereof. For example, the metal layer may include an alloy in which one or more metal elements or non-metal elements are added to one metal, and may include, for example, Invar, stainless steel (SUS), but is limited thereto. No, in consideration of the elastic modulus and cutting using a knife cutter to be described later, the Invar or stainless steel (SUS) may be excluded. In one example, the metal layer is iron, chromium, copper, aluminum nickel, iron oxide, chromium oxide, silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and combinations thereof. The metal layer may be deposited by electrolysis, rolling, thermal evaporation, electron beam evaporation, sputtering, reactive sputtering, chemical vapor deposition, plasma chemical vapor deposition, or electron cyclotron resonance source plasma chemical vapor deposition means. In an embodiment of the present application, the metal layer may be deposited by reactive sputtering.

In one example, the metal layer may have an elastic modulus (Young's modulus) at a temperature of 25° C. in the range of 30 GPa to 250 GPa, 30 GPa to 130 GPa, or 50 MPa to 120 GPa. In the present specification, the elastic modulus may be measured using a DMA (Dynamic Mechanical Analysis) device under the conditions of 0.1 strain, 1 Hz frequency, and 3° C./min ramp up for the sample. In the present application, as the tensile modulus of elasticity of the metal layer of the optical film to be cut is within the above range, knife cutter cutting, which will be described later, is possible. , it is possible to manufacture a highly reliable film using the cutting machine of the present application.

The optical film of the present application may further include a resin layer. The resin layer may be used in the same meaning as an encapsulation layer or a protective layer to be described later. The optical film of the present application may be a multilayer laminate film having a structure of at least two or more layers in which the metal layer and the resin layer are integrally laminated. The resin layer may have an elastic modulus (Young's modulus) at 25° C. in the range of 0.01 MPa to 3000 MPa, 1 MPa to 2500 MPa, or 10 MPa to 900 MPa. In particular, the present application is a cutting machine suitable for cutting the optical film of the specific structure. That is, the optical film is an optical film in which a metal layer and a resin layer are integrally included, and an object of the optical film is to provide a cutting machine suitable for cutting the same.

The cutter of the present application, as described above, may include a first cutter 11 and a second cutter 12, wherein the first cutter 11 and the second cutter 12 are 30° to 150° to each other. It may be included in the first cutter 100 and the second cutter 200 to form an angle of ° or 60 ° to 100 °, respectively. Accordingly, the first side 1 and the second side 2 may be cut to form an angle of 30° to 150° with each other. As shown in FIG. 1 , when the cutter is a cutter for cutting a rectangular optical film, the first cutter 11 and the second cutter 12 may exist to form a right angle with each other. In the present specification, right angle, perpendicular or parallel means a substantially right angle, perpendicular or parallel, and substantially right angle or parallel may have an error range of ±0.01°, ±0.11°, ±1° or ±3°.

In an embodiment of the present application, the cutter of the cutter may be a knife cutter. Conventionally, a laser cutter that cuts an optical film has a problem of high cost and poor process efficiency. However, as the cutter of the present application uses a knife cutter, there is an effect of increasing the process efficiency while being inexpensive. However, unlike laser cutting, since knife cutting cuts the optical film with a knife cutter by pressure, as described above, a phenomenon in which stress is concentrated at the vertex may occur. Accordingly, the present application can provide a film with high reliability while cutting the knife.

The present application also relates to a method of cutting an optical film. The optical film cutting method may be to cut the film in a polygonal shape using the above-described optical film cutting machine, but is not limited thereto.

The present application also relates to an optical film. The optical film may be cut through the above-described cutting machine, or may be a film cut by the above-described cutting method. For example, the optical film may include a metal layer and/or a resin layer.

The metal layer may have a metal deposited on a metal foil or a polymer substrate layer. The metal layer is not particularly limited as long as it is a material containing a metal. The metal layer may include any one of a metal, a metal oxide, a metal nitride, a metal carbide, a metal oxynitride, a metal oxyboride, and combinations thereof. For example, the metal layer may include an alloy in which one or more metal elements or non-metal elements are added to one metal, and may include, for example, Invar, stainless steel (SUS), but is limited thereto. No, in consideration of the elastic modulus and cutting using a knife cutter to be described later, the Invar or stainless steel (SUS) may be excluded. In one example, the metal layer is iron, chromium, copper, aluminum nickel, iron oxide, chromium oxide, silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and combinations thereof. The metal layer may be deposited by electrolysis, rolling, thermal evaporation, electron beam evaporation, sputtering, reactive sputtering, chemical vapor deposition, plasma chemical vapor deposition, or electron cyclotron resonance source plasma chemical vapor deposition means. In an embodiment of the present application, the metal layer may be deposited by reactive sputtering.

The optical film of the present application may also include a protective layer. The protective layer may be one type of the aforementioned resin layer. The protective layer may be positioned on the metal layer to prevent corrosion when the metal layer comes into contact with moisture and to prevent damage due to folding or bending during the process.

In one example, the protective layer may include a resin component. The material constituting the protective layer is not particularly limited, and may be the same as or different from the resin component of the encapsulation layer to be described later. In one example, as a resin component constituting the protective layer, polyorganosiloxane, polyimide, styrene-based resin or elastomer, polyolefin-based resin or elastomer, polyoxyalkylene-based resin or elastomer, polyester-based resin or elastomer, poly Vinyl chloride resin or elastomer, polycarbonate resin or elastomer, polyphenylene sulfide resin or elastomer, polyamide resin or elastomer, acrylate resin or elastomer, epoxy resin or elastomer, silicone resin or elastomer, and fluorine resin It may include one or more selected from the group consisting of a resin or an elastomer, but is not limited thereto.

In an embodiment of the present application, the optical film is a resin layer present on the lower surface of the metal layer separately from the protective layer, and may further include an encapsulation layer for front-sealing the organic electronic device. The optical film may include the metal layer and the encapsulation layer integrally. The encapsulation layer may include, as a resin component, an encapsulation resin including a crosslinkable resin or a curable resin.

In one example, the encapsulating resin may have a glass transition temperature of less than 0 °C, less than -10 °C, or less than -30 °C, less than -50 °C or less than -60 °C. In the above, the glass transition temperature may be a glass transition temperature after curing or crosslinking, and in one embodiment, the glass transition temperature after irradiating ultraviolet rays with an irradiation ^{amount of about 1J/cm 2 or more;} Alternatively, it may mean a glass transition temperature after further thermal curing after UV irradiation.

In one example, the encapsulating resin is a styrene-based resin or elastomer, a polyolefin-based resin or elastomer, other elastomers, polyoxyalkylene-based resins or elastomers, polyester-based resins or elastomers, polyvinyl chloride-based resins or elastomers, and polycarbonate-based resins. Resin or elastomer, polyphenylene sulfide-based resin or elastomer, mixture of hydrocarbons, polyamide-based resin or elastomer, acrylate-based resin or elastomer, epoxy-based resin or elastomer, silicone-based resin or elastomer, fluorine-based resin or elastomer or mixtures thereof and the like.

In one embodiment of the present invention, the encapsulating resin may be an olefin-based resin. In one example, the olefin-based resin is a homopolymer of butylene monomer; a copolymer obtained by copolymerizing a butylene monomer and another polymerizable monomer; reactive oligomers using butylene monomers; or a mixture thereof. The butylene monomer may include, for example, 1-butene, 2-butene, or isobutylene.

Other monomers polymerizable with the butylene monomer or derivative may include, for example, isoprene, styrene, or butadiene. By using the copolymer, it is possible to maintain physical properties such as fairness and degree of crosslinking, so that heat resistance of the adhesive itself can be secured when applied to an organic electronic device.

In addition, the reactive oligomer using the butylene monomer may include a butylene polymer having a reactive functional group. The oligomer may have a weight average molecular weight in the range of 500 to 5000. In addition, the butylene polymer may be bonded to another polymer having a reactive functional group. The other polymer may be an alkyl (meth)acrylate, but is not limited thereto. The reactive functional group may be a hydroxyl group, a carboxyl group, an isocyanate group, or a nitrogen-containing group. In addition, the reactive oligomer and the other polymer may be crosslinked by a polyfunctional crosslinking agent, and the polyfunctional crosslinking agent may be at least one selected from the group consisting of an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, and a metal chelate crosslinking agent.

In one example, the encapsulating resin of the present application may be a copolymer of a diene and an olefin-based compound including one carbon-carbon double bond. Here, the olefin-based compound may include butylene, and the like, and the diene may be a monomer polymerizable with the olefin-based compound, and may include, for example, isoprene or butadiene. For example, the copolymer of the diene and the olefin-based compound containing one carbon-carbon double bond may be butyl rubber.

In the resin layer, the resin or the elastomer component may have a weight average molecular weight (Mw) that allows the composition to be molded into a film shape. That is, the resin layer may be in a solid or semi-solid state even in an uncured state at room temperature. In the present specification, room temperature may mean, for example, 15°C to 35°C or about 25°C. In the present application, that the resin layer is in a solid or semi-solid state may mean a state after drying. In one example, the resin or elastomer may have a weight average molecular weight of about 100,000 to 2 million, 120,000 to 1.5 million, or 350,000 to 1 million. In the present specification, the term "weight average molecular weight" refers to a value converted to standard polystyrene measured by gel permeation chromatograph (GPC). However, it is not necessary for the resin or elastomer component to have the above-mentioned weight average molecular weight. For example, when the molecular weight of the resin or elastomer component does not reach a level sufficient to form a film, a separate binder resin may be blended into the pressure-sensitive adhesive composition.

In another embodiment, the encapsulating resin according to the present application may be a curable resin. The curable resin may be, for example, a resin having a glass transition temperature of 85° C. or higher after curing. The glass transition temperature may be a glass transition temperature after photocuring or thermosetting the encapsulating resin. Specific types of the curable resin that can be used in the present invention are not particularly limited, and, for example, various thermosetting or photocurable resins known in this field may be used. The term “thermosetting resin” refers to a resin that can be cured through the application of appropriate heat or an aging process, and the term “photocurable resin” refers to a resin that can be cured by irradiation with electromagnetic waves. In addition, the curable resin may be a dual-curable resin including both thermosetting and photocuring characteristics.

In the present application, a specific kind of the curable resin is not particularly limited as long as it has the above-described characteristics. For example, it can be cured to exhibit adhesive properties, and contains at least one thermosetting functional group such as a glycidyl group, an isocyanate group, a hydroxy group, a carboxyl group or an amide group, or an epoxide group, a cyclic ether and a resin including at least one functional group curable by irradiation with electromagnetic waves, such as a (cyclic ether) group, a sulfide group, an acetal group, or a lactone group. In addition, specific types of the above resins may include, but are not limited to, acrylic resins, polyester resins, isocyanate resins or epoxy resins.

In addition, the resin layer of the present application has high compatibility with the encapsulating resin, and may include an active energy ray polymerizable compound capable of forming a specific cross-linked structure together with the encapsulating resin.

For example, the resin layer of the present application may include a polyfunctional active energy ray-polymerizable compound that can be polymerized by irradiation with active energy rays together with the encapsulating resin. The active energy ray-polymerizable compound is, for example, a functional group capable of participating in a polymerization reaction by irradiation of active energy ray, for example, a functional group containing an ethylenically unsaturated double bond such as an acryloyl group or a methacryloyl group. , may mean a compound including two or more functional groups such as an epoxy group or an oxetane group.

As the polyfunctional active energy ray-polymerizable compound, for example, multifunctional acrylate (MFA) may be used.

In addition, the active energy ray polymerizable compound is 2 parts by weight to 35 parts by weight, 3 parts by weight to 33 parts by weight, 4 to 30 parts by weight, 5 to 28 parts by weight, 6 to 25 parts by weight based on 100 parts by weight of the encapsulating resin. , 8 parts by weight to 20 parts by weight, 10 parts by weight to 18 parts by weight, or 12 parts by weight to 18 parts by weight. The present application provides an encapsulation film having excellent durability and reliability even under severe conditions such as high temperature and high humidity within the above range.

The polyfunctional active energy ray-polymerizable compound that can be polymerized by irradiation with the active energy ray can be used without limitation. For example, the compound may be 1,4-butanediol di(meth)acrylate, 1,3-butylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8- Octanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, neopentylglycol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, cyclo Hexane-1,4-dimethanol di(meth)acrylate, tricyclodecanedimethanol(meth)diacrylate, dimethylol dicyclopentane di(meth)acrylate, neopentylglycol modified trimethylpropane di(meth)acryl lactate, adamantane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, or mixtures thereof.

As the polyfunctional active energy ray-polymerizable compound, for example, a compound having a molecular weight of less than 1,000 and containing two or more functional groups can be used. In this case, the molecular weight may mean a weight average molecular weight or a conventional molecular weight. The polyfunctional active energy ray polymerizable compound may include a ring structure, wherein the ring structure is a carbocyclic structure or a heterocyclic structure; Or any of monocyclic or polycyclic structure may be sufficient.

In an embodiment of the present application, the resin layer may further include a radical initiator. The radical initiator may be a photoinitiator or a thermal initiator. The specific type of the photoinitiator may be appropriately selected in consideration of the curing rate and the possibility of yellowing. For example, benzoin-based, hydroxy ketone-based, amino ketone-based or phosphine oxide-based photoinitiators can be used, and specifically, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether , benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethyl anino acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2 -Hydroxy-2-methyl-1-phenylpropan-1one, 1-hydroxycyclohexylphenylketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propane-1- One, 4- (2-hydroxyethoxy) phenyl-2- (hydroxy-2-propyl) ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone, 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4 -Dimethylthioxanthone, 2,4-diethylthioxanthone, benzyldimethylketal, acetophenone dimethylketal, p-dimethylaminobenzoic acid ester, oligo[2-hydroxy-2-methyl-1-[4-(1-methyl) vinyl) phenyl] propanone] and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide.

The radical initiator is 0.2 parts by weight to 50 parts by weight, 0.3 to 40 parts by weight, 0.4 to 34 parts by weight, 0.5 to 18 parts by weight, 1 to 15 parts by weight, or 2 parts by weight based on 100 parts by weight of the active energy ray-polymerizable compound. It may be included in a ratio of 13 parts by weight to 13 parts by weight. Through this, it is possible to effectively induce the reaction of the active energy ray-polymerizable compound, and also to prevent deterioration of the physical properties of the resin layer composition due to the remaining components after curing.

In an embodiment of the present application, a curing agent may be further included depending on the type of the resin component included in the resin layer. For example, by reacting with the above-described encapsulating resin, a curing agent capable of forming a cross-linked structure or the like may be further included. In this specification, the term encapsulation resin may be used in the same meaning as the resin component.

An appropriate type of the curing agent may be selected and used according to the type of the resin component or the functional group included in the resin.

In one example, when the resin component is an epoxy resin, the curing agent is a curing agent for an epoxy resin known in the art, for example, an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent or an acid anhydride curing agent. One or more than one type may be used, but the present invention is not limited thereto.

In one example, as the curing agent, an imidazole compound having a solid phase at room temperature and a melting point or decomposition temperature of 80° C. or higher may be used. Such compounds include, for example, 2-methyl imidazole, 2-heptadecyl imidazole, 2-phenyl imidazole, 2-phenyl-4-methyl imidazole or 1-cyanoethyl-2-phenyl imidazole, etc. This may be exemplified, but not limited thereto,

The content of the curing agent may be selected according to the composition of the composition, for example, the type or ratio of the encapsulating resin. For example, the curing agent may be included in an amount of 1 to 20 parts by weight, 1 to 10 parts by weight, or 1 to 5 parts by weight based on 100 parts by weight of the resin component. However, the weight ratio may be changed according to the type and ratio of the encapsulating resin or the functional group of the resin, or the crosslinking density to be implemented.

When the resin component is a resin that can be cured by irradiation with an active energy ray, as the initiator, for example, a cationic photopolymerization initiator can be used.

As the cationic photopolymerization initiator, an onium salt or organometallic salt-based ionized cationic initiator or an organosilane or latent sulfonic acid-based or non-ionized cationic photopolymerization initiator may be used. Examples of the onium salt-based initiator include a diaryliodonium salt, a triarylsulfonium salt, or an aryldiazonium salt, and the initiation of an organometallic salt-based initiator As the zero, iron arene may be exemplified, and the organosilane-based initiator may include o-nitrobenzyl triaryl silyl ether, triaryl silyl peroxide, and the like. Alternatively, acyl silane may be exemplified, and the latent sulfuric acid-based initiator may include α-sulfonyloxy ketone or α-hydroxymethylbenzoin sulfonate, but is not limited thereto. .

In one example, as the cationic initiator, an ionized cationic photopolymerization initiator may be used.

In one example, the resin layer may further include a tackifier, and the tackifier may preferably be a hydrogenated cyclic olefinic polymer. As a tackifier, the hydrogenated petroleum resin obtained by hydrogenating a petroleum resin can be used, for example. Hydrogenated petroleum resins may be partially or fully hydrogenated, and may be mixtures of such resins. Such tackifiers may be selected from those having good compatibility with the pressure-sensitive adhesive composition, excellent moisture barrier properties, and low organic volatile components. Specific examples of the hydrogenated petroleum resin include a hydrogenated terpene-based resin, a hydrogenated ester-based resin, or a hydrogenated dicyclopentadiene-based resin. The weight average molecular weight of the tackifier may be about 200 to 5,000. The content of the tackifier may be appropriately adjusted as necessary. For example, the content of the tackifier may be selected in consideration of the gel content, which will be described later, and according to one example, 5 to 100 parts by weight, 8 to 95 parts by weight, 10 parts by weight relative to 100 parts by weight of the resin component. It may be included in an amount of from 15 parts by weight to 93 parts by weight or from 15 parts by weight to 90 parts by weight.

In an embodiment of the present application, at least one of the resin layers may further include a moisture absorbent. As used herein, the term "moisture absorbent" may refer to, for example, a chemically reactive adsorbent capable of removing the moisture through a chemical reaction with moisture or moisture that has penetrated into the encapsulation film to be described later.

For example, the moisture adsorbent may exist in a state uniformly dispersed in the resin layer or the encapsulation film. Here, the evenly dispersed state may mean a state in which the moisture adsorbent is present at the same or substantially the same density in any part of the resin layer or the encapsulation film. As the moisture adsorbent that can be used above, for example, metal oxides, sulfates, or organometallic oxides may be mentioned. Specifically, examples of the sulfate include magnesium sulfate, sodium sulfate or nickel sulfate, and examples of the organometallic oxide include aluminum oxide octylate. Specific examples of the metal oxide in the above, phosphorus pentoxide (P ₂ O ₅ ), lithium oxide (Li ₂ O), sodium oxide (Na ₂ O), barium oxide (BaO), calcium oxide (CaO) or magnesium oxide (MgO) ) and the like, and examples of the metal salt include lithium sulfate (Li ₂ SO ₄ ), sodium sulfate (Na ₂ SO ₄ ), calcium sulfate (CaSO ₄ ), magnesium sulfate (MgSO ₄ ), cobalt sulfate (CoSO ₄ ), Sulfates such as gallium sulfate (Ga ₂ (SO ₄ ) ₃ ), titanium sulfate (Ti(SO ₄ ) ₂ ) or nickel sulfate (NiSO ₄ ), calcium chloride (CaCl ₂ ), magnesium chloride (MgCl ₂ ), strontium chloride (SrCl) ₂ ), yttrium chloride (YCl ₃ ), copper chloride (CuCl ₂ ), cesium fluoride (CsF), tantalum fluoride (TaF ₅ ), niobium fluoride _{(NbF 5} ), lithium bromide (LiBr), calcium bromide (CaBr ₂ ), metal halides such as cesium bromide (CeBr ₃ ), selenium bromide (SeBr ₄ ), vanadium bromide (VBr ₃ ), magnesium bromide (MgBr ₂ ), barium iodide (BaI ₂ ) or magnesium iodide (MgI _{2 );} or metal chlorates such as barium perchlorate (Ba(ClO ₄ ) ₂ ) or magnesium perchlorate (Mg(ClO ₄ ) ₂ ), but is not limited thereto. As a moisture adsorbent that may be included in the encapsulation layer, one of the above-described components may be used, or two or more types may be used. In one example, when two or more types of moisture adsorbents are used, calcined dolomite, etc. may be used.

Such a moisture adsorbent may be controlled to an appropriate size depending on the application. In one example, the average particle diameter of the moisture adsorbent may be controlled to about 10 to 15000 nm. The moisture absorbent having a size in the above range has a reaction rate with moisture that is not too fast, so it is easy to store, does not damage the device to be encapsulated, and can effectively remove moisture.

The content of the moisture adsorbent is not particularly limited and may be appropriately selected in consideration of desired barrier properties.

The resin layer may also contain a moisture barrier, if necessary. As used herein, the term “moisture blocker” may refer to a material that has no or low reactivity with moisture, but can physically block or impede the movement of moisture or moisture in the film. As the moisture barrier, for example, one or two or more of clay, talc, acicular silica, plate-shaped silica, porous silica, zeolite, titania, or zirconia may be used. In addition, the moisture barrier may be surface-treated by an organic modifier or the like to facilitate penetration of organic matter. Such organic modifiers include, for example, dimethyl benzyl hydrogenatedtallow quaternaty ammonium, dimethyl dihydrogenatedtallow quaternary ammonium, methyl tallow bis-2-hydroxyethyl Quaternary ammonium (methyl tallow bis-2-hydroxyethyl quaternary ammonium), dimethyl hydrogenatedtallow 2-ethylhexyl quaternary ammonium, dimethyl dehydrogenated tallow quaternary ammonium ) or an organic modifier that is a mixture thereof may be used.

The content of the moisture barrier agent is not particularly limited and may be appropriately selected in consideration of desired barrier properties.

In addition to the above-described configuration, the resin layer may include various additives depending on the use and the manufacturing process of the encapsulation film to be described later. For example, the resin layer may include a curable material, a crosslinking agent, or a filler in an appropriate range according to desired physical properties.

In an embodiment of the present application, the resin layer may be formed of two or more layers as described above. When formed of two or more layers, one of the resin layers may not contain a moisture absorbent or may include a moisture absorbent in a lower content than the other resin layers.

In one example, the content of the moisture adsorbent may be controlled in consideration of damage to the device, etc., considering that the encapsulation film is applied to the encapsulation of the organic electronic device. For example, a small amount of a moisture adsorbent may be included in the layer in contact with the device, or a moisture adsorbent may not be included. In one example, the resin layer in contact with the device may contain 0 to 20% of the moisture absorbent based on the total mass of the moisture absorbent contained in the encapsulation film. In addition, the resin layer not in contact with the device may contain 80 to 100% of the moisture absorbent based on the total mass of the moisture absorbent contained in the encapsulation film. In one example, the above-described second resin layer solution may include 80 to 100% of the moisture adsorbent with respect to the total mass of the moisture adsorbent contained in the film, and the first resin layer solution is the total moisture adsorbent contained in the film. It may contain 0 to 20% moisture adsorbent by mass.

The present application also relates to an organic electronic device encapsulation film. The encapsulation film may be manufactured by the above-described optical film cutter or cutting method. The encapsulation film may include an encapsulation layer, and the encapsulation layer may be the same as the resin layer described above.

The encapsulation film may further include a base film or a release film (hereinafter, may be referred to as a “first film”), and may have a structure in which the encapsulation layer is formed on the base material or the release film. The structure may further include a substrate or a release film (hereinafter, may be referred to as a “second film”).

A specific kind of the first film that can be used in the present application is not particularly limited. In the present application, as the first film, for example, a general polymer film in this field may be used. In the present application, for example, as the substrate or release film, a polyethylene terephthalate film, a polytetrafluoroethylene film, a polyethylene film, a polypropylene film, a polybutene film, a polybutadiene film, a vinyl chloride copolymer film, a polyurethane film , an ethylene-vinyl acetate film, an ethylene-propylene copolymer film, an ethylene-ethyl acrylate copolymer film, an ethylene-methyl acrylate copolymer film, or a polyimide film. In addition, an appropriate release treatment may be performed on one or both surfaces of the base film or release film of the present application. Examples of the release agent used in the release treatment of the base film include alkyd-based, silicone-based, fluorine-based, unsaturated ester-based, polyolefin-based or wax-based release agents. Preferably, but not limited thereto.

In the present application, the thickness of the base film or the release film (first film) as described above is not particularly limited, and may be appropriately selected depending on the application. For example, in the present application, the thickness of the first film may be about 10 μm to 500 μm, or about 20 μm to 200 μm. If the thickness is less than 10 μm, there is a risk that deformation of the base film may easily occur during the manufacturing process, and if it exceeds 500 μm, economic efficiency is deteriorated.

In one example, the above-described base film may be, for example, a metal layer. Accordingly, the present application provides, as shown in FIG. 7 , an encapsulation film 20 including a base film or release film 21 , an encapsulation layer (or resin layer) 22 and a metal layer 23 . can do. The thickness of the encapsulation layer included in the encapsulation film of the present application is not particularly limited, and may be appropriately selected according to the following conditions in consideration of the application to which the film is applied. The thickness of the encapsulation layer may be about 5 μm to 200 μm, or about 5 μm to 100 μm. The thickness may mean the thickness of the entire multi-layer when the encapsulation layer is multi-layered. When the thickness of the encapsulation layer is less than 5 μm, sufficient moisture blocking ability cannot be exhibited, and when it exceeds 200 μm, it is difficult to secure fairness. it falls

The present application also relates to an organic electronic device. The organic electronic device includes, as shown in FIG. 8 , a substrate 31; an organic electronic device 32 formed on the substrate 31; and the above-described optical films 22 and 23 for sealing the entire surface of the organic electronic device 32 . The optical film may encapsulate the entire surface, for example, upper and side surfaces, of the organic electronic device formed on the substrate. The optical film may include an encapsulation layer 22 and a metal layer 23 containing a pressure-sensitive adhesive composition or an adhesive composition in a crosslinked or cured state. In addition, the organic electronic device may be formed such that the encapsulation layer contacts the front surface of the organic electronic device.

In the above, the organic electronic device may be, for example, an organic light emitting device.

In addition, the encapsulation layer may be formed as a stable encapsulation layer regardless of the shape of the organic electronic device such as top emission or bottom emission.

In addition, the organic electronic device of the present application may include a protective layer. The protective layer may prevent damage to the electrode of the device, and may be made of a conventional material in the art, and may include, for example, SiNx or Al ₂ O ₃ as an inorganic material. The passivation layer may be a passivation layer in which an organic layer and an inorganic layer are alternately deposited.

The present application also provides a method of manufacturing an organic electronic device. The manufacturing method may include applying the above-described optical film to a substrate having an organic electronic device formed thereon so as to cover the organic electronic device. In addition, the manufacturing method may further include the step of curing the optical film. The curing of the optical film refers to curing of the encapsulation layer (resin layer), and the curing may be performed before or after the optical film covers the organic electronic device.

As used herein, the term “curing” may mean that the composition of the present invention forms a cross-linked structure through a heating or UV irradiation process, and thus is manufactured in the form of an adhesive. Alternatively, it may mean that the adhesive composition is solidified and adhered as an adhesive.

In one example, the manufacturing method forms a transparent electrode on a glass or polymer film used as a substrate by a method such as vacuum deposition or sputtering, and on the transparent electrode, for example, a hole transport layer, a light emitting layer and an electron transport layer, etc. After forming the layer of the light emitting organic material composed of Subsequently, the entire surface of the organic electronic device of the substrate subjected to the above process may be positioned to cover the encapsulation layer of the optical film.

The present application provides a cutting machine for an optical film capable of maintaining process efficiency and film reliability in manufacturing an optical film, and a method of cutting the optical film.

1 is a perspective view showing a cutting machine and a cutting method according to an example of the present application.
2 to 4 are cross-sectional views showing a first cutting machine according to an example of the present application.
5 is a cross-sectional view showing a second cutting machine according to an example of the present application.
6 is a cross-sectional view showing a top coat and a bottom coat (cutter) according to an example of the present application.
7 is a cross-sectional view illustrating an optical film according to an example of the present application.
8 is a cross-sectional view illustrating an organic electronic device according to an example of the present application.

Hereinafter, the present invention will be described in more detail through Examples according to the present invention and Comparative Examples not according to the present invention, but the scope of the present invention is not limited by the Examples presented below.

Example 1

Preparation of encapsulation layer

After preparing a solution (solids 33%) of 180 g of butyl rubber resin (BT-20, Sunwoo Chemtech) and 60 g of DCPD-based petroleum resin (SU5270, Sunwoo Chemtech) diluted with toluene, the solution was homogenized. 10 g of a polyfunctional acrylate (trimethylolpropane triacrylate, Miwon) and 3 g of a photoinitiator (Irgacure819, Ciba) were added to the homogenized solution, followed by homogenization and high-speed stirring for 1 hour to prepare an encapsulation layer solution.

The encapsulation layer solution prepared above was applied to the release surface of the release PET using a comma coater, and dried at 130° C. in a dryer for 3 minutes to form an encapsulation layer having a thickness of 50 μm.

Fabric sheet manufacturing of encapsulation film

On a pre-prepared metal layer (aluminum foil, thickness 70㎛), the encapsulation layer was laminated at 70°C in a roll-to-roll process to prepare a fabric sheet of the encapsulation film.

Cutting of the encapsulation film

The manufactured fabric sheet was cut through the first cutter 100 and the second cutter 200 according to FIG. 1 to prepare an organic electronic device encapsulation film.

100: first cutter
200: second cutter
300: optical film fabric sheet
1: 1st side
2: 2nd side
3: Third side
4: 4th side
11: First cutter
12: second cutter
13: third cutter
111: top
112: hado
113: cleaning unit
121: top
122: Hado
20: optical film
21: base film or release film
22: resin layer (encapsulation layer)
23: metal layer
31: substrate
32: organic electronic device

Claims (20)

It is a cutting machine that cuts the fabric sheet conveyed in one direction into a polygonal optical film,
The optical film is an optical film integrally including a metal layer and a resin layer,
The cutter includes: a first cutter including a first cutter for cutting a first side of the optical film of the polygonal shape; and a second cutter including a second cutter for cutting a second side adjacent to the first side,
the first cutter comprises at least two ring knives and the second cutter comprises a blade cutter;
After cutting the first side with the first cutter, the second side is cut with the second cutter,
The two ring knives each include a top coat and a bottom coat,
The fabric sheet is cut while being transferred between the upper coat and the lower coat,
The upper coat is located in the conveying direction or moving direction of the original sheet so that its central axis forms an angle within the range of 1 to 10 degrees with the central axis of the lower coat,
The angle range is based on an imaginary line perpendicular to the direction of gravity or the conveyance direction of the original sheet,
When cutting, the metal layer of the optical film is disposed in the undercoat direction, and the resin layer is disposed in the top coat direction,
The top coat and the bottom coat are arranged parallel to the conveying direction of the original sheet,
An optical film cutter configured so that the ratio of the rotation speed of the lower coat to the rotation speed of the upper coat is in the range of 1.15 to 1.5. The optical film cutter according to claim 1, wherein the cutting direction of the first cutter is parallel to the feeding direction of the original sheet. The optical film cutter according to claim 1, wherein the first and second cutters cut the first and second sides with a time difference. The optical film cutter according to claim 3, wherein the time difference is in the range of 0.01 second to 1 minute. The optical film cutter according to claim 1, wherein the first cutter further comprises a third cutter that cuts a third side adjacent to the second side without adjacent to the first side. delete delete delete The optical film cutter according to claim 1, wherein the upper angle has a blade angle of 50 to 90 degrees, and the lower angle has a blade angle of 50 to 90 degrees based on an imaginary line perpendicular to the direction of gravity or the feed direction of the original sheet. The optical film cutter according to claim 1, wherein the outer diameter size of the lower coat among the two ring knives is equal to or larger than the outer diameter size of the upper coat. delete The optical film cutter according to claim 1, wherein the first cutter includes a cleaning unit for cleaning the first cutter. The optical film cutter of claim 12 , wherein the cleaning unit includes oil or alcohol. The optical film cutter according to claim 12, wherein the cleaning unit is provided to be in contact with the ring knife blade of the first cutter. The method according to claim 1, wherein the second cutter includes an upper cut and a lower cut, and the blade angle of the upper cut is 40 to 90 degrees based on an imaginary line perpendicular to the direction of gravity or the feed direction of the fabric sheet, An optical film cutter with a blade angle of 80 to 90 degrees. The optical film cutter according to claim 1, wherein the second cutter is an oscillation type cutter. delete delete delete An optical film cutting method for cutting a film in a polygonal shape using the optical film cutting machine according to claim 1 .

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