KR102367988B1 - Apparatus and method for manufacturing a display apparatus - Google Patents

Abstract

Disclosed are an apparatus for manufacturing a display device and a method for manufacturing the display device. The present invention includes a chamber, a source part disposed inside the chamber, and a mask assembly disposed to face the source part, wherein the source part is formed such that one side is opened, and a crucible in which a deposition material is accommodated; a cover coupled to the crucible and shielding the open portion of the crucible, and a nozzle coupled to the cover and having a flow path through which the deposition material moves, wherein the nozzle is disposed in the flow path, at least one and a baffle portion having the above nozzle through-holes formed thereon.

Description

Apparatus and method for manufacturing a display apparatus

Embodiments of the present invention relate to an apparatus and method, and more particularly, to an apparatus and method for manufacturing a display device.

Electronic devices based on mobility are widely used. In addition to small electronic devices such as mobile phones, tablet PCs have recently been widely used as mobile electronic devices.

Such a mobile electronic device includes a display unit to provide visual information such as an image or video to a user in order to support various functions. Recently, as other components for driving the display unit are miniaturized, the proportion of the display unit in electronic devices is gradually increasing, and a structure capable of being bent to have a predetermined angle in a flat state is being developed.

In general, when a deposition material is deposited on a substrate through a mask assembly, the thickness of the deposition material in the pattern edge region of the deposition material is formed to be different from the thickness of the deposition material in the central portion, so that deposition cannot be performed accurately. . In this case, since it may be difficult to manufacture a high-resolution display device, embodiments of the present invention provide an apparatus for manufacturing a display device capable of depositing a deposition material in a precise pattern, and a method for manufacturing the display device.

An embodiment of the present invention includes a chamber, a source part disposed inside the chamber, and a mask assembly disposed to face the source part, wherein the source part is formed such that one side thereof is opened, and the deposition material is accommodated therein. a crucible, a cover coupled to the crucible and shielding an open portion of the crucible, and a nozzle coupled to the cover and having a flow path through which the deposition material moves, wherein the nozzle is disposed in the flow path, Disclosed is an apparatus for manufacturing a display device including a baffle portion in which at least one nozzle through hole is formed.

In the present embodiment, the discharge port of the flow path may be expanded as the distance from the crucible increases.

In this embodiment, the baffle part is disposed in the flow path, an upper baffle part having at least one upper through-hole formed therein, and disposed in the flow path to be spaced apart from the upper baffle part, at least one or more lower through-holes It may include the formed lower baffle part.

In this embodiment, the upper through-hole and the lower through-hole may be arranged so as not to overlap each other.

In this embodiment, the plurality of nozzles are provided, the plurality of nozzles are arranged in a line in one direction of the crucible, and the plurality of nozzles include a first nozzle disposed in a central portion of the crucible, and the first nozzle; The second nozzle may include a second nozzle spaced apart from the first nozzle, and a first width of the first outlet of the first nozzle may be different from a second width of the second outlet of the second nozzle.

In this embodiment, the first width may be greater than the second width.

In this embodiment, the plurality of nozzles are provided, the plurality of nozzles are arranged in a line in one direction of the crucible, and the plurality of nozzles include a first nozzle disposed in a central portion of the crucible, and the first nozzle; a second nozzle disposed to be spaced apart from the first nozzle, wherein the first nozzle is disposed to be perpendicular to the upper surface of the cover, and the second nozzle is different from an angle formed between the first nozzle and the upper surface of the cover It may be disposed on the cover at an angle.

In this embodiment, the second outlet of the second nozzle may be formed to be symmetrical with respect to an arbitrary straight line passing through the center of the second nozzle and parallel to the longitudinal direction of the second nozzle.

In this embodiment, the source unit may further include a crucible baffle unit disposed inside the crucible and having at least one crucible through hole formed therein.

In this embodiment, the crucible beffle part is disposed inside the crucible, a first crucible beffle part having at least one first crucible through hole formed therein, and the first crucible beffle part are disposed inside the crucible so as to be spaced apart from the first crucible beffle part, , and a second crucible baffle unit in which at least one or more second crucible through-holes are formed.

In this embodiment, the first crucible through-hole and the second crucible through-hole may be arranged so as not to overlap each other.

In this embodiment, at least a portion of the nozzle may be inserted into the crucible.

Another embodiment of the present invention includes the steps of inserting a substrate into the chamber, aligning the substrate and the mask assembly, and passing the deposition material accommodated in the crucible through a baffle part disposed in the flow path of the nozzle from the crucible. and supplying to the mask assembly side to increase the deposition material on the substrate.

In the present embodiment, the discharge port of the flow path may be expanded as the distance from the crucible increases.

In the present embodiment, a plurality of baffle parts may be provided, and the plurality of baffle parts may bend a movement path of the deposition material at least once.

In this embodiment, the nozzles include a plurality of nozzles arranged in a line, and the plurality of nozzles include a first nozzle disposed in a central portion of the crucible, and a second nozzle disposed to be spaced apart from the first nozzle. a nozzle, and a first width of the first outlet of the first nozzle may be different from a second width of the second outlet of the second nozzle.

In this embodiment, the plurality of nozzles may be provided, the plurality of nozzles may be arranged in a line in one direction of the crucible, and at least two of the plurality of nozzles may be arranged to form a predetermined angle.

In the present embodiment, the deposition material may be supplied to the flow passage through a crucible baffle unit disposed inside the crucible.

In the present embodiment, a plurality of crucible bevel parts may be provided, and the plurality of crucible beffle parts may bend the movement path of the deposition material at least once.

In this embodiment, at least a portion of the nozzle may be inserted into the crucible.

Other aspects, features and advantages other than those described above will become apparent from the following drawings, claims, and detailed description of the invention.

These general and specific aspects may be embodied using a system, method, computer program, or combination of any system, method, and computer program.

In the display device manufacturing apparatus and the display device manufacturing method according to the exemplary embodiments of the present invention, it is possible to uniformly deposit the deposition material over the entire substrate. In addition, the display device manufacturing apparatus and the display device manufacturing method according to the embodiments of the present invention can minimize the shadow area generated during deposition.

1 is a cross-sectional view illustrating an apparatus for manufacturing a display device according to an exemplary embodiment.
FIG. 2 is a perspective view showing the source unit shown in FIG. 1 .
FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2 .
4 is a conceptual diagram illustrating a display device according to another exemplary embodiment.
FIG. 5 is a perspective view showing the source unit shown in FIG. 4 .
FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. 5 .
FIG. 7 is a plan view illustrating a display device manufactured through the device for manufacturing the display device illustrated in FIG. 1 or FIG. 4 .
FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 7 .

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. Effects and features of the present invention, and a method for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, and when described with reference to the drawings, the same or corresponding components are given the same reference numerals, and the overlapping description thereof will be omitted. .

In the following embodiments, terms such as first, second, etc. are used for the purpose of distinguishing one component from another, not in a limiting sense.

In the following examples, the singular expression includes the plural expression unless the context clearly dictates otherwise.

In the following embodiments, terms such as include or have means that the features or components described in the specification are present, and the possibility that one or more other features or components will be added is not excluded in advance.

In the following embodiments, when it is said that a part such as a film, region, or component is on or on another part, not only when it is directly on the other part, but also another film, region, component, etc. is interposed therebetween. Including cases where there is

In the drawings, the size of the components may be exaggerated or reduced for convenience of description. For example, since the size and thickness of each component shown in the drawings are arbitrarily indicated for convenience of description, the present invention is not necessarily limited to the illustrated bar.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on a Cartesian coordinate system, and may be interpreted in a broad sense including them. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

In cases where certain embodiments may be implemented otherwise, a specific process sequence may be performed different from the described sequence. For example, two processes described in succession may be performed substantially simultaneously, or may be performed in an order opposite to the order described.

1 is a cross-sectional view illustrating an apparatus for manufacturing a display device according to an exemplary embodiment. FIG. 2 is a perspective view showing the source unit shown in FIG. 1 . FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2 .

1 to 3 , the display device manufacturing apparatus 100 includes a chamber 110 , a source unit 120 , a mask assembly 130 , a substrate support unit 140 , a seating unit 150 , and a vision unit ( 160) and a pressure control unit 170 may be included.

The chamber 110 may have a space formed therein, and the display substrate D and the mask assembly 130 may be accommodated therein. In this case, a portion of the chamber 110 may be formed to be opened, and a gate valve 111 may be disposed in the opened portion of the chamber 110 to selectively open and close the opened portion of the chamber 110 .

The source unit 120 may be disposed to be fixed to the chamber 110 or may be disposed to be linearly movable inside the chamber 110 . When the source unit 120 linearly moves, a linear driving unit 190 for linearly moving the source unit 120 may be disposed in the chamber 110 . The linear driving unit 190 may include a linear motor connected to the source unit 120 , a cylinder, and the like. In this case, the linear driving unit 190 is not limited to the above, and may include all devices and all structures that are connected to the source unit 120 to linearly move the source unit 120 .

The source unit 120 as described above may be disposed in the long side (eg, the Y direction of FIG. 1 ) or the short side (eg, the X direction of FIG. 1 ) of the mask assembly 130 . Hereinafter, for convenience of explanation, a case in which the source part 120 is disposed in the short side direction of the mask assembly 130 will be described in detail.

The source unit 120 may include a crucible 121 , a heater 122 , a cover 123 , a nozzle 124 , and a crucible baffle unit 127 . The crucible 121 may be formed so that a space is formed therein, the deposition material may be accommodated, and one side of the crucible 121 is opened. The heater 122 may be disposed on at least one of the crucible 121 and the cover 123 . In this case, the heater 122 may heat the deposition material by applying heat to at least one of the crucible 121 and the cover 123 . The cover 123 may be coupled to the crucible 121 to shield the opened portion of the crucible 121 .

The nozzle 124 may be disposed on the cover 123 . In this case, the nozzle 124 may be connected to the cover 123 in various forms. For example, the nozzle 124 may be integrally formed with the cover 123 . In another embodiment, the nozzle 124 may be formed separately from the cover 123 to be coupled to the cover 123 . Hereinafter, for convenience of description, the nozzle 124 will be described in detail focusing on the case where the nozzle 124 is formed separately from the cover 123 and coupled with the cover 123 .

The nozzle 124 as described above may be connected to the upper surface of the cover 123 . In another embodiment, at least a portion of the nozzle 124 may be inserted into the crucible 121 through the cover 123 . In this case, at least a portion of the nozzle 124 may be disposed below the lower surface of the cover 123 . Hereinafter, for convenience of description, a case in which at least a portion of the nozzle 124 is inserted into the crucible 121 of the cover 123 will be described in detail.

A plurality of nozzles 124 as described above may be provided. In this case, the plurality of nozzles 124 may be arranged in a line along the length direction of the cover 123 . Also, the plurality of nozzles 124 may form a predetermined angle with one surface of the cover 123 (eg, the upper surface of the cover 123 ). Specifically, the plurality of nozzles 124 may be perpendicular to one surface of the cover 123 .

The plurality of nozzles 124 may include a first nozzle 125 disposed in a central portion of the cover 123 and a second nozzle 126 disposed to be spaced apart from the first nozzle 125 . In this case, a plurality of first nozzles 125 may be provided, and the plurality of first nozzles 125 may be disposed adjacent to each other to form one group. In addition, a plurality of second nozzles 126 may be provided, and the plurality of second nozzles 126 may be disposed adjacent to each other to form one group. In this case, the plurality of first nozzles 125 forming one group and the plurality of second nozzles 126 forming one group may be disposed to be spaced apart from each other. In particular, the distance between the plurality of first nozzles 125 and the plurality of second nozzles 126 may be greater than the distance between the first nozzles 125 adjacent to each other or the distance between the second nozzles 126 adjacent to each other. . The first nozzle 125 and the second nozzle 126 as described above may be formed identically or similarly to each other. Hereinafter, for convenience of description, the first nozzle 125 will be described in detail.

The first nozzle 125 includes a first nozzle body part 125-1 having a first flow path 125-5 formed thereon and a first baffle part 125-2 disposed on the first flow path 125-5. may include The first nozzle body part 125 - 1 may be formed in various shapes. For example, the first nozzle body part 125 - 1 may have a cylindrical shape or a polygonal column shape. However, hereinafter, for convenience of description, the first nozzle body part 125-1 will be described in detail focusing on the cylindrical shape. At least a portion of the first nozzle body part 125 - 1 may be inserted into the crucible 121 through the cover 123 . The first flow path 125 - 5 may be formed to pass through the center of the first nozzle body 125 - 1 . At this time, the first flow path 125-5 is connected to the first linear flow path 125-6 formed in a straight line shape while having a constant inner diameter, and is connected to the first linear flow path 125-6, and has a first width (or inner diameter). (W1) may include different first outlets 125 - 7 in the longitudinal direction of the first nozzle 125 . The first width W1 of the first outlet 125 - 7 may be measured in a direction perpendicular to the length direction of the first nozzle 125 . In this case, the first width W1 of the first discharge port 125-7 increases from the first straight flow path 125-6 to the end of the first discharge port 125-7 of the first flow path 125-5. can In particular, the inner surface of the first flow path 125 - 5 forming the first discharge port 125 - 7 may be inclined.

The first nozzle 125 and the second nozzle 126 as described above may be formed to be different from each other. For example, the first width W1 of the first outlet 125 - 7 of the first nozzle 125 measured at the same point is the second width W1 of the second outlet 126 - 7 of the second nozzle 126 . 2 may be different from the width W2. In particular, the first width W1 of the first outlet 125 - 7 of the first nozzle 125 measured at the same point may be greater than the second width W2 of the second outlet 126 - 7 . In this case, the area of the deposition material injected through the first discharge hole 125 - 7 may be larger than the area of the deposition material injected through the second discharge hole 126 - 7 . That is, the first outlet 125 - 7 may supply the deposition material to a wider area than the second outlet 156 - 7 .

The first baffle part 125 - 2 may be disposed in the first flow path 125 - 5 . At this time, the first baffle part 125-2 includes a first upper baffle part 125-3 and a first lower baffle part 125-4 disposed to be spaced apart from each other inside the first flow path 125-5. can do. At least one first upper baffle part 125 - 3 may have at least one first upper through hole 125 - 3A. The first lower baffle part 125 - 4 may have at least one first lower through hole 125 - 4A formed therein. At this time, for convenience of description, a plurality of first upper through-holes 125-3A are provided, and a case in which only one first lower through-hole 125-4A is provided will be described in detail. The first upper through-hole 125-3A and the first lower through-hole 125-4A as described above may not overlap each other. That is, the first upper through-hole 125-3A and the first lower through-hole 125-4A may be arranged to cross each other. For example, the first lower through hole 125 - 4A may be formed in a central portion of the first lower baffle part 125 - 4 . On the other hand, the first upper through-hole 125 - 3A may be formed at the edge of the first upper baffle part 125 - 3 . In this case, when looking at the first upper through-hole 125-3A and the first lower through-hole 125-4A through the first outlet 125-7, only the first upper through-hole 125-3A is visible. The first lower through-hole 125 - 4A may be hidden by the first upper baffle part 125 - 3 to be invisible. In this case, the deposition material inside the first crucible 121 may pass through the first lower through hole 125 - 4A and the first upper through hole 125 - 3A to move to the first discharge port 125 - 7 . In particular, a movement path of the deposition material may be bent at least once while passing through the first lower through hole 125 - 4A and the first upper through hole 125 - 3A.

The crucible beffle unit 127 may be disposed inside the crucible 121 . In this case, the crucible beffle unit 127 may include a first crucible beffle unit 128 and a second crucible beffle unit 129 disposed to be spaced apart from each other. The first crucible beffle unit 128 and the second crucible beffle unit 129 may be disposed at different heights from each other. A first crucible through hole 128 - 1 may be formed in the first crucible beffle unit 128 , and a second crucible through hole 128 - 2 may be formed in the second crucible beffle unit 129 . In this case, similarly to the first upper through-hole 125-3A and the first lower through-hole 125-4A, the first crucible through-hole 128-1 and the second crucible through-hole 128-2 overlap each other. It can be arranged so as not to That is, the first crucible through-hole 128-1 and the second crucible through-hole 128-2 may be arranged to cross each other.

The mask assembly 130 may include a mask frame 131 , a mask sheet 132 , and a support frame 133 .

The mask frame 131 may be formed by connecting a plurality of frames, and may be formed so that a central portion thereof is penetrated. In this case, the inside of the mask frame 131 may be formed in a grid shape. For example, the mask frame 131 may be formed similarly to a window frame.

The mask sheet 132 may be installed in a tensioned state on the mask frame 131 . In this case, one mask sheet 132 may be provided and disposed on the mask frame 131 . As another embodiment, a plurality of mask sheets 132 may be provided, and the plurality of mask sheets 132 may be arranged along one side of the mask frame 131 . A plurality of openings 132-1 may be formed in each mask sheet 132 . In this case, the plurality of openings 132-1 may be formed in each mask sheet 132 to be spaced apart from each other. Hereinafter, for convenience of description, a case in which a plurality of mask sheets 132 are provided will be described in detail.

The support frame 133 may be disposed on the mask frame 131 . In this case, the support frame 133 may be disposed at a central portion of the mask frame 131 . A plurality of support frames 133 may be provided, and the plurality of support frames 133 may be disposed in at least one of a long side direction and a short side direction of the mask frame 131 . In this case, a long side of the mask frame 131 may be a direction in which the plurality of mask sheets 132 are arranged, and a short side of the mask frame 131 may be a longitudinal direction of each mask sheet 132 . Among the plurality of support frames 133 as described above, the support frame 133 disposed in the long side direction of the mask frame 131 divides the plurality of openings 132-1 of the mask sheet 132 into a plurality of regions. possible. Also, among the plurality of support frames 133 , the support frames 133 disposed in the short side direction of the mask frame 131 may be disposed between the mask sheets 132 adjacent to each other.

The substrate support unit 140 may support the display substrate (D). In this case, the substrate support 140 may be formed in various shapes. For example, as an embodiment, the substrate support unit 140 may include an electrostatic chuck or an adhesive chuck disposed above the chamber 110 to support the display substrate D. At this time, the substrate support unit 140 may perform a linear motion (or elevating motion) inside the chamber 110 . As another embodiment, the substrate support unit 140 may include a frame or a separate device (eg, shuttle, robot arm, etc.) for supporting the lower surface of the display substrate D. In this case, the substrate support unit 140 can finely adjust the position of the display substrate (D). As another embodiment, the substrate support unit 140 holds the side surface of the display substrate D or comes in contact with the side surface of the display substrate D to support the display substrate D by a clamp, a frame, or a separate device (for example, , shuttle, robot arm, cylinder, etc.). In this case, the substrate support unit 140 is not limited to the above, and may include all structures and all devices for fixing the position of the display substrate D by contacting the display substrate D or by gripping the display substrate D. there is. However, hereinafter, for convenience of description, the substrate support unit 140 will be described in detail focusing on the case of clamping the side surface of the display substrate (D).

The mounting part 150 may seat the mask assembly 130 . In this case, it is possible for the seating part 150 to fine-tune the mask assembly 130 in three different directions.

The vision unit 160 may be disposed inside the chamber 110 . In this case, the vision unit 160 may detect the positions of the mask assembly 130 and the display substrate D. In this case, the vision unit 160 may include a camera.

The pressure adjusting unit 170 may be connected to the chamber 110 to adjust the pressure inside the chamber 110 . At this time, the pressure adjusting unit 170 may include a connection pipe 171 (and a pump 172 disposed in the connection pipe 171 () connected to the chamber 110).

In addition to the above configuration, the display device manufacturing apparatus 100 includes a magnet unit 181 that applies electromagnetic force to the mask assembly 130 , a cooling plate 182 that adjusts the temperature of the display substrate D, and the display device manufacturing apparatus 100 . ) It is also possible to further include a control unit (not shown) for controlling the.

Meanwhile, referring to the operation of the apparatus 100 for manufacturing a display device as described above, the mask assembly 130 may be inserted into the chamber 110 and seated on the seating unit 150 . In this case, the mask assembly 130 may be initially disposed inside the chamber 110 and then may be continuously disposed inside the chamber 110 while deposition is performed a plurality of times.

The display substrate D may be disposed in the chamber 110 . At this time, the pressure inside the chamber 110 may be atmospheric pressure. Specifically, the pump 172 operates to inject gas into the chamber 110 through the connection pipe 171. After that, the gate valve 111 is opened to open the opening of the chamber 110 to the display substrate ( D) may be inserted into the chamber 110. In this case, the display substrate D may be moved by a robot arm disposed outside the chamber 110, or the like.

When the display substrate D is disposed inside the chamber 110 , the vision unit 160 may detect the positions of the display substrate D and the mask assembly 130 . In this case, alignment marks may be respectively formed on the display substrate D and the mask assembly 130 . The vision unit 160 may photograph the alignment mark as described above and transmit it to the control unit. The controller may determine the relative position between the display substrate D and the mask assembly 130 by comparing the positions of the alignment marks of the display substrate D and the alignment marks of the mask assembly 130 .

The control unit is configured to control at least one of the display substrate D and the mask assembly 130 so that the display substrate D and the mask assembly 130 correspond to each other based on the relative position between the display substrate D and the mask assembly 130 . position can be adjusted. In this case, the controller may adjust the position of at least one of the display substrate D and the mask assembly 130 through at least one of the substrate support unit 140 and the seating unit 150 . By adjusting the position of at least one of the display substrate D and the mask assembly 130 as described above, the display substrate D and the mask assembly 130 may be aligned.

When the alignment of the display substrate D and the mask assembly 130 is completed, the heater 122 operates to sublimate or evaporate the deposition material in the source unit 120 to supply the deposition material into the chamber 110 . there is. At this time, the pressure adjusting unit 170 may maintain the pressure inside the chamber 110 in a state almost similar to that of a vacuum.

The deposition material may have a uniform temperature and speed inside the crucible 121 while passing through the second crucible beffle unit 129 and the first crucible beffle unit 128 . Specifically, the second crucible through hole 128 - 2 and the first crucible through hole 128 - 1 may bend the deposition material at least once while passing through it. In addition, the second crucible beffle unit 129 and the first crucible beffle unit 128 divide the crucible 121 into a plurality of regions, and the deposition material may sequentially fill each region and then move to another region. In this case, the deposition material may maintain a uniform concentration in each region. In addition, the pressure and temperature of the deposition material may be reduced while passing through the second crucible beffle unit 129 and the first crucible beffle unit 128 from the inside of the crucible 121 .

As described above, the deposition material passing through each region may be sprayed through the first nozzle 125 and the second nozzle 126 . As the deposition material passes through the first nozzle 125 and the second nozzle 126 , the temperature and pressure may be lowered once again. Specifically, looking at the first nozzle 125 as the center, the deposition material may flow into the first flow path 125 - 5 from the space between the crucible 121 and the first crucible beffle unit 128 . Thereafter, the deposition material may pass through the first lower baffle part 125 - 4 and then pass through the first upper baffle part 125 - 3 . At this time, by passing through the first upper baffle part 125-3 in a state in which the deposition material is completely filled in the space between the first lower baffle part 125-4 and the first upper baffle part 125-3, the deposition material is removed. The pressure and temperature may be reduced, and the speed and concentration of the deposition material may be uniform. This phenomenon may also occur in the second nozzle 126 in the same or similar manner.

At this time, at least a portion of the first nozzle 125 and the second nozzle 126 is disposed inside the crucible 121 to prevent the deposition material from rapidly entering the first nozzle 125 and the second nozzle 126 . can do. In particular, the positions of the first nozzle 125 and the second nozzle 126 are arranged so as not to overlap the first upper through-hole 125-3A, so that the deposition material passing through the first upper through-hole 125-3A is immediately disposed. Inflow into the first nozzle 125 and the second nozzle 126 may be prevented.

Thereafter, the deposition material is supplied into the chamber 110 through the first outlet 125-7 along the first nozzle 125, and through the second outlet 126-7 along the second nozzle 126. (110) can be supplied inside.

In this case, the width of the first outlet 125 - 7 and the width of the second outlet 126 - 7 extend along the length direction of the first nozzle 125 and the length direction of the second nozzle 126 , respectively. By being formed, the deposition material can be radiated in various directions. Accordingly, the deposition material simultaneously sprayed from the first nozzle 125 and the second nozzle 126 may have a uniform concentration, pressure, and temperature.

In this case, the deposition material injected from the first nozzle 125 and the second nozzle 126 may pass through the mask assembly 130 to be deposited on the display substrate D. At this time, the deposition material may be uniformly deposited on the display substrate (D). In particular, the shadow area generated when the deposition material is deposited on the display substrate D after passing through the mask assembly 130 can be minimized. Specifically, when a general mask assembly and a source unit are used, the deposition material sprayed from the source unit may be diffused in various directions. In this case, the deposition material deposited on the display substrate through the opening of the mask sheet may form one pattern, and the area of one pattern may have an area different from the area of the opening. In particular, in the deposition material deposited on the display substrate, the thickness of the deposition material at the edge of the pattern and the thickness of the deposition material at the center of the pattern may be different. In this case, the thickness of the deposition material at the edge may be smaller than the thickness of the deposition material in the central portion, and this area is referred to as a shadow area. Such a shadow region may be generated by being blocked by a protruding portion of the mask sheet. When the shadow area is increased, the pattern of the deposition material may be different from the designed pattern, and a problem in that the degree of light emission is weakened may occur. Such a shadow region may be affected by the velocity, pressure, temperature, concentration, etc. of the deposition material emitted from the source part. In particular, when the deposition material emitted from the source part is not uniform over the entire region of the source part, shadow regions are different for each region of the display substrate, so that it may be impossible to manufacture a display device of uniform quality. In addition, when a general source part is used, the straightness of the deposition material sprayed from the outlet of the nozzle is weak, so that it may not go straight until it reaches the mask assembly. In this case, the area of the shadow region may increase because a large amount of the deposition material collides with the protruding portion of the mask sheet.

However, when the source unit 120 is formed as described above, it is desirable to maintain the same or similar velocity, pressure, temperature and concentration of the deposition material emitted from the source unit 120 over the entire region of the source unit 120 . possible. In addition, the flow rate of the deposition material in the central portion of each of the first nozzles 125 and the second nozzle 126 and the flow rate of the deposition material in the side portions of each of the first nozzle 125 and the second nozzle 126 are similar to each other. It is possible to keep

In addition, since the width of the first outlet 125-7 is formed to be larger than the width of the second outlet 126-7, the flow rate of the deposition material reaching the edge region of the display substrate D and the center of the display substrate D It is possible to keep the flow rate of deposition material reaching the part similar. In addition, each of the first outlet 125-7 and the second outlet 126-7 is formed to extend along the longitudinal direction of the first nozzle 125 and the longitudinal direction of the second nozzle 126, so that the first nozzle ( 125) The deposition material of the second nozzle 126 may collide with the inclined inner surface of the first outlet 125-7 and the inclined inner surface of the second outlet 126-7 to be sprayed at a predetermined angle. In particular, in this case, it is possible to spray a high concentration of the deposition material in a narrow angle range than that of the conventional nozzle of the source part. Since the first nozzle 125 and the second nozzle 126 as well as the first nozzle 125 and the second nozzle 126 are inserted into the crucible 121 , the straightness of the deposition material may be improved. In this case, the amount of the deposition material passing through the protruding portion of the mask sheet 132 and incident on the display substrate D among the deposition materials may be greater than before. In particular, as the amount of the deposition material incident on the existing shadow region among the deposition materials increases, the thickness of the deposition material deposited over the entire region of the deposition material pattern may be uniform, and the shadow region may be reduced than before.

As described above, the source 120 may deposit the deposition material on the display substrate D by linear motion in one direction while supplying the deposition material. This operation may be performed multiple times.

When the deposition material as described above is deposited on the display substrate D, the pressure adjusting unit 170 may operate to maintain the pressure inside the chamber 110 at atmospheric pressure. Thereafter, the display substrate D is taken out of the chamber 110 and another process is performed to manufacture a display device.

Accordingly, the display device 100 and the method of manufacturing the display device can manufacture a display device having a uniform pattern. In addition, the apparatus 100 for manufacturing a display device and the method of manufacturing the display device allow precise deposition, so that a high-resolution display device can be manufactured. The display device manufacturing apparatus 100 and the display device manufacturing method may minimize the shadow area.

4 is a conceptual diagram illustrating a display device according to another exemplary embodiment. FIG. 5 is a perspective view showing the source unit shown in FIG. 4 . FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. 5 .

4 to 6 , the display device manufacturing apparatus 100A includes a chamber 110A, a source unit 120A, a mask assembly 130A, a substrate support unit 140A, a seating unit 150A, and a vision unit ( 160A), a pressure control unit 170A, a magnet unit 181A, a pressure control unit 182A, and a linear driving unit (not shown). At this time, the chamber 110A, the mask assembly 130A, the substrate support part 140A, the seating part 150A, the vision part 160A, the pressure adjusting part 170A, the magnet part 181A, the pressure adjusting part 182A. and the linear driving unit is the same as or similar to that described above, and thus a detailed description thereof will be omitted.

The source unit 120A may include a crucible 121A, a heater 122A, a cover 123A, a nozzle 124A, and a crucible baffle unit 127A. At this time, since the crucible 121A, the heater 122A, the cover 123A, and the crucible beffle part 127A are the same as or similar to those described above, a detailed description thereof will be omitted.

The nozzle 124A may be disposed on the cover 123A. In this case, the nozzle 124A may be connected to the cover 123A in various forms. For example, the nozzle 124A may be integrally formed with the cover 123A. As another embodiment, the nozzle 124A may be formed separately from the cover 123A and coupled to the cover 123A. Hereinafter, for convenience of description, a case in which the nozzle 124A is integrally formed with the cover 123A will be described in detail.

The nozzle 124A as described above may be connected to the upper surface of the cover 123A. In another embodiment, at least a portion of the nozzle 124A may be inserted into the crucible 121A through the cover 123A. In this case, at least a portion of the nozzle 124A may be disposed below the lower surface of the cover 123A.

A plurality of nozzles 124A as described above may be provided. In this case, the plurality of nozzles 124A may be arranged in a line along the length direction of the cover 123A.

The plurality of nozzles 124A may include a first nozzle 125A disposed in a central portion of the cover 123A and a second nozzle 126A disposed to be spaced apart from the first nozzle 125A. In this case, a plurality of first nozzles 125A may be provided, and the plurality of first nozzles 125A may be disposed adjacent to each other to form one group. In addition, a plurality of second nozzles 126A may be provided, and the plurality of second nozzles 126A may be disposed adjacent to each other to form one group. In this case, the plurality of first nozzles 125A forming one group and the plurality of second nozzles 126A forming one group may be disposed to be spaced apart from each other. In particular, the distance between the plurality of first nozzles 125A and the plurality of second nozzles 126A may be greater than the distance between the first nozzles 125A adjacent to each other or the distance between the second nozzles 126A adjacent to each other. . A predetermined angle may be formed between the first nozzle 125A and the second nozzle 126A as described above. For example, the first nozzle 125A may be vertically arranged with respect to the upper surface of the cover 123A, and the second nozzle 126A may form an acute or obtuse angle with respect to the upper surface of the cover 123A. In this case, the first nozzle 125A and the second nozzle 126A may be formed to be identical or similar to each other. Hereinafter, for convenience of description, the first nozzle 125A will be described in detail.

The first nozzle 125A includes a first nozzle body part 125A-1 having a first flow path 125A-5 formed thereon and a first baffle part 125A-2 disposed on the first flow path 125A-5. may include The first nozzle body part 125A-1 may be formed in various shapes. For example, the first nozzle body part 125A-1 may have a cylindrical shape or a polygonal column shape. However, hereinafter, for convenience of description, the first nozzle body portion 125A-1 will be described in detail focusing on the cylindrical shape. At least a portion of the first nozzle body portion 125A-1 may be inserted into the crucible 121A through the cover 123A. The first flow path 125A-5 may be formed to pass through the center of the first nozzle body part 125A-1. At this time, the first flow path 125A-5 is connected to the first linear flow path 125A-6 formed in a straight line with a constant inner diameter, and the first linear flow path 125A-6, and has a first width (or inner diameter). (W1) may include different first discharge ports 125A-7 in the longitudinal direction of the first nozzle 125A. The first width W1 of the first discharge port 125A-7 may be measured in a direction perpendicular to the longitudinal direction of the first nozzle 125A. In this case, the first width W1 of the first discharge port 125A-7 may increase from the first straight flow path 125A-6 to the end of the first discharge port 125A-7 of the first flow path 125A-5. there is. In particular, the inner surface of the first flow path 125A-5 forming the first discharge port 125A-7 may be inclined.

The first nozzle 125A and the second nozzle 126A as described above may be formed to be different from each other. For example, the first width W1 of the first outlet 125A-7 of the first nozzle 125A measured at the same point is the second width W1 of the second outlet 126A-7 of the second nozzle 126A. 2 may be different from the width W2. In particular, the first width W1 of the first outlet 125A-7 of the first nozzle 125A measured at the same point may be greater than the second width W2 of the second outlet 126A-7. In this case, the area of the deposition material injected through the first discharge hole 125A-7 may be larger than the area of the deposition material injected through the second discharge hole 126A-7. That is, the first outlet 125A-7 may supply the deposition material to a wider area than the second outlet 156A-7.

The first baffle part 125A-2 may be disposed in the first flow path 125A-5. At this time, the first baffle part 125A-2 includes a first upper baffle part 125A-3 and a first lower baffle part 125A-4 disposed to be spaced apart from each other inside the first flow path 125A-5. can do. At least one first upper baffle part 125A-3 may be formed with at least one first upper baffle part 125A-3A. The first lower baffle part 125A-4 may have at least one first lower through hole 125A-4A formed therein. At this time, for convenience of description, a plurality of first upper through-holes 125A-3A are provided, and a case in which only one first lower through-hole 125A-4A is provided will be described in detail. The first upper through-holes 125A-3A and the first lower through-holes 125A-4A as described above may not overlap each other. For example, the first lower through-hole 125A-4A may be formed in a central portion of the first lower baffle part 125A-4. On the other hand, the first upper through-hole (125A-3A) may be formed in the edge portion of the first upper baffle portion (125A-3). In this case, when looking at the first upper through-hole 125A-3A and the first lower through-hole 125A-4A through the first outlet 125A-7, only the first upper through-hole 125A-3A is visible. The first lower through-holes 125A-4A may be hidden by the first upper baffle part 125A-3 to be invisible. In this case, the deposition material inside the first crucible 121A may pass through the first lower through-holes 125A-4A and the first upper through-holes 125A-3A to move to the first outlet 125A-7. In particular, a movement path of the deposition material may be bent at least once while passing through the first lower through-holes 125A-4A and the first upper through-holes 125A-3A.

The second nozzle 126A may include a second nozzle body part 126A-1 and a second baffle part 126A-2 similar to the first nozzle 125A described above. In this case, the second nozzle body part 126A-1 may be disposed such that at least a portion thereof is inserted into the crucible 121A, or may be connected to the cover 123A. In this case, the second nozzle body part 126A-1 may be connected to the cover 123A to have an angle (eg, an acute angle or an obtuse angle) that is not a right angle with respect to the upper surface of the cover 123A. In particular, the second nozzle body portion 126A-1 may be disposed to be inclined with respect to the upper surface of the cover 123A. In this case, the second outlet 126A-7 of the second flow path 126A-5 inside the second nozzle body 126A-1 may be formed similarly to the first outlet 125A-7. At this time, the second discharge port 126A-7 is parallel to the longitudinal direction of the second nozzle body part 126A-1, and has a symmetrical shape based on an arbitrary straight line passing through the center of the second nozzle body part 126A-1. can be formed with In this case, the second discharge port 126A-7 may be formed to extend along the longitudinal direction of the second nozzle body portion 126A-1.

Meanwhile, looking at the apparatus 100A for manufacturing a display device as described above, after inserting the display substrate D into the chamber 110A, the display substrate D and the mask assembly 130A are passed through the vision unit 160A. can be aligned In this case, the gate valve 111A may selectively open and close the opening of the chamber 110A. When the gate valve 111A opens the opening of the chamber 110A, the pressure control unit 170A may maintain the pressure inside the chamber 110A equal to or similar to atmospheric pressure, and the gate valve 111A is the chamber 110A. ) When closing the opening of the chamber (110A) it is possible to maintain the same or similar pressure inside the vacuum.

When the alignment between the display substrate D and the mask assembly 130A is completed, the source 120A may supply the deposition material to the mask assembly 130A to deposit the deposition material on the display substrate D. In this case, the deposition material may be supplied to the display substrate D in a state in which the temperature, pressure, and concentration are uniform while passing through the source unit 120A. In addition, the deposition material may be supplied to the central portion and the side portion of the display substrate D through the first nozzle 125A and the second nozzle 126A. At this time, as described above, the first nozzle 125A and the second nozzle 126A improve the straightness of the deposition material and supply the deposition material at a uniform concentration so that the deposition material is deposited on the display substrate D and formed. It is possible to minimize the shadow area in the pattern of the deposition material to be used.

Accordingly, the display device 100A and the method of manufacturing the display device can manufacture a display device having a uniform pattern. In addition, the apparatus 100A for manufacturing a display device and the method for manufacturing the display device allow precise deposition, so that a high-resolution display device can be manufactured. The apparatus 100A for manufacturing the display device and the method of manufacturing the display device may minimize the shadow area.

FIG. 7 is a plan view illustrating a display device manufactured through the device for manufacturing the display device illustrated in FIG. 1 or FIG. 4 . FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. 7 .

7 and 8 , in the display device 20 , a display area DA and a non-display area outside the display area DA may be defined on the substrate 21 . A light emitting part (not shown) may be disposed in the display area DA, and power wiring (not shown) may be disposed in the non-display area. In addition, the pad part C may be disposed in the non-display area.

The display device 20 may include a display substrate D, an intermediate layer 28B, a counter electrode 28C, and an encapsulation layer (not shown). In this case, the display substrate D may include a substrate 21 , a buffer layer 22 , a thin film transistor TFT, a passivation layer 27 , a pixel electrode 28A, and a pixel defining layer 29 . In addition, the encapsulation layer may include an encapsulation substrate (not shown) or a thin film encapsulation layer E identical to or similar to that of the substrate 21 . In this case, when the encapsulation layer includes the encapsulation substrate, a separate sealing member (not shown) may be disposed between the substrate 21 and the encapsulation substrate. However, hereinafter, for convenience of description, the case in which the encapsulation layer includes the thin-film encapsulation layer (E) will be described in detail.

The substrate 21 may be made of a plastic material, or a metal material such as SUS or Ti. In addition, the substrate 21 may be made of polyimide (PI). Hereinafter, for convenience of description, a case in which the substrate 21 is formed of polyimide will be described in detail.

A light emitting part (not marked) may be formed on the substrate 21 . In this case, the light emitting part is provided with a thin film transistor (TFT), a passivation layer 27 is formed to cover them, and an organic light emitting device 28 can be formed on the passivation layer 27 .

A buffer layer 22 made of an organic compound and/or an inorganic compound is further formed on the upper surface of the substrate 21 , and may be formed of SiOx (x≥1) or SiNx (x≥1).

After the active layer 23 arranged in a predetermined pattern is formed on the buffer layer 22 , the active layer 23 is buried by the gate insulating layer 24 . The active layer 23 has a source region 23C and a drain region 23A, and further includes a channel region 23B therebetween.

The active layer 23 may be formed to contain various materials. For example, the active layer 23 may contain an inorganic semiconductor material such as amorphous silicon or crystalline silicon. As another example, the active layer 23 may contain an oxide semiconductor. As another example, the active layer 23 may contain an organic semiconductor material. However, hereinafter, for convenience of explanation, a case in which the active layer 23 is formed of amorphous silicon will be described in detail.

The active layer 23 may be formed by forming an amorphous silicon film on the buffer layer 22 , crystallizing it to form a polycrystalline silicon film, and patterning the polycrystalline silicon film. In the active layer 23, a source region 23C and a drain region 23A thereof are doped with impurities, depending on the type of TFT, such as a driving TFT (not shown) and a switching TFT (not shown).

A gate electrode 25 corresponding to the active layer 23 and an interlayer insulating layer 26 filling the same are formed on the upper surface of the gate insulating layer 24 .

Then, after forming the contact hole H1 in the interlayer insulating layer 26 and the gate insulating layer 24, the source electrode 27B and the drain electrode 27A are respectively formed on the interlayer insulating layer 26 in the source region ( 23C) and the drain region 23A.

A passivation layer 27 is formed on the thin film transistor formed in this way, and a pixel electrode 28A of the organic light emitting device 28 (OLED) is formed on the passivation layer 27 . This pixel electrode 28A is in contact with the drain electrode 27A of the TFT by a via hole H2 formed in the passivation film 27 . The passivation film 27 may be formed of an inorganic material and/or an organic material, a single layer or two or more layers, and may be formed as a planarization film so that the upper surface is flat regardless of the curvature of the lower film, whereas the curvature of the film located below It may be formed so as to be curved along the . And, the passivation film 27 is preferably formed of a transparent insulator so as to achieve a resonance effect.

After the pixel electrode 28A is formed on the passivation film 27, a pixel defining film 29 is formed of an organic material and/or an inorganic material to cover the pixel electrode 28A and the passivation film 27, and the pixel The electrode 28A is opened so as to be exposed.

Then, an intermediate layer 28B and a counter electrode 28C are formed on at least the pixel electrode 28A.

The pixel electrode 28A functions as an anode electrode and the counter electrode 28C functions as a cathode electrode. Of course, the polarities of the pixel electrode 28A and the counter electrode 28C may be reversed.

The pixel electrode 28A and the counter electrode 28C are insulated from each other by the intermediate layer 28B, and voltages of different polarities are applied to the intermediate layer 28B so that light is emitted from the organic emission layer.

The intermediate layer 28B may include an organic emission layer. As another optional example, the intermediate layer 28B includes an organic emission layer, in addition to a hole injection layer (HIL), a hole transport layer, and an electron transport layer. and at least one of an electron injection layer. The present embodiment is not limited thereto, and the intermediate layer 28B includes an organic light emitting layer and may further include various other functional layers (not shown).

In this case, the intermediate layer 28B as described above may be formed through the above-described manufacturing apparatus (not shown) of the display device.

Meanwhile, one unit pixel includes a plurality of sub-pixels, and the plurality of sub-pixels may emit light of various colors. For example, each of the plurality of sub-pixels may include a sub-pixel emitting red, green, and blue light, and may include a sub-pixel (not marked) emitting red, green, blue, and white light.

Meanwhile, the thin film encapsulation layer (E) as described above may include a plurality of inorganic layers, or may include an inorganic layer and an organic layer.

The organic layer of the thin film encapsulation layer (E) is formed of a polymer, preferably a single film or a laminate film formed of any one of polyethylene terephthalate, polyimide, polycarbonate, epoxy, polyethylene, and polyacrylate. More preferably, the organic layer may be formed of polyacrylate, and specifically may include a polymerized monomer composition including a diacrylate-based monomer and a triacrylate-based monomer. A monoacrylate-based monomer may be further included in the monomer composition. In addition, a known photoinitiator such as TPO may be further included in the monomer composition, but is not limited thereto.

The inorganic layer of the thin film encapsulation layer (E) may be a single film or a laminated film including a metal oxide or a metal nitride. Specifically, the inorganic layer may include any one of SiNx, Al2O3, SiO2, and TiO2.

The uppermost layer exposed to the outside of the thin film encapsulation layer (E) may be formed of an inorganic layer to prevent moisture permeation to the organic light emitting device.

The thin film encapsulation layer (E) may include at least one sandwich structure in which at least one organic layer is inserted between at least two inorganic layers. As another example, the thin film encapsulation layer (E) may include at least one sandwich structure in which at least one inorganic layer is inserted between at least two organic layers. As another example, the thin film encapsulation layer (E) may include a sandwich structure in which at least one organic layer is inserted between at least two inorganic layers and a sandwich structure in which at least one inorganic layer is inserted between at least two organic layers. .

The thin film encapsulation layer E may include a first inorganic layer, a first organic layer, and a second inorganic layer sequentially from an upper portion of the organic light emitting diode OLED.

As another example, the thin film encapsulation layer E may include a first inorganic layer, a first organic layer, a second inorganic layer, a second organic layer, and a third inorganic layer sequentially from an upper portion of the organic light emitting diode OLED.

As another example, the thin film encapsulation layer (E) is sequentially formed from an upper portion of the organic light emitting diode (OLED) with a first inorganic layer, a first organic layer, a second inorganic layer, the second organic layer, a third inorganic layer, and a third It may include an organic layer and a fourth inorganic layer.

A metal halide layer including LiF may be further included between the organic light emitting diode (OLED) and the first inorganic layer. The metal halide layer may prevent the organic light emitting diode OLED from being damaged when the first inorganic layer is formed by sputtering.

The first organic layer may have a smaller area than the second inorganic layer, and the second organic layer may also have a smaller area than the third inorganic layer.

Accordingly, the display device 20 includes the intermediate layer 28B that forms a precise pattern, and the intermediate layer 28B is deposited and formed at an accurate position, so that a precise image can be realized. In addition, the display device 20 forms a uniform pattern even when the intermediate layer 28B is repeatedly deposited, thereby exhibiting uniform quality according to continuous production.

As such, the present invention has been described with reference to one embodiment shown in the drawings, but this is merely exemplary, and those skilled in the art will understand that various modifications and variations of the embodiments are possible therefrom. Accordingly, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims.

20: display device
100,100A: display device manufacturing device
110,110A: chamber
120, 120A: source part
130,130A: mask assembly
140, 140A: substrate support
150, 150A: seating part
160,160A: Vision Department
170,170A: pressure control unit
181,181A: magnet part
182,182A: cooling plate
190,190A: linear drive part

Claims (20)

chamber;
a source unit disposed inside the chamber;
Including; a mask assembly disposed to face the source unit;
The source unit,
The crucible is formed so that one side is opened, the deposition material is accommodated;
a cover coupled to the crucible and shielding the opened portion of the crucible; and
and a nozzle coupled to the cover and having a flow path through which the deposition material moves;
The nozzle is
and a baffle part disposed in the flow path and having at least one nozzle through hole formed therein;
A plurality of nozzles are provided, and the plurality of nozzles are arranged in a line in one direction of the crucible,
The plurality of nozzles,
a first nozzle disposed in the central portion of the crucible to supply the deposition material to the central portion of the display substrate; and
a second nozzle disposed to be spaced apart from the first nozzle and supplying the deposition material to a side surface of the display substrate; and
A first width of the first outlet of the first nozzle is greater than a second width of the second outlet of the second nozzle. The method of claim 1,
The discharge port of the flow path expands as the distance from the crucible increases. The method of claim 1,
The baffle part,
an upper baffle portion disposed in the flow path and having at least one upper through-hole formed therein; and
and a lower baffle part disposed in the flow path to be spaced apart from the upper baffle part and having at least one lower baffle part formed therein. 4. The method of claim 3,
The upper through-hole and the lower through-hole are arranged not to overlap each other. delete delete The method of claim 1,
The first nozzle is disposed perpendicular to the top surface of the cover, and the second nozzle is disposed on the cover at an angle different from an angle between the first nozzle and the top surface of the cover. 8. The method of claim 7,
The second discharge port of the second nozzle passes through a center of the second nozzle and is formed to be symmetrical with respect to an arbitrary straight line parallel to a length direction of the second nozzle. The method of claim 1,
The source unit,
and a crucible baffle part disposed inside the crucible and having at least one crucible through hole formed therein. 10. The method of claim 9,
The crucible baffle unit,
a first crucible beffle unit disposed inside the crucible and having at least one first crucible through hole formed therein; and
and a second crucible beffle part disposed inside the crucible to be spaced apart from the first crucible beffle part and having at least one second crucible through hole formed therein. 11. The method of claim 10,
The first crucible through-hole and the second crucible through-hole are arranged not to overlap each other. The method of claim 1,
At least a portion of the nozzle is inserted into the crucible. inserting the substrate into the chamber;
aligning the substrate and the mask assembly;
supplying the deposition material accommodated in the crucible to the mask assembly side from the crucible through the baffle portion disposed in the flow path of the nozzle to deposit the deposition material on the substrate;
A plurality of nozzles are provided, and the plurality of nozzles are arranged in a line in one direction of the crucible,
The plurality of nozzles,
a first nozzle disposed in the central portion of the crucible to supply the deposition material to the central portion of the display substrate; and
a second nozzle disposed to be spaced apart from the first nozzle and supplying the deposition material to a side surface of the display substrate; and
A first width of the first outlet of the first nozzle is greater than a second width of the second outlet of the second nozzle. 14. The method of claim 13,
The method of manufacturing a display device, wherein the discharge port of the flow path expands as the distance from the crucible increases. 14. The method of claim 13,
The method of manufacturing a display device includes a plurality of baffle parts, wherein the plurality of baffle parts bend a movement path of the deposition material at least once. delete 14. The method of claim 13,
At least two of the plurality of nozzles are arranged to form a predetermined angle. 14. The method of claim 13,
The deposition material is supplied to the flow path through a crucible baffle unit disposed inside the crucible. 19. The method of claim 18,
A method of manufacturing a display device in which a plurality of crucible beffle portions are provided, and the plurality of crucible beffle portions bend a movement path of the deposition material at least once. 14. The method of claim 13,
at least a portion of the nozzle is inserted into the crucible.

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