KR102447306B1 - Die bonding device and manufacturing method of semiconductor device - Google Patents

Abstract

An object of the present invention is to provide a technology capable of inspecting the appearance of a paste-type adhesive that changes shape after application.
In the registration operation before mass production, the die bonder measures the time from the operation of applying the paste-type adhesive to the metal frame during mass production to the operation of imaging the paste-type adhesive, and applying the paste-type adhesive to the metal frame, Then, it is comprised so that the said measured time may be waited, the paste-type adhesive applied to the said metal frame may be imaged, and a reference inspection image may be acquired.

Description

DIE BONDING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

The present disclosure relates to a die bonding apparatus, and is applicable to, for example, a die bonder having a function of applying a paste-type adhesive.

A part of the manufacturing process of a semiconductor device includes a process of assembling a package by mounting a semiconductor chip (hereinafter simply referred to as a die) on a wiring board or lead frame (organic substrate such as metal, glass, epoxy, etc.) A part of the process includes a step of dividing a die from a semiconductor wafer (hereinafter simply referred to as a wafer) (a dicing step) and a bonding step of mounting the divided die on a substrate. A semiconductor manufacturing device used in the bonding process is a die bonder.

A die bonder is a device for bonding (mounting and bonding) a die to a substrate or an already bonded die using a resin paste, solder, gold plating, or the like as a bonding material. In a die bonder for bonding a die to the surface of a substrate, for example, a suction nozzle called a collet is used to suck the die from the wafer, pick it up, convey it onto the substrate, apply a pressing force, and heat the bonding material. By doing so, the operation (work) of performing bonding is repeatedly performed.

When a resin is used as a bonding material, resin pastes, such as Ag epoxy and acrylic, are used as an adhesive agent (henceforth a paste-type adhesive agent). A paste-type adhesive for adhering the die to a lead frame or the like is enclosed in a syringe, and the syringe is It moves up and down with respect to the lead frame to inject and apply the paste-type adhesive. That is, a predetermined amount of the paste-type adhesive is applied to a predetermined position by a syringe in which the paste-type adhesive is sealed, and a die is pressed and baked on the paste-type adhesive to adhere. A recognition camera is installed in the vicinity of the syringe, and it is checked whether the paste-type adhesive applied with the recognition camera is applied at a predetermined position in a predetermined shape and in a predetermined amount.

Japanese Patent Laid-Open No. 2013-197277

In order to improve the adhesiveness to the board|substrate of the mold resin which seals the die mounted on board|substrates, such as a lead frame which is a metal frame, the board|substrate is subjected to a shell pattern treatment. However, after application of the paste-type adhesive, smearing of the paste-type adhesive occurs due to the fine irregularities formed on the substrate, and a shape change occurs in the applied paste-type adhesive. For this reason, the test|inspection of the apply|coated paste-type adhesive agent becomes difficult.

An object of the present disclosure is to provide a technique capable of inspecting the appearance of a paste-type adhesive in which a shape change occurs after application.

Other problems and novel features will become apparent from the description of this specification and accompanying drawings.

A brief outline of representative ones of the present disclosure is as follows.

That is, in the registration operation before mass production, the die bonder measures the time from the operation of applying the paste-type adhesive to the metal frame during mass production to the operation of imaging the paste-type adhesive, and applying the paste-type adhesive to the metal frame. It is comprised so that the said measured time may be waited after apply|coating, the paste-type adhesive applied to the said metal frame may be imaged, and a reference inspection image may be acquired.

According to the above die bonding apparatus, it is possible to inspect the appearance of the paste-type adhesive having a change in shape after application.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure explaining application|coating of a paste adhesive.
2 : is a figure explaining the problem in the case of apply|coating a paste-type adhesive agent to the lead frame in which the pear skin pattern process was made.
3 : is a figure explaining the problem in the case of apply|coating a paste-type adhesive agent to the lead frame in which the pear skin pattern process was made.
4 : is a figure explaining the outline|summary of embodiment.
5 : is a figure explaining the test|inspection method of the paste-type adhesive agent in 1st Embodiment.
It is a figure explaining the test|inspection method of the paste-type adhesive agent in 1st Embodiment.
7 : is a figure explaining the test|inspection method of the paste-type adhesive agent in 1st modified example.
It is a figure explaining the test|inspection method of the paste-type adhesive agent in 2nd Embodiment.
It is a figure explaining the test|inspection method of the paste-type adhesive agent in 2nd Embodiment.
It is a figure explaining the test|inspection method of the paste-type adhesive agent in 2nd Embodiment.
11 : is a figure explaining an example of the prediction method of a shape.
It is a figure explaining the test|inspection method of the paste-type adhesive agent in a 2nd modified example.
It is a figure explaining the test|inspection method of the paste-type adhesive agent in 3rd Embodiment.
Fig. 14 is a conceptual diagram of the die bonder of the embodiment viewed from above.
Fig. 15 is a configuration diagram of an optical system of the die bonder of Fig. 14;
Fig. 16 is a block diagram showing a schematic configuration of a control system of the die bonder of Fig. 14;
17 is a flowchart illustrating a method of manufacturing a semiconductor device.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment, a modification, and an Example are demonstrated using drawings. However, in the following description, the same code|symbol is attached|subjected to the same component, and repetitive description may be abbreviate|omitted. In addition, in order to make description more clear, although the drawing may be represented typically about the width, thickness, shape, etc. of each part compared with an actual aspect, it is an example to the last and does not limit the interpretation of this invention.

First, application|coating of a paste-type adhesive agent is demonstrated using FIG. Fig. 1 (a) is a diagram showing a captured image of a paste-type adhesive applied on tabs of a lead frame in which tabs are arranged in a grid, and Fig. 1 (b) is a binarization of Fig. 1 (a). It is a figure which shows an image.

Application of the paste adhesive to the lead frame which is a metal frame is performed by the preform part provided before a bonding part, for example. First, the preform part uses a recognition camera to position the lead frame LF to which the paste-type adhesive is to be applied. Positioning is performed by pattern matching or the like similarly to the bonding head. Next, the preform part is injected from the nozzle at the tip of the syringe in which the paste-type adhesive PA is sealed, and is applied along the trajectory of the nozzle. The syringe is driven on the XYZ axis according to the shape to be applied, and it is applied while drawing a free trajectory, such as an X mark shape or a cross shape, depending on the trajectory. Finally, the preform part uses a recognition camera to inspect the state of the paste-like adhesive PA after application (appearance inspection is performed). The presence or absence of the paste-type adhesive (PA), the application area, the application shape (shortage, protrusion), etc. are inspected as necessary. In addition to the method of counting the number of pixels after separating the paste region by the binarization process shown in FIG. Hereinafter, the application|coating pattern of the paste-type adhesive agent PA is demonstrated as a thing of the X mark shape.

As shown in Fig. 1 (a), depending on the application state of the paste-type adhesive, there is a shortage (interruption of Fig. 1 (a)), protrusion (lower end of Fig. 1 (a)), and the like. In addition, the upper end of Fig. 1 (a) is a case where the application state of the paste-type adhesive is normal.

In order to improve the adhesion with the mold resin that seals the lead frame as a substrate to which the die is bonded, a pear shell pattern treatment is performed on the lead frame. A problem in the case where the paste-type adhesive is applied to the lead frame on which the pear shell pattern treatment is made will be described with reference to FIGS. 2 and 3 . Fig. 2 (a) is a view showing a captured image immediately after applying a paste-type adhesive to the surface of the lead frame on which the pear shell pattern treatment has been made, and Fig. 2 (b) is a predetermined time from Fig. 2 (a). It is a figure which shows the captured image of the elapsed state, FIG.2(c) is a conceptual sectional drawing in the line A-A of FIG.2(b), FIG.2(d) is part 2 of FIG.2(a). It is a figure which shows a digitized image, and FIG.2(e) is a figure which shows the binarized image of FIG.2(b). Fig. 3 is a view showing a captured image of a paste-like adhesive applied on tabs of a lead frame in which tabs are arranged in a grid.

When the paste-type adhesive PA is applied to the tab TB as the die mounting portion of the lead frame LF subjected to the pear shell pattern treatment, as shown in FIG. 2(b)(c), with the lapse of time The paste-type adhesive (PA) spreads thinly. The surface of the lead frame LF on which the pear shell pattern treatment is made is not flat, and there are fine irregularities. The paste-type adhesive (PA) applied so as to permeate into this unevenness spreads. In the present specification, this bleeding is referred to as bleed (BO). The bleed BO spreads thinly in a uniform direction along with the elapsed time in the initial stage. Moreover, even if it is a lead frame which is not made with a pear pattern process, even when the viscosity of a paste-type adhesive agent is small, the paste-type adhesive agent spreads with the elapsed time.

In the case of visual inspection immediately after application of the paste-type adhesive PA, the inspection is completed before the bleed BO spreads. However, when a re-inspection or inspection is required after a predetermined time has elapsed for some reason, it is necessary to consider the change in the bleed BO.

Bleed includes seepage of solvent and seepage of paste itself. In the case of seepage of the paste itself, it is judged as defective when there is a change in bleed (BO). In this case, it can be detected by the binarized image of FIG.2(e) after predetermined time elapses after application|coating, and the binarized image of FIG.2(d) immediately after application|coating registered in advance.

On the other hand, when the bleed BO has little effect on the application amount of the paste-type adhesive PA, and the presence of the bleed BO itself is not bad, a certain amount of time has elapsed after the application of the paste-type adhesive PA. After that, when an appearance inspection is performed using an image captured by a recognition camera installed above the applied paste-type adhesive PA, even if the amount of the paste-type adhesive PA is measured, the The amount of paste (area/applying shape) cannot be detected. If the captured image is binarized as it is, as shown in Fig. 2(e), since the bleed BO is also regarded as a paste application area, the paste portion PST and the bleed BO cannot be separated. In the current inspection system capable of only two-dimensional inspection, it is determined that the application is excessive.

A case in which an inspection is required after a predetermined period of time has elapsed from the application of the paste-type adhesive PA will be described with reference to FIG. 3 .

In FIG. 3, the paste-type adhesive PA is sequentially applied in the downward direction from the upper right tab of the lead frame LF in which tabs are arranged in a grid pattern, and the paste-type adhesive PAR is applied to the right lower tab. After application, the paste-type adhesive PA is sequentially applied in the downward direction from the highest position in the second row from the right, and then, in the third and fourth rows in the same manner. Accordingly, the paste-like adhesive (PAS) applied to the highest tab in the first row has the longest elapsed time after application, and the paste-like adhesive (PAE) applied to the lowest tab in the fourth row has the smallest elapsed time after application.

As shown in Fig. 3, after the application of the 4 rows, that is, after the application of the paste adhesive (PAE), the appearance inspection of the paste adhesive applied to all the tabs in the 4 rows is performed, as shown in Fig. 3 , the bleed (BO) ) is different for each tap. Usually, since the appearance inspection of the paste-type adhesive is performed for each row, the diffusion of bleed (BO) is different for each tab in the paste-type adhesive of the tab applied at the beginning of the row and the paste-type adhesive of the tab applied at the end of the row.

In the case of performing a full tap inspection after application to a plurality of tabs such as one row or multiple rows, the time from application to inspection is different for each tab, and the spread of bleed (BO) varies from tab to tab, and the inspection result is determined based on the position of the tab. change according to

Next, the outline|summary of embodiment which solves the said problem is demonstrated using FIG. Fig. 4(a) is a view showing a captured image immediately after applying the paste-type adhesive to the surface of the lead frame, and Fig. 4(b) is a captured image after a predetermined time has elapsed from Fig. 4(a). Fig. 4(c) is a diagram showing the binarized image of Fig. 4(a), and Fig. 4(d) is a diagram showing the binarized image of Fig. 4(b). Fig. 4(e) is a diagram showing the binarized image of Fig. 4(a), and Fig. 4(f) is a binarized image in which the bleed change is removed from Fig. 4(b). It is a drawing.

In the first embodiment, the registration timing of a reference inspection image serving as a reference is matched with the inspection timing in continuous operation during mass production, and inspection is performed by image recognition including bleed as shown in Fig. 4(d). make a judgment On the other hand, in the second embodiment, the original application amount (shape) is predicted from the diffusion of the bleed, and as shown in FIG. In the third embodiment, the bleed is separated from the paste portion by illumination, and inspection judgment is performed. Hereinafter, each inspection method will be described in detail.

(First embodiment)

The inspection method of the paste-type adhesive agent in 1st Embodiment is demonstrated using FIG.5, FIG.6. 5 is a flowchart for explaining a method of acquiring a reference inspection image. Fig. 6(a) is a view showing a captured image immediately after applying the paste-type adhesive to the surface of the lead frame, and Fig. 6(b) is a captured image after A minute has elapsed from Fig. 6(a). Fig. 6(c) is a diagram showing a captured image in a state in which B minutes have elapsed from Fig. 6(a), and Fig. 6(d) is a binarization of Fig. 6(a). It is a figure which shows an image, FIG.6(e) is a figure which shows the binarized image of FIG.6(b), FIG.6(f) is a figure which shows the binarized image of FIG.6(c) It is a drawing.

As described above, in the first embodiment, the registration timing of the reference inspection image serving as a reference is matched with the inspection timing at the time of mass production, and inspection judgment is performed by image recognition including bleed. In the inspection method described below, a control device included in the die bonder controls a recognition camera or the like as an imaging device, and is performed.

First, the registration (image acquisition) operation at the actual recognition timing will be described.

(Step S1: Acquisition of mass production conditions (recognition timing))

It does not actually apply|coat, but a vain operation (step S11), and the timing (time) from application|coating in the continuous operation|movement at the time of mass production to the external appearance inspection (recognition) imaged with a recognition camera is measured (step S12). As described in FIG. 3 , after the paste-type adhesive PA is applied to the plurality of tabs TB of the lead frame LF, the first applied paste-type adhesive PAS to the last applied paste-type adhesive (PAS) PAE), in the case of sequential visual inspection, the time from each application to the visual inspection is measured. Thereby, the visual inspection timing at the time of mass production is acquired.

(Step S2: Acquisition of a reference inspection image)

In fact, the paste adhesive PA is applied once to the tab TB of the lead frame LF as the first substrate, and settings such as lighting are confirmed (step S21). Measurement of the elapsed time is started simultaneously with application. Wait until the elapsed time measured reaches the time measured in step S12 (actual measurement time) (step S22), that is, use the recognition camera at the actual recognition timing that is the visual inspection timing in mass production to apply paste-type adhesive (PA) A reference inspection image is acquired, stored in a storage device included in the control device, and registered (step S23). For example, when the time measured in step S12 is A minute, the captured image in Fig. 6(b) is registered as a reference inspection image, and when the time measured in step S12 is B minute, in Fig. 6(c) A captured image is registered as a reference inspection image. When the time measured in step S11 is one, one inspection image is acquired, and when the time measured in step S11 is plural, several reference inspection images in each time are acquired. Thereby, the reference inspection image in the visual inspection timing at the time of mass production is acquired.

In mass production, inspection and judgment are performed in continuous operation. After application of the paste-type adhesive PA to the tab TB of the lead frame LF as the second substrate, an image was acquired using a recognition camera in the visual inspection, and the application was performed normally compared to the reference inspection image registered in step S23. determine whether For example, when the time measured in step S12 is A minute by binarizing the captured image of the visual inspection at the time of mass production, the time measured in step S12 is compared with the binarized image shown in FIG. 6(e). In the case of this B minute, it is compared with the binarized image shown in FIG.6(f).

In the first embodiment, since the recognition registration timing takes into account the change in the two-dimensional shape of the paste-type adhesive, it is possible to distinguish the initial application amount and the change with time, and the registration of the reference inspection image and the inspection in the appearance inspection during mass production Correct inspection determination is made possible by matching the conditions of the image acquisition timing. That is, the registration timing of the reference inspection image and the acquisition timing of the inspection image at the time of mass production (continuous operation) are made to match, and the shape change of the apply|coated paste-like adhesive agent is detected. Thereby, stabilization of the determination of the presence or absence of the abnormality of the apply|coated paste adhesive is attained, and correct inspection determination becomes possible. Moreover, it becomes possible to eliminate the difference by an operator by automation of the registration timing of a reference inspection image (apparatus is adapted to mass production conditions), and it becomes possible also to improve an operation rate.

Hereinafter, some representative modifications and other embodiments of the embodiment will be exemplified. In the following description of modified examples and other embodiments, it is assumed that the same reference numerals as in the above-described embodiment can be used for parts having the same configuration and functions as those described in the above-described embodiment. In addition, about the description of such a part, it is assumed that the description in the above-mentioned embodiment can be used suitably within the range which does not contradict technically. In addition, all or part of a part of the above-mentioned embodiment and a plurality of modifications and other embodiments can be appropriately and compoundly applied within a range that is not technically inconsistent.

(1st modification)

You may make it detect the change by time after application|coating of the paste adhesive PA. A method of acquiring a reference inspection image in a modified example (first modified example) of the first embodiment will be described with reference to FIG. 7 . 7 is a flowchart for explaining a method of acquiring a reference inspection image.

After step S2 in FIG. 5 , a reference inspection image of the paste-like adhesive PA applied to the tab TB of the lead frame LF as the first substrate is acquired using a recognition camera, and the reference inspection image is acquired The time is acquired (step S24). Based on the previously acquired reference inspection image and the latest reference inspection image, it is determined whether the diffusion of the bleed is saturated (step S25). Steps S24 and S25 are repeated to obtain a saturation time at which the diffusion of bleed is saturated (step S26).

That is, with the passage of time after application, a reference inspection image is acquired a plurality of times, for example as shown in FIGS. 6A to 6C . With these reference inspection images, confirmation of change over time and confirmation of saturation time are performed. If the inspection is not performed after application but before the device is stopped, a determination is made at the time of resumption of mass production by the time from application to inspection after the restart of the device (herein referred to as device stop time). When the device stop time is within the saturation time, it is determined using the reference inspection image corresponding to the device stop time. When the device stop time is longer than the saturation time, a judgment is made using the reference inspection image corresponding to the saturation time.

(Second embodiment)

The inspection method of the paste-type adhesive agent in 2nd Embodiment is demonstrated using FIGS. 8-11. 8 is a flowchart for explaining registration of the spread of bleed. 9 is a flowchart illustrating an appearance inspection at the time of starting construction. It is a figure explaining prediction of the application amount (shape) of the paste-type adhesive agent immediately after application|coating. Fig. 10(a) is a view showing a captured image immediately after applying a paste-type adhesive to the surface of the lead frame, and Fig. 10(b) is a captured image after A minute has elapsed from Fig. 10(a). FIG. 10(c) is a diagram showing a captured image in a state in which B minutes have elapsed from FIG. 10(a). Fig. 10(d) is a diagram showing a captured image after A minute has elapsed from Fig. 10(a), and Fig. 10(e) is a diagram showing a binarized image of Fig. 10(d). , Fig. 10(f) is a binarized image obtained immediately after application from the binarized image of Fig. 10(d). Fig. 10(g) is a diagram showing a captured image in a state in which B minutes have elapsed from Fig. 10(a), and Fig. 10(h) is a diagram showing a binarized image of Fig. 10(g). , Fig. 10(i) is a binarized image obtained immediately after application from the binarized image of Fig. 10(h). It is a figure explaining an example of the prediction method of a shape.

As described above, in the second embodiment, the original application amount (shape) is predicted from the diffusion of the lead, and the change in the bleed is eliminated to perform the inspection determination. Hereinafter, it demonstrates in detail.

As shown in Fig. 8, by performing a mimicry operation (registration operation), the speed at which the bleed spreads for each variety is investigated and a database is formed. Hereinafter, the mimicking operation will be described.

The lead frame LF as a 1st board|substrate is conveyed to the place where the paste adhesive PA is apply|coated (step S31), and an illumination value is determined (step S32). Next, the paste-like adhesive PA is applied to the tab TB of the lead frame LF as the first substrate, and measurement of the lapse of time is started (step S33). Immediately after application, the paste-type adhesive PA is imaged using a recognition camera to introduce an image and a time stamp is acquired (step S34), and from the captured image, among the area and shape of the area of the paste-type adhesive applied At least one is measured (step S35). Thereafter, steps S34 and S35 are repeated every predetermined time until the bleed diffusion is saturated.

In the continuous operation at the start of construction, as shown in FIG. 9 , the lead frame LF as the second substrate is conveyed to a place where the paste adhesive PA is applied (step S41), and the paste adhesive PA is applied. It applies to the tab TB of the lead frame LF as a 2nd board|substrate (step S42). At the same time as the paste-like adhesive PA is applied, the measurement of the passage of time is started (step S43). After application|coating, the paste-like adhesive PA is imaged using the recognition camera at a predetermined timing, and an image is introduce|transduced and a time stamp is acquired (step S44).

Based on the elapsed time calculated from the time stamp acquired in step S44 and the image acquired at the time of the imitation operation, the area and shape of the area|region of the paste-like adhesive agent PA immediately after application|coating are predicted (step S45). At this time, the image acquired in step S44 is inspected by normal image processing. For example, when the elapsed time from application is A minute, as shown in FIG. Based on the amount of shrinkage, shrinkage treatment is performed, and the area and shape immediately after application are calculated. Thereby, the expected image at the time of application|coating shown in FIG.10(f) is produced|generated, and the application amount at the time of application|coating is estimated and let it be a result. When the elapsed time from application is B minutes, as shown in Fig. 10(h), based on the amount of contraction determined according to the elapsed time acquired by the simulating operation for the image obtained by binarizing the detected application area. Thus, shrinkage treatment is performed to calculate the area and shape immediately after application. Thereby, the expected image at the time of application|coating shown in FIG.10(i) is produced|generated, and the application amount at the time of application|coating is estimated and let it be a result.

As the shape prediction method, simple image expansion processing or image shrinkage processing may be used. The number of contractions or expansions with respect to the elapsed time is determined from the data acquired during the simulating operation. The image expansion processing or image shrinkage processing is performed in 8 directions or 4 directions. As shown in Fig. 11, a starting point is provided at each inflection point (marked ●) of the penlight trajectory of the X mark, and the amount of change per time in the outward direction with respect to the outline indicated by the arrow during the imitation operation is obtained, You may calculate using it in the prediction calculation. An area alone may be sufficient to predict the amount of change.

Inspection and determination are performed based on the area and shape predicted in step S45 and the area and shape in the image immediately after application at the time of the imitation operation (step S45). For example, the inspection is performed by comparing the predicted area or shape of the application area of the paste-like adhesive PA and the application shape serving as a reference during the imitation operation, and the like. The extraction of the area of the application area counts pixels of a specific brightness (extraction from histogram data, etc.) or uses blob detection or the like. For comparison of the shape of the application area, reference data capable of comparing the data after binarization is acquired and maintained by a simulating operation, and the reference data is compared with the data of the expected shape by difference processing or the like.

In the inspection method of the second embodiment, it is assumed that the speed and direction at which the bleed spreads within a certain time after application is confirmed in advance and reproduced according to the determined calculation formula. Therefore, the upper limit time during which the bleed continues to spread uniformly is also measured in advance by the imitation operation, and after the upper limit time has elapsed, a process for invalidating the measurement result is also performed.

In the second embodiment, since bleed advances by a certain amount within a certain period of time, the application state of the paste except for the bleed portion can be confirmed.

(Second Modification)

The inspection method of the paste-type adhesive agent in the modification (2nd modification) of 2nd Embodiment is demonstrated using FIG.8, FIG.12. 12 is a flowchart illustrating an appearance inspection at the time of starting construction.

The inspection method of the paste-type adhesive in the second modification compares the captured image or shape for each elapsed time during the imitation operation with the captured image or shape acquired at the start of mass production. It is similar to steps S41 to S44 at the time of the imitation operation and the start of construction in the second embodiment.

At the time of the imitation operation, a captured image or shape data is held for each elapsed time after application of the paste adhesive PA to the tab TB of the lead frame LF as the first substrate (steps S34 and S35). In the continuous operation at the start of construction, the elapsed time from application of the paste-like adhesive PA to the tab TB of the lead frame LF as the second substrate to the inspection is measured (step S43). From the value of the elapsed time, it is selected which image to compare with during the imitation operation. That is, the image or shape data at the time of the imitation operation corresponding to the elapsed time is acquired (step S45a). Inspection and determination are performed based on the image acquired in step S44 or shape data based thereon and the image or shape data acquired in step S45a (step S46a).

(Third embodiment)

In the second embodiment, the original application amount (shape) is predicted from the diffusion of the bleed, and the change in the bleed is removed to perform inspection judgment. In the third embodiment, the bleed is separated from the paste portion by illumination. The inspection method of the paste-type adhesive agent in 3rd Embodiment is demonstrated using FIG. 13 is a diagram illustrating an imaging device and an illuminating device according to the third embodiment.

As shown in FIG. 2C , since the paste part PST and the bleed BO are three-dimensionally different, the bleed BO is divided into an arm and a paste part PST as a light. Bleed (BO) is darkened on the substrate surface in most cases after application (such as the darkening of concrete after rain). Therefore, when the difference processing is performed between the image before application and the image after application, the bleed BO is always taken as a cancer (negative image). Therefore, if the difference processing is performed in the negative cut-off mode, the bleed (BO) portion can be excluded. However, it cannot be said that the paste part PST becomes a name. This is a characteristic of the liquid level reflection, and when parallel light is irradiated with the incident illumination, the periphery of the paste portion PST may become dark. Therefore, as shown in Fig. 13, it is used in combination with a slanted light (preferably a ring or square type) so that the peripheral portion of the paste portion PST is always bright.

As shown in FIG. 13, the illumination device ID in 3rd Embodiment is equipped with the coaxial illumination CL and the oblique illumination OL which are falling illumination. The coaxial illumination CL includes the illumination LS and the half mirror HM, and irradiates light along the optical axis of the imaging device CAM. The oblique illumination OL irradiates light obliquely with respect to the said optical axis. Since the application area of the paste-type adhesive PA is a liquid level, specular reflection occurs due to illumination, and bright lines and dark portions corresponding to the position of illumination are generated. For example, in the image acquired by the diagonal illumination OL, a bright line appears in the periphery of an application|coating area, and a dark part appears in the center of an application|coating area. This is because the incident direction of illumination is low in the oblique illumination OL. On the other hand, in the image acquired by the coaxial illumination CL, a bright line appears in the center of an application|coating area, and a dark part appears in the periphery of an application|coating area. This is because the incident direction of illumination is high in the coaxial illumination CL. By using the coaxial illumination CL and the diagonal illumination OL together, the dark part can be eliminated.

<Example>

The structure of the die bonder as a die bonding apparatus of an Example is demonstrated using FIGS. 14-16. 14 is a conceptual diagram of the die bonder of the embodiment viewed from above. 15 is a block diagram of an optical system of the die bonder of FIG. 14 . Fig. 16 is a block diagram showing a schematic configuration of a control system of the die bonder of Fig. 14;

The die bonder 10 is largely divided into a wafer supply unit 1 , a work supply/transport unit 2 , and a die bonding unit 3 .

The wafer supply unit 1 includes a wafer cassette lifter 11 and a pickup device 12 . The wafer cassette lifter 11 has a wafer cassette (not shown) filled with the wafer ring 16 , and sequentially supplies the wafer ring 16 to the pickup device 12 . The pickup device 12 moves the wafer ring 16 to push up the die D so that the desired die D can be picked up from the wafer ring 16 .

The work supply/conveyance unit 2 has a stack loader 21 , a frame feeder 22 , and an unloader 23 , and conveys the lead frame LF (refer to FIG. 15 ) in the direction of the arrow. The stack loader 21 supplies the lead frame LF for bonding the die D to the frame feeder 22 . The frame feeder 22 conveys the lead frame LF to the unloader 23 via two processing positions on the frame feeder 22 . The unloader 23 stores the conveyed lead frame LF.

The die bonding portion 3 has a preform portion (paste application unit) 31 and a bonding head portion 32 . The preform part 31 applies the paste adhesive PA, such as an epoxy resin, with the syringe 36 (refer FIG. 15) to the lead frame LF conveyed by the frame feeder 22. As shown in FIG. The syringe 36 has a paste-type adhesive PA sealed therein, and the paste-type adhesive PA is extruded from the nozzle tip to the lead frame LF by air pressure to be applied. When the lead frame LF is, for example, a multiple lead frame in which a plurality of unit lead frames are arranged in a horizontal line and continuously installed in series, a paste-type adhesive PA is applied to each tab of the unit lead frame. Here, the lead frame LF is subjected to pear shell pattern processing. The bonding head portion 32 picks up the die D from the pickup device 12 and raises it, and moves the die D to a bonding point on the frame feeder 22 . Then, the bonding head part 32 lowers the die D at the bonding point, and bonds the die D on the lead frame LF to which the paste-type adhesive PA is applied.

The bonding head part 32 raises and lowers the bonding head 35 in the Z-axis direction (height direction), and a ZY drive shaft 60 that moves in the Y-axis direction, and an X drive shaft 70 that moves in the X-axis direction. have The ZY drive shaft 60 is a Y-axis direction indicated by an arrow C, that is, a Y drive shaft 40 for reciprocating the bonding head 35 between a pickup position in the pickup device 12 and a bonding point, and the die D to the wafer. It has a Z drive shaft (50) that is lifted from (14) or lifted for bonding to a lead frame (LF). The X drive shaft 70 moves the ZY drive shaft 60 as a whole in the X direction which is the direction in which the lead frame LF is conveyed.

As shown in FIG. 15 , the optical system 88 includes an adhesive recognition camera 33 serving as an imaging device that grasps the application position of the syringe 36 and the like, and a lead frame LF to which the bonding head 35 has been transported. It has a substrate recognition camera 34 for grasping a bonding position to be bonded to, and a wafer recognition camera 15 for grasping a pickup position of a die D that the bonding head 35 picks up from the wafer 14 . Each recognition camera captures an image using a lighting device that illuminates the object. The die D diced in a mesh shape on the wafer 14 is being fixed to a dicing tape 17 fixed to the wafer ring 16 .

With this configuration, the paste-like adhesive PA is applied at the correct position by the syringe 36, the die D is reliably picked up by the bonding head 35, and the lead frame LF is placed at the correct position. are bonded

As shown in FIG. 16 , the control system 80 includes a control device 8 , a drive unit 86 , a signal unit 87 , and an optical system 88 . The control device 8 is largely divided into a control/arithmetic device 81 mainly composed of a CPU (Central Processor Unit), a storage device 82 , an input/output device 83 , a bus line 84 , and , a power supply unit 85 . The storage device 82 includes a main storage device 82a composed of RAM storing a processing program and the like, and an auxiliary storage unit 82b composed of an HDD storing control data, image data, etc. necessary for control. has The input/output device 83 includes a monitor 83a for displaying device status and information, a touch panel 83b for inputting instructions from an operator, a mouse 83c for operating the monitor, and an optical system 88 . It has an image introducing device 83d for introducing image data. In addition, the input/output device 83 includes a motor control device 83e that controls a driving unit 86 such as an XY table (not shown) of the wafer supply unit 1 and a ZY drive shaft of the bonding head table, and various sensor signals. An I/O signal control device 83f for introducing or controlling signals from a signal unit 87 such as a switch such as a lighting device or the like is provided. The optical system 88 includes a wafer recognition camera 15 , an adhesive recognition camera 33 , and a substrate recognition camera 34 . The control/arithmetic unit 81 introduces and calculates necessary data via the bus line 84, and transmits information to the control of the bonding head 35 and the like, the monitor 83a, and the like.

The control device 8 stores the image data captured by the optical system 88 in the storage device 82 via the image introduction device 83d. Positioning of the die D and the lead frame LF using the control/arithmetic device 81 by software programmed based on the saved image data, inspection of the application pattern of the paste-type adhesive PA, and The surface inspection of the die D and the lead frame LF is performed. Based on the positions of the die D and the lead frame LF calculated by the control/arithmetic unit 81, the driving unit 86 is moved via the motor control unit 83e by software. By this process, the positioning of the die D on the wafer 14 is performed, and the die D is bonded onto the lead frame LF by operating as the driving units of the wafer supply unit 1 and the die bonding unit 3 . . The recognition camera used in the optical system 88 is gray scale, color, etc., and quantifies the light intensity.

Next, a method of manufacturing a semiconductor device using the die bonder according to the embodiment will be described with reference to FIG. 17 . 17 is a flowchart showing a method of manufacturing a semiconductor device.

(Step S51: wafer/substrate loading process)

The wafer ring 16 holding the dicing tape 17 to which the die D divided from the wafer 14 is affixed is stored in a wafer cassette (not shown), and loaded into the die bonder 10 . The control device 8 supplies the wafer ring 16 to the wafer supply unit 1 from a wafer cassette filled with the wafer ring 16 . Further, the lead frame LF is prepared and loaded into the die bonder 10 . The control device 8 supplies the lead frame LF from the stack loader 21 to the frame feeder 22 .

(Step S52: Pickup process)

The control device 8 moves the wafer ring 16 to the pickup device 12 so that the desired die D can be picked up from the wafer ring 16 so as to push up the die D, and peel off. The formed die D is picked up from the wafer 14 by the bonding head 35 .

(Step S53: bonding process)

The control apparatus 8 acquires the image of the surface of the lead frame LF before application|coating with the adhesive agent recognition camera 33, and confirms the surface to which the paste-type adhesive agent PA should be apply|coated. If there is no problem with the surface to be applied, the control device 8 applies the paste-like adhesive PA from the syringe 36 to the lead frame LF conveyed by the frame feeder 22 . When the lead frame LF is a multiple lead frame, a paste-type adhesive PA is applied to all tabs. The control device 8 determines whether or not the paste-like adhesive PA has been accurately applied after application by the adhesive recognition camera 33 by which inspection method of the first embodiment, the second embodiment and the third embodiment, and their modifications. ), and inspect the applied paste-type adhesive (PA). If there is no problem in the application, the control device 8 bonds the die D picked up by the bonding head 35 to the lead frame LF to which the paste-type adhesive PA is applied.

(Step S54: Substrate unloading process)

The control device 8 supplies the lead frame LF to which the die D is bonded by the frame feeder 22 to the unloader 23 . The lead frame LF is taken out from the die bonder 10 .

As mentioned above, although the invention made|formed by the present inventors was specifically demonstrated based on embodiment, a modification, and an Example, this invention is not limited to the said embodiment, a modification, and an Example, It goes without saying that various changes are possible. no need

For example, in Embodiment 1, although the example in which it does not apply|coat actually in step S11 and the example which operates in vain was demonstrated, you may apply|coat actually in step S11.

Further, in the second embodiment, an example has been described in which the speed at which the bleed spreads for each type is investigated and converted into a database by performing a mimicry operation (registration operation). A recognition camera may be installed, and the speed at which the bleed spreads for each type may be calculated from the inspection image of the paste shape applied to the lead frame passing through and the conveyance speed of the lead frame, and the database may be formed. In addition, since the situation during mass production can be continuously checked, automatic correction of the database and detection of abnormalities or change points in paste application using data deviation can also be performed.

Further, in the embodiment, an example has been described in which the die D picked up from the wafer 14 by the bonding head 35 is bonded to the lead frame LF, but between the wafer 14 and the lead frame LF is described. An intermediate stage is provided, the die D picked up from the wafer 14 by the pickup head is placed on the intermediate stage, and the die D is picked up again from the intermediate stage by the bonding head 35, and the lead frame has been conveyed You may make it bond to (LF).

8: control unit
10: die bonder (die bonding device)
33: adhesive recognition camera (imaging device)
35: bonding head
D: die
LF: lead frame (substrate)
PA: paste adhesive

Claims (4)

an imaging device for imaging the paste-like adhesive applied on the substrate;
a stream lighting device for irradiating light from an oblique direction to the paste-type adhesive;
And a falling lighting device for irradiating light from an upward direction to the paste-type adhesive;
a bonding head for mounting a die on the substrate to which the paste-type adhesive is applied;
A control device that inspects the appearance based on the image of the paste-like adhesive captured by the imaging device.
to provide
The control device is
A first image is obtained by imaging the substrate on which the paste-type adhesive is not applied,
A second image is obtained by illuminating the substrate to which the paste-type adhesive is applied by both the diagonal lighting device and the sub-illuminating device and capturing an image;
difference processing is performed on the second image from the first image to calculate difference data;
Obtaining inspection data by excluding negative numbers from the difference data,
and perform an appearance inspection based on the inspection data. The method of claim 1,
a wafer ring holder for holding the dicing tape to which the die is affixed;
Syringe for applying the paste-type adhesive on the substrate
Further comprising, a die bonding device. an imaging device for imaging the paste-type adhesive applied on a substrate; a diagonal illumination device for irradiating light to the paste-type adhesive from an oblique direction; and a bonding head for mounting a die on the substrate on which the paste-type adhesive has been applied; a step of loading a substrate into a die bonding apparatus provided with a control device for performing an appearance inspection based on the image of the paste-like adhesive captured by the imaging device;
applying the paste-type adhesive on the substrate;
A first image is obtained by imaging the substrate to which the paste-type adhesive is not applied, and a second image is obtained by imaging the substrate to which the paste-type adhesive has been applied, and from the first image to A step of calculating difference data by performing a difference processing, obtaining inspection data by excluding negative numbers from the difference data, and performing an appearance inspection based on the inspection data
A method of manufacturing a semiconductor device comprising a. 4. The method of claim 3,
a step of carrying in a wafer ring holder holding the dicing tape to which the die is affixed;
picking up the die from the dicing tape;
The process of loading the picked-up die on the substrate
Further comprising a method of manufacturing a semiconductor device.

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