KR102584543B1 - Lighting module and lighting apparatus - Google Patents

Abstract

The lighting module disclosed in the embodiment includes a circuit board; a first light emitting unit having a plurality of first light emitting elements arranged on a first area of the circuit board; a second light emitting unit having a plurality of second light emitting elements arranged on a second area of the circuit board; a first resin layer disposed on the circuit board and sealing the first and second light emitting devices; and a housing including a lower cover covering a side of the first resin layer along an edge of the circuit board and an upper cover disposed on the first and second light emitting units, wherein the upper cover of the housing includes the The first resin layer has an opening that is open, the first and second light emitting elements face each other and are spaced apart by more than 1/2 of the width of the first resin layer, and the opening of the housing opens the first and second light emitting elements. It may have a width smaller than the gap between the light emitting parts.

Description

Lighting module and lighting device having the same {LIGHTING MODULE AND LIGHTING APPARATUS}

The embodiment relates to a lighting module having a light emitting device.

The embodiment relates to a lighting module having a light emitting device and a plurality of resin layers.

Embodiments relate to a lighting module that provides an area light source through a housing.

The embodiment relates to a light unit or vehicle lamp with a lighting module.

Typical lighting applications include backlights for displays and signage, as well as automotive lights.

Light-emitting devices, such as light-emitting diodes (LEDs), have advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness compared to existing light sources such as fluorescent lamps and incandescent lamps. These light emitting diodes are applied to various lighting devices such as various display devices, indoor lights, or outdoor lights.

Recently, lamps employing light-emitting diodes have been proposed as light sources for vehicles. Compared to incandescent lamps, light emitting diodes have an advantage in that they consume less power. However, because the emission angle of light emitted from a light emitting diode is small, when a light emitting diode is used as a vehicle lamp, there is a need to increase the light emitting area of the lamp using the light emitting diode.

Because light emitting diodes are small in size, they can increase the design freedom of lamps and are economical due to their semi-permanent lifespan.

Embodiments of the invention provide a lighting module that provides a surface light source.

An embodiment of the invention provides a lighting module in which a plurality of resin layers covering a plurality of light emitting devices and a housing having an opening are disposed on top of the resin layers.

An embodiment of the invention provides a lighting module in which a housing is disposed on light emitting elements that have openings and are spaced apart from each other.

An embodiment of the invention provides a lighting module that covers the upper perimeter and side of the resin layer covering the light emitting device.

Embodiments of the invention provide a flexible lighting module.

An embodiment of the invention provides a lighting module that irradiates a surface light source and a lighting device having the same.

Embodiments may provide a light unit, a liquid crystal display, or a vehicle lamp having a lighting module.

The lighting module according to the embodiment includes a circuit board; a first light emitting unit having a plurality of first light emitting elements arranged on a first area of the circuit board; a second light emitting unit having a plurality of second light emitting elements arranged on a second area of the circuit board; a first resin layer disposed on the circuit board and sealing the first and second light emitting devices; and a housing including a lower cover covering a side of the first resin layer along an edge of the circuit board and an upper cover disposed on the first and second light emitting units, wherein the upper cover of the housing includes the The first resin layer has an opening that is open, the first and second light emitting elements face each other and are spaced apart by more than 1/2 of the width of the first resin layer, and the opening of the housing opens the first and second light emitting elements. It may have a width smaller than the gap between the light emitting parts.

According to an embodiment of the invention, it may include a second resin layer disposed on the first resin layer and having a diffusion agent exposed to the opening.

According to an embodiment of the invention, the second resin layer may protrude further than the upper part of the housing.

According to an embodiment of the invention, it is disposed on the opening of the housing and may include a third resin layer having a phosphor or a phosphor and ink.

According to an embodiment of the invention, it is disposed on the second resin layer and includes a third resin layer having a phosphor or a phosphor and ink, and the top surface width or top area of the third resin layer is the top surface of the second resin layer. It may be equal to the width or top area.

According to an embodiment of the invention, it is disposed on the second resin layer and includes a third resin layer having a phosphor or a phosphor and ink, the second resin layer protrudes through the opening, and the third resin layer is It is disposed on the top and side surfaces of the second resin layer and may be in contact with the first resin layer.

According to an embodiment of the invention, the inner surface of the housing includes a curved or inclined surface, and a side surface of the second resin layer may be in contact with the inner surface of the housing.

According to an embodiment of the invention, the first and second light emitting devices may be disposed closer to the opening than the lower cover of the housing.

According to an embodiment of the invention, the lower cover of the housing covers all sides of the first resin layer and may be fixed to the upper surface of the circuit board.

According to an embodiment of the invention, the first and second light emitting devices emit blue light, and the phosphor may include at least one of red, green, blue, yellow, and purple phosphors.

According to an embodiment, light uniformity of a surface light source in a lighting module can be improved.

According to an embodiment, the uniformity of the planar light source can be improved by diffusing the light traveling from the lighting module.

According to an embodiment, uniformity of light may be improved by disposing a layer having at least one of a phosphor and an ink having the same color as the color of the phosphor on the surface of the lighting module.

According to an embodiment, hot spots can be reduced by housing on each light-emitting element in the lighting module.

According to an embodiment, there is an effect of preventing hot spots in the emission area by arranging a housing with only the emission area open on the upper part of the lighting module.

According to an embodiment, a flexible lighting module can be implemented by stacking a plurality of diffusion layers made of resin material.

The embodiment can improve the light efficiency and light distribution characteristics of the lighting module.

The optical reliability of the lighting module according to the embodiment and the lighting device having the same can be improved.

The reliability of a vehicle lighting device having a lighting module according to an embodiment can be improved.

Embodiments may be applied to backlight units with lighting modules, various display devices, surface light source lighting devices, or vehicle lamps.

1 is a plan view showing a lighting module according to a first embodiment.
Figure 2 is an example of a cross-sectional view on the AA side of the lighting module of Figure 1.
Figure 3 is another example of the lighting module of Figure 2.
Figure 4 is a diagram showing a first modified example of the lighting module of Figure 2.
Figure 5 is a diagram showing a second modified example of the lighting module of Figure 2.
Figure 6 is a diagram showing a third modified example of the lighting module of Figure 2.
Figure 7 is a diagram showing a fourth modified example of the lighting module of Figure 2.
Figure 8 is a diagram showing a fifth modified example of the lighting module of Figure 2.
Figure 9 is an example of a side cross-sectional view of a lighting module according to the second embodiment.
Figures 10 and 11 are modified examples of the lighting module of Figure 9.
Figure 12 is an example of a side cross-sectional view of a lighting module according to a third embodiment.
Figures 13 to 15 are modified examples of the side cross-sectional view of the lighting module of Figure 12.
Figure 16 is an example of a side cross-sectional view of a lighting module according to the fourth embodiment.
FIGS. 17 and 18 are modified examples of the side cross-sectional view of the lighting module of FIG. 16.
Figure 19 is an example of a side cross-sectional view of a lighting module according to the fifth embodiment.
Figures 20 and 21 are modified examples of the lighting module of Figure 20.
22 is a modified example of a housing covering a lighting module according to embodiment(s) of the invention.
Figure 23 is another example of the housing of Figure 22.
Figure 24 is an example of a reflective layer disposed on the inner surface of the housing of Figure 22.
Figure 25 is an example of a reflective structure of the housing of Figure 23.
26 is an example of a phosphor layer according to embodiment(s) of the invention.
Figure 27 is an example of a phosphor layer having a phosphor and ink according to the embodiment(s) of the invention.
Figures 28 and 29 are examples of light emitting devices according to embodiments of the invention.
30 is a plan view of a vehicle to which a lamp having a lighting module according to an embodiment is applied.
31 is a diagram showing a lamp having a lighting module or lighting device according to an embodiment.

Hereinafter, with reference to the attached drawings, preferred embodiments that allow those skilled in the art to easily practice the present invention will be described in detail. However, it should be understood that the embodiments described in this specification and the configurations shown in the drawings are only preferred embodiments of the present invention, and that there may be various equivalents and modifications that can replace them at the time of filing the present application.

In explaining in detail the operating principle of a preferred embodiment of the present invention, if a detailed description of a related known function or configuration is judged to unnecessarily obscure the gist of the present invention, the detailed description will be omitted. The terms described below are terms defined in consideration of their functions in the present invention, and the meaning of each term should be interpreted based on the content throughout the present specification. The same reference numerals are used for parts with similar functions and actions throughout the drawings.

The lighting device according to the present invention can be applied to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, head lamps, side lights, side mirror lights, fog lights, tail lamps, brake lights, daytime running lights, vehicle interior lights, door scars, rear combination lamps, backup lamps Applicable to etc. The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various electric train fields. In addition, it can be applied to all lighting-related fields or advertising-related fields that are currently developed and commercialized or can be implemented in the future according to technological development. It will be said that it is.

Hereinafter, embodiments will be clearly revealed through the accompanying drawings and descriptions of the embodiments. In the description of the embodiments, each layer (film), region, pattern or structure is formed “on” or “under” the substrate, each layer (film), region, pad or pattern. In the case where it is described, “on” and “under” include both being formed “directly” or “indirectly” through another layer. Additionally, the standards for the top or bottom of each floor are explained based on the drawing.

<First embodiment>

FIG. 1 is a plan view showing a lighting module according to a first embodiment, and FIG. 2 is an example of a cross-sectional view taken along the line A-A of the lighting module of FIG. 1.

Referring to Figures 1 and 2, the lighting module 100 includes a circuit board 11, light emitting elements 21 and 23 disposed on the circuit board 11, and the light emitting device on the circuit board 11. It may include a first resin layer 41 covering the elements 21 and 23, and a member having one or more layers on the first resin layer 41. The layer disposed on the first resin layer 41 may include at least one or two of a layer containing a phosphor, a layer containing colored powder or ink, and a layer containing a diffusion agent. Alternatively, a layer containing at least one or two of a phosphor, a colored powder ink, and a diffusion agent may be disposed on the first resin layer 41. The first embodiment of the invention will be described as an example in which the second resin layer 51 having a diffusion agent is disposed on the first resin layer 41.

The lighting module 100 may emit light emitted from the light emitting elements 21 and 23 as a planar light source. The lighting module 100 may include a reflective member disposed on the circuit board 11 . In the lighting module 100, a plurality of light emitting elements 21 and 23 may be arranged in N columns (N is an integer of 1 or more). The plurality of light emitting devices 21 and 23 may be arranged in N columns and M rows (N, M are integers of 1 or more) as shown in FIG. 1, and M>N may be satisfied.

The lighting module 100 can be applied to various lamp devices that require lighting, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, in the case of lighting modules applied to vehicle lamps, head lamps, side lights, side mirror lights, fog lights, tail lamps, turn signal lamps, back up lamps, and stop lamps. ), daytime running lights, vehicle interior lighting, door scarf, rear combination lamp, backup lamp, etc.

The circuit board 11 may include a printed circuit board (PCB). The circuit board 11 may include, for example, a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 board. The circuit board 11 may include, for example, a flexible PCB.

The circuit board 11 includes a wiring layer (not shown) on the top, and the wiring layer can be electrically connected to the light emitting devices 21 and 23. When the light emitting elements 21 and 23 are arranged in plurality on the circuit board 11, the plurality of light emitting elements 21 and 23 may be connected in series, parallel, or series-parallel by the wiring layer, There is no limitation to this. The circuit board 11 may function as a base member or support member located below the light emitting elements 21 and 23 and at least the first and second resin layers 41 and 51.

The length in the X direction and the length in the Y direction of the circuit board 11 may be the same or different from each other. For example, the length in the The thickness of the circuit board 11 may be 0.5 mm or less, for example, in the range of 0.3 mm to 0.5 mm. Since the circuit board 11 is provided with a thin thickness, the thickness of the lighting module may not be increased. The circuit board 11 includes at least one row of first light emitting elements 21 in a first area, and at least a second light emitting element 23 in a second area facing the first light emitting elements 21. It can be arranged in one column. A row of the first light emitting elements 21 may be defined as a first light emitting unit, and a row containing the second light emitting elements 23 may be defined as a second light emitting unit.

When each of the light emitting devices 21 and 23 is arranged in an N×M matrix on the circuit board 11, N may be one or two or more columns, and M may be one or two or more columns. The N and M are integers of 1 or more. The light emitting elements 21 and 23 may be arranged in the Y-axis and X-axis directions, respectively.

The thickness of the lighting module 100 is the distance from the lower surface of the circuit board 11 to the surface from which light is emitted, and may be 5.5 mm or less, for example, in the range of 4.5 mm to 5.5 mm or in the range of 4.5 mm to 5 mm. . The layer 51 having the surface from which the light is emitted may be a layer containing a phosphor, a layer containing a diffusion agent, or a layer containing ink. The thickness of the lighting module 100 may be the straight line distance between the lower surface of the circuit board 11 and the upper surface of the second resin layer 51. The thickness of the lighting module 100 may be 220% or less of the thickness of the first resin layer 41, for example, in the range of 180% to 220%. If the thickness of the lighting module 100 is thinner than the above range, the light diffusion space may be reduced and a hot spot may be generated, and if the thickness is greater than the above range, spatial installation restrictions and design freedom may be reduced due to the module thickness. The embodiment provides a thickness of the lighting module 100 of 5.5 mm or less, for example, 5 mm or less, thereby enabling a curved structure, thereby reducing design freedom and spatial constraints.

The circuit board 11 may have a connector in a portion to supply power to the light emitting elements 21 and 23. The area of the circuit board 11 where the connector is placed is an area where the first resin layer 41 is not formed, and may be equal to or smaller than the length of the circuit board 11 in the Y direction. If the connector is placed on the bottom of the circuit board 11, this area can be removed. The circuit board 11 may have a top view shape of a rectangle, a square, or another polygonal shape, or may have a curved bar shape.

The circuit board 11 may include a member having a protective layer or a reflective layer on the top. The protective layer or reflective layer may include a member made of a solder resist material, and the solder resist material is a white material and can reflect incident light.

The light emitting devices 21 and 23 may be disposed on the circuit board 11 and sealed by the first resin layer 41. The light emitting devices 21 and 23 emit light through the first resin layer 41. The light emitting devices 21 and 23 have a top surface and multiple side surfaces, and the top surface faces the top surface of the first resin layer 41 and emits light. The top and side surfaces of the light emitting elements 21 and 23 emit light. These light-emitting devices 21 and 23 are LED chips that emit light on at least five sides, and may be arranged on the circuit board 11 in the form of a flip chip. The light emitting elements 21 and 23 may be formed to have a thickness of 0.3 mm or less. As another example, the light emitting elements 21 and 23 may be implemented as horizontal chips or vertical chips. In this case, the horizontal chips or vertical chips are connected to other chips or wiring patterns with wires, Due to the height of the wire, the thickness of the second resin layer 51 may be increased, and a connection space depending on the length of the wire is required, so the distance between the light emitting elements 21 and 23 may be increased. The light emitting devices 21 and 23 according to the embodiment may emit light from five sides, thereby increasing the beam angle distribution. As another example, the light emitting devices 21 and 23 may include a package having an LED chip or a side view type package.

The gap (a) in the first direction between the light emitting devices 21 and 23 may be greater than the thickness (c, c<a) of the first resin layer 41. The spacing (a) may range from 4 mm or more, for example, 4 mm to 8 mm, and may vary depending on the LED chip size. The spacing (a) in the first direction between the light emitting devices 21 and 23 may be smaller than the spacing in the second direction. The first direction spacing (a) between the light emitting elements 21 and 23 or the spacing (a) between the first and second light emitting units may be more than 1/2 of the width of the first resin layer 41. Accordingly, a decrease in the light emission area on the opening 75 can be minimized.

It can be seen that the light emitting devices 21 and 23 disclosed in the embodiment are provided as flip chips that emit light on at least five sides, thereby further improving the luminance distribution and beam angle distribution. The light emitting devices 21 and 23 include a first light emitting device 21 disposed along a first area adjacent to the first side of the first resin layer 41, and a second light emitting device 21 of the first resin layer 41. It may include a second light emitting element 23 disposed along the second area adjacent to the side. The first light emitting devices 21 may be arranged in at least one row or in a second direction perpendicular to the first direction. The first light emitting devices 21 may be spaced at the same distance from the first side of the first resin layer 41, or at least one first light emitting device 21 may be arranged at a different interval from other first light emitting devices. there is. The second light emitting elements 23 may be arranged in at least one row or in a second direction. The second light-emitting devices 23 may be spaced equally from the second side of the first resin layer 41, or at least one second light-emitting device 23 may be arranged at a different interval from the other second light-emitting devices. there is. The plurality of first light emitting devices 21 may be connected in series or in parallel and driven. The plurality of second light emitting devices 23 may be connected in series or connected in parallel and driven. The first and second light emitting devices 21 and 23 may be electrically connected.

The first and second light emitting elements 21 and 23 may be arranged to face each other or may be arranged to be offset from each other. The light emitted from the first and second light emitting devices 21 and 23 may be guided through the first resin layer 41 and diffused by the second resin layer 51.

The first and second light emitting devices (21, 23) suppress the occurrence of dark portions due to the gap (a) between the first directions and each of the first and second light emitting devices (21, 23) generate hot spots in the third direction. The occurrence of can be suppressed.

The light emitting devices 21 and 23 are light emitting diode (LED) chips and can emit at least one of blue, red, green, ultraviolet (UV), and infrared rays. The light emitting elements 21 and 23 may emit, for example, blue, red, or blue and red. The light emitting devices 21 and 23 may be sealed on the surface with a transparent insulating layer or a resin layer, but are not limited thereto. The light emitting devices 21 and 23 may have a phosphor layer 125 formed on the surface of the light emitting devices 21 and 23, as shown in FIG. 29. The light emitting devices 21 and 23 may optionally include a compound semiconductor layer of group II to VI elements, for example, a compound semiconductor layer of group III-V elements or a compound semiconductor layer of group II-VI elements.

The light emitting elements 21 and 23 may have a support member having a ceramic support member or a metal plate disposed at the bottom, and the support member may be used as an electrically conductive and heat conductive member.

Referring to FIGS. 2 and 29, as an example of a lighting module, a phosphor layer (125 in FIG. 29) is disposed on the first and second light emitting devices 21 and 23, and the first resin layer 41 The second resin layer 51 disposed thereon may be a layer containing a dispersant and/or powder ink. The phosphor layer (125 in FIG. 29) may be at least one of blue, green, yellow, purple, and red phosphors. When the LED chips of the first and second light emitting devices 21 and 23 emit blue light and the phosphor layer 125 has red or/and yellow phosphors, the first and second light emitting devices 21 and 23 emit blue light. The light emitted from ,23) may be red or/and yellow light. That is, the lighting module converts the wavelength of light emitted from the LED chips of the first and second light emitting devices 21 and 23 and emits the light, and for example, can emit a peak wavelength of the same color as the phosphor layer 125. there is. As another example, when the LED chip is the target light, the phosphor layer can be removed.

The phosphor layer according to an embodiment of the invention may be disposed on the LED chips of the light emitting devices 21 and 23 or may be disposed on the path of light. The phosphor may include at least one of blue phosphor, green phosphor, red phosphor, purple phosphor, or yellow phosphor. The size of the phosphor may range from 1 ㎛ to 100 ㎛. The higher the density of the phosphor, the higher the wavelength conversion efficiency, but since the luminous intensity may decrease, it can be added within the above size taking light efficiency into consideration.

The second resin layer 51 according to an embodiment of the invention may be disposed on the path of light emitted from the light emitting devices 21 and 23. The second resin layer 51 may include a transparent resin material such as silicone or epoxy, or a plastic material. The diffusion agent added to the second resin layer 51 may include at least one of PMMA (Poly Methyl Meth Acrylate) series, TiO ₂ , SiO ₂ , Al ₂ O ₃ , and silicon series. The diffuser has a refractive index in the range of 1.4 to 2 at the emission wavelength, and its size may be in the range of 1 ㎛ to 100 ㎛. Here, the dispersing agent may be added in the range of 1.5 wt% to 2.5 wt% based on the amount of the second resin layer 51 during the process. The second resin layer 51 may be made of a transparent resin material, such as UV (Ultra violet) resin, epoxy, or silicone.

For example, the UV resin may use a resin (oligomer type) whose main material is urethane acrylate oligomer. For example, urethane acrylate oligomer, a synthetic oligomer, can be used. The main material may further include monomers mixed with low boiling point diluted reactive monomers such as IBOA (isobornyl acrylate), HBA (Hydroxybutyl Acrylate), and HEMA (Hydroxy Metaethyl Acrylate), and a photoinitiator (such as 1-hydroxycyclohexyl) as an additive. Phenyl-ketone, Diphenyl), Diphwnyl (2,4,6-trimethylbenzoyl phosphine oxide), etc. or antioxidants can be mixed. The UV resin may be formed of a composition containing 10 to 21% of oligomers, 30 to 63% of monomers, and 1.5 to 6% of additives. In this case, the monomer may be composed of a mixture of 10 to 21% isobornyl acrylate (IBOA), 10 to 21% hydroxybutyl acrylate (HBA), and 10 to 21% hydroxy metaethyl acrylate (HEMA). The additive can perform the function of initiating photoreactivity by adding 1-5% of a photoinitiator, and can be formed into a mixture that can improve the yellowing phenomenon by adding 0.5-1% of an antioxidant. The formation of the first resin layer 41 using the above-described composition allows the refractive index and thickness to be adjusted by forming a layer with a resin such as UV resin instead of a light guide plate, and at the same time, adhesive properties and reliability are achieved by using the above-described composition. and mass production speed can all be met.

The dispersing agent may have a spherical shape, but is not limited thereto. Here, if the light loss due to the second resin layer 51 is large or the light distribution is uniform without the second resin layer, the second resin layer can be removed.

The amount of diffusion agent added to the second resin layer 51 may be smaller than the amount of phosphor added to the phosphor layer. That is, the phosphor layer has a high density of phosphors to ensure high wavelength conversion efficiency, and a diffusion agent may be added to the second resin layer 51 to improve light uniformity while minimizing the decrease in luminous intensity.

One or more layers disposed on the first resin layer 41 may include a resin material. The plurality of layers may have the same refractive index, or at least two layers may have the same refractive index, or the layers adjacent to the uppermost layer may have gradually lower or higher refractive indices.

The housing 71 may be part of the lighting module 100 or may be a separate component. The housing 71 may include a lower cover 72 that covers the side surface of the first resin layer 41, and an upper or upper cover 73 having an opening 75. The lower cover 72 may overlap the first resin layer 41 in the horizontal direction. The lower cover 72 of the housing 71 overlaps the first resin layer 41 in the first and second directions and can reflect light leaking through the side of the first resin layer 41. there is. The lower cover 72 of the housing 71 may be disposed on the upper surface of the circuit board 11. The lower cover 72 of the housing 71 may be placed on the upper edge of the circuit board 11. The lower cover 72 of the housing 71 may overlap the upper surface of the circuit board 11 in a vertical direction. The upper cover 73 of the housing 71 covers the upper area of the first resin layer 41 excluding the opening 75.

The upper cover 73 of the housing 71 may be extended or bent from the lower cover 72 toward the opening 75. The upper cover 73 of the housing 71 may be disposed on the first light emitting device 21 and the second light emitting device 23. The upper cover 73 of the housing 71 may be disposed on the first and second light emitting units.

The upper cover 73 of the housing 71 may overlap the first light-emitting device 21 and the second light-emitting device 23 in a vertical direction, so that the first and second light-emitting devices 21 and 23 Hot spots on the surface can be prevented. The width (g) of the upper cover 73 of the housing 71 may be wider than the distance (b) between the light emitting devices 21 and 23 from the outer side of the first resin layer 41. The thickness d of the upper cover 73 of the housing 71 may be 0.5 mm or more, for example, in the range of 0.5 to 2 mm, thereby preventing the top from coming off.

The upper cover 73 of the housing 71 may be bent in a direction perpendicular to the lower cover 72 of the housing 71, or may be inclined or extended with a curved surface, as will be described later.

The lower cover 72 of the housing 71 or the first and second sides of the first resin layer 41 may be spaced apart from the first and second light emitting devices 21 and 23 by a predetermined distance b. there is. The separation distance (b) may be 1.2 times or more, for example, 1.2 to 4 times the width of the light emitting elements 21 and 23. The separation distance (b) may be 1 mm or more, for example, in the range of 1 to 4 mm. If it is smaller than the above range, light loss may increase, and if it is larger than the above range, the module size may increase. The thickness of the first resin layer 41 or the height (c) of the lower cover 72 of the housing 71 may be equal to or greater than the separation distance (b), and may be 2 mm or more, for example, in the range of 2 mm to 4 mm. there is. The height (c) of the lower cover 72 of the housing 71 may be greater than the thickness (t) of the light-emitting elements (21 and 23), for example, the thickness (t) of the light-emitting elements (21 and 23). It may range from 3 to 10 times. Since the housing 71 is arranged to surround the side and upper periphery of the first resin layer 41, light loss in the lateral direction can be reduced and light can be condensed and emitted in the direction of the opening 75. The housing 71 may include a reflective material or a material that blocks light. The housing 71 may include at least one of plastic materials such as PC, PP, ABS, PBT, and PET. As another example, the housing 71 may include at least one of metal materials such as aluminum, silver, and copper.

The housing 71 may be coupled to a lighting module having the first resin layer 41 and the second resin layer 51. The lower cover 72 of the housing 71 may be coupled to the circuit board 11 with an adhesive, adhesive, or screw fastening member. The inner surfaces of the lower cover 72 and the upper cover 73 of the housing 71 may be bonded to the first resin layer 41 with an adhesive. Alternatively, the housing 71 and the first resin layer 41 may be disposed with a predetermined air gap. The coupling between the housing 71 and the first resin layer 41 may be fastened with a separate screw fastening member.

As another example, as shown in FIG. 3, the bottom extension 74 of the housing 71 may be placed against the circuit board 11. The bottom extension 74 may be fastened to the circuit board 11 using a fastening member such as a screw, or may be adhered to the circuit board 11 using an adhesive. Accordingly, a non-contact area may be included between the surface of the first resin layer 41 and the inner surface of the housing 71.

In an embodiment of the invention, the housing 71 is coupled to the circuit board 11, so that the lighting module can be easily separated and combined. In addition, by moving or fixing the lighting module using the housing 71, the combining process of the lighting module is convenient. Additionally, the work process through the housing 71 may be convenient.

The width f of the opening 75 of the housing 71 may be equal to or smaller than the distance a between the first and second light emitting elements 21 and 23 in the first direction. The width f of the opening 75 may be 4 mm or more, for example, in the range of 4 to 8 mm. The length of the opening 75 in the second direction may be equal to or longer than the width f in the first direction. Since the opening 75 is arranged not to overlap the first and second light emitting elements 21 and 23 in the vertical direction, hot spots in the light distribution emitted through the opening 75 can be removed. The difference between the first direction of the opening 75 and the distance a between the first and second light emitting elements 21 and 23 may be 1 mm or less, for example, in the range of 0 to 1 mm. Through this difference, the problem of the light emitting elements 21 and 23 being exposed to the opening 75 can be prevented and the light path can be minimized to prevent a decrease in luminance.

An embodiment of the invention combines the housing 71 with a module having the light emitting elements 21 and 23, so that the durability and assembly of the module can be improved, and an advantageous effect can be provided when designing or changing the mechanism. Additionally, by providing a module with a housing 71, an advantageous effect can be provided when fixing or supporting a flexible module when it is deformed.

At least one of the first resin layer 41, the second resin layer 51, and a phosphor-containing layer may be exposed through the opening 75 of the housing 71. In the first embodiment, the second resin layer 51 may be disposed on the opening 75. The second resin layer 51 may overlap the opening 75 in a vertical direction. The second resin layer 51 may not overlap the upper cover 73 of the housing 71 in the vertical direction. The second resin layer 51 is disposed on the upper surface of the first resin layer 41 disposed in the opening 75 and may protrude further than the upper cover 73. The top surface area of the second resin layer 51 may be the same as the top surface area of the opening 75. Here, the housing 71 may be assembled or combined after the second resin layer 51 is formed. At this time, light may be emitted through the upper side, that is, the protruding side, of the second resin layer 51.

The thickness of the second resin layer 51 may be thicker than the thickness d of the upper cover 73 of the housing 71. The second resin layer 51 protrudes from the upper surface of the housing 71 at a predetermined height e, and may protrude by more than 0.1 mm, for example, in the range of 0.5 to 2 mm. Since the second resin layer 51 protrudes from the upper surface of the housing 71, the distribution of the diffused light can be increased. Diffused light may be emitted through the side surface of the second resin layer 51. In the first embodiment of the invention, since the second resin layer 51 is disposed only in the opening 75 area, the amount of diffusion agent can be reduced or the area of the second resin layer 51 can be reduced.

The width of the second resin layer 51 in the first direction may be equal to or smaller than the gap (a) between the first and second light emitting devices 21 and 23, thereby suppressing the occurrence of hot spots and emitting light. It is possible to suppress differences in uniformity depending on the distribution of beam angles of light emitted from the elements 21 and 23.

As another example, when the light emitting devices 21 and 23 emit blue light, the second resin layer 51 disposed on the first resin layer 41 is a phosphor layer having red or/and yellow phosphor. may include. The second resin layer 51 may be a phosphor layer in which only a phosphor is added without a diffusion agent.

The lighting module according to an embodiment of the invention may emit wavelength-converted light through the phosphor layer through the opening 75 of the housing 71. The phosphor layer may be disposed on the surface of the LED chip of the light emitting elements 21 and 23, or may be disposed on another path. In addition, since the second resin layer 51 protrudes beyond the upper cover 73 of the housing 71, the boundary portion of the second resin layer 51 can be expanded.

FIGS. 4 to 8 are modified examples of the lighting module of FIGS. 1 to 3. For the same configuration as above, refer to the above description, and redundant description will be omitted.

Referring to FIG. 4, the lighting module may have a second resin layer 51 disposed in the opening 75 of the housing 71. The second resin layer 51 is disposed on the first resin layer 41. The top surface area of the second resin layer 51 may be the same as the top surface area of the opening 75. The upper surface of the second resin layer 51 may be disposed at the same height as the upper surface of the housing 71, or may be disposed on the same horizontal plane as the upper surface of the housing 71. The width of the second resin layer 51 in the first direction may be equal to or smaller than the gap between the first and second light-emitting devices 21 and 23, thereby suppressing the occurrence of hot spots and forming the light-emitting devices 21 ,23), it is possible to suppress the difference in uniformity according to the beam angle distribution of the emitted light.

The thickness of the second resin layer 51 may be the same as the thickness of the upper cover 73 of the housing 71. Since the edge portion of the second resin layer 51 is in close contact with the upper cover 73 of the housing 71, the boundary portion of the second resin layer 51 can be provided more clearly.

For example, the light emitting elements 21 and 23 in the lighting module may emit red and/or yellow light, and the second resin layer 51 may emit the red or yellow light. As another example, the light emitting devices 21 and 23 generate blue light, and the second resin layer 51 includes a phosphor and can emit red and/or yellow light.

Referring to FIG. 5 , the second resin layer 51 may be disposed below the opening 75 of the housing 71. The second resin layer 51 may be disposed on the entire upper surface of the first resin layer 41. The second resin layer 51 is disposed below the opening 75 and can diffuse the incident light. The second resin layer 51 may be arranged to overlap the first and second light emitting devices 21 and 23 in the vertical direction. The upper surface area of the first resin layer 41 may be equal to the lower surface area of the second resin layer 51. Accordingly, hot spots on the first and second light emitting devices 21 and 23 can be suppressed. In addition, even if the distance between the first and second light emitting elements 21 and 23 is the same as the opening 75, hot spots can be suppressed. The second resin layer 51 may be provided thinner than the thickness of the first resin layer 41.

Referring to FIG. 6, a first resin layer 41 is disposed on the first light-emitting device 21 and the second light-emitting device 23, respectively, to protect the first and second light-emitting devices 21 and 23. do. The first resin layer 41 is disposed in a vertically overlapping area with the upper cover 73 of the housing 71, and seals the first and second light emitting devices 21 and 23. The first resin layer 41 may be arranged not to overlap at least part or all of the opening 75 in the vertical direction. A second resin layer 51 may be disposed between the first resin layers 41 covering the first and second light emitting devices 21 and 23. That is, since the inside of the first resin layer 41 has an open area, the second resin layer 51 can be disposed in the open area. The open area of the first resin layer 41 may overlap the opening 75 of the housing 71 in a vertical direction.

The second resin layer 51 may be arranged to overlap the opening 75 in a vertical direction. The thickness of the second resin layer 51 may be greater than the thickness of the first resin layer 41. The lower surface of the second resin layer 51 may face the upper surface of the circuit board 11. The side surface of the second resin layer 51 may be in contact with the side surface of the first resin layer 41. The second resin layer 51 may be disposed to face the first and second light emitting devices 21 and 23. This second resin layer 51 can diffuse the light emitted from the first and second light emitting devices 21 and 23. When the second resin layer 51 has a phosphor, it can emit wavelength-converted light.

The upper surface of the second resin layer 51 protrudes beyond the upper cover 73 of the housing 71, so that the diffused light can be emitted to a wider area. At this time, light may be emitted through the upper side, that is, the protruding side, of the second resin layer 51. The second resin layer 51 may be spaced apart from the first and second light emitting devices 21 and 23 by less than 1 mm.

FIG. 7 is a modified example of FIG. 6 , in which the second resin layer 51 may extend from the upper surface of the circuit board 11 to the opening 75 of the housing 71. The upper surface of the second resin layer 51 may not protrude from the upper surface of the housing 71 or may be disposed on the same horizontal plane. Since the perimeter of the second resin layer 51 is covered by the upper cover 73 of the housing 71, light may not be emitted through the side of the second resin layer 51.

FIG. 8 is a modified example of FIG. 7 , in which the second resin layer 51 may be disposed lower than the upper cover 73 of the housing 71. The second resin layer 51 may be formed to have the same thickness as the first resin layer 41. The second resin layer 51 may be spaced apart from the first and second light emitting devices 21 and 23 by less than 1 mm. 6 to 8, the top surface area of the second resin layer 51 may be larger than the top surface area of the first resin layer 41 covering the first and second light emitting devices 21 and 23.

<Second Embodiment>

9 to 11 are examples of lighting modules or lighting devices according to the second embodiment. In describing the second embodiment, the same configuration as above may be applied to the second embodiment with reference to the above description.

Referring to Figure 9, the lighting module may have a first resin layer 41 covering the first and second light emitting elements 21 and 23 disposed. The first resin layer 41 may be disposed in the opening 75 of the housing 71. The upper part of the first resin layer 41 may protrude through the opening 75. The upper part of the first resin layer 41 protrudes beyond the upper surface of the housing 71, as shown in FIG. 9, or is disposed within the opening 75 and does not protrude beyond the upper surface of the housing 71, as shown in FIG. 10. , As shown in FIG. 11, it may be placed below the upper surface of the opening 75.

The first and second light emitting devices 21 and 23 may emit target light desired by the module, such as red light. The first and second light emitting devices 21 and 23 may include a blue LED chip and a phosphor layer.

<Third embodiment>

12 to 15 are examples of side cross-sectional views of a lighting module or lighting device according to a third embodiment. In describing the third embodiment, the same configuration as above may be applied to the third embodiment with reference to the above description.

Referring to FIG. 12, the lighting module has a protrusion 41A of the first resin layer 41 protruding from the opening 75 of the housing 71, and the surface of the protrusion 41A of the first resin layer 41 The second resin layer 51 may be disposed. The second resin layer 51 may include at least one or two of a diffusion agent, a phosphor, and a powder ink. The second resin layer 51 may be provided with a thinner thickness than the upper cover 73 of the housing 71 and may be disposed on the top and side surfaces of the protrusion 41A of the first resin layer 41.

The second resin layer 51 may be provided as a diffusion layer with a diffusion agent. In this case, the light emitted from the first and second light emitting devices 21 and 23 may include red light or yellow light. The first and second light emitting devices 21 and 23 may include a layer having an LED chip and a phosphor.

The second resin layer 51 may be provided as a phosphor layer containing phosphor or/and powder ink. In this case, the light emitted from the first and second light emitting devices 21 and 23 may be blue light, and the light output through the phosphor layer may be red light and/or yellow light. Here, when the phosphor layer contains powder ink, such as red ink, the red ink can absorb the blue light and block it from being absorbed to the outside.

The surface color of the second resin layer 51 may be the same color as the phosphor or the same color as the powder ink, and the color when emitted may be brighter than the color. For example, in the case of red ink, it may be dark red when the ink is off, and may be bright or light red when the ink is on.

The second resin layer 51 may be in contact with the inner surface of the opening 75 or the inner surface of the upper cover 73 of the housing 71. The second resin layer 51 may be in contact with the upper surface of the first resin layer 41 below the opening 75. Accordingly, wavelength-converted light can be emitted through the side of the second resin layer 51. Additionally, since the second resin layer 51 covers the opening 75, light leakage problems can be prevented.

Referring to FIG. 13, the lower cover 72 and the upper cover 73 of the housing 71 are disposed around the side and upper surfaces of the first resin layer 41. A second resin layer 51 may be disposed on the first resin layer 41. The second resin layer 51 may be a diffusion layer to which a diffusion agent is added. A third resin layer 61 may be disposed on the second resin layer 51.

The third resin layer 61 may include a phosphor (p1) as shown in FIG. 26, or may be a layer containing a phosphor (p1) and a powdery ink (p2) as shown in FIG. 27. The phosphor (p1) converts the wavelength of the incident first light (L1) and emits it as second light. At this time, as shown in FIG. 26, most of the first light L1 can be wavelength converted, so the first light can be emitted at a low luminous intensity, and most of the second light L2 can be emitted. As shown in Figure 27, since the phosphor (p1) and the powder ink (p2) are filled at a high density in the third resin layer 61, only the second light (L2) whose wavelength is converted by the phosphor (p1) is emitted, The first light whose wavelength is not converted may be absorbed by the powder ink p2. The powder ink (p2) can provide a surface color similar to the color of the ink (p2) when the lighting module is turned off. This is because the color of the red or yellow phosphor is less dark than the color of the ink, so a problem may occur where the surface color is deteriorated when the module is turned off. To prevent this problem, the powder inks can be mixed.

The second resin layer 51 may be disposed within the opening 75 and protrude beyond the upper surface of the housing 71. The second resin layer 51 may be disposed in an area that does not overlap the first and second light emitting devices 21 and 23 in the vertical direction. The second resin layer 51 is disposed to have a width smaller than the width of the opening 75, and may be in contact with the upper surface of the first resin layer 41. Accordingly, the second resin layer 51 may be disposed between the first resin layer 41 and the third resin layer 61.

The third resin layer 61 may be disposed on the top and side surfaces of the second resin layer 51. The third resin layer 61 may be in contact with the upper surface of the first resin layer 41. This third resin layer 61 is arranged to surround the second resin layer 51 and contacts the upper surface of the first resin layer 41, thereby preventing the problem of light leakage through the first resin layer 41. This can be done, and the wavelength conversion efficiency of light diffused by the second resin layer 51 can be improved. The third resin layer 61 may be formed as a single layer, or may be laminated with a first layer containing a phosphor and a second layer containing the powder ink.

The phosphor content in the third resin layer 61 according to an embodiment of the invention may be placed relatively high. The content of the phosphor may be added in the same amount as the resin material forming the third resin layer 61. The phosphor content and the resin material of the third resin layer 61 may be added in the same ratio, for example, 50% to 50%. As another example, the phosphor may range from 40% to 60%, and the resin material of the third resin layer 61 may range from 40% to 60%. The content of the phosphor may differ from the resin material of the third resin layer 61 by 20% or less or 10% or less.

Referring to FIG. 14, a second resin layer 51 and a third resin layer 61 may be disposed on the first resin layer 41, and the second resin layer 51 is formed on the housing 71. is disposed on the first resin layer 41 below the opening 75, and the third resin layer 61 may be disposed on the second resin layer 51. The second resin layer 51 and the third resin layer 61 may have a width smaller than the width of the first resin layer 41 and may be equal to or smaller than the width of the opening 75. The upper surfaces of the second and third resin layers 51 and 61 may have the same area or the same width. The second and third resin layers 51 and 61 may be disposed on the same horizontal surface as the upper surface of the housing 71 or lower than the upper surface of the housing 71. The sum of the thicknesses of the second and third resin layers 51 and 61 may be the thickness of the upper cover 73 of the housing 71. By contacting the third resin layer 61 with the same area as the second resin layer 51, the wavelength conversion efficiency of the diffused light can be increased.

The second and third resin layers 51 and 61 are disposed in a center area that does not overlap the first and second light emitting elements 21 and 23 in the vertical direction, and diffuse the incident light and convert the wavelength. It can be released.

Referring to FIG. 15, the second and third resin layers 51 and 61 may be provided with an area equal to the top surface area of the first resin layer 41. Accordingly, the second resin layer 51 may be disposed between the first resin layer 41 and the third resin layer 61. The outer portions of the second and third resin layers 51 and 61 may overlap the first and second light emitting devices 21 and 23 in the vertical direction, thereby preventing hot spots in the vertical direction. The second and third resin layers 51 and 61 are disposed under the upper cover 73 of the housing 71, and the third resin layer may be exposed to the opening 75. Accordingly, the light diffused through the first and second light emitting devices 21 and 23 may be diffused by the second resin layer 51, have its wavelength converted by the third resin layer 61, and be emitted.

<Example 4>

FIG. 16 is an example of a side cross-sectional view of a lighting module or a lighting device having the same according to the fourth embodiment, and FIGS. 17 and 18 are modified examples of the side cross-sectional view of the lighting module of FIG. 16. In describing the fourth embodiment, the same configuration as above may be applied to the second embodiment with reference to the above description.

Referring to FIG. 16, a first resin layer 41 is disposed on the first light-emitting device 21 and the second light-emitting device 23, respectively, to protect the first and second light-emitting devices 21 and 23. do. The first resin layer 41 is disposed in a vertically overlapping area with the upper cover 73 of the housing 71, and seals the first and second light emitting devices 21 and 23. The first resin layer 41 may be arranged not to overlap at least part or all of the opening 75 in the vertical direction. A second resin layer 51 may be disposed between the first resin layers 41 covering the first and second light emitting devices 21 and 23. That is, since the inside of the first resin layer 41 has an open area, the second resin layer 51 can be disposed in the open area. The open area of the first resin layer 41 may overlap the opening 75 of the housing 71 in a vertical direction.

The second resin layer 51 may be arranged to overlap the opening 75 in a vertical direction. The thickness of the second resin layer 51 may be greater than the thickness of the first resin layer 41. The lower surface of the second resin layer 51 may face the upper surface of the circuit board 11. The side surface of the second resin layer 51 may be in contact with the side surface of the first resin layer 41. The second resin layer 51 may be disposed to face the first and second light emitting devices 21 and 23. This second resin layer 51 can diffuse the light emitted from the first and second light emitting devices 21 and 23. The protrusion 51A of the second resin layer 51 may protrude beyond the upper surface of the opening 75.

A third resin layer 61 may be disposed on the second resin layer 51. The third resin layer 61 may include a phosphor or a phosphor and ink. The third resin layer 61 may be in contact with the top and side surfaces of the protrusion 51A of the second resin layer 51. The third resin layer 61 may be disposed inside the opening 75 of the housing 71 along the side of the protrusion 51A of the second resin layer 51. Accordingly, since the third resin layer 61 covers the surface of the second resin layer 51 and the upper cover 73 of the housing 71 is disposed to cover the first resin layer 41, the problem of light leakage occurs. and can block hot spots. The top width or top surface area of the protrusion of the second resin layer 51 may be smaller than the bottom width or bottom area of the second resin layer 51.

The upper surface of the second resin layer 51 protrudes beyond the upper cover 73 of the housing 71, so that the diffused light can be emitted to a wider area. At this time, light may be emitted through the upper side, that is, the protruding side, of the second resin layer 51. The second resin layer 51 may be spaced apart from the first and second light emitting devices 21 and 23 by less than 1 mm.

FIG. 17 is a modified example of FIG. 16 , in which the second resin layer 51 may extend from the upper surface of the circuit board 11 to the opening 75 of the housing 71. The upper surface of the second resin layer 51 may not protrude from the upper surface of the housing 71 or may be disposed on the same horizontal plane. Since the perimeter of the second resin layer 51 is covered by the upper cover 73 of the housing 71, light may not be emitted through the side of the second resin layer 51.

The third resin layer 61 may be disposed on the second resin layer 51. The top surface area or top width of the third resin layer 61 may be the same as the top surface area or top width of the second resin layer 51. The top surface of the third resin layer 61 may be disposed to be equal to or lower than the top surface of the housing 71.

FIG. 18 is a modified example of FIG. 17 , in which the second resin layer 51 may be disposed lower than the upper cover 73 of the housing 71. The second resin layer 51 may be formed to have a thickness thinner than the thickness of the first resin layer 41. The second resin layer 51 may be spaced apart from the first and second light emitting devices 21 and 23 by less than 1 mm. The third resin layer 61 may be disposed lower than the upper cover 73 of the housing 71. The top surface of the third resin layer 61 may be disposed on the same horizontal plane as the top surface of the first resin layer 41. The second and third resin layers may be disposed in the opening area of the first resin layer 41 and may be in contact with the inner surface of the first resin layer 41. 16 to 18, the top surface area of the second resin layer 51 may be larger than the top surface area of the first resin layer 41 covering the first and second light emitting devices 21 and 23. The top surface area of the third resin layer 61 may be larger than the top surface area of the first resin layer 41 and may be the same as the top surface area of the second resin layer 51.

<Embodiment 5>

Figure 19 is an example of a side cross-sectional view of a lighting module according to the fifth embodiment, and Figures 20 and 21 are modified examples of the lighting module of Figure 20.

Referring to FIG. 19, the lighting module has a protrusion 41A of the first resin layer 41 protruding from the opening 75 of the housing 71, and the surface of the protrusion 41A of the first resin layer 41 The third resin layer 61 may be disposed. The third resin layer 61 may include at least one or two of a diffusion agent, a phosphor, and a powder ink. The second resin layer 51 may include, for example, a phosphor. At this time, the first and second light emitting devices 21 and 23 may emit blue light. The third resin layer 61 may be provided with a thinner thickness than the upper cover 73 of the housing 71 and may be disposed on the top and side surfaces of the protrusions of the first resin layer 41. This structure is configured without the second resin layer 51 having a diffusion agent.

The third resin layer 61 may be provided as a phosphor layer containing phosphor and powder ink. In this case, the light emitted from the first and second light emitting devices 21 and 23 may be blue light, and the light output through the phosphor layer may be red light and/or yellow light. Here, when the phosphor layer contains powder ink, such as red ink, the red ink can absorb the blue light and block it from being absorbed to the outside.

The surface color of the third resin layer 61 may be the same color as the phosphor or the same color as the powder ink, and the color when emitted may be brighter than the color. For example, in the case of red ink, it may be dark red when the ink is off, and may be bright or light red when the ink is on. The material of the third resin layer 61 may include a resin material such as silicone or epoxy. The third resin layer 61 may include a film. The third resin layer 61 may be made of a different material or the same resin material as the first resin layer 41.

The third resin layer 61 may be in contact with the inner surface of the opening 75 or the inner surface of the upper cover 73 of the housing 71. The third resin layer 61 may be in contact with the upper surface of the first resin layer 41 below the opening 75. Accordingly, wavelength-converted light can be emitted through the side of the third resin layer 61. Additionally, since the third resin layer 61 covers the opening 75, light leakage problems can be prevented.

Referring to FIG. 20, the lower cover 72 and the upper cover 73 of the housing 71 are disposed around the side and upper surfaces of the first resin layer 41. A third resin layer 61 may be disposed on the first resin layer 41. The third resin layer 61 may be a phosphor or a layer containing a phosphor and ink. The third resin layer 61 is disposed within the opening 75 and may be disposed at a level equal to or lower than the upper surface of the housing 71. The third resin layer 61 may be disposed in an area that does not overlap the first and second light emitting devices 21 and 23 in the vertical direction. The third resin layer 61 is disposed to have a width equal to or smaller than the width of the opening 75, and may be in contact with the upper surface of the first resin layer 41 or the upper surface of the protrusion.

As shown in FIG. 21, the third resin layer 61 may be disposed on the first resin layer 41. The third resin layer 61 is exposed below the opening 75 and may extend below the upper cover 73 of the housing 71. The top surface area or top width of the third resin layer 61 may be the same as the top surface area or top width of the first resin layer 41.

In lighting modules according to embodiments, the area of the surface emitting light from the planar light source may be arranged to be smaller than the area of the uppermost resin layer. Additionally, the lighting module is a surface light source and the width of the emission surface may be equal to or smaller than the gap between the first and second light emitting units.

Figure 22 is a modified example of a housing covering a lighting module according to the embodiment(s) of the invention, Figure 23 is another example of Figure 22, Figure 24 is an example of a reflective layer disposed on the inner surface of the housing, Figure 24 This is an example of a housing with a different reflective structure. The housing of FIGS. 22 to 24 may be selectively applied to the embodiment or modified examples having the resin layer(s) disclosed above.

Referring to FIG. 22, the housing 71 has at least one or two of the second resin layer 51 or the third resin layer 61 (see FIGS. 13 to 16) on the first resin layer 41. It can be placed. At least one or two of the second and third resin layers 51 and 61 may be exposed or protrude from the opening 75 of the housing 71.

The inner surface r1 of the upper cover 73 of the housing 71 may extend from the lower cover 72 of the housing 71 to have a curved surface with a predetermined curvature. Since the inner surface (r1) of the upper cover 73 of the housing 71 is disposed to have a curved surface, at least one of the first and second resin layers 41 and 51 in contact with the inner surface (r1) of the upper cover 73 At least one or more outer surfaces of the first to third resin layers 41, 51, and 61 may include a curved surface. As another example, the inner surface of the lower cover 71 may also be arranged to have a curved surface.

Among the inner surfaces of the housing 71, the lower vertical side height c1 may be the height of the first resin layer 41 or the same as the thickness of the light emitting elements 21 and 23, and the curved surface height of the upper cover. (c2) may be equal to the sum of the thicknesses of at least one or two of the second and third resin layers 51 and 61. The height c2 of the upper cover 73 may be greater than the height c1 of the lower cover 72, for example, 2 mm or more.

As shown in FIG. 23, the inner surface r2 of the housing 71 may include an inclined surface. The inclined surface is in contact with the side of at least one or both of the first and second resin layers 41 and 51, or at least one or both layers of the first and third resin layers 41, 51 and 61. More than one side may be in contact. The inclined surface may include a flat surface.

As shown in FIG. 24, a reflective layer 81 may be disposed on the inner surface r1 of the housing 71. The reflective layer 81 may be disposed between the inner surface r1 of the housing 71 and the resin layer(s). Accordingly, light leaking to the side through the resin layers 41 and 51 may be reflected by the reflective layer 81 and re-incident. The reflective layer 81 may be formed of metal or non-metallic material. The reflective layer 81 may also be formed on the side of the opening 75.

As shown in Figure 25, the lower inner surface of the housing 71 may include a lower inclined surface r3 inclined in the direction of the first and second light emitting devices 21 and 23. The lower inclined surface r3 may overlap the upper inclined surface r2 or the upper curved surface in a vertical direction and may reflect light incident from the light emitting elements 21 and 23 upward. The housing 71 may include a concave recess between the lower inclined surface r3 and the upper inclined surface r2 or the upper curved surface, thereby strengthening the bonding force with the resin layers 41 and 51. .

28 and 29 are examples of light-emitting elements in a lighting module or lighting device according to an embodiment.

Referring to FIG. 28, the light emitting devices 21 and 23 include a light emitting structure 123 and a plurality of bonding portions 121 and 122. The light emitting structure 123 may be formed of a compound semiconductor layer of group II to VI elements, for example, a compound semiconductor layer of group III-V elements or a compound semiconductor layer of group II-VI elements. The plurality of bonding parts 121 and 122 are selectively connected to the semiconductor layer of the light emitting structure 123 and supply power.

The light emitting devices 21 and 23 may include a substrate 124. The substrate 124 is disposed on the light emitting structure 123. The substrate 124 may be, for example, a light-transmitting, insulating, or conductive substrate. For example, the substrate 124 may be made of at least one of sapphire (Al ₂ O ₃ ), SiC, Si, GaAs, GaN, ZnO, Si, GaP, InP, Ge, and Ga ₂ O ₃ . A plurality of convex portions (not shown) may be formed on at least one or both of the top and bottom surfaces of the substrate 124 to improve light extraction efficiency. The side cross-sectional shape of each convex portion may include at least one of a hemispherical shape, a semi-elliptical shape, or a polygonal shape. This substrate 221 may be removed, but there is no limitation thereto.

At least one of a buffer layer (not shown) and a low-conductivity semiconductor layer (not shown) may be included between the substrate 124 and the light emitting structure 123. The buffer layer is a layer to alleviate the difference in lattice constant between the substrate 124 and the semiconductor layer, and can be selectively formed from group II to group VI compound semiconductors. An undoped group III-V compound semiconductor layer may be further formed under the buffer layer, but the present invention is not limited thereto.

The light emitting structure 123 may be disposed under the substrate 124 and includes a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. Another semiconductor layer may be further disposed on at least one of the above and below the semiconductor layer, but this is not limited.

The first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer are group II-VI compound semiconductors or/and compound semiconductors of group III-V elements, such as GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN. , AlGaAs, GaP, GaAs, GaAsP, and AlGaInP.

As another example of the light emitting structure 123, the first conductive semiconductor layer may be an n-type semiconductor layer and the second conductive semiconductor layer may be a p-type semiconductor layer. Conversely, the first conductive semiconductor layer may be implemented as a p-type semiconductor layer, and the second conductive semiconductor layer may be implemented as an n-type semiconductor layer. Additionally, the light emitting structure 123 may be implemented as any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure.

First and second bonding parts 121 and 122 are disposed below the light emitting structure 225. The first bonding part 121 is electrically connected to the first conductive semiconductor layer, and the second bonding part 122 is electrically connected to the second conductive semiconductor layer. The first and second bonding parts 121 and 122 include electrodes, and their bottoms may have a polygonal or circular shape. At least one or two of an electrode layer, a reflective layer, a diffusion layer, and an insulating layer may be included between the first and second bonding portions 121 and 122 and the light emitting structure 123.

The light emitting structure 123 may emit at least one of blue, green, red, and UV light.

As shown in FIG. 29, a phosphor layer 125 may be disposed on the surface of the light emitting structure. The phosphor layer 125 may include at least one of blue, green, red, purple, and yellow phosphors. The phosphor layer 125 may include, for example, at least one of a phosphor that emits a different wavelength from the emission wavelength, such as a rough or red phosphor.

The phosphor content in the phosphor layer according to an embodiment of the invention may be arranged to be relatively high. The content of the phosphor may be added in the same amount as the resin material forming the phosphor layer. The phosphor content may be added in the same ratio as the resin material of the phosphor layer, for example, 50% to 50%. As another example, the phosphor may range from 40% to 60%, and the resin material of the phosphor layer 125 may range from 40% to 60%. The content of the phosphor may differ from the resin material of the phosphor layer 125 by 20% or less or 10% or less.

FIG. 30 is a plan view of a vehicle to which a vehicle lamp to which a lighting module is applied according to an embodiment is applied, and FIG. 31 is a view showing a vehicle lamp to which a lighting module or lighting device is applied according to an embodiment.

30 and 31, in the vehicle 900, the tail light 800 includes a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. can do. Here, the first lamp unit 812 may be a light source to serve as a turn signal, the second lamp unit 814 may be a light source to serve as a sidelight, and the third lamp unit 816 may serve as a brake light. It may be a light source for use, but is not limited thereto. At least one or all of the first to third lamp units 812, 814, and 816 may include the lighting module disclosed in the embodiment. The housing 810 accommodates the first to third lamp units 812, 814, and 816, and may be made of a light-transmitting material. At this time, the housing 810 may have a curve depending on the design of the vehicle body, and the first to third lamp units 812, 814, and 816 may implement a surface light source that may have a curved surface depending on the shape of the housing 810. You can. These vehicle lamps can be applied to a vehicle's turn signal lamp when the lamp unit is applied to a vehicle's tail light, brake light, or turn signal lamp.

The features, structures, effects, etc. described in the embodiments above are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc. illustrated in each embodiment can be combined or modified and implemented in other embodiments by a person with ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, although the above description has been made focusing on the examples, this is only an example and does not limit the present invention, and those skilled in the art will understand the above examples without departing from the essential characteristics of the present embodiment. You will be able to see that various modifications and applications are possible. For example, each component specifically shown in the examples can be modified and implemented. And these variations and differences in application should be construed as being included in the scope of the present invention as defined in the appended claims.

11: circuit board
21,23: Light emitting device
41: First resin layer
51: second resin layer
61: Third resin layer
71: housing
72: Lower cover
73: Top cover
100: lighting module

Claims (11)

circuit board;
a first light emitting unit having a plurality of first light emitting elements arranged on a first area of the circuit board;
a second light emitting unit having a plurality of second light emitting elements arranged on a second area of the circuit board;
a first resin layer disposed on the circuit board and sealing the first and second light emitting devices;
a second resin layer disposed within the first resin layer and having a diffusion agent; and
It includes a housing including a lower cover covering a side of the first resin layer along an edge of the circuit board and an upper cover disposed on the first and second light emitting units,
The upper cover of the housing has an opening that opens,
The gap between the first and second light emitting elements is more than 1/2 of the width of the first resin layer in the first direction,
The plurality of first light emitting elements are arranged in a second direction perpendicular to the first direction,
The plurality of second light emitting elements are arranged in the second direction,
The opening of the housing has a width smaller than the gap between the first and second light emitting units,
The lower surface of the second resin layer is disposed lower than the upper surface of the first resin layer,
The first resin layer is a lighting module disposed on both sides of the second resin layer. The lighting module of claim 1, wherein the first resin layer has an open area, and the second resin layer is disposed in the open area of the first resin layer. According to paragraph 1,
A lighting module wherein the top surface of the second resin layer protrudes further than the top of the housing. The lighting module of claim 1, wherein the lighting module includes a third resin layer disposed on the opening of the housing and having a phosphor or a phosphor and ink. The method of claim 1, comprising a third resin layer disposed on the second resin layer and having a phosphor or a phosphor and ink,
A lighting module wherein the top width or top area of the third resin layer is the same as the top width or top area of the second resin layer. The method of claim 1, comprising a third resin layer disposed on the second resin layer and having a phosphor or a phosphor and ink,
The second resin layer protrudes through the opening,
The third resin layer is disposed on the top and side surfaces of the second resin layer and is in contact with the first resin layer. According to any one of claims 1 to 5,
A lighting module wherein the inner surface of the housing includes a curved or inclined surface. The lighting module according to any one of claims 1 to 5, wherein the first and second light emitting elements are disposed closer to the opening than the lower cover of the housing. According to any one of claims 1 to 5,
A lighting module where the lower cover of the housing covers all sides of the first resin layer and is fixed to the upper surface of the circuit board. According to any one of claims 4 to 6,
The first and second light emitting elements emit blue light,
A lighting module wherein the phosphor includes at least one of red, green, blue, yellow, and purple phosphors. According to any one of claims 1 to 5,
The circuit board includes a protective layer or reflective layer on top,
The second resin layer is in contact with the upper surface of the circuit board,
A lighting module wherein the first resin layer overlaps the upper cover of the housing in a vertical direction and is arranged not to overlap in the vertical direction with the opening of the housing.

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