KR102608062B1 - Receptacle connector and method for fabricating the same - Google Patents

Abstract

A receptacle connector is provided. The receptacle connector is a receptacle connector including first and second contact structures, wherein the first contact structure includes first and second sub GNDs spaced apart in a first direction and extending in a second direction intersecting the first direction, respectively. A GND plate including a plate and a third sub-GND plate extending in the first direction and connecting one side of the first and second sub-GND plates, a GND pin disposed on the GND plate, and the first and second sub-GND plates It includes first and second GND mounting units respectively connected to the other side of A Vbus comprising first and second sub-Vbus plates spaced apart in one direction and extending respectively in a second direction, and a third sub-Vbus plate connected to a Vbus mounting unit and connecting one side of the first and second sub-Vbus plates. plate, and a Vbus pin disposed on the Vbus plate.

Description

Receptacle connector and method for manufacturing the same {Receptacle connector and method for fabricating the same}

The present invention relates to a receptacle connector and a method of manufacturing the same.

Connectors generally include plug connectors and receptacle connectors. The receptacle connector is mounted on a printed circuit board (PCB) of an electronic device and connected to the plug connector, and includes a plurality of connection terminals, a mold structure supporting the plurality of connection terminals, and a shell surrounding the mold structure ( shell).

Specifically, the connection terminals are arranged in a form that satisfies the pin standard of, for example, USB (universal serial bus). The connection terminals are held and insulated from each other by the mold structure, and are shielded from the outside by the shell surrounding the mold structure.

Recently, details of the new USB standard, type-C connector, were released at the IDF (Intel Developer Forum). The USB Type-C connector has a similar size to USB 2.0 Micro-B, and has the advantage of being easy to attach and detach the plug connector because it is not limited by the connection direction. In addition, the USB Type-C connector has a transmission speed of up to 10Gbps, which is twice as fast as the existing USB 3.0, and can supply power up to 100W, so it is expected to be used in various fields.

The technical problem to be solved by the present invention is to provide a receptacle connector for charging with a simplified structure.

Another technical problem to be solved by the present invention is to provide a method of manufacturing a receptacle connector that reduces manufacturing costs through a simplified process.

The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

A receptacle connector according to some embodiments of the present invention for achieving the above technical problem is a receptacle connector including first and second contact structures, wherein the first contact structure is spaced apart in a first direction and intersects the first direction. A GND plate including first and second sub-GND plates each extending in a second direction, and a third sub-GND plate extending in the first direction and connecting one side of the first and second sub-GND plates. It includes a GND pin disposed in and first and second GND mounting portions respectively connected to the other sides of the first and second sub-GND plates, and the second contact structure is disposed between the first and second GND mounting portions. A Vbus mounting unit, first and second sub-Vbus plates spaced apart in the first direction and extending in the second direction, respectively, between the first and second sub-GND plates, connected to the Vbus mounting unit, and first and second sub-Vbus plates It includes a Vbus plate including a third sub Vbus plate connecting one side of the plate, and a Vbus pin disposed on the Vbus plate.

In some embodiments of the invention, a receptacle connector further comprising a mold structure supporting the contact structure and a shell surrounding the mold structure.

In some embodiments of the present invention, the GND pins include first and second upper GND pins that protrude from the upper surfaces of the first and second sub-GND plates, respectively, and protruding from the lower surfaces of the first and second sub-GND plates, respectively. It includes first and second lower GND pins, wherein the Vbus pins include first and second upper Vbus pins that protrude from the upper surfaces of the first and second sub-Vbus plates, respectively, and lower surfaces of the first and second sub-Vbus plates. It includes first and second lower Vbus pins, respectively protruding from.

In some embodiments of the present invention, the width of the first and second GND mounting portions in the first direction is 2.5 to 10 times greater than the width of the GND pin in the first direction.

In some embodiments of the invention, the width of the Vbus mounting portion in the first direction is 5 to 10 times greater than the width of the first and second upper Vbus pins and the first and second lower Vbus pins in the first direction. big.

In some embodiments of the present invention, the first and second GND mounting portions and the Vbus mounting portion have a horseshoe shape.

In some embodiments of the invention, the contact structure includes a copper alloy.

A method of manufacturing a receptacle connector according to some embodiments of the present invention for achieving the above other technical problems includes forming a contact structure including first and second contact structures, and forming a mold structure supporting the contact structure, forming a shell surrounding the mold structure, wherein the first contact structure includes first and second sub-GND plates spaced apart in a first direction and each extending in a second direction intersecting the first direction, and A GND plate including a third sub-GND plate extending to and connecting one side of the first and second sub-GND plates, a GND pin disposed on the GND plate, and each connected to the other side of the first and second sub-GND plates It includes first and second GND mounting portions, and the second contact structure includes a Vbus mounting portion disposed between the first and second GND mounting portions, a first and second sub-GND plate spaced apart in a first direction, and a second contact structure. A Vbus plate including first and second sub-Vbus plates extending in two directions, respectively, and a third sub-Vbus plate connected to the Vbus mounting portion and connecting one side of the first and second sub-Vbus plates, and a Vbus plate Includes the Vbus pins that are placed.

In some embodiments of the invention, forming the contact structure includes forming the first and second contact structures by press molding.

In some embodiments of the invention, forming the mold structure includes forming by insert molding using a contact structure.

Specific details of other embodiments are included in the detailed description and drawings.

A receptacle connector according to some embodiments of the technical idea of the present invention provides a receptacle connector for charging with a simplified structure.

The receptacle connector according to some embodiments of the technical idea of the present invention simplifies the manufacturing process and reduces the manufacturing cost of the charging receptacle connector.

1 is a perspective view showing a receptacle connector according to some embodiments of the technical idea of the present invention.
Figure 2 is an exploded perspective view for explaining a receptacle connector according to some embodiments of the technical idea of the present invention.
FIG. 3A is a perspective view showing the first contact structure of FIGS. 1 and 2.
FIG. 3B is a perspective view showing the first contact structure of FIG. 3A turned over.
FIG. 4A is a perspective view showing the second contact structure of FIGS. 1 and 2.
FIG. 4B is a perspective view showing the second contact structure of FIG. 4A turned over.
Figure 5 is a perspective view showing first and second contact structures and mold structures according to some embodiments of the technical idea of the present invention.
Figure 6 is a cross-sectional view taken along line A-A' of Figure 5.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms. The present embodiments only serve to ensure that the disclosure of the present invention is complete and that common knowledge in the technical field to which the present invention pertains is not limited. It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

One component is said to be “connected to” or “coupled to” another component when it is directly connected or coupled to another component or with an intervening other component. Includes all cases. On the other hand, when one component is referred to as “directly connected to” or “directly coupled to” another component, it indicates that there is no intervening other component. “And/or” includes each and every combination of one or more of the mentioned items.

When a component is referred to as “on” or “on” another component, it includes both cases where the other component is interposed as well as directly on top of the other component. On the other hand, when a component is referred to as “directly on” or “directly above” another component, it indicates that there is no intervening other component.

Spatially relative terms such as “below”, “beneath”, “lower”, “above”, “upper”, etc. are used as a single term as shown in the drawing. It can be used to easily describe the correlation between components and other components. Spatially relative terms should be understood as terms that include different directions of the element during use or operation in addition to the direction shown in the drawings. For example, if an element shown in a drawing is turned over, a component described as “below” or “beneath” another element may be placed “above” the other element. . Accordingly, the illustrative term “down” may include both downward and upward directions. Components can also be oriented in different directions, so spatially relative terms can be interpreted according to orientation.

The terminology used herein is for describing embodiments and is not intended to limit the invention. As used herein, singular forms also include plural forms, unless specifically stated otherwise in the context. As used herein, “comprises” and/or “comprising” refers to the presence of one or more other components, steps, operations and/or elements. or does not rule out addition.

Although first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are merely used to distinguish one component from another. Therefore, of course, the first component mentioned below may also be the second component within the technical spirit of the present invention.

Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used with meanings that can be commonly understood by those skilled in the art to which the present invention pertains. Additionally, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless clearly specifically defined.

Hereinafter, with reference to FIGS. 1 and 2, a receptacle connector according to some embodiments of the technical idea of the present invention will be described.

1 is a perspective view showing a receptacle connector according to some embodiments of the technical idea of the present invention. Figure 2 is an exploded perspective view for explaining a receptacle connector according to some embodiments of the technical idea of the present invention.

1 and 2, the receptacle connector 1 includes a contact structure 10, a mold structure 20, and a shell 30.

Contact structure 10 may include first and second contact structures 100 and 200.

The first and second contact structures 100 and 200 may be formed in a 'ㄷ' shape. Specifically, the first contact structure 100 may be formed in a 'ㄷ' shape, and the second contact structure 200 may be formed in a 'ㄷ' shape that is smaller than the first contact structure 100.

At this time, the second contact structure 200 may be arranged inside the first contact structure 100 in an inverted 'ㄷ' shape. Specifically, the first contact structure' formed in a 'ㄷ' shape may form a space inside, and the second contact structure' may be arranged in this space in an inverted 'ㄷ' shape. Accordingly, the mounting portions of the first and second contact structures 100 and 200 may be arranged in a row.

The first and second contact structures 100 and 200 may be ground contacts and power contacts, respectively. Accordingly, when the receptacle connector 1 is coupled with the corresponding plug connector (not shown), the first and second contact structures 100 and 200 may be electrically connected to the ground contact and power contact of the plug connector. .

Specifically, when the receptacle connector 1 is coupled with the corresponding plug connector, the first and second contact structures 100 and 200 may be arranged as shown in Table 1 below, respectively.

plug connector contact GND RX2+ RX2- Vbus SBU1 D1- D1+ CC1 Vbus TX1- TX1+ GND 100 200 200 100 100 200 200 100 100 200 200 100 plug connector contact GND TX2+ TX2- Vbus CC2 D2+ D2- SBU2 Vbus RX1- RX1+ GND

Here, GND is the ground contact of the plug connector. TX and RX are data bus contacts, forming a (+) and (-) pair and adjacent to each other. Vbus is a power contact. SBU is a contact for sideband. CC is a contact for the configuration channel. D is a contact for differential data signals and is adjacent to each other in a pair of (+) and (-).

That is, as shown in Table 1, when the receptacle connector 1 is coupled with the corresponding plug connector (not shown), the first and second contact structures 100 and 200 are electrically connected to the ground contact and power contact of the plug connector. It can be connected to .

Accordingly, the first contact structure 100 is connected to ground and can prevent electromagnetic interference caused by high-speed signals. Additionally, the second contact structure 200 can input and output power electrical signals to a printed circuit board (PCB; not shown) on which the receptacle connector 1 is mounted.

Contact structure 10 may be formed of a conductive material. For example, the contact structure 10 may include a copper alloy, but the technical idea of the present invention is not limited thereto.

The contact structure 10 may be formed by processing a metal plate through a press mold. Specifically, first, a mold corresponding to the shape of the first and second contact structures 100 and 200 may be provided, and a molding material may be injected into the cavity of the mold. Next, the molding material is brought into a fluid state and pressed to form the first and second contact structures 100 and 200. At this time, the molding material may include, for example, a copper alloy, but the technical idea of the present invention is not limited thereto.

The mold structure 20 may be arranged to surround the contact structure 10 . That is, the mold structure 20 can support the contact structure 10. Accordingly, the strength of the contact structure 10 can be strengthened by being supported by the mold structure 20.

At this time, the mold structure 20 may expose the pins and mounting portions of the contact structure 10. This will be described in detail later in the description of FIGS. 5 and 6.

The mold structure 20 may be formed of an insulating material including polymer, plastic resin, etc. For example, the mold structure 20 may include liquid crystal polymer (LCP), but the technical idea of the present invention is not limited thereto.

The mold structure 20 may be formed by insert molding using the first and second contact structures 100 and 200. Specifically, first, the first and second contact structures 100 and 200 may be inserted and fixed into an insert molding mold. Next, the mold structure 20 can be formed by injecting molding material into the insert molding mold and performing insert molding. At this time, the molding material may include plastic resin, LCP, etc., but the technical idea of the present invention is not limited thereto.

The shell 30 may surround the mold structure 20. That is, the contact structure 10 and the mold structure 20 can be accommodated inside the shell 30. Accordingly, the contact structure 10 and the mold structure 20 can be protected from external forces acting on the receptacle connector 1 by the shell 30.

At this time, the mounting portion formed on the shell 30 may be mounted on a printed circuit board on which the receptacle connector 1 is mounted. Accordingly, the receptacle connector 1 can be mounted on a printed circuit board or the like using a mounting portion formed on the shell 30.

The shell 30 may be formed of a metallic material. For example, the shell 30 may include stainless steel. Additionally, the shell 30 may be plated with Ni, but the technical idea of the present invention is not limited thereto.

Hereinafter, with reference to FIGS. 3A to 6 , first and second contact structures according to some embodiments of the technical idea of the present invention will be described in detail. For convenience of explanation, parts that overlap with those described using FIGS. 1 and 2 will be briefly described or omitted.

FIG. 3A is a perspective view showing the first contact structure of FIGS. 1 and 2. FIG. 3B is a perspective view showing the first contact structure of FIG. 3A turned over.

3A and 3B, the first contact structure 100 includes a GND plate 120, GND pins 150A, 150B, 160A, and 160B, and first and second GND mounting units 110a and 110b. Includes.

The GND plate 120 may include first to third sub-GND plates 121, 122, and 123.

The first and second sub GND plates 121 and 122 may be spaced apart in the first direction (X) and extend in the second direction (Y), respectively. Specifically, the first sub GND plate 121 may extend in the second direction (Y), and the second sub GND plate 122 may be spaced apart from the first sub GND plate 121 in the first direction (X). and may extend in the second direction (Y). Accordingly, the first and second sub GND plates 121 and 122 may have a shape facing each other.

The third sub GND plate 123 extends in the first direction (X) and can connect one side of the first and second sub GND plates 121 and 122. Specifically, the third sub GND plate 123 may extend from one side of the first sub GND plate 121 in the first direction (X) and be connected to one side of the second sub GND plate 122. Accordingly, the first and second sub GND plates 121 and 122 may be connected by the third GND plate 120.

That is, the first to third sub GND plates 121, 122, and 123 may be connected to each other to form a 'ㄷ' shaped GND plate 120.

GND pins 150a, 150b, 160a, and 160b may be placed on the GND plate 120. As shown, the GND pins 150A, 150B, 160A, and 160B may have a shape that protrudes from the GND plate 120 and is disposed on the GND plate 120.

Specifically, the GND pins 150A, 150B, 160A, and 160B are first and second upper GND pins 150a and 160a, respectively protruding from the GND plate 120 and extending in the second direction (Y), and the first and second lower GND pins 150b and 160b.

As shown in FIG. 3A, the first and second upper GND pins 150a and 160a may protrude from the upper surfaces of the first and second sub GND plates 121 and 122, respectively, and extend in the second direction (Y). there is. In contrast, as shown in FIG. 3B, the first and second lower GND pins 150b and 160b protrude from the lower surfaces of the first and second sub GND plates 121 and 122, respectively, and extend in the second direction (Y). It may be extended.

The GND pins 150A, 150B, 160A, and 160B may be directly connected to the ground contact of the receptacle connector 1 when connected to the corresponding plug connector (not shown).

The first and second GND mounting units 110a and 110b may be connected to other sides of the first and second sub GND plates 121 and 122, respectively.

Specifically, the first GND mounting unit 110a may be connected to one side of the first sub-GND plate 121 to which the third sub-GND plate 123 is not connected. That is, the third sub-GND plate 123 may be connected to one side of the first sub-GND plate 121, and the first GND mounting unit 110a may be connected to the other side of the first sub-GND plate 121.

Likewise, the second GND mounting unit 110b may be connected to one side of the second sub GND plate 122 to which the third sub GND plate 123 is not connected. That is, the third sub-GND plate 123 may be connected to one side of the second sub-GND plate 122, and the second GND mounting unit 110b may be connected to the other side of the second sub-GND plate 122.

The first and second GND mounting units 110a and 110b may mount the first contact structure 100 on a printed circuit board of an electronic device using a method such as soldering. That is, the first contact structure 100 can be mounted on a printed circuit board, etc. by the first and second GND mounting units 110a and 110b.

FIG. 4A is a perspective view showing the second contact structure of FIGS. 1 and 2. FIG. 4B is a perspective view showing the second contact structure of FIG. 4A turned over.

Referring to FIGS. 4A and 4B , the second contact structure 200 includes a Vbus plate 220, Vbus pins 250a, 250b, 260a, and 260b, and a Vbus mounting unit 210.

The Vbus plate 220 may include first to third sub Vbus plates 221, 222, and 223.

The first and second sub Vbus plates 221 and 222 may be spaced apart in the first direction (X) and extend in the second direction (Y), respectively. Specifically, the first sub Vbus plate 221 may extend in the second direction (Y), and the second sub Vbus plate 222 may be spaced apart from the first sub Vbus plate 221 in the first direction (X). and may extend in the second direction (Y). Accordingly, the first and second sub Vbus plates 221 and 222 may have a shape facing each other.

At this time, the first and second sub Vbus plates 221 and 222 may be disposed between the first and second sub GND plates 121 and 122 (FIGS. 3A and 3B). That is, the first and second sub Vbus plates 221 and 222 may be spaced apart in the first direction (X) and extend in the second direction (Y) between the first and second sub GND plates 121 and 122. there is. Specifically, the first sub Vbus plate 221 may be adjacent to the first sub GND plate 121 and extend in the second direction (Y), and the second sub Vbus plate 222 may be a second sub GND plate ( 122) and may extend in the second direction (Y).

The third sub Vbus plate 223 extends in the first direction (X) and can connect one side of the first and second sub Vbus plates 221 and 222. Specifically, the third sub Vbus plate 223 may extend from one side of the first sub Vbus plate 221 in the first direction (X) and be connected to one side of the second sub Vbus plate 222. Accordingly, the first and second sub Vbus plates 221 and 222 may be connected by the third sub Vbus plate 223.

At this time, the third sub Vbus plate 223 may be disposed between the first and second sub GND plates 121 and 122 (FIGS. 3A and 3B). That is, the third sub Vbus plate 223 may extend in the first direction (X) between the first and second sub GND plates 121 and 122.

That is, the first to third sub Vbus plates 120, 130, and 140 may be connected to each other to form a 'ㄷ' shaped Vbus plate 220 that is smaller than the GND plate 120 (FIGS. 3A and 3B). .

Vbus pins 250a, 250b, 260a, 260b may be placed on Vbus plate 220. As shown, the Vbus pins 250a, 250b, 260a, and 260b may have a shape that protrudes from the Vbus plate 220 and is disposed on the Vbus plate 220.

Specifically, the Vbus pins 250a, 250b, 260a, and 260b are first and second upper Vbus pins 250a and 260a, respectively protruding from the Vbus plate 220 and extending in the second direction (Y), and the first and second lower Vbus pins 250b and 260b.

As shown in FIG. 4A, the first and second upper Vbus pins 250a and 260a may protrude from the upper surfaces of the first and second sub Vbus plates 221 and 222, respectively, and extend in the second direction (Y). there is. In contrast, as shown in FIG. 4B, the first and second lower Vbus pins 250b and 260b protrude from the lower surfaces of the first and second sub Vbus plates 221 and 222, respectively, and protrude in the second direction (Y). It may be extended.

The Vbus pins 250a, 250b, 260a, and 260b may be directly connected to the power contact of the receptacle connector 1 when connected to the corresponding plug connector (not shown). Accordingly, the Vbus pins 250a, 250b, 260a, and 260b can supply power to a printed circuit board on which the receptacle connector 1 is mounted. That is, the Vbus pins 250a, 250b, 260a, and 260b can input and output power electrical signals.

The Vbus mounting unit 210 may be connected to the third sub Vbus plate 223.

Specifically, the Vbus mounting unit 210 may be connected to one side of the third sub Vbus plate 223 where the first and second sub Vbus plates 221 and 222 are not connected. That is, the first and second sub Vbus plates 221 and 222 may be connected to one side of the third sub Vbus plate 223, and the Vbus mounting unit 210 may be connected to the other side of the third sub Vbus plate 223. You can.

The Vbus mounting unit 210 can mount the second contact structure 200 on a printed circuit board of an electronic device, etc. using a method such as soldering. That is, the second contact structure 200 can be mounted on a printed circuit board, etc. by the Vbus mounting unit 210. Accordingly, the second contact structure 200 can supply power to a printed circuit board on which the receptacle connector 1 is mounted.

Figure 5 is a perspective view showing first and second contact structures and mold structures according to some embodiments of the technical idea of the present invention. Figure 6 is a cross-sectional view taken along line A-A' of Figure 5.

Referring to FIGS. 5 and 6 , the first and second contact structures 100 and 200 may be disposed on and supported by the mold structure 20 .

Specifically, the first contact structure 100 may be disposed along the edge of the mold structure 20, and the second contact structure 200 may be disposed at the center of the mold structure 20. At this time, the GND pins (150A, 150B, 160A, 160B) and Vbus pins (250a, 250b, 260a, 260b) may be exposed on the upper or lower surface of the mold structure 20. Additionally, a portion of the side surface of the GND plate 120 may be exposed from a portion of the side surface of the mold structure 20 . However, the Vbus plate 220 may not be exposed in the mold structure 20.

More specifically, the first and second upper GND pins 150a and 160a may be exposed on the upper surface of the mold structure 20 adjacent to the side of the mold structure 20, and the first and second lower GND pins ( 150b and 160b may be exposed from the lower surface of the mold structure 20 adjacent to the side of the mold structure 20 . Additionally, part of the side surface of the first and second sub GND plates 121 and 122 may be exposed to part of the side surface of the mold structure 20 .

In contrast, the first and second upper Vbus pins 250a and 260a may be exposed on the upper surface of the mold structure 20 between the first and second upper GND pins 150a and 160a, and the first and second upper Vbus pins 250a and 260a may be exposed on the upper surface of the mold structure 20 between the first and second upper GND pins 150a and 160a. The lower Vbus pins 250b and 260b may be exposed on the lower surface of the mold structure 20 between the first and second lower GND pins 150b and 160b. However, the Vbus plate 220 may be placed inside the mold structure 20 and not exposed.

Accordingly, the GND pins (150A, 150B, 160A, 160B) and Vbus pins (250a, 250b, 260a, 260b) are connected to the plug when the receptacle connector (1) is connected to the corresponding plug connector (not shown). It can be connected directly to the ground contact and power contact of the connector.

Additionally, the first and second GND mounting units 110a and 110b and the Vbus mounting unit 210 may protrude out of the mold structure 20. Accordingly, the first contact structure 100 may be mounted on a printed circuit board, etc. by the first and second GND mounting units 110a and 110b, and the second contact structure 200 may be mounted on the Vbus mounting unit 210. It can be mounted on a printed circuit board, etc.

A portion of the side surface of the GND plate 120 may be exposed from the side surface of the mold structure 20 and connected to ground.

Accordingly, the receptacle connector 1 according to some embodiments of the technical idea of the present invention provides a receptacle connector for charging with a simplified structure.

For example, the receptacle connector 1 may include first and second contact structures 100 and 200 of a simplified structure in which an upper contact, a lower contact, a plate, and a mounting portion are integrally formed. Specifically, the first contact structure 100 may include a GND plate 120, GND pins 150a, 150b, 160a, 160b, and GND mounting units 110a, 110b, and the second contact structure may be formed integrally with the first contact structure 100. In (200), the Vbus plate 220, the Vbus pins 250a, 250b, 260a, and 260b, and the Vbus mounting unit 210 may be formed integrally.

That is, the first and second contact structures 100 and 200 are formed as one body and can input and output electrical signals with a large cross-sectional area. Accordingly, the first and second contact structures 100 and 200 can reduce resistance heat caused by high-speed signals and prevent ignition of the electronic device on which the receptacle connector 1 is mounted. Additionally, the first and second contact structures 100 and 200 may improve the feeling of connection when the receptacle connector 1 is connected to the corresponding plug connector.

In addition, the receptacle connector 1 simplifies the manufacturing process and reduces the manufacturing cost of the receptacle connector for charging.

For example, when the contact structure 10 and the shell 30 are each formed by press mold processing, only two types of molds corresponding to each are required. Therefore, compared to a contact structure in which lower contacts, upper contacts, plates, shells, etc. are formed separately and thus require more types of molds, the manufacturing process of the receptacle connector 1 can simplify the press mold processing process.

Also, for example, in a process of forming the mold structure 20 by insert molding, the mold structure 20 can be formed with only one insert molding process. Specifically, the first and second contact structures 100 and 200 are inserted and fixed into the insert molding mold, and then molding materials such as plastic resin are injected into the insert molding mold to form the mold structure 20 with only one insert molding. can be formed. Therefore, compared to other receptacle connectors having complex structures of contacts or plates, the manufacturing process of the receptacle connector 1 according to the technical idea of the present invention can simplify the insert molding process.

In some embodiments, the top surfaces of GND pins 150A, 150B, 160A, 160B and Vbus pins 250a, 250b, 260a, 260b may be plated. For example, the top surfaces of the GND pins (150A, 150B, 160A, 160B) and Vbus pins (250a, 250b, 260a, 260b) are made of nickel (Ni), lead (Pd), gold (Au), or a combination thereof. Can be plated with at least one.

Additionally, the top surfaces of the GND pins (150A, 150B, 160A, 160B) and Vbus pins (250a, 250b, 260a, 260b) may be plated multiple times. For example, the top surfaces of the GND pins (150A, 150B, 160A, 160B) and Vbus pins (250a, 250b, 260a, 260b) may be plated with nickel (Ni), and the GND pin plated with nickel (Ni) ( The top surfaces of (150A, 150B, 160A, 160B) and Vbus pins (250a, 250b, 260a, 260b) may be plated with lead-nickel (Ni-Pd). Additionally, the top surfaces of the GND pins (150A, 150B, 160A, 160B) and Vbus pins (250a, 250b, 260a, 260b) plated with lead-nickel (Ni-Pd) may be plated with gold (Au).

Plating the top surfaces of the GND pins (150A, 150B, 160A, 160B) and Vbus pins (250a, 250b, 260a, 260b) , 260b) can improve durability. In addition, plating the upper surfaces of the GND pins (150A, 150B, 160A, 160B) and Vbus pins (250a, 250b, 260a, 260b) improves connectivity with the contacts of the plug connector corresponding to the receptacle connector (1). You can do it.

In some embodiments, the width of the first and second GND mounting portions 110a and 110b in the first direction (X) is greater than or equal to the width of the GND pins 150A, 150B, 160A, and 160B in the first direction (X). It can be bigger than the width. The receptacle connector 1 according to some embodiments does not include contacts for inputting and outputting data electrical signals, and therefore does not require a mounting unit for this. Accordingly, the first and second GND mounting portions 110a and 110b may be formed larger. That is, the second width W2 may be larger than the first width W1.

To put it into perspective, the second width W2 may be 2.5 to 10 times larger than the first width W1, and preferably may be about 3 times larger. When the second width W2 is 2.5 times or more than the first width W1, the area where the first and second GND mounting portions 110a and 110b are connected to the printed circuit board, etc. is expanded to form the first contact structure 100. ) can be stably mounted on a printed circuit board, etc. However, when the second width W2 is 10 times or more than the first width W1, the area occupied by the first and second GND mounting portions 110a and 110b is excessively expanded, resulting in miniaturization of the receptacle connector 1. It may not be easy.

In some embodiments, the width of the Vbus mounting unit 210 in the first direction (X) may be larger than the width of the Vbus pins 250a, 250b, 260a, and 260b in the first direction (X). As described above, the receptacle connector 1 according to some embodiments does not have contacts for inputting and outputting data electrical signals. Accordingly, the Vbus mounting portion 210 may be formed larger, like the first and second GND mounting portions 110a and 110b. That is, the fourth width W4 may be larger than the third width W3.

To a large scale, the fourth width W4 may be 5 to 10 times larger than the third width W3, and preferably may be about 6 times larger. When the fourth width W4 is 5 times or more than the third width W3, the area where the Vbus mounting portion 210 is connected to the printed circuit board, etc. is expanded, so that the receptacle connector 1 is mounted on the printed circuit board, etc. It can supply a large amount of power. However, when the fourth width W4 is 10 times or more than the third width W3, the area occupied by the Vbus mounting unit 210 may be excessively expanded, making it difficult to miniaturize the receptacle connector 1.

In some embodiments, the first and second GND mounting units 110a and 110b and the Vbus mounting unit 210 may have a horseshoe shape. Specifically, as shown in FIGS. 3A to 4B, the first and second GND mounting units 110a and 110b and the Vbus mounting unit 210 may each have a shape similar to a concave shape. In particular, as shown in FIGS. 4A and 4B, the Vbus mounting unit 210 may have a shape in which two concave shapes are combined.

Accordingly, compared to the case where the mounting portion is rectangular, the area where the first and second GND mounting portions 110a and 110b and the Vbus mounting portion 210 are connected to the printed circuit board, etc. can be expanded. That is, the first contact structure 100 and the second contact structure 200 can be stably mounted on a printed circuit board, etc.

Additionally, when the mounting portion is formed in a concave shape, the cutting process after press mold processing may be easier. As described above, the first and second contact structures 100 and 200 can be compressed and molded through press mold processing. The compressed molded product can be cut to form the first and second contact structures 100 and 200. In this case, since the concave shape is hollow in the center, the mounting portion including the concave shape can be cut more easily.

Although embodiments of the present invention have been described above with reference to the attached drawings, the present invention is not limited to the above embodiments and can be manufactured in various different forms, and can be manufactured in various different forms by those skilled in the art. It will be understood by those who understand that the present invention can be implemented in other specific forms without changing its technical spirit or essential features. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

1: receptacle connector 10: contact structure
20: mold structure 30: shell
120: GND plate 130: Vbus plate
150a, 150b, 160a, 160b: GND pins 250a, 250b, 260a, 260b: Vbus pins
110a, 110b: GND mounting part 210: Vbus mounting part

Claims (10)

In a receptacle connector including first and second contact structures,
The first contact structure is,
First and second sub GND plates spaced apart in a first direction and extending in a second direction intersecting the first direction, respectively, and connecting one side of the first and second sub GND plates extending in the first direction. A GND plate including a third sub-GND plate,
A GND pin disposed on the GND plate, and
It includes first and second GND mounting units respectively connected to other sides of the first and second sub-GND plates,
The second contact structure is,
A Vbus mounting unit disposed between the first and second GND mounting units,
First and second sub Vbus plates spaced apart in the first direction and extending in the second direction between the first and second sub GND plates, respectively, connected to the Vbus mounting unit and the first and second sub GND plates A Vbus plate including a third sub-Vbus plate connecting one side of the Vbus plate, and
Including a Vbus pin disposed on the Vbus plate,
The length at which the first and second sub-GND plates extend in the second direction is greater than the length at which the first and second sub-Vbus plates extend in the second direction,
The first and second sub-Vbus plates are a receptacle connector disposed between the third sub-GND plate and the third sub-Vbus plate in the second direction. According to clause 1,
A receptacle connector further comprising a mold structure supporting the contact structure, and a shell surrounding the mold structure. According to clause 1,
The GND pin is,
It includes first and second upper GND pins that protrude from the upper surfaces of the first and second sub-GND plates, respectively, and first and second lower GND pins that protrude from the lower surfaces of the first and second sub-GND plates, respectively. do,
The Vbus pin is,
It includes first and second upper Vbus pins that protrude from the upper surfaces of the first and second sub-Vbus plates, respectively, and first and second lower Vbus pins that protrude from the lower surfaces of the first and second sub-Vbus plates, respectively. receptacle connector. According to clause 1,
A receptacle connector in which the width of the first and second GND mounting portions in the first direction is 2.5 to 10 times greater than the width of the GND pin in the first direction. According to clause 1,
The width of the Vbus mounting portion in the first direction is 5 to 10 times greater than the width of the first and second upper Vbus pins and the first and second lower Vbus pins in the first direction. . According to clause 1,
A receptacle connector wherein the first and second GND mounting portions and the Vbus mounting portion have a horseshoe shape. According to clause 1,
A receptacle connector wherein the contact structure includes a copper alloy. forming a contact structure comprising first and second contact structures;
Forming a mold structure supporting the contact structure,
Including forming a shell surrounding the mold structure,
The first contact structure is,
First and second sub GND plates spaced apart in a first direction and extending in a second direction intersecting the first direction, respectively, and connecting one side of the first and second sub GND plates extending in the first direction. A GND plate including a third sub-GND plate, a GND pin disposed on the GND plate, and first and second GND mounting units respectively connected to the other side of the first and second sub-GND plates,
The second contact structure is,
A Vbus mounting portion disposed between the first and second GND mounting portions, and first and second sub Vbus spaced apart from each other in the first direction and extending in the second direction between the first and second sub GND plates, respectively. A Vbus plate including a plate, a third sub-Vbus plate connected to the Vbus mounting unit and connecting one side of the first and second sub-Vbus plates, and a Vbus pin disposed on the Vbus plate,
The length at which the first and second sub-GND plates extend in the second direction is greater than the length at which the first and second sub-Vbus plates extend in the second direction,
The first and second sub-Vbus plates are disposed between the third sub-GND plate and the third sub-Vbus plate in the second direction. According to clause 8,
Forming the contact structure includes:
A method of manufacturing a receptacle connector comprising forming the first and second contact structures by press molding. According to clause 8,
A method of manufacturing a receptacle connector including forming the mold structure by insert molding using the contact structure.