KR102715350B1 - Mounting device of electronic component and mounting method of electronic component - Google Patents

Abstract

Provided are a mounting device for electronic components and a mounting method for electronic components, which are capable of picking up electronic components without contact and determining their position at a mounting location. An electronic component C mounting device (1) of an embodiment comprises a mounting head (31) for mounting an electronic component C, which is suction-held and supported, on a substrate S, and a porous member (701) for non-contact holding and supporting the electronic component C, a pickup collet (700) for picking up the electronic component C from a supply section (6) and transferring it to the mounting head (31), a moving device (7) for relatively moving the mounting head (31) and the pickup collet (700), and a state in which the electronic component C is non-contact held and supported by the negative pressure of the suction hole (701c) together with the ejection of gas from the porous member (701), the moving device (7) causes the mounting head (31) and the pickup collet (700) to approach to a predetermined interval and suction by the mounting head (31), and after a predetermined time has elapsed at a predetermined interval, the suction of the pickup collet (700) is released so that the electronic component is attached to the mounting head (31). It has a control device (8) that supports suction holding of C.

Description

MOUNTING DEVICE OF ELECTRONIC COMPONENT AND MOUNTING METHOD OF ELECTRONIC COMPONENT

The present invention relates to a mounting device for electronic components and a mounting method for electronic components.

When mounting electronic components such as logic, memory, and image sensors, which are semiconductor elements, on a substrate, the wafer on which the semiconductor elements are formed is cut into individual chips. Then, these chips are picked up one by one, transferred to the substrate, and mounted.

One side of the chip, the surface, is a functional surface on which a fine circuit is formed. When picking up this chip from a wafer, if the picking material comes into direct contact with the functional surface, there is a risk that the circuit, etc., may be damaged, so there is a need to avoid contact.

In addition, as a non-contact adsorption technology, there is a Bernoulli chuck as a representative example, but the adsorption force is very small compared to the large air flow rate required. Therefore, when picking up a chip from a state where it is supported by a UV tape, the adsorption holding force that only removes the chip from the UV tape is not obtained.

In addition, the connection terminals on the surface of the chip and the connection terminals on the substrate are joined so that they face each other. At this time, in order to secure and improve the bonding between the connection terminals, surface treatment such as plasma treatment or surface activation treatment is sometimes performed on the surface of the chip. In order to maintain the surface state of the chip that has undergone such treatment, there is a demand to avoid direct contact of the pick-up member with the surface of the chip.

In order to respond to the demand that the surface of the chip not come into contact with the absence, conventionally, in a collet, which is a member for picking up a chip, the surface that holds and supports the chip is made as a tapered surface, so that only the periphery, not the surface of the chip, comes into contact with the tapered surface of the collet, and the chip is held and supported by suction from the center of the chip (see patent document 1).

Japanese Utility Model Publication No. 63-124746

However, in the above-described conventional technology, the chip is only contacted by the collet at the periphery, and suction is performed from the center of the chip. For this reason, the chip is easily deformed, and there is a possibility that the chip may be cut or cracked. In addition, since the collet contacts the edge portion of the chip periphery, and the chip being sucked is supported at the contact portion, stress is concentrated at the periphery, and cut or cracking is easily performed. In addition, since the holding and supporting position of the chip is fixed in the state of being held and supported by suction, if there is a misalignment or inclination when the chip is held and supported by suction, it cannot be corrected when transmitted to the mounting device thereafter.

An embodiment of the present invention has been proposed to solve the problems described above, and its purpose is to provide an electronic component mounting device and an electronic component mounting method capable of picking up an electronic component without contact and determining its position at the mounting position.

An electronic component mounting device of an embodiment of the present invention comprises a mounting head for mounting an electronic component on a substrate by suction and holding it by negative pressure of a suction hole, a porous member for non-contactly holding and holding the electronic component by negative pressure of the suction hole while ejecting gas from a thin hole, a pickup collet for picking up the electronic component from a supply section that supplies the electronic component and transferring it to the mounting head, a moving device for relatively moving the mounting head and the pickup collet, and a control device for causing the mounting head and the pickup collet to approach each other by a predetermined interval by the moving device and suction by the mounting head while the electronic component is non-contactly held and held by the negative pressure of the suction hole together with the ejection of gas from the porous member, and for releasing the suction of the pickup collet after a predetermined time has elapsed at the predetermined interval so that the electronic component is suction-held and held by the mounting head.

A method for mounting an electronic component according to an embodiment of the present invention comprises: a pick-up collet having a porous member that non-contactably holds and supports an electronic component by the negative pressure of a suction hole while emitting gas from a thin hole picks up and supports the electronic component from a supply portion of the electronic component in a non-contact manner; a moving device brings a mounting head that mounts the electronic component on a substrate and the pick-up collet that has picked up and inverted the electronic component close to a predetermined interval, initiates suction by the negative pressure of a suction hole provided in the mounting head, and after a predetermined time has elapsed at the predetermined interval, releases the suction of the pick-up collet, whereby the mounting head suction-holds and supports the electronic component.

An embodiment of the present invention can provide an electronic component mounting device and an electronic component mounting method capable of picking up an electronic component without contact and determining its position at a mounting position.

Fig. 1 is a front view showing a schematic configuration of a mounting device of an embodiment.
Figure 2 is a plan view showing electronic components and a substrate.
Figure 3 is a plan view (A) of the mounting device and an enlarged plan view (B) of the mounting location.
Fig. 4 is a cross-sectional schematic diagram (A) showing the principle of holding and supporting electronic components by a pickup collet, and a bottom perspective view (B) showing the base.
Figure 5 is a bottom perspective view showing the pickup collet and the attachment/detachment portion.
Figure 6 is a top perspective view showing the pickup collet and the attachment/detachment portion.
Figure 7 is an enlarged view showing the inversion operation of an electronic component, with the left side being a front view and the right side being a plan view.
Figure 8 is an explanatory diagram showing the pickup operation of an electronic component.
Figure 9 is an explanatory diagram showing the transmission operation of electronic components.
Figure 10 is an explanatory diagram showing a state in which the mounting head approaches the pickup collet to the first gap (A), a state in which suction of the mounting head is initiated (B), a state in which suction of the pickup collet is weakened (C), and a state in which the mounting head approaches to the second gap and holds and supports an electronic component (D).
Figure 11 is an explanatory drawing showing a state in which the pickup collet is positioned on the mounting head (A) and a state in which the electronic component is positioned in the center (B).
Figure 12 is an explanatory diagram showing the mounting operation of the mounting device.
Figure 13 is a flow chart showing the sequence of the pickup operation and transfer operation of electronic components.
Figure 14 is a flow chart showing the mounting sequence of electronic components.
Figure 15 is an explanatory drawing showing a mounting head provided with a nozzle.
Figure 16 is a bottom view showing a variation of the arrangement of the guide section.
Figure 17 is a schematic plan view showing the arrangement of suction holes and the state of pulling electronic components in the second embodiment. ((A) state where electronic components are misaligned, (B) state where electronic components are pulled toward the center)
Fig. 18 is a cross-sectional view showing the arrangement of suction holes of the second embodiment. ((A) State where electronic components are misaligned, (B) State where electronic components are pulled toward the center)
Figure 19 is an explanatory drawing showing examples of arrangement of suction holes (A) to (O).

1. First embodiment

Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. This embodiment is a mounting device (1) for mounting an electronic component C on a substrate S, as shown in FIGS. 1 and 2. FIG. 1 is a front view showing a schematic configuration of the mounting device (1). FIG. 2 is a plan view showing the electronic component C and the substrate S. In addition, the drawings are schematic, and the size (hereinafter also referred to as "dimensions") of each part, the shape, the ratio of the sizes of each part, etc. may differ from actual ones.

[Electronic Components]

First, the electronic component C to be mounted in this embodiment may be, for example, a semiconductor element such as an IC or an LSI. As illustrated in Fig. 2, this embodiment uses a semiconductor chip having a rectangular parallelepiped shape as the semiconductor element. The semiconductor chip is a bare chip that is cut into pieces by dicing, which cuts a semiconductor wafer into a dice-shaped shape. The bare chip has a functional surface that functions as a semiconductor element on one of the front and back surfaces. A bump or bumpless electrode is provided on the surface of the functional surface, and is mounted by a flip chip connection that is connected to an electrode pad on a substrate S.

The electronic component C is provided with a plurality of marks m for positioning. In the present embodiment, two marks m are provided, one each at a pair of diagonal corners of the rectangular electronic component C. The marks m are provided on a surface of the electronic component C on which an electrode is formed, i.e., a face. The present embodiment is an example of a device for face-down mounting in which the face side is mounted toward the substrate S.

[Substrate]

In this embodiment, the substrate S on which the electronic component C is mounted is, as illustrated in Fig. 2, a plate-shaped member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate or the like on which a circuit pattern is formed. On the substrate S, a mounting area B, which is an area on which the substrate S is mounted, is provided, and a plurality of marks M for positioning are provided on the outside of the mounting area B. In this embodiment, two marks M are provided at positions corresponding to the marks m of the electronic component C, which are positions on the outside of the mounting area B.

[Mount Device]

The mounting device (1) of the present embodiment is a mounting device (1) that enables mounting with high precision, for example, a mounting precision of ±0.2 ㎛ or less, and, as shown in FIGS. 1 and 3, has a substrate support mechanism (2), a mounting mechanism (3), a first imaging unit (4), a second imaging unit (5), a supply unit (6), a moving unit (7), and a control unit (8). FIG. 3 (A) is a plan view of the mounting device (1), and FIG. 3 (B) is a plan view showing a mark M that has passed through a mounting head (31) described later.

In addition, in the following description, the direction in which the mounting mechanism (3) moves to mount the electronic component C on the substrate S is referred to as the Z-axis, and two axes that are orthogonal to each other on a plane orthogonal thereto are referred to as the X-axis and the Y-axis. In the present embodiment, the Z-axis is vertical, the direction that follows gravity is referred to as downward, the direction that resists gravity is referred to as upward, and the position on the Z-axis is referred to as height. In addition, the X-axis and the Y-axis are on a horizontal plane, and when viewed from the front side in Fig. 1, the X-axis is the left-right direction and the Y-axis is the depth direction. However, the present invention is not limited to this installation direction. Regardless of the installation direction, with respect to the substrate S or the substrate support mechanism (2), the side on which the electronic component C is mounted is referred to as the upper side, and the opposite side is referred to as the lower side.

The substrate support mechanism (2) is a mechanism that supports the substrate S on which the electronic component C is mounted, and is a so-called substrate stage. The mounting mechanism (3) is a mechanism that mounts the electronic component C on the substrate S. The mounting mechanism (3) has a mounting head (31). The mounting head (31) has a transparent portion that allows a mark M on the substrate S facing the electronic component C to be recognized by transmitting it while holding and supporting the electronic component C.

The first imaging unit (4) is positioned lower than the substrate support mechanism (2) at the mounting position OA where the mounting head (31) mounts the electronic component C on the substrate S, and captures an image of the mark m of the electronic component C held by the mounting head (31) from a position facing the electronic component C, that is, from below, while the substrate S is retracted from the mounting position OA by the substrate support mechanism (2). The mounting position OA is the position where the electronic component C is mounted on the substrate S, and is indicated in the drawing by a dashed-dotted line along the Z-axis passing through a point (for example, the center point) on the XY coordinates within the area of the electronic component C to be mounted. The mounting position OA coincides with the optical axes of the cameras of the first imaging unit (4) and the second imaging unit (5), as described later. The second imaging unit (5) is positioned above the mounting head (31) at the mounting position OA, and captures the mark M of the substrate S through the transmission portion of the mounting head (31) (hereinafter, this is referred to as “capturing the image beyond the mounting head (31)”). Based on the images captured in this manner, detection of the marks m and M, i.e. recognition of the marks m and M, becomes possible.

In addition, the substrate support mechanism (2) and the mounting mechanism (3) each have a positioning mechanism. The positioning mechanism determines the positions of the substrate S and the electronic component C based on the positions of the substrate S and the electronic component C obtained from images of marks m and M captured by the first imaging unit (4) and the second imaging unit (5). Each part of the mounting device (1) described above is mounted on a support (11) installed on an installation surface. The ceiling surface of the support (11) is a horizontal plane.

The supply unit (6) supplies electronic components C. The moving device (7) transfers the electronic components C from the supply unit (6) to the mounting position OA. The moving device (7) has a transfer head (71) and a transfer mechanism (73). The transfer head (71) picks up the electronic components C from the supply unit (6) in a non-contact manner, inverts them, and transfers them to the mounting head (31). The transfer mechanism (73) moves the transfer head (71) to a space created when the substrate support mechanism (2) retracts the substrate S from the mounting position OA, and positions it at the mounting position OA.

The control device (8) controls the operation of the mounting device (1). This control device (8) is composed of, for example, an electronic circuit or a computer operating with a predetermined program. That is, the control device (8) is a processing device such as a PLC or CPU that reads a program and data from a memory device and executes control of the mounting device (1). Each part is described in detail below.

(Substrate support mechanism)

As shown in (A) of FIG. 1 and FIG. 3, the substrate support mechanism (2) is arranged on the support (11) and has a stage (21) and a driving mechanism (22). The stage (21) is a plate-shaped member that loads the substrate S. The driving mechanism (22) is a two-axis moving mechanism that has, for example, an X-axis guide rail (22a) and a Y-axis guide rail (22b), and moves the stage (21) within a horizontal plane by a belt or a ball screw using a motor (not shown) as a driving source. This driving mechanism (22) functions as a positioning mechanism that determines the position of the substrate S. In addition, the driving mechanism (22) is provided with a θ driving mechanism (not shown) that rotates the stage (21) within a horizontal plane.

The driving mechanism (22) is configured to include a moving plate (23) that moves in the Y-axis direction along a guide rail (22b). A through hole (23a) is formed in this moving plate (23) so that the first imaging unit (4) can capture an image of the electronic component C.

In addition, although the city is not formed, on one side of the moving stage (21) of the substrate support mechanism (2) in the X-axis direction (specifically, the moving stage on the right side of the city), a loader/unloader for supplying/storing the substrate S to the stage (21) is provided. Therefore, the substrate support mechanism (2) receives the supply of the substrate S from the loader or transfers the substrate S to the unloader while moving the stage (21) by the moving stage.

(Practical mechanism)

The mounting mechanism (3) has a mounting head (31) and a driving mechanism (32). The mounting head (31) has a generally rectangular parallelepiped shape and has a hollow portion (31a) as a transparent portion and a holding support portion (31b). The hollow portion (31a) is a cylindrical through hole formed with the Z-axis as an axis. The holding support portion (31b) is a plate-shaped member that can transmit light for imaging, and is installed so as to block an opening on the side of the hollow portion (31a) facing the substrate S. For example, a transparent glass plate is used as the holding support portion (31b). The holding support portion (31b) is a so-called mounting tool and holds and supports an electronic component C.

In the center of the holding support member (31b), as shown in (B) of Fig. 3, an adsorption region D is provided for adsorption-retaining and supporting the electronic component C. This adsorption region D is a position at which the electronic component C is held and supported by the holding support member (31b). A suction hole (31c) is formed in the adsorption region D. That is, in the center of the holding support member (31b), a suction hole (31c) is formed that is connected to a suction path formed inside the holding support member (31b). The center referred to here is an area having a certain width that includes the center of the adsorption region D. The suction path inside the holding support member (31b) is a path for connecting the suction hole (31c) to a negative pressure source, and is provided so that the electronic component C can be adsorption-retained and supported by generating a negative pressure in the suction hole (31c).

The suction area D of the holding support member (31b) and its surroundings are a transparent area T that can transmit and image an electronic component C held and supported by the pickup collet (700). Furthermore, even when the suction area D holds and supports the electronic component C, the mark M of the substrate S can be transmitted and imaged by the transparent area T around the suction area D. That is, the mounting head (31) has a transparent portion so that the mark M of the substrate S can be imaged by the second imaging unit (5). Furthermore, the holding surface (absorption surface) that holds and supports the electronic component C of the holding support member (31b) is referred to as a bottom surface.

The driving mechanism (32) is configured to include moving bodies (33, 34, 35) and is a mechanism for driving the mounting head (31). The moving body (33) is provided so as to be able to move along a Y-axis guide rail (33a) provided on a support (11). The moving body (34) is provided so as to be able to move along an X-axis guide rail (34a) provided on a ceiling surface of the moving body (33). The moving body (35) is provided so as to be able to move along a Z-axis guide rail (35a) provided on the front surface of the moving body (34). The moving body (35) is formed in a generally concave shape when viewed from the top. These moving bodies (33, 34, 35) are driven by a ball screw, linear motor, cylinder, or the like that uses a motor as a driving source.

The mounting head (31) is provided at the bottom of a moving body (35) that moves in the Z-axis direction. Therefore, the moving body (35) performs an operation for mounting an electronic component C held and supported by a holding support member (31b) of the mounting head (31) on a substrate S. In addition, the moving body (35) provided with the mounting head (31) moves in the X-axis direction and the Y-axis direction by the movement of the moving bodies (33, 34). For this reason, the driving mechanism (32) functions as a positioning mechanism that determines the position of the electronic component C held and supported by the mounting head (31). In addition, although not illustrated, the driving mechanism (32) is provided with a θ driving mechanism that rotates the mounting head (31) within a horizontal plane.

In addition, in the present embodiment, it is preferable that the movement amounts in the X-axis direction, Y-axis direction, and Z-axis direction by the driving mechanism (32) be set as short as possible from the viewpoint of preventing movement errors. For example, the movement amounts in the X-axis direction and the Y-axis direction by the moving bodies (33, 34) are each set to several mm to several tens of mm. In addition, the movement amount in the Z-axis direction by the moving body (35) is also set to several mm to several tens of mm. That is, the mounting head (31) is positioned at a height where the lower surface of the holding support member (31b) is at an opposing distance (separation distance in the vertical direction) of several mm, for example, 1 to 2 mm, with respect to the upper surface of the substrate S loaded on the stage (21), so that the receipt of the electronic component C or the imaging of the mark m of the received electronic component C is performed. Therefore, as for the amount of movement in the Z-axis direction of the moving body (35), at least, from this height position, it is sufficient to secure a movement amount that can pressurize and mount the electronic component C held and supported by the holding support member (31b) onto the substrate S with a predetermined pressing force.

(1st camera section)

The first imaging unit (4) has a camera, a lens, a barrel, a light source, etc., and is fixed to a receiving hole (11a) provided in a support (11). The first imaging unit (4) is arranged so that the optical axis of the camera can capture a mark m of an electronic component C held and supported by a mounting head (31). Specifically, the optical axis is arranged so as to be vertical. The first imaging unit (4) is fixed with respect to the mounting position OA of the electronic component C. In the present embodiment, the first imaging unit (4) is arranged upward in a state where the optical axis of the camera is aligned with the mounting position OA within the receiving hole (11a) of the support (11) which is at a lower position of the substrate support mechanism (2). The first imaging unit (4) is fixed to the support (11) so that the electronic component C comes into the imaging field of view when the pickup collet (700) faces the mounting head (31) to transfer the electronic component C. In addition, the first imaging unit (4) is provided with an imaging magnification so that the precision of recognizing the position by imaging the mark m of the electronic component C held by the mounting head (31) is the required precision. Of course, it has a field of view range that allows the mark m to be imaged. In addition, this field of view range is set by taking into consideration the variation in the position at which the electronic component C is held by the mounting head (31), that is, the holding position precision. In addition, in the case where a plurality of marks m are imaged to recognize the positions of the electronic component C held by the mounting head (31), a field of view range that allows the plurality of marks m to be imaged simultaneously can also be used. Such magnification and field of view range are appropriately determined based on the required position determination precision.

Here, floating means that the first imaging unit (4) (as well as the second imaging unit (5) described later) does not move when capturing images of marks m and M. For example, a configuration in which the imaging units (4, 5) are provided with drive devices in the X, Y-axis directions (horizontal direction) or drive devices in the Z-axis direction (up-down direction) and the horizontal position or the up-down position of the imaging units (4, 5) are adjusted by these drive devices as a preparatory work for operation of the device, and the device does not move during subsequent operation of the device is included in floating.

(Second camera unit)

The second imaging unit (5) has a camera, a lens, a barrel, a light source, etc., and is supported and fixed by a frame (not shown) above the support (11), more specifically, above the mounting head (31). The second imaging unit (5) is arranged in a direction in which the optical axis of the camera can capture an image of a mark M around the mounting area B of the substrate S by transmitting the holding support unit (31b) of the mounting head (31). That is, in the present embodiment, the second imaging unit (5) is arranged downward at a position directly above the mounting head (31) with the optical axis of the camera aligned with the mounting position OA. The second imaging unit (5), like the first imaging unit (4), is stationary with respect to the mounting position OA of the electronic component C. That is, the second imaging unit (5) is provided with an imaging magnification such that the precision with which it recognizes the position by imaging the mark M attached to the mounting area B of the substrate S loaded on the stage (21) is the required precision. At the same time, the imaging field of view of the second imaging unit (5) is set so that at least two marks M attached at the diagonal thereof are included with respect to the mounting area B of the substrate S. In addition, the range of this imaging field of view is set in consideration of the variation in the position at which the substrate S is loaded on the stage (21), i.e., the loading position precision.

(Supply Department)

The supply unit (6) has a support mechanism (61) and a drive mechanism (62). The support mechanism (61) is a device that supports a wafer sheet WS to which an electronic component C is attached. The drive mechanism (62) moves the support mechanism (61) along the X-axis direction and the Y-axis direction. In the supply unit (6), the surface (area) on which the electronic component C is mounted is called a loading surface F. In the present embodiment, the electronic component C is a wafer attached to the wafer sheet WS that is divided into pieces by dicing. Therefore, the surface (surface of the wafer) on which the electronic component C is attached of the wafer sheet WS is the loading surface F. The wafer sheet WS is attached to a wafer ring (not shown). The support mechanism (61) has a ring holder (61a) that mounts the wafer ring. That is, the surface of the support mechanism (61) that supports the wafer sheet WS can also be called a loading surface F.

In addition, although the city is not formed, on one side of the moving end in the Y-axis direction of the support mechanism (61) (specifically, the moving end on the city front side), a loader/unloader for supplying/storing wafer rings to/from the ring holder (61a) is provided. The support mechanism (61), while moving to the moving end, receives a supply of wafer rings from the loader or transfers wafer rings to the unloader.

In addition, although the city did not do it, the support mechanism (61) has an expand mechanism that creates a gap between the electronic components C by expanding the wafer sheet WS, and a pushing mechanism that separates the electronic components C by individually pushing them up with the expanded wafer sheet WS between them. In addition, the support mechanism (61) has a θ drive mechanism that rotates the ring holder (61a) within the horizontal plane. In addition, the pushing mechanism is fixedly arranged on the support (11), and the receipt of the electronic components C from the supply section (6) by the moving device (7), i.e., the pickup, is performed at this position (pickup position).

The driving mechanism (62) moves the support mechanism (61) in a predetermined direction. For example, the driving mechanism (62) is a mechanism that has an X-axis guide rail (62a) and a Y-axis guide rail (62b), uses a motor (not shown) as a driving source, and moves the support mechanism (61) in the X-axis and Y-axis directions within a horizontal plane by a belt or a ball screw. This driving mechanism (62) functions as a positioning mechanism that positions the electronic component C relative to the transfer head (71). In addition, the driving mechanism (62) is arranged at a position lower than the height position L (see FIG. 5) of the loading surface F.

(mobile device)

The moving device (7) moves the mounting head (31) and the pickup collet (700) relative to each other. The moving device (7) has a transfer head (71), an arm (72), and a transfer mechanism (73). As shown in Fig. 3 (A), the transfer head (71) has a pickup collet (700) and a reverse driving unit (710). The pickup collet (700) is a member that supports and attracts an electronic component C, as shown in Figs. 4 to 6, and also releases the support by attracting and releasing the electronic component C. The pickup collet (700) has a porous member (701), a base (702), and a guide unit (703). In the present embodiment, the pickup collet (700) moves by the moving device (7) to transfer the electronic component C to the mounting head (31). However, the movement for transmission must be relative, and either one or both of the pickup collet (700) and the mounting head (31) may move.

The porous member (701) is a member that has breathability and supplies gas supplied inside through thin holes on an opposing surface (701a) facing the electronic component C (in addition, in the following description, the symbol G is attached to the gas supplied toward the electronic component C and illustrated). The porous member (701) of the present embodiment has a rectangular plate shape, and minute spaces communicating with each other as a whole are formed densely and almost uniformly. The porous member (701) has breathability due to this structure, but its conductance is very small. When one surface of the porous member (701) becomes the opposing surface (701a), and gas is supplied inside from the back surface (701b) opposite to the opposing surface (701a), the gas is ejected from the thin holes that exist densely and evenly on the opposing surface (701a). This eruption is a substantially planar eruption that spreads over the entire surface of the erupted opposing surface (701a). This eruption is very gentle, so to speak, and feels like it is seeping out, and is about the level of feeling a slight air current when you put your finger close to it. In addition, surfaces other than the opposing surface (701a) and the back surface (701b) may have thin holes blocked.

As described above, the porous member (701) is a continuous structure in which fine pores, which are microscopic spaces inside, are connected to each other and through which gas can pass. As such a porous member (701), sintered metal, ceramic, resin, etc. can be used. From the viewpoint that the particles inside are difficult to separate and flow out, it is preferable to use sintered metal.

In addition, the porous member (701) has an opening (701d) on the opposing surface (701a), as shown in FIGS. 4 and 5, and is provided with a suction hole (701c), which is a through hole for sucking the electronic component C by negative pressure. The suction hole (701c) of the present embodiment passes straight through from the center of the back surface (701b) to the center of the opposing surface (701a).

The base (702) is a member that covers a surface of the porous member (701) other than the opposing surface (701a). The base (702) of the present embodiment is a rectangular box with an open bottom. The porous member (701) is inserted through the opening of the base (702) so that the bottom surface is exposed as the opposing surface (701a), and is attached and fixed within the base (702).

On the ceiling surface of the base (702), as illustrated in FIGS. 4 and 6, an air supply hole (702a), an exhaust hole (702b), and an installation hole (702c) are provided. The air supply hole (702a) is a through hole for supplying air to the porous member (701). The air supply hole (702a) is formed at a position close to the outer edge of the base (702) for a pipe connected to the air supply hole (702a). The exhaust hole (702b) is a through hole for generating a negative pressure in the opening (701d) through the suction hole (701c). The exhaust hole (702b) extends downward and is formed to fit into the suction hole (701c) of the porous member (701). A space for collecting gas is formed between the inner surface of the base (702) and the porous member (701) around the exhaust hole (702b). In addition, the exhaust hole (702b) may penetrate the suction hole (701c) and reach the opposing surface (701a). In this case, the suction hole (701c) and the opening (701d) of the porous member (701) are provided so as to be in close contact with the outer side of the exhaust hole (702b) that reaches the opposing surface (701a) of the porous member (701). The installation hole (702c) is a pair of concave holes for preventing misalignment when connected to the attachable/detachable portion (704) described later.

The supply hole (702a) is connected to a gas supply circuit through a pipe (not shown). The supply circuit is configured to include a gas supply source, a pump, a valve, etc. Here, the gas supplied to the porous member (701) through the supply hole (702a) is an inert gas. The exhaust hole (702b) is connected to a negative pressure generating circuit including a vacuum pump, a valve, etc. through a pipe (not shown).

The guide member (703) is a member that is arranged along the four sides of the side surface of the rectangular base (702) so as to follow the outer edge of the electronic component C, and controls the movement of the electronic component C held and supported on the opposing surface (701a). The guide member (703) is a plurality of plate-shaped bodies provided along the four sides of the base (702), that is, the four sides of the opposing surface (701a) of the rectangle, as illustrated in FIGS. 4, 5, and 6, for example. The guide member (703) of the present embodiment is provided one on each side of the opposing surface (701a), but is not limited to this. In addition, the outer edge of the pickup collet (700) formed by the base (702) is not limited to a rectangular shape. The guide part (703) may be positioned in a position that can regulate the movement of the electronic component C, for example, in a direction along the outer edge of the electronic component C, and is not limited to being positioned along the side of the base (702).

Each guide portion (703) has a protruding portion that protrudes further than the opposing surface (701a). The distance (protrusion amount) by which the guide portion (703) protrudes from the opposing surface (701a) may be such that the movement of the electronic component C held and supported on the opposing surface (701a) via the gas layer can be controlled, and may be at least as long as it spans from the opposing surface (701a) to the electronic component C held and supported via the gas layer. However, when the protruding portion of the guide portion (703) protrudes beyond the electronic component C held and supported on the opposing surface (701a) via the gas layer, it is necessary to take into account that the protruding portion does not come into contact with the electronic component C surrounding the electronic component C being picked up when picking it up from the wafer in a non-contact manner. Therefore, it is preferable that the distance by which the protruding portion of the guide portion (703) protrudes from the opposing surface (701a) is within the side surface of the electronic component C held and supported on the opposing surface (701a) via the gas layer. However, before the pickup collet (700) approaches the wafer sheet WS for pickup, the electronic components C are individually pushed up by interposing the wafer sheet WS by the pushing mechanism, so that they do not come into contact with the surrounding electronic components C in response to various protrusion amounts.

In addition, in the following description, the orthogonal guide part (703) on one side is referred to as 703K, 703L, and the orthogonal guide part (703) on the other side is referred to as 703M, 703N, and when these are not distinguished, they are referred to as the guide part (703). The orthogonal part referred to here includes a case where two guide parts (703) on adjacent sides are in contact or are continuous to form a right angle, and a case where there are multiple guide parts (703) on one side and those guide parts (703) are separated so that the straight lines (planes) they follow are orthogonal (see Fig. 16).

The inversion driving unit (710) inverts the electronic component C, which is held and suctioned by the pickup collet (700), in the up-and-down direction, as shown in Fig. 7 (A) and (B). That is, the pickup collet (700) is provided so as to be rotatable between the direction toward the wafer sheet WS and the direction toward the mounting head (31) by the inversion driving unit (710). The inversion driving unit (710) can use, for example, a rotation motor.

The pickup collet (700) is installed to the reverse driving unit (710) via the rotating body (720) and the detachable part (704). The rotating body (720) is connected to the reverse driving unit (710) and is provided so as to be rotatable about an axis in the Y direction. The detachable part (704) is installed to the rotating body (720) and is provided so as to be rotatable together with the rotating body (720). The detachable part (704) has a magnet inside and absorbs and holds the base (702) of the pickup collet (700) by the attractive force of the magnet. As shown in FIG. 5 and FIG. 6, a pair of pins (704a) are provided on the contact surface of the detachable part (704) with the base (702). The misalignment of the pickup collet (700) with respect to the detachable portion (704) is prevented by the pin (704a) being fitted into the installation hole (702c) provided in the base (702). In addition, although not shown, the pipe connected to the exhaust hole (702b) passes through the detachable portion (704), and the pipe connected to the air supply hole (702a) is supported by the detachable portion (704).

In addition, although the city did not do it, the transfer head (71) has a buffer member that drives the pickup collet (700) up and down, and applies an appropriate load and absorbs an excessive load when the tip of the pickup collet (700) comes into contact with the electronic component C. As the buffer member, for example, an elastic member such as a spring or rubber, a magnet, an air cylinder, a damper, a voice coil motor, or the like can be used.

The arm (72) is a member having a transfer head (71) provided at one end. The arm (72) has an extended protrusion (72a) and a body part (72b), as illustrated in (A) of Fig. 3. The extended protrusion (72a) is a member formed in an L shape by a rectangular parallelepiped-shaped member extending linearly in the Y-axis direction facing the front, and a rectangular parallelepiped-shaped member extending linearly in the X-axis direction facing the mounting mechanism (3). At one end of the extended protrusion (72a) facing the mounting mechanism (3), a reverse drive member (710) is provided so that its rotation axis is in the Y-axis direction. A pick-up collet (700) is installed on the rotation axis of the reverse drive member (710), so that the pick-up collet (700) is provided to be rotatable. The body part (72b) is a plate-shaped body parallel to the X-axis direction and is fixed to the other end of the extended protrusion part (72a) (see Fig. 8).

The tube for supplying negative pressure connected to the pickup collet (700), the reverse driving unit (710), and the cable for electrical connection connected to the buffer member are built into the female part (72). Built-in means that they are covered by the outer shell of the female part (72) and are not exposed to the outside. In the present embodiment, the tube and the cable are inserted into a hollow portion formed inside the female part (72).

The transport mechanism (73) moves the transport head (71) between the supply section (6) and the mounting position OA by driving the arm section (72). The transport mechanism (73) has a sliding section SL provided at a position where there is no overlap with the loading surface F when viewed in plan. In other words, the sliding section SL of the transport mechanism (73) is provided outside the movement range of the support mechanism (61). The transport mechanism (73) drives the arm section (72) according to the sliding movement of the sliding section SL. The sliding section SL referred to here refers to a component that moves while the members come into contact with each other. Such a sliding section SL becomes a source of dust generation. The sliding section SL of the present embodiment is configured to include a first sliding section (732b) and a second sliding section (734b) described later, as illustrated in FIG. 5. The first sliding member (732b) and the second sliding member (734b) are provided at a position (lower) lower than the height position L of the loading surface F.

The transport mechanism (73) has a fixed body (731), a first driving unit (732), a moving body (733), and a second driving unit (734), as illustrated in Fig. 8. The fixed body (731) is a rectangular parallelepiped-shaped member that is fixed to a support (11) (see Fig. 3 (A)) and extends in the X-axis direction. The position of the fixed body (731) is fixed with respect to the mounting position OA.

The first driving unit (732) drives the arm (72) in the X-axis direction. The first driving unit (732) has a first driving source (732a) and a first sliding unit (732b). The first driving source (732a) is a linear motor extending in the X-axis direction and is provided along the upper surface (the surface parallel to the XY plane) of the fixed body (731). The first sliding unit (732b) is a linear guide extending in the X-axis direction and is provided on the front surface (the surface parallel to the XZ plane) of the fixed body (731). In addition, since the linear motor moves without contacting the movable member with the stator, the first driving source (732a) does not have a sliding unit SL.

The moving body (733) is a block in the shape of a rectangular solid, and is provided with a mover of the first driving source (732a) and a slider of the first sliding part (732b), so that the moving body can slide in the X-axis direction according to the operation of the first driving source (732a).

The second driving unit (734) drives the arm (72) in the Z-axis direction. The second driving unit (734) has a second driving source (734a) and a second sliding unit (734b). The second driving source (734a) is a linear motor extending in the Z-axis direction and is provided on the moving body (733). The second sliding unit (734b) is a linear guide extending in the Z-axis direction and is provided on the moving body (733).

The body part (72b) of the arm (72) is provided so as to be able to slide in the Z-axis direction by installing the movable part of the second driving source (734a) and the slider of the second sliding part (734b). In this way, the sliding part SL of the present embodiment has a first sliding part (732b) and a second sliding part (734b) that slide linearly along two orthogonal axes. Then, the first sliding part (732b) and the second sliding part (734b) are arranged on two opposing sides of the front and back of the common moving body (733) in a positional relationship that overlaps in the height direction. That is, the positions of the two orthogonal axes are close positions. In addition, it is preferable that the distance between the two sides of the moving body (733) is short, that is, the moving body (733) is thin.

(Relationship between the spacing between the substrate and mounting head on the stage and the dimensions of the transfer head)

In this embodiment, as illustrated in Fig. 1, the opposing distance between the substrate S at the mounting position OA and the mounting head (31) is set so that the retreat of the substrate S becomes necessary in order for the transfer head (71) to move to the mounting position OA. In other words, the closer the height position of the upper surface of the substrate S supported by the substrate support mechanism (2) becomes to the need for retreat of the substrate S in order for the transfer head (71) to move to the mounting position OA, the closer the height position of the upper surface of the substrate S supported by the substrate support mechanism (2) is to the height position of the mounting head (31) when receiving the electronic component C at the mounting position OA is set. More specifically, the distance h when the height position of the upper surface of the substrate S loaded on the stage (21) of the substrate support mechanism (2) at the mounting position OA and the lower surface of the mounting head (31) when receiving the electronic component C are opposed is shorter than the height direction dimension H of the tip transfer head (71) of the arm portion (72) (h<H). Here, as described above, the distance from the lower surface of the holding support member (31b) to the height position of the upper surface of the substrate S is, for example, several mm.

(dimensions of the dark part)

As shown in FIG. 1, FIG. 3(A), and FIG. 7(A), the extended protrusion (72a) of the arm portion (72) has a width w of the member extending linearly in the Y-axis direction and a width d of the member extending linearly in the X-axis direction that are both longer than the thickness t in the Z-axis direction (w>t, d>t). As a result, while suppressing the expansion of the dimension of the arm portion (72) in the height direction, the rigidity of the arm portion (72) that becomes relatively long is secured, and the position of the electronic component C transferred by the transfer head (71) can be stabilized. By suppressing the expansion of the dimension of the arm portion (72) in the height direction, there is no need to raise the receiving position of the mounting head (31).

(controller)

The control device (8) controls the moving device (7), the negative pressure generating circuit, the positioning mechanism, etc., so that the electronic component C held and supported in the suction area D is positioned at the mounting position OA. First, the control device (8) holds and supports the electronic component C in a non-contact manner by the negative pressure of the suction hole (701c) together with the ejection of gas from the porous member (701) in the pickup collet (700), and then causes the transport mechanism (73) to bring the mounting head (31) and the pickup collet (700) close to a predetermined interval, and then starts the suction of the mounting head (31), and after a predetermined time has elapsed at a predetermined interval, the suction of the pickup collet (700) is released so that the electronic component C is held and supported by the suction of the mounting head (31).

The predetermined interval is set as a first interval (see d1 of (A), (B), and (C) of FIG. 10) and a second interval (see d2 of (D) of FIG. 10) smaller than the first interval d1. The first interval d1 and the second interval d2 of the present embodiment are intervals between the opposing surface (701a) and the holding support member (31b). The predetermined interval is set to a value obtained in advance by an experiment or the like. The first interval d1 is an interval at which the electronic component C held by the pickup collet (700) at the center of the mounting head (31) can be pulled by the suction of the suction hole (31c) of the holding support member (31b) within a predetermined allowable range, and the second interval d2 is an interval at which the electronic component C is suction-held and supported by the holding support member (31b) of the mounting head (31). In addition, the second interval d2 is set as an interval at which the holding support member (31b) does not contact the guide member (703) or exactly contacts the guide member (703).

The predetermined time is the time required for the electronic component C, which is held in the pickup collet (700) at the center of the mounting head (31), to be pulled within a predetermined tolerance range. This predetermined time is set to a value obtained in advance through experiments, etc. The predetermined tolerance range refers to an area within which positioning of the substrate S, which will be described later, can be determined during mounting. The control device (8) initiates suction of the mounting head (31) at a first interval d1, and releases suction of the pickup collet (700) at a second interval d2 after the lapse of the predetermined time.

In addition, the control device (8) controls the positioning mechanism so that the substrate S and the electronic component C are positioned based on the marks m and M captured by the first imaging unit (4) and the second imaging unit (5). That is, in the control device (8), the position of the mark m of the electronic component C on the design basis and the position of the mark M of the substrate S on the design basis are stored in the memory device as reference positions, respectively, corresponding to the position at which the electronic component C should be accurately mounted.

This reference position may be the position of marks m and M when electronic components C are accurately mounted on the substrate S in advance, rather than the design position. The control device (8) determines the misalignment between the mark m captured by the first imaging unit (4), the mark M captured by the second imaging unit (5), and the reference position, and controls the positioning mechanism (the driving mechanism (22) and the driving mechanism (32)) so that the electronic components C and the substrate S move in the direction and by the amount of movement in which the misalignment is corrected.

In addition, the control device (8) sequentially positions the electronic component C to be picked up at the pick-up position by controlling the transport mechanism (73) of the moving device (7) and the drive mechanism (62) of the supply unit (6) based on the map information indicating the position coordinates of the electronic component C on the wafer sheet WS. In addition, the pickup mentioned here means taking the electronic component C off from a member on which the electronic component C is loaded, for example, the wafer sheet WS, and receiving it. In addition, the control device (8) controls the holding and supporting of the electronic component C by the pick-up collet (700) of the transfer head (71), the reversal of the pick-up collet (700) by the reversal drive unit (710), the movement of the transfer head (71) by the transport mechanism (73) to the mounting position OA where the mounting head (31) is waiting, and the transfer of the electronic component C from the pick-up collet (700) to the mounting head (31).

[Principle of suction holding support by pickup collet]

Next, the principle by which the electronic component C can be held and supported by suction using the pickup collet (700) as described above will be explained. As shown in Fig. 4 (A), gas supplied from the air supply hole (702a) is ejected in a flat shape from a thin hole in the opposing surface (701a), thereby forming a layer of gas between the gas and the electronic component C. This layer has a thickness of, for example, 2 to 10 μm. Then, by applying a negative pressure to the suction hole (701c) by the negative pressure generating circuit, the electronic component C is held and supported by suction by bringing the opposing surface (701a) closer to the electronic component C. At this time, since the layer of gas is formed between the opposing surface (701a) and the electronic component C, the opposing surface (701a) and the electronic component C are maintained in a non-contact state. In addition, by releasing the negative pressure by the negative pressure generating circuit, the negative pressure is no longer applied to the suction hole (701c), so the electronic component C is released from the pickup collet (700).

[movement]

The operation of the present embodiment as described above will be described with reference to the explanatory drawings of FIGS. 8 to 12 and the flow charts of FIGS. 13 and 14 in addition to the drawings of FIGS. 1 to 7. In addition, in the initial state, the substrate S is transferred from the loader to the stage (21) of the substrate support mechanism (2), but is retracted together with the stage (21) from the position facing the mounting head (31), i.e., the mounting position OA.

[Transportation of electronic components]

The transport operation of the electronic component C is explained with reference to the explanatory drawings of FIGS. 8 to 12 and the flow chart of FIG. 13. A wafer ring having a wafer sheet WS attached thereto is mounted on a ring holder (61a) of a support mechanism (61) in a supply section (6) by an auto loader (see FIG. 3). An electronic component C divided into pieces by dicing is attached to this wafer sheet WS. In FIG. 8, the illustration is omitted except for the electronic component C to be picked up.

First, as shown in (A) of Fig. 8 and (A) of Fig. 3, the support mechanism (61) moves in the X-axis and Y-axis directions, and positions the electronic component C to be mounted at a pickup position. In addition, by moving the arm portion (72) in the X-axis direction, the tip of the pickup collet (700) of the transfer head (71) is positioned directly above the electronic component C to be mounted, i.e., at the pickup position (step S101).

At this time, the movement of the wafer sheet WS in the X-axis and Y-axis directions is performed by the driving mechanism (62) of the supply unit (6). The movement of the dark unit (72) in the X-axis direction is performed by the first driving source (732a) of the first driving unit (732) operating so that the moving body (733) moves along the first sliding unit (732b).

As shown in (B) of Fig. 8, a pushing mechanism (not shown) pushes up an electronic component C to be mounted. Then, a pickup collet (700) of a transfer head (71) picks up the electronic component C (step S102). At this time, pressurized gas is supplied to the porous member (701) of the pickup collet (700) through an air supply hole (702a), and the gas is ejected from the opposing surface (701a). In addition, no exhaust is performed from the exhaust hole (702b), and no suction is performed from the opening (701d). In this way, the pickup collet (700) to which gas is supplied from the opposing surface (701a) descends and approaches the electronic component C. When the pickup collet (700) approaches the electronic component C, the gas of the opposing surface (701a) is clamped and supported by the opposing surface (701a) and the electronic component C, thereby forming a gas layer. It is thought that the clamped and supported gas layer at this time becomes a viscous layer. Then, the pickup collet (700) stops descending toward the electronic component C due to the gas layer that is not compressed any further.

In this way, with the pickup collet (700) stopped through the gas layer, the suction by the suction hole (701c) is initiated by the exhaust from the exhaust hole (702b), so that the electronic component C is held and supported by suction on the opposing surface (701a). At this time, there are cases where the electronic component C held and supported by suction is misaligned from the center, but as described later, it is positioned at the center when transferred to the mounting head (31).

In this way, the dark part (72) moves in a direction approaching the wafer sheet WS, so that the pickup collet (700) adsorbs and holds the electronic component C, and then moves in a direction away from the wafer sheet WS, thereby detaching the electronic component C from the wafer sheet WS, as shown in (C) of FIG. 8.

At this time, the movement of the dark part (72) is performed by the operation of the second driving source (734a) of the second driving part (734) so that the body part (72b) moves along the second sliding part (734b). Then, as shown in (A) and (B) of FIG. 7, (C) and (D) of FIG. 8, the inversion driving part (710) rotates the pickup collet (700) 180° to invert the electronic component C (step S103). Due to the inertial force acting on the electronic component C at the time of inversion, the electronic component C that is adsorbed and supported may be displaced from the center, but as described later, the electronic component C is positioned in the center when it is transferred to the mounting head (31).

Next, as shown in (A) and (B) of Fig. 9, the arm portion (72) moves in the X-axis direction, thereby positioning the transfer head (71) at the mounting position OA (step S104). That is, the pickup collet (700) of the transfer head (71) comes to a position opposing the holding support portion (31b) of the mounting head (31) in the mounting mechanism (3). At this time, the movement of the arm portion (72) in the X-axis direction is performed by the operation of the first driving source (732a) of the first driving portion (732), thereby causing the moving body (733) to move along the first sliding portion (732b) from the pickup position to the mounting position OA. In addition, at this time, the mounting head (31) waits at a height position where the opposing distance between the lower surface of the holding support portion (31b) and the upper surface of the substrate S is a distance of several mm. The opposing gap at this time is larger than the first gap d1. The electronic component C, which is held and supported by suction, may be displaced from the center due to the inertial force acting on the electronic component C as a result of the movement of the transfer head (71), but as described later, the electronic component C is positioned at the center when it is transferred to the mounting head (31).

And, as shown in (C) of FIG. 9 and (A) of FIG. 10, by moving the arm portion (72) in the Z-axis direction, the distance between the holding support portion (31b) of the mounting head (31) and the opposing surface (701a) of the pickup collet (700) becomes the first interval d1 (step S105). At this time, the movement of the arm portion (72) is performed by operating the second driving source (734a) of the second driving portion (734) and moving the gas portion (72b) along the second sliding portion (734b) (see FIG. 8). And, as shown in (B) of FIG. 10 and (A) of FIG. 11, the suction of the mounting head (31) is initiated by the negative pressure generating circuit (step S106), the suction force of the pickup collet (700) is weakened, and the passage of a predetermined time is waited for (NO of step S107).

In this way, as indicated by the arrow of the dashed-dotted line in the drawing, a suction flow Q acts on the electronic component C by being pulled toward the center where the suction hole (31c) is located by the suction from the suction hole (31c) of the mounting head (31). That is, when suction is performed from the suction hole (31c), a suction flow Q is generated that sucks the surrounding gas from the entire circumference in the horizontal direction. This suction flow Q flows through the narrow gap between the holding support portion (31b) of the mounting head (31) and the electronic component C (see (B) and (C) of FIG. 10). At this time, a force is generated between the suction flow Q and the surface of the electronic component C to press the electronic component C from the outer periphery of the mounting head (31) toward the suction hole (31c) due to friction between the two. Since this force becomes larger the wider the area where the suction Q and the electronic component C face each other, when the electronic component C is misaligned from the center, the area of the surface of the electronic component C in the misaligned direction becomes larger, so this pressing force becomes larger than the area on the opposite side where the area is narrower (the pressing force is indicated by the dotted arrow in the drawing). Therefore, as shown in Fig. 10 (C) and Fig. 11 (B), the electronic component C is positioned so as to be attached closer to the center. At this time, the suction force that causes it to be sucked onto the opposing surface (701a) of the pickup collet (700) is weakened, so that the electronic component C moves more smoothly. In addition, since the suction from the opening (701d) of the porous member (701) continues while weakening, a force that pulls the electronic component C toward the center where the opening (701d) is located acts, so that the force that causes it to be attached closer to the center is strengthened.

After a predetermined period of time (an example of step S107), as shown in (D) of Fig. 10, the suction of the pickup collet (700) is released, and the arm portion (72) moves in the Z-axis direction, so that the distance between the holding support portion (31b) and the opposing surface (701a) becomes the second interval d2 (step S108). Then, the electronic component C is pulled to the holding support portion (31b) of the mounting head (31) and is held and supported (step S109). At this time, the electronic component C is subjected to a force that brings it close to the center of the holding support portion (31b) by the suction from the suction hole (31c), and furthermore, since the distance between the electronic component C and the holding support portion (31b) is very close, when the electronic component C is held and supported by the holding support portion (31b), there is almost no or very little chance of the position of the electronic component C being misaligned. Thereafter, as shown in (D) of Fig. 9, the arm portion (72) moves in a direction away from the holding support portion (31b), thereby releasing the electronic component C. At this time, the movement of the arm portion (72) is performed by operating the second driving source (734a) of the second driving portion (734) so that the gas portion (72b) moves along the second sliding portion (734b) (see Fig. 8).

In addition, as shown in (E) of Fig. 9, when the arm (72) moves toward the supply portion (6), the transfer head (71) retracts from directly below the holding support portion (31b). At this time, the movement of the arm (72) is performed by the operation of the first driving source (732a) of the first driving portion (732), so that the moving body (733) moves in the X-axis direction along the first sliding portion (732b) (see Figs. 2 and 8). In addition, since the transfer of the electronic component C to the holding support portion (31b) by the moving device (7) is performed at the mounting position OA, the stage (21) remains in the retracted state during the transfer in order to avoid interference with the transfer mechanism (73).

[Installation of electronic components]

Next, the mounting operation of the electronic component C will be described with reference to the explanatory drawing of Fig. 12 and the flowchart of Fig. 14. Here, as illustrated in Fig. 12 (A), the holding support part (31b) of the mounting head (31) that holds and supports the electronic component C as described above is located directly below the second imaging part (5). The first imaging part (4) captures an image of the mark m of the electronic component C held and supported by the mounting head (31) (step S201). The control device (8) determines the position of the electronic component C by determining the amount of misalignment between the position of the mark m captured by the first imaging part (4) and the reference position and operates the driving mechanism (32) so that the amount of misalignment is eliminated (step S202).

Next, as illustrated in (B) of Fig. 12, the substrate support mechanism (2) moves the stage (21) so that the mounting area B of the substrate S (this time, the mounting area B where the electronic component C is mounted) is positioned opposite to the electronic component C held and supported by the mounting head (31), i.e., the center of the mounting area B comes to the mounting position OA (step S203). Then, as illustrated in (B) of Fig. 3, the second imaging unit (5) captures the mark M of the substrate S visible in the transparent area T around the electronic component C beyond the mounting head (31) (step S204).

The control device (8) determines the position of the substrate S by determining the amount of misalignment between the position of the mark M captured by the second imaging unit (5) and the reference position and operating the driving mechanism (22) so that the amount of misalignment is eliminated (step S205). In addition, as shown in (C) of Fig. 11, the mounting head (31) is driven toward the substrate S by the driving mechanism (32), and the electronic component C held and supported by the mounting head (31) is mounted on the substrate S (step S206).

In this way, by repeating the operations of transferring the electronic component C from the wafer sheet WS, delivering the electronic component C to the mounting head (31), positioning the electronic component C and the substrate S, and mounting, the electronic component C is sequentially mounted in each mounting area B of the substrate S. The substrate S on which a predetermined number of electronic components C are mounted is returned by the substrate support mechanism (2) and stored in the unloader.

[Effectiveness]

(1) The mounting device (1) of the electronic component C of the present embodiment comprises a mounting head (31) that mounts an electronic component C, which is suction-held and supported by the negative pressure of the suction hole (31c), on a substrate S, a porous member (701) that non-contactly holds and supports the electronic component C by the negative pressure of the suction hole (701c) while emitting gas from a thin hole, a pickup collet (700) that picks up the electronic component C from a supply section (6) that supplies the electronic component C and transfers it to the mounting head (31), a moving device (7) that relatively moves the mounting head (31) and the pickup collet (700), and, while the electronic component C is non-contactly held and supported by the negative pressure of the suction hole (701c) together with the ejection of gas from the porous member (701), the moving device (7) causes the mounting head (31) and the pickup collet (700) to approach and mount to a predetermined distance. It has a control device (8) that causes suction by the head (31) to be performed, and after a predetermined time has elapsed at a predetermined interval, releases the suction of the pickup collet (700) to suction-hold and support the electronic component C on the mounting head (31).

In addition, in the method for mounting an electronic component C of the present embodiment, a pick-up collet (700) having a porous member (701) that non-contactably holds and supports an electronic component C by the negative pressure of a suction hole (701c) while emitting gas from a thin hole picks up an electronic component C from a supply section (6) of the electronic component C by non-contactly holding and supporting it, and a moving device (7) brings a mounting head (31) that mounts the electronic component C on a substrate S and a pickup collet (700) that picks up and inverts the electronic component C close to a predetermined interval, initiates suction by the negative pressure of a suction hole (31c) provided in the mounting head (31), and after a predetermined time has elapsed at a predetermined interval, the suction of the pickup collet (700) is released, so that the mounting head (31) suctions and holds the electronic component C.

For this reason, in this embodiment, when the electronic component C is picked up non-contactly by the pickup collet (700) and transferred to the mounting head (31), the positioning can be determined in the suction hole (701c). Here, when the electronic component C is picked up non-contactly by suction by the suction hole (31c) while ejecting gas from the porous member (701), the electronic component C becomes easy to move within the area surrounded by the guide portion (703).

However, in the present embodiment, since the mounting head (31) determines the position of the electronic component C in which misalignment has occurred by pulling it into the suction hole (31c) and then receives the electronic component C, the holding and supporting position of the electronic component C by the mounting head (31) is made constant, and it is possible to suppress time consuming or errors increasing in the position recognition by imaging of the mark m of the electronic component C and the subsequent correction movement. Furthermore, the positional misalignment during mounting can be reduced. In addition, even if the horizontal or θ-direction misalignment of the holding and supporting position by the mounting head (31) is not completely corrected, the amount of movement when performing position correction by the position determination of the electronic component C by the marks m and M as described above can be reduced, so that more accurate mounting is possible.

In addition, if the mounting head (31) continues to perform suction before receiving the electronic component C, it will continue to suck in surrounding dust, affecting the nearby electronic component C. However, in the present embodiment, since the suction is initiated by the negative pressure of the suction hole (31c) after the mounting head (31) and the pickup collet (700) approach a predetermined distance, the time for sucking dust can be minimized, thereby reducing the impact on the electronic component C.

(2) The suction hole (31c) is provided at the center of the suction area D of the electronic component C of the mounting head (31), and the predetermined time is the time for the center of the electronic component C, which is held and supported by the pickup collet (700), to be pulled within a predetermined allowable range to the center of the suction area D. Therefore, the electronic component C can move horizontally with respect to the holding support member (31b) of the mounting head (31), and after securing the time for being positioned at the center, it can be transmitted to the mounting head (31). Therefore, the possibility of being positioned at the center of the suction area D can be increased.

(3) The predetermined interval is set to be a first interval d1 and a second interval d2 smaller than the first interval d1, and the control device (8) moves the mounting head (31) and the pickup collet (700) to the moving device (7) from the first interval d1 to the second interval d2, and in a state of the first interval d1, suction is performed by the suction of the mounting head (31) for a predetermined time, and in a state of the second interval d2, suction of the pickup collet (700) is released.

For this reason, by setting the first interval d1, the electronic component C can move horizontally with respect to the holding support member (31b), and a state in which it is attracted to the suction hole (31c) and positioned is secured, and then by setting the second interval d2, the electronic component C can be held and supported by the mounting head (31) in a very close state. Accordingly, the change in the attitude (XYθ) of the electronic component C during transmission of the electronic component C can be minimized, and the amount of movement when performing position correction by positioning the electronic component C by marks m, M, etc. can be reduced, so that more accurate mounting becomes possible.

In addition, when the suction of the mounting head (31) is initiated, there are cases where the suction force for the electronic component C becomes strong momentarily. In such a case, the electronic component C may jump up, and there is a possibility that unintended contact with the mounting head (31) or falling due to release from the pickup collet (700) may occur. Therefore, by initiating the suction of the mounting head (31) at a first interval d1 in which the distance between the mounting head (31) and the electronic component C is relatively long, the strong suction force that momentarily acts on the electronic component C is suppressed, and the position is determined in a stable state, and then the mounting head (31) can be held and supported by setting the second interval d2.

In addition, the initiation of the suction of the mounting head (31) should be able to avoid a period in which the suction force becomes instantaneously strong by rapidly starting the suction along with the initiation of the suction force. Therefore, the suction may be initiated before the first interval d1 is reached. Even just before the first interval d1 is reached, if the period in which the suction force becomes instantaneously strong has passed, then the proximity is considerably large, so that the surrounding dust is continuously sucked in, thereby not affecting the nearby electronic component C. Therefore, "causing the mounting head and the pickup collet by the moving device to approach to a predetermined interval and suction by the mounting head" includes a period in which the initiation of the suction of the mounting head (31) becomes immediately before the predetermined interval or when the predetermined interval has become.

In addition, the second interval d2 does not necessarily have to be set. The electronic component C may be held and suctioned while the first interval d1 is maintained. When the suction of the pickup collet (700) is stopped and the electronic component C is suctioned to the holding support member (31b), if damage to the electronic component C is within an allowable range or if misalignment occurs, it is possible to perform the suction holding and suction without transitioning to the second interval d2. In addition, by gradually stopping the suction of the pickup collet (700), the movement of the electronic component C when suctioned can be made gentle, so that impact or positional misalignment can be suppressed. At this time, a flow rate adjustment mechanism or a suction pressure adjustment mechanism that controls the suction may be provided to weaken the suction at the holding support member (31b). Weakening the suction of the holding support member (31b) and gradually weakening the suction of the pickup collet (700) and stopping may be performed simultaneously and in parallel. In this case, since there is no need to move to the second interval d2 or to stop, the tact time can be shortened. In addition, depending on which of the damage or misalignment of the electronic component or the tact time is given priority, a mode that can select whether to hold and support by suction at the first interval d1 or by holding and suction at the second interval d2 can be set in the control device (8).

(4) In this embodiment, when the electronic component C is transferred, the suction force of the pickup collet (700) is weakened when the mounting head (31) is sucked at a predetermined interval. Therefore, the vertical pulling force of the pickup collet (700) is weakened, and the electronic component C becomes easier to move horizontally, and the suction and holding support of the electronic component C by the mounting head (31) becomes smooth.

[Variations]

(1) In the above aspect, when the mounting head (31) approaches the electronic component C, the holding support member (31b) performs suction to attract the electronic component C. However, depending on the distance between the electronic component C and the holding support member (31b), the resistance when the gas flows is large, and depending on the size of the electronic component C, there is a concern that sufficient airflow may not be obtained. Therefore, as illustrated in Fig. 15, a jet port (31d) for jetting gas toward the outer periphery of the electronic component C may be provided in the mounting head (31). For example, a through hole inclined in the holding support member (31b) of the mounting head (31) toward the outer periphery of the electronic component C is provided as the jet port (31d). A gas supply circuit (not illustrated) is connected to the jet port (31d), and gas is jetted from the bottom surface side of the holding support member (31b) toward the outer periphery of the electronic component C. Thereby, it becomes easy to attach the electronic component C closer to the center. In this way, by ejecting gas from the outer peripheral side of the holding support member (31b) and supplying the gas to the outer peripheral part of the electronic component C to increase the air pressure, it becomes easy to secure the necessary air flow. Therefore, as long as the necessary gas can be supplied, the ejection port (31d) does not necessarily have to be inclined so as to face the outer peripheral part of the electronic component C.

(2) In the above aspect, the moving device (7) approaches the mounting head (31) by moving the pickup collet (700) at the mounting position OA (see Fig. 9). However, the movement should be relative, and the pickup collet (700) may be approached by the moving device that moves the mounting head (31), or the two may be approached by the moving device that moves both. For example, the height may be fixed at the inverted position of the pickup collet (700), and the mounting head (31) may be lowered to perform transmission.

(3) The guide portion (703) of the pickup collet (700) may be provided along the outer edge of the opposing surface (701a) so as to control the movement of the electronic component C. That is, it may be provided so as to control the movement of the electronic component C to the extent that the electronic component C falls out of the pickup collet (700) due to movement or reversal of the pickup collet (700). For this reason, the guide portion (703) may be provided on the four sides of the opposing surface (701a), and may be provided over the entire periphery of the opposing surface (701a) or may be provided on a part of each side. For example, as illustrated in (A) of Fig. 16, the guide portions (703) may be arranged with corners interposed therebetween, or as illustrated in (B) of Fig. 16, the guide portions (703) may be arranged continuously along the corners. In addition, as shown in (B) of Fig. 14, there are cases where one orthogonal guide part (703) and the other orthogonal guide part (703) are continuous.

In addition, a pickup collet (700) without a guide portion (703) may be used. In this case, misalignment of the electronic component C is likely to occur, but a large misalignment can be corrected by positioning by the above suction.

(4) The number and size of the suction holes (701c) and openings (701d) are not limited to the above-mentioned embodiments. By balancing the area where the electronic component C is supported by the gas layer on the opposing surface (701a) of the porous member (701) and the total area of the openings (701d), it is possible to realize maintenance of the suction holding support state and the non-contact state.

(5) The position and shape of the suction hole (701c) and the opening (701d) are not limited to the above-mentioned aspect. For example, the shape of the opening (701d) may be a circle or a rectangle, or may be an oval, a polygon, a polygon with rounded corners, a star, etc.

(6) The pickup collet (700) is provided to be exchangeable, so that it can be exchanged according to the shape and size of the electronic component C. As for the configuration that enables exchange, the structure that can be held and supported by magnets is simple, and the exchange operation is also easy. However, any configuration that allows the pickup collet (700) to be exchangeable is sufficient. For example, it may be an adsorption holding support using negative pressure, or a structure that holds and supports mechanically may be used.

(7) The supply unit (6) is not limited to a device that supplies electronic components C attached to a wafer sheet WS. For example, it may be a device that supplies electronic components C arranged on a tray. In addition, regarding the configuration of the transport mechanism (73), it is sufficient as long as it can individually pick up and transport electronic components C from the supply unit (6). For this reason, it may be a configuration in which the arm portion (72) moves in the X-axis and Y-axis directions, or a configuration in which the support mechanism (61) moves in the X-axis and Y-axis directions.

(8) In the transport mechanism (73), the driving unit that drives the arm (72) is not limited to a mechanism that uses a linear motor as a driving source. It may be a mechanism using a ball screw or belt that uses a motor whose shaft rotates as a driving source. In the case of such a mechanism, since the sliding unit SL is included, it is preferable to provide it at a position where there is no overlap with the loading surface F when viewed from a plan view. In addition, it is preferable to provide the sliding unit SL at a position lower than the height position of the loading surface F. In addition, in the case where there are multiple sliding units SL, some of the sliding units SL do not have to be provided at a position where there is no overlap with the loading surface F when viewed from a plan view. In addition, some of the sliding units SL do not have to be provided at a position lower than the height position of the loading surface F. In such a case, it is preferable to provide a shield such as an exterior, a wall, or another component between the sliding unit SL and the loading surface F. In addition, it is preferable to make the distance between the sliding unit SL and the loading surface F long.

(9) The mounting head (31) may be configured so that the second imaging unit (5) can capture the mark M of the substrate S. Therefore, even if the transparent portion of the mounting head (31) is not formed of a transparent material, a through hole may be formed at a location corresponding to the mark M. More specifically, the holding support unit (31b) may be formed of an opaque material, and a through hole may be formed at a location corresponding to the mark M, or the hollow portion (31a) may not exist, and further, the holding support unit (31b) may be formed of an opaque material, and a through hole may be formed at a location corresponding to the mark M of the mounting head (31) and the holding support unit (31b). In other words, such a through hole is also a transparent portion of the mounting head (31).

(10) The first imaging unit (4) or the second imaging unit (5) may be provided so as to be movable with respect to the position where the electronic component C is mounted (mounting position OA). That is, in a case where multiple marks m of the electronic component C or multiple marks M of the substrate S cannot be imaged at once, the first imaging unit (4) or the second imaging unit (5) may be configured to move between the marks m or between the marks M to image. That is, a movement device for moving between the marks m may be provided in the first imaging unit (4), or a movement device for moving between the marks M may be provided in the second imaging unit (5). Even in this case, since the movement distance is short and remains within the range of the size of the mounting area B of the electronic component C or the substrate S, errors and oscillations can be suppressed. Since the imaging magnification can be selected according to the required mounting precision, the position recognition precision can be improved.

(11) In the above embodiment, the position of the mark m of the electronic component C and the position of the mark M of the mounting area B of the substrate S are respectively aligned to the reference position (mounting position OA), but the present invention is not limited thereto, and the position of the mounting area B may be aligned with the position of the electronic component C, or the position of the electronic component C may be aligned with the position of the mounting area B. In short, it is sufficient as long as the position of the mounting area B of the substrate S and the position of the electronic component C can be aligned. The stage (21) does not move by a correction amount for position alignment, and when the position of the substrate S and the electronic component C is aligned, there is no need to move the relatively large and heavy stage (21) for the position alignment of each mounting area B, so that the mounting precision can be further increased while also shortening the time for position correction.

(12) The transfer of the substrate S to the stage (21) of the substrate support mechanism (2) may be performed at the mounting position OA. In this case, after the substrate S is supplied to the stage (21), the substrate S may be withdrawn from the mounting position OA prior to imaging of the mark m of the electronic component C by the first imaging unit (4).

2. Second embodiment

A second embodiment of the present invention will be described with reference to FIGS. 17, 18, and 19. The second embodiment adopts a mounting head (31) different from that of the first embodiment. Since other parts are the same as those of the first embodiment, description of parts other than the mounting head (31) will be omitted. FIG. 17 is a plan view showing an example of the mounting head (31) adopted in the second embodiment, in which a pickup collet (700) that holds and supports an electronic component C in a non-contact manner is approaching the mounting head (31). FIG. 18 is a cross-sectional view showing the appearance. FIG. 17 is a schematic diagram showing the mounting head (31) through the mounting head (31) side.

[composition]

In the second embodiment, as illustrated in Fig. 17, two suction holes (311c) and a suction hole (312c) are provided in the holding support member (31b) provided in the mounting head (31). The suction holes (311c) and the suction holes (312c) are arranged symmetrically with respect to the center of the suction area D in the mounting head (31). For example, the two suction holes (311c) and the suction holes (312c) are arranged at positions symmetrical (linearly symmetrical) with respect to a straight line passing through the center of the suction area D. At this time, the straight line passing through the center of the suction area D can be extended in a direction that becomes a direction required when mounting the electronic component C on the substrate S. In Fig. 17, it becomes a line (not illustrated) that is orthogonal to the center line extending vertically in the drawing.

In addition, if it is line symmetrical, the number of suction holes provided in the holding support member (31b) does not have to be two, and the number may be increased or decreased according to the size of the electronic component C. At that time, in the assumed maximum misalignment state of the electronic component C immediately before the mounting head (31) is transferred from the pickup collet (700), it is preferable that the suction holes (311c and 312c) are positioned so that they do not protrude from the electronic component C. In addition, in order to balance the suction force, it is preferable that the number of suction holes and the distance from the center be the same. In addition, even in the case where there is a difference in the number of suction holes in the direction along the straight line passing through the center of the suction area D, the suction force may be balanced by adjusting the distance from the center point according to the number of suction holes. In addition, the same applies to the case of the direction intersecting the straight line passing through the center of the suction area D.

The arrangement of each suction hole is preferably such that the sucked electronic component moves toward the center of the suction area D of the mounting head (31), and is line-symmetrical with respect to a straight line in a direction that coincides with the longitudinal and transverse center lines of the suction area D, and is preferably point-symmetrical with equidistance and equiangularity with respect to the center point of the suction area D.

In addition, in the second embodiment, as illustrated in (A) of Fig. 20, the suction holes are formed at equal distances and equal angles (180 degrees) from the center of the suction region, but as illustrated in (B to H) of Fig. 20, even when more than two are provided, each suction hole may be arranged at equal distances and equal angles from the center of the suction region. For example, as illustrated in (C) of Fig. 20, in the case of four, the angles may be 90 degrees, etc.

[Action]

In the second embodiment having such a configuration, when gas is sucked in from the suction holes (311c) and (312c) provided symmetrically with respect to the center of the mounting head (31), the mounting head (31) generates a suction flow Q that flows from the outer periphery of the mounting head (31) toward the suction holes (311c) and (312c) on the center side in order to suck in surrounding gas from the entire horizontal periphery. This suction flow Q flows in the gap between the surface of the electronic component C supported by the air flow G ejected from the pores of the porous member (701) and the holding support portion (31b) of the mounting head (31), as illustrated in Fig. 18.

At this time, a force is generated between the suction flow Q and the surface of the electronic component C due to friction between the two to press the electronic component C from the outer periphery of the mounting head (31) toward the suction hole (311c) and the suction hole (312c). Since this force increases as the area where the suction flow Q and the electronic component C face each other is wide, when the centers of the electronic component C and the mounting head (31) are misaligned as in (A) of Fig. 18, the greater the misalignment and the wider the contact area with the suction flow Q as shown on the right side of the drawing, the more the force of the suction flow Q is received, and the electronic component C is strongly pressed toward the suction hole (311c) and the suction hole (312c), that is, toward the center of the mounting head (31).

Since this action occurs over the entire periphery of the electronic component C as illustrated in Fig. 17 (A), as a result, the electronic component C is placed at the center of the mounting head (31), as illustrated in Fig. 17 (B). In particular, in the second embodiment, by providing two or more suction holes (311c) and suction holes (312c) symmetrically with respect to the center of the holding support member (31b), even if the electronic component C is misaligned in a certain direction, the force V of each suction hole (311c, 312c) that pulls the electronic component C is naturally balanced according to the position or rotational misalignment of the electronic component C. In addition, as the interval between the suction holes becomes wider, the distance from the support point to the force point becomes longer, so that the angle correction (pulling) force becomes larger.

As a result, the electronic component C is pulled toward the center of the mounting tool by the suction flow Q from two suction holes symmetrical to the center of the mounting tool, and the misalignment in the rotational direction is also balanced by the two suction holes, so that the required posture is assumed and the rotational misalignment is resolved.

[effect]

In this way, by providing two or more suction holes symmetrically about the center of the holding support member (31b) in the holding support member (31) of the mounting head (31), when the electronic component C is transferred from the pickup collet (700) to the mounting head (31), the posture (horizontal position or rotation) of the electronic component C held and supported in a non-contact manner by the pickup collet (700) can be corrected to an angle according to the shape of the holding support member (31b) with respect to the center of the holding support member (31b). Therefore, when there are two or more suction holes rather than one, it becomes possible to receive the electronic component C from the pickup collet at a more appropriate position in the holding support member (31b) of the mounting head (31). The electronic component C held and supported in a non-contact manner by the pickup collet (700) is likely to move or rotate during transport or reversal, but even if these movements or rotations occur, it can be brought into a state of a required posture. In addition, it is possible to prevent the electronic component C being held and supported by the holding support member (31b) from freely rotating. As a result, the mounting head (31) is able to always hold and support the electronic component C at a constant position/rotational position, thereby enabling higher-precision mounting.

In addition, by using multiple suction holes, the posture of the electronic component C is made as required, so the force acting on the electronic component C is increased, and the predetermined time, which is the time during which the center of the electronic component C, held and supported by the pickup collet (700), is pulled within a predetermined allowable range at the center of the suction area D, can be shortened. As a result, the tact time can be shortened, and productivity can be improved.

In particular, by arranging a plurality of suction holes in a state symmetrical (linear symmetry) with respect to a straight line passing through the center of the suction area D in the direction required for mounting, i.e., a straight line passing through the center of the holding support member (31b), the posture (position, direction) of the electronic component C can be corrected to the required state more reliably and quickly. As a result, mounting with higher precision can be performed.

3. Other embodiments

The present invention is not limited to the above-described embodiments, and can be concretized by modifying the components within a scope that does not deviate from the gist of the invention during the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the above-described embodiments. For example, some components may be deleted from all components shown in the embodiments. In addition, components across different embodiments may be appropriately combined.

Another example of the arrangement of the suction holes is shown in Fig. 19. In addition, each suction hole is indicated by a circle in (A) to (O) of Fig. 19. As shown in (A) to (O) of Fig. 19, they may be arranged in a horizontal row or a vertical row, or they may be arranged to cross, and furthermore, a plurality of suction holes may be arranged at the vertices of a square, a rectangle, a rhombus, or the like, or at positions along the sides thereof. In addition, they may be arranged so as to have various other linear symmetries not included in Fig. 19. The arrangement is sufficient as long as the electronic component C is pulled in a posture (position, direction) required for mounting the electronic component C on the substrate S when it is transferred from the pickup collet (700) to the holding support member (31b) by suction.

For example, when a plurality of suction holes are arranged in a straight line and the electronic component C is misaligned in the rotational direction so as to intersect the direction in which the straight line extends, the direction of the electronic component C is corrected so as to follow the straight line along which the suction holes are arranged. In addition, the misalignment of the electronic component C in the horizontal direction (XY direction) causes the center position of the electronic component C to be pulled toward the center position of the arrangement of the plurality of suction holes. This effect is as illustrated in Figs. 17 and 18. The arrangement of Fig. 19 (A) is the same as the arrangement of Fig. 17 with the direction changed by 90°. The same effect is achieved. The arrangement of Fig. 19 (D) is considered to be the same as Fig. 17. Therefore, the same effect is achieved.

Figs. 19(B), (E), and (J) can also be considered to be the same as these, and exhibit similar effects. However, since the number of suction holes is large, the horizontal or rotational corrective force acts strongly. Therefore, this corrective force acts stronger in Fig. 19(B) than in Fig. 19(A), and stronger in Fig. 19(J) than in Fig. 19(B). Fig. 19(E) acts stronger than in Fig. 19(D). As a result, the posture can be corrected more reliably and quickly.

(C) and (D) of Fig. 19 show that four suction holes are arranged so as to be symmetrical with respect to the direction in which the line indicated by the dotted line in Fig. 19 (the line passing through the center of the suction region D) extends and the direction intersecting the line, in this case, the orthogonal direction. Further, the centers of the four suction holes are arranged so as to coincide with the center of the suction region D. In either case, as in Fig. 17, the electronic component C can be attracted in the direction along the line passing through the center of the suction region D and toward the center of the suction region D.

In addition to exhibiting the same effect as in Fig. 17, by departing from the center of the adsorption area D in a direction orthogonal to the direction in which the line passing through the center of the adsorption area D extends, the corrective force in the rotational direction becomes stronger. Therefore, the electronic component C can be corrected to the desired posture more reliably and quickly. The same effect is exhibited in (G), (H), (I), (K), (L), (M), (N), and (O) of Fig. 19. Therefore, the same effect is exhibited in various arrangements that are symmetrical with respect to the line passing through the center of the adsorption area D according to the desired posture of the electronic component C.

In addition, as in these, in Fig. 19, when the distance from the center of the suction area D to the suction hole in the direction in which the line indicated by the dotted line extends is longer than the distance in the direction orthogonal to this line, the longer the distance, the greater the correction force, especially in the rotational direction, so that the desired posture of the electronic component C can be achieved more reliably and quickly. Accordingly, the correction force is stronger in Fig. 19 (F) than in Fig. 19 (C), and the correction force is stronger in Fig. 19 (L) than in Fig. 19 (K). That is, the posture of the electronic component C can be corrected more reliably and quickly.

Of course, in the case where a suction hole is provided at the center of the suction area D, as in (B), (E), (K), (L), (N), and (O) of Fig. 19, a strong corrective force acts to position the electronic component C at the center of the suction area D. Therefore, the electronic component C can be positioned in the desired position more reliably and quickly.

In addition, when arranging three suction holes, at least one suction hole may be provided on a line passing through the center of the suction area D, and more preferably, as shown in (H) of Fig. 19, a suction hole located at one vertex may be provided on a line passing through the center of the suction area D, and the other two suction holes may be provided symmetrically to the line passing through the center of the suction area D in a direction perpendicular to this line.

In this way, the same effect as in Fig. 17 can be achieved. In addition, in this case, since the center of the electronic component C is pulled toward the two suction holes, the electronic component C can be positioned so that it is misaligned by taking that into account so that it can be positioned at the center of the suction area D.

As for the corrective force in the direction of rotation, it is better if the distance between the suction hole located at the vertex and other suction holes is spaced apart, so it is better to make the triangle with three suction holes as vertices an isosceles triangle.

1: Mounting device
2: Substrate support mechanism
3: Mounting mechanism
4: 1st camera section
5: 2nd camera section
6: Supply Department
7: Moving device
8: Control device
11: Support
11a: Receiving hole
21: Stage
22: Driving mechanism
22a, 22b, 33a, 34a, 35a, 62a, 62b: Guide rail
23: Moving plate
23a: Through hole
31: Head of the real thing
31a: Hollow section
31b: Holding support
31c: suction hole
311c, 312c: Suction hole
31d: spout
32: Driving mechanism
33, 34, 35: Mobile
61: Support mechanism
61a: Ring holder
62: Driving mechanism
71: Transfer head
71a: Suction nozzle
71b: Reverse drive unit
72: Dark part
72a: Extended projection
72b: Airframe
73: Transport mechanism
700: Pickup Collet
701: Porous Absence
701a: Opposite side
701b: Back
701c: Suction hole
701d: Opening
702: Base
702a: Intake hole
702b: exhaust hole
702c: Mounting holes
703: Guide Department
704: Detachable part
704a: pin
731: Fixed body
732: 1st drive unit
732a: 1st drive source
732b: 1st sliding section
733: Mobile
734: 2nd drive unit
734a: Second drive source
734b: Second sliding section
OA: Field location
B: Field area
C: Electronic components
D: Adsorption area
F: Loading surface
M, m: Mark
S: Base
T: Transmission area
WS: Wafer sheet
Q: Suction Q
V: The force that pulls the electronic component C

Claims (8)

A mounting head that mounts electronic components supported by suction by the negative pressure of the suction hole onto a substrate,
A porous member having a porous member that non-contactly holds and supports the electronic component by the negative pressure of the suction hole while emitting gas from a hole on an opposing surface facing the electronic component, and a pickup collet that picks up the electronic component from a supply section that supplies the electronic component and transfers the electronic component to the mounting head;
A moving device that moves the above-mentioned mounting head and the above-mentioned pickup collet relative to each other,
A control device that causes the mounting head and the pickup collet to approach each other to a predetermined distance by the moving device and to be sucked by the mounting head while the electronic component is held and supported in a non-contact manner by the negative pressure of the suction hole, along with the ejection of gas from the porous member, and after a predetermined time has elapsed at the predetermined distance, releases the suction of the pickup collet to hold and suck the electronic component by the mounting head.
An electronic component mounting device characterized by having a . In the first paragraph,
The above suction hole is provided in the center of the suction area of the electronic component of the mounting head,
An electronic component mounting device, characterized in that the above-described predetermined time is a time during which the center of the electronic component held in the pickup collet at the center of the suction area is pulled within a predetermined allowable range. In the first paragraph,
The above suction holes are provided symmetrically in multiple portions with respect to a line passing through the center of the suction area of the electronic component of the mounting head,
An electronic component mounting device, characterized in that the above-described predetermined time is a time during which the center of the electronic component held in the pickup collet at the center of the suction area is pulled within a predetermined allowable range. In the first paragraph,
The above suction holes are provided in multiples at equal distances and at equal angles from the center of the suction area of the electronic component of the mounting head,
An electronic component mounting device, characterized in that the above-described predetermined time is a time during which the center of the electronic component held in the pickup collet at the center of the suction area is pulled within a predetermined allowable range. In the first paragraph,
The above predetermined interval is set to include a first interval and a second interval smaller than the first interval,
The above control device,
In the above moving device, the mounting head and the pickup collet are moved from the first interval to the second interval,
In the state of the first interval above, for a predetermined time, suction is performed by the mounting head,
An electronic component mounting device characterized in that the suction of the pickup collet is released in the state of the second gap. In any one of paragraphs 1 to 5,
An electronic component mounting device characterized in that, when the electronic component is delivered, the suction force of the pickup collet is weakened when the mounting head sucks at the predetermined interval. In any one of paragraphs 1 to 5,
An electronic component mounting device, characterized in that the mounting head has a nozzle for emitting gas to the outer periphery of the electronic component. A pick-up collet having a porous member that ejects gas from a hole on an opposing surface facing the electronic component while holding and supporting the electronic component in a non-contact manner by the negative pressure of the suction hole picks up the electronic component from the supply portion of the electronic component by holding and supporting it in a non-contact manner.
The moving device brings the mounting head, which mounts the electronic component on the substrate, and the pickup collet, which picks up and inverts the electronic component, close to a predetermined distance,
Initiate suction by negative pressure of the suction hole provided in the above-mentioned mounting head,
By releasing the suction of the pickup collet after a predetermined time has elapsed at the predetermined interval, the mounting head suction-holds and supports the electronic component.
A method for mounting an electronic component, characterized by: