KR102726347B1 - High voltage diode module and system including the same - Google Patents

Abstract

According to various embodiments of the present invention, a high voltage diode module is disclosed, which includes a lower substrate, at least two insulating blocks spaced apart from each other on an upper surface of the lower substrate and configured to prevent electrical short circuits, an upper substrate disposed on top of the insulating blocks, a plurality of terminal pins attached and fixed to the upper surface of the upper substrate, and at least one high voltage diode attached and fixed to the lower surface of the upper substrate.
By applying a high-voltage diode module and a system including the same, a gap adjusting unit is provided so that the gap between substrates can be adjusted in response to the sizes and shapes of various high-voltage diodes, and an efficient heat dissipation structure can be achieved.

Description

HIGH VOLTAGE DIODE MODULE AND SYSTEM INCLUDING THE SAME

The present invention relates to a high voltage diode module and a system including the same.

The material described in this section merely provides background information for the present embodiment and does not constitute prior art.

High voltage diode modules can be used for the purpose of rectifying the high voltage of the boosted AC component.

High-voltage diode modules are generally used as bridge circuits, doublers, and center taps in power supplies, and are used in various industrial fields including automobiles, medical devices, communication equipment, and microwave ovens.

For high-voltage diode modules, heat dissipation performance, insulation strength, and durability are evaluated as important factors in determining their performance.

In particular, when the high-voltage diode module is used as a bridge circuit, a huge amount of heat is generated during the rectification process when alternating current (AC) is converted to direct current (DC). This heat must be dissipated as quickly and effectively as possible, otherwise the diode may be damaged in a relatively short period of time.

In addition, the above-mentioned insulation strength is necessary because the high-voltage diode module is used at several kV to several tens of kV, and if the insulation strength is not maintained, the desired performance cannot be achieved. In particular, in diode module structures that require a specific shape or form, the need for a method to strengthen the insulation strength while minimizing deformation of the shape or size is emerging.

Accordingly, the need for high-voltage diode modules with enhanced insulation strength, enhanced heat dissipation performance, and enhanced durability is increasing.

In addition, there is a problem that high-voltage diode module-related parts corresponding to each diode of various sizes must be manufactured and designed separately.

Republic of Korea Patent Publication No. 10-1002913 (December 15, 2010)

The purpose of the present invention is to provide a high voltage diode module and a system including the same.

Another object of the present invention is to provide a high-voltage diode module having a gap adjusting unit that can adjust the gap between substrates to correspond to the sizes and shapes of various high-voltage diodes and have an efficient heat dissipation structure, and a system including the same.

Additional, unspecified objects of the present invention may be additionally considered within a scope that can be easily inferred from the following detailed description and its effects.

According to one embodiment of the present invention for achieving the above-described purpose, a high-voltage diode module includes: a lower substrate; an upper substrate disposed on an upper surface of the lower substrate; a plurality of terminal pins attached and fixed to an upper surface of the upper substrate; and at least one high-voltage diode attached and fixed to a lower surface of the upper substrate.

Here, it is characterized by further including at least two insulating blocks spaced apart at a certain interval on the upper surface of the lower substrate and preventing electrical short circuit.

Here, the lower substrate is made of a metal material, the insulating block is made of a ceramic material, the upper substrate is a printed circuit board, and each of the plurality of terminal pins provided on the upper substrate is provided to be spaced apart at a set interval with a spacer hole or a spacer groove therebetween.

Here, the high-voltage diode module is characterized by having a bridge rectifier circuit structure according to the connection form of the electrodes of the high-voltage diode and the plurality of terminal pins.

Here, the at least two insulating blocks and the lower substrate are characterized in that they are joined using a soldering joint, a brazing joint, or a joining method using an adhesive.

Here, the internal space of the high-voltage diode module is characterized by being potted with a potting solution.

Here, it is characterized by further including at least one gap adjusting unit that adjusts the gap between the upper substrate and the lower substrate corresponding to the shape of the high voltage diode.

Here, the gap adjusting unit is characterized by including: a ring cover positioned on the lower surface of the upper substrate and having a first through hole formed therein; a gap adjusting screw which is forcibly fitted into the first through hole through a bearing, has a second through hole formed therein, and has a first female thread formed in the second through hole; and a gap adjusting bolt whose head is positioned on the upper surface of the upper substrate, whose length penetrates all of the upper substrate, the ring cover, and the gap adjusting screw, has a first male thread formed on the outside, and rotates while engaging with the first female thread.

Here, the lower substrate has a second female screw thread formed at a position corresponding to the gap adjustment screw, the gap adjustment screw has a second male screw thread formed on the outside, and the gap adjustment part adjusts the gap between the upper substrate and the lower substrate in such a way that when the gap adjustment bolt is rotated, the first male screw thread rotates while engaging with the first female screw thread, and in response, the second male screw thread rotates while engaging with the second female screw thread.

According to an embodiment of the present invention for achieving the above-described purpose, a high-voltage diode module system includes a high-voltage diode module including a lower substrate, an upper substrate disposed on an upper surface of the lower substrate, a plurality of terminal pins attached and fixed to an upper surface of the upper substrate, and at least one high-voltage diode attached and fixed to a lower surface of the upper substrate; and a case for packaging the high-voltage diode module.

Here, the high voltage diode module is characterized by including at least two insulating blocks spaced apart at a certain interval on the upper surface of the lower substrate and preventing electrical short circuit.

Here, the lower substrate is made of a metal material, the insulating block is made of a ceramic material, the upper substrate is a printed circuit board, and each of the plurality of terminal pins provided on the upper substrate is provided to be spaced apart at a set interval with a spacer hole or a spacer groove therebetween.

Here, the high voltage diode module is characterized by including at least one gap adjusting unit that adjusts the gap between the upper substrate and the lower substrate corresponding to the shape of the high voltage diode.

As described above, according to one embodiment of the present invention, by applying a high-voltage diode module and a system including the same, a gap adjusting unit is provided so as to adjust the gap between substrates in response to the sizes and shapes of various high-voltage diodes, and an efficient heat dissipation structure can be provided.

Even if an effect is not explicitly mentioned herein, the effect and its provisional effect described in the following specification expected by the technical features of the present invention are treated as described in the specification of the present invention.

Figure 1 is a block diagram schematically illustrating the configuration of a high-voltage diode module according to the prior art.
FIG. 2 is a block diagram schematically illustrating the configuration of a high-voltage diode module according to one embodiment of the present invention.
FIG. 3 is a drawing showing a high-voltage diode module according to an embodiment of the present invention from various angles.
FIG. 4 is a drawing for explaining in detail a gap adjusting unit according to one embodiment of the present invention.
FIG. 5 is a drawing for explaining the configuration of a high-voltage diode module according to the form of a high-voltage diode according to one embodiment of the present invention.
FIG. 6 is a diagram for explaining a circuit of a high-voltage diode module according to one embodiment of the present invention.
FIG. 7 is a drawing for explaining the configuration of a high-voltage diode module system according to one embodiment of the present invention.
FIGS. 8 and 9 are drawings for explaining a process for manufacturing a high-voltage diode module system according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The advantages and features of the present invention, and the methods for achieving them, will become clear with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and these embodiments are provided only to make the disclosure of the present invention complete and to fully inform those skilled in the art of the invention of the scope of the invention, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification. Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used in a meaning that can be commonly understood by those skilled in the art of the present invention. In addition, terms defined in commonly used dictionaries shall not be ideally or excessively interpreted unless explicitly specifically defined. The terms used in this application are used only to describe specific embodiments and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but should be understood as not excluding in advance the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. Terms including ordinal numbers such as second, first, etc. may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a second component may be referred to as a first component, and similarly, a first component may also be referred to as a second component. The terms and/or include a combination of a plurality of related described items or any item among a plurality of related described items.

In this specification, the identification symbols (e.g., a, b, c, etc.) for each step are used for convenience of explanation, and the identification symbols do not describe the order of each step, and each step may occur in a different order than the stated order unless the context clearly indicates a specific order. That is, each step may occur in the same order as the stated order, may be performed substantially simultaneously, or may be performed in the opposite order.

In this specification, the expressions “have,” “may have,” “include,” or “may include” indicate the presence of a given feature (e.g., a component such as a number, function, operation, or part), and do not exclude the presence of additional features.

Figure 1 is a block diagram schematically illustrating the configuration of a high-voltage diode module according to the prior art.

Referring to FIG. 1, a conventional high-voltage diode module comprises a base substrate, an intermediate substrate arranged on an upper portion of the base substrate and having at least one electrode printing portion on a portion of an upper surface, and a groove or protrusion surrounding the at least one electrode printing portion, an upper substrate arranged on an upper portion of the intermediate substrate and having at least two terminals attached and fixed to an upper surface, and at least one high-voltage diode arranged between the intermediate substrate and the upper substrate.

Rectifying voltage through diodes is a very common technology, and rectifying high voltage is affected by the characteristics of the diode (withstand voltage, switching speed, and allowable current, etc.). The purpose of a high-voltage diode module is to rectify the required high voltage by connecting several high-voltage diodes. A high-voltage diode module is manufactured in the form of a module rather than a single diode to use one or more high-voltage diodes for various circuit types (bridge, doubler, center tap, etc.)

Most high-voltage diode modules are imported and used from overseas, and there is a disadvantage in that it is difficult to obtain a product with the same performance when the original manufacturer discontinues the product.

In addition, high-voltage diode modules generate a lot of heat when rectifying AC voltage into DC voltage. If the heat dissipation design of the high-voltage diode is incorrect, the ceramic used as a heat dissipation medium may be destroyed, so an efficient heat dissipation design is necessary.

When using various diodes, there is a problem that related components corresponding to the diodes must be newly manufactured and designed.

Hereinafter, various embodiments of a high voltage diode module and a system including the same according to the present invention will be described in detail with reference to the attached drawings.

The embodiments described in this specification can be applied to various industrial fields such as ships, medical devices, aerospace and defense industries.

FIG. 2 is a block diagram schematically illustrating the configuration of a high-voltage diode module according to one embodiment of the present invention.

Referring to FIG. 2, the high voltage diode module (100) may include a lower substrate (110), at least two insulating blocks (120), an upper substrate (130), a plurality of terminal pins (140), at least one high voltage diode (150), and at least one gap adjusting unit (160).

The lower substrate (110) is a metal material with excellent thermal conductivity, and may have any one material selected from alumina, copper, and copper alloy. Through this, durability and thermal conductivity can be improved. The lower substrate (110) can be any material as long as it has good thermal conductivity and durability.

At least two insulating blocks (120) are arranged spaced apart from each other at a set interval on the upper surface of the lower substrate (110) and can act as insulators to prevent electrical short circuits. The insulating blocks (120) can be joined to the lower substrate (110) using a soldering method, a brazing method, or a joining method using an adhesive (e.g., an epoxy adhesive).

If the insulating blocks (120) are implemented as a single piece rather than being arranged in multiple pieces at regular intervals, a crack may occur in the middle due to heat conduction, and if a crack occurs, there is a risk of a short circuit occurring due to the high energy generated from the diode.

The insulating block (120) can be changed to correspond to the number of high voltage diodes (150).

It is preferable that the insulating block (120) be a non-metallic solid. More specifically, the insulating block (120) can be used for various purposes such as electronic materials and precision machine materials, and it is preferable that it be implemented with a material that, unlike metals, does not conduct electricity well and, unlike organic materials, can withstand high temperatures well.

According to one embodiment of the present invention, the insulating block (120) may be formed of ceramic. Since ceramics have a form in which atoms are regularly arranged like crystals, they may be limited to inorganic ceramics, but may also include all ceramics of a non-inorganic form.

The upper substrate (130) may be placed on top of the lower substrate (110). More specifically, the upper substrate (130) may be placed on top of the insulating block (120). According to one embodiment of the present invention, the upper substrate (130) may be a printed circuit board (PCB) substrate.

If the upper substrate (130) is a printed circuit board (PCB), a bridge circuit that can configure four stages may be printed.

The terminal pin (140) is attached and fixed to the upper surface of the upper substrate (130), and it is preferable that a plurality of terminal pins (140) are provided. Each of the plurality of terminal pins (140) may be provided at a certain interval with a separation hole or a separation groove (131) provided in the upper substrate (130) in between. The terminal pin (140) may play a role in connecting to an input/output power source. It is preferable that the terminal pin (140) is formed long in the longitudinal direction to facilitate soldering with a wire.

The high voltage diode (150) may include a leg portion (151) and a body portion (152). The high voltage diode (150) is attached and fixed to the lower surface of the upper substrate (130), and at least one may be provided. The high voltage diode (150) may be implemented to be connected to the terminal pin (140) with a circuit pattern without a separate connection line.

Referring to FIGS. 3, 5, and 8, the leg parts (151) are illustrated as being included in two each of the high-voltage diodes (150), but in the present invention, the number of leg parts (151) is not limited thereto and may be variously changed depending on the characteristics of the high-voltage diode (150).

The high voltage diode (150) preferably refers to a bipolar oscillator and semiconductor diode used in rectifiers, detectors, etc., utilizing a rectifying function at high voltage (preferably meaning electricity having a reverse voltage withstand voltage of 2000 to 5000 volts), but is not necessarily limited thereto.

Diodes generally have positive voltage (approximately 3 V to 15 V) characteristics and reverse voltage (2000 V to 5000 V) characteristics, and the high voltage diode (150) according to the present invention preferably means a diode with a high reverse voltage withstand voltage, but is not necessarily limited thereto.

Referring first to (c) of FIG. 3, unlike the prior patent of the Republic of Korea Patent Publication No. 10-1002913, the high voltage diode (150) has the leg portion (151) of the high voltage diode (150) attached and fixed to the lower surface of the upper substrate (130), so that the body portion (152) of the high voltage diode (150) is positioned lower than the leg portion (151). Compared to the prior patent of the Republic of Korea Patent Publication No. 10-1002913, the high voltage diode (150) is positioned in an upside-down form, which can more efficiently disperse the high temperature heat generated in the body portion (152).

More specifically, the high temperature heat generated in the body part (152) can be efficiently dispersed along the gap between at least two insulating blocks (120). Accordingly, unlike the prior art patent of Patent Publication No. 10-1002913, in which the body part (152) of the high voltage diode is positioned higher than the leg part (151), and thus the heat emitted from the high voltage diode can damage the PCB substrate located above the high voltage diode, a high voltage diode module (100) having excellent heat dissipation performance and durability can be implemented.

The gap adjusting unit (160) adjusts the gap between the upper substrate (130) and the lower substrate (110) in response to the shape (size and shape, etc.) of the high voltage diode (150), and at least one may be provided.

As the gap adjustment unit (160) is included in the high voltage diode module (100), a separate tool for adjusting the gap between the upper substrate (130) and the lower substrate (110) is not required. The closer the high voltage diode (150) and the insulating block (120) are, the better the heat dissipation performance is; however, since there is a possibility of a short circuit with the heat dissipation plate, it is necessary to maintain an appropriate distance. However, by using the gap adjustment unit (160), fine adjustment of the gap between the upper substrate (130) and the lower substrate (110) is possible.

In addition, since the gap adjustment unit (160) is included in the high voltage diode module (100) to perform fine adjustment of the gap between the upper substrate (130) and the lower substrate (110), damage to the high voltage diode module (100) can be prevented from inrush current that may occur momentarily in the upper substrate (130) (e.g., printed circuit board), and damage to the high voltage diode module (100) can be prevented from arc that may occur in the space between the upper substrate (130) and the lower substrate (110).

High-voltage diode modules have various applications depending on the purpose of use, but in order to rectify/smooth AC power with a high switching frequency into DC power, it is necessary to effectively dissipate heat generated from the diode to prevent the diode from being destroyed. However, since the high-voltage diode module (100) has a gap adjustment unit (160), the gap between the upper substrate (130) and the lower substrate (110) can be adjusted, and the heat generated from the diode can be effectively dissipated.

The gap adjustment unit (160) is described in more detail in FIGS. 4 and 5.

Not all blocks illustrated in FIG. 1 are essential components, and some blocks connected to the high voltage diode module (100) may be added, changed, or deleted in other embodiments.

FIG. 3 is a drawing showing a high-voltage diode module according to an embodiment of the present invention from various angles.

FIG. 3 (a) is a plan view illustrating a high-voltage diode module according to an embodiment of the present invention as viewed from above.

According to one embodiment of the present invention, the upper substrate (130) may have a spacing hole or spacing groove (131) between each of the plurality of terminal pins (140) to maintain maximum insulation between each terminal pin (140) within a limited space.

Referring to (a) of Fig. 3, when four terminal pins (140) are provided in one unit, a rectangular-shaped separation hole or separation groove (131) may be provided. In this case, when a separation hole is provided, the insulation strength can be further strengthened compared to when a separation groove is provided.

According to one embodiment of the present invention, the upper substrate (130) can be separated into a plurality of units of terminal pins (140) having a certain arrangement structure, and each unit of terminal pins (140) having a certain arrangement structure can be provided with a rectangular-shaped partition hole or partition groove (132) to increase insulation.

Referring to (a) of FIG. 3, the partition holes or partition grooves (132) can be implemented as a pair with one terminal pin (140) between them.

The partition holes or partition grooves (132) can partition a unit of terminal pins (140) to correspond to one insulating block (120). For example, referring to (b) of FIG. 3, corresponding to four insulating blocks (120), the partition holes or partition grooves (132) can be provided as three pairs to partition the upper substrate (130) into four regions.

Also, referring to (a) of FIG. 3, reference numbers 140-4, 140-7 and 140-10 may be located in overlapping portions of two upper substrate (130) unit areas.

If the upper substrate (130) has a partition hole or a partition groove (132), when the internal space of the high-voltage diode module (100) is potted with a potting agent, there is also an advantage in that perfect insulation can be maintained by the potting agent.

FIG. 3 (b) is a perspective view of a high-voltage diode module according to an embodiment of the present invention.

Referring to (b) of FIG. 3, the gap adjusting unit (160) may be implemented to connect the edges of the upper substrate (130) and the lower substrate (110). When the upper substrate (130) and the lower substrate (110) are implemented in a rectangular parallelepiped shape as shown in (b) of FIG. 3, it is preferable that four gap adjusting units (160) are positioned in the high voltage diode module (100).

Fig. 3 (c) is a front view of a high-voltage diode module according to an embodiment of the present invention.

In the present invention, the 'length direction' refers to the vertical direction based on Fig. 4, and the 'width direction' refers to the horizontal direction based on Fig. 4. The following description will be given based on the specified direction.

FIG. 4 is a drawing for explaining in detail a gap adjusting unit according to one embodiment of the present invention.

The gap adjustment unit (160) may include a ring cover (161), a bearing (162), a gap adjustment screw (163), and a gap adjustment bolt (164).

The ring cover (161) is positioned on the lower surface of the upper substrate (130) and can be implemented so that a first through hole (165) is formed inside.

The bearing (162) can be forcibly fitted with a gap adjustment screw (163) into the first through hole (166).

The gap adjustment screw (163) may be implemented so that a second through hole (166) is formed inside, and a first female screw thread (167) is formed in the second through hole (166).

The gap adjustment bolt (164) may be implemented such that the head of the gap adjustment bolt (164) is positioned on the upper surface of the upper substrate (130), the length of the gap adjustment bolt (164) penetrates all of the upper substrate (130), the ring cover (161), and the gap adjustment screw (163), and a first male screw thread (168) is formed on the outside and rotates while engaging with the first female screw thread (167).

As the user rotates the gap adjustment bolt (164) of the gap adjustment part (160), the first male screw thread (168) rotates in engagement with the first female screw thread (167), and in response, the gap adjustment screw (163) moves up and down in the longitudinal direction, thereby allowing the gap between the upper substrate (130) and the lower substrate (110) to be adjusted.

According to one embodiment of the present invention, the lower substrate (110) may be implemented such that a second female screw thread (not shown) is formed at a position corresponding to the gap adjustment screw (163), and the gap adjustment screw (163) may be implemented such that a second male screw thread (169) is formed on the outside.

As the user rotates the gap adjustment bolt (164) of the gap adjustment unit (160), the first male screw thread (168) rotates while engaging with the first female screw thread (167), and in response, the second male screw thread (169) rotates while engaging with the second female screw thread (167), thereby adjusting the gap between the upper substrate (130) and the lower substrate (110).

FIG. 5 is a drawing for explaining the configuration of a high-voltage diode module according to the form of a high-voltage diode according to one embodiment of the present invention.

The gap adjusting unit (160) can adjust the gap between the upper substrate (130) and the lower substrate (110) in accordance with the size, shape, and characteristics of the diode (150).

Referring to (a) of Fig. 5, since the size of the high voltage diode (150-1) is small, the user can tighten the gap adjustment bolt (164) to reduce the gap between the upper substrate (130) and the lower substrate (110).

Even if the size of the high voltage diode (150-1) is small, if the amount of heat emitted from the high voltage diode (150-1) is large, in order to prevent damage to the high voltage diode (150-1), the user can loosen the gap adjustment bolt (164) to increase the gap between the upper substrate (130) and the lower substrate (110).

Referring to (b) of Fig. 5, since the size of the high voltage diode (150-2) is large, the user can loosen the gap adjustment bolt (164) to increase the gap between the upper substrate (130) and the lower substrate (110).

FIG. 6 is a diagram for explaining a circuit of a high-voltage diode module according to one embodiment of the present invention.

The high voltage diode module (100) can be formed to have a bridge rectifier circuit structure depending on the connection type of the electrodes of the high voltage diode (150) and the plurality of terminal pins (140).

According to one embodiment of the present invention, the circuit structure of the high voltage diode module (100) is a circuit that connects four bridge full-wave rectifier circuits, and 16 high voltage diodes (150) and 13 terminal pins (140) (hereinafter, referred to as PINs in the description of FIG. 6) are arranged as shown in FIG. 6, and it is preferable that the output voltage be implemented by rectifying it to a - voltage rather than a + voltage that is generally used.

More specifically, the circuit structure of the high-voltage diode module (100) can receive AC voltages from each of PIN 2 to 3, PIN 5 to 6, PIN 8 to 9, and PIN 11 to 12, and output rectified -voltages of four stages of PIN 1 to 4, PIN 4 to 7, PIN 7 to 10, and PIN 10 to 13.

The circuit structure of the high-voltage diode module (100) is such that by connecting a high-voltage capacitor between PINs 1 to 4, 4 to 7, 7 to 10, and 10 to 13 in the power supply, a rectifier/smoothing circuit can be configured to output a - voltage summed in four stages from PIN 1 based on PIN 13.

FIG. 7 is a drawing for explaining the configuration of a high-voltage diode module system according to one embodiment of the present invention.

Referring to FIG. 7, the internal space of the high voltage diode module (100) can be potted with a potting solution (170).

Since the high-voltage diode module (100) has a compact and integrated form, the internal space can be potted with a potting agent to maintain high insulation strength.

It is preferable to use a soft potting agent (STYCAST-5459 A/B) with excellent insulation strength and thermal conductivity.

A high voltage diode module system (10) may include a high voltage diode module (100) and a case (200) packaging the high voltage diode module (100).

As shown in Fig. 7, the case (200) has an empty space formed inside so that a high-voltage diode module (100) can be positioned, and is preferably formed in a rectangular hexahedron shape with only one side open, but is not necessarily limited thereto.

The case (200) can prevent damage to the high-voltage diode module (100) and prevent the potting solution (170) from overflowing to the outside during potting.

Below, the manufacturing process of a high-voltage diode module system (10) according to one embodiment of the present invention is described.

FIGS. 8 and 9 are drawings for explaining a process for manufacturing a high-voltage diode module system according to an embodiment of the present invention.

First, the manufacturer can swage a plurality of terminal pins (140) onto the upper substrate (130) (e.g., a printed circuit board).

Next, referring to FIG. 8, the manufacturer can attach and fix a plurality of high voltage diodes (150) to the lower surface of the upper substrate (130). A method of attaching and fixing the high voltage diodes (150) may include soldering.

Next, the manufacturer can apply adhesive to the lower substrate (110) and then laminate the insulating block (120).

According to one embodiment of the present invention, the lower substrate (110) can be used after being chromated, and the manufacturer can cure it for a certain period of time (e.g., 30 minutes) in an oven maintained at a certain temperature (e.g., 65° C.) after pressing so that the lower substrate (110) and the insulating block (120) can be well adhered.

Next, the manufacturer can position the gap adjustment part (160) on the lower substrate (110). More specifically, the manufacturer can position the gap adjustment part (160) with the gap adjustment bolt (164) separated on the lower substrate (110).

Next, referring to FIG. 9, the manufacturer can position the lower substrate (110) within the case (200).

Next, the manufacturer can apply a potting agent to cover the lower substrate (110) within the case (200).

Next, the manufacturer can position the upper substrate (130) to cover the potting agent applied within the case (200).

Next, the manufacturer can attach the gap adjustment bolt (164) to the gap adjustment part (160) from which the gap adjustment bolt (164) is separated.

Additionally, the manufacturer can allow the high voltage diode module (100) to naturally harden after additionally applying the potting agent.

In the process of the high voltage diode module system (10) through FIGS. 8 and 9, each process is described as being executed sequentially, but this is merely an example, and those skilled in the art may change the order described in the process of the high voltage diode module system (10) through FIGS. 8 and 9 without departing from the essential characteristics of the embodiment of the present invention, or may modify and change it in various ways by executing one or more processes in parallel or adding other processes.

Even though all the components constituting the embodiments of the present invention described above are described as being combined as one or operating in combination, the present invention is not necessarily limited to such embodiments. That is, within the scope of the purpose of the present invention, all of the components may be selectively combined as one or more and operating.

The above description is merely an illustrative description of the technical idea of the present invention, and those skilled in the art will appreciate that various modifications, changes, and substitutions may be made without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are not intended to limit the technical idea of the present invention but to explain it, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

10: High voltage diode module system
100: High voltage diode module
110: Lower substrate
120: Insulating block
130: Upper substrate
140: Terminal pin
150: High voltage diode
151: Legs
152: Torso
160: Gap adjustment part
161: Ring Cover
162: Bearing
163: Gap adjustment screw
164: Gap adjustment bolt
170: Potting liquid
200: Case

Claims (13)

lower substrate;
An upper substrate disposed on top of the lower substrate;
A plurality of terminal pins attached and fixed to the upper surface of the upper substrate;
At least one high voltage diode attached and fixed to the lower surface of the upper substrate; and
At least two insulating blocks are arranged at regular intervals on the upper surface of the lower substrate and prevent electrical short-circuiting;
The high voltage diode comprises a leg portion; and a body portion connected to the leg portion;
A high voltage diode module, characterized in that the leg portion is attached and fixed to the lower surface of the upper substrate so that the body portion is positioned lower than the leg portion and heat generated from the body portion is distributed along the gap between the at least two insulating blocks. delete In the first paragraph,
The above lower substrate is made of metal,
The above insulating block is made of ceramic material,
A high-voltage diode module characterized in that the upper substrate is a printed circuit board, and each of the plurality of terminal pins provided on the upper substrate is provided spaced apart at a set interval with a spacer hole or a spacer groove therebetween. In the third paragraph,
The above high voltage diode module,
A high-voltage diode module characterized by having a bridge rectifier circuit structure according to the connection form of the electrodes of the high-voltage diode and the plurality of terminal pins. In the first paragraph,
The above at least two insulating blocks and the lower substrate,
A high voltage diode module characterized in that it is joined using a soldering joint, a brazing joint or an adhesive-based joint method. In the first paragraph,
A high voltage diode module, characterized in that the internal space of the high voltage diode module is potted with a potting solution. In the first paragraph,
A high voltage diode module characterized by further comprising at least one gap adjusting unit for adjusting the gap between the upper substrate and the lower substrate corresponding to the shape of the high voltage diode. In Article 7,
The above gap adjustment part,
A ring cover positioned on the lower surface of the upper substrate and having a first through hole formed therein;
A gap adjusting screw that is forcibly fitted through a bearing into the first through hole, has a second through hole formed inside, and has a first female screw thread formed in the second through hole; and
A high voltage diode module characterized by including a gap adjustment bolt, wherein the head portion is positioned on the upper surface of the upper substrate, the length portion penetrates all of the upper substrate, the ring cover, and the gap adjustment screw, and a first male screw thread is formed on the outside and rotates while interlocked with the first female screw thread. In Article 8,
The above lower substrate is,
A second female screw thread is formed at a position corresponding to the above gap adjustment screw,
The above gap adjustment screw has a second male screw thread formed on the outside,
A high-voltage diode module characterized in that the gap adjusting part adjusts the gap between the upper substrate and the lower substrate in such a way that, as the gap adjusting bolt is rotated, the first male screw thread rotates while engaging with the first female screw thread, and in response, the second male screw thread rotates while engaging with the second female screw thread. A high voltage diode module comprising a lower substrate, an upper substrate disposed on an upper surface of the lower substrate, a plurality of terminal pins attached and fixed to an upper surface of the upper substrate, and at least one high voltage diode attached and fixed to a lower surface of the upper substrate; and
A case for packaging the above high voltage diode module;
At least two insulating blocks are arranged at regular intervals on the upper surface of the lower substrate and prevent electrical short-circuiting;
The high voltage diode comprises a leg portion; and a body portion connected to the leg portion;
A high voltage diode module system, characterized in that the leg portion is attached and fixed to the lower surface of the upper substrate so that the body portion is positioned lower than the leg portion and heat generated from the body portion is distributed along the gap between the at least two insulating blocks. delete In Article 10,
The above lower substrate is made of metal,
The above insulating block is made of ceramic material,
A high-voltage diode module system, characterized in that the upper substrate is a printed circuit board, and each of the plurality of terminal pins provided on the upper substrate is provided spaced apart at a set interval with a spacer hole or a spacer groove therebetween. In Article 10,
The above high voltage diode module,
A high voltage diode module system characterized by including at least one gap adjusting unit for adjusting the gap between the upper substrate and the lower substrate corresponding to the shape of the high voltage diode.

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