KR102757551B1 - Test Apparatus Using A Multi Termination Module - Google Patents

Abstract

The purpose of the present invention is to provide a test device using a multi-termination module, in which a test signal can be corrected using a multi-termination module mounted on a socket board, and to this end, the test device using a multi-termination module according to the present invention includes: a socket board to which a semiconductor device to be tested (DUT: Device Under Test) is connected; a multi-termination module connected to the socket board and including a correction circuit; a cable connected to the socket board; and a test board connected to the cable, wherein the correction circuit corrects the received test signal so that a received test signal output from the test board and transmitted to the semiconductor device through the cable and the socket board becomes identical to an output test signal output from the test board, and includes at least one resistor.

Description

{Test Apparatus Using A Multi Termination Module}

The present invention relates to a test device for testing the characteristics of semiconductor devices.

Various types of semiconductor devices are used for data storage.

Semiconductor devices may include solid state drives (SSDs), hard disk drives (HDDs), double data rate (DDR)4, and DDR5.

Test devices are used to diagnose whether semiconductor devices are operating normally.

A test board equipped with a test device transmits various test signals to a semiconductor device, and tests the characteristics of the semiconductor device using various signals received from the semiconductor device according to the test signals.

In this case, various configurations are provided between the test board and the semiconductor device. Therefore, the test signal transmitted from the test board to the semiconductor device may include various forms of noise, and accordingly, accurate testing of the semiconductor device may not be performed.

In order to perform an accurate test on a semiconductor device, the received test signal transmitted from the test board to the semiconductor device must have characteristics that are identical to, or similar within an error range to, the output test signal output from the test board. In other words, the reliability (hereinafter, simply referred to as signal integrity (SI)) of the test signal transmitted from the test board to the semiconductor device must be secured in order to perform an accurate test on the semiconductor device.

To ensure signal reliability, a base board is conventionally mounted between the socket board to which the semiconductor elements are connected and the test board, and the received test signal transmitted from the test board to the semiconductor elements is compensated through a compensation circuit provided in the base board.

However, as described above, conventionally, the output test signal output from the test board is transmitted to the semiconductor element through various paths, such as a cable, a base board, and a socket board, and since the correction circuit is provided in the base board, it is difficult for the received test signal to be corrected to the same form as the output test signal.

In addition, since a complex structure for connecting a test board, cable, base board, and socket board had to be provided in the past, the structure of the test device became complex, and accordingly, the production of the test device was difficult and a lot of cost was required for the production of the test device.

An object of the present invention to solve the above-described problems is to provide a test device using a multi-termination module, in which a test signal can be corrected using a multi-termination module mounted on a socket board.

According to the present invention for achieving the above-described purpose, a test device using a multi-termination module comprises: a socket board to which a semiconductor device to be tested (DUT: Device Under Test) is connected; a multi-termination module connected to the socket board and including a correction circuit; a cable connected to the socket board; and a test board connected to the cable, wherein the correction circuit corrects the reception test signal so that a reception test signal output from the test board and transmitted to the semiconductor device through the cable and the socket board becomes identical to an output test signal output from the test board, and includes at least one resistor.

The above socket board is provided with a first connector and a second connector, the multi-termination module is connected to the socket board through the first connector, one end of the cable is connected to the socket board through the second connector, and the other end of the cable is connected to the test board.

The above multi-termination module includes a compensation board having the compensation circuit; and a case having a slit into which the compensation board is inserted and fixed, and an end of the compensation board exposed through the slit is connected to the socket board through a first connector provided in the socket board.

At least two of the above correction boards are fixed in the above case.

At least two of the above correction boards include a first type correction board and a second type correction board, and the first type correction board and the second type correction board have a left-right symmetrical structure.

At least two of the above correction boards include a first type correction board formed in a ┌ shape and a second type correction board formed in a ┐ shape symmetrical to the first type correction board.

At least two of the above correction boards include a first type correction board and a second type correction board, wherein the first type correction board includes a first connecting portion connected to the socket and a first body extended from one lower side of the front side of the first connecting portion, and the second type correction board includes a second connecting portion connected to the socket and a second body extended from the other lower side of the front side of the second connecting portion.

The first connecting portion and the second connecting portion are arranged to overlap in the multi-termination module, and the first body and the second body are arranged to not overlap in the multi-termination module.

When at least four of the above correction boards are fixed to the above case, the first type correction board and the second type correction board are fixed to the case alternately.

The first correction circuit of the first type correction board is mounted on the front side of the first main body, and the second correction circuit of the second type correction board is mounted on the front side of the second main body.

According to the present invention, since the test signal can be corrected by the multi-termination module mounted on the socket board, signal reliability for the test signal can be secured.

In addition, according to the present invention, since at least one correction board can be provided in one multi-termination module and the correction board can be provided with at least one correction circuit, correction for various types of test signals can be performed through one multi-termination module.

Figure 1 is an exemplary diagram explaining a method of using a test device using a multi-termination module according to the present invention.
Figure 2 is an exemplary diagram showing the configuration of a test device using a multi-termination module according to the present invention.
Figure 3 is an exemplary diagram showing the structure of a multi-termination module applied to a test device using a multi-terminal line module according to the present invention.
Figure 4 is an exploded view of a multi-termination module applied to a test device using a multi-termination module according to the present invention.
Figure 5 is a perspective view of a multi-termination module applied to a test device using a multi-termination module according to the present invention.

Throughout the specification, the same reference numerals refer to substantially identical components. In the following description, if it is not related to the core configuration of the present invention, detailed descriptions of the configurations and functions known in the technical field of the present invention may be omitted. The meanings of the terms described in this specification should be understood as follows.

The advantages and features of the present invention, and the method for achieving them, will become clear with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and these embodiments are provided only to make the disclosure of the present invention complete and to fully inform a person having ordinary skill in the art to which the present invention belongs of the scope of the invention, and the present invention is defined only by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for explaining embodiments of the present invention are exemplary, and the present invention is not limited to the matters illustrated. The same reference numerals refer to the same components throughout the specification. In addition, in explaining the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description will be omitted.

In the present specification, when the words "includes," "has," and "consists of," are used, other parts may be added unless "only" is used. When a component is expressed in the singular, it includes the plural unless there is a special explicit description.

When interpreting a component, it is interpreted as including the error range even if there is no separate explicit description.

When describing a positional relationship, for example, when the positional relationship between two parts is described as 'on ~', 'upper ~', 'lower ~', 'next to ~', etc., one or more other parts may be located between the two parts, unless 'right' or 'directly' is used.

When describing a temporal relationship, for example, when describing a temporal relationship using phrases such as 'after', 'following', 'next to', or 'before', it can also include cases where there is no continuity, as long as 'right away' or 'directly' is not used.

Although the terms first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, a first component referred to below may also be a second component within the technical concept of the present invention.

“X-axis direction”, “Y-axis direction” and “Z-axis direction” should not be interpreted as merely geometric relationships in which the relationship between them is perpendicular to each other, but may mean a wider directionality within the range in which the configuration of the present invention can function functionally.

The term "at least one" should be understood to include all combinations that can be represented from one or more of the associated items. For example, the meaning of "at least one of the first, second, and third items" can mean not only each of the first, second, or third items, but also all combinations of items that can be represented from two or more of the first, second, and third items.

The individual features of the various embodiments of the present invention may be partially or wholly combined or combined with each other, and may be technically linked and driven in various ways, and each embodiment may be implemented independently of each other or may be implemented together in a related relationship.

Hereinafter, embodiments of the present specification will be described in detail with reference to the attached drawings.

FIG. 1 is an exemplary diagram illustrating a method of using a test device using a multi-termination module according to the present invention, FIG. 2 is an exemplary diagram illustrating a configuration of a test device using a multi-termination module according to the present invention, and FIG. 3 is an exemplary diagram illustrating a structure of a multi-termination module applied to a test device using a multi-termination wire module according to the present invention.

A test device using a multi-termination module according to the present invention (hereinafter, simply referred to as a test device) includes a socket board (210) to which a semiconductor element is connected, a multi-termination module (220) connected to the socket board, a cable (250) connected to the socket board, and a test board (230) connected to the cable, as illustrated in FIGS. 1 and 2. In this case, the multi-termination module (220) includes at least one correction circuit, and the correction circuit may include at least one resistor that corrects the received test signal so that the received test signal output from the test board (230) and transmitted to the semiconductor element through the cable (250) and the socket board (210) becomes identical to the output test signal output from the test board (230).

First, the socket board (210) can be mounted on the high fix (240).

At least one socket board (210) can be connected to the high-fix (240).

The semiconductor device (100) may be connected to the socket board (210) through a slot (260) provided in the socket board (210), or may be connected to the socket board (210) through a slot (260) provided in a high-fix (240) equipped with the socket board (210).

That is, the slot (260) illustrated in Fig. 1 may be provided in the socket board (210) or may be provided in the high-fix (240).

Semiconductor devices (100) refer to solid state drives (SSD), hard disk drives (HDD), double data rate (DDR)4, and DDR5.

In particular, the semiconductor device (100) refers to a device to be tested and is also called a DUT (Device Under Test).

Next, the test board (230) can be connected to the socket board (210) via a cable (250).

At least one test board (230) can be mounted in a test board box (239), as shown in FIG. 2.

The test board (230) transmits test signals to a semiconductor device (100) inserted into a slot (260) of a corresponding socket board (210), and, using signals received from the semiconductor device (100) according to the test signals, various characteristics of the semiconductor device (100) and whether it is operating normally can be tested.

To this end, the test board (230) may be equipped with a test board control unit (231) that can generate various test signals and supply them to the semiconductor device (100). That is, a test on the semiconductor device (100) may be performed on the test board (230), and in particular, may be performed by the test board control unit (231).

Each of the test boards (230) may be connected one-to-one with a socket board (210), or two or more test boards (230) may be connected to one socket board (210). In addition, the socket board (210) may be connected one-to-one with a semiconductor device (100), or two or more semiconductor devices (100) may be connected to one socket board (210).

Hereinafter, for convenience of explanation, a test device in which one test board (230) is connected to one socket board (210) and one semiconductor device (100) is connected to one socket board (210) is described as an example of the present invention.

The test device (200) can be connected to an administrator terminal (400) via a network. An administrator can control various functions of the test device (200) via the administrator terminal (400) and monitor various test information collected from the test device (200) via the administrator terminal (400).

Next, the cable (250) performs the function of connecting the test board (230) to the socket board (210).

For this purpose, the socket board (210) is provided with at least one first connector (211) and at least one second connector (212).

The multi-termination module (220) is connected to the socket board through the first connector (211), and the cable (250) is connected to the socket board through the second connector (212).

That is, one end of the cable (250) is connected to the socket board (210) through the second connector (212) provided on the socket board (210), and the other end of the cable (250) is connected to the test board connector provided on the test board (230), so that the test board (230) can be connected to the socket board (210).

Accordingly, various test signals output from the test board (230) can be transmitted to the semiconductor device (100) through the socket board (210), and various signals generated from the semiconductor device (100) can be transmitted to the test board (230) through the socket board (210) and the cable (250).

When the number of test signals transmitted from the test board (230) to the semiconductor device (100) and the number of signals transmitted from the semiconductor device (100) to the test board (230) are large, at least two cables (250) may be connected to one test board (230).

In this case, the socket board (210) may be provided with at least two second connectors (212) connected to at least two cables (250). FIG. 2 illustrates an example of a test device including a socket board (210) provided with four second connectors (212) according to the present invention.

Finally, the multi-termination module (220) is connected to the socket board via the first connector (211).

At least two first connectors (211) can be provided on one socket board, and thus, at least two multi-termination modules (220) can be mounted on one socket board.

The number of multi-termination modules (220) can be varied depending on the number of output test signals supplied from the test board (230) to the semiconductor device (100). In addition, the socket board (210) is mounted on the high-fix (240) as shown in FIGS. 1 to 3, and the number of socket boards (210) mounted on the high-fix (240) can be varied depending on the number of semiconductor devices (100) to be tested and the number of test boards (230).

Hereinafter, for convenience of explanation, a test device in which two multi-termination modules (220) are connected to one socket board (210) and four socket boards (210) are connected to one high-fix (240) as shown in FIGS. 2 and 3 is described as an example of the present invention.

The multi-termination module (220) includes at least one compensation circuit (220a), as illustrated in FIG. 3.

The compensation circuit (220a) may include at least one resistor that compensates for the reception test signal so that the reception test signal output from the test board (230) and transmitted to the semiconductor element through the cable (250) and the socket board (210) becomes identical to the output test signal output from the test board (230).

The reception test signal refers to an output test signal transmitted to the semiconductor element (100). That is, the output test signal is transmitted to the semiconductor element (100) through the cable (250) and the socket board (210), and the output test signal transmitted to the semiconductor element (100) is called a reception test signal.

The compensation circuit (220a) performs the function of compensating the reception test signal so that the reception test signal can be identical to the output test signal.

Making the reception test signal identical to the output test signal may mean making the reception test signal completely identical to the output test signal, and may also mean making the reception test signal have similar characteristics to the output test signal within a preset error range. Here, the reception test signal having similar characteristics to the output test signal within the preset error range means a signal that can be used for testing a semiconductor device.

That is, if the output test signal output from the test board (230) is a signal completely identical to the received test signal received from the semiconductor device, the test intended on the test board can be performed normally on the semiconductor device.

However, in general, when the output test signal is transmitted through a cable (250), etc., various noises may be included in the output test signal, and accordingly, the received test signal may be different from the output test signal, and thus, the test on the semiconductor device (100) may not be performed normally.

To prevent this, the present invention is provided with a correction circuit (220a), and in particular, the correction circuit (220a) is provided in the multi-termination module (220). The correction circuit (220a) can be connected to the semiconductor element circuit (110) provided in the semiconductor element (100) through the socket board (210). Therefore, the reception test signal received by the semiconductor element circuit (110) can be corrected by the resistor or capacitor provided in the correction circuit (220a).

To this end, during the manufacturing process of the test device, the sizes of the resistors and capacitors to be provided in the compensation circuit (220a) can be calculated through various simulations and tests, and accordingly, the compensation circuit (220a) can be provided in various forms.

When a semiconductor device (100) is tested through a test device equipped with a multi-termination module (220) equipped with a compensation circuit (220a), the compensation circuit (220a) affects the semiconductor device circuit (110), and accordingly, a reception test signal received by the semiconductor device circuit (110) may be the same signal as the output test signal or may be a similar signal within an error range.

Accordingly, a receiving test signal corrected by the correction circuit (220a) is supplied to the semiconductor element circuit (110), so that a test on the semiconductor element (100) can be performed.

In this case, the compensation circuit (220a) may be provided as many times as the number of output test signals requiring compensation.

Therefore, one multi-termination module (220) may be equipped with at least two compensation circuits (220a).

In this case, the structures of the two correction circuits (220a) may be different depending on the characteristics of the corresponding output test signals. Accordingly, the structures of each of at least two correction circuits (220a) provided in one multi-termination module (220) may be different from each other or may be the same.

In addition, when the number of output test signals supplied through the cable (250) is greater than the number of correction circuits (220a) that can be equipped in one multi-termination module (220), at least two multi-termination modules (220) can be equipped in one semiconductor device (210), and at least two correction circuits (220a) can be equipped in each of the at least two multi-termination modules (220).

To explain in more detail, as illustrated in FIG. 3, since the correction circuit (220a) is electrically connected to the semiconductor element circuit (110), the output test signal supplied to the semiconductor element circuit (110) through the cable (250) and the socket board (210) can be corrected according to the structure and size of the resistor and capacitor, etc., provided in the correction circuit (220a). Accordingly, a reception test signal that is identical to or similar to the output test signal can be supplied to the semiconductor element circuit (110), and thus, the reception test signal intended by the test board (230) can be supplied to the semiconductor element circuit (110). Accordingly, the test for the semiconductor element (100) can be performed normally.

Below, the structure of the multi-termination module (220) is described in detail with reference to FIGS. 1 to 5.

FIG. 4 is an exploded view of a multi-termination module applied to a test device using a multi-termination module according to the present invention, and FIG. 5 is a perspective view of a multi-termination module applied to a test device using a multi-termination module according to the present invention.

As described above, the multi-termination module (220) is mounted on the socket board (210) via the first connector (211) provided on the socket board (210), and at least one first connector (211) may be provided on one socket board (210).

The multi-termination module (220) includes a compensation board (221) having at least one compensation circuit (220a) as shown in FIGS. 4 and 5, and a case (222) to which the compensation board (221) is fixed.

First, the correction board (221) is connected to the socket board through the first connector (211) provided on the socket board (210).

Next, the case (222) may be equipped with at least one correction board (221), and a multi-termination module (220) equipped with three correction boards (221) is illustrated as an example of the present invention in FIGS. 4 and 5. The case (222) is equipped with slits into which the correction boards (221) are inserted and fixed. FIG. 4 illustrates a case (222) equipped with three slits as an example of the present invention. The three correction boards (221) inserted into the three slits may be fixed to the case (222) through fastening devices such as bolts and nuts.

The end of the correction board (221) exposed through the slit is connected to the socket board through the first connector (2111) provided on the socket board. In this case, one end of the cable (250) is connected to the socket board through the second connector (212), and the other end of the cable is connected to the test board (230).

Next, when at least two correction boards (221) are mounted in the case (222), the at least two correction boards (221) may include a first type correction board (221a) and a second type correction board (221b).

In this case, the first type correction board (221a) and the second type correction board (221b) may have a left-right symmetrical structure.

For example, the first type correction board (221a) may be formed in a ┌ shape as shown in FIGS. 4 and 5, and the second type correction board (221b) may be formed in a ┐ shape that is symmetrical to the left and right of the first type correction board.

In this case, the first type correction board (221a) includes a first connecting portion (221a_1) connected to the socket and a first main body (221a_2) extended from one lower side of the front of the first connecting portion (221a_1), and the second type correction board (221b) includes a second connecting portion (221b_1) connected to the socket and a second main body (221b_2) extended from the other lower side of the front of the second connecting portion (221b_1).

The first connecting portion (221a_1) and the second connecting portion (221b_1) are arranged so as to overlap in the multi-termination module, and the first main body (221a_2) and the second main body (221b_2) are arranged so as not to overlap in the multi-termination module.

The reason for the arrangement as described above is to prevent various elements constituting the compensation circuit (220a), such as resistors or capacitors, from coming into contact between the compensation boards (221a, 221b).

That is, the correction circuits (220a) may be provided on at least one of the front and rear surfaces of the first main body (221a_2) and the second main body (221b_2), and in order to prevent contact between the correction circuits (220a) as much as possible, the correction circuits (220a) may be provided only on the front surface of the first main body (221a_1) and the front surface of the second main body (221b_1), respectively. For example, the first correction circuit of the first type correction board may be mounted on the front of the first main body, and the second correction circuit of the second type correction board may be mounted on the front of the second main body. In this case, if the structure of the first type correction board (221a) and the structure of the second type correction board (221b) are the same, the correction circuits (220a) provided in the first main body (221a_2) and the second main body (221b_2) may come into contact with each other, and even when the correction circuits (220a) are provided on only one of the front and the rear, the correction circuits (220a) provided in one of the correction boards (221) may come into contact with the adjacent correction board (221). Accordingly, the correction circuits (220a) may not operate normally.

In order to solve this problem in the present invention, as shown in FIGS. 4 and 5, the first type correction board (221a) and the second type correction board (221b) have a structure that is symmetrical to each other left and right. Therefore, when the first type correction board (221a) and the second type correction board (221b) are sequentially mounted in the case (222), the first body (221a_2) and the second body (221b_2) can be separated left and right without being in close contact with each other.

In this case, since the first connecting portion (221a_1) and the second connecting portion (221b_1) must be connected to the first connector (211) having the same structure, they can be formed in the same shape. Since the first connecting portion (221a_1) and the second connecting portion (221b_1) are not equipped with complex circuit elements, even if the connecting portion (221a_1) and the second connecting portion (221b_1) are in close contact, no electrical error occurs.

For example, in the multi-termination module (220) illustrated in FIGS. 4 and 5, a first type correction board (221a) is mounted at the frontmost end of the case (222), another first type correction board (221a) is mounted at the rearmost end, and a second type correction board (221b) is mounted between the two first type correction boards (221a).

Accordingly, the first first main body (221a_2) of the first type correction board (221a) equipped at the frontmost end of the case (222) and the first main body (221a_2) of the first type correction board (221a) equipped at the rearmost end of the case (222) can be spaced apart from each other by a certain interval on the left side of the case (222), and thus, the two first main bodies (221a_2) can be spaced apart from each other. Accordingly, the correction circuits (220a) equipped in the two first main bodies (221a_2) may not come into contact with each other.

In addition, the second body (221b_2) of the second type correction board (221b) mounted between the two first type correction boards (221a) is positioned on the right side of the case (222), and therefore does not overlap with the two first bodies (221a_2). Accordingly, the correction circuits equipped in the second body (221b_2) may not come into contact with the correction circuits (220a) equipped in the first bodies (221a_2).

Therefore, the correction circuits provided on different correction boards (221) do not affect each other.

Finally, when at least four correction boards are fixed to the case (222), the first type correction board (221a) and the second type correction board (221b) are fixed alternately to the case (222).

Accordingly, correction boards of the same type are inserted between correction boards of different types. Accordingly, the first bodies (221a_2) can be spaced apart at least by the thickness of the second bodies (221b_2), the second bodies (221b_2) can be spaced apart at least by the thickness of the first bodies (221a_2), and the first bodies (221a_2) and the second bodies (221b_2) can not overlap each other. Accordingly, the correction circuits (220a) provided in the different correction boards (221) do not affect each other.

Accordingly, even if a plurality of correction boards (221) are mounted in one case (222), the correction circuits (220a) provided in each of the plurality of correction boards (221) can be operated normally, and thus, the semiconductor device (100) can be tested simultaneously using a plurality of output test signals.

It should be understood that the embodiments described above are exemplary in all respects and are not restrictive. The scope of the present invention is indicated by the claims described below rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

100: Semiconductor Device 200: Test Device
400: Admin Terminal 220: Multi-Termination Module

Claims (10)

A socket board to which the semiconductor device under test (DUT) is connected;
A multi-termination module connected to the above socket board and including a compensation circuit;
a cable connected to the above socket board; and
Including a test board connected to the above cable,
The above compensation circuit compensates the reception test signal so that the reception test signal output from the test board and transmitted to the semiconductor element through the cable and the socket board becomes identical to the output test signal output from the test board, and includes at least one resistor.
The above multi-termination module,
A compensation board equipped with the above compensation circuit; and
A test device using a multi-termination module including a case having a slit into which the above correction board is inserted and fixed. A socket board to which the semiconductor device under test (DUT) is connected;
A multi-termination module connected to the above socket board and including a compensation circuit;
a cable connected to the above socket board; and
Including a test board connected to the above cable,
The above compensation circuit compensates the reception test signal so that the reception test signal output from the test board and transmitted to the semiconductor element through the cable and the socket board becomes identical to the output test signal output from the test board, and includes at least one resistor.
The above socket board is provided with a first connector and a second connector,
The above multi-termination module is connected to the socket board through the first connector,
A test device using a multi-termination module, one end of the cable being connected to the socket board via the second connector, and the other end of the cable being connected to the test board. In paragraph 1,
A test device using a multi-termination module in which the end of the compensation board exposed through the slit is connected to the socket board through a first connector provided on the socket board. In the third paragraph,
A test device using a multi-termination module in which at least two of the above compensation boards are fixed in the above case. In paragraph 4,
At least two of the above correction boards include a first type correction board and a second type correction board,
The above first type correction board and the above second type correction board are a test device using a multi-termination module having a left-right symmetrical structure. In paragraph 4,
A test device using a multi-termination module including at least two of the above correction boards, a first type correction board formed in a ┌ shape and a second type correction board formed in a ┐ shape symmetrical to the first type correction board. In paragraph 4,
At least two of the above correction boards include a first type correction board and a second type correction board,
The above first type compensation board includes a first connecting portion connected to the socket and a first body extending from the lower side of one front side of the first connecting portion,
The above second type compensation board is a test device using a multi-termination module including a second connecting portion connected to the socket and a second body extended from the lower side of the front side of the second connecting portion. In paragraph 7,
A test device using a multi-termination module, wherein the first connecting portion and the second connecting portion are arranged to overlap in the multi-termination module, and the first body and the second body are arranged to not overlap in the multi-termination module. In Article 8,
A test device using a multi-termination module in which the first type correction board and the second type correction board are alternately fixed to the case when at least four of the correction boards are fixed to the case. In Article 8,
The first correction circuit of the above first type correction board is mounted on the front side of the first main body,
The second correction circuit of the above second type correction board is a test device using a multi-termination module mounted on the front side of the above second main body.

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