KR102764058B1 - Substrate treating apparatus - Google Patents

Abstract

The substrate processing device of the present invention comprises: a spin chuck for supporting a substrate; a spin chuck for supporting a substrate; a bowl member surrounding the spin chuck; and a rinse solution supply member for supplying a rinse solution, wherein the bowl member comprises: a first bowl provided at a lower portion of the substrate and having an inclined surface inclined downwardly toward the outside, a cup positioned at the upper portion of the inclined surface and extending downward, a groove formed concavely on the inclined surface, and a through hole extending vertically through the groove member; and a second bowl provided at an outer side of the first bowl and having a discharge line connected to a bottom surface through which a fluid including the rinse solution that falls along the first bowl is discharged.

Description

{SUBSTRATE TREATING APPARATUS}

The present invention relates to a substrate processing device.

The manufacturing process of semiconductor devices includes processes such as photolithography, etching, ashing, thin film deposition, and cleaning. Among these processes, the photolithography, etching, ashing, and cleaning processes are processes that process the substrate by supplying a treatment solution onto the substrate. The photolithography process includes a coating step, an exposure step, and a developing step.

The coating step is a coating process in which a photosensitive liquid such as photoresist is applied on the substrate, and some of the used photosensitive liquid is recovered through the bail. The photosensitive liquid is viscous, so it may adhere to the bail during the recovery process. Therefore, after the substrate coating process is performed, it is necessary to clean the bail.

Meanwhile, cleaning of the paul requires the operator to physically clean the paul by separating it from the substrate processing device, which is time-consuming. In addition, if the processing vessel is contaminated with a large amount of photosensitive liquid, the paul must be replaced. Development is needed to reduce paul contamination.

The problem to be solved by the present invention is to provide a substrate treatment device capable of reducing contamination of a substrate.

The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the description below.

An aspect of a substrate processing device of the present invention for achieving the above object comprises: a spin chuck for supporting a substrate; a bowl member surrounding the spin chuck; and a rinse solution supply member for supplying a rinse solution, wherein the bowl member comprises: a first bowl provided on a lower portion of the substrate and having an inclined surface inclined downwardly toward the outside; a cup positioned at the upper portion of the inclined surface and extending downwardly; a groove formed concavely on the inclined surface; and a through hole extending vertically through the groove member; and a second bowl provided on the outer side of the first bowl and having a discharge line connected to a bottom surface through which a fluid including the rinse solution falling along the first bowl is discharged.

Another aspect of the substrate processing device of the present invention for achieving the above object comprises: a spin chuck including a support plate that supports a substrate and has a smaller diameter than the substrate; a bowl member surrounding the spin chuck; a guide member formed of a ring-shaped disc; a rinse solution supply member that supplies a rinse solution to the substrate and the bowl member; and a mesh ring provided on the bowl member and having a plurality of holes formed therein, wherein the bowl member has a cup provided with an inclined surface that slopes downwardly toward the outside between the substrate and the guide member, the inclined surface being positioned at the top and extending downward, and the guide member being provided on the peripheral surface, a groove portion that is concavely formed on the inclined surface and has a ring shape, and a plurality of through holes formed in the groove portion at positions opposite to the guide member in the vertical direction; a second bowl provided on the outside of the first bowl and having a discharge line that discharges a fluid including the rinse solution that falls along the first bowl and is located outside the edge of the guide member and is connected to a bottom surface; A first exhaust port through which airflow within the second bauble is exhausted, and which is located on the circumference of the cup, but extends upward from the bottom surface of the second bauble, and a gap is formed between the first exhaust port and the lower portion of the guide portion, and an airflow outside the bauble member is exhausted, and which is provided on the outer side of the second bauble, wherein an inclined surface of the first bauble extends downward with an edge being perpendicular to the ground, and the mesh ring surrounds between the first bauble and the second bauble, and is located at a starting point where the inclined surface of the first bauble extends perpendicularly.

Specific details of other embodiments are included in the detailed description and drawings.

FIG. 1 is a drawing illustrating a substrate processing device according to some embodiments of the present invention.
FIG. 2 is a diagram illustrating an example of a fluid flow state over time in a substrate processing device according to some embodiments of the present invention.
FIG. 3 is a diagram illustrating another example of a fluid flow state over time in a substrate processing device according to some embodiments of the present invention.
FIG. 4 is a cross-sectional view illustrating a bowl member of a substrate processing device according to the first embodiment of the present invention.
FIG. 5 is a perspective view illustrating a first bowl of a substrate processing device according to a first embodiment of the present invention.
FIG. 6 is a plan view illustrating a mesh ring of a substrate processing device according to the first embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The advantages and features of the present invention and the methods for achieving them will become apparent with reference to the embodiments described in detail below together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and these embodiments are provided only to make the disclosure of the present invention complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The terminology used herein is for the purpose of describing embodiments only and is not intended to be limiting of the invention. As used herein, the singular includes the plural unless the context clearly dictates otherwise. The terms "comprises" and/or "comprising" as used herein do not exclude the presence or addition of one or more other components, steps, operations, and/or elements.

FIG. 1 is a drawing illustrating a substrate processing device according to some embodiments of the present invention. FIG. 6 is a plan view illustrating a meshing of a substrate processing device according to a first embodiment of the present invention.

Referring to FIGS. 1 and 6, the substrate treatment device (100) can perform a treatment solution application process. The substrate treatment device (100) can include a housing (110), a fan filter unit (120), a substrate support unit (130), a solution supply unit (140), a rinse solution supply unit (150), a bowl member (160), a guide unit (170), and a mesh ring (180). Here, identification symbol 11 indicates the flow of the treatment solution, and identification symbol 13 indicates the air flow. In addition, identification symbol 15 of FIG. 4 indicates a cleaning solution and the flow of the cleaning solution.

The housing (110) may be provided with a space in which a substrate support unit (130) and a bowl member (160) are provided. An opening (not shown) may be formed on one side of the housing (110). The opening is an entrance through which a substrate (W) is taken out and a door (not shown) may be installed. When a substrate processing process is performed, the door may block the opening to seal the space of the housing (110).

A first exhaust port (113), a second exhaust port (115), and an exhaust line (117) may be formed at the bottom of the housing (110). The airflow formed within the housing (110) may be exhausted to the outside through the first exhaust port (113) and the second exhaust port (115).

For example, the airflow inside the bail member (160) can be exhausted through the first exhaust port (113), and the airflow outside the bail member (160) can be exhausted through the second exhaust port (115). In addition, the treatment liquid and the rinse liquid can be discharged to the outside through the discharge line (117).

The first exhaust port (113) may be positioned around the cup (161C) (see FIG. 4) of the first bowl (161) so that gas is exhausted and liquid does not pass through, but may extend upward from the bottom surface (169BT) of the second bowl (169). In addition, the exhaust line (117) may be formed so as not to protrude from the bottom surface (169BT) of the second bowl (169) so that the treatment liquid remains at least on the bottom surface (169BT) of the bowl member (160).

Although not shown in the drawing, an elevating unit may be provided within the housing (110). The elevating unit may adjust the relative height between the substrate support unit (130) and the bowl member (160). For example, the elevating unit may be provided to be connected to the bowl member (160) or the substrate support unit (130) to elevate and lower it. The elevating unit may include, but is not limited to, a bracket and a motor.

The fan filter unit (120) may be installed at the top of the housing (110). The fan filter unit (120) may be provided with a fan and a filter, and may form a descending airflow in the internal space of the housing (110). That is, the fan filter unit (120) may form an airflow from the top to the bottom of the substrate support unit (130).

Through the descending air current formed in the internal space of the housing (110), particles can be discharged to the outside via the first exhaust port (113) and the second exhaust port (115). The fan filter unit (120) is provided with a line connected to the outside, so that outside air can be supplied to the inside of the housing (110) through the line.

The substrate support unit (130) can support and rotate the substrate (W). The substrate support unit (130) can be provided as a spin chuck and can include a support plate (132) and a driver (136). The support plate (132) can be provided as a circular plate having a diameter smaller than that of the substrate (W). The driver (136) can be provided as a motor and can provide a rotational force to rotate the support plate (132).

The liquid supply unit (140) can supply a treatment liquid or a rinse liquid onto the substrate (W). For example, the treatment liquid can be a photoresist, and the rinse liquid can be a thinner/solvent that dilutes the treatment liquid. The liquid supply unit (140) can include a first nozzle (141) and a second nozzle (145).

The first nozzle (141) can supply the treatment liquid at the central position of the substrate (W). The first nozzle (141) can eject the treatment liquid onto the substrate (W) at a position opposite to the center of the substrate (W). Although not shown in the drawing, the first nozzle (141) can be connected to a treatment liquid supply unit.

The second nozzle (145) can supply the rinse solution at the center position of the substrate (W) and/or the edge position of the substrate (W). That is, the second nozzle (145) can be provided in a form that ejects the rinse solution over the entire substrate (W) or ejects the rinse solution at a bevel formed at the edge of the substrate (W). Various modifications are possible, such as the second nozzle (145) being supplied with the rinse solution from a separate supply unit or being connected to the rinse solution supply unit (150) to be supplied with the rinse solution.

The first nozzle (141) and the second nozzle (145) may process the substrate (W) at different times. For example, after the substrate (W) is processed through the first nozzle (141), the substrate (W) may be processed through the second nozzle (145).

The rinse liquid supply unit (150) can supply rinse liquid for cleaning the substrate (W) and the bowl member (160). The rinse liquid supply unit (150) can supply rinse liquid to the second nozzle (145) to clean the upper surface of the substrate (W). In addition, the rinse liquid supply unit (150) can include a first rinse liquid line (151) and a second rinse liquid line (152) to clean the lower surface of the substrate (W) and the bowl member (160). The first rinse liquid line (151) and the second rinse liquid line (152) have a branched structure so that the rinse liquid can be supplied from one storage tank. However, the present invention is not limited thereto.

The first rinse liquid line (151) may be provided so that the discharge port faces the lower surface of the substrate (W). For example, when the substrate (W) is rotated by the substrate support unit (130), the treatment liquid may be supplied from the first nozzle (141) to the upper surface of the substrate (W). At this time, the treatment liquid may be rolled along the edge of the substrate (W) to the lower surface due to viscosity. In this way, an unnecessary liquid film may be formed on the lower surface of the substrate (W), and thus cleaning of the lower surface of the substrate (W) is required. Cleaning of the lower surface of the substrate (W) may be performed by the rinse liquid discharged through the first rinse liquid line (151).

A nozzle (not shown) is provided at the end of the first rinse liquid line (151) so that the rinse liquid can be supplied to the lower surface of the substrate (W) through the nozzle. In addition, the nozzle may be provided so that the angle can be changed in multiple directions, so that various modifications are possible, such as the nozzle's discharge port being directed toward the first bowl (161) in addition to the lower surface of the substrate (W).

The second rinse liquid line (152) may have a discharge port connected to the bowl member (160), may be installed so that at least a portion of it penetrates the bowl member (160), or may be provided facing the bowl member (160). That is, the second rinse liquid line (152) may be provided in various structures/shapes for cleaning the bowl member (160).

For example, if the treatment liquid accumulates on the substrate (W), the bail member (160) must be replaced. To reduce the replacement cycle of the bail member (160), the second rinse liquid line (152) can supply the rinse liquid to the bail member (160).

A bail member (160) may be provided to surround the substrate support unit (130). The bail member (160) may include a first bail (161) and a second bail (169).

The first bowl (161) can guide the flow of a fluid such as a rinse solution. The first bowl (161) can be positioned at least partially above the first exhaust port (113) at the lower portion of the substrate (W). In addition, the first bowl (161) can be provided with a structure that surrounds the rotation shaft. The first bowl (161) can have a structure that is easy to clean with a rinse solution. This will be described later.

The second pole (169) may be provided as a tubular structure surrounding the first pole (161) on the outside of the first pole (161). The upper portion of the second pole (169) may have an inclined surface spaced apart from the first pole (161) at the upper portion of the first pole (161). The upper portion of the second pole (169) may be positioned higher than the substrate (W). An airflow introduced along the substrate (W) may pass under the upper structure (incline) of the second pole (169). The lower portion of the second pole (169) may have a cup shape, and a peripheral surface and a bottom surface (169BT) may be provided. A first exhaust port (113) and an exhaust line (117) may be installed on the bottom surface (169BT) of the second pole (169).

That is, the second bowl (169) can be connected to a discharge line (117) on the bottom surface (169BT) through which a fluid including a rinse liquid that falls along the first bowl (161) is discharged. In addition, the second bowl (169) can be connected to a first exhaust port (113) so that the air flow within the bowl member (160) can be exhausted.

The second pole (169) can be provided with the upper and lower parts separately and then joined together. This is to facilitate the installation of the first exhaust port (113) and the exhaust line (117) in the second pole (169), but is not limited thereto.

The guide part (170) can guide the flow of rinse liquid through the first bowl (161) to the bottom surface (169BT) of the second bowl (169), so that the bottom surface (169BT) is cleaned. This will be described later with reference to the drawings.

The mesh ring (180) surrounds the first pole (161) and the second pole (169), and a plurality of holes can be formed. For example, as shown in FIG. 4, the mesh ring (180) can be provided on the upper part of the edge (161E) of the first pole (161). That is, it is positioned at the starting point where the inclined surface of the first pole (161) extends perpendicularly, thereby improving the cleaning efficiency of the first pole (161) and the second pole (169).

For example, if the rinse liquid remains in the mesh ring (180) or the flow is delayed by the mesh ring (180), the stagnation time of the rinse liquid flowing along the edge (161E) of the first bowl (161) may increase, thereby increasing the cleaning time.

The supply of treatment liquid and rinse liquid is explained below with reference to the drawings.

FIGS. 2 and 3 are diagrams illustrating the flow state of fluid over time in a substrate processing device according to some embodiments of the present invention.

The fluids (treatment liquid and rinse liquid) supplied in the substrate treatment process may be supplied differently depending on the process time.

For example, referring to FIG. 2, first, during a first process time (T1 to T2), a flow of a treatment liquid may be formed through the first nozzle (141), so that the treatment liquid may be supplied from the first nozzle (141) to the upper surface of the substrate (W). After the treatment liquid, such as photoresist, is applied to the substrate (W), the fluid flow of the first nozzle (141) may be blocked. That is, during a second process time (T2 to T3) after the first process time, the flow of the treatment liquid through the first nozzle (141) may be blocked.

Meanwhile, during the second process time (T2 to T3), a flow of fluid can be formed through the second nozzle (145), the first rinse liquid line (151), and the second rinse liquid line (152). In other words, the rinse liquid can be supplied so that the upper surface of the substrate (W) is cleaned while the lower surface of the substrate (W) and the bowl member (160) are cleaned at the same time.

For example, when a flow of rinse liquid is formed from the second nozzle (145) to the upper surface of the substrate (W), rinse liquid may be supplied from the first rinse liquid line (151) to the lower surface of the substrate (W) so that the lower surface of the substrate (W) is cleaned. At the same time, rinse liquid may be supplied from the second rinse liquid line (152) to the bowl member (160) so that the bowl member (160) is cleaned.

Here, after the photoresist is applied to the substrate (W), the rinsing solution is supplied to the lower surface of the substrate (W) to prevent the rinsing solution having a different temperature, such as room temperature, from being supplied to the lower surface of the substrate (W) where heat is generated by the rotational force of the substrate support unit (130). That is, the effect of the photoresist, whose thickness is processed differently depending on the temperature, is minimized so that the coating process of the substrate (W) becomes uniform. Therefore, the supply of the rinsing solution can have various modifications as long as it does not affect the substrate (W).

As another example, referring to FIG. 3, when the treatment liquid is discharged from the first nozzle (141) to the substrate (W) during the first process time (T1 to T2) similar to the example, the fluid flow of the first rinse liquid line (151) can be blocked.

On the other hand, during the first process time (T1 to T2) in which the first nozzle (141) ejects the treatment liquid onto the upper surface of the substrate (W), the flow path of the second rinse liquid line (152) is opened so that the rinse liquid can be supplied to the bowl member (160).

That is, the flow of fluid through the first rinse liquid line (151) may not be performed simultaneously with the flow of fluid through the first nozzle (141). On the other hand, the flow of fluid through the second rinse liquid line (152) may not be performed simultaneously with the flow of fluid through the first nozzle (141), but may be performed simultaneously with the flow of fluid through the second nozzle (145), or as another example, may be performed simultaneously with the flow of fluid through the first nozzle (141) and simultaneously with the flow of fluid through the second nozzle (145).

Below, the first pole (161) will be described in detail with reference to the drawing.

Fig. 4 is a cross-sectional view illustrating a bowl member of a substrate processing device according to a first embodiment of the present invention. Fig. 5 is a perspective view illustrating a first bowl of a substrate processing device according to the first embodiment of the present invention.

Referring to FIGS. 4 and 5, first, the first pole (161) may include an inclined surface (161S), an edge (161E), and a cup (161C), and a groove (161H1) and a through hole (161H2) may be formed.

The inclined surface (161S) of the first pole (161) may be provided at the lower portion of the substrate (W) and may be inclined downward in an outward direction to guide the fluid. A groove (161H1) and a through hole (161H2) may be formed in the inclined surface (161S).

The edge (161E) of the first bowl (161) may be provided facing the discharge line (117) in the upper and lower direction or on the outside to allow the treatment liquid to easily flow into the discharge line (117). The edge (161E) of the first bowl (161) may be extended in the lower direction and spaced apart from the first exhaust port (113), thereby preventing the treatment liquid passing through the first bowl (161) from flowing into the first exhaust port (113).

The edge (161E) of the first bowl (161) can prevent the treatment liquid from flowing into the first exhaust port (113), while improving the cleaning efficiency by the mesh ring (180). This is because the rinse liquid remains in the mesh ring (180) or the flow of the rinse liquid is delayed by the mesh ring (180), so that the stagnation time of the rinse liquid flowing along the edge (161E) of the first bowl (161) can increase.

The cup (161C) may have an inclined surface (161S) positioned on the upper side. For example, the cup (161C) may have a structure in which the cup is coupled to the center of the inclined surface (161S). The cup (161C) may have a structure in which a peripheral surface is formed.

The groove (161H1) may be formed concavely on the inclined surface (161S) so that the cleaning liquid can remain therein. The groove (161H1) may have a ring shape, and a plurality of grooves (161H1) may be formed spaced apart from each other in an outward direction from the inclined surface (161S). Among the plurality of grooves (161H1), the groove (161H1) located at the uppermost position is connected to the second rinse liquid line (152) so that the rinse liquid can be directly supplied thereto, and the groove (161H1) located below the uppermost position allows the rinse liquid flowing along the inclined surface (161S) to remain therein.

However, it is not limited to this, and various modifications are possible, such as the discharge port of the second rinse liquid line (152) being formed at a position higher than the groove portion (161H1).

The rinse liquid introduced into the home portion (161H1) may remain in the home portion (161H1) for a certain period of time due to the downwardly inclined structure of the inclined surface (161S) and the continuously supplied rinse liquid, and then the continuously supplied rinse liquid may overflow and fall along the inclined surface (161S) to the bottom surface (169BT) of the second bowl (169). In this process, the rinse liquid may clean the first bowl (161).

The through hole (161H2) penetrates vertically from the groove (161H1) so that the rinse liquid can be discharged. In other words, the through hole (161H2) can form an outlet through which the cleaning liquid is supplied from the first bowl (161) to the guide portion (170) and/or the bottom surface (169BT) of the second bowl (169). Accordingly, the bottom surface (169BT) of the second bowl (169) (which may be an area between the discharge line (117) and the first exhaust port (113)) that is difficult for the rinse liquid to reach can be easily cleaned.

The guide part (170) may be provided on the circumference of the cup (161C) of the first bowl (161) and may be provided as a ring-shaped disc. However, the present invention is not limited thereto. The guide part (170) may have various structures that cover the first exhaust port (113) to prevent the treatment liquid or rinse liquid from flowing into the first exhaust port (113). Various modifications are possible, such as being provided at a position facing the first exhaust port (113) in the vertical direction, but formed of a plurality of plates (e.g., fan-shaped) that are radially spaced apart from each other.

In addition, the guide part (170) may be provided spaced apart from the upper portion of the first exhaust port (113) so as to cover the first exhaust port (113) while not blocking the first exhaust port (113) so as to prevent the fluid discharged from the through hole (161H2) from flowing into the first exhaust port (113).

And, so that the rinse liquid falling along the guide part (170) falls onto the bottom surface (169BT) of the second bowl (169), the edge of the guide part (170) may be positioned inside the discharge line (117). In addition, the guide part (170) may be inclined downward in the outward direction so that the fluid is guided and falls in a downward direction.

Although the embodiments of the present invention have been described with reference to the above and the attached drawings, those skilled in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing the technical idea or essential characteristics thereof. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

100: Substrate Processing Unit
160: Paul's Absence
170: Guide Department

Claims (10)

Spin chuck supporting the substrate;
A rinse solution supply unit that supplies rinse solution;
A bowl member comprising: a first bowl having an inclined surface provided on the lower portion of the substrate and slanted downwardly toward the outside, a cup positioned on the upper portion of the inclined surface and extending downward, a groove formed concavely on the inclined surface, and a through hole extending vertically through the groove; and a second bowl member having a discharge line provided on the outside of the first bowl and connected to a bottom surface for discharging a fluid including the rinse liquid that falls along the first bowl;
A first exhaust port, through which airflow within the above-mentioned bowl is exhausted, is located on the circumference of the above-mentioned cup and extends upward from the bottom surface of the above-mentioned second bowl; and
It is provided on the circumference of the above cup and includes a guide part made of a ring-shaped disc or a plurality of plates spaced apart from each other radially.
A substrate processing device, wherein the guide portion is provided spaced apart from the upper portion of the first exhaust port so as to cover the first exhaust port without blocking it, so as to prevent fluid discharged from the through hole from flowing into the first exhaust port. In the first paragraph,
A substrate processing device in which airflow outside the above-mentioned bowl is exhausted, and a second exhaust port is further formed outside the above-mentioned second bowl. delete delete Spin chuck supporting the substrate;
A rinse solution supply unit that supplies rinse solution;
A bowl member having a first bowl, which is provided on the lower part of the substrate and has an inclined surface that slopes downwardly toward the outside and a cup that is positioned on the upper part of the inclined surface and extends downward, a groove formed concavely on the inclined surface, and a through hole that penetrates vertically through the groove, and a second bowl member having a discharge line that is provided on the outside of the first bowl and is connected to a bottom surface for discharging a fluid including the rinse liquid that falls along the first bowl; and
It is provided on the circumference of the above cup and includes a guide part made of a ring-shaped disc or a plurality of plates spaced apart from each other radially.
A substrate processing device wherein the discharge line is positioned outside the edge of the guide section so that the rinse liquid falling along the guide section falls onto the bottom surface of the second bowl. In paragraph 5,
A substrate processing device, wherein the edge of the first pole is positioned outside the discharge line or positioned so as to be vertically opposite to the discharge line. Spin chuck supporting the substrate;
A rinse solution supply unit that supplies rinse solution;
A bowl member having a first bowl, which is provided on the lower part of the substrate and has an inclined surface that slopes downwardly toward the outside and a cup that is positioned on the upper part of the inclined surface and extends downward, a groove formed concavely on the inclined surface, and a through hole that penetrates vertically through the groove, and a second bowl member having a discharge line that is provided on the outside of the first bowl and is connected to a bottom surface for discharging a fluid including the rinse liquid that falls along the first bowl; and
It is provided on the circumference of the above cup and includes a guide part made of a ring-shaped disc or a plurality of plates spaced apart from each other radially.
The above home portion is formed in a ring shape,
The above guide portion is a substrate processing device that slopes downward in an outward direction. Spin chuck supporting the substrate;
Absence of a pole surrounding the above spin chuck; and
Includes a rinse solution supply unit that supplies rinse solution,
The above absence of Paul,
A first bowl is provided on the lower part of the substrate and has a downwardly sloping surface and a cup with the inclined surface positioned at the upper part and extending downward, a groove formed concavely on the inclined surface, and a through hole penetrating upwardly and downwardly through the groove; and
A second bowl is provided on the outside of the first bowl and includes a discharge line for discharging a fluid including the rinse liquid that falls along the first bowl, and is connected to the bottom surface.
The above rinse solution supply unit,
A first rinse liquid line having a discharge port formed toward the lower edge of the substrate; and
A substrate processing device comprising a second rinse liquid line connected to the home portion. In the first paragraph,
A substrate processing device further comprising a mesh ring formed between the first and second poles and having a plurality of holes. A spin chuck comprising a support plate that supports a substrate and has a diameter smaller than that of the substrate;
Absence of a pole surrounding the above spin chuck;
A guide part made of a ring-shaped disc;
A rinse solution supply unit for supplying rinse solution to the substrate and the bowl absence; and
It is provided in the absence of the above-mentioned Paul, and includes a mesh ring in which a number of holes are formed,
The above absence of Paul,
A first bowl having an inclined surface slanted downwardly toward the outside between the substrate and the guide portion, a cup having the inclined surface positioned at the top and extending downward, and the guide portion provided on the circumferential surface, a groove portion concavely formed on the inclined surface and having a ring shape, and a plurality of through holes formed in the groove portion at positions facing the guide portion in the vertical direction;
A second bowl provided on the outside of the first bowl and having a discharge line connected to the bottom surface and located outside the edge of the guide section to discharge a fluid including the rinse liquid that falls along the first bowl;
A first exhaust port through which airflow within the second bowl is exhausted, located on the circumference of the cup, extending upward from the bottom surface of the second bowl, and forming a gap between the first exhaust port and the lower portion of the guide portion; and
The airflow outside the above-mentioned Paul absence is exhausted, and a second exhaust port provided on the outside of the second Paul is included.
The slope of the first pole extends downward with its edge perpendicular to the ground,
A substrate processing device, wherein the mesh ring is positioned at a starting point where the inclined surface of the first pole extends perpendicularly between the first pole and the second pole.

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