KR102779917B1 - Sensor detection device and semiconductor apparatus using the same - Google Patents

Abstract

A sensor detection device according to an embodiment of the present invention may include: a main body having a bearing housing formed therein; a sensor detection plate formed to be connected to one side of the main body so that sensing is performed by approaching one of a plurality of position detection sensors as the main body is tilted; a bearing inserted into the bearing housing; and a support formed to be connected to the other side of the main body and made of a material having a higher specific gravity than the material of the main body.

Description

{Sensor detection device and semiconductor apparatus using the same}

The present invention relates to a sensor detection device and a semiconductor device using the same.

Among semiconductor equipment, equipment for expanding and separating WBL (wafer backside lamination) from a wafer may include a heater device for the above-described process.

The above-described heater device performs a rotational motion, and during the rotational operation, the rotational motion is controlled by detecting the rotation limit point in the clockwise or counterclockwise direction through a plurality of sensors.

At this time, the detection of the sensor can be implemented in a manner in which the sensor detection plate located between the plurality of sensors approaches one of the plurality of sensors as it tilts according to external pressure and detects the rotation limit point in the clockwise or counterclockwise direction.

The sensor detection plate described above is currently equipped with a separate spring so that it can stand upright before being tilted when the external pressure is removed while in a tilted state.

Meanwhile, the spring is often damaged in the process of continuously receiving clockwise or counterclockwise energy as the detection plate tilts.

In addition, due to the spring being broken, the sensor detection plate is tilted to the left or right regardless of the presence or absence of external pressure, causing errors in sensor detection.

An embodiment of the present invention provides a sensor detection device capable of standing up independently after a main body is tilted by pressurization under conditions of relatively little influence by heat and no spatial constraints, and a semiconductor device using the same.

A sensor detection device according to an embodiment of the present invention may include: a main body having a bearing housing formed therein; a sensor detection plate formed to be connected to one side of the main body so as to allow sensing to be performed by approaching one of a plurality of position detection sensors as the main body is tilted; a bearing inserted into the bearing housing; and a support formed to be connected to the other side of the main body and made of a material having a higher specific gravity than the material of the main body.

According to an embodiment of the present invention, a sensor detection device may include: a main body having a bearing housing formed therein; a sensor detection plate formed to be connected to one side of the main body so that sensing is performed by approaching one of a plurality of position detection sensors as the main body is tilted; a bearing inserted into the bearing housing; a support formed to be connected to the other side of the main body, the support having an insertion groove formed with a preset depth in an upward direction from a lower surface; a magnetic body formed in a form inserted into the insertion groove; and a support plate positioned on a lower surface of the support body, the area of which comes into contact with the magnetic body being formed of a metal material.

According to an embodiment of the present invention, a semiconductor device may include: a plurality of position detection sensors for detecting approach of a specific object; a pin for pressing a side surface of the sensor detection device to cause the sensor detection device to tilt in one of a first direction and a second direction; a sensor detection device which tilts in one of the first direction and the second direction as the pin is pressed and approaches one of the plurality of position detection sensors; a rotating body having the pin and a processing device formed thereon and rotating according to driving of the processing device; a driving unit for driving the rotating body; and a controller for controlling driving of the driving unit and determining a rotational position of the processing device based on sensing information transmitted from one of the plurality of position detection sensors.

According to the present embodiments, it is expected that a sensor detection device having a structure that can stand up by itself after being tilted can be provided.

In addition, according to the present embodiments, since the components forming the sensor detection device are relatively less constrained by heat and have a relatively longer lifespan than in the past, the performance of the sensor detection device can be maintained in good condition, thereby improving the sensor detection efficiency.

In addition, according to the present embodiment, since a sensor detection device capable of standing up independently is provided without the need for implementing a separate additional component that takes up space, space constraints are relatively reduced, and thus usability for various equipment can be increased.

FIG. 1 is a drawing showing the arrangement relationship between a wafer and a heater device according to an embodiment of the present invention.
FIG. 2 is a drawing showing an example of installation of a sensor detection device according to an embodiment of the present invention.
FIGS. 3 and 4 are exemplary diagrams for explaining an operation example of a sensor detection device according to an embodiment of the present invention.
FIGS. 5 to 8 are drawings showing an embodiment of a sensor detection device according to an embodiment of the present invention.
FIGS. 9 to 12 are drawings showing other embodiments of a sensor detection device according to an embodiment of the present invention.
FIG. 13 is a drawing showing the configuration of a semiconductor device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described based on the attached drawings.

FIG. 1 is a drawing showing the arrangement relationship between a wafer and a heater device according to an embodiment of the present invention, and FIG. 2 is a drawing showing an example of installation of a sensor detection device according to an embodiment of the present invention. At this time, FIG. 2 may be a drawing showing the interior of part A of FIG. 1 as an example.

Specifically, FIG. 1 is intended to illustrate a process of expanding and separating a WBL (wafer backside lamination) from a wafer (10) while the wafer (10) is mounted on top of a wafer ring (20). Although not shown, the wafer ring (20) on which the wafer (10) is mounted may be positioned on top of a chuck table.

For the above-described process, a semiconductor device (30) may be placed on top of the wafer (10). At this time, the semiconductor device (30) may be a heater device for performing a heating operation.

The semiconductor device (30) performs a rotation operation, and during the rotation operation, the rotation operation is controlled by detecting the rotation limit point in the clockwise or counterclockwise direction through a plurality of position detection sensors (210, 211, 213 of FIG. 3).

FIG. 2 shows the interior of part A of FIG. 1 of a semiconductor device (30). The semiconductor device (30) may include processing equipment (32) for performing a heater operation, etc., and a sensor detection device (100) connected to the processing equipment (32).

As shown in Fig. 2, the processing equipment (32) is formed on top of the rotating body (250), and the rotating body (250) can rotate separately from the area of the processing equipment (32) equipped with the sensor detection device (100).

At this time, a sensor detection device (100) may be attached to the side of the processing equipment (32). The processing device (32) may be a device implemented inside the heater device.

As the rotating body (250) rotates, a pin formed to be fixed to the upper portion of the rotating body (250) presses a specific area (e.g., the lower side) of the sensor detection device (100), so that the sensor detection device (100) tilts in one direction and approaches one of the plurality of position detection sensors (211, 213) arranged on both sides.

FIGS. 3 and 4 are exemplary diagrams for explaining an operation example of a sensor detection device according to an embodiment of the present invention.

As shown in FIGS. 3 and 4, the sensor detection device (100) may be positioned between a plurality of position detection sensors (210, 211, 213) and arranged in a row side by side.

In this arrangement, as the rotating body (250) rotates counterclockwise (① in FIG. 3) or clockwise (② in FIG. 4), the pin (230) formed to be fixed to the upper portion of the rotating body (250) presses the lower side of the sensor detection device (100). At this time, it will be obvious that the area where the pin (230) presses the sensor detection device (100) is not limited to the lower side.

Referring to FIGS. 3 and 4, a sensor detection device (100) positioned between a plurality of position detection sensors (211, 213) approaches in a form in which a sensor detection plate (120 of FIG. 3) is inserted into one of the plurality of position detection sensors (211, 213) as it is tilted by external pressure.

The above-described position detection sensor (211, 213) is formed of an optical sensor and can transmit and receive an optical signal. Referring to Fig. 3, the position detection sensor (211, 213) is formed in a T-shape and can transmit an optical signal from one side of a T-shaped area to the other side.

In this structure, the sensor detection device (100) is inserted into the T-shaped area of the position detection sensor (211, 213) due to the tilt, and the position detection sensor (211, 213) senses because the path of the optical signal is blocked.

Afterwards, the sensor detection device (100) stands up on its own in the vertical state before being tilted when the external pressure on the pin (230) is removed.

FIGS. 5 to 8 are drawings showing an embodiment of a sensor detection device according to an embodiment of the present invention.

Referring to FIG. 5, the sensor detection device (100) may include a main body (110), a sensor detection plate (120), a bearing (130), and a support (140).

Additionally, the sensor detection device (100) may include a first fixing part (151), a second fixing part (153), a third fixing part (155), and a fourth fixing part (157).

As shown in Fig. 8, the main body (110) may have a configuration in which a bearing housing (111) is formed.

At this time, the main body (110) is not limited to a specific material, and can be arbitrarily determined according to the weight distribution, material conditions, etc. of the sensor detection device (100) according to the operator's needs.

The sensor detection plate (120) may be configured to be connected to one side of the main body (110) so that sensing is performed by approaching one of the plurality of position detection sensors (211, 213) as the main body (110) is tilted.

As shown in FIGS. 5 to 8, the sensor detection plate (120) may have one side formed in an arrow shape that approaches one of the plurality of position detection sensors (211, 213 in FIG. 3), but is not limited thereto. For example, even if one side of the sensor detection plate (120) is not in an arrow shape, it may be formed in a shape that can be inserted into an area capable of blocking the optical signal path of the position detection sensor (211, 213).

The above-described position detection sensor (211, 213) is not limited to an optical sensor.

The bearing (130) may be configured to be inserted into a bearing housing (111). For example, the bearing (130) may be inserted into a bearing housing (111) such as that of FIG. 8 to form a structure as shown in FIG. 6.

The bearing (130) described above may be a high-speed bearing with a relatively small rotational load. The high-speed bearing can be expected to have the effect of applying a relatively small rotational load compared to a bushing that is generally applied. At this time, when the load is minimized, the bushing may experience a phenomenon in which the play becomes severe. In contrast, the high-speed bearing can reduce the rotational load, and thus may be suitable for the self-standing of the sensor detection device (100).

The support (140) is formed to be connected to the other side of the main body (110), and may be formed of a material having a greater specific gravity than the material of the main body (110).

For example, the sensor detection plate (120) may be formed of aluminum, and the support (140) may be formed of copper. Referring to FIG. 5, the sensor detection device (100) may be easily standing up even when tilted at an arbitrary angle because the sensor detection plate (120) made of a material having a relatively small specific gravity compared to the support body (140) is positioned at the top when standing vertically, and the support body (140) made of a material having a relatively large specific gravity compared to the sensor detection plate (120) is positioned at the bottom. At this time, the sensor detection device (100) may be attached to the side of the processing equipment (32) as shown in FIG. 2, and may be floating in the air, separated from the rotating body (250).

The support (140) described above is not limited to copper material, and may be applied with a material having a weight corresponding to about 25% of the total weight for the self-standing of the sensor detection device (100). At this time, the weight of the support (140) is also not limited to 25%, and may be changed and applied according to the operator's needs.

Referring to FIG. 7, the first fixing member (151) can be inserted in a form penetrating the bearing (130) and the bearing housing (111) to fasten the bearing (130) to the bearing housing (111).

The second fixed part (153) may be formed in a form that is tightened to one side of the first fixed part (151) to fasten the bearing (130) to the bearing housing (111).

The third fixed part (155) may be configured to fasten the main body (110) and the sensor detection plate (120).

The main body (110) and the sensor detection plate (120) are separated as shown in FIG. 8, and the main body (110) and the sensor detection plate (120) are fastened through the third fixing part (155).

The fourth fixed part (157) may be configured to fasten the main body (110) and the support (140).

FIGS. 9 to 12 are drawings showing other embodiments of a sensor detection device according to an embodiment of the present invention.

Below, a case in which a magnetic body (170) is additionally applied to a support (160) will be described as an example.

Referring to FIGS. 9 to 12, the sensor detection device (100) may include a main body (110), a sensor detection plate (120), a bearing (130), a support (160), a magnetic body (170), and a support plate (252).

Additionally, the sensor detection device (100) may include a first fixing part (151), a second fixing part (153), a third fixing part (155), and a fourth fixing part (157).

As shown in Fig. 11, the main body (110) may have a configuration in which a bearing housing (111) is formed.

The sensor detection plate (120) may be formed to be connected to one side of the main body (110) so that sensing is performed by approaching one of the plurality of position detection sensors (211, 213 of FIG. 3) as the main body (110) is tilted.

The sensor detection plate (120) may be formed of aluminum material, but is not limited thereto.

As shown in FIGS. 9 to 12, the sensor detection plate (120) may have one side formed in an arrow shape that approaches one of the plurality of position detection sensors (211, 213).

The bearing (130) may be configured to be inserted into a bearing housing (111). For example, the bearing (130) may be inserted into a bearing housing (111) such as that of FIG. 11 to form a structure as shown in FIG. 10.

The bearing (130) described above may be a high-speed bearing with a relatively small rotational load. The high-speed bearing can be expected to have the effect of applying a relatively small rotational load compared to a bushing that is generally applied. At this time, since the bushing may experience a phenomenon in which the play becomes severe when the load is minimized, a high-speed bearing may be more suitable than a bushing in order to reduce the rotational load.

As shown in Fig. 11, the support (160) is formed to be connected to the other side of the main body (110), and an insertion groove (162) of a preset depth may be formed from the lower surface in an upward direction.

The above support (160) may be formed of a material having a greater specific gravity than the material of the main body (110).

Referring to Fig. 11, the magnetic body (170) can be formed in a form that is inserted into the insertion groove (162).

The above magnetic body may be formed of a neodymium magnet, but is not limited thereto.

Referring to FIG. 12, the support plate (252) is located on the lower surface of the support body (160), and the area in contact with the magnetic body (170) may be formed of a metal material.

Referring to Fig. 12, since the magnetic body (170) and the support plate (252) described above can generate magnetic force on each other, if no external pressure is applied to the sensor detection device (100), it can be as in (a). If, as in cases (b) and (c), a pushing force is generated on the sensor detection device (100) by the pin (230), a restoring force is generated in the opposite direction to the pushing force due to the magnetic force generated between the magnetic body (170) and the support plate (252), so that the sensor detection device (100) can more easily achieve vertical independence as in (a).

Referring to FIG. 11, the first fixing member (151) can be inserted in a form that penetrates the bearing (130) and the bearing housing (111) to fasten the bearing (130) to the bearing housing (111).

The second fixed part (153) may be formed in a form that is tightened to one side of the first fixed part (151) to fasten the bearing (130) to the bearing housing (111).

The third fixed part (155) may be configured to fasten the main body (110) and the sensor detection plate (120).

The fourth fixed part (157) may be configured to fasten the main body (110) and the support (140).

FIG. 13 is a drawing showing the configuration of a semiconductor device according to an embodiment of the present invention.

Referring to FIG. 13, the semiconductor device (30) may include a communication unit (201), a position detection sensor (210), a pin (230), a rotor (250), a driving unit (270), a controller (290), and a sensor detection device (100).

The communication unit (201) may be configured to perform communication for data transmission and reception between the semiconductor device (30) and an external device. For example, the rotational position of the processing equipment (32 in FIG. 2) identified through the controller (290) may be transmitted to an operator terminal (not shown), and data transmitted from the operator terminal may be received.

The position detection sensor (210) is configured to detect the approach of a specific object, and may be composed of multiple sensors in this embodiment.

The position detection sensor (210) is composed of an optical sensor and can transmit and receive optical signals. Referring to Fig. 3, the position detection sensor (211, 213) is formed in a T-shape and can transmit optical signals from one side of the T-shaped area to the other side.

In this structure, the sensor detection device (100) is inserted into the T-shaped area of the position detection sensor (211, 213) due to the tilt, and the position detection sensor (211, 213) senses the position by blocking the path of the optical signal.

In this embodiment, the position detection sensor (211, 213) is described as an example of a light sensor, but it is not limited thereto and any sensor that can detect proximity to the sensor detection device (100) may be applied. For example, the position detection sensor (211, 213) may be implemented as various sensors such as a proximity sensor using a wireless short-range communication method such as NFC (near field communication).

The pin (230) may be configured to pressurize the side of the sensor detection device (100) to cause it to tilt in either the first direction or the second direction.

The pin (230) may be made of a material that is determined by considering the material of the contact area of the sensor detection device (100). For example, if the contact area of the sensor detection device (100) includes a magnetic body, the pin (230) should be made of a material (e.g., an insulating material) that is not affected by the magnetic body described above. If the sensor detection device (100) is of a type in which a magnetic body (170) is formed on a support (160) as shown in FIG. 10, the pin (230) should be made of a material that is not affected by the magnetic body (170).

The rotating body (250) may be configured to have a pin (230) and a processing device (32 in FIG. 2) formed on the upper portion, and to rotate according to the operation of the processing device.

The driving unit (270) may be configured to drive the rotating body (250).

The sensor detection device (100) may be configured to tilt in one of the first direction (① in FIG. 3) and the second direction (② in FIG. 3) as the pin (230) is pressed, and to approach one of the plurality of position detection sensors (211, 213).

Referring to FIG. 5, the sensor detection device (100) may include a main body (110), a sensor detection plate (120), a bearing (130), and a support (140).

Additionally, the sensor detection device (100) may include a first fixing part (151), a second fixing part (153), a third fixing part (155), and a fourth fixing part (157).

As shown in Fig. 8, the main body (110) may have a configuration in which a bearing housing (111) is formed.

The sensor detection plate (120) may be configured to be connected to one side of the main body (110) so that sensing is performed by approaching one of the plurality of position detection sensors (211, 213) as the main body (110) is tilted.

As shown in FIGS. 5 to 8, the sensor detection plate (120) may have one side formed in an arrow shape approaching one of the plurality of position detection sensors (211, 213), but is not limited thereto.

The bearing (130) may be configured to be inserted into a bearing housing (111). For example, the bearing (130) may be inserted into a bearing housing (111) such as that of FIG. 8 to form a structure as shown in FIG. 6.

The bearing (130) described above may be a high-speed bearing with a relatively small rotational load. The high-speed bearing can be expected to have the effect of applying a relatively small rotational load compared to a bushing that is generally applied. At this time, since the bushing may experience a phenomenon in which the play becomes severe when the load is minimized, a high-speed bearing may be more suitable than a bushing in order to reduce the rotational load.

The support (140, 160) may be as in either FIG. 5 or FIG. 9.

Below, we will explain two cases as examples.

For example, referring to FIG. 5, the support (140) is formed to be connected to the other side of the main body (110), but may be formed of a material having a greater specific gravity than the material of the main body (110).

For example, the sensor detection plate (120) may be formed of aluminum, and the support (140) may be formed of copper. The support (140) is not limited to copper, and may be applied with a material having a weight corresponding to about 25% of the total weight for the self-standing of the sensor detection device (100). At this time, the weight of the support (140) is also not limited to 25%, and may be changed and applied according to the operator's needs.

Referring to FIG. 7, the first fixing member (151) can be inserted in a form penetrating the bearing (130) and the bearing housing (111) to fasten the bearing (130) to the bearing housing (111).

The first fixed part (151) described above can be formed so that, when tightened with the second fixed part (153), there is a region that protrudes from the second fixed part (153) in the longitudinal direction.

Referring to FIG. 2, the protruding area may be formed such that the sensor detection device (100) is positioned apart from the upper surface of the rotating body (250) by being attached to the side of the processing equipment (32), but within a distance that allows the pin (230) to press the sensor detection device (100).

The second fixed part (153) may be formed in a form that is tightened to one side of the first fixed part (151) to fasten the bearing (130) to the bearing housing (111).

The third fixed part (155) may be configured to fasten the main body (110) and the sensor detection plate (120).

The main body (110) and the sensor detection plate (120) are separated as shown in FIG. 8, and the main body (110) and the sensor detection plate (120) are fastened through the third fixing part (155).

The fourth fixed part (157) may be configured to fasten the main body (110) and the support (140).

As another example, referring to FIGS. 9 and 11, the support (160) may have an insertion groove (162) formed with a preset depth from the lower surface to the upper surface.

When applying another example of a support (160), the sensor detection device (100) may further include a magnetic body (170) formed in a form that is inserted into an insertion groove (162) and a support plate (252) positioned on the lower surface of the support (160) and having an area in contact with the magnetic body (170) formed of a metal material.

At this time, the magnetic body (170) may be made of a neodymium magnet, but is not limited thereto.

When a magnetic body is inserted into the insertion groove (162), the pin (230) may be formed of an insulating material.

The support plate (252) is formed between the pin (230) and the processing equipment (32) and the rotating body (250), and may be formed separately on the upper surface of the rotating body (250) or formed integrally with the rotating body (250).

The controller (290) controls the operation of the driving unit (270) and can determine the rotational position of the processing equipment (32) based on sensing information transmitted from one of a plurality of position detection sensors (211, 213).

The controller (290) can transmit the rotational position of the processing equipment (32) to an operator terminal, etc. through the communication unit (201), and then receive the control information, etc. in return.

Those skilled in the art should understand that the present invention can be implemented in other specific forms without changing the technical idea or essential characteristics thereof, and thus the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is indicated by the claims described below rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be interpreted as being included in the scope of the present invention.

100: Sensor detection device
110: Body
120: Sensor detection plate
130: Bearing
140, 160: Support
200: Semiconductor devices
210, 211, 213: Position detection sensor
230: pin
250: Rotor

Claims (22)

A body in which a bearing housing is formed;
A sensor detection plate formed to be connected to one side of the main body so that sensing is performed by approaching one of the plurality of position detection sensors as the main body is tilted;
A bearing inserted into the above bearing housing;
A support formed to be connected to the other side of the main body, but formed of a material having a higher specific gravity than the material of the main body; and
A fourth fixing member for connecting the above main body and the above support,
A sensor detection device comprising: In the first paragraph,
A sensor detection device wherein the sensor detection plate is formed of aluminum material and the support is formed of copper material. In the first paragraph,
The above sensor detection plate,
A sensor detection device having one side formed in the shape of an arrow that approaches one of the above plurality of position detection sensors. In the first paragraph,
A first fixing member inserted in a form penetrating the bearing and the bearing housing to fasten the bearing to the bearing housing; and
A second fixing part formed in a form that is tightened to one side of the first fixing part and connects the bearing to the bearing housing;
A sensor detection device further comprising: In the first paragraph,
A third fixing part for connecting the above body and the above sensor detection plate,
A sensor detection device further comprising: A body in which a bearing housing is formed;
A sensor detection plate formed to be connected to one side of the main body so that sensing is performed by approaching one of the plurality of position detection sensors as the main body is tilted;
A bearing inserted into the above bearing housing;
A support formed to be connected to the other side of the main body, and having an insertion groove formed with a preset depth in an upward direction from the lower surface;
A magnetic body formed in a form that is inserted into the above insertion groove; and
A support plate is located on the lower surface of the support body and includes a region formed of a metal material that comes into contact with the magnetic body.
A sensor detection device in which a restoring force for vertical independence is generated due to the magnetic force generated between the above-mentioned magnetic body and the above-mentioned support plate. In Article 6,
The above magnetic body is a sensor detection device made of a neodymium magnet. In Article 6,
A sensor detection device in which the above sensor detection plate is formed of aluminum material and the support is formed of a material having a higher specific gravity than the material of the main body. In Article 6,
The above sensor detection plate,
A sensor detection device having one side formed in the shape of an arrow that approaches one of the above plurality of position detection sensors. In Article 6,
A first fixing member inserted in a form penetrating the bearing and the bearing housing to fasten the bearing to the bearing housing; and
A second fixing part formed in a form that is tightened to one side of the first fixing part and connects the bearing to the bearing housing;
A sensor detection device further comprising: In Article 6,
A third fixing member for connecting the main body and the sensor detection plate; and
A fourth fixing member for connecting the above main body and the above support,
A sensor detection device further comprising: Multiple position detection sensors for detecting the approach of a specific object;
A pin for pressing the side of a sensor detection device to cause it to tilt in either the first direction or the second direction;
A sensor detection device that tilts in one of the first direction and the second direction as the pin is pressed and approaches one of the plurality of position detection sensors;
A rotating body formed with the above pins and processing equipment at the upper part and rotating according to the driving of the processing equipment;
A driving unit for driving the above-mentioned rotating body; and
Including a controller that controls the driving of the above driving unit and determines the rotational position of the processing equipment based on sensing information transmitted from any one of the plurality of position detection sensors,
The above sensor detection device,
A body having a bearing housing formed thereon, a sensor detection plate formed to be connected to one side of the body so that sensing is performed by approaching one of a plurality of position detection sensors as the body is tilted, a bearing inserted into the bearing housing, a support formed to be connected to the other side of the body and made of a material having a higher specific gravity than the material of the body, and a fourth fixing member for connecting the body and the support.
A semiconductor device comprising: delete In Article 12,
A semiconductor device in which the sensor detection plate is formed of aluminum material and the support is formed of copper material. In Article 12,
The above sensor detection plate,
A semiconductor device having one side formed in the shape of an arrow that approaches one of the above multiple sensors. In Article 12,
The above sensor detection device,
A first fixing member inserted in a form penetrating the bearing and the bearing housing to fasten the bearing to the bearing housing; and
A second fixing part formed in a form that is tightened to one side of the first fixing part and connects the bearing to the bearing housing;
A semiconductor device further comprising: In Article 16,
The above first fixed part is,
It is formed so that a region protrudes from the second fixing part in the longitudinal direction while being tightened with the second fixing part,
A semiconductor device in which the protruding region is attached to a side of the processing equipment so that the sensor detection device is positioned apart from the upper surface of the rotating body, but is formed within a distance that allows the pin to press the sensor detection device. In Article 12,
The above sensor detection device,
A third fixing part for connecting the above body and the above sensor detection plate,
A semiconductor device further comprising: In Article 12,
The above support has an insertion groove formed with a preset depth in the upward direction from the lower surface,
The above sensor detection device,
A magnetic body formed in a form that is inserted into the above insertion groove; and
A support plate located on the lower surface of the support body and having an area in contact with the magnetic body formed of a metal material,
A semiconductor device further comprising: In Article 19,
The above magnetic body is a semiconductor device made of a neodymium magnet. In Article 19,
When the magnetic body is inserted into the above insertion groove,
The above pin is a semiconductor device formed of an insulating material. In Article 19,
The above support plate,
A semiconductor device formed between the above pin and processing equipment and the above rotor, wherein the semiconductor device is formed separately on the upper surface of the above rotor or formed integrally with the above rotor.

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