KR102801402B1 - A Panels Sticking and PCB Inspecting Pressing Appartus - Google Patents

Abstract

The present invention relates to a pressing device for panel bonding and substrate inspection, comprising: a frame portion formed in a plate shape; a heating jig portion having a heater provided inside and horizontally seated on an upper surface of the frame portion so that a plate-shaped workpiece and a panel are seated on the upper surface; a driving portion provided in the frame portion to vertically raise and lower the frame portion; a head assembly provided below the driving portion to vertically approach or separate the heating jig portion; and a control portion for controlling the operation of the heating jig portion and the driving portion. The head assembly comprises a heating head portion formed below the head assembly, comprising: a probe head body having a space provided therein; a plurality of inspection pins exposed by penetrating the bottom surface of the probe head body; a PCB module for collecting information on a printed circuit board through the inspection pins provided in the space; an MCU provided in the PCB module to process information; a communication chip provided in the PCB module to transmit and receive information with an external control unit; and a socket provided in the PCB module to connect power and communication with the outside by wire. It features optional mounting of a probe head including:

Description

{A Panels Sticking and PCB Inspecting Pressing Appartus}

The present invention relates to a pressing device for panel bonding and substrate inspection, and more specifically, to a pressing device for panel bonding and substrate inspection capable of selectively attaching a heating jig and a substrate inspection jig to a limited number of pressing devices.

Panel bonding pressing equipment is a production process machine that can be widely applied to various electrical and electronic products/parts, including mobile phones, industrial testers, digital counters, voltage and current meters, LCD modules, lighting, and smart switches.

Recently, as products become more sophisticated, durable, and design-wise more accessible, the need for a combination of materials with different properties, such as glass, touch panels, acrylic, metal, and ABS, has increased. In addition, rather than a simple attachment structure, high reliability is required, including long-term life, adhesive strength, sealing strength, and water resistance.

And, generally, printed circuit boards (PCBs) are manufactured by surface mount technology (SMT), which melts the lead and solders it by passing it through a furnace with a soldering temperature set at around 240 to 290℃ while electronic components such as IC chips and resistors are mounted on a circuit board printed with cream-shaped lead.

In particular, since the circuit elements of the printed circuit board are very fine in size and work is performed at high temperatures, the printed circuit board is mounted on a jig plate (10) for fixing the printed circuit board to reduce defective products and improve productivity, and soldering work and ICT (In-circuit Test) and FT (Function Test) are performed.

Printed circuit boards (PCBs) produced through this process go through a comprehensive testing process to check for soldering defects in components, whether each component is functioning normally, and whether it exhibits normal performance.

However, the prior art had the following problems:

There was a problem that the pressing device for bonding and the inspection device for inspecting the printed circuit board were installed separately, making the entire work process cumbersome.

Registered Utility Model No. 10-0853766

In order to solve the above-described problems, the purpose of the present invention is to provide a pressing device for panel bonding and substrate inspection that can handle both the bonding process and the substrate inspection process with one device.

In order to achieve the above-described purpose, the present invention provides a pressing device for panel bonding and substrate inspection, comprising: a frame portion formed in a plate shape; a heating jig portion having a heater provided therein and horizontally seated on an upper surface of the frame portion so that a plate-shaped workpiece and a panel are seated on the upper surface; a driving portion provided in the frame portion to vertically raise and lower the jig portion; a head assembly formed in a plate shape and provided below the driving portion to vertically approach or separate the heating jig portion; and a control portion that controls the operations of the heating jig portion and the driving portion, characterized in that a heating head portion or a probe head is selectively mounted below the head assembly.

The above driving unit is provided in multiple numbers, and the heating head unit or probe head is selectively mounted on each head assembly of the driving unit.

The above probe head is characterized by including a probe head body having a space provided therein, a plurality of inspection pins exposed by penetrating the bottom surface of the probe head body, a PCB module for collecting information of a printed circuit board through the inspection pins provided in the space, an MCU provided in the PCB module for processing information, a communication chip provided in the PCB module for transmitting and receiving information with an external control unit, and a socket provided in the PCB module for connecting power and communication with the outside via a wire.

The pressing device for panel bonding and substrate inspection according to the present invention has the following effects.

A heating head for bonding and a probe head for inspection can be selectively applied to a single device, so that both the bonding process and the substrate inspection process can be processed with a single device. Flexible production and mass production can be selectively performed depending on the demand for each item, and the overall process is simplified, which has the advantage of reducing costs.

In addition, the probe head is manufactured as a single module, so that it can be easily replaced according to the corresponding printed circuit board, enabling it to respond to various working conditions. In addition, the probe head has an MCU for information processing and wireless communication, so that the amount of cables connected to the outside is minimized, and there is an advantage in that it is easy to attach and detach.

Figure 1 is a drawing showing a preferred embodiment of a pressing device for panel bonding and substrate inspection according to the present invention.
FIG. 2 is a drawing showing a heating head part and a heating jig part constituting a preferred embodiment of a pressing device for panel bonding and substrate inspection according to the present invention.
FIG. 3 is a drawing showing a probe head and a heating jig part constituting a preferred embodiment of a pressing device for panel bonding and substrate inspection according to the present invention.
FIG. 4 is an exploded perspective view showing the configuration of a probe head constituting a preferred embodiment of a pressing device for panel bonding and substrate inspection according to the present invention.

Hereinafter, a preferred embodiment of a pressing device for panel bonding and substrate inspection according to the present invention will be described in detail with reference to the attached drawings.

The pressing device for panel bonding and substrate inspection according to the present invention, as illustrated in FIG. 1, comprises a frame portion (10) formed in a plate shape, a heating jig portion (20) having a heater provided therein and horizontally mounted on an upper surface of the frame portion (10) so that a plate-shaped workpiece and a panel are mounted on the upper surface, a driving portion (40) provided on the frame portion (10) and vertically raised and lowered with respect to the frame portion (10), a head assembly (12) formed in a plate shape and provided below the driving portion (40) to vertically approach or space away from the heating jig portion (20), and a control portion (50) for controlling the operations of the heating jig portion (20) and the driving portion (40), and is characterized in that a heating head portion (30) or a probe head (60) is selectively mounted below the head assembly (12).

First, the pressing device for panel bonding and substrate inspection according to the present invention is provided with a frame part (10). As shown in Fig. 1, the frame part (10) is formed in a plate shape and serves to form the skeleton of the present device. The frame part (10) is provided with a side wall (11) and an upper plate (13), so that a space penetrating to the front is formed, allowing the worker to freely enter and exit the workpiece and the panel.

The frame part (10) is provided with a head assembly (12). The head assembly (12) is formed in a plate shape and serves to fix the heating head part (30) and the probe head (60) described below and raise and lower them by the operation of the driving part. The head assembly (12) may further be provided with a hole. The hole serves to guide a cable or the like connected to the probe head (60) so that it can pass through and be connected to the outside.

The above head assembly (12) is further provided with a means that can be coupled with the heating head part (30) and the probe head (60). The coupling means may be composed of a fastening hole and a fastening nut, etc.

The above frame part (10) is provided with a heating jig part (20). The heating jig part (20) is positioned on the upper surface of the frame part (10), provides a space on the upper surface where a workpiece and a panel to be attached to the workpiece are loaded, and serves to provide heat so that the workpiece and the panel are attached by an adhesive.

The above heating jig part (20) has a heater provided inside and is horizontally installed on the upper surface of the frame part (10) so that a plate-shaped workpiece and panel can be installed on the upper surface. Any configuration can be applied to the heating jig part (20) as long as it has the above-described function.

The heating jig part (20) is formed in a plate shape as shown in Fig. 2, and a loading surface (23) is formed on the upper surface. The loading surface (23) is formed in a shape corresponding to the shape of the workpiece, so that the workpiece can be safely supported. Of course, the heating jig part (20) can be replaced depending on the shape of the workpiece.

And, a heating head part (30) is provided above the heating jig part (20). More preferably, the heating head part (30) is attached to the head assembly (12).

The above heating head part (30) is positioned above the heating jig part (20), and has a pressing surface (not shown) provided on the lower surface for pressing a workpiece and a panel to be attached to the workpiece, and serves to provide heat so that the panel can be attached to the workpiece using an adhesive.

The heating head part (30) above has a heater provided inside and is positioned horizontally relative to the heating jig part (20), and a pressing surface is formed on the lower surface to enable pressing of a plate-shaped workpiece and a panel. Any configuration can be applied to the heating head part (30) as long as it has the function described above.

And, the pressing device for panel bonding of the present invention is provided with a driving unit (40). The driving unit (40) raises and lowers the heating head unit (40) so that the heating head unit (30) is brought into close contact with or separated from the heating jig unit (30).

And, the pressing device for panel bonding of the present invention is provided with a control unit (50). The control unit (50) serves to control the operation of the heating jig unit (20), the heating head unit (30), and the driving unit (40).

In addition, a counting unit (not shown) is further provided on the upper surface of the heating jig unit (20). The counting unit senses the workpiece and panel loaded on the upper surface of the heating jig unit (20) and stores the number of operations.

In addition, the head assembly (12) may further be provided with a probe head (60). The probe head (60) is formed in a plate shape and has an inspection pin (62) provided at the bottom to contact a terminal of the printed circuit board that requires inspection, thereby inspecting whether the printed circuit board (S) is defective.

The above probe head (60) has a plurality of inspection pins (62) formed downwardly and electrically connected to the plate-shaped body. The above probe head (60) is formed in a structure that can be coupled to the lower surface of the head assembly (12) like the above heating head part (30).

That is, the probe head (60) is positioned above the heating jig part (20), and a plurality of inspection pins (62) for inspecting a printed circuit board (S) are provided on the lower surface thereof. The probe head (60) descends from the upper surface of the heating jig part (20) toward the upper surface of the heating jig part (20) to inspect the terminals of the printed circuit board (S) provided on the heating jig part (20) using the inspection pins (62).

The above probe head (60) is positioned horizontally relative to the heating jig part (20), and has an inspection pin (62) formed on the lower surface to enable inspection of a printed circuit board (S).

The inspection pins (62) provided on the lower surface of the above probe head (60) are provided in multiple numbers and, when inspecting a printed circuit board (S), come into contact with the printed circuit board (S) to measure the circuit status of the printed circuit board (S).

Here, the inspection pin (62) has a characteristic in that, among the plurality of inspection pins, current flows only to the inspection pin (62) corresponding to the circuit of the printed circuit board (S) to be inspected, so that inspection can be performed efficiently.

The above probe head (60) is provided with a probe head body (63) having a space provided inside, and a PCB module (64) is provided in the space inside the probe head body (63). The PCB module (64) collects information by inspecting the printed circuit board (S), which is the inspection object, through the inspection pin (62).

And, the PCB module (64) is provided with an MCU (65) for information processing and a communication chip (66). The communication chip (66) is for communication with the control unit (50), etc., and can be configured as RS-485 or Bluetooth. In particular, by using the communication chip (66), the number and size of cables connected to the control unit (50) can be reduced.

In addition, a socket (67) for power and communication is provided in the PCB module (64). External power and communication cables can be connected through the socket (67).

The above power and communication cables can pass through the hole (14) of the head assembly (12) and communicate with external devices such as the control unit (50).

By providing an MCU (65), a communication chip (66), and a socket (67) within the PCB module (64), a simple structure is implemented on the probe head (60) at a low power source of 5 V or 12 V, so that inspection work can be safely performed simply by replacing the probe head (60).

Additionally, the probe head (60) may further be provided with a transmitter and a PCB determination unit (not shown).

First, the transmitter is provided anywhere within the probe head (60) and plays a role of transmitting a signal to the receiver. The transmitter transmits a signal to the receiver to determine whether the printed circuit board (S) is correctly positioned on the heating jig (20), has disengaged, or has been removed at the time it should have been removed.

That is, if the signal transmitted from the above-described transmitter is received by the above-described receiver, this means that the printed circuit board (S) is not properly positioned in the above-described heating jig portion (20). Also, if the signal transmitted from the above-described transmitter is not received by the above-described receiver, this means that the printed circuit board (S) is positioned in the above-described heating jig portion (20). In the above-described manner, by utilizing the above-described transmitter and receiver, it is possible to safely and error-free counting of good/defective products by checking whether the printed circuit board (S) is positioned in place, dislodged, or properly removed.

Here, the transmitter and receiver can be utilized not only in the PCB inspection equipment of the present invention but also in a pressing device, and by using the transmitter and receiver, it is possible to check whether the panel and the workpiece are properly positioned, displaced from their original positions, or properly removed, thereby enabling safe and error-free counting during pressing work.

And, the PCB determination unit (not shown) is provided anywhere inside the probe head (60) without limitation, and serves to determine the type of the printed circuit board (S). Here, since the printed circuit board (S) is provided in various types, a hole is created at a different location depending on the type of the printed circuit board (S), or a different logo is created depending on the type, and the PCB determination unit (not shown) is configured with a sensor or a scanning unit to determine this, so that the type of the printed circuit board (S) can be determined.

Not limited thereto, the PCB determination unit (not shown) can detect different types of printed circuit boards (S). That is, regardless of the form in which the PCB determination unit (not shown) is formed, it can identify different types of printed circuit boards (S) and transmit this to the control unit (50), thereby allowing current to flow to an inspection pin (62) corresponding to the circuit of the printed circuit board (S) among the inspection pins (62) formed in a plurality, thereby enabling efficient operation.

The above probe head (60) is configured in a modular form so that it can be easily replaced as the type and shape of the printed circuit board (S) for inspection in the panel bonding and substrate inspection pressing device of the present invention changes.

That is, since all information is processed in the MCU within the probe head (60), preparations are completed to easily inspect various printed circuit boards (S) by simply replacing the probe head (60).

Of course, the heating jig part (20) and the heating head part (30) can also be replaced depending on changes in the printed circuit board (S).

In addition, the pressing device for panel bonding and substrate inspection according to the present invention is provided with several driving units (40) in the frame portion (10). That is, a head assembly (12) is provided below each of the driving units (40).

The head assembly (12) above can selectively be connected to the probe head (60) and the heating head part (30). That is, in a device having three driving parts (40) as shown in Fig. 1, one probe head (60) and two heating head parts (30) are currently installed, but in cases where further inspection of the printed circuit board is required, two probe heads (60) and one heating head part (30) may be installed.

In addition, a space extending forward is formed between the side wall (11) and the upper plate (13) of the frame portion (10), so that the worker can freely insert and remove the printed circuit board (S).

The above heating jig part (20) can provide a space on the upper surface where a printed circuit board (S) is loaded. Of course, the printed circuit board can be loaded by positioning a different jig separate from the heating jig part (20).

The heating jig part (20) may further be provided with a receiving part (not shown). The receiving part may be provided anywhere within the heating jig part (20), without limitation, and receives a signal transmitted from the transmitting part, which will be described below. By determining whether the printed circuit board (S) is properly positioned or dislodged by the receiving part and the transmitting part, which will be described below, it is possible to determine whether inspection can be performed. In addition, by confirming whether the printed circuit board (S) is removed within the time it should be removed, it is possible to determine whether inspection of different printed circuit boards (S) can be performed.

And, the control unit (50) plays a role of controlling the operation of the heating jig unit (20), the receiving unit, the probe head (60), the transmitting unit, the PCB determining unit (not shown), and the driving unit (40). The control unit (50) is linked to the jig unit (20), the receiving unit, the probe head (60), the transmitting unit, the PCB determining unit (not shown), and the driving unit (40) to control their operation so that an inspection using the PCB inspection device is performed properly without errors.

In addition, the present invention may further include a display unit (not shown). The display unit may display the inspection status of the PCB inspection device of the present invention, counting of good/defective products, instructions for progress to the operator, etc., and this is possible through the control unit (50).

In this way, it will be understood by those skilled in the art that the technical configuration of the present invention described above can be implemented in other specific forms without changing the technical idea or essential features of the present invention.

Therefore, the embodiments described above should be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the claims described below rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

10: Frame 11: Side wall
12: Head assembly 13: Top plate
14: Through hole 20: Heating jig part
23: Loading surface 30: Heating head section
40: Drive unit 50: Control unit
60: Probe head 62: Inspection pin
63: Probe head body 64: PCB module
65: MCU 66: Communication chip
67 : Socket S : PCB

Claims (3)

A frame formed in the shape of a plate;
A heating jig section having a heater provided inside and horizontally positioned on the upper surface of the frame section, on which a plate-shaped workpiece and panel are positioned on the upper surface;
A driving unit provided on the above frame to vertically raise and lower the above frame;
A head assembly formed in a plate shape and provided below the driving unit to vertically approach or separate the heating jig unit;
It includes a control unit that controls the operation of the heating jig unit and the driving unit;
A pressing device for panel bonding and substrate inspection, characterized in that a heating head or a probe head is selectively mounted on the lower part of the head assembly. In paragraph 1,
A pressing device for panel bonding and substrate inspection, characterized in that a plurality of driving units are provided, and the heating head unit or the probe head is selectively mounted on each head assembly of the driving units. In paragraph 1,
The above probe head,
A probe head body with a space provided inside;
A plurality of inspection pins exposed by penetrating the bottom surface of the probe head body;
A PCB module that collects information of a printed circuit board through the inspection pin provided in the above space;
MCU provided on the above PCB module to process information;
A communication chip provided in the above PCB module for transmitting and receiving information with an external control unit; and
A pressing device for panel bonding and substrate inspection, characterized by including a socket provided on the PCB module for connecting power and communication with the outside via a wire.