KR102839526B1 - Glass assembly - Google Patents

Abstract

A glass assembly according to one embodiment of the present invention comprises: a first transparent substrate, a transparent electrode layer disposed on the first transparent substrate, a plurality of light-emitting elements disposed on the transparent electrode layer, an edge electrode electrically connected to the transparent electrode layer and disposed at an edge of the first transparent substrate, a first sealing member disposed on the plurality of light-emitting elements and the edge electrode, a second transparent substrate disposed on the first sealing member, a flexible printed circuit board (FPCB) electrically connected to the edge electrode and extending outwardly of the first transparent substrate and the second transparent substrate, and a barrier layer covering side surfaces of the first transparent substrate and the second transparent substrate, wherein the barrier layer comprises an adhesive layer facing the side surface of the first transparent substrate and the side surface of the second transparent substrate, and a metal thin film formed on the adhesive layer, and wherein the barrier layer includes a first barrier layer and a second barrier layer on a side surface of the flexible printed circuit board extending outwardly.

Description

GLASS ASSEMBLY

It relates to a glass assembly. Specifically, it relates to a glass assembly that can display characters or images while maintaining visual transparency by including a transparent display inside.

In general, glass windows serve to allow outside light to enter the room, block outside air and allow it to enter, and properly ventilate the indoor air. When closed, they block the flow of heat between the inside and outside, maintaining a cooling and heating effect.

Recently, windows made of LED all-glass assemblies with LEDs inserted into the glass windows of buildings have been used. Windows made of LED all-glass assemblies can provide lighting effects or advertising effects without damaging the inherent functions of glass windows. However, LED all-glass assemblies have LEDs inserted between two glass plates, and at this time, the LEDs are mounted on a transparent electrode layer formed on the glass plates.

In addition, a flexible printed circuit board (FPCB) is formed at the edge of the transparent electrode layer of the glass assembly to electrically connect the electrode layer and the driving control unit. Here, the driving control unit controls the operation of the LED to display characters or images.

In the case of a glass assembly in which an LED is inserted between two glass plates, the LED placed between the glass assemblies and the electrodes for driving it may be damaged by corrosion caused by moisture, etc. Therefore, in order to improve durability, extra care is required to prevent the penetration of moisture, etc. In particular, in the case of a flexible printed circuit board that electrically connects the transparent electrode layer of the glass assembly and the driving control unit, there was a problem in that the electrode layer, etc. are easily damaged because they are extended to the outside of the glass assembly and there is a high possibility of external air penetrating into this part.

The present invention is intended to solve such problems and to provide a glass assembly capable of preventing an internal electrode layer from being corroded by external moisture, etc.

However, the problems to be solved by the embodiments of the present invention are not limited to the problems described above and can be expanded in various ways within the scope of the technical ideas included in the present invention.

A glass assembly according to one embodiment of the present invention includes a first transparent substrate, a transparent electrode layer disposed on the first transparent substrate, a plurality of light-emitting elements disposed on the transparent electrode layer, an edge electrode electrically connected to the transparent electrode layer and disposed at an edge of the first transparent substrate, a first sealing member disposed on the plurality of light-emitting elements and the edge electrode, a second transparent substrate disposed on the first sealing member, a flexible printed circuit board (FPCB) electrically connected to the edge electrode and extending outwardly of the first transparent substrate and the second transparent substrate, and a barrier layer covering side surfaces of the first transparent substrate and the second transparent substrate, wherein the barrier layer includes an adhesive layer facing the side surface of the first transparent substrate and the side surface of the second transparent substrate, and a metal thin film formed on the adhesive layer, and wherein the barrier layer includes a first edge barrier layer and a second edge barrier layer on a side surface of the flexible printed circuit board extending outwardly.

The glass assembly may further include a transparent base film disposed between the first transparent substrate and the transparent electrode layer, and a second sealing member disposed between the transparent base film and the first transparent substrate.

The above barrier layer may further include a decorative layer formed on the metal thin film.

The configuration of the first edge barrier layer and the second edge barrier layer may be the same.

The first edge barrier layer includes a slit through which the flexible printed circuit board is drawn out, and the second edge barrier layer can cover the first edge barrier layer and the flexible printed circuit board drawn out through the slit.

The second edge barrier layer and the adhesive layer can adhere to a portion of the outermost layer of the first edge barrier layer and a portion of the flexible printed circuit board.

The first edge barrier layer is formed to correspond to only one of the side surfaces of the first transparent substrate and the side surfaces of the second transparent substrate, the flexible printed circuit board extends to completely cover the outermost layer of the first edge barrier layer, and the adhesive layer of the second edge barrier layer can adhere to the other of the side surfaces of the first transparent substrate and the second transparent substrate and a portion of the flexible printed circuit board.

The second edge barrier layer can be adhered to the flexible printed circuit board at a portion where the first edge barrier layer and the flexible printed circuit board overlap.

The above metal film may include aluminum (Al).

The above adhesive layer may include polyurethane.

The first sealing member may include a transparent display including at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), ionoplast polymer, cyclo olefin polymer (COP), and polyurethane.

The second sealing member may include at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), ionoplast polymer, cyclo olefin polymer (COP), and polyurethane.

A glass assembly according to one embodiment of the present invention effectively blocks the inflow of moisture from the outside, thereby preventing internal electrodes and the like from being corroded and damaged.

FIG. 1 is a drawing schematically showing the configuration of a glass assembly according to one embodiment of the present invention.
Figure 2 is a drawing showing a cross-section cut along line II-II' of Figure 1.
Figure 3 is a drawing showing a cross-section cut along III-III' of Figure 1.
FIG. 4 is a photograph of an FPCB connection portion in a glass assembly according to one embodiment of the present invention.
FIG. 5 is a drawing showing a cross-section of a portion cut along line III-III' of FIG. 1 in a glass assembly according to a modified example of the present invention.
FIG. 6 is a drawing showing a cross-section of a portion cut along line II-II' of FIG. 1 in a glass assembly according to another embodiment of the present invention.
Figures 7a and 7b are photographs of the electrode layer after evaluating the corrosion state in examples and comparative examples, respectively.

The terms first, second, and third, etc. are used to describe, but are not limited to, various parts, components, regions, layers, and/or sections. These terms are only used to distinguish one part, component, region, layer, or section from another part, component, region, layer, or section. Thus, a first part, component, region, layer, or section described below may be referred to as a second part, component, region, layer, or section without departing from the scope of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein, the singular forms include the plural forms as well, unless the context clearly dictates otherwise. The word "comprising," as used herein, specifies particular features, regions, integers, steps, operations, elements, and/or components, but does not exclude the presence or addition of other features, regions, integers, steps, operations, elements, and/or components.

When a part is referred to as being "on" or "on" another part, it may be directly on or above the other part, or there may be other parts intervening. In contrast, when a part is referred to as being "directly on" another part, there are no other parts intervening.

Unless otherwise defined, all terms, including technical and scientific terms, used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. Terms defined in commonly used dictionaries are additionally interpreted as having a meaning consistent with the relevant technical literature and the presently disclosed content, and are not interpreted in an ideal or very formal sense unless defined.

Hereinafter, embodiments of the present invention will be described in detail so that those with ordinary skill in the art can easily implement the present invention. However, the present invention may be implemented in various different forms and is not limited to the embodiments described herein.

The configuration of a glass assembly according to one embodiment of the present invention will be described with reference to FIGS. 1 to 4.

FIG. 1 is a drawing schematically illustrating the configuration of a glass assembly according to one embodiment of the present invention, FIG. 2 is a drawing illustrating a cross-section taken along line II-II' of FIG. 1, FIG. 3 is a drawing illustrating a cross-section taken along line III-III' of FIG. 1, and FIG. 4 is a photograph of an FPCB connection portion in a glass assembly according to one embodiment of the present invention.

Referring to FIGS. 1 to 3, a glass assembly (100) includes a first transparent substrate (11), a second transparent substrate (12) positioned facing the first transparent substrate (11), a transparent electrode layer (23) positioned between the first transparent substrate (11) and the second transparent substrate, a plurality of light-emitting elements (LEDs, 20) mounted on the transparent electrode layer (23), and a first sealing member (51) covering the light-emitting elements (20).

In addition, in this embodiment, a transparent electrode layer (23) and a light-emitting element (20) are formed on a transparent substrate film (10), and at this time, a second sealing member (52) is positioned between the transparent substrate film (10) and the first transparent substrate (11).

A barrier layer (600) is arranged on the side surfaces of the first transparent substrate (11) and the second transparent substrate (12) to prevent moisture and the like from penetrating into the interior of the glass assembly (100). The barrier layer (600) may include a metal film (62) that blocks the penetration of moisture, and an adhesive layer (61) that can adhere the metal film (62) to the side surfaces of the first and second transparent substrates (11, 12), and may further include a decorative layer (63) to enhance durability and aesthetic effects in a portion exposed to the outside.

This barrier layer (600) is configured to include a first edge barrier layer (610) and a second edge barrier layer (620), particularly on the side where the flexible printed circuit board (FPCB, 40) electrically connected to the edge electrode (30) electrically connected to the transparent electrode layer (23) extends to the outside of the first and second transparent substrates (11, 12).

In one embodiment of the present invention, a barrier layer (600) is provided on the side surfaces of the first transparent substrate (11) and the second transparent substrate, and in particular, a flexible printed circuit board (FPCB, 40) is provided with a double barrier layer (600) on the side surface of the edge portion extending outwardly from the first and second transparent substrates (11, 12), thereby preventing moisture from penetrating from the outside and corroding the transparent electrode layer (23) and the edge electrode (30), thereby improving the durability and lifespan of the glass assembly (100).

Below, each component is explained in detail.

In a glass assembly (100) according to one embodiment of the present invention, the first transparent substrate (11) is a plate member containing glass and/or a transparent polymer such as polymethyl methacrylate (PMMA), polycarbonate (PC), etc., and may be colorless and transparent or colored and transparent. In this case, the first transparent substrate (11) may have a light transmittance of 85% or more for visible light.

The second transparent substrate (12) positioned opposite the first transparent substrate (11) is also a plate member containing a transparent polymer such as glass and/or polymethyl methacrylate (PMMA), polycarbonate (PC), etc., just like the first transparent substrate (11), and may be colorless and transparent or colored and transparent. At this time, the second transparent substrate (12) may have a light transmittance of 85% or more for visible light. The material, color, and/or light transmittance of this second transparent substrate (12) may be the same as or different from those of the first transparent substrate (11).

The first transparent substrate (11) and the second transparent substrate (12) are placed therebetween to protect the components for displaying image and character information, i.e., the transparent electrode layer (23), the light-emitting element (20), the edge electrode layer (30), etc., while also satisfying the purpose of use as a window, etc., and it is preferable that the thickness be 0.5 mm to 6 mm.

A transparent display is arranged between the first transparent substrate (11) and the second transparent substrate (12). The transparent display in this embodiment includes a transparent base film (10), a transparent electrode layer (23) arranged on the transparent base film (10), a light-emitting element (20) arranged on the transparent electrode layer (23), an edge electrode (30) arranged at an edge of the transparent base film (10) and electrically connected to the transparent electrode layer (23), and a flexible printed circuit board (40) electrically connecting the edge electrode (30) and an external driving unit.

The transparent substrate film (10) may be a single-layer or multi-layer light-transmitting polymer film. The transparent substrate film (10) may have insulating properties and heat resistance in order to prevent changes in state due to external light while preventing electricity from leaking to the outside. Examples of the transparent substrate film (10) include, but are not limited to, polyethylene terephthalate (PET), polycarbonate (PC), and cyclo olefin polymer (COP). As an example, the transparent substrate film (10) may be a COP film. In this case, the heat resistance is excellent, and the durability of the glass assembly (100) is improved.

The thickness of the transparent substrate film (10) is not particularly limited. However, if the thickness of the transparent substrate film (10) is too thin, the transparent substrate film (10) may be deformed or cracks may be induced in the electrode layer portion due to the pressure applied to the light-emitting element when bonding the glass assembly (100). On the other hand, if the thickness of the transparent substrate film is too thick, cracks may occur in the first and second transparent substrates (11, 12) due to stress. According to an example, the thickness of the transparent substrate film (10) may be about 200 to 300 ㎛. In this case, not only will the above-described problem not occur, but also the heat resistance is excellent, so that even if the glass assembly (100) is exposed to external light for a long time, thermal deformation of the transparent substrate film (10) can be prevented.

In a glass assembly (100) according to one embodiment of the present invention, a transparent electrode layer (23) is arranged on one surface of a transparent base film (10) and serves to drive a light-emitting element (20) by applying a signal to it. In addition, since the transparent electrode layer (23) has excellent light transmittance, not only does it allow external light to enter, but also the portion where the transparent electrode layer (23) is formed does not block the user's view, and also has excellent appearance characteristics. Therefore, the glass assembly (100) according to one embodiment of the present invention has excellent visual transparency.

The transparent electrode layer (23) may include a circuit pattern formed of one or more of metal, metallic nano wire, transparent conductive oxide, metal mesh, carbon nano tube, and graphene.

Here, non-limiting examples of metal nanowires include silver nanowires (Ag nanowires), copper nanowires, nickel nanowires, etc., and these may be used alone or in a mixture of two or more thereof. Non-limiting examples of transparent conductive oxides include ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), ZnO (Zinc Oxide), AZO (Aluminium Zinc Oxide), In ₂ O ₃ (Indium Oxide), etc., and these may be used alone or in a mixture of two or more thereof. Non-limiting examples of metal meshes include silver (Ag) mesh, copper (Cu) mesh, aluminum (Al) mesh, etc., and these may be used alone or in a mixture of two or more thereof. Among these, silver nanowires, copper mesh, and silver mesh have excellent conductivity and light transmittance, and ITO and IZO have low resistivity, can be deposited at low temperatures, and have high visible light transmittance.

According to an example, the transparent electrode layer (23) may include a circuit pattern formed of an electrode material selected from the group consisting of silver nano wires, copper mesh, and silver mesh. At this time, the line width and thickness of the circuit pattern are not particularly limited. However, when the circuit pattern has a width of about 5 to 15 ㎛ and a thickness of about 0.2 to 1 ㎛, the transparent electrode layer (23) has a sheet resistance of about 0.5 to 3 Ω/sq.

The transparent electrode layer (23) can be formed by a method known in the art. For example, the transparent electrode layer (23) can be formed by coating the above-described electrode material on a transparent substrate film (10) and then irradiating the laser or forming at least one circuit pattern through a mask and etching process. Alternatively, the circuit pattern made of the electrode material can be formed on the transparent substrate film (10) through an inkjet printing process. However, the present invention is not limited thereto.

In a glass assembly (100) according to one embodiment of the present invention, a light emitting diode (LED) 20 is mounted on a transparent electrode layer (23) and is a light emitting body that blinks according to the supply of power. Since a plurality of such light emitting elements (20) are spaced apart and arranged in a matrix form, various types of characters or images can be displayed, and moving images can also be displayed.

In one embodiment of the present invention, a light-emitting element (20) that can be used can be used without special limitation if it is commonly known in the art. Accordingly, the color of the light-emitting element (20) can be a single-color light-emitting element (20) such as red (R), green (G), or blue (B), or a two-color light-emitting element (20) of R and G, or a three-color light-emitting element (20) of R, G, and B. When each light-emitting element (20) is a three-color light-emitting element (20) of R, G, and B, characters or images having various colors can be displayed.

The light-emitting element (20) may be fixed on the transparent electrode layer (23) through a mounting method known in the art. For example, a pad (not shown) containing a highly electrically conductive material such as silver (Ag) may be formed on at least a portion of the transparent electrode layer (23). In this case, the light-emitting element (20) may be fixed on the pad using a low-temperature SMT (surface mount technology) process. At this time, the light-emitting element (20) may be attached to the pad through solder.

The edge electrode (30) is connected to the wiring (42) on the flexible printed circuit board (40) and transmits a signal to the transparent electrode layer (23). The edge electrode (30) may be opaque and may have lower resistance than the transparent electrode layer (23). For example, it may be a patterned metal layer made of the same material as the metal mesh that constitutes the transparent electrode layer (23). Alternatively, when the transparent electrode layer (23) is made of a transparent conductive oxide, it may be made by attaching a separate metal layer.

The edge electrode (30) and the flexible printed circuit board (40) can be electrically connected by an anisotropic conductive adhesive layer (not shown), and at this time, the anisotropic conductive adhesive layer can use various anisotropic conductive adhesives or adhesive films used in the relevant field without limitation. For example, the anisotropic conductive adhesive layer can include a resin and conductive particles dispersed in the resin. In this way, the anisotropic conductive adhesive layer can use a film that has electrical conductivity in the thickness direction of the adhesive layer and insulation in the plane direction of the film. In addition, a resin such as acrylic or epoxy can be used so as to secure adhesive performance between the edge electrode (30) and the flexible printed circuit board (40). In addition, the conductive particles can include a polymer core having an average particle diameter of 2 to 20 ㎛ and a coating layer including at least one of Ni, Au, Cu, and Ag.

A flexible printed circuit board (FPCB, 40) is disposed on an anisotropic conductive adhesive layer and is electrically connected to an edge electrode (30). The electrically connected flexible printed circuit board (40) electrically connects the edge electrode (30) and the drive control unit. Any flexible printed circuit board used in the relevant field of the flexible printed circuit board (FPCB, 40) can be used without limitation. Specifically, the flexible printed circuit board (40) can include a plurality of wires (not shown) formed on a resin layer. The wires of the flexible printed circuit board (40) can be made of a conductive metal such as copper, tin-plated copper, or nickel-plated copper. As the conductor, a foil-shaped conductive metal is preferable. The resin layer of the flexible printed circuit board (40) can include polyimide or polyester.

The flexible printed circuit board (40) may be one or more. However, if the flexible printed circuit board (40) is arranged on a large portion of the transparent substrate film (10), the bonding reliability of the glass assembly (100) may be reduced. Therefore, it is preferable to adjust the width of each flexible printed circuit board (40) so that the ratio of the overall width (W) of the flexible printed circuit board (40) to the overall length (L) of the edge portion of the transparent substrate film (10) is in the range of about 0.1 to 0.5. Here, the overall width (W) of the flexible printed circuit board (40) is the sum of the widths (W1) of n flexible printed circuit boards (n×W ₁ ), and at this time, the widths of each flexible printed circuit board (40) may be the same as or different from each other.

In a glass assembly (100) according to one embodiment of the present invention, a first sealing member (51) is a portion disposed between a second transparent substrate (12) and the glass assembly (100) and prevents external air such as moisture or oxygen from penetrating into the glass assembly (100). The first sealing member (51) may be disposed on the entire surface of the glass assembly (100) to cover the glass assembly (100). In this case, the first sealing member (51) protects the light-emitting element (20) of the glass assembly (100) and seals the glass assembly (100) and the second transparent substrate (12) so that they do not become separated from each other.

The first sealing member (51) is formed of an optically transparent polymer so as to allow external light to enter without blocking the user's view. Specifically, the first sealing member (51) may include at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), ionoplast polymer, and polyurethane. For example, the first sealing member (51) may be formed of a PVB resin. In this case, the first sealing member (51) not only seals the glass assembly (100) to the second transparent substrate (12), but also blocks ultraviolet rays (UV) by about 99% or more while blocking external air.

The thickness of the first sealing member (51) is adjusted according to the height of the light-emitting element (20) in the glass assembly (100). However, in order to protect the light-emitting element (20) of the glass assembly (100) while at the same time ensuring that light transmittance is not impaired, the ratio (D ₁ /H 1 ) of the thickness (D ₁ ) of the first sealing member (51) to the height (H ₁ ) of the light-emitting element ( ₂₀ ) may be in the range of 1.5 to 5.

In a glass assembly (100) according to one embodiment of the present invention, a second sealing member (52) is a part arranged between a first transparent substrate (11) and a glass assembly (100), and prevents the first transparent substrate (11) and the glass assembly (100) from being separated from each other. In addition, the second sealing member (52) prevents external air, such as moisture or oxygen, from penetrating into the glass assembly (100). The second sealing member (52) may be arranged on the entire surface of the first transparent substrate (11).

This second sealing member (52) is formed of an optically transparent polymer so as to allow external light to enter without blocking the user's view. Specifically, the second sealing member (52) may include at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), ionoplast polymer, and polyurethane. For example, the second sealing member (52) may be formed of a PVB resin. In this case, the second sealing member (52) may not only seal the glass assembly (100) to the first transparent substrate (11), but also block external air while blocking ultraviolet rays (UV) by about 99% or more.

The thickness of the second sealing member (52) is not particularly limited. However, if the thickness of the second sealing member (52) is too thick, pressure may be applied to the glass assembly (100) during the bonding process between the first transparent substrate (11) and the glass assembly (100), which may cause cracks in the electrode layer or deteriorate light transmittance. On the other hand, if the thickness of the second sealing member (52) is too thin, the sealing characteristics and external air blocking characteristics may deteriorate. Therefore, the thickness of the second sealing member (52) may be 0.2 to 0.8 mm.

As shown in FIGS. 2 and 3, the first sealing member (51) and the second sealing member (52) can be formed integrally with each other by being arranged at the edge portion of the glass assembly (100). Accordingly, even the side surface of the area where the light-emitting element (20) is arranged can be covered by the sealing member, so that the outside air can be blocked more reliably.

In a glass assembly (100) according to one embodiment of the present invention, a barrier layer (600) is disposed on the side surfaces of the first transparent substrate (11) and the second transparent substrate (12). Here, the side surface is a surface that is perpendicular to the plane on which the light-emitting elements (20) are disposed and is disposed at an edge. In addition, as illustrated in FIGS. 2 and 3, not only the side surfaces of the first transparent substrate (11) and the second transparent substrate (12), but also the portion where the first and second sealing members (51, 52) disposed therebetween are connected may be covered by the barrier layer (600). As a result, it is possible to prevent external air from penetrating between the first transparent substrate (11) and the second transparent substrate (12) from the side surface.

As illustrated in FIGS. 1 and 2, on a plane of a glass assembly (100), a barrier layer (600) is disposed on the side surfaces of the first transparent substrate (11) and the second transparent substrate (12) along the remaining edges except for the edges where the edge electrode (30) and the flexible printed circuit board (40) connected thereto are disposed. The barrier layer (600) may include a metal thin film (62) and an adhesive layer (61) for attaching the metal thin film (62) to the side surfaces of the first transparent substrate (11) and the second transparent substrate (12). The metal thin film (62) may be any metal material having barrier properties, and may preferably be a thin film containing aluminum. The thickness of the metal thin film (62) may be 10 µm to 100 µm. If the thickness of the metal thin film (62) is too thin, the barrier properties are weakened, and if it is too thick, it may easily fall off or the processability may be deteriorated, which is not preferable.

The metal thin film (62) can be attached to the side surfaces of the first transparent substrate (11) and the second transparent substrate (12) by the adhesive layer (61). A commonly used resin adhesive can be used as the adhesive layer (61), and preferably, a polyurethane adhesive can be used. The thickness of the adhesive layer (61) can be 0.5 mm to 2 mm. If the thickness of the adhesive layer (61) is too thin, sufficient adhesion may not be achieved, and if it is too thick, the adhesive may overflow or leak out of the side areas of the first transparent substrate (11) and the second transparent substrate (12), which is not preferable.

On the outside of the metal film (62), a decorative layer (63) may be further positioned to protect the metal film (62) and improve durability. By attaching the decorative layer (63), the aesthetic function may also be improved. If necessary, roughness or a pattern may be formed on the surface of the decorative layer (63). A commonly used resin layer may be used as the decorative layer (62), and preferably, it may be a resin layer made of a thermoplastic polyurethane (TPU) material.

As illustrated in FIG. 3, on the plane of the glass assembly (100), at the edge where the edge electrode (30) and the flexible printed circuit board (40) connected thereto are arranged, a barrier layer (600) may be formed in two layers. That is, it may include a first edge barrier layer (610) arranged close to the side of the first transparent substrate (11) and the second transparent substrate (12), and a second edge barrier layer (620) formed on the first edge barrier layer (610).

The first edge barrier layer (610) is formed to cover the entire side surfaces of the first transparent substrate (11), the second transparent substrate (12), and the first and second sealing members (51, 52) arranged therebetween, but further includes a slit (611) through which the flexible printed circuit board (40) can be drawn outward from the first transparent substrate (11) and the second transparent substrate (12). That is, in the vertical cross-section, the slit (611) is provided at a position corresponding to the flexible printed circuit board (40) extended in combination with the edge electrode (30). A flexible printed circuit board (40) extending outwardly of the first transparent substrate (11) and the second transparent substrate (12) through a slit (611) extends downwardly of the first transparent substrate (11) along the outer surface of the first edge barrier layer (611), that is, the surface located far from the side surfaces of the first transparent substrate (11) and the second transparent substrate (12).

The second edge barrier layer (620) is formed to cover a portion of the flexible printed circuit board (40) extending along the outer surface (upper surface) of the first edge barrier layer (610) as described above, with a configuration further provided on the upper surface of the first edge barrier layer (610). That is, the adhesive layer of the second edge barrier layer (620) adheres to the first edge barrier layer (610) above the slit (611) in the vertical cross-section, and adheres to the flexible printed circuit board (40) below the slit (611).

In this way, the flexible printed circuit board (40) that is extended to the outside of the first transparent substrate (11) and the second transparent substrate (12) and extends to the lower side of the first transparent substrate (11) is combined with the glass assembly (100), as shown in FIG. 4. In FIG. 4, the portion where the flexible printed circuit board (40) is arranged on the upper side is the lower surface of the first transparent substrate (11). That is, as shown in FIG. 4, by forming a double barrier layer (600) in the portion where the flexible printed circuit board (40) is extended, the external air is more reliably blocked from flowing into the interior of the glass assembly (100) through the portion where the flexible printed circuit board (40) is connected, thereby preventing corrosion of the edge electrode (30) and the transparent electrode layer (23).

The first and second edge barrier layers (610, 620) can be configured to include an adhesive layer (61), a metal film (62), and a decorative layer (63) in the same manner as the barrier layer (600) described above, and since their configuration is the same as that of the barrier layer (600), a duplicate description is omitted.

Meanwhile, in order to form a double barrier layer (600) at the edge where the edge electrode (30) and the flexible printed circuit board (40) are arranged, first, a first edge barrier layer (610) including a slit (611) may be attached to the edge where the edge electrode (30) and the flexible printed circuit board (40) are arranged, and after the flexible printed circuit board (40) is pulled outward through the slit (611), a barrier layer (600) including a second edge barrier layer (620) may be attached to the entire edge. Or, conversely, after attaching a barrier layer (600) including a first edge barrier layer (610) including a slit (611) to the entire edge, a second edge barrier layer (620) may be further attached only to the edge where the edge electrode (30) and the flexible printed circuit board (40) are arranged, but this is not particularly limited.

As such, in one embodiment of the present invention, since the side surfaces of the first transparent substrate (11) and the second transparent substrate (12) and the area therebetween are covered by a barrier layer (600) including a metal thin film (62) having barrier properties, external air containing moisture or the like can be effectively prevented from penetrating between the first transparent substrate (11) and the second transparent substrate (12) from the outside and corroding the electrodes. In particular, by forming a double barrier layer (600) in the lead portion of the flexible printed circuit board (40) that is essential for electrical connection with the outside, the external air can be more reliably blocked.

FIG. 5 is a drawing showing a cross-section of a portion cut along line III-III' of FIG. 1 in a glass assembly according to a modified example of the present invention.

In a modified example of the present invention, only the configuration of the double barrier layer (600) at the edge where the edge electrode (30) and the flexible printed circuit board (40) are placed is different, and the remaining configuration is the same as the previously described embodiment.

As illustrated in FIG. 5, the first edge barrier layer (610') is formed to cover the side surface of the first transparent substrate (11), while covering the side surfaces of the first and second sealing members (51, 52) only up to the point where the flexible printed circuit board (40) is withdrawn. That is, it is formed to cover only the lower portion in cross-section based on the point where the flexible printed circuit board (40) is withdrawn, not the entire width of the side surface of the glass assembly (100). Alternatively, it may be formed to cover only the upper portion in cross-section based on the point where the flexible printed circuit board (40) is withdrawn.

And the second edge barrier layer (620') is formed to cover the side surfaces of the first and second sealing members (51, 52) and the side surface of the second transparent substrate (12) that are not covered by the first edge barrier layer (610') and the first edge barrier layer (620'). In this case, the flexible printed circuit board (40) can be pulled outward only by adjusting the width of the first edge barrier layer (610') without forming a separate slit in the first edge barrier layer (610').

In this way, in one embodiment and a modified example of the present invention, a configuration in which a double barrier layer (600) is formed at the edge where the edge electrode (30) and the flexible printed circuit board (40) are arranged has been described, but the present invention is not limited thereto, and may be appropriately modified as long as the barrier layer (600) is formed by overlapping the flexible printed circuit board (40) so as not to form a gap through which external air can penetrate at the portion where it is pulled outward.

FIG. 6 is a drawing showing a cross-section of a portion cut along line II-II' of FIG. 1 in a glass assembly according to another embodiment of the present invention.

As shown in Fig. 6, this embodiment is the same as the previously described embodiment, except that the transparent electrode layer (23) is formed directly on the first transparent substrate (11).

That is, the glass assembly (100') can be implemented by omitting the configuration of the transparent base film, directly forming the transparent electrode layer (23) on the first transparent substrate by a method such as printing, and arranging the light-emitting element (20) thereon. In this case, the configuration of the second sealing member arranged under the light-emitting element (20) can also be omitted, so that the glass assembly (100') having a thinner thickness can be obtained.

Hereinafter, the present invention will be described in more detail through experimental examples. However, these experimental examples are only for illustrating the present invention, and the present invention is not limited thereto.

[Example 1]

1-1. Manufacturing of transparent displays

On one side of a PET film substrate (size: 500 mm × 600 mm, thickness: 250 μm), a circuit pattern (line width: 15 μm) was formed using a copper mesh through a mask and etching process to form an electrode layer (sheet resistance: approximately 1 Ω/sq). The edge electrode layer formed a circuit pattern using copper lines. Thereafter, silver (Ag) solder was formed on the electrode layer through a screen printing process, and multiple LEDs (height: approximately 1 mm) were mounted on each silver (Ag) solder using a low-temperature SMT (surface mount technology) method. An anisotropic conductive adhesive layer (TGP20520AG, manufactured by H&S) was formed on the edge of the electrode layer where no LEDs were mounted, and a flexible printed circuit board (FPCB) was laminated on the anisotropic conductive adhesive layer. Thereafter, a protective adhesive layer (silicone epoxy adhesive layer/PET double layer) was laminated to manufacture a transparent display.

1-2. Manufacturing of glass assembly

On a first transparent substrate (a 5 mm thick glass substrate from Korea Glass Industry Co.), a transparent display manufactured in Example 1-1, a PVB resin film (1.52 m thick, Kuraray Butatcite), and a second transparent substrate (same as the first transparent substrate) were sequentially laminated, and then bonded by applying pressure of 11.5 bar at 130°C.

An edge seal tape (EdgeSealPLUS, registered trademark, manufactured by SWM INTL) having a laminated structure of a polyurethane adhesive layer/aluminum foil layer/polyurethane resin layer was attached to a side surface of the obtained assembly. In particular, in a portion where the flexible printed circuit board is pulled outward, an edge seal tape having a slit formed therein was first attached, and after the flexible printed circuit board was passed through the slit, the edge seal tape was then attached a second time together with the remaining portion, thereby manufacturing a glass assembly.

[Comparative Example 1]

A glass assembly was manufactured in the same manner as in Example 1, except that the edge seal tape was attached at the end.

[Experimental example: Corrosion status evaluation]

The glass assemblies manufactured in Example 1 and Comparative Example 1 were left in an environment of 85°C and 85% relative humidity for 1,200 hours, and then the corrosion state of the electrodes was observed.

FIGS. 7a and 7b show the results of photographing edge electrodes to evaluate the corrosion resistance of glass assemblies according to Example 1 and Comparative Example 1, respectively. As shown in the drawings, in Example 1 (FIG. 7a), almost no corrosion was observed on the electrode, but in Comparative Example 2 (FIG. 7b), severe corrosion of the electrode could be visually confirmed.

The present invention is not limited to the above embodiments, but can be manufactured in various different forms, and a person having ordinary skill in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing the technical idea or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

10: Transparent substrate film
11: 1st transparent substrate
12: Second transparent substrate
51: First sealing member
52: Second sealing member
20: Light-emitting element
23: Transparent electrode layer
30: Edge electrode
40: Flexible printed circuit board
100: Glass Assembly
600: Barrier layer
61: Adhesive layer
62: Metal thin film
63: Decorative layer
610: 1st edge barrier layer
620: 2nd edge barrier layer

Claims (12)

1st transparent substrate,
A transparent electrode layer disposed on the first transparent substrate,
A plurality of light-emitting elements arranged on the transparent electrode layer,
An edge electrode electrically connected to the transparent electrode layer and arranged at the edge of the first transparent substrate;
A first sealing member disposed on the plurality of light-emitting elements;
A second transparent substrate disposed on the first sealing member;
A flexible printed circuit board (FPCB) electrically connected to the edge electrode and extending to the outside of the first transparent substrate and the second transparent substrate, and
A barrier layer covering the side surfaces of the first transparent substrate and the second transparent substrate
Including,
The barrier layer includes an adhesive layer facing the side of the first transparent substrate and the side of the second transparent substrate, and a metal thin film formed on the adhesive layer,
The barrier layer comprises a first edge barrier layer attached to at least one of the side surfaces of the first transparent substrate and the side surfaces of the second transparent substrate, from which the flexible printed circuit board extends outward, and a second edge barrier layer attached to an outer side of the first edge barrier layer.
A glass assembly, wherein each of the first edge barrier layer and the second edge barrier layer includes the adhesive layer and the metal film. In the first paragraph,
A transparent base film disposed between the first transparent substrate and the transparent electrode layer, and
A glass assembly further comprising a second sealing member disposed between the transparent base film and the first transparent substrate. In paragraph 1 or 2,
A glass assembly, wherein the barrier layer further includes a decorative layer formed on the metal film. In the third paragraph,
A glass assembly wherein the first edge barrier layer and the second edge barrier layer have the same configuration. In paragraph 1 or 2,
The first edge barrier layer includes a slit through which the flexible printed circuit board is drawn,
A glass assembly, wherein the second edge barrier layer covers the first edge barrier layer and the flexible printed circuit board drawn through the slit. In paragraph 5,
A glass assembly, wherein the adhesive layer of the second edge barrier layer adheres to a portion of the outermost layer of the first edge barrier layer and a portion of the flexible printed circuit board. In paragraph 1 or 2,
The first edge barrier layer is formed to correspond to only one of the side surfaces of the first transparent substrate and the side surface of the second transparent substrate,
The above flexible printed circuit board extends to completely cover the outermost layer of the first edge barrier layer,
A glass assembly, wherein the adhesive layer of the second edge barrier layer adheres to the other of the side surfaces of the first transparent substrate and the side surface of the second transparent substrate and to a portion of the flexible printed circuit board. In Article 7,
A glass assembly, wherein the second edge barrier layer is adhered to the flexible printed circuit board at a portion where the first edge barrier layer and the flexible printed circuit board overlap. In the first paragraph,
A glass assembly, wherein the metal film comprises aluminum (Al). In the first paragraph,
A glass assembly, wherein the adhesive layer comprises polyurethane. In the first paragraph,
A glass assembly, wherein the first sealing member comprises at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), ionoplast polymer, cyclo olefin polymer (COP), and polyurethane. In the second paragraph,
A glass assembly, wherein the second sealing member comprises at least one of polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), ionoplast polymer, cyclo olefin polymer (COP), and polyurethane.