KR102845120B1 - Bake unit, substrate treating method - Google Patents

Abstract

The present invention relates to a bake unit. According to one embodiment of the present invention, the bake unit comprises: a housing; a heating plate positioned within the housing and configured to heat a substrate; and lift pins that move up and down on pinholes of the heating plate; wherein the lift pins may include dampers that provide elasticity so that their upper ends always contact the substrate.

Description

BAKE UNIT, SUBSTRATE TREATING METHOD

The present invention relates to a substrate processing device, and more specifically, to a baking unit for heating a substrate and a substrate processing method.

Typically, manufacturing semiconductor devices involves a variety of processes, including cleaning, deposition, photolithography, etching, and ion implantation. The photolithography process, used to form patterns, plays a crucial role in achieving high integration of semiconductor devices.

The photolithography process is performed to form a photoresist pattern on a semiconductor substrate. The photolithography process includes a coating process to form a photoresist film on the substrate, an exposure process to form a photoresist pattern from the photoresist film, and a development process to remove the area irradiated with light during the exposure process or the opposite area. Before and after each process, a baking process is performed to heat and cool the substrate.

The bake unit that performs the baking process provides the substrate with high heat of 200℃ or more to perform heat treatment, and during this process, electric charges are accumulated on the surface of the substrate due to the electromagnetic field generated when current flows through the heat source (conductor wire) inside the heating plate. Typically, the heating plate is made of hard-anodized AIN and has a surface resistance value of the sub-body band. Therefore, if the residual charge on the substrate surface is not removed during the baking process, it may exceed the substrate standard charge amount (50V/inch), making it vulnerable to arcing.

The present invention provides a method for processing a bake unit substrate capable of continuously removing residual charges on the substrate surface during a baking process.

In addition, the present invention provides a baking unit and a substrate processing method that can always maintain a lift pin in contact with a substrate during a baking process.

The purpose of the present invention is not limited thereto, and other purposes not mentioned will be clearly understood by those skilled in the art from the description below.

According to one aspect of the present invention, a bake unit may be provided, comprising: a housing; a heating plate positioned within the housing and configured to heat a substrate; and lift pins configured to move up and down on pinholes of the heating plate; wherein the lift pins include a damper that provides elasticity so that the upper ends thereof always contact the substrate.

Additionally, each of the lift pins may include an upper pin and a lower pin, and the damper may be provided between the upper pin and the lower pin.

Additionally, the baking unit may further include a cooling plate that moves above the heating plate to cool the substrate heated on the heating plate.

In addition, the apparatus further includes a pin driving unit for elevating the lift pins; and a control unit for controlling the pin driving unit, wherein the control unit controls the driving unit so that the lift pins are elevated to a first height for loading and unloading a substrate; a second height for placing a substrate on the heating plate for baking the substrate; and a third height for placing a substrate on the cooling plate for cooling the substrate, and the lift pins can be maintained in contact with the lower surface of the substrate by the elastic force of the damper at the first height, the second height, and the third height.

In addition, the first height, the second height, and the third height are set to be a predetermined distance higher than the substrate setting height at which the actual substrate is positioned during the process, and when the damper is compressed by the load of the substrate during the process, the lift pins can come into contact with the substrate at the set height.

Additionally, the damper may include a spring.

Additionally, the elastic force of the spring can be provided to be smaller than the load of the substrate.

According to another aspect of the present invention, a substrate processing method may be provided, comprising: a loading step of bringing a substrate into a housing of a bake unit; a baking step of heating a substrate while the substrate is seated on a heating plate; a cooling step of cooling the substrate by seating the substrate heated on the heating plate on a cooling plate; and an unloading step of taking the substrate cooled on the cooling plate out of the housing; wherein the substrate is maintained in contact with lift pins from the loading step to the unloading step so that residual charges on the substrate are continuously removed.

Additionally, the lift pins may be moved to a pin-up height in the loading step, to a pin-down height in the baking step, and to a middle-up height in the cooling step.

Additionally, the middle-up height may be lower than the pin-up step and higher than the pin-down height.

Additionally, the lift pins can be brought into contact with the substrate by the elastic force of the damper.

In addition, the pin-up height, the pin-down height, and the middle-up height are set to a predetermined distance higher than the substrate setting height set during the substrate process, and when the damper is compressed by the load of the substrate during the process, the lift pins can come into contact with the substrate at the set height.

Additionally, the elastic force of the damper can be provided to be less than the load of the substrate.

Additionally, the cooling step may be performed while the cooling plate is positioned on top of the heating plate and the lift pins are in contact with the substrate.

According to one embodiment of the present invention, residual charges on the substrate surface can be continuously removed during a baking process, thereby preventing damage to the substrate.

The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present invention pertains from this specification and the attached drawings.

FIG. 1 is a schematic drawing showing a substrate processing device according to one embodiment of the present invention.
Fig. 2 is a drawing of the substrate processing device (1) of Fig. 1 viewed from the AA direction.
Fig. 3 is a drawing of the substrate processing device (1) of Fig. 1 viewed from the BB direction.
Figure 4 is a perspective view of a bake unit according to one embodiment of the present invention.
Figure 5 is a plan view of the bake unit of Figure 4.
Fig. 6 is a cross-sectional view of the bake unit of Fig. 4.
Figure 7 is a drawing showing a lift pin assembly installed in a bake unit.
Figure 8 is a cross-sectional view of a lift pin.
FIG. 9 is a flow chart sequentially showing a method of processing a substrate in a bake unit according to one embodiment of the present invention.
Figure 10 is a drawing showing the substrate loading state.
Figure 11 is a drawing showing the substrate heating state.
Figure 12 is a drawing showing the substrate cooling status.
Figure 13 is a drawing for comparing the heights of lift pins.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. The embodiments of the present invention may be modified in various ways, and the scope of the present invention should not be construed as being limited to the embodiments described below. These embodiments are provided to more fully explain the present invention to those of ordinary skill in the art. Accordingly, the shapes of elements in the drawings are exaggerated and reduced to emphasize a clearer description.

The equipment of this embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. In particular, the equipment of this embodiment can be connected to an exposure device and used to perform a coating process and a development process on the substrate. The following description will be given as an example where a wafer is used as the substrate.

Figures 1 to 3 are schematic drawings showing a substrate processing device (1) according to one embodiment of the present invention. Figure 1 is a drawing of the substrate processing device (1) as viewed from above, Figure 2 is a drawing of the substrate processing device (1) of Figure 1 as viewed from the A-A direction, and Figure 3 is a drawing of the substrate processing device (1) of Figure 1 as viewed from the B-B direction.

Referring to FIGS. 1 to 3, the substrate processing device (1) includes a load port (100), an index module (200), a buffer module (300), a coating and developing module (400), an interface module (700), and a purge module (800). The load port (100), the index module (200), the buffer module (300), the coating and developing module (400), and the interface module (700) are sequentially arranged in a row in one direction. The purge module (800) may be provided within the interface module (700). Alternatively, the purge module (800) may be provided at various locations, such as a location where an exposure device is connected at the rear end of the interface module (700) or a side of the interface module (700).

Hereinafter, the direction in which the load port (100), index module (200), buffer module (300), application and development module (400), and interface module (700) are arranged is referred to as the first direction (12). When viewed from above, the direction perpendicular to the first direction (12) is referred to as the second direction (14), and the directions perpendicular to the first direction (12) and the second direction (14) are referred to as the third direction (16).

The substrate (W) is moved while stored in a cassette (20). The cassette (20) has a structure that can be sealed from the outside. For example, a front open unified pod (FOUP) having a door at the front can be used as the cassette (20).

Below, the load port (100), index module (200), buffer module (300), application and development module (400), interface module (700), and fuzzy module (800) are described.

The load port (100) has a mounting plate (120) on which a cassette (20) containing substrates (W) is placed. A plurality of mounting plates (120) are provided, and the mounting plates (120) are arranged in a row along the second direction (14). In Fig. 1, four mounting plates (120) are provided.

The index module (200) transfers a substrate (W) between a cassette (20) placed on a mounting plate (120) of a load port (100) and a buffer module (300). The index module (200) includes a frame (210), an index robot (220), and a guide rail (230). The frame (210) is provided in the shape of a rectangular parallelepiped with an interior that is generally hollow. The frame (210) is arranged between the load port (100) and the buffer module (300). The frame (210) of the index module (200) may be provided at a lower height than the frame (310) of the buffer module (300) described below. The index robot (220) and the guide rail (230) are arranged within the frame (210). The index robot (220) has a structure capable of four-axis driving so that a hand (221) for directly handling a substrate (W) can move and rotate in a first direction (12), a second direction (14), and a third direction (16). The index robot (220) includes a hand (221), an arm (222), a support (223), and a pedestal (224). The hand (221) is fixedly installed to the arm (222). The arm (222) is provided with an elastic structure and a rotatable structure. The support (223) is arranged such that its longitudinal direction is along the third direction (16). The arm (222) is coupled to the support (223) so as to be movable along the support (223). The support (223) is fixedly coupled to the pedestal (224). A guide rail (230) is provided such that its longitudinal direction is arranged along the second direction (14). The pedestal (224) is coupled to the guide rail (230) so as to be able to move linearly along the guide rail (230). In addition, although not shown, the frame (210) is further provided with a door opener for opening and closing the door of the cassette (20).

The buffer module (300) includes a frame (310), a first buffer (320), a second buffer (330), a cooling chamber (350), and a first buffer robot (360). The frame (310) is provided in the shape of a rectangular parallelepiped with an interior that is hollow, and is placed between the index module (200) and the application and development module (400). The first buffer (320), the second buffer (330), the cooling chamber (350), and the first buffer robot (360) are positioned within the frame (310). The cooling chamber (350), the second buffer (330), and the first buffer (320) are sequentially placed from below in a third direction (16). The first buffer (320) is positioned at a height corresponding to the application module (401) of the application and development module (400) described later, and the second buffer (330) and the cooling chamber (350) are provided at a height corresponding to the development module (402) of the application and development module (400) described later. The first buffer robot (360) is positioned at a predetermined distance from the second buffer (330), the cooling chamber (350), and the first buffer (320) in the second direction (14).

A first buffer (320) and a second buffer (330) each temporarily store a plurality of substrates (W). The second buffer (330) has a housing (331) and a plurality of supports (332). The supports (332) are arranged in the housing (331) and are provided spaced apart from each other along a third direction (16). One substrate (W) is placed on each support (332). The housing (331) has openings (not shown) in a direction in which the index robot (220) is provided and in a direction in which the first buffer robot (360) is provided so that the index robot (220) and the first buffer robot (360) can load or unload the substrate (W) onto the supports (332) within the housing (331). The first buffer (320) has a structure generally similar to that of the second buffer (330). However, the housing (321) of the first buffer (320) has an opening in the direction in which the first buffer robot (360) is provided and in the direction in which the application robot (432) positioned in the application module (401) is provided. The number of supports (322) provided in the first buffer (320) and the number of supports (332) provided in the second buffer (330) may be the same or different. In one example, the number of supports (332) provided in the second buffer (330) may be greater than the number of supports (322) provided in the first buffer (320).

A first buffer robot (360) transfers a substrate (W) between a first buffer (320) and a second buffer (330). The first buffer robot (360) includes a hand (361), an arm (362), and a support (363). The hand (361) is fixedly installed on the arm (362). The arm (362) is provided with an elastic structure so that the hand (361) can move along a second direction (14). The arm (362) is coupled to the support (363) so as to be able to move linearly along the support (363) in a third direction (16). The support (363) has a length extending from a position corresponding to the second buffer (330) to a position corresponding to the first buffer (320). The support (363) may be provided to be longer in an upper or lower direction. The first buffer robot (360) may be provided so that the hand (361) can only be driven in two axes along the second direction (14) and the third direction (16).

The cooling chamber (350) cools each substrate (W). The cooling chamber (350) includes a housing (351) and a cooling plate (352). The cooling plate (352) has an upper surface on which the substrate (W) is placed and a cooling means (353) for cooling the substrate (W). Various methods, such as cooling using coolant or cooling using a thermoelectric element, may be used as the cooling means (353). In addition, the cooling chamber (350) may be provided with a lift pin assembly for positioning the substrate (W) on the cooling plate (352). The housing (351) has openings in the direction in which the index robot (220) is provided and in the direction in which the developing robot is provided so that the developing robot provided in the index robot (220) and the developing module (402) can load or unload the substrate (W) onto or from the cooling plate (352). In addition, the cooling chamber (350) may be provided with doors for opening and closing the above-described openings.

The coating module (401) includes a process of coating a photosensitive liquid such as photoresist on a substrate (W) and a heat treatment process such as heating and cooling on the substrate (W) before and after the resist coating process. The coating module (401) has a liquid treatment chamber (410), a bake unit (500), and a return chamber (430). The liquid treatment chamber (410), the bake unit (500), and the return chamber (430) are sequentially arranged along the second direction (14). The liquid treatment chamber (410) may be provided as a resist coating chamber (410) that performs a substrate (W) DP resist coating process. A plurality of resist coating chambers (410) are provided, each provided in a first direction (12) and a third direction (16). A plurality of bake units (500) are provided in the first direction (12) and the third direction (16).

The return chamber (430) is positioned parallel to the first buffer (320) of the first buffer module (300) in the first direction (12). An application robot (432) and a guide rail (433) are positioned within the return chamber (430). The return chamber (430) has a generally rectangular shape. The application robot (432) transfers a substrate (W) between the bake units (420), the resist application chambers (410), and the first buffer (320) of the first buffer module (300). The guide rail (433) is positioned so that its length direction is parallel to the first direction (12). The guide rail (433) guides the application robot (432) to move in a straight line in the first direction (12). The application robot (432) has a hand (434), an arm (435), a support (436), and a pedestal (437). The hand (434) is fixedly installed on the arm (435). The arm (435) is provided with an elastic structure so that the hand (434) can move horizontally. The support (436) is provided so that its length direction is arranged along the third direction (16). The arm (435) is coupled to the support (436) so as to be linearly movable in the third direction (16) along the support (436). The support (436) is fixedly coupled to the pedestal (437), and the pedestal (437) is coupled to the guide rail (433) so as to be movable along the guide rail (433).

All resist coating chambers (410) have the same structure. However, the type of photoresist used in each resist coating chamber (410) may be different. For example, a chemical amplification resist may be used as the photoresist. The resist coating chamber (410) coats the photoresist on a substrate (W). The resist coating chamber (410) has a housing (411), a support plate (412), and a nozzle (413). The housing (411) has a cup shape with an open top. The support plate (412) is positioned within the housing (411) and supports the substrate (W). The support plate (412) is provided to be rotatable. The nozzle (413) supplies the photoresist onto the substrate (W) placed on the support plate (412). The nozzle (413) has a circular tubular shape and can supply photoresist to the center of the substrate (W). Optionally, the nozzle (413) has a length corresponding to the diameter of the substrate (W), and the discharge port of the nozzle (413) can be provided as a slit. In addition, the resist coating chamber (410) can further be provided with a nozzle (414) that supplies a cleaning solution, such as deionized water, to clean the surface of the substrate (W) on which the photoresist is coated.

Referring to FIGS. 1 to 3, the developing module (402) includes a developing process for removing a portion of a photoresist by supplying a developing solution to obtain a pattern on a substrate (W), and a heat treatment process such as heating and cooling performed on the substrate (W) before and after the developing process. The developing module (402) has a liquid treatment chamber (460), a bake unit (470), and a return chamber (480). The liquid treatment chamber (460), the bake unit (500), and the return chamber (480) are sequentially arranged along the second direction (14). The liquid treatment chamber (460) may be provided as a developing chamber. The developing chamber (460) and the bake unit (500) are positioned spaced apart from each other in the second direction (14) with the return chamber (480) interposed therebetween. A plurality of developing chambers (460) are provided, and a plurality of them are provided in each of the first direction (12) and the third direction (16).

The return chamber (480) is positioned parallel to the second buffer (330) of the first buffer module (300) in the first direction (12). A developing robot (482) and a guide rail (483) are positioned within the return chamber (480). The return chamber (480) has a generally rectangular shape. The developing robot (482) transfers the substrate (W) between the bake units (470), the developing chambers (460), and the second buffer (330) and cooling chamber (350) of the first buffer module (300). The guide rail (483) is positioned so that its length direction is parallel to the first direction (12). The guide rail (483) guides the developing robot (482) to move in a straight line in the first direction (12). The development robot (482) has a hand (484), an arm (485), a support (486), and a pedestal (487). The hand (484) is fixedly installed on the arm (485). The arm (485) is provided with an elastic structure so that the hand (484) can move horizontally. The support (486) is provided so that its length direction is arranged along a third direction (16). The arm (485) is coupled to the support (486) so as to be linearly movable in the third direction (16) along the support (486). The support (486) is fixedly coupled to the pedestal (487). The pedestal (487) is coupled to the guide rail (483) so as to be movable along the guide rail (483).

The developing chambers (460) all have the same structure. However, the type of developer used in each developing chamber (460) may be different. The developing chamber (460) removes the photoresist on the substrate (W) in the area that has been irradiated with light. At this time, the area of the protective film that has been irradiated with light is also removed. Depending on the type of photoresist used, only the areas of the photoresist and the protective film that have not been irradiated with light may be removed.

The developing chamber (460) has a housing (461), a support plate (462), and a nozzle (463). The housing (461) has a cup shape with an open top. The support plate (462) is positioned within the housing (461) and supports a substrate (W). The support plate (462) is provided to be rotatable. The nozzle (463) supplies a developing solution onto the substrate (W) placed on the support plate (462). The nozzle (463) has a circular tubular shape and can supply the developing solution to the center of the substrate (W). Optionally, the nozzle (463) has a length corresponding to the diameter of the substrate (W), and the discharge port of the nozzle (463) may be provided as a slit. In addition, the developing chamber (460) may further be provided with a nozzle (464) that supplies a cleaning solution, such as deionized water, to clean the surface of the substrate (W) to which the developing solution has been additionally supplied.

The bake unit (500) provided in the development module (402) is provided substantially the same as the bake unit (500) described above.

As described above, in the application and development module (400), the application module (401) and the development module (402) are provided to be separated from each other. In addition, when viewed from above, the application module (401) and the development module (402) may have the same chamber arrangement.

An interface module (700) transports a substrate (W). The interface module (700) includes a frame (710), a first buffer (720), a second buffer (730), and an interface robot (740). The first buffer (720), the second buffer (730), and the interface robot (740) are positioned within the frame (710). The first buffer (720) and the second buffer (730) are spaced apart from each other by a certain distance and are arranged to be stacked on top of each other. The first buffer (720) is arranged higher than the second buffer (730).

The interface robot (740) is positioned apart from the first buffer (720) and the second buffer (730) in the second direction (14). The interface robot (740) transports the substrate (W) between the first buffer (720), the second buffer (730), and the exposure device (900).

The first buffer (720) temporarily stores substrates (W) on which a process has been performed before they are moved to the exposure device (900). And the second buffer (730) temporarily stores substrates (W) on which a process has been completed before they are moved from the exposure device (900). The first buffer (720) has a housing (721) and a plurality of supports (722). The supports (722) are arranged in the housing (721) and are provided spaced apart from each other along a third direction (16). One substrate (W) is placed on each support (722). The housing (721) has an opening in a direction in which the interface robot (740) is provided and a direction in which the preprocessing robot (632) is provided so that the interface robot (740) and the preprocessing robot (632) can load or unload the substrate (W) onto the support (722) into or out of the housing (721). The second buffer (730) has a similar structure to the first buffer (720). The interface module may be provided with only the buffers and the robot as described above, without providing a chamber for performing a predetermined process on the wafer.

Figures 4 to 6 are drawings showing a bake unit.

Referring to FIGS. 4 to 6, the bake unit (500) heat-treats the substrate (W). For example, the bake units (500) may perform a heating process, such as a prebake process that heats the substrate (W) to a predetermined temperature to remove organic substances or moisture from the surface of the substrate (W) before applying photoresist, or a soft bake process that is performed after applying photoresist on the substrate (W), and may perform a cooling process that cools the substrate (W) after each heating process.

The baking unit (500) may include a housing (510), a cooling unit (530), a heating unit (550), and a controller (590) that controls them.

The housing (510) provides a space within which a baking process takes place. The housing (510) is provided in a rectangular parallelepiped shape. The housing (510) includes a first side wall (511), a second side wall (513), and an entrance (512).

A first side wall (511) is provided on one side of the housing (510). A second side wall (512) is provided opposite the first side wall (511). An entrance (512) through which a substrate (W) enters and exits is formed on the side wall of the housing (510). For example, the entrance (512) may be formed on the first side wall (511). The entrance (512) provides a passage through which the substrate (W) moves.

The cooling unit (530) cools the heating plate (551) or the processed substrate (W). The cooling unit (530) may include a cooling plate (531) and a return unit (540) that moves the cooling plate (531). For example, the cooling plate (531) may have a cooling path provided therein. Cooling water may be supplied to the cooling path to cool the substrate (W) and the cooling plate (531). The return unit (540) returns the cooling plate (531) within the housing (510). The cooling plate (531) may be moved to a standby position and a cooling position by the return unit (540). The standby position may be a position adjacent to the entrance (the position shown in FIG. 4), and the cooling position may be a position corresponding to the upper portion of the heating plate.

A substrate (W) is placed on a cooling plate (531). The cooling plate (531) is provided in a circular shape. The cooling plate (531) is provided in the same size as the substrate (W). The cooling plate (531) is provided with a metal material having good thermal conductivity. A guide hole (535) is formed in the cooling plate (531). The guide hole (535) is provided to extend from the outer surface of the cooling plate (531) to the inner side thereof. The guide hole (535) prevents interference or collision with the lift pin (553) when the cooling plate (531) moves. A flow path through which a cooling refrigerant flows may be provided within the cooling plate (531).

The arm (532) is fixedly connected to the cooling plate (531). The arm (532) is provided between the cooling plate (531) and the return part (540).

The return unit (540) drives the cooling plate (531). The return unit (540) moves the cooling plate (531) horizontally or up and down. The return unit (540) can move the cooling plate (531) to a first position and a second position. The first position is a position where the cooling plate (531) is adjacent to the first side wall (511). The second position is a position close to the second side wall (513) and above the heating plate (551).

The heating unit (550) heats the substrate (W) to a set temperature. The heating unit (550) includes a heating plate (551), a lift pin (573), a cover (555), and a driver (557).

A heating means for heating the substrate (W) is provided inside the heating plate (551). For example, the heating means may be provided as a heating coil. Alternatively, heating patterns may be provided on the heating plate (551). The heating plate (551) is provided in a cylindrical shape. A pin hole (554; see FIG. 10) for accommodating a lift pin (573) is formed inside the heating plate (551).

A pin hole (554) is provided for a moving path of the lift pin (573) when the lift pin (573) moves the substrate (W) up and down. The pin hole (554; see Fig. 10) is provided to penetrate the heating plate (551) in the up and down direction, and a plurality of pin holes may be provided.

The lift pin (573) is moved up and down by the pin driver (571). The lift pin (573) can place the substrate (W) on the heating plate (551). The lift pin (573) can elevate the substrate (W) to a position spaced a certain distance from the heating plate (551).

The cover (555) is positioned on top of the heating plate (551). The cover (555) is provided in a cylindrical shape. The cover (555) provides a heating space inside. The cover (555) is moved to the top of the heating plate (551) by the driver (557) when the substrate (W) moves to the heating plate (551). The cover (555) is moved downward by the driver (557) when the substrate (W) is heated by the heating plate (551), thereby forming a heating space in which the substrate (W) is heated.

The actuator (557) is fixedly connected to the cover (555) by the support member (558). The actuator (557) moves the cover (555) up and down when the substrate (W) is transferred or returned to the heating plate (551). For example, the actuator (557) may be provided as a cylinder.

The controller (590) controls the cooling unit (530) and the heating unit (550).

Fig. 7 is a drawing showing a lift pin assembly installed in a bake unit, and Fig. 8 is a cross-sectional view of the lift pin.

As illustrated in FIGS. 7 and 8, the lift pins (573) are installed in a vertical direction on one end of the moving arm (572). The moving arm (572) is raised and lowered by the pin driving unit (571). The pin driving unit (671) is controlled by the control unit (590).

The lift pin (573) may include an upper pin (574), a lower pin (575), and a damper (576) provided therebetween. For example, the damper (576) may be provided as a spring. It is preferable that the elastic force of the spring be less than the load of the substrate. As shown in FIG. 8, when the lift pins (573) support the substrate (W), the damper (576) of the lift pin (573) is compressed by the load of the substrate (W), and the upper pin (574) moves downward by a predetermined height (T1). Therefore, the elevation height of the lift pins (573) is set to be a predetermined distance higher than the substrate setting height set during the substrate process, and the damper (576) is compressed by the load of the substrate during the process, and comes into contact with the substrate at the set height.

Figure 13 is a drawing for comparing the heights of lift pins.

Referring to FIG. 13, the control unit (590) controls the pin driving unit (571) so that the lift pins (573) are raised to a first height (L1) for loading and unloading the substrate, a second height (L2) for placing the substrate on the heating plate (551) for baking the substrate, and a third height (L3) for placing the substrate on the cooling plate (531) for cooling the substrate, and the lift pins (573) are maintained in contact with the bottom surface of the substrate by the elastic force of the damper (576) at the first, second, and third heights. The third height is lower than the first height (pin-up) and higher than the second height (pin-down).

FIG. 9 is a flow chart sequentially showing a method of processing a substrate in a bake unit according to one embodiment of the present invention, FIG. 10 is a drawing showing a substrate loading state, FIG. 11 is a drawing showing a substrate heating state, and FIG. 12 is a drawing showing a substrate cooling state.

Referring to FIGS. 9 to 12 below, a method for processing a substrate may include a substrate loading step (S110), a substrate heating step (S120), a substrate cooling step (S130), and a substrate unloading step (S140).

In the loading step (S110), the substrate is brought into the housing of the bake unit and supported by the lift pins (573). In the loading step, the substrate can be returned by the cooling plate (531) and placed on the lift pins (573), and the cooling plate (531) after completing the return of the substrate can be returned to the standby position. At this time, the lift pins (573) are in a pin-up state.

In the substrate heating step (baking step) (S120), the substrate is heat-treated while mounted on the heating plate (551). The substrate is supported by gap pins (protrusions) located on the upper surface of the heating plate (551). At this time, the lift pins (573) maintain contact with the lower surface of the substrate at the pin-down height.

In the substrate cooling step (cooling step) (S130), the substrate heated on the heating plate (551) is cooled while seated on the cooling plate (531). At this time, the lift pins (573) remain in contact with the bottom surface of the substrate at the middle-up height.

In the substrate unloading step (S140), the substrate cooled on the cooling plate (531) is taken out of the housing. At this time, the lift pins (573) are in a pin-down state.

The substrate processing method according to this embodiment is characterized by maintaining the substrate in contact with the lift pins from the loading stage to the unloading stage so that residual charges on the substrate are continuously removed. To this end, dampers provide elasticity to the lift pins so that their upper ends always remain in contact with the substrate.

For example, the pin-up, pin-down, and middle-up heights are set to a predetermined distance higher than the height set when the actual substrate is processed, and the damper is compressed by the load of the substrate during the process and comes into contact with the substrate at the predetermined height.

The detailed description above is illustrative of the present invention. Furthermore, the foregoing description illustrates preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. In other words, changes or modifications may be made within the scope of the inventive concepts disclosed herein, the scope equivalent to the written disclosure, and/or the scope of technology or knowledge in the art. The written embodiments illustrate the best possible state for implementing the technical idea of the present invention, and various modifications required for specific applications and uses of the present invention are also possible. Therefore, the detailed description of the invention above is not intended to limit the present invention to the disclosed embodiments. Furthermore, the appended claims should be construed to include other embodiments.

100: Load port 200: Index module
300: Buffer module 400: Application and development module
500: Bake unit 510: Housing
530: Cooling unit 531: Cooling plate
550: Heating unit 551: Heating plate
573: Lift pin

Claims (14)

In the bake unit,
housing;
A heating plate positioned within the housing and heating the substrate; and
Including lift pins that move up and down on the pinholes of the above heating plate;
The above lift pins
A baking unit including a damper that provides elasticity to maintain the substrate in contact with the substrate until the baking step in which the substrate is brought into the housing and placed on the heating plate and heated. In the first paragraph,
Each of the above lift pins
Includes upper and lower pins,
The above damper is a bake unit provided between the upper pin and the lower pin. In the first paragraph,
The above bake unit
A baking unit further comprising a cooling plate that is moved above the heating plate and cools the substrate heated by the heating plate. In the third paragraph,
A pin driving unit that elevates the above lift pins; and
Further comprising a control unit for controlling the above pin driving unit,
The above control unit
The driving unit is controlled so that the above lift pins are raised to a first height for loading and unloading the substrate; a second height for placing the substrate on the heating plate for baking the substrate; and a third height for placing the substrate on the cooling plate for cooling the substrate.
A bake unit in which the above lift pins are maintained in contact with the lower surface of the substrate by the elastic force of the damper at the first height, the second height, and the third height. In paragraph 4,
The above first height, the above second height and the above third height
A bake unit in which the actual substrate is set a predetermined distance higher than the substrate setting height at which the process is performed, and the lift pins come into contact with the substrate at the set height as the damper is compressed by the load of the substrate during the process. In any one of the first to fifth clauses,
The above damper
A baking unit containing a spring. In paragraph 6,
The elasticity of the above spring is
A bake unit provided with a load less than that of the above substrate. A loading step in which the substrate is brought into the housing of the bake unit;
A baking step of heating the substrate while the substrate is placed on a heating plate;
A cooling step of cooling the substrate by placing the substrate heated on the heating plate on a cooling plate; and
Including an unloading step of transporting the substrate cooled on the cooling plate out of the housing;
From the loading step to the unloading step, the substrate is maintained in contact with the lift pins so that residual charges on the substrate are continuously removed;
The above lift pins
In the above loading step, it moves to the pin-up height,
In the above baking step, it is moved to the pin-down height,
A method for processing a substrate moved to a middle-up height in the above cooling step. delete In paragraph 8,
The above middle-up height
A substrate processing method having a height lower than the above pin-up step and higher than the above pin-down height. In paragraph 8,
The above lift pins
A method for processing a substrate that comes into contact with the substrate by the elastic force of a damper. In Article 11,
The above pin-up height, the above pin-down height and the above middle-up height
A substrate processing method in which the substrate setting height is set to a predetermined distance higher than the set substrate setting height during the substrate processing process, and the lift pins come into contact with the substrate at the set height as the damper is compressed by the load of the substrate during the processing. In Article 12,
The elasticity of the above damper is
A method for processing a substrate provided with a load less than that of the above substrate. In Article 12,
The above cooling step
A substrate processing method in which the cooling plate is positioned on top of the heating plate and the lift pins are in contact with the substrate.