KR102848406B1 - Printing apparatus using selective electrochemical additive manufacturing and control method of the same - Google Patents

Abstract

The present invention relates to a Selective Electrochemical Additive Manufacturing (S-ECAM) printing device capable of selectively depositing metal materials on a substrate using an electrochemical deposition-based lamination method (ECAM, Electrochemical Additive Manufacturing). In addition, the present invention relates to a S-ECAM printing device capable of forming a bonding layer for mounting chips on a circuit board without using a mask.

Description

S-ECAM printing apparatus and control method thereof {Printing apparatus using selective electrochemical additive manufacturing and control method of the same}

The present invention relates to an S-ECAM printing device, and more particularly, to an S-ECAM (Selective ElectroChemical Additive Manufacturing) printing device capable of selectively depositing a metal raw material on a substrate using an electrochemical deposition lamination method (ECAM, ElectroChemical Additive Manufacturing).

Korean Patent No. 10-2392201 (3D printing device using selective electrochemical deposition having a multi-electrode module), Korean Patent No. 10-2392199 (Control method for 3D printing device using selective electrochemical deposition), Korean Patent No. 10-2382806 (3D printing device using selective electrochemical deposition performing gap control using pulse peak) disclose 3D printing devices using selective electrochemical deposition.

Figure 1 is a drawing showing a 3D printing device using conventional selective electrochemical deposition, and Figure 2 is a drawing showing a state in which power is applied to a substrate and electrodes.

Referring to FIGS. 1 and 2, a conventional 3D printing device (10) using selective electrochemical deposition includes a tub (20) that accommodates an electrolyte (11), a substrate (12) placed in a state of being immersed in the electrolyte (11) accommodated in the tub (20), a multi-electrode module (30) having an electrode holder (31) and a plurality of electrodes (32) arranged and fixed at a predetermined interval to the electrode holder (31), a driving unit (13) that controls the movement of the multi-electrode module (30), a power supply unit (50) for applying power to the substrate (12) and the plurality of electrodes (32), and a control unit (14) that controls the driving unit (13) and the power supply unit (50) to selectively deposit and laminate metal ions contained in the electrolyte (11) on the substrate (12).

The substrate (12) and the bottom surface (33) of the plurality of electrodes (32) can be immersed in the electrolyte (11) contained in the tub (20) while facing each other and spaced apart from each other by a predetermined distance.

For example, the substrate (12) can be immersed in the electrolyte (11) contained in the tub (20) while being placed on a support (21) provided in the tub (20), and the plurality of electrodes (32) can be immersed in the electrolyte (11) contained in the tub (20) with the bottom surfaces (33) of the plurality of electrodes (32) facing the substrate (12) at a predetermined distance from each other by the movement of the multi-electrode module (30) by the operation of the driving unit (13).

And, when the substrate (12) and the bottom surfaces (33) of the plurality of electrodes (32) are immersed in the electrolyte (11) contained in the tub (20) while facing each other with a predetermined distance between them, the control unit (14) controls the power supply unit (50) to apply power to the substrate (12) and the plurality of electrodes (32) by making the plurality of electrodes (32) (+) and the substrate (12) (-), the metal ions included in the electrolyte (11) can be electrochemically deposited on the area (17) where the bottom surfaces (33) of the electrodes (32) face each other on the substrate (12), thereby being laminated.

Accordingly, the control unit (14) can selectively deposit and laminate the metal ions contained in the electrolyte (11) on the substrate (12) by controlling the driving unit (13) and the power supply unit (50).

The above driving unit (13) is a configuration for controlling the movement of the multi-electrode module (30), and may be provided so as to be able to drive the multi-electrode module (30) in horizontal and vertical directions.

For example, the driving unit (13) can horizontally move the multi-electrode module (30) to select a position where it is stacked on the substrate (12), and after stacking to a predetermined height, for example, after a preset 1-layer stacking is completed, the multi-electrode module (30) can be moved vertically by approximately the 1-layer stacking height to adjust the gap between the substrate (12) and the bottom surface (33) of the plurality of electrodes (32).

That is, the driving unit (13) can drive the multi-electrode module (30) to control the three-dimensional displacement including the gap between the bottom surface (33) of the plurality of electrodes (32) and the substrate (12).

Meanwhile, in the past, a method using a mask was mainly used to form a bonding layer for mounting chips on a semiconductor circuit board, but this method had problems such as high equipment cost, investment cost, long process time, and increased environmental cost due to the exposure process and the strip process for removing photoresist.

The present invention provides an S-ECAM printing device capable of selectively laminating a metal raw material on a substrate using a lamination method by electrochemical deposition.

In addition, the present invention provides an S-ECAM printing device capable of forming a bonding layer for mounting a chip on a circuit board without using a mask.

According to one embodiment of the present invention, an S-ECAM printing device comprises: a bath; a substrate support portion provided in the bath and having a substrate placed thereon; an electrode module including an electrode holder having an inlet for introducing an electrolyte and an outlet for discharging the electrolyte introduced through the inlet, and a plurality of electrodes provided at predetermined intervals on the bottom surface of the electrode holder; a first driving unit for moving the electrode module; a power supply unit for applying power using the electrode as an anode and the substrate as a cathode; a storage unit for storing an electrolyte; a pump for supplying the electrolyte stored in the storage unit to the inlet; a camera module including a camera for detecting a substrate alignment mark formed on the substrate and an electrode alignment mark formed on the electrode holder; a second driving unit for moving the camera module; And it may include a control unit that controls the first driving unit and the second driving unit so that the substrate alignment mark and the electrode alignment mark detected by the camera overlap each other to align the substrate and the electrode module, and applies power to the power supply unit while the electrode and the substrate are immersed in the electrolyte discharged from the discharge port of the electrode holder in a state where they are spaced apart from each other by a predetermined distance, thereby depositing metal ions included in the electrolyte on a predetermined area of the substrate facing the electrode.

In addition, in an S-ECAM printing device according to an embodiment of the present invention, the control unit controls the second driving unit so that the camera detects the substrate alignment mark, then controls the first driving unit so that the camera detects the electrode alignment mark, and then controls the first driving unit so that the substrate alignment mark and the electrode alignment mark recognized by the camera overlap each other, thereby aligning the substrate and the electrode module.

In addition, the S-ECAM printing device according to one embodiment of the present invention includes a body having the camera mounted on one side of the camera module, an upper opening mounted on the upper side of the other side of the body, and a lower opening mounted on the lower side of the other side of the body, and a beam splitter may be mounted inside the body to reflect light incident through the upper opening and light incident through the lower opening toward the camera.

In addition, the S-ECAM printing device according to one embodiment of the present invention has an upper lighting unit provided in the upper opening, a lower lighting unit provided in the lower opening, and the control unit can turn on the lower lighting unit and turn off the upper lighting unit when the camera detects the substrate alignment mark, and can turn off the lower lighting unit and turn on the upper lighting unit when the camera detects the electrode alignment mark.

In addition, the S-ECAM printing device according to one embodiment of the present invention may include a pressurizing unit positioned on one side of the bath to pressurize a substrate placed on top of the substrate support unit, and a vacuum pump that fixes the substrate placed on top of the substrate support unit through a vacuum hole formed in the substrate support unit.

In addition, the S-ECAM printing device according to one embodiment of the present invention may include a rod rotatably provided on one side of the bath, and a third driving unit that rotates the rod to pressurize the substrate.

In addition, in the S-ECAM printing device according to one embodiment of the present invention, the control unit can operate the vacuum pump to fix the substrate while the substrate is pressurized by the pressurizing unit.

In addition, in an S-ECAM printing device according to one embodiment of the present invention, at least three gap sensors are provided in the electrode module, and the control unit can control the first driving unit according to detection of the gap sensor so that the bottom surface of the electrode module is parallel to the top surface of the substrate.

In addition, the S-ECAM printing device according to one embodiment of the present invention includes a cleaning block for cleaning the substrate and the electrode module, and a fourth driving unit for moving the cleaning block, and the control unit can control the operation of the fourth driving unit so that the cleaning block moves between the substrate and the electrode module.

In addition, the S-ECAM printing device according to one embodiment of the present invention includes a partition frame having a partition wall that forms a space in which the substrate and the electrode are immersed by the electrolyte discharged from the discharge port of the electrode module, and a fifth driving unit that moves the partition wall frame, and the control unit can control the operation of the fifth driving unit so that the partition wall is positioned above the substrate support unit.

In addition, an S-ECAM printing device according to an embodiment of the present invention includes: a cleaning block for cleaning the substrate and the electrode module; a fourth driving unit for moving the cleaning block; a partition frame having a partition wall that forms a space in which the substrate and the electrode are immersed by an electrolyte discharged from an outlet of the electrode module; and a fifth driving unit for moving the partition wall frame; wherein the control unit can control the operation of the fourth driving unit so that the cleaning block moves between the substrate and the electrode module, and control the operation of the fifth driving unit so that the partition wall is positioned above the substrate support unit.

Meanwhile, a control method of an S-ECAM printing device according to an embodiment of the present invention may include a substrate pressurization step of controlling the operation of a third driving unit so that a rod located at one side of a bath pressurizes a substrate placed on an upper portion of a substrate support unit; a substrate fixing step of operating a vacuum pump while the substrate is pressurized so that the substrate is fixed through a vacuum hole formed at a lower portion of the substrate support unit; a substrate pressurization releasing step of controlling the operation of the third driving unit while the substrate is fixed so that the pressurized state of the substrate is released; an alignment step of controlling the operation of a first driving unit and a second driving unit to align the substrate and an electrode module; a printing step of controlling the operation of the first driving unit, a power supply unit, and a pump to deposit metal ions contained in an electrolyte on a predetermined area of the substrate facing an electrode formed on a bottom surface of the electrode module; and a cleaning step of controlling the operation of a fourth driving unit so that a cleaning block moves between the substrate and the electrode module.

In addition, a control method of an S-ECAM printing device according to an embodiment of the present invention includes a partition forming step of controlling the operation of a fifth driving unit to move a partition frame provided with the partition so that the partition forming a space in which the substrate and the electrode are immersed in an electrolyte is positioned above the substrate support unit, and the partition forming step can be performed before the alignment step or before the printing step.

In addition, a control method of an S-ECAM printing device according to an embodiment of the present invention may include, before the cleaning step, a gap forming step of vertically moving the electrode module and the partition frame so that the electrode module and the partition frame are spaced apart from the substrate by a preset gap by controlling the operation of the first driving unit and the fifth driving unit.

In addition, a control method of an S-ECAM printing device according to an embodiment of the present invention may include: an electrode module leveling step in which the alignment step controls the operation of the first driving unit according to detection by a gap sensor provided in the electrode module so that the bottom surface of the electrode module is parallel to the top surface of the substrate; a substrate alignment mark detection step in which the operation of the second driving unit is controlled so that the camera provided in the camera module moves the camera module so that the camera detects a substrate alignment mark formed on the substrate; an electrode alignment mark detection step in which the operation of the first driving unit is controlled so that the electrode module moves so that the camera detects an electrode alignment mark formed on the electrode module; and an alignment mark overlapping step in which the operation of the first driving unit is controlled so that the electrode alignment mark detected by the camera overlaps the substrate alignment mark.

In addition, a control method of an S-ECAM printing device according to an embodiment of the present invention may include an initial gap forming step in which the printing step controls the operation of the first driving unit to lower the electrode module so that the gap between the substrate and the electrode forms a preset initial gap; an electrolyte supply step in which the operation of the pump is controlled to supply the electrolyte stored in the storage unit to an inlet formed in the electrode module; and an electrodeposition step in which, while the substrate and the electrode are immersed in the electrolyte discharged through the outlet formed in the electrode module, the metal ions contained in the electrolyte are electrodeposited on a predetermined area of the substrate facing the electrode by controlling the operation of the power supply unit.

In addition, in a control method of an S-ECAM printing device according to one embodiment of the present invention, the cleaning step can be performed by operating at least one of a vacuum pump and an air compressor.

In addition, in the control method of the S-ECAM printing device according to one embodiment of the present invention, the substrate pressing step can be performed when a proximity sensor provided in the substrate support detects the substrate.

According to an S-ECAM printing device according to an embodiment of the present invention, a bonding layer for mounting a chip on a circuit board can be formed without using a mask by using a lamination method by electrochemical deposition, so that an exposure process and a strip process for removing a photoresist, which are required when using a mask, are not required, and thus there is an effect of lower equipment price and investment cost, shortened process time, and minimization of environmental costs.

The effects according to the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art to which the present invention pertains from the description of the claims and detailed description.

Figure 1 is a drawing showing a 3D printing device using conventional selective electrochemical deposition.
Figure 2 is a drawing showing a state in which power is applied to the substrate and electrodes.
FIG. 3 is a perspective view of an S-ECAM printing device according to an embodiment of the present invention.
Figure 4 is a rear view of an S-ECAM printing device according to an embodiment of the present invention.
FIG. 5 is a top perspective view of an S-ECAM printing device according to an embodiment of the present invention.
Figure 6 is a schematic front view of Figure 5,
FIG. 7 is a drawing showing a camera module according to an embodiment of the present invention.
Figure 8 is a perspective view showing a bath and a pressurizing unit according to one embodiment of the present invention.
Figure 9 is a perspective view showing a state in which a pressurizing part is pressing a substrate.
Figure 10 is a perspective view of a bass and a substrate support according to one embodiment of the present invention.
Figure 11 is a plan view of Figure 10,
Figure 12 is a cross-sectional view taken along line AA of Figure 11,
Fig. 13 is a partial cross-sectional view of a substrate support according to another embodiment of the present invention.
Figure 14 is a perspective view of an electrode module according to an embodiment of the present invention.
Figure 15 is an exploded perspective view of an electrode module according to one embodiment of the present invention.
Figure 16 is a vertical cross-sectional view of an electrode module according to one embodiment of the present invention.
Figure 17 is a bottom view of a cover according to one embodiment of the present invention.
Fig. 18 is a drawing showing the bottom surface of an electrode holder according to one embodiment of the present invention.
FIG. 19 is a schematic side view of an S-ECAM printing device according to an embodiment of the present invention.
Figure 20 is a schematic front view of Figure 19,
Figure 21 is a perspective view of a combination of a cleaning block according to an embodiment of the present invention.
Fig. 22 is an exploded perspective view of the cleaning block according to Fig. 22,
FIG. 23 is a schematic side view of an S-ECAM printing device according to an embodiment of the present invention.
Figure 24 is a perspective view schematically showing the state in which the bulkhead frame is located at the rear of the bath.
Figure 25 is a perspective view schematically showing a state in which the bulkhead frame is located above the substrate support portion.
Fig. 26 is a vertical cross-sectional view schematically showing a fifth driving unit according to another embodiment of the present invention.
Figure 27 is a vertical cross-sectional view schematically showing an S-ECAM printing device according to one embodiment of the present invention.
FIG. 28 is a drawing showing a control method of an S-ECAM printing device according to one embodiment of the present invention.

Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same drawing reference numerals, and redundant descriptions thereof are omitted.

Terms such as first, second, etc. may be used to describe components, but the components are not limited to these terms and are used only for the purpose of distinguishing one component from another.

When a part is said to "include" a component, this does not mean that it excludes other components, but rather that it may have other components, unless otherwise stated.

The thickness or size of each layer (film), region, pattern or structure in the drawings may be modified for clarity and convenience of description, and therefore do not entirely reflect the actual size. In the description of the embodiments, when each layer (film), region, pattern or structure is described as being formed "over", "on" or "under" the substrate, each layer (film), region, pad or pattern, "over", "on" and "under" include both being formed "directly" or "indirectly" via another layer.

Additionally, “on ~” means located above or below the target object, and does not necessarily mean located above in the direction of gravity.

In this specification, relative terms such as 'upper', 'lower', 'top', 'bottom', 'upper', 'lower', etc. may be used to describe the relationship between components based on the direction shown in the drawings, and the present invention is not limited by such terms.

Each embodiment may be implemented independently or together, and some components may be excluded to suit the purpose of the invention.

FIG. 3 is a perspective view of an S-ECAM printing device according to an embodiment of the present invention, and FIG. 4 is a rear view of an S-ECAM printing device according to an embodiment of the present invention.

Referring to FIGS. 3 and 4, an S-ECAM printing device (100) according to one embodiment of the present invention may include a bath (120), a substrate support member (200) provided in the bath (120) and having a substrate (130) placed thereon, and an electrode module (300) positioned at a predetermined distance above the substrate support member (200).

The above substrate (130) may be a circuit board. For example, the S-ECAM printing device (100) according to the present invention may be used to form a bonding layer for mounting a chip on a circuit board.

The above electrode module (300) may include an electrode holder having an inlet for introducing electrolyte and an outlet for discharging the electrolyte introduced through the inlet, and a plurality of electrodes provided at predetermined intervals on the bottom surface of the electrode holder. A detailed description thereof will be provided later.

In addition, the S-ECAM printing device (100) according to one embodiment of the present invention may include a first driving unit (101) that moves the electrode module (300), a power supply unit (102) that applies power using the electrode formed on the bottom surface of the electrode holder as an anode and the substrate (130) as a cathode, a storage unit (103) that stores an electrolyte, and a pump (104) that supplies the electrolyte stored in the storage unit (103) to the inlet of the electrode holder.

In addition, the S-ECAM printing device (100) according to one embodiment of the present invention may include a control unit (110) that controls the first driving unit (101), the power supply unit (102), and the pump (104).

Accordingly, when power is applied to the power supply unit (102) while the electrode and the substrate (130) are immersed in the electrolyte discharged from the discharge port of the electrode holder while being spaced apart from each other by a predetermined distance, the metal ions contained in the electrolyte can be deposited on a predetermined area of the substrate (130) facing the electrode.

For example, the control unit (110) can control the operation of the first driving unit (101) so that the electrode and the substrate (130) are spaced apart by a predetermined distance, control the operation of the pump (104) so that the electrode and the substrate (130) can be immersed in the electrolyte while the electrode and the substrate (130) are spaced apart by the predetermined distance, and control the operation of the power supply unit (102) so that power can be applied to the electrode and the substrate (130) while the electrode and the substrate (130) are immersed in the electrolyte discharged from the discharge port of the electrode holder. Then, printing can be performed by depositing metal ions included in the electrolyte on a predetermined area of the substrate (130) facing the electrode.

The bath (120) has a space for receiving the electrolyte discharged from the discharge port of the electrode holder, and the bath (120) may be provided with a discharge port for discharging the received electrolyte to the storage unit (103). Then, the electrolyte collected in the storage unit (103) is supplied again to the inlet port of the electrode holder by the operation of the pump (104), so that the electrolyte can circulate.

In addition, the S-ECMA printing device (100) according to one embodiment of the present invention may include an input unit (105) that can input printing conditions, such as electrolyte conditions such as pressure and flow rate, gap conditions between the substrate (130) and the electrode, power supply conditions such as constant current and constant voltage, and a UI that allows a user to input the conditions and a display unit (106) that displays a state in which electrodeposition is performed on the substrate.

In addition, the S-ECMA printing device (100) according to one embodiment of the present invention may include a camera module (140) equipped with a camera that detects a substrate alignment mark formed on the substrate (130) and an electrode alignment mark formed on the electrode holder, and a second driving unit (107) that moves the camera module (140), and the control unit (110) may control the operation of the second driving unit (107).

Then, the control unit (110) can align the substrate (130) and the electrode module by controlling the first driving unit (101) and the second driving unit (107) so that the substrate alignment mark and the electrode alignment mark detected by the camera overlap each other. A detailed description thereof will be provided later.

In addition, the S-ECAM printing device (100) according to one embodiment of the present invention may include a vacuum pump (108) that fixes a substrate placed on the substrate support member (200) through a vacuum hole formed in the substrate support member (200), and an air compressor (109) that generates air pressure, and the control unit (110) may control the operation of the vacuum pump (108) and the air compressor (109).

FIG. 5 is a top perspective view of an S-ECAM printing device according to an embodiment of the present invention, FIG. 6 is a schematic front view of FIG. 5, and FIG. 7 is a drawing showing a camera module according to an embodiment of the present invention.

In the S-ECAM printing device (100) according to one embodiment of the present invention, the upper part is a space where metal ions included in the electrolyte are deposited on the substrate (120), that is, printing is performed, and may include a base frame (111), an upper frame (112), and a support frame (113) provided at the edge of the base frame (111) to support the upper frame (112).

Referring to FIGS. 5 and 6, the bath (120) can be fixed to the upper portion of the base frame (11), and the first driving unit (101) can be fixed to the upper frame (112).

In addition, the S-ECAM printing device (100) according to one embodiment of the present invention may include a pressurizing unit (150) positioned on one side of the bath (120) to pressurize a substrate (130) placed on top of the substrate support unit (200).

At this time, the control unit (110) can operate the vacuum pump (108) to fix the substrate (130) while the substrate (130) is pressurized by the pressurizing unit (150). A detailed description thereof will be provided later.

Meanwhile, a substrate alignment mark (144) may be formed on the upper surface of the substrate (130), and an electrode alignment mark (145) corresponding to the substrate alignment mark (144) may be formed on the lower surface of the electrode module (300).

The above substrate alignment mark (144) and the above electrode alignment mark (145) are for alignment of the substrate (130) and the electrode module (300).

The above camera module (140) may be equipped with a camera (142) that detects the substrate alignment mark (144) and the electrode alignment mark (145).

The second driving unit (107) may be provided to enable left-right, front-back, and rearward driving, and the camera module (140) may be provided to enable left-right, front-back, and rearward movement according to the driving of the second driving unit (107).

For example, an S-ECAM printing device (100) according to one embodiment of the present invention may include a support member (146) that supports the camera module (140), a left-right guide member (147) that guides left-right movement of the support member (146), and a front-rear guide member (148) that is fixed to the upper frame (112) and guides the front-rear movement of the first guide member (147).

Then, the camera module (140) can move left and right and forward and backward according to the driving of the second driving unit (107).

Referring to FIG. 7, a camera module (140) according to one embodiment of the present invention may include a body (160) having the camera (142) provided on one side, an upper opening (161) provided on the upper side of the other side of the body (160), and a lower opening (162) provided on the lower side of the other side of the body (160).

In addition, inside the body (160), a beam splitter (163) that reflects light incident through the upper opening (161) and light incident through the lower opening (163) toward the camera (142), and an optical system that allows light reflected from the beam splitter (163) to be incident on the camera (142) may be provided.

In addition, the upper opening (161) may be provided with an upper lighting unit (164), the lower opening (162) may be provided with a lower lighting unit (165), and the upper opening (161) and the lower opening (162) may each be provided with a lens (166).

The above control unit (110) can control the on/off of the upper lighting unit (164) and the lower lighting unit (165).

The control unit (110) can align the substrate (130) and the electrode module by controlling the first driving unit (101) and the second driving unit (107) so that the substrate alignment mark (144) and the electrode alignment mark (145) detected by the camera (142) overlap each other.

For example, the control unit (110) controls the second driving unit (107) so that the camera (142) detects the substrate alignment mark (144), then controls the first driving unit (101) so that the camera (142) detects the electrode alignment mark (145), and then controls the first driving unit (101) so that the substrate alignment mark (144) recognized by the camera (142) and the electrode alignment mark overlap each other, thereby aligning the substrate (130) and the electrode module (300).

At this time, the control unit (110) can turn on the lower lighting unit (165) and turn off the upper lighting unit (164) when the camera (142) detects the substrate alignment mark (144), and can turn off the lower lighting unit (165) and turn on the upper lighting unit (164) when the camera (142) detects the electrode alignment mark (145).

Then, when detecting the substrate alignment mark (144), the light noise coming from the upper lighting unit (164) can be reduced, and conversely, when detecting the electrode alignment mark (145), the light noise coming from the lower lighting unit (165) can be reduced, and accordingly, the camera (142) can easily detect the substrate electrode alignment mark (144) and the electrode alignment mark (145).

In addition, as shown in FIG. 6, at least two substrate alignment marks (144) can be formed, and at least two electrode alignment marks (145) can be formed to correspond to the substrate alignment marks (144).

At this time, two or more camera modules (140) may be provided so as to simultaneously detect two or more substrate alignment marks (144) and electrode alignment marks (145).

Then, the substrate (130) and the electrode module (300) can be aligned more precisely.

Fig. 8 is a perspective view showing a bath and a pressurizing unit according to one embodiment of the present invention, and Fig. 9 is a perspective view showing a state in which the pressurizing unit is pressing a substrate.

Referring to FIGS. 8 and 9, a pressurizing unit (150) according to one embodiment of the present invention may include a rod (152) provided on one side of the bath (120), and a third driving unit (153) that rotates the rod (152) to pressurize the substrate (130).

The above control unit (110) can control the operation of the third driving unit (153) to pressurize the substrate (130) placed on the substrate support unit (200).

In addition, the control unit (110) can operate the third driving unit (153) to operate the vacuum pump (108) while the substrate (130) is pressurized by the pressurizing unit (150) to fix the substrate (130).

Then, the substrate (130) can be fixed in a flat state. When the substrate (130) is placed on the substrate support member (200), the center of the substrate (130) becomes lifted. In this embodiment, the substrate (130) in the lifted state is pressed to make it flat, and in order to fix the substrate (130) that has been flattened by the pressurization in that state, the vacuum pump (108) is operated while the substrate (130) is pressurized.

A third driving unit (153) according to one embodiment of the present invention may include a rotary driving unit that rotates the rod (152) above the substrate (130), and a vertical driving unit that lowers the rod (152) rotated above the substrate (130) to pressurize the substrate (130).

In another embodiment, the third driving unit (153) may be a rotary actuator that rotates and lowers the load (152). The rotary actuator may be operated by pneumatic pressure from the air compressor (109).

The above rotary actuator is a cylinder that rotates and reciprocates within a set angular range with an output shaft. By utilizing this, rotation and vertical movement can be performed simultaneously in one configuration, thereby simplifying the configuration of the third driving unit (153).

In addition, a damage prevention member (154) may be provided at the lower end of the end of the load (152) to prevent damage to the substrate (130) when the load (152) presses the substrate (130). For example, a rubber pad may be used as the damage prevention member (154).

Fig. 10 is a perspective view of a bass and a substrate support according to an embodiment of the present invention, Fig. 11 is a plan view of Fig. 10, and Fig. 12 is a cross-sectional view taken along line A-A of Fig. 11 showing a state in which a first sealing member is provided.

Referring to FIGS. 10 to 12, a vacuum hole (201) connected to the vacuum pump (108) may be formed in a substrate support member (200) according to one embodiment of the present invention.

A first sealing member (220) may be provided on the upper surface of the substrate support member (200) to prevent electrolyte from flowing into the vacuum hole (201).

For example, the first sealing member (220) may be provided to surround the vacuum hole (201) at a predetermined interval.

Then, when the substrate (130) is pressed downward, i.e., toward the upper surface of the substrate support member (200), by the vacuum pump (108), the substrate (130) presses the first sealing member (220), thereby preventing the electrolyte from flowing into the vacuum hole (201).

In this way, in a state where the substrate (130) presses the first sealing member (220) to prevent the electrolyte from flowing into the vacuum hole (201), the control unit (110) can operate the pump (104) to supply the electrolyte stored in the storage unit (103) to the inlet of the electrode module (300).

On the upper surface of the substrate support member (200), insertion grooves (203) may be formed to surround the vacuum hole (201) at a predetermined interval, and the first sealing member (220) may be provided to surround the vacuum hole (201) by being inserted into the insertion grooves (203).

Meanwhile, a vacuum hole forming area (210) in which a plurality of vacuum holes (201) are formed may be formed on the upper surface of the substrate support member (200), and the first sealing member (220) may be provided to surround the vacuum hole forming area (210).

For example, on the upper surface of the substrate support member (200), insertion grooves (203) may be formed to surround the vacuum hole forming area (210) at a predetermined interval, and the first sealing member (220) may be provided to surround the vacuum hole forming area (210) by being inserted into the insertion grooves (203).

On the upper surface of the substrate support member (200), a plurality of vacuum hole forming areas (210) may be formed at predetermined intervals. Then, the substrate (130) placed on the upper surface of the substrate support member (200) can be evenly and firmly fixed. At this time, the number of first sealing members (220) may be provided equal to the number of vacuum hole forming areas (210).

A connecting hole (205) may be formed at the bottom of the substrate support member (200) to which a connecting pipe (122) connected to the vacuum pump (108) is connected, and a connecting hole (207) may be formed between the connecting hole (205) and the vacuum hole (201) to allow them to communicate with each other.

When the vacuum hole forming area (210) is formed on the surface of the substrate support member (200), the coupling hole (205) can be formed one by one at the bottom of the vacuum hole forming area (210), and at this time, the upper cross-sectional size of the connecting hole (207) can have a size that includes all of the plurality of vacuum holes (201) formed in the vacuum hole forming area (210). For example, the connecting hole (207) can have a tapered shape in which the cross-section becomes wider as it goes upward. Then, vacuum pressure can be generated in the plurality of vacuum holes (210) formed in the vacuum hole forming area (210) with only the one connecting pipe (122).

A through hole (123) through which the connecting pipe (122) passes may be formed at the bottom of the above-mentioned bath (120), the substrate support member (200) may be provided above the through hole (123), and a second sealing member (223) may be provided at the lower edge of the substrate support member (200) to prevent electrolyte from flowing into the through hole (123).

For example, a protrusion (125) protruding upward and supporting the substrate support member (200) may be formed on the inside of the bath (120), and the through hole (13) may be formed at the bottom of the protrusion (125).

At this time, a space (128) for receiving an electrolyte may be formed around the protrusion (125), the second sealing member (223) may be provided on the upper edge of the protrusion (125), and an insertion groove (124) into which the second sealing member (223) is inserted may be formed on at least one of the lower edge of the substrate support member (200) and the upper edge of the protrusion (125).

Additionally, the bath (120) may be provided with a discharge port (121) to discharge the electrolyte collected in the space (128) to the storage unit (103).

In addition, the bath (120) may be provided with a pair of support walls (127) on both sides of the substrate support member (200) to support the forward and backward movement of the cleaning member to be described later. A detailed description thereof will be described later.

Meanwhile, the S-ECAM printing device (100) according to the present invention can be used to print metal ions contained in an electrolyte onto a circuit board. For example, the S-ECAM printing device (100) according to the present invention can be used to form a bonding layer for mounting a chip on a circuit board without a mask. Therefore, it is necessary to prevent damage to the substrate (130) due to pressure.

To this end, a proximity sensor (207) for detecting a substrate (130) placed on the upper surface of the substrate support member (200) may be provided, and a catch (205) may be formed on the edge of the upper surface of the substrate support member (200) to catch the edge of the substrate (130) so as to guide the correct position of the substrate (130).

Then, the control unit (110) can determine whether the substrate (130) is positioned at the upper position of the substrate support unit (200) based on whether the proximity sensor (207) detects the substrate (130).

If the substrate (130) is not positioned inside the catch (205) on the upper surface of the substrate support member (200) and a portion of the edge of the substrate (130) hangs over the catch (205), the substrate (130) is lifted by a predetermined distance from the upper surface of the substrate support member (200), so the proximity sensor (207) cannot detect the substrate (130).

Conversely, when the substrate (130) is located inside the catch (205), the substrate (130) is not lifted from the upper surface of the substrate support member (200), so the proximity sensor (207) can detect the substrate (130).

That is, the control unit (110) can determine whether the substrate (130) is located inside the catch (205), that is, whether the substrate (130) is located at the upper position of the substrate support member (200), based on whether the proximity sensor (207) detects the substrate (130).

Accordingly, the control unit (110) controls the operation of the pressurizing unit (150), for example, the third driving unit (153), so that the pressurizing unit (150) presses the substrate (130) when the proximity sensor (207) detects the substrate (130), thereby guiding the substrate (130) to be positioned at the upper position of the substrate support unit (200), and preventing damage to the substrate (130) due to pressurization.

In addition, if the substrate (130) is not detected by the proximity sensor (207), the control unit (110) determines that the substrate (130) is not located inside the catch (205) but is partially hanging over the catch (205), and can generate a warning sound or warning light to inform the operator that the substrate (130) is not located in the correct position.

Meanwhile, the control unit (110) can operate the vacuum pump (108) to fix the substrate (130) while the substrate (130) is pressurized by the pressurizing unit (150).

At this time, the control unit (110) can determine whether the substrate (130) is firmly fixed or whether the inside of the vacuum hole (201) is completely sealed by measuring the pressure inside the vacuum hole (201).

If the pressure inside the vacuum hole (201) is below the reference value, the control unit (110) determines that the inside of the vacuum hole (201) is not completely sealed and that the substrate (130) is not firmly fixed, and stops all operations and then generates a warning sound or warning light to notify the operator of this.

FIG. 13 is a partial cross-sectional view of a substrate support according to another embodiment of the present invention.

Referring to FIG. 13, the substrate support member (200) according to the present embodiment may include an upper plate (230) forming the upper surface of the substrate support member (200), and a lower plate (234) coupled to the lower portion of the upper plate (230).

A vacuum hole forming area (210) in which a plurality of vacuum holes (201) are formed may be formed on the upper surface of the upper plate (230), and the first sealing member (220) may be provided to surround the vacuum hole forming area (210).

A joining hole (205) may be formed at the bottom of the lower plate (234) to which a connecting pipe (122) connected to the vacuum pump (108) is joined.

In addition, a connecting groove (208) may be formed at the lower portion of the upper plate (230) to connect the joining hole (205) and a plurality of vacuum holes (201) formed in the vacuum hole forming region (210), and the upper cross-sectional size of the connecting groove (208) may have a size that includes all of the plurality of vacuum holes (201) formed in the vacuum hole forming region (210). Then, vacuum pressure can be generated in the plurality of vacuum holes (210) formed in the vacuum hole forming region (210) with only the one connecting pipe (122).

A through hole (123) through which the connecting pipe (122) passes is formed at the bottom of the above bath (120), the lower plate (234) is provided above the through hole (123), and a second sealing member (223) that prevents electrolyte from flowing into the through hole (123) may be provided at the lower edge of the lower plate (234).

In addition, a third sealing member (225) surrounding the connection groove (208) may be provided between the upper plate (230) and the lower plate (234) to prevent electrolyte from flowing into the connection groove (208). At this time, an insertion groove (227) into which the third sealing member (225) is inserted may be formed in at least one of the upper plate (230) and the lower plate (234).

In manufacturing the substrate support member (200), vacuum holes (201) and coupling holes (205) of different sizes may be formed on the upper and lower portions of a single plate, but, as in the substrate support member (200) according to the present embodiment, if an upper plate (230) in which a plurality of vacuum holes (201) are formed and a lower plate (234) in which coupling holes (205) are formed are manufactured separately and then the upper plate (230) and the lower plate (234) are combined, the substrate support member (200) can be easily manufactured.

FIG. 14 is a perspective view of an electrode module according to an embodiment of the present invention, FIG. 15 is an exploded perspective view of an electrode module according to an embodiment of the present invention, FIG. 16 is a vertical cross-sectional view of an electrode module according to an embodiment of the present invention, FIG. 17 is a bottom view of a cover according to an embodiment of the present invention, and FIG. 18 is a drawing showing the bottom of an electrode holder according to an embodiment of the present invention.

In a conventional 3D printing device (10) using selective electrochemical deposition (see FIGS. 1 and 2), an electrode (32) is electrically connected to a power supply unit (50) through a multi-electrode module (30), and a substrate (12) is electrically connected directly to the power supply unit (50). However, as in the conventional method, there are many difficulties in directly connecting the substrate (12) to the power supply unit (50) due to space constraints.

In particular, the S-ECAM printing device (100) according to one embodiment of the present invention can be used to form a bonding layer for mounting a chip on a semiconductor circuit board, wherein the substrate is a semiconductor circuit board, and the electrode is an area on the semiconductor circuit board where the bonding layer is to be formed, so that in order to print on the area, the electrode must be electrically connected to the surroundings of the area, but since there are several areas on the substrate that are not electrically connected to each other, it is very difficult to directly electrically connect the substrate to a power supply unit.

In order to solve the above problem, an electrode module according to one embodiment of the present invention is configured so that not only the electrode but also the substrate are electrically connected to the power supply unit.

Referring to FIGS. 14 to 18, an electrode module (300) according to an embodiment of the present invention may include an electrode holder (310) having an inlet (312) through which an electrolyte is introduced and an outlet (313) through which the electrolyte introduced through the inlet (312) is discharged, a plurality of electrodes (320) provided at predetermined intervals on the bottom surface of the electrode holder (310), a cover (330) coupled to the upper portion of the electrode holder (310), an anode plate (340) fixed to the cover (330), and a cathode plate (350) fixed to the cover (330).

The above positive electrode plate (340) can be connected to the positive electrode of the power supply unit (102), and the above negative electrode plate (350) can be connected to the negative electrode of the power supply unit (102).

For example, the positive electrode plate (340) may be provided with a positive electrode connection part (342) connected to the positive electrode of the power supply unit (102), the negative electrode plate (350) may be provided with a negative electrode connection part (352) connected to the negative electrode of the power supply unit (102), and the cover (330) may be provided with a power connection groove (331) that allows the positive electrode connection part (342) and the negative electrode connection part (352) to protrude outside the cover (330).

The electrode holder (310) may be provided with an anode probe (360) that connects the electrode (320) and the anode plate (340), and a cathode probe (370) that connects the substrate (130) and the cathode plate (350).

The cathode probe (370) may have an upper end connected to the cathode plate (350), a lower end protruding below the electrode holder (310), and the protruding lower end may be connected to the substrate (130).

The electrode holder (310) may be formed with an anode probe hole (315) into which the anode probe (360) is inserted, a fixing groove (316) into which the electrode (320) is fixed at the bottom of the anode probe hole (315), and a cathode probe hole (317) into which the cathode probe (370) is inserted.

The above anode probe (360) is inserted into the anode probe hole (315) so that the lower end contacts the electrode (320) and the upper end contacts the anode plate (340), thereby electrically connecting the electrode (320) and the anode plate (340).

The above cathode probe (370) is inserted into the cathode probe hole (317), and the lower end protrudes below the electrode holder (310) and the upper end can contact the cathode plate (350). The protruding lower end can contact the substrate (130) to electrically connect the substrate (130) and the cathode plate (350).

Then, the electrode module (300) according to one embodiment of the present invention can electrically connect not only the electrode (320) but also the substrate (130) to the power supply unit (102).

The above anode probe (360) may include an anode probe body (361), an anode upper contact portion (362) fixed to the upper end of the anode probe body (361) and in contact with the anode plate (340), and an anode lower contact portion (363) fixed to the lower end of the anode probe body (361) and in contact with the electrode (320).

In addition, the anode probe (360) may include an anode upper elastic member (364) provided between the upper end of the anode probe body (361) and the anode upper contact portion (362) to provide upward elasticity. Then, the anode upper contact portion (362) can stably contact the anode plate (340) by the anode upper elastic member (364).

In addition, the anode probe (360) may include an anode lower elastic member (365) provided between the lower end of the anode probe body (361) and the anode lower contact portion (363) to apply elastic force downward. Then, the anode lower contact portion (363) can stably contact the electrode (320) by the anode lower elastic member (365).

The above anode upper elastic member (364) and the anode lower elastic member (365) may use springs.

The above anode probe (360) may be configured to electrically connect the electrode (320) and the anode plate (340). For example, the anode probe body (361), the anode upper contact portion (362), and the anode lower contact portion (363) may be made of an electrically conductive material, such as copper or a gold-plated metal material. Alternatively, the anode upper contact portion (362) and the anode lower contact portion (363) may be made of an electrically conductive material, such as copper or a gold-plated metal material, and the anode probe body (361) may be provided with a wire (366) that electrically connects the anode upper contact portion (362) and the anode lower contact portion (363).

Likewise, the cathode probe (370) may include a cathode probe body (371) inserted into the cathode probe hole (317), a cathode upper contact portion (372) coupled to the upper portion of the cathode probe body (371) and contacting the cathode plate (350), and a cathode lower contact portion (373) coupled to the lower portion of the cathode probe body (371) and protruding to the lower portion of the electrode holder (310) and contacting the substrate (130).

In addition, the cathode probe (370) may include a cathode upper elastic member (374) provided between the upper portion of the cathode probe body (371) and the cathode upper contact portion (372) to provide upward elasticity.

Then, the cathode upper contact portion (372) can stably contact the cathode plate (350) by the cathode upper elastic member (374).

In addition, the cathode probe (370) may include a cathode lower elastic member (375) provided between the lower end of the cathode probe body (371) and the cathode lower contact portion (373) to apply elastic force downward. Then, the cathode lower contact portion (373) can stably contact the substrate (130) by the cathode lower elastic member (375).

The above cathode upper elastic member (374) and the above cathode lower elastic member (375) may use springs.

The above-described cathode probe (370) may be configured to electrically connect the substrate (130) and the cathode plate (350). For example, the cathode probe body (371), the cathode upper contact portion (372), and the cathode lower contact portion (373) may be made of an electrically conductive material, for example, a copper or gold-plated metal material. Alternatively, the cathode upper contact portion (372) and the cathode lower contact portion (373) may be made of an electrically conductive material, for example, a copper or gold-plated metal material, and the cathode probe body (371) may be provided with a wire (376) that electrically connects the cathode upper contact portion (372) and the cathode lower contact portion (373).

Meanwhile, the positive electrode plate (340) and the negative electrode plate (350) can be fixed to the cover (330) with a height difference so that they do not come into contact with each other.

For example, the cover (330) may be formed with a step portion (333) and a fixing groove (334) having different heights, and one of the positive electrode plate (340) and the negative electrode plate (350) may be fixed in a state supported by the step portion (333), and the other may be fixed in a state secured in the fixing groove (334).

As shown in Fig. 17, the step portion (333) may be formed on the edge of the cover, the fixing groove (334) may be formed on the inside of the step portion (333), and the fixing groove (334) may be provided with a fixing block (335) for fixing the positive electrode plate (340) or negative electrode plate (350) to be fixed in the fixing groove (334).

Additionally, the positive electrode plate (340) or negative electrode plate (350) that is seated in the above-mentioned seating groove (334) may have a shape that conforms to the shape of the above-mentioned seating groove (334).

Additionally, the positive electrode plate (340) or negative electrode plate (350) that is fixed in a supported state on the above-mentioned step portion (333) may have a contact prevention hole formed therein.

For example, as shown in the drawing, when the negative electrode plate (350) is fixed in a state supported by the step portion (333) and the positive electrode plate (340) is fixed in a state seated in the seating groove (334), a contact prevention hole (353) may be formed in the negative electrode plate (350) to prevent the positive electrode probe (360) from contacting the negative electrode plate (350).

Conversely, when the positive electrode plate (340) is fixed in a state supported by the step portion (333) and the negative electrode plate (350) is fixed in a state seated in the seating groove (334), a contact prevention hole may be formed in the positive electrode plate (340) to prevent the negative electrode probe (370) from contacting the positive electrode plate (350).

Meanwhile, the electrode module (300) according to one embodiment of the present invention may include a bracket (304) provided on the upper portion of the cover (330) and fixedly coupled to the first driving unit (101).

Additionally, the electrode module (300) according to one embodiment of the present invention may be equipped with at least three gap sensors (307).

Then, the control unit (110) can control the operation of the first driving unit (101) based on detection by the gap sensor (307) so that the bottom surface of the electrode module (300) is parallel to the top surface of the substrate (130).

The electrode holder (310) may be formed with a gap sensor hole (318) into which the gap sensor (307) is inserted, and a connecting passage (314) connecting the inlet (312) and the outlet (313), and at least two electrode alignment marks (145) may be formed on the bottom surface of the electrode holder (310).

The electrode (320) may be a PT sheet that is attached and fixed to the fixing groove (316), and the fixing groove (316) may be formed so that the bottom surface of the attached PT sheet is level with the bottom surface of the electrode holder (310).

Additionally, the inlet (312) may be formed on the side of the electrode holder (310), and the outlet (313) may be formed on the bottom of the electrode holder (310).

FIG. 19 is a schematic side view of an S-ECAM printing device according to an embodiment of the present invention, and FIG. 20 is a schematic front view of FIG. 19.

Referring to FIGS. 19 and 20, an S-ECAM printing device (100) according to an embodiment of the present invention may include a cleaning block (400) for cleaning the substrate (130) and the electrode module (300), and a fourth driving unit (402) for moving the cleaning block, and the control unit (110) may control the operation of the fourth driving unit (402) to clean the substrate (130) and the electrode module (300).

For example, the cleaning block (400) may be positioned at the rear of the bath (120), and the fourth driving unit (402) may be configured to allow the cleaning block (400) to move forward and backward and vertically, and the control unit (11) may control the operation of the fourth driving unit (402) so that the cleaning block (400) moves between the substrate (130) and the electrode module (300) and cleans the substrate (130) and the electrode module (300).

In another embodiment, as shown in FIG. 19, the fourth driving unit (402) may be configured as a cylinder that moves the cleaning block (400) horizontally forward, and the cylinder may be operated by air pressure from the air compressor (109).

Additionally, the cylinder may be provided at a height that enables cleaning of the upper portion of the substrate (130) when the cleaning block (400) moves horizontally forward.

Here, the height at which cleaning is possible may be the height of the bottom surface of the cleaning block (400) being the same as the height of the top surface of the substrate (130), and the height may be the height from the base frame (111).

Then, since the cleaning block (400) can clean the electrode (130) and the electrode module (300) only by horizontal movement by the fourth driving unit (402), the configuration of the fourth driving unit (402) can be simplified.

For example, when the control unit (110) operates the fourth driving unit (402) after spacing the electrode module (300) away from the substrate (130) by the thickness of the cleaning block (400), the cleaning block (400) can automatically move between the substrate (130) and the electrode module (300) to clean the substrate (130) and the electrode module (300).

In general, after a printing process is performed on the substrate (130), the substrate (130) and the electrode module (300) are covered with electrolyte, so the cleaning block (400) can be configured to clean the electrolyte covered on the substrate (130) and the electrode module (300).

For example, the cleaning block (400) may be composed of a sponge or rubber capable of absorbing or removing the electrolyte remaining on the substrate (130) and the electrode module (300). Of course, even if the cleaning block (400) is composed of a sponge or rubber, it is possible to clean foreign substances other than the electrolyte.

In addition, a guide ball (403) may be provided at the bottom of the cleaning block (400), and a support wall (127) for supporting the guide ball (403) may be provided at the bath (120). Then, sagging of the cleaning block (400) can be prevented when the cleaning block (400) moves horizontally.

In addition, when the cleaning block (400) is made of sponge or rubber, the cleaning block (400) can be fixed to a bracket, and at this time, the guide ball (403) can be provided at the lower part of the bracket.

In another embodiment, the cleaning block (400) may be configured to clean the substrate (130) and the electrode module (300) by blowing or suctioning the electrolyte.

Fig. 21 is a perspective view of a combined cleaning block according to an embodiment of the present invention, and Fig. 22 is an exploded perspective view of the cleaning block according to Fig. 22.

Referring to FIGS. 21 and 22, the cleaning block (400) according to the present embodiment may include a coupling hole (404) to which a connecting pipe (401) connected to the vacuum pump (108) or the air compressor (109) is coupled, an internal flow path (405) connected to the coupling hole (404), and an exhaust hole (406) connecting the internal flow path (405) to the outside.

Then, the vacuum pressure of the vacuum pump (108) is generated externally through the exhaust hole (406) to suction out foreign substances such as electrolyte stuck to the substrate (130) and the electrode module (300), or the air pressure of the air compressor (109) is generated externally through the exhaust hole (406) to blow out foreign substances such as electrolyte stuck to the substrate (130) and the electrode module (300), thereby cleaning the substrate (130) and the electrode module (300).

The above-mentioned joining hole (404) may be formed on the side of the cleaning block (400), the internal flow path (405) may be formed long in the length direction of the cleaning block (400) inside the cleaning block (400), and the exhaust hole (406) may be formed in multiple numbers at the top and bottom of the cleaning block (400).

The above cleaning block (400) may be provided as a single block, but as shown in the drawing, the cleaning block (400) may include a first cleaning block (410) for cleaning the electrode module (300) and a second cleaning block (420) for cleaning the substrate (130).

The first coupling hole (414) of the first cleaning block (410) may be formed on the side of the first cleaning block (410), the first internal flow path (415) of the first cleaning block (410) may be formed long in the longitudinal direction of the first cleaning block (410) inside the first cleaning block (410), and the first exhaust hole (416) of the first cleaning block (410) may be formed on the upper end of the first cleaning block (410) so as to be able to clean the electrode module (300) located above the first cleaning block (410).

The second coupling hole (424) of the second cleaning block (420) may be formed on the side of the second cleaning block (420), the second internal flow path (425) of the second cleaning block (420) may be formed long in the longitudinal direction of the second cleaning block (420) inside the second cleaning block (420), and the second exhaust hole (426) of the second cleaning block (420) may be formed at the lower end of the second cleaning block (420) so as to be able to clean the substrate (130) located at the lower end of the second cleaning block (420).

The first coupling hole (414) can be coupled with a connecting pipe connected to the vacuum pump (108) or the air compressor (109), and similarly, the second coupling hole (424) can be coupled with a connecting pipe connected to the vacuum pump (108) or the air compressor (109).

However, since the first exhaust hole (416) is formed at the top of the first cleaning block (410), when the first coupling hole (414) is coupled with the connection pipe of the air compressor (109), a problem may occur in which the electrolyte is widely scattered as upward blowing occurs due to the air pressure of the air compressor (109). Therefore, as shown in the drawing, the first coupling hole (414) is coupled with the first connection pipe (411) connected to the vacuum pump (108) so that the electrode module (300) can be cleaned by suction due to the vacuum pressure of the vacuum pump (108).

At this time, the second coupling hole (424) can be coupled with the second connection pipe (421) connected to the air compressor (109). Since the second exhaust hole (426) is formed at the bottom of the second cleaning block (420), even if the second coupling hole (424) is coupled with the second connection pipe (421), the blowing by the air pressure of the air compressor (109) occurs downward, so the problem of the electrolyte scattering is relatively small, while both the blowing by the air pressure of the air compressor (109) and the suction by the vacuum pressure of the vacuum pump (108) can be utilized, so that the cleaning effect can be maximized.

In addition, the cleaning block (400) may include a connector block (419) interposed between the first cleaning block (410) and the second cleaning block (420) to firmly fix the first cleaning block (410) and the second cleaning block (420).

Additionally, the second cleaning block (420) located at the rear of the cleaning block (400) may be provided with a coupling part (427) coupled to the fourth driving part (402).

FIG. 23 is a schematic side view of an S-ECAM printing device according to an embodiment of the present invention, FIG. 24 is a perspective view schematically showing a state in which a bulkhead frame is positioned at the rear of a bath, and FIG. 25 is a perspective view schematically showing a state in which a bulkhead frame is positioned above a substrate support portion.

Referring to FIGS. 23 to 25, an S-ECAM printing device (100) according to an embodiment of the present invention may include a partition frame (450) having a partition wall (452) that forms a space (451) in which the substrate (130) and the electrode (320) are immersed by the electrolyte discharged from the discharge port of the electrode module (300), and a fifth driving unit (470) that moves the partition wall frame (450), and the control unit (110) may control the operation of the fifth driving unit (470) so that the partition wall (452) is positioned above the substrate support unit (200).

For example, as shown in FIG. 23, the fifth driving unit (470) may be configured as a cylinder that moves the bulkhead frame (450) horizontally forward, and the cylinder may be operated by pneumatic pressure from the air compressor (109).

In the S-ECAM printing device (100) according to one embodiment of the present invention, the gap between the substrate (130) and the electrode module (300) during the printing process is very small, at about 200 micrometers, so the substrate (130) and the electrode (310) can be immersed in the electrolyte discharged from the discharge port (313) of the electrode module (300). However, as in the S-ECAM printing device (100) according to this embodiment, a separate partition wall (452) may be installed on the upper portion of the substrate support member (200) to facilitate the immersion of the substrate (130) and the electrode (320) in the electrolyte discharged from the discharge port (313) of the electrode module (300).

In this case, as in the S-ECAM printing device (100) according to the present embodiment, it is preferable that the partition wall (452) be configured to be positioned at the rear of the bath (120) and to move forward only during the printing process to be positioned above the substrate support member (200). If the partition wall (452) is fixed above the substrate support member (200), it may cause significant interference during other processes, such as a substrate fixing process, a substrate and electrode module alignment process, a cleaning process, etc., other than the printing process.

Fig. 26 is a vertical cross-sectional view schematically showing a fifth driving unit according to another embodiment of the present invention.

Referring to FIG. 26, the fifth driving unit (470) according to the present embodiment can be configured to enable the bulkhead frame (450) to move forward and backward horizontally and vertically.

For example, an S-ECAM printing device (100) according to one embodiment of the present invention may include a vertical movement guide frame (463) that guides vertical movement of the partition frame (450), and a horizontal movement guide frame (465) that guides horizontal movement of the vertical movement guide frame (463), and the fifth driving unit (470) may include a horizontal driving unit (472) that horizontally moves the vertical movement guide frame (463) forward and backward, and a vertical driving unit (474) that vertically moves the partition frame (450).

Then, the control unit (110) controls the operation of the horizontal driving unit (472) and the vertical driving unit (474), so that when the partition wall (452) is positioned above the substrate support unit (200), it can be brought into close contact with the upper surface of the substrate support unit (200).

Since the substrate (130) is placed on the upper portion of the substrate support member (200), as in the above embodiment, if the fifth driving member (450) is configured to only allow the partition frame (450) to move horizontally, the partition frame (450) gets caught on the substrate (130) when moving horizontally, making it difficult to adhere to the upper surface of the substrate support member (200).

Fig. 27 is a vertical cross-sectional view schematically showing an S-ECAM printing device according to one embodiment of the present invention.

The S-ECAM printing device (100) according to the present embodiment can position the partition wall (252) on top of the substrate support member (200) during the printing process, and can be configured to enable cleaning of the substrate (130) and the electrode module (300) after the printing process.

Referring to FIG. 27, the S-ECAM printing device (100) according to the present embodiment may include a cleaning block (400) for cleaning the substrate (130) and the electrode module (300), a fourth driving unit (402) for moving the cleaning block (400), a partition frame (450) provided with a partition wall (452) for forming a space (451) in which the substrate (130) and the electrode (320) are immersed by the electrolyte discharged from the discharge port (312) of the electrode module (300), and a fifth driving unit (470) for moving the partition frame (450), and the control unit (110) may control the operation of the fourth driving unit (402) so that the cleaning block (400) moves between the substrate (130) and the electrode module (300), and The operation of the fifth driving unit (470) can be controlled so that the bulkhead (452) is positioned above the substrate support unit (200).

As described in the above embodiment, the fourth driving unit (402) may be configured as a cylinder (402) that horizontally moves the cleaning block (400) forward.

In this case, the S-ECAM printing device (100) according to one embodiment of the present invention includes a bracket (460) to which the bulkhead frame (450) and the cylinder (402) are fixed, a vertical movement guide frame (463) that guides vertical movement of the bracket (560), and a horizontal movement guide frame (465) that guides horizontal movement of the vertical movement guide frame (463), and the fifth driving unit (470) may include a horizontal driving unit (472) that horizontally moves the vertical movement guide frame (463) forward and backward, and a vertical driving unit (474) that vertically moves the bracket (460).

Then, the cleaning block (400) and the cylinder (402) can be moved horizontally and vertically together with the bulkhead frame (450), so that the overall configuration of the S-ECAM printing device (100) can be simplified.

In addition, when the cylinder (402) is fixed to the bracket (460) together with the bulkhead frame (450), the cylinder (402) can be fixed to the bracket (460) so as to be positioned at the lower portion of the bulkhead frame (450).

At this time, the height at which the cylinder (402) is fixed to the bracket (460) can be fixed at a height at which the lower part of the bulkhead frame (450) can be cleaned when the cleaning block (400) moves horizontally. For example, the cylinder (402) can be fixed at a height at which the upper surface of the cleaning block (400) is located at the lower surface of the bulkhead frame (450).

Then, the control unit (110) controls the operation of the vertical driving unit (474) to vertically move the partition frame (450) so that the bottom surface of the partition frame (450) is horizontal to the bottom surface of the electrode module (300), and then operates the cylinder (402) to horizontally move the cleaning block (400), so that the cleaning block (400) can move horizontally between the substrate (130) and the electrode module (300), and simultaneously clean not only the upper portion of the substrate (130) and the lower portion of the electrode module (300), but also the lower portion of the partition frame (450).

In addition, as described in the above embodiment, a guide ball (403) may be provided at the bottom of the cleaning block (400), and a support wall (127) for supporting the guide ball (403) may be provided at the bath (120).

Hereinafter, a control method for an S-ECAM printing device according to an embodiment of the present invention will be described. Each step of the control method can be performed by the control unit (110).

FIG. 28 is a drawing showing a control method of an S-ECAM printing device according to one embodiment of the present invention.

Referring to FIG. 28, a control method (S100) of an S-ECAM printing device in one embodiment of the present invention may include a substrate pressurization step (S110) of controlling the operation of the third driving unit (153) so that the load (152) located on one side of the bath (120) presses the substrate (130) placed on the substrate support unit (200).

The above substrate pressurizing step (S110) can be performed when the proximity sensor (207) formed on the substrate support member (200) detects the substrate (130).

The above control method (S100) may include a substrate fixing step (S120) in which, after the substrate pressurization step (S110), the vacuum pump (108) is operated while the substrate (130) is pressurized to fix the substrate (130) through a vacuum hole (201) formed at the bottom of the substrate support member (200).

The above control method (S100) may include a substrate pressure release step (S130) that releases the pressurized state of the substrate (130) by controlling the operation of the third driving unit (153) after the substrate fixing step (S120) while the substrate (130) is fixed.

The above control method (S100) may include, after the substrate pressure release step (S130), an alignment step (S140) of controlling the operation of the first driving unit (101) and the second driving unit (107) to align the substrate (130) and the electrode module (300).

The alignment step (S140) includes an electrode module leveling step (S141) that controls the operation of the first driving unit (101) according to detection by the gap sensor (307) provided in the electrode module (300) so that the bottom surface of the electrode module (300) is parallel to the top surface of the substrate (130), a substrate alignment mark detection step (S142) that controls the operation of the second driving unit (107) so that the camera (142) provided in the camera module (140) moves the camera module (140) so that the camera detects the substrate alignment mark (144) formed on the substrate (130), and an electrode alignment mark detection step that controls the operation of the first driving unit (101) so that the camera (142) moves the electrode module (300) so that the electrode alignment mark (145) formed on the electrode module (300) is detected. It may include a step (S143) and an alignment mark overlapping step (S144) of controlling the operation of the first driving unit (101) to move the electrode module (300) so that the electrode alignment mark (145) detected by the camera (142) overlaps the substrate alignment mark (144).

The above control method (S100) may include a printing step (S150) of, after the alignment step (S140), controlling the operation of the first driving unit (101), the power supply unit (102), and the pump (104) to deposit metal ions included in the electrolyte on a predetermined area of the substrate (130) facing the electrode (320) formed on the bottom surface of the electrode module (300).

The printing step (S150) may include an initial gap forming step (S151) of lowering the electrode module (300) by controlling the operation of the first driving unit (101) so that the gap between the substrate (130) and the electrode (320) forms a preset initial gap, an electrolyte supply step (S152) of supplying the electrolyte stored in the storage unit (103) to the inlet (312) formed in the electrode module (300) by controlling the operation of the pump (104), and an electrodeposition step (S153) of depositing metal ions included in the electrolyte on a predetermined area of the substrate (130) facing the electrode (320) by controlling the operation of the power supply unit (102) while the substrate (130) and the electrode (320) are immersed in the electrolyte discharged through the outlet (313) of the electrode module (300).

The above preset initial interval may be an interval entered by the worker through the input unit (105).

The above control method (S100) may include a cleaning step (S160) that controls the operation of the fourth driving unit (402) after the printing step to cause the cleaning block (400) to move between the substrate (130) and the electrode module (300).

The above cleaning step (S160) can be performed by operating at least one of the vacuum pump (108) and the air compressor (109).

In addition, the control method (S100) may include a partition forming step (S170) of controlling the operation of the fifth driving unit (470) to move the partition frame (450) provided with the partition (452) so that the partition (452) forming a space (451) in which the substrate (130) and the electrode (320) are immersed in the electrolyte is positioned above the substrate support unit (200).

The above-mentioned bulkhead formation step (S170) may be performed before the above-mentioned alignment step (S140) or before the above-mentioned printing step (S150).

In addition, the control method (S100) may include a gap forming step (S180) for vertically moving the electrode module (300) and the partition frame (450) so that the electrode module (300) and the partition frame (450) are spaced apart from the substrate (130) by a preset gap by controlling the operation of the first driving unit (101) and the fifth driving unit (470) before the cleaning step (S160).

The above preset interval may be an interval corresponding to the thickness of the cleaning block (400), and the interval forming step (S180) may be performed so that the electrode module (300) is inserted into the partition wall (452) so that the bottom surface of the electrode module (300) and the bottom surface of the partition wall frame (450) are parallel.

As described above, the present invention relates to a S-ECAM (Selective Electrochemical Additive Manufacturing) printing device capable of selectively depositing a metal raw material on a substrate using an electrochemical deposition-based lamination method (ECAM, Electrochemical Additive Manufacturing), and the embodiment thereof may be modified in various ways. Therefore, the present invention is not limited to the embodiments disclosed in this specification, and all modifications that can be made by a person of ordinary skill in the art to which the present invention pertains are also within the scope of the present invention.

100: S-ECAM printing device 110: Control unit
120: Bath 130: Board
200: substrate support 300: electrode module
400: Cleaning block 450: Bulkhead frame

Claims (18)

bass;
A substrate support part provided in the above bath and having a substrate placed on top;
An electrode module comprising an electrode holder having an inlet for introducing electrolyte and an outlet for discharging electrolyte introduced through the inlet, and a plurality of electrodes provided at predetermined intervals on the bottom surface of the electrode holder;
A first driving unit that moves the above electrode module;
A power supply unit that supplies power using the electrode as an anode and the substrate as a cathode;
A storage unit where the electrolyte is stored;
A pump that supplies the electrolyte stored in the storage unit to the inlet;
A camera module having a camera that detects a substrate alignment mark formed on the substrate and an electrode alignment mark formed on the electrode holder;
A second driving unit that moves the above camera module;
A partition frame having a partition wall that forms a space in which the substrate and the electrode are immersed by the electrolyte discharged from the discharge port of the electrode module;
A fifth driving unit that moves the above bulkhead frame; and
An S-ECAM printing device comprising: a control unit for controlling the first driving unit and the second driving unit so that the substrate alignment mark and the electrode alignment mark detected by the camera overlap each other to align the substrate and the electrode module, applying power to the power supply unit while the electrode and the substrate are immersed in the electrolyte discharged from the discharge port of the electrode holder in a state where the electrode and the substrate are spaced apart from each other by a predetermined distance to deposit metal ions contained in the electrolyte on a predetermined area of the substrate facing the electrode, and controlling the operation of the fifth driving unit so that the partition wall is positioned above the substrate support unit; In the first paragraph,
An S-ECAM printing device characterized in that the control unit controls the second driving unit so that the camera detects the substrate alignment mark, then controls the first driving unit so that the camera detects the electrode alignment mark, and then controls the first driving unit so that the substrate alignment mark and the electrode alignment mark recognized by the camera overlap each other, thereby aligning the substrate and the electrode module. In the first paragraph,
The above camera module includes a body having the camera on one side, an upper opening provided on the upper side of the other side of the body, and a lower opening provided on the lower side of the other side of the body.
An S-ECAM printing device characterized in that a beam splitter is provided inside the body to reflect light incident through the upper opening and light incident through the lower opening toward the camera. In the third paragraph,
The upper opening is provided with an upper lighting unit, and the lower opening is provided with a lower lighting unit.
An S-ECAM printing device characterized in that the control unit turns on the lower lighting unit and turns off the upper lighting unit when the camera detects the substrate alignment mark, and turns off the lower lighting unit and turns on the upper lighting unit when the camera detects the electrode alignment mark. In the first paragraph,
The S-ECAM printing device is characterized in that it includes a pressurizing unit located on one side of the bath and pressurizing a substrate placed on top of the substrate support unit, and a vacuum pump that fixes the substrate placed on top of the substrate support unit through a vacuum hole formed in the substrate support unit. In paragraph 5,
An S-ECAM printing device characterized in that the pressurizing unit includes a rod rotatably provided on one side of the bath, and a third driving unit that rotates the rod to pressurize the substrate. In paragraph 5,
An S-ECAM printing device characterized in that the control unit operates the vacuum pump to fix the substrate while the substrate is pressurized by the pressurizing unit. In the first paragraph,
The above electrode module is equipped with at least three gap sensors,
An S-ECAM printing device characterized in that the control unit controls the first driving unit based on detection by the gap sensor so that the bottom surface of the electrode module is parallel to the top surface of the substrate. In the first paragraph,
The above S-ECAM printing device includes a cleaning block for cleaning the substrate and the electrode module, and a fourth driving unit for moving the cleaning block.
An S-ECAM printing device, characterized in that the control unit controls the operation of the fourth driving unit so that the cleaning block moves between the substrate and the electrode module. delete In the first paragraph,
The above S-ECAM printing device
A cleaning block for cleaning the substrate and the electrode module; and
Including a fourth driving unit that moves the above cleaning block;
An S-ECAM printing device, characterized in that the control unit controls the operation of the fourth driving unit so that the cleaning block moves between the substrate and the electrode module. A substrate pressurizing step for controlling the operation of the third driving unit so that a load located on one side of the bath presses a substrate placed on top of the substrate support unit;
A substrate fixing step of operating a vacuum pump while the substrate is pressurized to fix the substrate through a vacuum hole formed at the bottom of the substrate support member;
A substrate pressure release step for releasing the pressure state of the substrate by controlling the operation of the third driving unit while the substrate is fixed;
An alignment step for aligning the substrate and electrode module by controlling the operation of the first driving unit and the second driving unit;
A printing step of controlling the operation of the first driving unit, the power supply unit, and the pump to deposit metal ions contained in the electrolyte on a predetermined area of the substrate facing the electrode formed on the bottom surface of the electrode module; and
A cleaning step for controlling the operation of the fourth driving unit to move the cleaning block between the substrate and the electrode module;
Further comprising a partition forming step of moving a partition frame provided with the partition so that the partition forming a space in which the substrate and the electrode are immersed in the electrolyte is positioned above the substrate support part by controlling the operation of the fifth driving unit,
A control method for an S-ECAM printing device, characterized in that the above-mentioned bulkhead forming step is performed before the above-mentioned alignment step or before the above-mentioned printing step. delete In paragraph 12,
A control method for an S-ECAM printing device, characterized in that the control method includes a gap forming step of vertically moving the electrode module and the partition frame so that the electrode module and the partition frame are spaced apart from the substrate by a preset gap by controlling the operation of the first driving unit and the fifth driving unit before the cleaning step. In paragraph 12,
The above sorting step is,
An electrode module leveling step for controlling the operation of a first driving unit based on detection by a gap sensor provided in the electrode module so that the bottom surface of the electrode module is parallel to the top surface of the substrate;
A substrate alignment mark detection step for controlling the operation of the second driving unit to move the camera module so that the camera provided in the camera module detects a substrate alignment mark formed on the substrate;
An electrode alignment mark detection step for controlling the operation of the first driving unit to move the electrode module so that the camera detects an electrode alignment mark formed on the electrode module; and
A control method of an S-ECAM printing device, characterized in that it includes an alignment mark overlapping step for controlling the operation of the first driving unit to move the electrode module so that the electrode alignment mark detected by the camera overlaps the substrate alignment mark. In paragraph 12,
The above printing steps are
An initial gap forming step of lowering the electrode module by controlling the first driving unit so that the gap between the substrate and the electrode forms a preset initial gap;
An electrolyte supply step for controlling the operation of the pump to supply the electrolyte stored in the storage unit to the inlet formed in the electrode module; and
A control method for an S-ECAM printing device, characterized in that it includes an electrodeposition step of controlling the operation of the power supply unit to deposit metal ions contained in the electrolyte on a predetermined area of the substrate facing the electrode while the substrate and the electrode are immersed in the electrolyte discharged through an outlet formed in the electrode module. In paragraph 12,
A control method for an S-ECAM printing device, characterized in that the above cleaning step is performed by operating at least one of a vacuum pump and an air compressor. In paragraph 12,
A control method for an S-ECAM printing device, characterized in that the substrate pressurizing step is performed when a proximity sensor provided in the substrate support detects the substrate.