KR20000030950A - Transfer device for wafer of semiconductor - Google Patents
Transfer device for wafer of semiconductor Download PDFInfo
- Publication number
- KR20000030950A KR20000030950A KR1019980044012A KR19980044012A KR20000030950A KR 20000030950 A KR20000030950 A KR 20000030950A KR 1019980044012 A KR1019980044012 A KR 1019980044012A KR 19980044012 A KR19980044012 A KR 19980044012A KR 20000030950 A KR20000030950 A KR 20000030950A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor wafer
- wafer transfer
- tip chuck
- transfer device
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 발명의 반도체 웨이퍼 이송장치는 팁 척(tip chuck)의 스크류 부분을 테프론(TEFLON)과 같은 폴리테트라플루에틸렌 재질로 형성하는 것을 특징으로 한다.The semiconductor wafer transfer apparatus of the present invention is characterized in that the screw portion of the tip chuck is formed of a polytetrafluoroethylene material such as TEFLON.
Description
본 발명은 반도체 웨이퍼 이송장치에 관한 것으로, 좀 더 구체적으로는 진공 흡착을 이용하여 반도체 웨이퍼를 이송시키기 위한 반도체 웨이퍼 이송장치에 관한 것이다.The present invention relates to a semiconductor wafer transfer apparatus, and more particularly, to a semiconductor wafer transfer apparatus for transferring a semiconductor wafer using vacuum adsorption.
도 1은 반도체 제조 공정에서 반도체 웨이퍼를 이송시키기 위하여 사용되는 반도체 웨이퍼 이송장치이다.1 is a semiconductor wafer transfer apparatus used to transfer a semiconductor wafer in a semiconductor manufacturing process.
도 1을 참조하면, 종래 반도체 웨이퍼 이송장치(100)는 팁 척(110)을 사용하여 진공도를 조절하고 있다. 그러나, 상기 팁 척(110)은 알루미늄(aluminum)의 재질로 형성된다. 이와 같은 상기 팁 척(110)은 사용 중에 금속성 파티클(metallic particle)을 유발시키고 있으며, 계속되는 사용으로 마모되어 진공 누출(vacuum leak)을 일으키고 있다. 따라서, 금속성 파티클에 의한 반도체 웨이퍼의 오염이 발생되고, 진공 누출로 인하여 반도체 웨이퍼를 이송하는 중에 파손되는 경우가 발생되고 있다.Referring to FIG. 1, the conventional semiconductor wafer transfer apparatus 100 controls the degree of vacuum using the tip chuck 110. However, the tip chuck 110 is formed of aluminum. Such tip chuck 110 causes metallic particles during use, and wears out with continued use, causing a vacuum leak. Therefore, contamination of the semiconductor wafer due to metallic particles occurs, and damage occurs while transferring the semiconductor wafer due to vacuum leakage.
본 발명은 이와 같은 종래의 문제점을 해결하기 위한 것으로, 그 목적은 팁 척이 사용되는 반도체 웨이퍼 이송장치에서 팁 척에서 발생되는 금속성 파티클을 방지할 수 있는 새로운 형태의 반도체 웨이퍼 이송장치를 제공하는데 있다. 또한, 본 발명은 팁 척의 결합부에서 발생되는 진공 누출을 방지할 수 있는 새로운 형태의 반도체 웨이퍼 이송장치를 제공하는데 그 목적이 있다.The present invention is to solve such a conventional problem, an object of the present invention is to provide a semiconductor wafer transfer apparatus of a new type that can prevent the metallic particles generated in the tip chuck in a semiconductor wafer transfer apparatus using a tip chuck. . It is also an object of the present invention to provide a novel type of semiconductor wafer transfer apparatus capable of preventing vacuum leakage occurring at the coupling portion of the tip chuck.
도 1은 종래 반도체 웨이퍼 이송장치의 개략적인 단면도;1 is a schematic cross-sectional view of a conventional semiconductor wafer transfer device;
도 2는 본 발명의 실시예에 따른 반도체 웨이퍼 이송장치의 단면도이다.2 is a cross-sectional view of a semiconductor wafer transfer apparatus according to an embodiment of the present invention.
* 도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings
10 : 반도체 웨이퍼 이송장치 20 : 팁 척10 semiconductor wafer transfer device 20 tip chuck
상술한 목적을 달성하기 위한 본 발명의 특징에 의하면, 반도체 웨이퍼를 진공 흡착하여 이송시키기 위한 반도체 웨이퍼 이송장치는 상기 반도체 웨이퍼 이송장치의 진공 흡착력을 조절하기 위한 팁 척을 포함하되, 상기 팁 척은 폴리테트라플루에틸렌(polytetrafluoethylene) 재질의 스크류 부분을 갖고, 상기 스크류 부분을 통하여 상기 반도체 웨이퍼 이송장치에 결합된다.According to a feature of the present invention for achieving the above object, the semiconductor wafer transfer device for vacuum adsorption and transfer of the semiconductor wafer includes a tip chuck for adjusting the vacuum suction force of the semiconductor wafer transfer device, the tip chuck is It has a screw portion of polytetrafluoethylene material, and is coupled to the semiconductor wafer transfer device through the screw portion.
본 발명의 반도체 웨이퍼 이송장치는 팁 척(tip chuck)의 스크류 부분을 테프론(TEFLON)과 같은 폴리테트라플루에틸렌 재질로 형성하는 것을 특징으로 한다. 이와 같은 본 발명의 반도체 웨이퍼 이송장치에 의하면, 반도체 웨이퍼 이송장치의 진공 흡착력을 조절하는 팁 척의 스크류 부분이 폴리테트라플루에틸렌 재질로 형성되므로, 파티클이 발생되지 않는다. 또한, 계속되는 사용에도 마모에 의해서 진공 누출되는 문제점이 발생되지 않는다. 따라서, 반도체 웨이퍼가 파티클에 의해서 오염되거나, 진공 누출로 인하여 파손되는 문제점이 없으므로, 반도체 웨이퍼 이송의 안전성을 유지할 수 있다.The semiconductor wafer transfer apparatus of the present invention is characterized in that the screw portion of the tip chuck is formed of a polytetrafluoroethylene material such as TEFLON. According to the semiconductor wafer transfer apparatus of the present invention as described above, since the screw portion of the tip chuck for adjusting the vacuum suction force of the semiconductor wafer transfer apparatus is formed of polytetrafluoroethylene, no particles are generated. In addition, the problem of vacuum leakage due to wear does not occur even with continued use. Therefore, there is no problem that the semiconductor wafer is contaminated by particles or broken due to vacuum leakage, thereby maintaining the safety of semiconductor wafer transfer.
이하, 본 발명의 실시예를 첨부도면 도 2에 의거하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명의 실시예에 따른 반도체 제조 공정에서 반도체 웨이퍼를 이송시키기 위하여 사용되는 반도체 웨이퍼 이송장치이다.2 is a semiconductor wafer transfer apparatus used to transfer a semiconductor wafer in a semiconductor manufacturing process according to an embodiment of the present invention.
도 2를 참조하면, 본 발명의 실시예에 따른 반도체 웨이퍼 이송장치(10)는 팁 척(20)을 가지고 있다. 상기 팁 척(20)은 상기 반도체 웨이퍼 이송장치(10)의 진공 흡착력을 조절하기 위하여 사용된다. 상기 팁 척(20)의 결합면에는 진공 라인(40)이 연결된다. 상기 팁 척(20)은 상기 진공 라인(40)에 의해서 상기 반도체 웨이퍼 이송장치(10)에 형성되는 진공 흡착력을 조절하게 된다. 상기 팁 척(20)의 스크류 부분을 테프론과 같은 폴리테트라플루에틸렌 재질로 형성한다. 이와 같은 본 발명의 반도체 웨이퍼 이송장치(10)는 상기 팁 척(20)에서 파티클이 발생되지 않고, 진공 누출이 발생되지 않는다.2, the semiconductor wafer transfer apparatus 10 according to the embodiment of the present invention has a tip chuck 20. The tip chuck 20 is used to adjust the vacuum suction force of the semiconductor wafer transfer device 10. The vacuum line 40 is connected to the engaging surface of the tip chuck 20. The tip chuck 20 adjusts the vacuum suction force formed in the semiconductor wafer transfer device 10 by the vacuum line 40. The screw portion of the tip chuck 20 is formed of polytetrafluoroethylene material such as Teflon. In the semiconductor wafer transfer apparatus 10 of the present invention, no particles are generated in the tip chuck 20, and no vacuum leak is generated.
이와 같은 본 발명을 적용하면, 반도체 웨이퍼 이송장치의 진공 흡착력을 조절하는 팁 척의 스크류 부분이 폴리테트라플루에틸렌 재질로 형성되므로, 파티클이 발생되지 않는다. 또한, 계속되는 사용에도 마모에 의해서 진공 누출되는 문제점이 발생되지 않는다. 따라서, 반도체 웨이퍼가 파티클에 의해서 오염되거나, 진공 누출로 인하여 파손되는 문제점이 없으므로, 반도체 웨이퍼 이송의 안전성을 유지할 수 있다.According to the present invention, since the screw portion of the tip chuck for adjusting the vacuum suction force of the semiconductor wafer transfer device is formed of polytetrafluoroethylene, no particles are generated. In addition, the problem of vacuum leakage due to wear does not occur even with continued use. Therefore, there is no problem that the semiconductor wafer is contaminated by particles or broken due to vacuum leakage, thereby maintaining the safety of semiconductor wafer transfer.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980044012A KR20000030950A (en) | 1998-10-20 | 1998-10-20 | Transfer device for wafer of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980044012A KR20000030950A (en) | 1998-10-20 | 1998-10-20 | Transfer device for wafer of semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20000030950A true KR20000030950A (en) | 2000-06-05 |
Family
ID=19554774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980044012A Withdrawn KR20000030950A (en) | 1998-10-20 | 1998-10-20 | Transfer device for wafer of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20000030950A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6997670B2 (en) | 2002-10-22 | 2006-02-14 | Samsung Electronics Co., Ltd. | Semiconductor wafer transfer apparatus |
-
1998
- 1998-10-20 KR KR1019980044012A patent/KR20000030950A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6997670B2 (en) | 2002-10-22 | 2006-02-14 | Samsung Electronics Co., Ltd. | Semiconductor wafer transfer apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19981020 |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |