KR20030070678A - Method for manufacturing liquid crystal display device - Google Patents

Abstract

The present invention relates to a method for manufacturing a liquid crystal display device of a liquid crystal dropping method, comprising: loading a first substrate, a second substrate on which a substance is formed into a combiner chamber, bonding the first and second substrates together; And applying the heat to the material to fix the bonded first and second substrates, and unloading the fixed first and second substrates.

Description

Method for manufacturing liquid crystal display device

The present invention relates to a method for manufacturing a liquid crystal display device, and more particularly, to a method for manufacturing a liquid crystal display device of a liquid crystal dropping method.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, the LCD (Lipuid Crystal Display Device), PDP (Plasma Display Panel), ELD (Electro Luminescent Display), and VFD (Vacuum Fluorescent) Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices.

Among them, LCD is the most widely used as the substitute for CRT (Cathode Ray Tube) for mobile image display because of its excellent image quality, light weight, thinness, and low power consumption. In addition to the use of the present invention, a variety of applications such as a television, a computer monitor, and the like for receiving and displaying broadcast signals have been developed.

As described above, although various technical advances have been made in order for a liquid crystal display device to serve as a screen display device in various fields, the task of improving the image quality as a screen display device is often arranged with the above characteristics and advantages. . Therefore, in order to use a liquid crystal display device in various parts as a general screen display device, the key to development is how much high definition images such as high definition, high brightness, and large area can be realized while maintaining the characteristics of light weight, thinness, and low power consumption. It can be said.

Such a liquid crystal display may be largely divided into a liquid crystal panel displaying an image and a driving unit for applying a driving signal to the liquid crystal panel, wherein the liquid crystal panel has a predetermined space and is bonded to the first and second glass substrates. And a liquid crystal layer injected between the first and second glass substrates.

The first glass substrate (TFT array substrate) may include a plurality of gate lines arranged in one direction at a predetermined interval, a plurality of data lines arranged at regular intervals in a direction perpendicular to the gate lines, and A plurality of pixel electrodes formed in a matrix form in each pixel region defined by crossing each gate line and data line, and a plurality of thin films that transmit signals of the data line to each pixel electrode by being switched by signals of the gate line Transistors are formed.

The second glass substrate (color filter substrate) includes a black matrix layer for blocking light in portions other than the pixel region, an R, G and B color filter layer for expressing color colors, and a common electrode for implementing an image. Is formed.

The first and second substrates are bonded to each other by a seal material having a predetermined space by a spacer and having a liquid crystal injection hole, so that the liquid crystal is injected between the two substrates.

At this time, in the liquid crystal injection method, the liquid crystal is injected between the two substrates by osmotic pressure when the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates bonded by the real material. When the liquid crystal is injected as described above, the liquid crystal injection hole is sealed with a sealing material.

However, the manufacturing method of such a liquid crystal injection type liquid crystal display device has the following problems.

First, after cutting into a unit panel, the liquid crystal injection hole is immersed in the liquid crystal liquid by maintaining the vacuum state between the two substrates, so that the liquid crystal injection takes a lot of time, the productivity is reduced.

Second, in the case of manufacturing a large-area liquid crystal display device, when the liquid crystal is injected by the liquid crystal injection method, the liquid crystal is not completely injected into the panel, which causes a defect.

Third, since the process is complicated and time-consuming as described above, several liquid crystal injection equipment is required, which requires a lot of space.

Therefore, in recent years, the manufacturing method of the liquid crystal display device using the method of dropping a liquid crystal is researched. Among them, Japanese Unexamined Patent Application Publication No. 2000-147528 discloses a technique using the following liquid crystal dropping method.

The manufacturing method of the conventional liquid crystal display device using the liquid crystal dropping method is as follows.

1A to 1F are cross-sectional views of a liquid crystal display device according to a conventional liquid crystal dropping method.

As shown in FIG. 1A, an ultraviolet curable material 1 is applied to the first glass substrate 3 on which the thin film transistor array is formed to have a thickness of about 30 μm, and the liquid crystal 2 is disposed inside the material 1 (a thin film transistor array). Dropping At this time, the real material 3 is formed without a liquid crystal injection hole.

The first glass substrate 3 as described above is mounted on the table 4 in the vacuum container C that is movable in the horizontal direction, and the entire lower surface of the first glass substrate 3 is mounted on the first adsorption mechanism 5. ) By vacuum adsorption.

As shown in Fig. 1B, the entire lower surface of the second glass substrate 6 on which the color filter array is formed is vacuum-adsorbed and fixed by the second adsorption mechanism 7, and the vacuum vessel C is closed and vacuumed. Then, the second adsorption mechanism 7 is lowered in the vertical direction so that the distance between the first glass substrate 3 and the second glass substrate 6 is 1 mm, and the first glass substrate 3 is mounted. The table 4 is moved in the horizontal direction to align the position of the first glass substrate 3 and the second glass substrate 6.

As shown in FIG. 1C, the second adsorption mechanism 7 is lowered in the vertical direction to bring the second glass substrate 6 into contact with the liquid crystal 2 or the actual material 1.

As shown in FIG. 1D, the table 4 on which the first glass substrate 3 is mounted is moved in the horizontal direction to adjust the position of the first glass substrate 3 and the second glass substrate 6.

As shown in FIG. 1E, the second adsorption mechanism 7 is lowered in the vertical direction to bond the second glass substrate 6 to the first glass substrate 3 through the actual material 1, and to press to 5 μm. .

As shown in FIG. 1F, the bonded first and second glass substrates 3 and 6 are removed from the vacuum container C, and the ultraviolet rays are irradiated to the actual substance 1 to cure the actual substance 1 so that a liquid crystal display device is obtained. Complete

In this case, the real material 1 refers to a main material and a dummy material surrounding the active area of the liquid crystal display.

However, the conventional method of manufacturing the liquid crystal display device of the liquid crystal dropping method has the following problems.

First, since the actual material is formed on the same substrate and the liquid crystal is dropped, the process time until joining the two substrates takes a lot.

Second, since a real material is applied to the first substrate and liquid crystal is dropped, but no process is performed on the second substrate, an unbalance occurs between the processes of the first substrate and the second substrate, thereby efficiently operating the production line. Difficult to do

Third, since the substance is applied to the first substrate and the liquid crystal is dropped, the substrate to which the substance is applied cannot be cleaned by the cleaning equipment USC before bonding. Therefore, it is not possible to wash the material to which the upper and lower substrates are bonded, so that the particles cannot be removed, resulting in the actual contact failure during the bonding.

Fourth, as the size of the substrate increases, misalignment may occur because the substrate is not fixed when the substrate is transferred for unloading or subsequent processing after bonding.

Fifth, as the substrate size increases, it is difficult to maintain the bonding state until the actual hardening of the substrate is performed in a subsequent process.

Sixth, when the substrate is distorted, flow occurs in the liquid crystal between the substrates, which causes a liquid crystal alignment defect.

Seventh, when the substrate is misaligned, the alignment of the upper and lower substrates may be misaligned, thereby decreasing the aperture ratio.

Eighth, when a misalignment of the liquid crystal occurs, spots such as scratches and spots associated with luminance may occur.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a liquid crystal display device of a liquid crystal dropping method which can improve the productivity by shortening the process time and maximizing the efficiency.

1A to 1F are schematic cross-sectional views showing a conventional liquid crystal display method of a liquid crystal display device.

2a to 2f are schematic cross-sectional views showing a liquid crystal display device process of the liquid crystal dropping method according to the present invention.

3 is a bonding process flow chart according to the present invention

4 is a real layout view for explaining the fixing according to the first embodiment of the present invention.

5 is a real layout view illustrating the fixing according to the second embodiment of the present invention.

6 is a real layout view for explaining the fixing according to the third embodiment of the present invention.

7 is a real layout view illustrating the fixing according to the fourth embodiment of the present invention.

8 is a real layout view for explaining the fixing according to the fifth embodiment of the present invention.

9 is a real layout view for explaining the fixing according to the sixth embodiment of the present invention.

10 is a cross-sectional view of the upper and lower stages and the substrate on the line II ′ of FIG. 4.

Explanation of symbols for the main parts of the drawings

10 vacuum vacuum chamber 11, 13 glass substrate

12: liquid crystal 14: real

14a: main entity 14b: dummy entity

15: upper stage 16: lower stage

17: hole 18a, 18b: light (UV) irradiation pin or heat mechanism

According to an aspect of the present invention, there is provided a method of manufacturing a liquid crystal display device, including: loading a first substrate, a second substrate on which an actual material is formed into a combiner chamber, and bonding the first and second substrates together. And a step of fixing the first and second substrates bonded to each other by applying heat to the material, and a step of unloading the fixed first and second substrates.

Here, the actual material is preferably made of a thermosetting material.

It is preferable to fix part by applying heat to the said substance.

The actual material includes a main material of the thermosetting material and a fixing material, and the fixing of the bonded substrates is preferably performed by applying heat to the fixing material to fix the two bonded substrates.

The fixing material is preferably formed at the edge of the substrate.

The fixing material is preferably formed at the cutting portion between each panel and the edge of the substrate.

The actual material is heat curable for a plurality of main materials for sealing the liquid crystal dropped on the plurality of panel parts, a dummy material for protecting the plurality of main materials, and a fixing material for fixing the two bonded substrates. It is preferable that the step of fixing the bonded substrate is provided with a real material, and is provided with a step of fixing the two bonded substrates by applying heat to the fixing material.

The actual material includes a plurality of main materials for sealing liquid crystals dropped on the plurality of panel portions, and a plurality of dummy materials for protecting the plurality of main materials, respectively, as thermosetting materials, and fix the bonded substrate. It is preferable that the process is carried out by applying a heat to the dummy material, the step of fixing the two bonded substrates.

It is preferable to fix the bonded substrate by partially applying heat to the dummy material.

It is preferable to form the substance as a pressure curable substance and to fix the bonded substrate by applying pressure instead of the heat.

It is preferable to form the material into a light and heat curable material and to fix the bonded substrate by applying light and heat instead of the heat.

It is preferable to apply the adhesive which is excellent in sclerosis | hardenability rather than the said real thing to the cutting part or the edge part of a 2nd board | substrate, and to fix the said bonded board | substrate, to fix the board | substrate bonded by the said adhesive agent.

At the time of the said fixing process, it is preferable to make thermal conditions into the temperature of 50-200 degreeC.

It is preferred to apply heat for at least 10 seconds at this temperature.

In addition, the manufacturing method of the liquid crystal display device according to the present invention for achieving the above object comprises a first substrate on which a liquid crystal is dropped and the main substance is applied, and a second substrate on which a substance for fixing the thermosetting material is coated. A process of loading into the combiner chamber, a process of bonding the first and second substrates, a process of fixing the bonded first and second substrates by applying heat to the fixing material, and the fixed first, Another feature is that it comprises a process of unloading the second substrate.

In addition, in the method for manufacturing a liquid crystal display device according to the present invention for achieving the above object, a liquid crystal is dropped, the first substrate on which the thermosetting fixing material is formed, and the second substrate on which the main material is formed is placed in the adapter chamber. A process of loading, bonding the first and second substrates, fixing the bonded first and second substrates by applying heat to the fixing material, and fixing the first and second substrates. Another feature is that the process includes an unloading process.

In addition, the manufacturing method of the liquid crystal display device according to the present invention for achieving the above object, the first substrate and the second substrate in which the liquid crystal is dropped, the main material and the heat-curable fixing material is formed, and the second substrate is loaded into the adapter chamber. A step of attaching the first and second substrates, a step of fixing the first and second substrates bonded by applying heat to the fixing material, and the fixed first and second substrates. Another feature is that it comprises a loading process.

In the above, the fixing material is formed of a pressure curable material, and in the fixing process, it is preferable to fix the substrate by applying pressure instead of heat.

In the above, it is preferable to fix the substrate by applying light and heat instead of heat in the process of forming the fixing material of the light and heat curable material and the fixing.

Hereinafter, a method of manufacturing a liquid crystal display device according to the present invention having such a feature will be described in detail with reference to the accompanying drawings.

2A to 2F are schematic cross-sectional views showing the process of the liquid crystal display device according to the present invention.

2A, the liquid crystal 12 is dripped at the 1st glass substrate 11, and the real material 14 is formed in the 2nd glass substrate 13. As shown in FIG. Here, a plurality of panels are designed on one of the first and second glass substrates 11 and 13 to form a thin film transistor array on each panel, and on the remaining substrates, a plurality of panels are designed to correspond to each panel. As a result, a color filter array including a black matrix layer, a color filter layer, a common electrode, and the like is formed in each panel. For ease of explanation, the substrate on which the thin film transistor array is formed is called a first glass substrate 11, and the substrate on which a color filter array is formed is called a second glass substrate 13.

Here, the bonding process is described in more detail as follows.

3 is a flowchart illustrating a bonding process of the liquid crystal display according to the present invention.

The bonding process according to the present invention includes the steps of: loading two substrates into a large chamber, bonding the two substrates, and curing and fixing a substance of the substrate bonded in the same chamber; In addition, the bonded two substrates may be divided into a process of unloading the vacuum combiner chamber.

First, before loading the first and second glass substrates 11 and 13 into the vacuum adhering chamber, the second glass substrate 13 coated with the actual material is cleaned in a USC (Ultra Sonic Cleaner) and in process Remove generated particles. That is, since the liquid crystal is not dripped but the actual material is apply | coated to the 2nd glass substrate 13, cleaning is possible.

And the loading process is a vacuum adhering chamber (FIG. 2B), so that the part to which the real material 14 was apply | coated may be directed to the 2nd glass substrate 13 to which the real material 14 was apply | coated as shown in FIG. The first glass substrate 11 on which the liquid crystal 12 is dripped is fixed to the upper stage 15 of the vacuum cleaner chamber 10 by the vacuum suction method (31S). It is fixed (32S). At this time, the vacuum adapter chamber 10 maintains the standby state.

Specifically, the loader of the robot (not shown in the drawing) has a second glass substrate 13 coated with a sealant 14 so that the portion coated with the seal 14 faces downward. ) Mounts the second glass substrate and places it into the vacuum adapter chamber 10. In this state, the upper stage 15 of the vacuum adhering chamber 10 descends to fix the second glass substrate 13 by vacuum adsorption, and then rise. At this time, it can be fixed by the electrostatic adsorption method instead of the vacuum adsorption method.

The loader of the robot exits the vacuum combiner chamber 10, and the lower stage 16 in the vacuum combiner chamber 10 is placed on the first glass substrate 11 having the liquid crystal 12 dropped by the loader of the robot. ) To the top.

In the above description, although the liquid crystal 12 is dropped on the first glass substrate 11 having the thin film transistor array and the substance is formed on the second glass substrate 13 having the color filter array, the first glass substrate ( 11) a real substance can be applied, and a liquid crystal can be dripped onto the said 2nd board | substrate, and a liquid crystal can also be dripped and the real thing may be apply | coated to either of the two glass substrates. However, the board | substrate with which liquid crystal was dripped may be located in a lower stage, and the remaining board | substrate may be located in an upper stage.

Subsequently, a substrate receiver (not shown) is positioned immediately below the second glass substrate 13 fixed to the upper stage 15 (33S). At this time, the method of placing the substrate receiver on the second substrate is as follows.

First, the upper stage is lowered or the substrate receiver is raised to bring the second glass substrate and the substrate receiver into close proximity, and then the second glass substrate 13 is lowered on the substrate receiver.

Second, the upper stage is first lowered by a predetermined distance and the substrate receiver is secondly raised to bring the second glass substrate 13 and the substrate receiver into close proximity, and then the second glass substrate 13 is moved to the substrate receiver. Put on top.

Third, the upper stage is lowered, the substrate receiver is raised, or the upper stage is first lowered, and the substrate receiver is raised secondly so that the second glass substrate 13 and the substrate receiver have a predetermined distance. The upper stage can then adsorb the second glass substrate.

At this time, the reason why the substrate receiver is positioned below the second glass substrate 13 is that the stages 15 and 16 adsorb the first and second glass substrates by a vacuum adsorption method. Since the degree of vacuum in the adapter chamber becomes higher than the vacuum of each stage while making the chamber 10 into a vacuum state, the suction force of the first and second glass substrates 11 and 13 held by the stage is lost, in particular The second glass substrate adsorbed on the upper stage is to be prevented from falling off and falling on the first glass substrate 11.

Therefore, before the vacuum chamber is brought into the vacuum state, the second glass substrate 13 adsorbed on the upper stage is placed on the substrate receiver, or the upper stage and the substrate receiver on which the second glass substrate is adsorbed are spaced at a predetermined interval. The second glass substrate 13 may be positioned from the upper stage to the substrate receiver while positioning and vacuuming the chamber. In addition, when the vacuum chamber chamber starts to be vacuumed, there may be additional means for fixing the substrate since the substrate may move due to flow in the chamber at an initial stage.

The vacuum adhering chamber 10 is brought into a vacuum state (34S). Here, the vacuum degree of the vacuum adapter chamber 10 varies depending on the liquid crystal mode to be bonded, but the IPS mode is about 1.0 x 10 ^-3 Pa to 1Pa, and the TN mode is about 1.1 x 10 ^-3 Pa to 10 ^2. Let Pa.

In the above, the chamber 10 of the vacuum adapter may be vacuumed in two stages. That is, the substrate is adsorbed to the upper and lower stages, the door of the chamber is closed, and the first vacuum is started. The substrate receiver is positioned below the upper stage and the substrate adsorbed on the upper stage is placed on the substrate receiver or the substrate is held at a predetermined interval while the substrate is held at the substrate receiver. Is vacuumed second. At this time, the vacuum is faster at the time of the second vacuum than at the first vacuum, and the primary vacuum ensures that the vacuum degree of the vacuum adhering chamber is not higher than the vacuum suction force of the upper stage.

In addition, without separating the vacuum into primary and secondary, the substrate may be adsorbed to each stage, the door of the chamber may be closed, and the vacuum may be started to place the substrate receiver under the upper stage during the vacuum. At this time, the time point at which the substrate receiver is positioned below the upper stage should be positioned before the vacuum degree of the vacuum adapter chamber becomes higher than the vacuum suction force of the upper stage.

The reason why the vacuum of the vacuum adapter chamber is secondly carried out as described above is to prevent the vacuum adapter chamber from suddenly evacuating because the substrate in the chamber may be distorted or flowed.

When the vacuum adhering chamber 10 reaches the vacuum in a predetermined state, the upper and lower stages 15 and 16 are each of the first and second glass substrates 11 and 13 by an electrostatic charge (ESC) method. ) Is fixed (35S), and the substrate receiver is placed in its original position (36S).

Here, the electrostatic adsorption method includes at least two or more plate electrodes formed on the stage to supply negative / positive DC power to the plate electrodes and to adsorb them. That is, when a positive or negative voltage is applied to each of the flat plate electrodes, a negative or positive charge is induced on the stage and a conductive layer (a transparent electrode such as a common electrode or a pixel electrode is formed) is formed on the glass substrate by those charges. Therefore, the substrate is adsorbed by the Coulomb force generated between the conductive layer and the stage. At this time, a voltage of about 0.1 to 1 KV is applied when the surface on which the conductive layer of the substrate is formed is located on the stage side, and 3 to 4 KV when a surface on which the conductive layer of the substrate is formed is located on the side opposite to the stage. do. Here, an elastic sheet may be formed on the upper stage.

As shown in FIGS. 2C and 2D, the first glass substrate 11 is lowered by lowering the upper stage 15 while the two glass substrates 11 and 13 are loaded on the stages 15 and 16 by electrostatic adsorption. And pressurization (37S) to bond the 2nd glass substrate 13 together. At this time, in the pressing method, the upper stage 15 or the lower stage 16 is moved in the vertical direction to press the two substrates, and at this time, the moving speed and the pressure of the stage are varied and pressed. That is, when the liquid crystal 12 of the 1st glass substrate 11 and the 2nd glass substrate 13 contact, or the real material 14 of the 1st glass substrate 11 and the 2nd glass substrate 13 is contacted, The stage is moved at a constant speed or constant pressure up to a point in time, and the pressure is gradually increased step by step from the point of contact to the desired final pressure (see FIG. 2D).

At this time, the upper stage pressurizes the substrate by one axis, but by installing several axes, a separate load cell (device for measuring pressure) can be installed to press each axis independently. have. Therefore, when the lower stage and the upper stage are not horizontally aligned and the materials are not uniformly bonded, the shafts of the corresponding portions may be pressed at a relatively higher pressure or at a lower pressure so that the materials may be uniformly bonded.

After pressing and bonding the two substrates, as shown in FIG. 2E, light (UV) is irradiated to a material to which the first and second glass substrates 11 and 13 are bonded, or heat is transferred to the material. Hardening to fix the first and second glass substrates 11 and 13 (38S). Here, in the fixing process, since the substrate is enlarged (1000 mm x 1200 mm) and the two substrates are bonded after the dropping of the liquid crystal, the two substrates joined together may be misaligned during the next process or movement after the bonding. Therefore, the fixing is performed to prevent misalignment of the two bonded substrates during the next process or movement after bonding and to maintain the bonded state.

Here, the fixing method will be described in more detail as follows.

First, the fixing method is performed in the coalescing chamber, wherein the coalescing chamber is maintained in a vacuum or standby state. In addition, it is preferable to proceed with the fixing process after the bonding process is made, but may be performed before the bonding process is completed in order to shorten the process time. And, in order to simplify the process, it is preferable to use the same material as the main material as the fixing material, but a material different from the main material may be used to improve the fixing efficiency. As the fixing material, a light (UV) curable resin, a thermosetting resin, a light (UV) and a thermosetting resin, a pressure curable resin, or a material having high adhesive strength may be used. Here, the photocurable resin includes a light (UV) curable resin, and when the light (UV) curable resin is used, the light (UV) irradiation condition irradiates 50 to 500 mW of light (UV) for 5 to 40 seconds. Preferably, 200 mW of light (UV) is irradiated for about 14 seconds. And, in the case of using a thermosetting resin, but may vary depending on the material of the fixing material, a temperature of 50 to 200 ℃ is added to about 10 seconds or more. Therefore, the bonded substrate fixing method can be fixed using light, heat, light and heat, or pressure. The position for forming the fixing material may be formed on the same substrate as the main material or on a different substrate.

4 is a layout view of a substrate for explaining fixing according to the present invention, and FIG. 10 is a cross-sectional view of the upper and lower stages and the substrate on the line II ′ of FIG. 4.

The bonded substrate fixing method according to the first embodiment of the present invention is a light (UV) curable resin, a heat curable resin, a light (UV) and a heat curable resin, or a pressure during the application of the material 14 as described above. Using the curable resin, as shown in FIG. 4, the plurality of main materials 14a for bonding the two substrates to the periphery of each panel unit as well as for sealing the liquid crystal between the two substrates, and for each inner main material during the bonding and pressing process ( The dummy material 14b formed to surround the plurality of panel parts to protect 14a), and the plurality of fixing material 14c formed at regular intervals on the outer portion (edge portion of the substrate) of the dummy material 14b. Is formed on the second glass substrate 13. The dummy material 14b is for protecting the main material 14a and the fixing material 14c is only for preliminary fixing of two substrates, and thus is removed during the cutting process.

As described above, the fixing material 14c is formed and the two substrates are bonded to each other, and then, in that state, the fixing material 14c is irradiated with light (UV) to cure the fixing material 14c or the Heat is applied to the fixing material 14c to cure the fixing material 14c to fix the two bonded substrates. That is, when the fixing material 14c is formed of a light (UV) curable resin, the fixing material 14c is irradiated with light (UV) to fix it, and the fixing material 14c is a thermosetting resin. In the case of forming, the fixing material 14c is hardened by applying heat to the fixing material 14c.

Here, as shown in FIG. 10, the upper stage 15 and / or the lower stage 16 are provided with a plurality of holes 17 for irradiating light or applying heat. Therefore, it is considered that the fixing material 14c and the hole 17 are aligned because each substrate is adsorbed after being aligned at each stage before bonding. Therefore, when the light (UV) is irradiated or heat is applied to the fixing material 14c through the hole 17 from the upper stage or / and lower stage where the hole 17 is formed, the fixing material 14c Is cured so that the two bonded substrates are fixed. At this time, the light (UV) irradiation is performed by the light (UV) irradiation pins (18a, 18b) for irradiating the light (UV) is lowered on the upper side of the adapter chamber or raised below the adapter chamber. ) Is irradiated to the fixing substance 14c, and light (UV) irradiation conditions irradiate 50 to 500 mW of light (UV) for 5 to 40 seconds. Preferably, 200 mW of light (UV) is irradiated for about 14 seconds. In the case of curing with heat, the heat mechanisms 18a and 18b descend from the upper side of the combiner chamber or rise from the lower side of the combiner chamber to pass through the hole 17 to which the fixing member 14c is applied. It contacts the 1st, 2nd glass substrate 11, 13 of a part, and heats the said fixing material 14c. The conditions for applying heat may vary depending on the material of the fixing material, but if the temperature of 50 to 200 ° C. is added for about 10 seconds or more, only the fixing material 14c may be selectively cured. In addition, light (UV) irradiation and heat can be fixed in parallel.

Of course, the main material 14a, the dummy material 14b, and the fixing material 14c may be formed on the second glass substrate, but in some cases, the dummy material 14b or the fixing material 14c may be the first. It can be formed in the glass substrate 11, and the fixing material 14c can be formed from a material different from the main material 14a. In other words, the main material 14a is formed on the first substrate 11 and the fixing material 14c or the dummy material 14b is formed on the second substrate 13, or the main material 14 is formed on the second substrate 13. 14a) and the fixing material 14c or the dummy material 14b may be formed on the first substrate 11, and both the main material 14a, the dummy material 14b and the fixing material 14c may be formed. It may be formed on the first substrate 11.

5 is a layout view of a substrate for explaining fixing according to the second embodiment of the present invention.

According to the bonded substrate fixing method of the second embodiment of the present invention, all panel parts are made of real (light (UV) curable resin, thermosetting resin, light (UV) and thermosetting resin, pressure curable resin, etc.) as shown in FIG. Bonding the two substrates to the edge of the second substrate as well as surrounding the main material 14a for sealing the liquid crystal between the two substrates, and formed to surround the plurality of panel parts to protect the internal main material 14a during the bonding process The dummy material 14b is formed, and the two substrates are fixed by partially irradiating or applying heat UV to the dummy material 14b.

That is, in the fixing method of the first embodiment of the present invention as shown in FIG. 4, the dummy material 14b is applied to a portion to which the fixing material is applied, and the dummy material 14b is partially irradiated with light UV or heat. To partially fix the dummy material 14b. The remaining light (UV) irradiation conditions and the conditions to which heat is applied are as described in the first embodiment of the present invention, and the light (UV) and heat can be fixed in parallel. In Fig. 5, reference numeral 14d denotes a portion to which the light (UV) irradiation and / or heat is applied. Here, the dummy real material 14b may be interpreted as the fixed real material 14c.

6 is a layout view of a substrate for explaining fixing according to a third embodiment of the present invention.

In the fixing method of the third embodiment of the present invention, in the fixing method of the first embodiment of the present invention, the fixing material 14c formed on the edge of the main material 14a and the substrate is formed without forming a dummy material. The two bonded substrates are fixed by irradiating light UV or applying heat or pressure to the actual material 14c. The remaining conditions are as described in the first embodiment. Here, the fixing member 14c may be formed so as to be closed in a dummy member shape.

7 is a layout view of a substrate for explaining fixing according to the fourth embodiment of the present invention.

In the bonded substrate fixing method of the fourth embodiment of the present invention, in the bonded substrate fixing method of the third embodiment of the present invention, the fixing material 14c is not only fixed to the peripheral portions (edges) of the substrate but also to the cutting portions between the panel portions. The fixing substrates 14c are formed at intervals, and the two bonded substrates are fixed by irradiating light (UV) or applying heat or pressure to the fixing members 14c. The remaining conditions are as described in the first embodiment.

8 is a layout view of a substrate for explaining fixing according to a fifth embodiment of the present invention.

In the fixing method according to the fifth embodiment of the present invention, in the first embodiment of the present invention as shown in FIG. 4, the panel member (main) is not formed so as to surround all the panel parts (main material). A plurality of dummy materials 14b are formed to surround each of the materials, and a fixing material 14c is formed at the edge of the substrate. As described above, the fixing material 14c is irradiated with light (UV) or heat or The two bonded substrates were fixed by applying pressure. The remaining conditions are as described in the first embodiment.

9 is a layout view of a substrate for explaining fixing according to the sixth embodiment of the present invention.

In the fixing method according to the sixth embodiment of the present invention, in the fifth embodiment of the present invention as shown in FIG. 8, the fixing method is partially formed in the plurality of dummy materials 14b formed in the panel portions without separately forming the fixing material 14c. This is to fix two bonded substrates by irradiating with light or applying heat. The remaining conditions are as described in the first embodiment.

In addition, although not shown in the drawing, in the fixing method according to the seventh embodiment of the present invention, the main material (light (UV) curable resin, heat) which bonds the two substrates without forming a separate dummy material and a fixing material on the board. The curable resin or light (UV) and heat curable resin) may be partially irradiated with light (UV) or heat to partially harden and fix the present substance.

In addition, although not shown in the drawings, in the fixing method according to the eighth embodiment of the present invention, in the first, third, fourth, and fifth embodiments, the fixing material is formed at a portion where the fixing material 14c is formed. When the adhesive having excellent curability is applied and the first and second glass substrates are bonded to each other, the two substrates may be fixed by the adhesive.

As such, when the two bonded substrates are fixed, the bonded first and second glass substrates may be prevented from being shifted or deformed when moving for the next process.

As described above, when the two substrates are bonded and fixed, the adsorption is stopped by the electrostatic adsorption method (ESC off), and then the upper stage 15 is raised by raising the upper stage 15 as shown in FIG. 2F. Separate from the two fixed glass substrates 11 and 13.

Then, the substrate is unloaded (38S). That is, the upper stage 15 rises and unloads the fixed first and second glass substrates 11 and 13 using the loader of the robot, or the fixed first and second glass substrates 11 and 13. ), The robot's loader unloads from the upper stage 16 after the upper stage 15 is absorbed and raised.

At this time, in order to shorten the process time, one of the first glass substrate 11 or the second glass substrate 13 to be subjected to the next bonding process is loaded on the stage and the unloaded fixed first and second glass substrates are unloaded. can do. That is, a second substrate to be bonded next is placed on the upper stage 15 by using a loader of the robot so that the upper stage adsorbs the second substrate by vacuum adsorption, and then fixed on the lower stage 16. The first and second substrates unloaded, or the first stage 15 is lifted by the fixed first and second glass substrates 11 and 13, and the loader of the robot moves to the first bonding process. After the glass substrate 11 is loaded on the lower stage, the fixed first and second glass substrates may be unloaded.

In the above, the liquid crystal spreading process of spreading the liquid crystal of the fixed substrate to the actual side before the unloading after bonding the substrate may be further proceeded. Alternatively, after the unloading process is completed, if the liquid crystal does not spread, the liquid crystal spreading process may be further performed in order to spread the liquid crystal evenly toward the actual surface. At this time, the liquid crystal spreading step is performed for 10 minutes or more, and the liquid crystal spreading step can be performed in air or in vacuum.

The manufacturing method of the liquid crystal display device according to the present invention as described above has the following effects.

First, since a liquid crystal is dropped on the first substrate and a substance is formed on the second substrate, the process time before joining the two substrates is shortened, thereby improving productivity.

Second, since the liquid crystal is dropped on the first substrate and the real and Ag dots are applied on the second substrate, the process of the first substrate and the second substrate is balanced, so that the production line can be efficiently operated. .

Third, since the liquid crystal is dropped on the first substrate and the real and Ag dots are applied on the second substrate, the substrate is coated with the actual material in the cleaning equipment (USC) immediately before the bonding, so that the actual material is contaminated from particles. Can be prevented as much as possible.

Fourth, since the substrate receiver is positioned below the substrate and the adapter chamber is made in a vacuum state, the substrate adsorbed on the upper stage can be prevented from falling and the substrate is damaged.

Fifth, since the two substrates are bonded while recognizing the time point at which the two substrates are in contact with each other, the damage that the dropped liquid crystal may affect the alignment layer may be minimized.

Sixth, since the upper stage presses the substrate by a plurality of shafts that can press independently on each axis, when the lower stage and the upper stage are not horizontal to each other and the material is not uniformly bonded, It may be pressurized to a higher pressure or to a lower pressure so that the substance can be uniformly bonded.

Seventh, since vacuuming the adjoiner chamber over a second time, it is possible to prevent the chamber from suddenly vacuuming, thereby preventing the substrate from breaking and flowing due to a sudden vacuum.

Eighth, after the two substrates are bonded together, the dummy material or the main material is partially cured or the two bonded substrates are fixed by using a separate adhesive, and then the next process or the bonded substrates are moved. Alternatively, the first glass substrate and the second glass substrate may be prevented from being misaligned during the movement.

Ninth, loading and unloading can be done at the same time, reducing the process time.

Tenth, since the liquid crystal spreading step is performed, the process time of the liquid crystal display device can be shortened.

Claims (19)

Loading the first substrate and the second substrate on which the substance is formed into the combiner chamber; Bonding the first and second substrates together; Fixing the bonded first and second substrates by applying heat to the material; And, And unloading the fixed first and second substrates. The method of claim 1, The material is a manufacturing method of the liquid crystal display device, characterized in that made of a thermosetting material. The method of claim 2, A method of manufacturing a liquid crystal display device, characterized in that the heat is fixed to the real part. The method of claim 1, The actual material has a main material and a fixing material of the thermosetting material, The fixing of the bonded substrates includes fixing the two bonded substrates by applying heat to the fixing material. The method of claim 4, wherein The fixing material is formed on the edge of the substrate manufacturing method of the liquid crystal display device. The method of claim 5, The fixing material is formed in the cutting portion between each panel and the edge of the substrate manufacturing method of the liquid crystal display device. The method of claim 1, The actual material is heat curable for a plurality of main materials for sealing the liquid crystal dropped on the plurality of panel parts, a dummy material for protecting the plurality of main materials, and a fixing material for fixing the two bonded substrates. And a process of fixing the bonded substrates by applying heat to the fixing substance, wherein the fixing of the bonded substrates is performed. The method of claim 1, The actual material includes a plurality of main materials for sealing liquid crystals dropped on the plurality of panel portions, and a plurality of dummy materials for protecting the plurality of main materials, respectively, as thermosetting materials. And fixing the bonded substrates to each other by fixing heat to the dummy material to fix the two bonded substrates. The method of claim 8, And partially applying heat to the dummy material to fix the bonded substrate. The method according to claim 2, 4, 7, or 8, And forming the material into a pressure curable material and applying the pressure instead of the heat to fix the bonded substrate. The method according to claim 2, 4, 7, or 8, And forming the material into a light and thermosetting material and applying light and heat instead of the heat to fix the bonded substrate. The method of claim 1, The adhesive which is more excellent in curability than the said real thing is apply | coated separately to the cutting part or the edge part of a 2nd board | substrate, The fixing of the bonded substrate, the method of manufacturing a liquid crystal display device, characterized in that for fixing the bonded substrate by the adhesive. The method of claim 1, In the fixing step, the heat condition is a temperature of 50 ~ 200 ℃ characterized in that the manufacturing method of the liquid crystal display device. The method of claim 13, In the fixing step, the manufacturing method of the liquid crystal display device characterized in that the heat is applied for more than 10 seconds. Loading a first substrate onto which the liquid crystal is dropped and the main substance is applied, and a second substrate on which the fixing substance for the thermosetting material is applied, into the adapter chamber; Bonding the first and second substrates together; Fixing the bonded first and second substrates by applying heat to the fixing material; And, And unloading the fixed first and second substrates. Loading a first substrate on which a liquid crystal is dropped and a heat-curable fixing material and a second substrate on which a main material is formed into the combiner chamber; Bonding the first and second substrates together; Fixing the bonded first and second substrates by applying heat to the fixing material; And, And unloading the fixed first and second substrates. Loading a first substrate and a second substrate on which a liquid crystal is dropped and a main substance and a heat-curable fixing substance are formed, and into a combiner chamber; Bonding the first and second substrates together; Fixing the bonded first and second substrates by applying heat to the fixing material; And, And unloading the fixed first and second substrates. The method according to claim 15, 16 or 17, And the substrate is fixed by applying pressure instead of heat in the process of forming the fixing material with a pressure curable material and fixing the material. The method according to claim 15, 16 or 17, And fixing the substrate by applying light and heat instead of heat in the step of forming the fixing material with a light and thermosetting material and fixing the light.