KR20040060509A - Cmos 이미지 센서 - Google Patents
Cmos 이미지 센서 Download PDFInfo
- Publication number
- KR20040060509A KR20040060509A KR1020020087309A KR20020087309A KR20040060509A KR 20040060509 A KR20040060509 A KR 20040060509A KR 1020020087309 A KR1020020087309 A KR 1020020087309A KR 20020087309 A KR20020087309 A KR 20020087309A KR 20040060509 A KR20040060509 A KR 20040060509A
- Authority
- KR
- South Korea
- Prior art keywords
- light
- array
- photodiode array
- received light
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 5
- 238000000926 separation method Methods 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 206010034960 Photophobia Diseases 0.000 abstract description 8
- 208000013469 light sensitivity Diseases 0.000 abstract description 8
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 238000006243 chemical reaction Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 26
- 239000011229 interlayer Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 2
- 238000002493 microarray Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims (2)
- 반도체 기판에 단위 픽셀간 분리를 위한 복수의 필드절연막;상기 복수의필드절연막간의 액티브영역 일정 간격으로 형성되며, 수광된 빛을 전기신호로 광전변환하는 포토다이오드 어레이;상기 포토다이오드 어레이 상부에 형성되며, 상기 수광된 빛을 상기 포토다이오드 어레이로 투과하는 광투과층;상기 수광된 빛의 균일한 투과를 위하여 상기 광투과층 상부에 형성된 평탄화층;상기 평탄화층의 상부에 컬러 포토레지스터를 도포하여 형성한 컬러필터부;상기 컬러필터부의 상부에 형성되며, 상기 수광된 빛을 상기 포토다이오드 어레이로 집광하기 위해 소정의 굴절율을 갖는 마이크로 렌즈 어레이; 및상기 마이크로 렌즈 어레이 상부에 상기 상기 마이크로 렌즈 어레이의 굴절율보다 상대적으로 큰 재료로 형성된 적어도 하나 이상의 물질층을 구비하는 것을 특징으로 하는 CMOS 이미지 센서.
- 제 1 항에 있어서,상기 적어도 하나 이상의 물질층은 서로 다른 굴절율을 갖는 것을 특징으로 하는 CMOS 이미지 센서.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020087309A KR20040060509A (ko) | 2002-12-30 | 2002-12-30 | Cmos 이미지 센서 |
| JP2003431947A JP2004215264A (ja) | 2002-12-30 | 2003-12-26 | イメージセンサー |
| US10/746,498 US7005627B2 (en) | 2002-12-30 | 2003-12-29 | Image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020020087309A KR20040060509A (ko) | 2002-12-30 | 2002-12-30 | Cmos 이미지 센서 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040060509A true KR20040060509A (ko) | 2004-07-06 |
Family
ID=32709761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020020087309A Ceased KR20040060509A (ko) | 2002-12-30 | 2002-12-30 | Cmos 이미지 센서 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7005627B2 (ko) |
| JP (1) | JP2004215264A (ko) |
| KR (1) | KR20040060509A (ko) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100733265B1 (ko) * | 2005-12-28 | 2007-06-27 | 동부일렉트로닉스 주식회사 | 이미지 센서 모듈 및 그 제조 방법 |
| KR101160089B1 (ko) * | 2010-06-23 | 2012-06-26 | 주식회사 코리아일레콤 | 굴절체 어레이를 이용한 협대역 레이저 감지 장치 |
| KR20180016125A (ko) | 2016-08-05 | 2018-02-14 | (주) 솔 | 광센서 모듈 |
| CN112088434A (zh) * | 2018-03-30 | 2020-12-15 | 威世科技公司 | 多光谱光传感器 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100538149B1 (ko) * | 2003-12-27 | 2005-12-21 | 동부아남반도체 주식회사 | 이미지 센서 |
| KR100595898B1 (ko) * | 2003-12-31 | 2006-07-03 | 동부일렉트로닉스 주식회사 | 이미지 센서 및 그 제조방법 |
| US7078260B2 (en) * | 2003-12-31 | 2006-07-18 | Dongbu Electronics Co., Ltd. | CMOS image sensors and methods for fabricating the same |
| KR100659503B1 (ko) * | 2004-07-27 | 2006-12-20 | 삼성전자주식회사 | 광감도를 개선한 이미지 센서 |
| KR100640531B1 (ko) * | 2004-08-20 | 2006-10-30 | 동부일렉트로닉스 주식회사 | 자기 정렬 이미지 센서 제조방법 |
| KR100595601B1 (ko) * | 2004-12-14 | 2006-07-05 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 제조방법 |
| US20060198008A1 (en) * | 2005-03-07 | 2006-09-07 | Micron Technology, Inc. | Formation of micro lens by using flowable oxide deposition |
| US7491621B2 (en) * | 2006-01-30 | 2009-02-17 | Macronix International Co., Ltd. | Method of forming isolation structures in a semiconductor manufacturing process |
| KR100791842B1 (ko) * | 2006-07-25 | 2008-01-07 | 삼성전자주식회사 | 마이크로렌즈의 쉬프트가 필요 없는 이미지센서 및 그 제조방법 |
| US7965444B2 (en) * | 2006-08-31 | 2011-06-21 | Micron Technology, Inc. | Method and apparatus to improve filter characteristics of optical filters |
| KR100824625B1 (ko) * | 2006-12-12 | 2008-04-25 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 및 그 제조 방법 |
| US8975599B2 (en) * | 2007-05-03 | 2015-03-10 | Asml Netherlands B.V. | Image sensor, lithographic apparatus comprising an image sensor and use of an image sensor in a lithographic apparatus |
| US9153614B2 (en) * | 2007-08-15 | 2015-10-06 | Micron Technology, Inc. | Method and apparatus for lens alignment for optically sensitive devices and systems implementing same |
| WO2010009462A2 (en) * | 2008-07-18 | 2010-01-21 | Massachusetts Institute Of Technology | Dark current reduction for large area photodiodes |
| US20110127628A1 (en) * | 2009-11-30 | 2011-06-02 | Aptina Imaging Corporation | Ion implantation to change the optical properties of the passivation films in cmos imager devices |
| US9128218B2 (en) * | 2011-12-29 | 2015-09-08 | Visera Technologies Company Limited | Microlens structure and fabrication method thereof |
| CN118692882A (zh) * | 2023-03-24 | 2024-09-24 | 华为技术有限公司 | 一种光阴极、电子源模组以及电子设备 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2451668A1 (de) | 1974-10-31 | 1976-05-06 | Leitz Ernst Gmbh | Anordnung zur geometrischen trennung von lichtfluessen in abbildungssystemen |
| US4901153A (en) | 1988-08-10 | 1990-02-13 | Seiko Instruments Inc. | Image sensor with reduced surface reflection interference |
| DE69409655T2 (de) | 1993-09-17 | 1998-08-06 | Polaroid Corp | Herstellung von mikrolinsen auf festkörper-bildaufnehmer |
| KR100303774B1 (ko) | 1998-12-30 | 2001-11-15 | 박종섭 | 개선된 광감도를 갖는 씨모스이미지센서 제조방법 |
| US6583438B1 (en) * | 1999-04-12 | 2003-06-24 | Matsushita Electric Industrial Co., Ltd. | Solid-state imaging device |
-
2002
- 2002-12-30 KR KR1020020087309A patent/KR20040060509A/ko not_active Ceased
-
2003
- 2003-12-26 JP JP2003431947A patent/JP2004215264A/ja active Pending
- 2003-12-29 US US10/746,498 patent/US7005627B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100733265B1 (ko) * | 2005-12-28 | 2007-06-27 | 동부일렉트로닉스 주식회사 | 이미지 센서 모듈 및 그 제조 방법 |
| KR101160089B1 (ko) * | 2010-06-23 | 2012-06-26 | 주식회사 코리아일레콤 | 굴절체 어레이를 이용한 협대역 레이저 감지 장치 |
| KR20180016125A (ko) | 2016-08-05 | 2018-02-14 | (주) 솔 | 광센서 모듈 |
| CN112088434A (zh) * | 2018-03-30 | 2020-12-15 | 威世科技公司 | 多光谱光传感器 |
| CN112088434B (zh) * | 2018-03-30 | 2024-05-28 | 威世科技公司 | 多光谱光传感器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004215264A (ja) | 2004-07-29 |
| US20040135066A1 (en) | 2004-07-15 |
| US7005627B2 (en) | 2006-02-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20021230 |
|
| PG1501 | Laying open of application | ||
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
Patent event date: 20050221 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20071126 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20021230 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20090307 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20090826 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20090307 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |