KR200415210Y1 - Rigid Flexible Printed Circuit Board - Google Patents

Abstract

According to the present invention, a dynamic laminated plate, a coverlay stacked on one surface of a dynamic laminated plate, and a first preserved portion formed by stacking a plurality of prepregs stacked on one surface of the coverlay, and one end of a dynamic laminated plate A flexible portion having a flexible cover laminated to the cover layer, the other end of which is connected to the coverlay of the first rigid part, and the other end of which is connected to the coverlay of the second rigid part. A rigid flexible printed circuit board comprising: a flexible layer formed by stacking each flexible dynamic laminate and a flexible coverlay A rigid flexible printed circuit board is disclosed, wherein a predetermined gap is formed therebetween.

According to the disclosed rigid flexible printed circuit board, since a predetermined gap is formed in the flexible portion, the flexible flexible printed circuit board can be bent more flexibly, thereby improving the flex resistance of the circuit bent portion.

Rigid, Flexible, Printed Circuit Board, Via Hole, Dynamic Layer, Coverlay, Prepreg

Description

Rigid-flexible Printed Circuit Board

1 is a cross-sectional view of a rigid flexible printed circuit board according to a preferred embodiment of the present invention,

2A to 2F are cross-sectional views sequentially shown according to a manufacturing step of a rigid flexible printed circuit board according to a preferred embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100 ... rigid flexible printed circuit board 110 ... first rigid part

111 Polyimide layer 112 Copper foil layer

113 Dynamic Laminate 114 Coverlay

115 ... prepreg 116 ... via hole

117 ... Airgap 120 ... Second Rigid Part

130 ... flexible part 133 ... flexible laminated board

134.Flexible Coverlay

The present invention relates to a rigid flexible printed circuit board, and more particularly, to a rigid flexible printed circuit board to improve the bending resistance of the circuit bent portion.

Generally, a printed circuit board is a circuit line pattern formed of a conductive material such as copper on an electrically insulating substrate, and refers to a substrate immediately before mounting an electronic component.

Printed circuit boards are classified into rigid printed circuit boards made of phenol and epoxy and flexible printed circuit boards made of easily bendable materials such as polyimid, depending on the type of substrate material. do.

Recently, with the growth of electronic devices such as mobile phones, PDAs, and digital cameras, printed circuit board prose is an important core component of high integration and packaging of products. The technology for miniaturization, light weight, and light weight of the electronic device requires not only a small microfabrication technology for the mounted parts, but also an optimized design technology for the mounting space, and a printed circuit that enables high-density, high-density component mounting, in particular. Provision of the substrate is necessary.

Here, flexible boards, which are flexible circuit boards that can be flexibly responded to when circuit boards such as automation devices and camcorders need to move, and when circuit boards need to be inserted or inserted into components, are used for space problems due to the use of separate connectors. There is a problem of connection reliability and component mounting, which can be improved by applying a rigid flexible printed circuit board.

Such a rigid flexible printed circuit board may simultaneously perform a function of a component mounting board and a function of an interface.

Therefore, a rigid flexible board is a board in which a rigid board and a flexible board are structurally coupled and connected to a rigid unit and a flexible unit without a separate connector. Since the connector is not used, a space problem on a printed circuit board can be solved. It is possible to secure the reliability generated in the connection of the connector portion, and has the advantage of improving the component mountability.

In particular, the demand for rigid flexible printed circuit boards is steadily growing due to the development of electronic components and component embedding technology and the reduction of light and small size of electronic products.

The conventional rigid flexible printed circuit board has a problem in that, when there is a continuous repetitive motion of the circuit bent portion of the electronic device, the flexibility is reduced by the adhesive laminated on the flexible portion, and the circuit formed on the flexible portion is easily shorted.

In addition, many via holes formed by plating gold on the inner surface of the laser via hole after being drilled with a laser are used. In addition, the surface of the via hole becomes uneven due to the empty space inside the via hole, as well as contact with various microelectronic components. Since the area is small, there is a problem in that bonding characteristics between the electronic component and the via hole are degraded.

The present invention was devised to solve the above problems, and an object thereof is to provide a rigid flexible printed circuit board having improved flex resistance by improving the structure of the flexible part.

Other objects and advantages of the present invention will be described below and will be appreciated by the embodiments of the present invention. In addition, the objects and advantages of the present invention can be realized by the means and combinations shown in the claims.

According to the present invention, a first rigid part and a second rigid part formed by stacking a dynamic layer plate, a coverlay stacked on one surface of the dynamic layer plate and a prepreg stacked on one surface of the coverlay, and one end of the first rigid part A flexible cover plate connected to the dynamic layer plate, the other end of which is connected to the dynamic layer plate of the second rigid part, and one end of which is connected to the coverlay of the first rigid part, and the other end of which is connected to the coverlay of the second rigid part; A rigid flexible printed circuit board comprising a flexible part, wherein the flexible part is formed by stacking each of the flexible dynamic laminate and the flexible coverlay. A rigid flexible printed circuit board is disclosed, wherein a predetermined gap is formed therebetween.

Here, the first rigid portion and the second rigid portion preferably include via holes filled with a filler.

Moreover, it is preferable that the said dynamic laminated board and a flexible dynamic laminated board contain a polyimide layer and a copper foil layer.

Moreover, it is preferable that the said copper foil layer was formed with the circuit pattern.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, the terms or words used in this specification and claims should not be construed as being limited to their usual or dictionary meanings, and the inventors will properly describe the concept of terms in order to best explain their own design. Based on the principle that it can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical ideas of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a cross-sectional view of a rigid flexible printed circuit board according to a preferred embodiment of the present invention.

First, referring to FIG. 1, a rigid flexible printed circuit board 100 according to an exemplary embodiment of the present invention includes a first rigid part 110, a second rigid part 120, and a flexible part 130.

First, the first rigid part 110 and the second rigid part 120 include a dynamic layer plate 113, a coverlay 114, a prepreg 115, and a via hole 116.

The dynamic layer plate 113 includes a polyimide layer 111 and a copper foil layer 112. In the dynamic layer plate 113, the copper foil layer 112 is laminated on one surface of the polyimide layer 111, and has heat resistance and chemical resistance properties.

Here, the copper foil layer 112 of the dynamic layer plate 113 is a circuit pattern is formed through the process of laminating a dry film, double-sided exposure, development, etching.

The coverlay 114 is an insulating resin used to protect and insulate the exposed surface of the circuit pattern formed on the copper foil layer 112 of the dynamic layer plate 113, and is disposed on one surface of the dynamic layer plate 113. Are stacked.

The prepreg 115 is interposed on one surface of the coverlay 114. In addition, the prepreg 115 is interposed between the dynamic layer plate 113 in order to stack the dynamic layer plate 113 up and down.

The via hole 116 is formed through the place where the dynamic layer plate 113, the coverlay 114, the prepreg 115, and the dynamic layer plate 113 are sequentially stacked and filled with a filler. After the via hole 116 is formed, the coverlay 114 is stacked on the upper surface.

The flexible part 130 has one end connected to the dynamic layer plate 113 of the first rigid part 110 and the other end connected to the dynamic layer plate 113 of the second rigid part 120. 133 and one end of the flexible coverlay 134 is connected to the coverlay 114 of the first rigid portion 110, the other end is connected to the coverlay 114 of the second rigid portion 120. do.

Here, the flexible part 130 is a layer formed by stacking each of the flexible dynamic laminate 133 and the flexible coverlay 134 A predetermined gap is formed between them. The predetermined interval is also referred to as the air gap 117, where the prepreg 115 is not interposed.

2A to 2F are cross-sectional views sequentially shown according to a manufacturing step of a rigid flexible printed circuit board according to a preferred embodiment of the present invention.

Referring to FIGS. 2A to 2F, each manufacturing step of the rigid flexible printed circuit board according to the embodiment of the present invention will be described.

First, as shown in FIG. 2A, the dynamic layer plate 113 having the copper foil layer 112 laminated on one surface of the polyimide layer 111 is prepared. Here, the copper foil layer 112 of the dynamic layer plate 113 is a circuit pattern is formed through the process of laminating a dry film, double-sided exposure, development, etching.

Next, as shown in FIG. 2B, the coverlay 114 is stacked on one surface of the copper foil layer 112 of the dynamic layer plate 113 to protect the circuit pattern formed on the dynamic layer plate 113. Here, the coverlay 114 is an insulating resin used to protect and insulate the exposed surface of the circuit pattern.

Next, as shown in FIG. 2C, as described above, two dynamic layer plates 113 covered with the coverlay 114 are prepared, disposed to face each other, and then interposed between the prepregs 115. do.

Here, the prepreg 115 is not interposed on the circuit board portion on which the flexible part is to be formed. Prepreg is a material that is cured by impregnating glass fiber with resin, and has adhesiveness.

The two dynamic layer plates 113 prepared above are stacked on upper and lower surfaces of the prepreg 115. The dynamic layer plate 113 is stacked on the upper and lower surfaces of the prepreg 115, and the dynamic layer plate 113 is compressed and stacked on the prepreg 115 by a vacuum press.

Next, as shown in FIG. 2D, an open region is formed without stacking the prepreg 115 at a position corresponding to the flexible formation region, and other copper is formed at a portion of the coverlay 114 that is not an open region. The laminated plate 113 is laminated. Then, the coverlay 114 and the dynamic layer plate 113 is laminated using a prepreg 115, and compression molding using a press.

As described above, another dynamic layer is described as being laminated, but this is for convenience of description, and the dynamic layer may be further stacked, which is a common knowledge in the technical field to which the present invention belongs. Of course, various modifications and variations are possible by those who have.

Accordingly, the first rigid part 110 and the second rigid part 120 formed of the dynamic layer plate 113, the coverlay 114, the prepreg 115, and another dynamic layer plate 113 are formed, and once The flexible laminated board 133 and one end of which are connected to the dynamic laminated board 113 of the first rigid part 110 and the other end of which is connected to the dynamic laminated board 113 of the second rigid part 120. A flexible portion 130 including a flexible coverlay 134 connected to the coverlay 114 of the rigid portion 110 and the other end connected to the coverlay 114 of the second rigid portion 120 is formed. .

Here, the flexible part 130 is not interposed with the prepreg 115, a predetermined interval is formed. The predetermined interval is also referred to as the air gap 117, where the prepreg 115 is not interposed. Therefore, the bending resistance of the circuit bend may be improved due to a predetermined interval without the prepreg 115 interposed therebetween.

That is, by not interposing the prepreg 115 in the flexible portion 130, when the flexible substrate is bent, it can be bent more flexibly, it is possible to prevent the short circuit formed in the flexible portion.

Next, as shown in FIG. 2E, via holes 116 are formed in the first rigid part 110 and the second rigid part 120 for connection between different layers.

 The via hole 116 is formed in the first and second rigid parts 110 and 120 by using a laser drill, and then filled with a filler. The via hole 116 is preferably filled with ink of a resin type. After filling the via hole 116 with a filler, a circuit is formed by planarization by polishing and through double-sided exposure and etching.

Here, it is possible to maintain high bonding (bonding) due to the flatness of the filled via hole, maintain reliability by high conductivity of the product, and make it possible to reduce the thickness of the product. In addition, by filling the via hole 116 with a filler, the surface may be uneven, and the contact area of the via hole 116 may be increased to improve electrical contact and bonding characteristics with components mounted on the substrate. .

Finally, as shown in FIG. 2F, after forming the via hole 116, the coverlay 114 is applied to the dynamic layer plate 113 stacked on the outermost layer to form a rigid flexible printed circuit board. At this time, the outer surface may print a photo solder resist in place of the coverlay 114, and various modifications such as processing with a photosensitive solder resistor may be possible.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is intended by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalent claims.

According to the rigid flexible printed circuit board of the present invention, since a predetermined interval is formed in the flexible portion, the flexible flexible circuit board can be bent more flexibly, thereby improving the flex resistance of the circuit bent portion.

In addition, by filling the via hole with a filler, the surface may be uneven, and the contact area of the via hole may be increased to improve electrical contact and bonding characteristics with components mounted on the substrate.

Claims (4)

A first rigid part and a second rigid part formed by stacking a dynamic layer plate, a coverlay stacked on one surface of the dynamic layer plate, and a plurality of prepregs stacked on one surface of the coverlay; One end is connected to the dynamic lay plate of the first rigid part, the other end is connected to the coverlay of the first rigid part, and the other end is connected to the cover lay of the first rigid part, and the other end is connected to the cover lay of the second rigid part. In a rigid flexible printed circuit board comprising a flexible portion having a flexible coverlay, The flexible part is a layer formed by stacking each flexible dynamic laminate and a flexible coverlay Rigid flexible printed circuit board, characterized in that a predetermined gap is formed between. The method of claim 1, The first rigid portion and the second rigid portion, A rigid flexible printed circuit board comprising a via hole filled with a filler. The method of claim 2, The dynamic laminate and flexible dynamic laminate, A rigid flexible printed circuit board comprising a polyimide layer and a copper foil layer. The method of claim 3, wherein       The copper foil layer is a rigid flexible printed circuit board, characterized in that the circuit pattern is formed.

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