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KR20060010304A - Vacuum pump device for semiconductor manufacturing equipment - Google Patents

Vacuum pump device for semiconductor manufacturing equipment Download PDF

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Publication number
KR20060010304A
KR20060010304A KR1020040058936A KR20040058936A KR20060010304A KR 20060010304 A KR20060010304 A KR 20060010304A KR 1020040058936 A KR1020040058936 A KR 1020040058936A KR 20040058936 A KR20040058936 A KR 20040058936A KR 20060010304 A KR20060010304 A KR 20060010304A
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vacuum pump
semiconductor manufacturing
manufacturing equipment
pumping line
pressure
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서문민
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삼성전자주식회사
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)

Abstract

본 발명은 반도체 제조공정이 수행되는 공정챔버와 펌핑라인을 통해 연결되는 진공펌프와 상기 펌핑라인에 설치되어 상기 공정챔버와 상기 펌핑라인의 압력을 측정하는 압력 게이지 및 상기 진공펌프가 다운되었을 시 가동되는 보조펌프를 포함하는 것을 특징으로 하는 반도체 제조설비용 진공펌프장치에 관한 것이다.The present invention provides a vacuum pump connected to a process chamber and a pumping line in which a semiconductor manufacturing process is performed, and a pressure gauge installed at the pumping line and measuring pressure of the process chamber and the pumping line and operating when the vacuum pump is down. It relates to a vacuum pump device for a semiconductor manufacturing equipment, characterized in that it comprises an auxiliary pump.

또한, 상기 압력 게이지에서 압력 측정값을 감지하여 상기 진공펌프의 다운시 신호를 전달하는 시그날제어부와, 상기 시그날제어부에서 전기적 신호를 인가하여 밸브를 개폐시키는 역할을 하는 솔레노이드밸브를 포함하는 것을 특징으로 하는 반도체 제조설비용 진공펌프장치에 관한 것이다.The apparatus may further include a signal controller configured to sense a pressure measurement value in the pressure gauge and transmit a signal when the vacuum pump is down, and a solenoid valve serving to open and close the valve by applying an electrical signal from the signal controller. It relates to a vacuum pump device for semiconductor manufacturing equipment.

진공펌프Vacuum pump

Description

반도체 제조설비용 진공펌프장치{Vacuum Pump Equipment for Semiconductor Manufacturing Apparatus}      Vacuum Pump Equipment for Semiconductor Manufacturing Equipment {Vacuum Pump Equipment for Semiconductor Manufacturing Apparatus}

도 1은 본 발명에 따른 반도체 제조설비용 진공펌프장치의 구성을 도시한 개략도1 is a schematic diagram showing the configuration of a vacuum pump device for semiconductor manufacturing equipment according to the present invention

도 2는 본 발명에 따른 반도체 제조설비용 진공펌프장치의 진공펌프와 보조펌프의 배치도2 is a layout view of the vacuum pump and the auxiliary pump of the vacuum pump device for semiconductor manufacturing equipment according to the present invention

<주요 부분에 대한 부호의 설명><Description of the code for the main part>

10 : 진공펌프 20 : 펌핑라인10: vacuum pump 20: pumping line

40 : 압력 게이지 50 : 공정챔버40: pressure gauge 50: process chamber

110 : 보조펌프 120 : 시그날제어부 110: auxiliary pump 120: signal control unit

130 : 솔레노이드밸브130: solenoid valve

본 발명은 반도체 제조설비용 진공펌프장치에 관한 것으로, 보다 상세하게는 진공펌프가 다운되었을 경우 순간적인 역류현상이 발생하여 생성된 파우더로 인하여 웨이퍼가 손상되는 것을 막기 위해 보조펌프를 별도로 장착한 반도체 제조설비 용 진공펌프장치에 관한 것이다.The present invention relates to a vacuum pump device for semiconductor manufacturing equipment, and more particularly, a semiconductor having an auxiliary pump separately installed to prevent damage to the wafer due to powder generated by instantaneous backflow when the vacuum pump is down. It relates to a vacuum pump apparatus for manufacturing equipment.

일반적으로 반도체 디바이스(Device)는 순수 실리콘 웨이퍼(Silicon Wafer) 상에 소정 회로패턴(Pattern)을 갖는 박막이 복층으로 적층됨으로써 제조되는 바, 웨이퍼 제조공정에 의해 제조된 웨이퍼(Wafer)는 소정 회로패턴 박막의 적층을 위해 포토(Photo)공정, 식각공정, 박막증착공정 등과 같은 다수의 단위 공정을 반복적으로 수행하게 된다.In general, a semiconductor device is manufactured by stacking a thin film having a predetermined circuit pattern on a pure silicon wafer in multiple layers. A wafer manufactured by a wafer manufacturing process is a predetermined circuit pattern. In order to stack thin films, a plurality of unit processes such as a photo process, an etching process, and a thin film deposition process are repeatedly performed.

이때, 이와 같은 다수의 단위공정 중 대부분의 단위공정에서는 매우 정밀한 작업을 위해 진공상태에서 작업이 진행되고 있다.At this time, in most of the unit processes of such a plurality of unit processes are working in a vacuum state for a very precise operation.

이에, 반도체 디바이스를 제조하기 위한 각 단위공정에서는 저압이나 초 저압등 각 단위공정에 필요한 소정 압력을 연속적으로 적절하게 유지시켜 주는 것이 매우 중요하며, 이에 이를 위해 각 단위공정을 수행하는 반도체 제조설비는 각 챔버(Chamber)를 소정 압력으로 유지시켜 주는 진공펌프 등이 구비되고 있다.Therefore, in each unit process for manufacturing a semiconductor device, it is very important to continuously and continuously maintain a predetermined pressure necessary for each unit process such as low pressure or ultra low pressure. The vacuum pump etc. which hold each chamber at predetermined pressure are provided.

예를 들면, 저압공정에 사용되는 반도체 제조설비는, 공정챔버, 펌핑라인(Pumping line), 밸브(Valve) 및 진공펌프를 포함한다. For example, the semiconductor manufacturing equipment used in the low pressure process includes a process chamber, a pumping line, a valve and a vacuum pump.

상기 공정챔버 내부에 반도체 기판을 배치하고, 상기 공정챔버 내부의 압력을 낮춘 후, 반응기체를 주입하여 공정을 진행한다. The semiconductor substrate is disposed in the process chamber, the pressure in the process chamber is lowered, and then a reactor is injected to proceed with the process.

또한, 상기 진공펌프는 상기 챔버와 펌핑라인으로 연결되어 있으며, 상기 펌핑라인에는 설비를 점검하거나 보수하는 등 필요에 의해 상기 챔버를 상기 진공펌프로부터 격리시키도록 상기 펌핑라인을 개폐시키는 밸브가 설치되어 있다.In addition, the vacuum pump is connected to the chamber and the pumping line, the pumping line is provided with a valve for opening and closing the pumping line to isolate the chamber from the vacuum pump as necessary, such as to check or repair equipment have.

그러나, 이와 같은 진공펌프를 이용하는 공정의 경우 진공펌프가 다운이 되 게 되면, 순간적인 압력 역류현상(Back fill)이 발생하여 반응기체로 인한 파티클(Particle)이 발생하게 된다. However, in the case of using such a vacuum pump, when the vacuum pump goes down, instantaneous pressure backflow occurs and particles are generated due to the reactor body.

또한, 이와 같은 파티클로 인해 웨이퍼가 손상이 되는 문제점이 발생하게 된다.In addition, the particles may cause damage to the wafer.

따라서, 본 발명은 이와 같은 문제점을 감안한 것으로, 본 발명의 목적은 진공펌프가 사용되는 반도체 제조공정에서 보조펌프를 장착하여 진공펌프가 다운되었을 경우에도 공정챔버 내부에 진공을 유지함으로써 파티클로 인한 웨이퍼의 손상을 막는 보조펌프가 별도로 장착된 반도체 제조설비용 진공펌프장치를 제공함에 있다.Accordingly, the present invention has been made in view of such a problem, and an object of the present invention is to provide a wafer due to particles by maintaining a vacuum in the process chamber even when the vacuum pump is down by installing an auxiliary pump in a semiconductor manufacturing process in which a vacuum pump is used. It is to provide a vacuum pump device for a semiconductor manufacturing equipment equipped with a separate auxiliary pump to prevent damage.

이와 같은 목적을 구현하기 위한 본 발명 반도체 제조설비용 진공펌프장치는 전체적으로 보아 진공펌프와, 상기 진공펌프에서 나오는 압력을 전달하는 역할을 하는 펌핑라인과, 상기 진공펌프와 상기 펌핑라인의 압력을 측정하는 압력게이지와, 진공펌프의 다운시 가동하는 보조펌프로 구성되어 있다.Vacuum pump device for semiconductor manufacturing equipment according to the present invention for achieving the above object is a vacuum pump, a pumping line that serves to transfer the pressure from the vacuum pump as a whole, and the pressure of the vacuum pump and the pumping line is measured It consists of a pressure gauge, and an auxiliary pump that operates when the vacuum pump is down.

바람직하게 상기 보조펌프는 상기 공정챔버와 상기 펌핑라인의 압력이 소정 압력 이상으로 측정된 경우 시그날을 전달받는 시그날제어부(Signal Controller)와, 상기 보조펌프의 압력을 개방 또는 차단하는 에어밸브(Air Valve)와, 상기 시그날제어부에서 전기적 신호를 전달받아 에어밸브를 작동시키는 솔레노이드밸브(Solenoid Valve)로 구성된 것을 특징으로 한다. Preferably, the auxiliary pump includes a signal controller receiving a signal when the pressure of the process chamber and the pumping line is measured to be higher than a predetermined pressure, and an air valve for opening or blocking the pressure of the auxiliary pump. ), And a solenoid valve for operating an air valve by receiving an electrical signal from the signal control unit.                     

이하, 도면을 참조하여 본 발명 반도체 제조설비용 진공펌프장치의 바람직한 일실시예를 구체적으로 설명하면 다음과 같다.Hereinafter, a preferred embodiment of the vacuum pump apparatus for semiconductor manufacturing equipment of the present invention will be described in detail with reference to the drawings.

도 1을 참조하여 반도체 제조설비용 진공펌프장치를 구체적으로 설명하면, 먼저, 펌핑라인(20)의 일측에는 반도체 제조공정을 수행하는 공정챔버(50)가 연결되어 있고, 타측에는 공정챔버(50) 내부에 소정 압력을 일정하게 유지시켜 주는 진공펌프(10)가 연결된다. 상기 펌핑라인(20) 상에는 상기 진공펌프(10)와 펌핑라인(20) 내부의 압력을 측정하는 압력 게이지(Pressure Gauge)(40)가 설치된다.Referring to FIG. 1, a vacuum pump apparatus for semiconductor manufacturing equipment will be described in detail. First, a process chamber 50 for performing a semiconductor manufacturing process is connected to one side of a pumping line 20, and a process chamber 50 is connected to the other side. ) Is connected to a vacuum pump 10 for maintaining a predetermined pressure inside. On the pumping line 20, a pressure gauge 40 for measuring the pressure inside the vacuum pump 10 and the pumping line 20 is installed.

또한, 상기 진공펌프(10)의 다운시 순간적인 압력역류 현상이 발생하여 생성된 파우더로 인하여 웨이퍼가 손상되는 것을 방지하기 위해 가동되는 보조펌프(100)가 설치된다. 상기 보조펌프(100)는 상기 진공펌프(10)와 상기 공정챔버(50)의 사이에 설치된다. 또한, 상기 펌핑라인(20) 상에 설치된 상기 압력 게이지(40)에서 압력을 측정하여 소정 압력 이상으로 압력이 측정된 경우 시그날을 제어하는 시그날제어부(120)와, 상기 보조펌프(100)의 압력을 개방 또는 차단하는 에어밸브(150)와, 상기 시그날제어부(120)에서 전기적 신호를 전달받아 상기 에어밸브(150)를 작동시키는 역할을 하는 솔레노이드밸브(130)를 포함한다.In addition, an auxiliary pump 100 that is operated to prevent damage to the wafer due to powder generated by instantaneous pressure backflow occurs when the vacuum pump 10 is installed is installed. The auxiliary pump 100 is installed between the vacuum pump 10 and the process chamber 50. In addition, by measuring the pressure in the pressure gauge 40 installed on the pumping line 20, the signal control unit 120 for controlling the signal when the pressure is measured above a predetermined pressure and the pressure of the auxiliary pump 100 It includes an air valve 150 for opening or blocking the solenoid valve 130, which serves to operate the air valve 150 by receiving an electrical signal from the signal control unit 120.

이하, 본 발명 반도체 제조설비용 진공펌프장치의 작용 및 효과를 설명하면 다음과 같다.Hereinafter, the operation and effects of the vacuum pump apparatus for semiconductor manufacturing equipment of the present invention will be described.

진공상태를 요구하는 단위공정시 공정챔버(50)를 소정 압력으로 유지시켜 주는 진공펌프(10)가 다운되었을 경우 먼저 공정챔버(50)와 펌핑라인(20) 내부의 압력이 상승을 할 것이다. 이것을 압력 게이지(40)에서 측정하여 공정챔버(50) 내부 에서 압력이 일정 압력 이상으로 높아지면, 압력 게이지(40)가 스위치(Switch) 역할을 하여 시그날제어부(120)에 신호를 전달한다. 또한, 상기 시그날제어부(120)는 솔레노이드밸브(130)에 전기적 신호를 인가하여 에어밸브(150)를 개방하고, 보조펌프(100)를 가동하여 배기가스와 반응 분산물이 역류하여 웨이퍼들을 손상시키는 것을 방지한다.When the vacuum pump 10 that maintains the process chamber 50 at a predetermined pressure in a unit process requiring a vacuum state is down, the pressure inside the process chamber 50 and the pumping line 20 will first increase. When the pressure is measured by the pressure gauge 40 and the pressure in the process chamber 50 rises above a predetermined pressure, the pressure gauge 40 serves as a switch and transmits a signal to the signal controller 120. In addition, the signal controller 120 applies an electrical signal to the solenoid valve 130 to open the air valve 150, and operates the auxiliary pump 100 to reverse the exhaust gas and the reaction dispersion to damage the wafers. To prevent them.

한편, 진공펌프(10)와 보조펌프(100)의 배치를 도 2를 참조하여 살펴보면, 하나의 공정설비에 1대의 보조펌프를 장착하면 비용이 많이 들게 되는데, 여러 개의(5~10대) 설비에 하나의 보조펌프를 사용을 하면 비용이 적게 들 뿐만 아니라 보조펌프 장착으로 인한 웨이퍼의 제조 수율을 높일 수 있다.On the other hand, referring to the arrangement of the vacuum pump 10 and the auxiliary pump 100 with reference to Figure 2, if one auxiliary pump is installed in one process equipment is expensive, several (5 ~ 10) equipment The use of a single subpump in a low cost is not only costly, but also increases the manufacturing yield of the wafer due to the subpump installed.

이상에서 설명한 바와 같이, 본 발명은 진공펌프가 다운되었을 경우 보조펌프를 가동시킴으로써 공정챔버내의 진공상태를 유지시켜 웨이퍼가 손상되는 것을 방지하여 웨이퍼의 제조수율을 높이는 효과가 있다.As described above, the present invention has an effect of increasing the manufacturing yield of the wafer by maintaining the vacuum in the process chamber to prevent damage to the wafer by operating the auxiliary pump when the vacuum pump is down.

Claims (2)

반도체 제조공정이 수행되는 공정챔버와 펌핑라인을 통해 연결되는 진공펌프;A vacuum pump connected through a process chamber in which a semiconductor manufacturing process is performed and a pumping line; 상기 펌핑라인에 설치되어 상기 공정챔버와 상기 펌핑라인의 압력을 측정하는 압력 게이지; 및A pressure gauge installed in the pumping line to measure pressures of the process chamber and the pumping line; And 상기 진공펌프가 다운되었을 시 가동되는 보조펌프를; 포함하는 것을 특징으로 하는 반도체 제조설비용 진공펌프장치.An auxiliary pump operated when the vacuum pump is down; Vacuum pump device for semiconductor manufacturing equipment comprising a. 제 1항에 있어서,The method of claim 1, 상기 압력 게이지에서 압력 측정값을 감지하여 상기 진공펌프의 다운시 신호를 전달하는 시그날제어부와, 상기 시그날제어부에서 전기적 신호를 인가하여 밸브를 개폐시키는 역할을 하는 솔레노이드밸브를 포함하는 것을 특징으로 하는 반도체 제조설비용 진공펌프장치.And a solenoid valve that senses a pressure measurement value at the pressure gauge and transmits a signal when the vacuum pump is down, and a solenoid valve serving to open and close the valve by applying an electrical signal from the signal controller. Vacuum pump device for manufacturing equipment.
KR1020040058936A 2004-07-27 2004-07-27 Vacuum pump device for semiconductor manufacturing equipment Withdrawn KR20060010304A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108486543A (en) * 2018-03-02 2018-09-04 惠科股份有限公司 Base plate film forming machine table and using method
KR20210000526A (en) * 2019-06-25 2021-01-05 오브유니티 주식회사 Dust collector and control method therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108486543A (en) * 2018-03-02 2018-09-04 惠科股份有限公司 Base plate film forming machine table and using method
US11466363B2 (en) 2018-03-02 2022-10-11 HKC Corporation Limited Substrate film forming machine table and usage method
KR20210000526A (en) * 2019-06-25 2021-01-05 오브유니티 주식회사 Dust collector and control method therefor

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