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KR20090040637A - Camera module and its manufacturing method - Google Patents

Camera module and its manufacturing method Download PDF

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Publication number
KR20090040637A
KR20090040637A KR1020070106091A KR20070106091A KR20090040637A KR 20090040637 A KR20090040637 A KR 20090040637A KR 1020070106091 A KR1020070106091 A KR 1020070106091A KR 20070106091 A KR20070106091 A KR 20070106091A KR 20090040637 A KR20090040637 A KR 20090040637A
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image sensor
housing
reflowable
circuit board
camera module
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KR101417017B1 (en
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정영근
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엘지이노텍 주식회사
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0012—Arrays characterised by the manufacturing method
    • G02B3/0018—Reflow, i.e. characterized by the step of melting microstructures to form curved surfaces, e.g. manufacturing of moulds and surfaces for transfer etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)

Abstract

본 발명은 카메라모듈 및 그 제작 방법에 관한 것으로서, 리플로어블 적층 렌즈를 이미지센서 표면에 부착하고 하우징을 표면실장하는 특징을 가진다. 본 발명은 광이미지를 전기적신호로 변환하는 이미지센서와, 다수의 렌즈 및 적외선필터가 레이어를 이루며 적층되어 상기 이미지센서 상부면에 부착되는 리플로어블 적층 렌즈와, 상기 이미지센서 및 리플로어블 적층렌즈의 외곽을 감싸 보호하는 하우징과, 상기 이미지센서의 하부면이 솔더링 표면실장되며, 상기 하우징이 솔더링 표면실장되는 인쇄회로기판을 포함한다.The present invention relates to a camera module and a method of manufacturing the same, and has a feature of attaching a reflowable laminated lens to an image sensor surface and surface mounting a housing. The present invention provides an image sensor for converting an optical image into an electrical signal, a plurality of lenses and an infrared filter stacked in a layer and attached to an upper surface of the image sensor, and the image sensor and the reflowable stack. A housing surrounding and protecting the outside of the lens, and a lower surface of the image sensor is soldered surface-mounted, and the housing includes a printed circuit board that is soldered surface-mounted.

Description

카메라모듈 및 그 제작 방법{Camera module and method for manufacturing the same}Camera module and method for manufacturing the same

본 발명은 카메라모듈 및 그 제작 방법에 관한 것이다.The present invention relates to a camera module and a manufacturing method thereof.

일반적으로 각종 단말기에 장착되는 카메라모듈은 도 1에 도시와 같이 렌즈 어셈블리(10)와, 홀더(11)와, 적외선필터(12)와, 이미지센서(13), 수동소자(14), 및 인쇄회로기판(15) 등으로 구성되어 피사체의 광이미지를 렌즈 어셈블리(11)가 수광받아 적외선필터(12)로 전달하고, 적외선필터(12)는 수광된 광이미지에서 적외선을 차단한 후 이미지센서(13)로 조사하게 되며, 이미지센서(13)는 조사된 광이미지를 전기적인 신호로 변환하여 출력하는 구조로 구성된다. 이때, 렌즈 어셈블리(11)는 이미지센서(13)와의 거리조절을 통해 초점을 맞추어 가장 선명한 이미지를 얻을 수 있도록 포커싱(Focusing) 작업을 수행할 수 있도록 구성되어 있다.In general, a camera module mounted on various terminals has a lens assembly 10, a holder 11, an infrared filter 12, an image sensor 13, a passive element 14, and printing as shown in FIG. It consists of a circuit board 15 or the like, the lens assembly 11 receives the optical image of the subject received by the infrared filter 12, the infrared filter 12 blocks the infrared light from the received optical image and then the image sensor ( 13), the image sensor 13 is configured to convert the irradiated optical image into an electrical signal to output. At this time, the lens assembly 11 is configured to perform a focusing (Focusing) operation to obtain the sharpest image by adjusting the focus by adjusting the distance with the image sensor (13).

종래 카메라모듈의 제조공정을 간단히 살펴 보면, 인쇄회로기판(15;PCB) 위에 각종 수동 부품과 단말기 본체와의 결합을 위한 커넥터(16)를 실장한다. 그 후 이미지센서(13)를 인쇄회로기판(15) 위에 실장 후 이미지센서(13)와 인쇄회로기판 (15)간의 전기적인 연결을 위하여 와이어 본딩(wire bonding)을 진행한다. 적외선 필터(12)가 내장된 홀더(11)를 인쇄회로기판(15) 위에 하우징(housing)함으로써, 모듈 내부 부품을 보호하고 불필요한 빛을 차단한다. 그리고 그 후 렌즈 어셈블리(10)를 홀더(11)에 체결 후 규격에 맞게 포커스를 조정한 후 렌즈를 고정시킨다.Looking briefly at the manufacturing process of the conventional camera module, the connector 16 for coupling the various passive components and the terminal body is mounted on the printed circuit board 15 (PCB). Thereafter, the image sensor 13 is mounted on the printed circuit board 15, and wire bonding is performed for electrical connection between the image sensor 13 and the printed circuit board 15. By housing the holder 11 incorporating the infrared filter 12 on the printed circuit board 15, it protects the internal components of the module and blocks unnecessary light. Then, after the lens assembly 10 is fastened to the holder 11, the focus is adjusted to a standard, and then the lens is fixed.

상기에서 살핀 바와 같이 종래의 카메라모듈의 패키지 공정은, 인쇄회로기판 위에 수동 부품 실장을 위한 표면칩 실장(Surface Chip Mount) 공정, 인쇄회로기판 위에 이미지센서를 실장하기 위한 다이 본딩(Die Bonding) 공정, 이미지센서와 인쇄회로기판 간의 전기적 연결을 위한 와이어 본딩(Wire Bonding) 공정, 이미지센서의 보호와 렌즈 체결을 위한 하우징 실장(Housing Mount) 공정, 기준 해상력을 갖추기 위한 포커스 조절 공정 등의 많은 공정을 거쳐야 하며, 특히, 상기 하우징 실장 공정에서는 일반적으로 사용되는 플라스틱 재질의 홀더가 사용되는데, 주로 열경화성 에폭시(epoxy)가 접착제로 사용됨에 따라 별도의 경화 과정이 필요하다.As described above, the packaging process of a conventional camera module includes a surface chip mounting process for mounting passive components on a printed circuit board and a die bonding process for mounting an image sensor on a printed circuit board. Many processes such as wire bonding process for the electrical connection between the image sensor and the printed circuit board, housing mounting process to protect the image sensor and fastening the lens, and focus adjustment process to achieve the standard resolution In particular, in the housing mounting process, a holder of a plastic material, which is generally used, is used. As the thermosetting epoxy is mainly used as an adhesive, a separate curing process is required.

그런데, 상기에서 설명한 카메라모듈의 패키지 공정은 이미지 센서의 마운팅(mounting) 후, 미립자(particle)에 의한 오염을 피할 수 없기에 미립자 제거를 위해 많은 공정을 거쳐야 하는 문제가 있다. 예컨대, 세정공정, 공정라인 클린 룸(clean room) 실현 등을 이루어야하는 불편이 있다.However, the package process of the camera module described above has a problem that after the mounting of the image sensor, contamination by the particles cannot be avoided, so that many processes must be performed to remove the particles. For example, it is inconvenient to achieve a cleaning process, a process line clean room, and the like.

본 발명은 카메라모듈의 패키지 제조 시에 그 제작 공정을 간소히 할 수 있는 방안을 제안한다.The present invention proposes a method that can simplify the manufacturing process when manufacturing a package of the camera module.

본 발명은 광이미지를 전기적신호로 변환하는 이미지센서와, 다수의 렌즈 및 적외선필터가 레이어를 이루며 적층되어 상기 이미지센서 상부면에 부착되는 리플로어블 적층 렌즈와, 상기 이미지센서 및 리플로어블 적층렌즈의 외곽을 감싸 보호 하는 하우징과, 상기 이미지센서의 하부면이 솔더링 표면실장되며, 상기 하우징이 솔더링 표면실장되는 인쇄회로기판을 포함한다.The present invention provides an image sensor for converting an optical image into an electrical signal, a plurality of lenses and an infrared filter stacked in a layer and attached to an upper surface of the image sensor, and the image sensor and the reflowable stack. A housing surrounding and protecting the outer periphery of the lens, and a lower surface of the image sensor is a soldering surface mounted, the housing includes a printed circuit board on the soldering surface mounted.

또한, 상기 리플로어블 적층 렌즈 및 하우징은 내열성의 재질로 이루어지며, 상기 이미지센서 상부면에 부착되는 리플로어블 적층 렌즈는, 투명 접착제에 의해 부착된다.The reflowable laminated lens and the housing may be made of a heat resistant material, and the reflowable laminated lens attached to the upper surface of the image sensor may be attached by a transparent adhesive.

또한, 상기 인쇄회로기판은, 상기 이미지센서가 솔더링되는 지점인 이미지센서 패드와, 상기 하우징이 솔더링되는 지점인 하우징 패드와, 수동소자가 실리는 수동소자 패드를 포함한다.The printed circuit board may include an image sensor pad at which the image sensor is soldered, a housing pad at which the housing is soldered, and a passive element pad on which passive devices are loaded.

또한, 상기 하우징 패드는 상기 인쇄회로기판의 외곽 둘레를 따라 형성됨을 특징으로 한다.In addition, the housing pad is characterized in that formed along the outer periphery of the printed circuit board.

본 발명은, 이미지센서가 표면실장될 이미지센서 패드와, 하우징이 표면실장될 하우징 패드가 인쇄회로기판에 형성되는 과정과, 상기 이미지센서 패드에 이미지센서가 솔더링 표면실장되는 과정과, 다수의 렌즈 및 적외선필터가 레이어를 이루며 적층된 리플로어블 적층 렌즈가 상기 이미지센서 상부면에 부착되는 과정과, 상기 하우징이 상기 인쇄회로기판의 하우징 패드에 솔더링 표면실장되는 과정을 포함한다.The present invention provides a process for forming an image sensor pad on which an image sensor is to be surface-mounted, a housing pad on which a housing is to be surface-mounted on a printed circuit board, a process of surface-soldering an image sensor on the image sensor pad, and a plurality of lenses. And attaching a reflowable laminated lens in which an infrared filter is layered and attached to an upper surface of the image sensor, and mounting the soldering surface on a housing pad of the printed circuit board.

본 발명은 카메라모듈의 패키지 방식을 단순화함으로써, 미립자에 의한 오염 가능성을 획기적으로 줄이고 생산 단가를 최소화할 수 있는 효과가 있다.The present invention can simplify the package method of the camera module, it is possible to significantly reduce the possibility of contamination by the particles and minimize the production cost.

이하, 본 발명의 바람직한 실시 예들의 상세한 설명이 첨부된 도면들을 참조하여 설명될 것이다. 하기에서 각 도면의 구성요소들에 참조부호를 부가함에 있어 동일한 구성요소들에 대해서는 비록 다른 도면상에 표시되더라도 가능한 한 동일한 부호를 가지도록 하고 있음에 유의해야 한다. Hereinafter, the detailed description of the preferred embodiments of the present invention will be described with reference to the accompanying drawings. In the following description of the reference numerals to the components of the drawings it should be noted that the same reference numerals as possible even if displayed on different drawings.

도 2는 본 발명의 실시 예에 따라 표면실장을 통해 패키징되는 카메라모듈의 단면도이고 도 3은 상기 카메라모듈의 사시도이다.2 is a cross-sectional view of a camera module packaged through a surface mount according to an embodiment of the present invention and Figure 3 is a perspective view of the camera module.

본 발명의 카메라모듈은 표면실장(SMT) 공정에서 모든 패키지 공정이 끝나 제작되는 특징을 가지는데, 이를 위하여 렌즈(23)는 리플로어블(reflowable)해야 하며, 홀더 역할을 하는 케이스(22;이하, '하우징'이라 함)의 경우 솔더(solder)를 사용하여 인쇄회로기판과 고정한다.The camera module of the present invention has a feature that all package processes are finished in the surface mount (SMT) process, and for this purpose, the lens 23 must be reflowable and has a case 22 serving as a holder. , 'Housing') is fixed to the printed circuit board using solder.

상기 리플로어블된 렌즈는 리플로어블 적층 렌즈(23;reflowable stacked lens)를 말하는 것으로서, 여러 층의 렌즈 및 필터를 적층(stack)시켜 제작된 렌즈이다. 종래에는 주로 내열성이 떨어진 렌즈를 사용함에 따라 렌즈 체결 상태에서의 리플로우(reflow)나 경화가 제한이 되었다. 하지만, 최근에는 몇몇 업체에서 리플로어블(reflowable)한 렌즈를 개발 생산하고 있으며, 동시에 웨이퍼 레벨 렌즈(wafer level lens) 개념이 도입되면서, 여러 층의 렌즈 및 필터를 적층한 리플로어블(reflowable) 적층 렌즈를 제작할 수 있게 되었다. The reflowable lens refers to a reflowable stacked lens 23, and is a lens manufactured by stacking lenses and filters of various layers. Conventionally, reflow or hardening in a lens fastening state has been limited by mainly using lenses having low heat resistance. Recently, however, several companies have developed and produced reflowable lenses, and at the same time, the introduction of the wafer level lens concept has allowed the reflowable layer of lenses and filters to be stacked. A laminated lens can be manufactured.

상기 리플로어블 적층 렌즈(23)에는 기존에 사용되던 적외선필터가 리플로어 블 적층 렌즈의 레이어(layer)에 포함되며, 또한, 다수의 렌즈가 레이어(layer)로서 적층되어 있다. 이러한 리플로어블 적층 렌즈(23)는 이미지센서(24)의 상부면에 마운팅 부착되는데, 투명 접착제 등을 통해 부착된다.In the reflowable laminated lens 23, an infrared filter that has been used in the past is included in a layer of the reflowable laminated lens, and a plurality of lenses are stacked as a layer. This reflowable laminated lens 23 is attached to the upper surface of the image sensor 24, it is attached through a transparent adhesive or the like.

본 발명은 이러한 리플로어블 적층 렌즈(23)를 사용하여 표면실장(SMT) 공정을 수행한다. 따라서 종래의 카메라모듈의 패키지 제작 시에는 패키징(packaging) 공차 및 부품 공차에 의해 포커싱 과정이 필요하지만, 본 발명처럼 이미지센서(24) 위에 바로 마운팅 부착되는 리플로어블 적층 렌즈(23)는 포커싱을 할 필요가 없다. The present invention performs the surface mount (SMT) process using the reflowable laminated lens 23. Therefore, when manufacturing a package of a conventional camera module, a focusing process is required by a packaging tolerance and a component tolerance, but the reflowable laminated lens 23 mounted directly on the image sensor 24 as in the present invention is focused. There is no need to do it.

인쇄회로기판(20)에는 이미지센서 및 하우징이 솔더링(21;soldering)되어 표면 실장된다. 상기 솔더링(21)은 이미지센서(24)와 하우징(22)를 인쇄회로기판(20)의 상부면에 표면실장하도록 하는 납땜으로서, 이미지센서(24) 및 하우징(22)이 표면실장(SMT) 공정에 의하여 인쇄회로기판(20)에 솔더링 실장된다.The image sensor and the housing are soldered to the printed circuit board 20 to be surface mounted. The soldering 21 is soldered to surface mount the image sensor 24 and the housing 22 on the upper surface of the printed circuit board 20. The image sensor 24 and the housing 22 are surface mounted (SMT). It is soldered and mounted on the printed circuit board 20 by the process.

한편, 상기 리플로어블 적층 렌즈(23) 및 하우징(22)은 내열성을 가지는 재료로 구현되어, 솔더링 표면실장 시에 그 온도 제한을 받지 않는다.Meanwhile, the reflowable laminated lens 23 and the housing 22 are made of a material having heat resistance, and thus are not subject to temperature limitations when soldering the surface.

도 4는 본 발명의 실시 예에 따라 표면실장을 통해 패키징되는 카메라모듈의 제작 과정을 도시한 플로차트이다.4 is a flowchart illustrating a manufacturing process of a camera module packaged through surface mounting according to an embodiment of the present invention.

우선, 인쇄회로기판(20)에 이미지센서 및 하우징이 솔더링되는 패드(51,52,53)를 형성하며 아울러 수동소자가 부착될 패드를 형성(S41)한다. 상기 패드에는, 이미지센서가 솔더링되는 위치인 이미지센서 패드(51), 하우징이 솔더링 되는 위치인 하우징 패드(53), 수동소자가 솔더링되는 위치인 수동소자 패드(52)를 포함한다. 특히, 상기 하우징 패드(53)는 인쇄회로기판(20)의 외곽 둘레에 솔더 인쇄되어 있어 하우징(22)이 솔더링되어 표면실장된다.First, pads 51, 52, and 53 on which the image sensor and the housing are soldered are formed on the printed circuit board 20, and pads to which the passive element is attached are formed (S41). The pad includes an image sensor pad 51 where the image sensor is soldered, a housing pad 53 where the housing is soldered, and a passive element pad 52 where the passive element is soldered. In particular, the housing pad 53 is solder printed around the outer periphery of the printed circuit board 20 so that the housing 22 is soldered and surface mounted.

상기와 같이 인쇄회로기판(20)에 패드를 형성한 후에는, 이미지센서(24)를 이미지센서 패드에 솔더링하여 표면실장하고, 아울러 수동소자(25)를 수동소자 패드에 실장하는 과정을 가진다(S42). 그 후, 다수의 렌즈 및 적외선필터가 적층된 리플로어블 적층 렌즈(23)를 이미지센서 위에 마운팅시킨다(S43). 상기 이미지센서(24) 위에 마운팅 부착되는 리플로어블 적층 렌즈(23)는 투명 접착제 등에 의하여 부착될 수 있다.After the pad is formed on the printed circuit board 20 as described above, the image sensor 24 is surface-mounted by soldering the image sensor pad, and the passive element 25 is mounted on the passive element pad ( S42). Thereafter, the reflowable laminated lens 23 in which the plurality of lenses and the infrared filter are stacked is mounted on the image sensor (S43). The reflowable laminated lens 23 mounted on the image sensor 24 may be attached by a transparent adhesive or the like.

상기와 같이 리플로어블 적층 렌즈(23)가 이미지센서(24) 위에 마운팅된 후에는, 하우징(22)을 인쇄회로기판(20)에 표면실장(S44)하여, 이미지센서(24) 및 리플로어블 적층 렌즈(23) 및 수동소자(25)를 보호한다. 상기 하우징(22)이 인쇄회로기판(20)에 표면실장되는 영역은 인쇄회로기판의 외곽 둘레의 하우징 패드(53) 위치에 솔더링되어 표면실장된다.After the reflowable laminated lens 23 is mounted on the image sensor 24 as described above, the housing 22 is surface-mounted (S44) on the printed circuit board 20, so that the image sensor 24 and the reflower are mounted. The black laminated lens 23 and the passive element 25 are protected. The area where the housing 22 is surface-mounted on the printed circuit board 20 is soldered to the housing pad 53 at the periphery of the printed circuit board to be surface-mounted.

상술한 본 발명의 설명에서는 구체적인 실시 예에 관해 설명하였으나, 여러 가지 변형이 본 발명의 범위에서 벗어나지 않고 실시될 수 있다. 따라서 본 발명의 특허 범위는 상기 설명된 실시 예에 의하여 정할 것이 아니고 특허청구범위뿐 아니라 균등 범위에도 미침은 자명할 것이다.In the above description of the present invention, specific embodiments have been described, but various modifications may be made without departing from the scope of the present invention. Therefore, the scope of the present invention is not to be determined by the embodiments described above, but will be apparent in the claims as well as equivalent scope.

도 1은 종래의 카메라모듈 단면도이다.1 is a cross-sectional view of a conventional camera module.

도 2는 본 발명의 실시 예에 따른 카메라모듈의 단면도이다.2 is a cross-sectional view of the camera module according to an embodiment of the present invention.

도 3은 본 발명의 실시 예에 따른 카메라모듈의 외곽 사시도이다.3 is an outer perspective view of the camera module according to an embodiment of the present invention.

도 4는 본 발명의 실시 예에 따른 카메라모듈의 제조 공정을 도시한 플로차트이다.4 is a flowchart illustrating a manufacturing process of a camera module according to an exemplary embodiment of the present invention.

Claims (8)

광이미지를 전기적신호로 변환하는 이미지센서;An image sensor for converting an optical image into an electrical signal; 다수의 렌즈 및 적외선필터가 레이어를 이루며 적층되어 상기 이미지센서 상부면에 부착되는 리플로어블 적층 렌즈;A reflowable laminated lens in which a plurality of lenses and infrared filters are stacked in a layer and attached to an upper surface of the image sensor; 상기 이미지센서 및 리플로어블 적층렌즈의 외곽을 감싸 보호하는 하우징; A housing surrounding and protecting an outer portion of the image sensor and the reflowable laminated lens; 상기 이미지센서의 하부면이 솔더링 표면실장되며, 상기 하우징이 솔더링 표면실장되는 인쇄회로기판A printed circuit board on which the lower surface of the image sensor is mounted on the soldering surface, and the housing is soldered on the surface 를 포함하는 카메라모듈.Camera module comprising a. 제1항에 있어서, 상기 리플로어블 적층 렌즈 및 하우징은 내열성의 재질로 이루어지는 카메라모듈.The camera module of claim 1, wherein the reflowable laminated lens and the housing are made of a heat resistant material. 제1항에 있어서, 상기 이미지센서 상부면에 부착되는 리플로어블 적층 렌즈는, 투명 접착제에 의해 부착되는 카메라모듈.The camera module of claim 1, wherein the reflowable laminated lens attached to the upper surface of the image sensor is attached by a transparent adhesive. 제1항에 있어서, 상기 인쇄회로기판은, The method of claim 1, wherein the printed circuit board, 상기 이미지센서가 솔더링되는 지점인 이미지센서 패드;An image sensor pad which is a point at which the image sensor is soldered; 상기 하우징이 솔더링되는 지점인 하우징 패드;A housing pad at which the housing is soldered; 수동소자가 실리는 수동소자 패드Passive element pads with passive elements 를 포함하는 카메라모듈.Camera module comprising a. 제1항에 있어서, 상기 하우징 패드는 상기 인쇄회로기판의 외곽 둘레를 따라 형성되는 카메라모듈. The camera module of claim 1, wherein the housing pad is formed along an outer periphery of the printed circuit board. 이미지센서가 표면실장될 이미지센서 패드와, 하우징이 표면실장될 하우징 패드가 인쇄회로기판에 형성되는 과정;Forming an image sensor pad on which the image sensor is to be surface mounted, and a housing pad on which the housing is to be surface mounted on a printed circuit board; 상기 이미지센서 패드에 이미지센서가 솔더링 표면실장되는 과정;Soldering the surface sensor to the image sensor pad; 다수의 렌즈 및 적외선필터가 레이어를 이루며 적층된 리플로어블 적층 렌즈가 상기 이미지센서 상부면에 부착되는 과정;Attaching a reflowable laminated lens in which a plurality of lenses and infrared filters are layered and attached to an upper surface of the image sensor; 상기 하우징이 상기 인쇄회로기판의 하우징 패드에 솔더링 표면실장되는 과정A process of soldering the surface of the housing to the housing pad of the printed circuit board 을 포함하는 카메라모듈 제조 방법.Camera module manufacturing method comprising a. 제6항에 있어서, 상기 리플로어블 적층 렌즈는 내열성 재료로 이루어지는 카메라모듈 제조 방법.The method of claim 6, wherein the reflowable laminated lens is made of a heat resistant material. 제6항에 있어서, 상기 하우징 패드는 인쇄회로기판의 외곽 둘레를 따라 형성되는 카메라모듈 제조 방법.The method of claim 6, wherein the housing pad is formed along an outer periphery of the printed circuit board.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140109756A (en) * 2013-03-06 2014-09-16 삼성전기주식회사 Lens module and manufacturing method for the same
KR20220068888A (en) * 2020-11-19 2022-05-26 비스에라 테크놀러지스 컴퍼니 리미티드 Optical structure

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JP2004139035A (en) * 2002-09-25 2004-05-13 Seiko Epson Corp Lens with infrared cut filter, method of manufacturing the same, and small camera
TWI437301B (en) * 2006-02-03 2014-05-11 Hitachi Maxell Camera module

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140109756A (en) * 2013-03-06 2014-09-16 삼성전기주식회사 Lens module and manufacturing method for the same
KR20220068888A (en) * 2020-11-19 2022-05-26 비스에라 테크놀러지스 컴퍼니 리미티드 Optical structure
US12174405B2 (en) 2020-11-19 2024-12-24 Visera Technologies Company Limited Optical structure having polymer-covered protrusions contacting bandpass filter

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