KR20100045136A - Optical modulator package and method thereof - Google Patents

Abstract

An optical modulator package including an optical modulator and a driver circuit for driving the optical modulator, the optical modulator package comprising: a substrate, a first insulating layer coated on the substrate, a first wiring printed on the first insulating layer, a first insulating layer, and a first insulating layer; A second insulating layer coated on the wiring, the second wiring printed on the horizontal position different from the horizontal position of the first wiring on the second insulating layer, and electrically connected to the first wiring or the second wiring, and the optical modulator or the driver circuit. An optical modulator package is provided that includes a connected bump. According to the present invention, it is possible to ensure the electrical separation and the minimization of the space at the same time in the interconnection between the components inside the optical modulator package.

Description

Optical modulator package and method for manufacturing same

The present invention relates to an optical modulator package and a method of manufacturing the same, and more particularly, to an optical modulator package and a method for manufacturing the same, which are printed by separating the wiring for electrically connecting the elements inside the optical modulator package in a multi-layered structure. will be.

MEMS (Micro-Electro Mechanical System) is a micro-mechanical electronic system that manufactures mechanical structures with a diameter of several um using micromachining technology, and refers to a system that drives electrical signals by applying electrical signals to the mechanical structures. This MEMS technology is becoming the most important factor in miniaturizing the core modules in various technology fields which are miniaturized.

The display field is no exception. In particular, in order to modulate the light input from the light source in the field of projection display, an optical modulator that modulates a luminance value by moving a fine optical element is representative.

An optical modulator is an element or device that modulates incident light by diffracting or reflecting incident light, and is an essential component in a projection display apparatus.

Projection display technology is a next-generation display technology that can solve problems such as screen size of a conventional PDP or LCD display, and such next-generation display technology or optical modulators are widely used in stationary or portable devices as well as virtual display devices that are currently growing rapidly. The scope of application is expanding.

Therefore, securing core technologies such as the manufacturing process of the projection display, the optical system design, the circuit design, and the ASIC technology is a very important task. In particular, when the projection display technology is mounted on a mobile phone instead of a general display device, various electronic components mounted on the mobile phone should be light and small in accordance with the trend toward miniaturization, high functionality, and convergence of mobile phones.

Therefore, optical modulators, which are essential for projection display devices, must also be miniaturized to meet the changing trend of mobile phones. In addition, the entire optical modulator package including a driver circuit for driving the optical modulator MEMS needs to be miniaturized.

As the optical modulator, the driver circuit, and the like, which are components inside the optical modulator package, are miniaturized, it is very important to secure electrical connections between these components. For example, if a few 1cm optical modulator includes hundreds or thousands of fine MEMS drivers, each of them must be connected to a driver circuit in order to transmit electrical signals to these MEMS drivers. That is, in the case of the optical modulator, since the light must be modulated for each pixel of the image irradiated on the screen, it is necessary for each micro driver to be driven independently.

Conventionally, ACF has been used to connect hundreds of MEMS drivers and driver circuits. In other words, the wiring was printed on the anisotropic conductive monolayer film to connect the MEMS driver and the driver circuit.

However, since the wirings for connecting the hundreds of MEMS driving units are printed in a single layer, it is difficult to secure the spacing between the wirings, causing various problems.

First, since several hundreds of MEMS driving units must be connected to each other, and hundreds of wirings must be finely printed, a short circuit can occur between each wiring, which causes serious problems in the optical modulation function of the optical modulator.

In addition, even if a short circuit does not occur because the wiring is all printed on a single layer, noise may occur due to the interference between the wirings, which may also cause a malfunction of the optical modulator.

For this reason, conventionally, the wiring is printed on the ACF single-layer film, and the gap between the wirings is sufficiently secured. This method is not a perfect solution to the above-mentioned problem, but also devotes too much space to the interconnection. The problem arises of increasing the overall size of the optical modulator package.

Accordingly, the present invention has been made to solve the above problems, an optical modulator package that can be electrically connected to each device by separating and printing the wiring for electrically connecting the elements inside the optical modulator package layer by layer in a multi-layer structure and The purpose is to provide a method of manufacturing the same.

Other objects of the present invention will become more apparent through the preferred embodiments described below.

According to an aspect of the present invention for achieving the above object, there is provided an optical modulator package.

According to an embodiment of the present invention, an optical modulator package including an optical modulator and a driver circuit for driving the optical modulator, comprising: a substrate; A first insulating layer coated on the substrate; A first wiring printed on the first insulating layer; A second insulating layer coated on the first insulating layer and the first wiring; A second wiring printed on the second insulating layer at a horizontal position different from a horizontal position of the first wiring; And a bump electrically connected to the first wiring or the second wiring, the bump being connected to the optical modulator or the driver circuit.

The first wiring and the second wiring may each have a plurality, and the first wiring and the second wiring may be alternately printed in a horizontal position.

The bump may include a first bump connected to the first wiring and a second bump connected to the second wiring, wherein the first bump and the second bump may be formed in a zigzag position horizontally with each other.

The optical modulator includes a plurality of micro-driving units configured to move light to a plurality of ribbon structures and the ribbon structure, respectively, wherein the first bumps and the second bumps are respectively connected to different micro-driving units of the plurality of micro-driving units. Can be.

The first insulating layer and the second insulating layer may be coated with different materials.

According to another aspect of the present invention for achieving the above object, there is provided an optical modulator package manufacturing method.

According to an embodiment of the present invention, there is provided a method of manufacturing an optical modulator package including an optical modulator and a driver circuit for driving the optical modulator, the method comprising: applying a first insulating layer on a substrate; Printing a first wiring on the first insulating layer; Applying a second insulating layer on the first insulating layer and the first wiring; Printing a second wiring on the second insulating layer at a horizontal position different from a horizontal position of the first wiring; And electrically connecting a bump for connection with the optical modulator or the driver circuit to the first wiring or the second wiring.

The connecting of the bumps may include removing a portion of the second insulating layer to open a portion of the first wiring; And connecting a bump to a part of the open first wiring.

As described above, according to the present invention, it is possible to simultaneously ensure electrical separation and minimization of space in the interconnection between components within the optical modulator package.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers such as first and second may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component. And / or < / RTI > includes any combination of a plurality of related listed items or any of a plurality of related listed items.

When a component is said to be "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but other components may be present in the middle. It should be understood. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, and in describing the present invention with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals regardless of the reference numerals. Duplicate explanations will be omitted.

1A is a cross-sectional view of a connection part connecting an optical modulator inside an optical modulator package according to an exemplary embodiment of the present invention.

Referring to FIG. 1A, a connection part includes a substrate 200, a first insulating layer 210, a second insulating layer 220, a first wiring 101, a second wiring 100 and 102, and a bump 150. , 152). The illustrated connecting portion shows only a part of the connecting portion, and there may further be hundreds or thousands of wirings 100, 101, and 102 in the left and right directions of the drawing. However, only a portion is shown in order to explain the layered wiring structure of the multilayer structure of the present invention.

The first wiring 101 is present between the first insulating layer 210 and the second insulating layer 220 on the substrate 200. Therefore, the first wiring 101 is covered by the second insulating layer 220 and is not exposed to the outside. However, this is due to the cross-sectional position of the connecting portion, and at the other end of the connecting portion, a part of the second insulating layer 220 is removed to expose the first wiring. This will be described later with reference to FIG. 1B. SiO 2, PE-SiO 2, and the like may be used as the first insulating layer 210 and the second insulating layer 220, and may be formed of different materials for electrical characteristics between the insulating layers.

The second insulating layer 220 covers the first insulating layer 210 and the first wiring 101 described above, and the second wirings 100 and 102 are printed on the second insulating layer 220. In this case, the respective wirings 100, 101, and 102 are printed at different horizontal positions. Each of the wirings 100, 101, and 102 is printed at different horizontal positions because the wirings 100, 101, and 102 are to be individually connected to each of the micro drivers (not shown) included in the optical modulator (not shown).

Accordingly, the second wiring 100, the first wiring 101, and the second wiring 102 are alternately positioned horizontally from the left side horizontally, and the second wiring 100 and 102 and the first wiring 101 are alternately positioned. ) Is completely electrically separated by the second insulating layer 220.

In addition, since the wirings 100, 101, and 102 are alternately positioned on the upper and lower layers with respect to the second insulating layer 220, there is no need to secure a space between the wirings. It is very efficient compared to the case where all wiring is printed.

As described above, one side of the wires alternately printed on different layers may be connected to a driver circuit (not shown) to transfer electrical signals transmitted from the driver circuit to the other side.

In addition, bumps 150 and 152, which are contact terminals, are connected to the other side of the wirings 100, 101, and 102. That is, bumps 150 and 152 capable of contacting a piezoelectric body (not shown) to be described with reference to FIG. 2 and applying a driving signal transmitted from a driver circuit are connected to the respective wirings 100, 101, and 102. In FIG. 1A, only the bumps 150 and 152 connected to the second wirings 100 and 102 printed on the second insulating layer 220 are shown due to the position of the cross section, but each of the wirings 100, 101, and 102 are all bumps. May be connected to the This will be described later with reference to FIG. 1B.

Figure 1b is a plan view of the connecting portion for connecting the optical modulator inside the optical modulator package according to an embodiment of the present invention.

Referring to FIG. 1B, it can be seen that the cross-sectional view of FIG. 1A is a cross-sectional view based on the axis b-b '. Therefore, in FIG. 1A, the bump is only connected to the second wirings 100 and 102, but the bump 151 connected to the first wiring 101 is also illustrated in the plan view of FIG. 1B.

Hereinafter, for convenience, the bumps connected to the first wiring 101 are referred to as first bumps 151 and the bumps connected to the second wirings 100 and 102 as the second bumps 150 and 152.

The first bumps 151 and the second bumps 150 and 152 are connected to the wirings 100, 101, and 102, respectively, and exist in a horizontal position that is zigzag or stagger. The horizontal position means the position on the top view.

Therefore, according to the embodiment of the present invention, it is possible to solve a problem in which bumps are formed in a line and inter-bump connection or interference occurs.

However, the bumps 150 and 152 connected to the second wirings 100 and 102 are directly exposed to the metal paste printing method or screen printing since the second wirings 100 and 102 are printed and exposed on the second insulating layer 220. The inkjet method may be used to directly connect the second wirings 100 and 102.

However, in the case of the first bump 151, since the first wiring 101 exists in another layer under the second insulating layer 200 (indicated by a dotted line), the first bump 101 is not exposed to the outside and thus connects the bump 151 immediately. Can't.

Therefore, in order to connect the first bump 151 to the first wiring 101, a part of the second insulating layer 220 must be removed to open a portion of the first wiring 101. In this case, a part of the second insulating layer 220 may be a dry etching method such as plasma etching, RIE, ion milling, or the like. This will be described in detail with reference to FIG. 4B.

Figure 1c is a three-dimensional view of the connecting portion connecting the optical modulator inside the optical modulator package according to an embodiment of the present invention.

Referring to FIG. 1C, as described with reference to FIG. 1A, the first wiring 101 and the second wiring 100 and 102 may be disposed at different horizontal positions from the first insulating layer 210 or the second insulating layer 220, respectively. It is printed alternately. Therefore, the space of an interconnection connecting each device in the conventional optical modulator package can be greatly reduced.

The second bumps 150, 152, and 154 connected to the second wirings 100, 102, and 104 are arranged in one row, and the first bumps 151 and 153 connected to the first wirings 101 and 103. ) Are also arranged in one row and connected to the respective wirings 100, 101, 102, 103, 104.

However, according to the exemplary embodiment of the present invention, the heat formed by the first bumps 151 and 153 and the second bumps 150, 152 and 154 are different from each other. That is, the first bumps 151, 153 and the second bumps 150, 152, 154 are zigzag by differentiating the rows of the first bumps 151, 153 and the rows of the second bumps 150, 152, 154. It can be seen that the formed.

Thus, according to the present invention, the separation distance can be ensured even between adjacent bumps 149, 151, 152, 153, and 154, and signal interference, short-circuit phenomenon, etc. can be prevented between the bumps 149, 151, 152, 153, and 154. You can prevent it.

In addition, in the case of the first wirings 101 and 103, since the second insulating layer 220 covers the upper portion, in order to connect the first bumps 151 and 153 to the first wirings 101 and 103. A part of the insulating layer 220 needs to be removed. In this case, the position where the first bumps 151 and 153 are connected is different from the heat formed by the second bumps 150, 152 and 154. Milling) and the like.

However, since the first bumps 151 and 153 and the second bumps 150, 152 and 154 described above must be in contact with the micro driver of the optical modulator, the heat formed by the second bumpers 150, 152 and 154 and the first bumper The spacing between the rows 151 and 153 should be smaller than the size of the micro driver.

Hereinafter, referring to FIGS. 2 and 3, a structure of an optical modulator connected to the above-described bumps 149, 151, 152, 153, and 154 and generated from a driver circuit to receive a driving signal through respective wires is described with reference to FIGS. 2 and 3. This will be described in detail.

2 is a view showing the shape of the micro mirror constituting the optical modulator included in the optical modulator package according to an embodiment of the present invention.

Referring to FIG. 2, a diagram illustrating a micromirror of one of a plurality of micromirrors arranged in a line constituting an optical modulator includes a substrate 210, an insulating layer 220, a sacrificial layer 230, and a ribbon structure 240. ) And a micromirror including a piezoelectric body 250 is shown. The piezoelectric body 250 is one type of the fine driver described with reference to FIGS. 1A, 1B, and 1C.

When the micromirrors are arranged in a line in the optical modulator, the optical mirror is a one-dimensional optical modulator. This will be described in detail with reference to FIG. 3.

The substrate 210 is a commonly used semiconductor substrate, and the insulating layer 220 is deposited as an etch stop layer, and an etchant for etching a material used as a sacrificial layer, where the etchant is an etching gas or an etching solution. Solution). The reflective layer 220 (a) may be formed on the insulating layer 220 to reflect incident light.

The sacrificial layer 230 supports the ribbon structure 240 on both sides so that the ribbon structure 240 is spaced apart from the insulating layer 220 at regular intervals, and forms a space at the center.

The ribbon structure 240 serves to optically modulate the signal by causing diffraction and interference with respect to the incident light as described above. The shape of the ribbon structure 240 may be configured as a plurality of ribbon shapes as described above, or may be provided with one or more open holes 240 (b) in the center of the ribbon. In addition, the piezoelectric member 250 controls the ribbon structure 240 to move up and down in accordance with the degree of contraction or expansion of up and down or left and right caused by the voltage difference between the upper and lower electrodes. Here, the reflective layer 220 (a) is formed corresponding to the hole 240 (b) formed in the ribbon structure 240.

For example, when the wavelength of light is λ, the distance between the upper reflective layer 240 (a) formed on the ribbon structure 240 and the lower reflective layer 220 (a) formed on the insulating layer 220 is (2 L) λ. A first voltage is applied to the piezoelectric body 250 such that / 4 (l is a natural number). In this case, in the case of zero-order diffracted light, the total path difference between the light reflected from the upper reflective layer 240 (a) and the light reflected from the lower reflective layer 220 (a) is equal to λ. Have Here, in the case of + 1st and -1st diffracted light, the brightness of light has a minimum value due to destructive interference.

In addition, the distance between the upper reflective layer 240 (a) formed on the ribbon structure 240 and the lower reflective layer 220 (a) formed on the insulating layer 220 is (2L + 1) λ / 4 (L is a natural number). A second voltage is applied to the piezoelectric body 250. In this case, in the case of zero-order diffracted light, the total path difference between the light reflected from the upper reflecting layer 240 (a) and the light reflected from the lower reflecting layer 220 (a) is equal to (2ℓ + 1) λ / 2, so that the destructive interference The modulated light thus has a minimum luminance. In the case of the + 1st and -1st diffracted light, the luminance of light has a maximum value due to constructive interference.

As a result of this interference, the micromirror can adjust the amount of diffracted light to carry a signal for one pixel on the light. In the above, the case where the space | interval between the ribbon structure 240 and the insulating layer 220 is (2L) (lambda) / 4 or (2L + 1) (lambda) / 4 was demonstrated. However, it is obvious that various embodiments of the present invention may be applied to adjust the distance between the ribbon structure 240 and the insulating layer 220 to adjust the luminance of light interfered by diffraction and reflection of incident light.

In addition, although described with reference to the diffraction type optical modulator in FIG. 2, only the optical modulator included in the projection display apparatus according to an exemplary embodiment of the present invention may be replaced by a transmissive or reflective optical modulator.

In addition, in FIG. 2, the piezoelectric type optical modulator has been described. However, this is only an example of the optical modulator used in the present invention, and it is obvious that the optical modulator may be replaced by an electrostatic type optical modulator.

3 is a view illustrating an optical modulator included in an optical modulator package according to an exemplary embodiment of the present invention.

Referring to FIG. 3, the optical modulator 130 includes a first pixel (pixel # 1), a second pixel (pixel # 2),. And m micromirrors 100-1, 100-2,..., 100-m that are responsible for the m-th pixel (pixel #m). The optical modulator 130 is responsible for image information on a 1D image of a vertical scanning line or a horizontal scanning line (assuming that the vertical scanning line or the horizontal scanning line is composed of m pixels), and each micromirror 100-1, 100-2, ..., 100-m) are in charge of one pixel of m pixels constituting the vertical scan line or the horizontal scan line. Therefore, the optical modulator 130 shown in FIG. 3 corresponds to a one-dimensional optical modulator.

As illustrated in FIG. 3, the vertical scan line or the horizontal scan line is a one-dimensional modulated light modulated in units of pixels while a linear beam is incident on a longitudinal optical modulator in which micromirrors are arranged in a line.

The light reflected and / or diffracted at each micro mirror is then projected by the scanner 190 to the screen 195 as a two dimensional image. For example, in the case of VGA 640x480 resolution, one plane frame is generated on the screen 195 per side of the optical scanning apparatus by modulating 640 times on one side of the scanner 190 for 480 vertical pixels.

In the present embodiment, it is assumed that there are two holes 240 (b) -1 formed in the ribbon structure 240. Due to the two holes 240 (b)-1, three upper reflective layers 240 (a)-1 are formed on the ribbon structure 240. Two lower reflective layers are formed in the insulating layer 220 corresponding to the two holes 240 (b)-1. In addition, another lower reflective layer is formed on the insulating layer 220 corresponding to the portion of the gap between the first pixel (pixel # 1) and the second pixel (pixel # 2). Accordingly, the number of upper reflective layers 240 (a) -1 and lower reflective layers is equal to three for each pixel, and the brightness of modulated light is adjusted using modulated light (0th order diffracted light or ㅁ 1st diffracted light). It is possible.

FIG. 4A is a view illustrating a method of manufacturing a connection part during an optical modulator package process according to an exemplary embodiment of the present invention based on cross section b-b 'of FIG. 1B.

Referring to FIG. 4A, in operation S300, the first insulating layer 210 is coated on the silicon substrate 200, and the first wirings 99, 101, 103, 105, and 107 are printed. Various methods widely used in the technical field of the present invention may be used for printing the wirings 99, 101, 103, 105, and 107, such as an inkjet method, a screen printing method, and a paste method.

Thereafter, in step S310, the second insulating layer 220 is coated while the first wirings 99, 101, 103, 105, and 107 are printed on the first insulating layer 210, and the first insulating layer 210 is applied. The second wiring 100, 102, 104, 106 is printed at the position printed in step S300, that is, the horizontally different position. As a result, as described with reference to FIG. 1C, the first wirings 99, 101, 103, 105, and 107 and the second wirings 100, 102, 104, and 106 are alternately positioned. Therefore, the first wirings 99, 101, 103, 105, and 107 and the second wirings 100, 102, 104, and 106 are electrically isolated with an insulating layer.

Thereafter, in step S340, the second bumps 150, 152, 154, and 156 are connected or formed to one side of each of the second wires 100, 102, 104, and 106. In this case, the bumps manufactured in advance may be connected to one side, and the second bumps 150, 152, 154, and 156 may be formed on the second wiring through a separate semiconductor process.

That is, the second bump may be formed by a lithography method using a mask and an exposure apparatus. However, this is merely an example, and bumps may be connected or formed using various semiconductor manufacturing methods.

FIG. 4B is a view illustrating a method of manufacturing a connection part during an optical modulator package process according to an exemplary embodiment of the present invention based on the section a-a 'of FIG. 1B.

Referring to FIG. 4B, the process of step S310 described with reference to FIG. 4A may be completed. That is, FIG. 1A illustrates a process of connecting or forming bumps 150, 152, 154, and 156 to second wirings 100, 102, 104, and 106 printed on the second insulating layer 220 and exposed to the outside. Although FIG. 1B illustrates the first bumps 149, 151, 152, 153 and 154 connected to the first wirings 99, 101, 103, 105 and 107 covered by the second insulating layer 220. Or it is shown centering on the forming process.

Therefore, step S310 is completed, and any of step S340 or step S320 of Figure 4a is included in the optical modulator package manufacturing method of the present invention.

Hereinafter, for convenience of explanation, it is assumed that after step S310 and step S330 of FIG. 4B are performed after step S310, step S430 of FIG. 4A is performed.

In operation S310, the first wirings 99, 101, 103, 105, and 107 and the second wirings 100, 102, 104, and 106 are coated on the first insulating layer 210 and the second insulating layer 220, respectively. In operation S320, the first wirings 99, 101, 103, 105, and 107 may be opened or exposed to cover the first wirings 99, 101, 103, 105, and 107 covered by the second insulating layer 220. A portion of the second insulating layer 220 existing on the upper portion of) is removed.

In this case, the second bumps 150, 152, 154, and 156 may be connected or formed at positions different from those of the first bumps 149, 151, 152, 153 and 154, as described in the plan view of FIG. 1B. The removal process of the second insulating layer 220 is not affected. In addition, the operation may be easily performed regardless of the positions of the second bumps 150, 152, 154, and 156 in the process of removing the second insulating layer 220.

In this case, the second insulating layer 220 may be removed using a dry etching method such as plasma etching, sputter etching, reactive ion etching (RIE), ion milling, or the like. However, the method of removing a part of the second insulating layer 220 is not limited thereto, and the second insulating layer 220 may be removed using various semiconductor manufacturing techniques.

In operation S330, a part of the second insulating layer 220 is removed to connect or form the first bumps 149, 151, 152, 153, and 154 to the exposed first wirings 99, 101, 103, 105, and 107. do.

The process of connecting or generating the first bumps 149, 151, 152, 153, and 154 may include the previously manufactured bumps on the first wirings 99, 101, 103, 105, and 107 as described in step S340 of FIG. 4A. The first bumps 149, 151, 152, 153, and 154 may be formed on the first wirings 99, 101, 103, 105, and 107 through separate semiconductor processes.

As described later, when all bumps are connected or formed, the bumps 149, 150, ..., 157 and the piezoelectric body, which is the micro driver of the optical modulator described in FIG. Can cause vertical movement.

As described above, one end of the wirings 99, 100, ..., 107 is connected to the micro driver of the optical modulator through the bumps 149, 150, ..., 157, and the other end of the wiring output terminal of the driver circuit which generates the driving signal. To be connected to.

Then, the optical modulator package is completed by sealing the optical modulator, the connection part, and the driver circuit described above with a cap and connecting the input terminal or output terminal of the drive circuit with an image control circuit (not shown) outside the optical modulator package. can do. In addition, since the configuration and manufacturing process of the optical substrate, printed circuit board, etc., which may be further included in the optical modulator package, will be apparent to those skilled in the art, description thereof will be omitted.

Although the above has been described with reference to the embodiments of the present invention, those skilled in the art may variously modify and modify the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. It will be appreciated that it can be changed.

Figure 1a is a cross-sectional view of the connecting portion connecting the optical modulator inside the optical modulator package according to an embodiment of the present invention.

Figure 1b is a plan view of the connecting portion connecting the optical modulator inside the optical modulator package according to an embodiment of the present invention.

Figure 1c is a three-dimensional view of the connecting portion connecting the optical modulator inside the optical modulator package according to an embodiment of the present invention.

2 is a view showing the shape of the micro mirror constituting the optical modulator included in the optical modulator package according to an embodiment of the present invention.

3 is a view showing an optical modulator included in an optical modulator package according to an embodiment of the present invention.

Figure 4a is a view showing a method for manufacturing a connection during the optical modulator packaging process according to an embodiment of the present invention based on the cross-section b-b 'of Figure 1b.

Figure 4b is a view showing a method for manufacturing a connection during the optical modulator packaging process according to an embodiment of the present invention with reference to the cross-section a-a 'of FIG.

Claims (7)

An optical modulator package including an optical modulator and a driver circuit for driving the optical modulator, Board; A first insulating layer coated on the substrate; A first wiring printed on the first insulating layer; A second insulating layer coated on the first insulating layer and the first wiring; A second wiring printed on the second insulating layer at a horizontal position different from a horizontal position of the first wiring; And And a bump electrically connected to the first wiring or the second wiring, the bump being connected to the optical modulator or the driver circuit. The method of claim 1, And a plurality of the first wiring lines and the second wiring lines, respectively, wherein the first wiring lines and the second wiring lines are alternately printed in a horizontal position. The method of claim 1, The bump includes a first bump connected to the first wiring and a second bump connected to the second wiring, The first bump and the second bump is an optical modulator package, characterized in that formed in a zigzag position horizontally to each other. The method of claim 1, The optical modulator includes a plurality of micro-driving units to move light to the plurality of ribbon structures and the ribbon structure, respectively, The first bump and the second bump is an optical modulator package, characterized in that connected to each of the different fine drive of the plurality of fine drive. The method of claim 1, And the first insulating layer and the second insulating layer are coated with different materials. 1. A method of manufacturing an optical modulator package including an optical modulator and a driver circuit for driving the optical modulator. Applying a first insulating layer on the substrate; Printing a first wiring on the first insulating layer; Applying a second insulating layer on the first insulating layer and the first wiring; Printing a second wiring on the second insulating layer at a horizontal position different from a horizontal position of the first wiring; And And electrically connecting a bump for connection with the optical modulator or the driver circuit to the first wiring or the second wiring. The method of claim 6, The step of connecting the bumps Removing a portion of the second insulating layer to open a portion of the first wiring; And And coupling a bump to a portion of the open first wiring.

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