KR20120044489A - Electro-conductive adhesive for cdi electrode and preparation of electrode using the same - Google Patents
Electro-conductive adhesive for cdi electrode and preparation of electrode using the same Download PDFInfo
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- KR20120044489A KR20120044489A KR1020100105775A KR20100105775A KR20120044489A KR 20120044489 A KR20120044489 A KR 20120044489A KR 1020100105775 A KR1020100105775 A KR 1020100105775A KR 20100105775 A KR20100105775 A KR 20100105775A KR 20120044489 A KR20120044489 A KR 20120044489A
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- electrode
- conductive adhesive
- cdi
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- 239000000853 adhesive Substances 0.000 title claims abstract description 56
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 56
- 238000002360 preparation method Methods 0.000 title description 5
- 238000000034 method Methods 0.000 claims abstract description 27
- 229920001661 Chitosan Polymers 0.000 claims abstract description 25
- 239000007772 electrode material Substances 0.000 claims abstract description 25
- 239000002612 dispersion medium Substances 0.000 claims abstract description 13
- 239000006229 carbon black Substances 0.000 claims abstract description 12
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 150000007524 organic acids Chemical class 0.000 claims abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 49
- 239000011230 binding agent Substances 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 16
- 238000001035 drying Methods 0.000 claims description 15
- 239000003431 cross linking reagent Substances 0.000 claims description 13
- 229910052799 carbon Inorganic materials 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000008367 deionised water Substances 0.000 claims description 9
- 229910021641 deionized water Inorganic materials 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000010354 integration Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000002242 deionisation method Methods 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 17
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 11
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 10
- 239000002002 slurry Substances 0.000 description 7
- 239000006258 conductive agent Substances 0.000 description 6
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 3
- 239000011976 maleic acid Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 150000007519 polyprotic acids Polymers 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 2
- 239000004966 Carbon aerogel Substances 0.000 description 2
- 239000011149 active material Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000003795 desorption Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000011069 regeneration method Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 229940014800 succinic anhydride Drugs 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical group 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- -1 amine salts Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010612 desalination reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229920001542 oligosaccharide Polymers 0.000 description 1
- 150000002482 oligosaccharides Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000001223 reverse osmosis Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000011163 secondary particle Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J105/00—Adhesives based on polysaccharides or on their derivatives, not provided for in groups C09J101/00 or C09J103/00
- C09J105/08—Chitin; Chondroitin sulfate; Hyaluronic acid; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
본 발명은 CDI(Capacitive Deionization) 공정 장치에 사용되는 전극용 도전성 접착제 및 이를 이용한 전극제조에 관한 것으로서, 상기 도전성 접착제는 키토산과 유기산 및 그 유도체를 분산매에 용해시킨 용액에, 도전재인 카본 블랙을 혼련한 것을 특징으로 한다. 이 도전성 접착제는 집전체와 전극재 사이의 접합면에 삽입되어 종래의 전극보다 계면사이의 들뜸 현상 및 공극을 줄여주며 계면사이의 밀착성을 증대시킨다. 이로서 집전체로부터 전극재의 박리현상을 방지하여 전극의 수명을 장기간 유지할 수 있다. 또한 전극자체의 전극저항을 감소시켜 축전 용량을 증대시킨다.The present invention relates to a conductive adhesive for an electrode used in a CDI (Capacitive Deionization) process apparatus and to manufacturing an electrode using the same, wherein the conductive adhesive is kneaded with carbon black as a conductive material in a solution in which chitosan, an organic acid and a derivative thereof are dissolved in a dispersion medium. It is characterized by one. The conductive adhesive is inserted into the bonding surface between the current collector and the electrode material to reduce lifting and voids between the interfaces and to improve the adhesion between the interfaces than conventional electrodes. As a result, peeling of the electrode material from the current collector can be prevented and the life of the electrode can be maintained for a long time. In addition, the capacitance of the electrode is increased by reducing the electrode resistance of the electrode itself.
Description
본 발명은 CDI(Capacitive Deionization) 공정 장치에 사용되는 전극용 도전성 접착제 및 이를 이용한 전극제조에 관한 것이다.
The present invention relates to a conductive adhesive for an electrode used in a CDI (Capacitive Deionization) processing apparatus and an electrode manufacturing using the same.
전기용량적 탈이온(capacitive deionization, 이하 CDI라 칭한다) 공정장치는 두 전극 사이에 전압을 가하여 용액 중에 존재하는 이온을 전극 표면에 전기화학적으로 흡착시키는 것(양극에는 음이온이, 음극에는 양이온이 흡착)에 의하여 용존하는 이온을 제거하는 장치를 말한다. CDI 전극에 이온의 흡착이 포화되면 전극의 극성을 역전위시켜줌으로서 흡착이온의 탈착이 용이하게 되어 전극의 재생이 간편하다. 이러한 전기적 정제방법은 전극재생을 위해 이온교환수지법이나 역삼투압법과 같이 산이안 염기 등의 화학약품을 사용하지 않아 폐수가 적게 발생하고 장치가 단순하여 고도로 집적할 수 있으며 조작하기 수월하고 주로 상온상압조건에서 운전되므로 다른 처리방법에 비해 에너지 효율이 높아 에너지 효율 측면에서 경제적이라 할 수 있다. 이러한 이유로 폐수의 처리공정에서는 많은 곳에서 사용이 되고 있으며 담수화 및 정수처리에서도 효과적인 정수방법으로 부각되고 있다.Capacitive deionization (hereinafter referred to as CDI) process equipment applies a voltage between two electrodes to electrochemically adsorb ions in solution on the surface of the electrode (anion on the anode and cation on the cathode). Refers to a device that removes dissolved ions. When the adsorption of ions on the CDI electrode is saturated, the polarity of the electrode is reversed to facilitate the desorption of the adsorption ion, thereby simplifying the regeneration of the electrode. This electrical purification method does not use chemicals such as acid ionic base such as ion exchange resin method or reverse osmosis method for electrode regeneration, so less waste water is generated and the device is simple and highly integrated. Since it is operated under the conditions, it is more economical in terms of energy efficiency than other treatment methods. For this reason, it is used in many places in the wastewater treatment process and is emerging as an effective water purification method in desalination and water treatment.
CDI 전극의 활물질로 사용되는 것은 통상적으로 활성탄(activated carbon), 탄소 에어로젤(carbon aerogel), 탄소 나노튜브(carbon nanotube) 등이 사용된다. 탄소 에어로젤, 탄소 나노튜브는 표면적이 넓고 미세세공이 많아 이온의 흡착과 탈착이 용이하여 CDI전극 재료로서 성능이 우수하다고 할 수 있으나 이들은 제조단가가 고가이며 또한 이들을 슬러리화하는 분산공정 및 전극에 도포하는 코팅공정이 어렵다는 단점이 있어왔다. 따라서 전극활물질의 슬러리화 및 도포가 용이한 활성탄을 주로 사용하고 있다. As the active material of the CDI electrode, activated carbon, carbon aerogel, carbon nanotube, and the like are commonly used. Although carbon aerogels and carbon nanotubes have a large surface area and a large number of micropores, they are easy to adsorb and desorption of ions and thus have excellent performance as CDI electrode materials, but they are expensive to manufacture and are applied to dispersion processes and electrodes that slurry them. There has been a disadvantage that the coating process is difficult. Therefore, activated carbon, which is easy to slurry and apply electrode active materials, is mainly used.
한편, 활성탄을 전극활물질로 사용한 경우에는 집전체인 카본 sheet와 전극재인 활성탄 사이의 접합면에 공극이 생겨 전극저항을 상승시키는 요인이 되고 또한 전극재의 밀착성이 떨어져 CDI 전극의 충방전 싸이클이 증가하면서 전극재인 활성탄이 떨어져 성능열화를 가져오는 문제점이 있었다.
On the other hand, when activated carbon is used as an electrode active material, voids are formed in the joint surface between the carbon sheet, which is the current collector, and the activated carbon, which is an electrode material, thereby increasing the electrode resistance, and the adhesion of the electrode material is decreased, thereby increasing the charge / discharge cycle of the CDI electrode. There was a problem in that activated carbon, which is an electrode material, fell and caused performance deterioration.
상기 문제를 해결하기 위해, 본 발명은 집전체인 카본 sheet와 전극재인 분극성 다공질 활성탄의 계면 들뜸 현상 및 공극을 없애주어 계면사이의 밀착성을 증대시키고, 이로서 집전체로부터 전극재의 박리현상을 방지하여 전극의 수명을 장기간 유지할 수 있는 한편, 전극자체의 전극저항을 감소시켜 축전 용량을 증대시킬 수 있는 CDI(Capacitive Deionization) 전극용 도전성 접착제 및 이를 이용한 전극제조 방법을 제공하는 것을 발명의 목적으로 한다.
In order to solve the above problems, the present invention eliminates interfacial lifting and voids between the carbon sheet as the current collector and the polarized porous activated carbon as the electrode material, thereby increasing the adhesion between the interfaces, thereby preventing the peeling of the electrode material from the current collector. SUMMARY OF THE INVENTION An object of the present invention is to provide a conductive adhesive for capacitive deionization (CDI) electrodes that can maintain the life of an electrode for a long time and increase the capacitance by reducing the electrode resistance of the electrode itself.
상기와 같은 목적을 달성하기 위하여, In order to achieve the above object,
본 발명은 탈이온수의 분산매 70 ~ 85wt%와,The present invention is 70 ~ 85wt% dispersion medium of deionized water,
수용성 키토산 5 ~ 10wt%와,5-10 wt% of water-soluble chitosan,
유기산 또는 그 유도체의 가교제 5 ~ 10wt%와,5 to 10 wt% of a crosslinking agent of an organic acid or a derivative thereof,
카본블랙의 도전재 2 ~ 15wt%의 혼합으로 조성된 CDI 전극용 도전성 접착제와,
A conductive adhesive for CDI electrodes composed of a mixture of carbon black conductive material 2-15 wt%,
상기 CDI 전극용 도전성 접착제를 이용한 전극제조방법에 관한 것으로서,It relates to an electrode manufacturing method using the conductive adhesive for CDI electrode,
탈이온수의 분산매 70 ~ 85wt%에 수용성 키토산 5 ~ 10wt%와, 유기산 또는 그 유도체의 가교제 5 ~ 10wt%와, 카본블랙의 도전재 2 ~ 15wt%를 첨가하여 도전성 접착제를 제조하는 단계와,Preparing a conductive adhesive by adding 5-10 wt% of a water-soluble chitosan, 5-10 wt% of a crosslinking agent of an organic acid or a derivative thereof, and 2-15 wt% of a conductive material of carbon black to 70-85 wt% of a dispersion medium of deionized water;
상기 도전성 접착제를 카본 sheet상 표면에 상기 도전성 접착제를 도포하고, 가열건조하여 건조두께 0.2 ~ 50의 도전성 접착제층을 이루는 단계와,Applying the conductive adhesive to the surface of the carbon sheet on the conductive adhesive, and heating and drying to form a conductive adhesive layer having a dry thickness of 0.2 to 50;
전극재인 활성탄 슬러리를 도포한 후 건조하는 단계와,Coating and drying the activated carbon slurry as an electrode material;
전극의 균질성을 향상시키기 위해 프레스하는 프레싱 단계로 이루어진 CDI 전극용 도전성 접착제를 이용한 전극제조방법을 주요 기술적 구성으로 한다.
An electrode manufacturing method using a conductive adhesive for CDI electrodes consisting of a pressing step to improve the homogeneity of the electrode is a main technical configuration.
그리고, 상기 수용성 키토산은 탈아세트화도가 40~60%인 키토산인 것을 특징으로 한다.And, the water-soluble chitosan is characterized in that the deacetization degree is chitosan with 40 to 60%.
상기 유기산은 구연산, 말레인산, 무수석신산, 피로멜리트산 또는 트리멜리트산의 다염기산 중 선택되는 어느 1종 또는 2종 이상의 혼합인 것임을 특징으로 한다.
The organic acid is characterized in that any one or a mixture of two or more selected from the polybasic acid of citric acid, maleic acid, succinic anhydride, pyromellitic acid or trimellitic acid.
이하, 상기 기술적 구성에 대해 상세히 살펴보고자 한다.
Hereinafter, the technical configuration will be described in detail.
본 발명은 CDI(Capacitive Deionization) 공정 장치에 사용되는 전극용 도전성 접착제 및 이를 이용한 전극제조에 관한 것으로, 상기 도전성 접착제는 분산매, 결착제, 가교제 및 도전제의 혼합으로 조성되는 것이다.
The present invention relates to a conductive adhesive for an electrode used in a CDI (Capacitive Deionization) process apparatus and to manufacturing an electrode using the same, wherein the conductive adhesive is composed of a mixture of a dispersion medium, a binder, a crosslinking agent, and a conductive agent.
상기 분산매는 주로 도전성 접착제의 용도에 의해서 결정되는데, 본 발명에서는 도전성 접착제가 연수기의 수처리용으로 사용되므로 탈이온수를 사용한다.The dispersion medium is mainly determined by the use of the conductive adhesive. In the present invention, since the conductive adhesive is used for water treatment of the water softener, deionized water is used.
탈이온수를 주체로 하지만, 해당 도전성 접착제의 도포시에 있어서의 레벨리성(leveling property)을 향상시키기 위한 표면장력 저하 목적으로, 필요에 따라서는 메탄올, 에탄올, 이소피로필알코올의 알코올계 용매와 병용할 수도 있다.Deionized water is mainly used, but in combination with an alcohol solvent such as methanol, ethanol or isopyrophyll alcohol, if necessary, for the purpose of lowering the surface tension for improving the leveling property at the time of applying the conductive adhesive. You may.
상기 분산매는 도전성 접착제의 전체 함량에 대해 70 ~ 85wt% 범위 내에서 사용하며, 사용량이 70wt% 미만인 경우에는 도전성 접착제의 도포성 즉, 점성이 증가하여 도막 형성이 어려운 문제가 있고, 85wt%를 초과하게 되는 경우에도 너무 점성이 낮아 도막 형성이 어려운 한편, 도전성 접착제의 접착성능이 문제가 있으므로, 상기 분산매는 도전성 접착제 전체 함량에 대해 70 ~ 85wt%의 범위 내에서 사용하는 것이 바람직하다.
The dispersion medium is used within the range of 70 to 85wt% with respect to the total content of the conductive adhesive, when the amount of use is less than 70wt%, there is a problem that the coating film formation, that is, the viscosity is difficult to increase due to the increase in coating properties of the conductive adhesive, exceeding 85wt% Even if the viscosity is too low, the coating film is difficult to form, while the adhesive performance of the conductive adhesive is problematic, it is preferable to use the dispersion medium within the range of 70 to 85wt% based on the total content of the conductive adhesive.
상기 수용성 키토산은 탈아세트화도가 40~60%, 분자량이 30,000~60,000인 키토산인 것을 특징으로 한다. 기본적으로 키토산은 물이나 알카리에는 녹지 않는 불용성 성질을 가지지만 젖산, 구연산, 초산 등의 약산에 녹아 산업적으로 많이 이용되지 못하고 있는 실정이다. 수용성 키토산화의 방법으로 첫번째 분자량을 낮추어 올리고당화하는 방법, 두 번째 키토산에 작용기를 중합하여 수용성 유도체를 만드는 방법, 세 번째 탈아세트화도를 40~60%로 하는 방법이 있다. 첫 번째 방법의 수용성 키토산을 사용할 경우는 도전성 접착제의 성능에 필요한 유동성 및 결착성이 나타나지 않고, 두 번째 방법의 수용성 키토산을 사용할 경우는 키토산 자체가 고가이기 때문에 경제적이지 못한 단점이 있다. 그러나 탈아세트화도를 40~60%로 처리한 키토산은 분자량이 낮추지 않고 물에 용해성이 있어 그 산업적 용도에 있어 뛰어나다. 또한 수용성 키토산은 그 작용기에 아민(-NH2)가 존재하여 카본블랙과의 친화성을 가지므로 슬러리 중의 카본블랙 입자를 양호하게 분산시키는 것이 가능하다.
The water-soluble chitosan is characterized in that the deacetization degree is chitosan 40 ~ 60%, molecular weight 30,000 ~ 60,000. Basically, chitosan has an insoluble property that is insoluble in water or alkali, but is not used in industrial use because it is dissolved in weak acid such as lactic acid, citric acid and acetic acid. As a method of water-soluble chito oxidation, there is a method of lowering the first molecular weight to oligosaccharide, a method of polymerizing a functional group to a second chitosan to make a water-soluble derivative, and a method of setting a third degree of deacetization to 40 to 60%. When the water-soluble chitosan of the first method is used, the fluidity and binding properties required for the performance of the conductive adhesive do not appear, and when the water-soluble chitosan of the second method is used, the chitosan itself is expensive, which is not economical. However, chitosan treated with 40 to 60% deacetization is soluble in water without lowering its molecular weight and is excellent in its industrial use. In addition, the water-soluble chitosan has affinity with carbon black due to the presence of amine (-NH2) in the functional group, and thus it is possible to satisfactorily disperse the carbon black particles in the slurry.
한편, 그리고, 상기 결착제의 결착제 성분으로서 수용성 키토산의 사용량은 도전성 접착제의 전체 함량에 대해 5 ~ 10wt%의 범위 내에서 결정되며, 상기 사용량이 5wt% 미만인 경우에는 안정된 결착층을 얻기 어렵고, 10wt%를 초과하게 되는 경우에는 도포성이 떨어지거나, 비용면에서 비경제적인 문제가 발생하게 되므로, 상기 결착제의 사용량은 결착성과 비용의 관점에 비추어 볼 때 도전성 접착제의 전체 함량에 대해 5 ~ 10wt%의 범위 내에서 사용하는 것이 바람직하다.
On the other hand, the amount of water-soluble chitosan used as a binder component of the binder is determined within the range of 5 to 10wt% with respect to the total content of the conductive adhesive, when the amount is less than 5wt%, it is difficult to obtain a stable binder layer, If the content exceeds 10wt%, the coating property is poor or the cost is uneconomical. Therefore, the amount of the binder is 5 to 10wt% based on the total content of the conductive adhesive in view of the binding property and the cost. It is preferable to use within the range of%.
그리고, 상기 결착제와 관련하여, 유기산 및 그 유도체는 수용성 키토산이 집전체인 카본 sheet와 전극재인 활성탄층의 결착제로서 사용되어 도전층을 형성하면, 가열 건조시에 수용성 키토산의 가교제로서 작용하며, 가교된 수용성 키토산은 집전체와 전극재 사이의 뛰어난 밀착성을 부여하여 전극재의 박리현상을 방지하는 기능을 갖게 된다.In addition, with respect to the binder, the organic acid and its derivatives are used as a binder of the carbon sheet as the current collector and the activated carbon layer as the electrode material to form a conductive layer, and then act as a crosslinking agent of the water-soluble chitosan during heat drying. The crosslinked water-soluble chitosan has a function of preventing peeling of the electrode material by providing excellent adhesion between the current collector and the electrode material.
상기 가교제의 유기산은 옥살산, 말론산, 말산, 주석산, 멜리트산, 구연산, 아디핀산, 말레인산, 피로멜리트산, 프탈산, 트리멜리트산, 석신산의 다염기산 중 선택되는 어느 1종 또는 2종 이상의 혼합물에서 선택되며, 상기 가교제의 유기산 유도체는 상기 다염기산의 산무수물, 다염기산의 일부 또는 전부의 카르복실기의 염, 특히 암모늄염이나 아민염 중에서 선택된다. 특히, 가교성 측면에서 3가 이상의 방향족 폴리카르복실산인 피로멜리트산, 트리멜리트산 또는 이의 산무술물 중에서 선택하여 사용하는 것이 바람직하다.The organic acid of the crosslinking agent may be selected from oxalic acid, malonic acid, malic acid, tartaric acid, methalic acid, citric acid, adipic acid, maleic acid, pyromellitic acid, phthalic acid, trimellitic acid and succinic acid in any one or two or more mixtures thereof. The organic acid derivative of the crosslinking agent is selected from acid anhydrides of the polybasic acids, salts of some or all of the carboxyl groups of polybasic acids, in particular ammonium salts or amine salts. In particular, it is preferable to select and use from pyromellitic acid, trimellitic acid, or acid arsenic matter which are trivalent or more aromatic polycarboxylic acid from a crosslinking | crosslinking point.
또한, 상기 결착제의 가교제 성분으로서 유기산 또는 그 유도체의 첨가량은 도전성 접착제의 전체 함량에 대해 5 ~ 10wt%의 범위 내에서 사용되며, 상기 가교제의 사용량이 5wt% 미만인 경우에는 수용성 키토산의 가교밀도가 낮아, 형성되는 결착층이 집전체와 전극재사이의 밀착성을 떨어뜨리는 문제가 있고, 10wt%를 초과하게 되는 경우에는 가교성이 떨어지며 밀착성 또한 저해되는 문제가 있으므로, 상기 가교제는 도전성 접착제의 전체 양에 대해 5 ~ 10wt%의 범위 내에서 사용하는 것이 바람직하다.
In addition, the amount of the organic acid or its derivative added as a crosslinking agent component of the binder is used within the range of 5 to 10wt% with respect to the total content of the conductive adhesive. Low, there is a problem in that the binding layer formed to reduce the adhesiveness between the current collector and the electrode material, if the content exceeds 10wt% crosslinkability is poor and the adhesiveness is also inhibited, the crosslinking agent is the total amount of the conductive adhesive It is preferable to use within the range of 5 to 10wt%.
상기 도전제인 카본 블랙은 평균 1차입경이 10 ~ 200nm, 바람직하게는 20 ~ 100nm인 탄소원자가 사슬형상으로 2차 응집한 구조를 보유하고 이와 같은 2차 입자구조를 가지는 것을 사용하며, 이와 같은 구조의 카본 블랙은 도전제로서 도전성이 뛰어나다.Carbon black, which is the conductive agent, has a structure in which carbon atoms having an average primary particle diameter of 10 to 200 nm, preferably 20 to 100 nm, are secondarily aggregated in a chain shape and have such a secondary particle structure. Carbon black is excellent in conductivity as a conductive agent.
상기 카본 블랙은 아세틸렌 블랙, 케첸 블랙, Super P 블랙 및 VGCF(vaper gas cabon fiber) 중 선택되는 어느 1종 또는 2종 이상의 혼합인 것을 사용할 수 있으나, 특별히 이에 한정하는 것은 아니다.
The carbon black may be any one or a mixture of two or more selected from acetylene black, Ketjen black, Super P black, and VGCF (vaper gas cabon fiber), but is not particularly limited thereto.
상기 도전제의 사용량은 도전성 접착제의 전체 함량에 대해 2 ~ 15wt%의 범위 내에서 결정되며, 사용량이 2wt% 미만인 경우에는 도전성능을 발현할 수 없다는 문제가 발생하고, 15wt%를 초과하게 되는 경우에는 분산매의 대부분이 카본 블랙에 흡수되어 유동성이 현저히 상실되어 취급이 곤란하다는 문제가 발생하게 되므로, 상기 도전제의 사용량은 도전성 접착제의 전체 함량에 대해 2 ~ 15wt%의 범위 내에서 유지하며, 더욱 바람직하게는 2 ~ 10wt%의 범위 내를 유지한다.
The amount of the conductive agent is determined within the range of 2 to 15wt% with respect to the total content of the conductive adhesive, and when the amount is less than 2wt%, a problem arises that the conductive ability cannot be expressed, and when the amount exceeds 15wt% Since most of the dispersion medium is absorbed by the carbon black, the fluidity is remarkably lost and handling is difficult. Therefore, the amount of the conductive agent is maintained within the range of 2 to 15 wt% based on the total content of the conductive adhesive. Preferably it is maintained in the range of 2 to 10wt%.
다음으로, 본 발명에서 사용되는 도전성 접착제의 제조에 대해 살펴보면, 먼저 탈이온수의 분산매 70 ~ 85wt%에 결착제인 수용성 키토산 5 ~ 10wt%를 첨가하여 용해한 후,Next, looking at the manufacturing of the conductive adhesive used in the present invention, first dissolving by adding 5-10 wt% of water-soluble chitosan as a binder to 70 ~ 85wt% of the dispersion medium of deionized water,
수용성 키토산의 가교제인 유기산 또는 그 유도체 5 ~ 10wt%를 첨가하고,5-10 wt% of an organic acid or a derivative thereof, which is a crosslinking agent of water-soluble chitosan, is added,
마지막 과정으로서, 카본블랙의 도전제 2 ~ 15wt%를 첨가하여 고속 임펠러 분산기, 호모지나이저, 볼 밀, 샌드 밀 또는 플래니터리 믹서, 페이스트 믹서를 이용하여 혼련 분산하는 것에 의해서 본 발명의 도전성 접착제를 제조한다.
As a final process, the conductive adhesive of the present invention is added by kneading and dispersing using a high speed impeller disperser, homogenizer, ball mill, sand mill or planetary mixer, paste mixer by adding 2-15 wt% of carbon black conductive agent. To prepare.
상기 과정을 통해 제조된 도전성 접착제를 이용한 전극제조방법에 대해 살펴보면, CDI 전극용 집전체인 카본 sheet상 표면에 상기 도전성 접착제를 건조두께 0.2 ~ 50로 도포하고, 상기 도포한 도전성 접착제를 가열건조하는 과정을 통해 도전성 접착층을 형성하는 단계와,Looking at the electrode manufacturing method using the conductive adhesive prepared through the above process, the conductive adhesive is applied to the surface of the carbon sheet on the surface of the carbon sheet that is the current collector for the CDI electrode with a drying thickness of 0.2 to 50, and heat-drying the applied conductive adhesive Forming a conductive adhesive layer through the process;
전극재인 활성탄 슬러리를 도포한 후 건조하는 단계와,Coating and drying the activated carbon slurry as an electrode material;
전극의 균질성을 향상시키기 위해 프레싱 단계를 거쳐 이루어진다.
This is done through a pressing step to improve the homogeneity of the electrode.
상기 도전성 접착층 형성 방법은 CDI 전극용 집전체인 카본 sheet상 표면에 상기 도전성 접착제를 도포 방법에 의하여 건조두께로 0.2 ~ 50, 바람직하게는 1.0 ~ 20의 두께로 도포한 후, 가열 건조하여 도전성 접착층을 형성하는 것으로,In the method for forming the conductive adhesive layer, the conductive adhesive is applied to a carbon sheet surface, which is a current collector for CDI electrodes, by a coating method with a thickness of 0.2 to 50, preferably 1.0 to 20, by drying, followed by heat drying to form a conductive adhesive layer. By forming
상기 도포방법은 그라비아 코트, 그라비아 리버스 코트, 슬라이드 다이 코트(Slide dye coating), 콤마 다이렉트 코터(Comma direct coating), 콤마 리버스 코터(Comma reverse coating), 다이 노즐(Dye nozzle) 코팅 중 선택되는 어느 1종의 방법을 이용한다.The coating method may be any one selected from gravure coat, gravure reverse coat, slide dye coating, comma direct coating, comma reverse coating, and die nozzle coating. The species method is used.
그리고, 상기 가열건조시에는 수용성 키토산의 가교를 충분히 형성시키기 위해 110에서 5 ~ 10분 동안 가열건조 한 후, 150에서 5 ~ 10분 동안 가열건조하는 것이 바람직하다.In the heat drying, heat drying at 110 to 5 to 10 minutes in order to sufficiently form crosslinking of the water-soluble chitosan, and heat drying at 150 to 5 to 10 minutes is preferable.
상기 건조온도를 달리 하여 2단계로 가열건조하는 이유는 가교제의 충분한 가교밀도를 형성시켜 집전체에 대한 도전성 접착제의 밀착성 증대하는 한편, 도전성 접착층에 존재하는 잔여 분산매를 제거하는데 있다.The reason for heating and drying in two stages by changing the drying temperature is to form sufficient crosslinking density of the crosslinking agent to increase the adhesion of the conductive adhesive to the current collector and to remove the residual dispersion medium present in the conductive adhesive layer.
상기 110에서 5분 미만인 경우에는 도전성 접착제의 가교제 성분이 충분히 가교가 이루어지지 않아 집전체와의 밀착성이 결여되는 문제가 있고, 10분을 초과하게 되는 경우에는 전극생산의 경제성이라는 비용적인 면에 문제가 있다. 그리고, 150에서 5분 미만인 경우에는 도전성 접착층에 존재하는 잔여 분산매가 제거되지 않아 이후에 전극재와의 접착성이 떨어지는 문제가 있고, 10분을 초과하게 되는 경우에는 전극생산의 경제성이라는 비용적인 면에 문제가 있다.If the cross-linking agent component of the conductive adhesive is less than 5 minutes at 110, there is a problem in that the cross-linking component of the conductive adhesive is not sufficiently crosslinked and lacks adhesion with the current collector. There is. In addition, if it is less than 5 minutes at 150, the remaining dispersion medium present in the conductive adhesive layer is not removed, and thus the adhesiveness with the electrode material is inferior. If it is more than 10 minutes, the cost of electrode production is economical. There is a problem.
그리고, 상기 전극재인 활성탄 슬러리는 분극성 다공성 활물질로서 활성탄과, 결합재인 PTFE 바인더로 이루어진다.The activated carbon slurry as the electrode material is formed of activated carbon as a polarizable porous active material and a PTFE binder as a binder.
보다 구체적으로, 상기 활성탄 슬러리는 10의 크기를 갖는 활성탄 96wt%와 바인더로서 PTFE solution(고형분 60%) 4wt%의 혼합물에 알코올을 첨가하여 롤프레스로 일정 두께가 될 때까지 압연하여 전극을 제조한다.More specifically, the activated carbon slurry is prepared by rolling an alcohol to a mixture of 96 wt% activated carbon having a size of 10 and 4 wt% of a PTFE solution (solid content 60%) as a binder and rolling it to a predetermined thickness by a roll press. .
그리고, 상기 프레싱 공정에서의 프레스(Press)방법으로는 콜드 프레스(Cold press) 또는 핫 프레스(Hot press) 중 선택되는 방법을 사용한다.As a press method in the pressing step, a method selected from a cold press or a hot press is used.
이상에서 살펴본 바와 같이, 본 발명에 따른 CDI(Capacitive Deionization) 공정 장치에 사용되는 전극용 도전성 접착제 및 이를 이용하여 제조된 전극은, 집전체인 카본 sheet와 전극재인 분극성 다공질 활성탄 사이의 접합면에 삽입되어 종래의 전극보다 계면사이의 들뜸 현상 및 공극을 줄여주며 계면사이의 밀착성을 증대시킨다. 이로서 집전체로부터 전극재의 박리현상을 방지하여 전극의 수명을 장기간 유지할 수 있다. 또한 전극자체의 전극저항을 감소시켜 축전 용량을 증대시킨다.
As described above, the conductive adhesive for the electrode used in the CDI (Capacitive Deionization) process apparatus according to the present invention and the electrode prepared by using the same, the bonding surface between the collector carbon sheet and the electrode material polarized porous activated carbon It is inserted to reduce the lifting and voids between the interface than the conventional electrode and to increase the adhesion between the interface. As a result, peeling of the electrode material from the current collector can be prevented and the life of the electrode can be maintained for a long time. In addition, the capacitance of the electrode is increased by reducing the electrode resistance of the electrode itself.
이하, 상기 기술 구성에 따른 구체적인 내용을 실시 예를 통해 살펴보고자 한다.
Hereinafter, the specific contents according to the technical configuration will be described through embodiments.
먼저, 본 발명의 바람직한 실시예에 따른 CDI 전극용 도전성 접착제 및 이를 이용한 전극제조 방법을 상세하게 설명하지만 본 발명이 하기의 실시예에 의하여 제한되거나 한정된 것은 아니다.
First, a conductive adhesive for a CDI electrode and an electrode manufacturing method using the same according to a preferred embodiment of the present invention will be described in detail, but the present invention is not limited or limited by the following examples.
실시 예 1 : 도전성 접착제를 이용한 전극의 제조Example 1 Preparation of an Electrode Using a Conductive Adhesive
도전성 접착제의 제조
Preparation of Conductive Adhesive
본 실시 예1의 도전성 접착제는 페이스트 믹서기에 탈이온수 800g을 넣고 여기에 결착제로서 수용성 키토산 50g, 구연산 50g을 용해시킨 다음, 도전재인 Super P블랙을 100g 첨가하여 제조하였다.
The conductive adhesive of Example 1 was prepared by adding 800 g of deionized water to a paste mixer, dissolving 50 g of water-soluble chitosan and 50 g of citric acid as a binder, and then adding 100 g of Super P black as a conductive material.
전극의 제조
Preparation of the electrode
다음으로 전극재인 활성탄 전극을 이하의 방법에 의하여 제조했다. 평균10의 크기를 갖는 활성탄 960g, 바인더로서 PTFE solution(고형분 60%) 40g을 페이스트 믹서로 교반하고 알코올을 첨가하여 일정한 두께가 될 때까지 롤프레스로 성형하여 전극을 얻었다.
Next, the activated carbon electrode which is an electrode material was manufactured by the following method. 960 g of activated carbon having an average size of 10 and 40 g of a PTFE solution (60% solids) as a binder were stirred with a paste mixer, and alcohol was added to form a roll press until a constant thickness was obtained to obtain an electrode.
집전체 상의 도전성 접착층 형성과 전극의 일체화 Formation of conductive adhesive layer on current collector and integration of electrodes
집전체 상의 도전성 접착층 형성과 전극의 일체화는 우선 상기에서 얻어진 도전성 접착제를 CDI 전극용 집전체인 카본 sheet의 표면위에 콤마 다이렉트 코터를 사용하여 도포한 다음, 그 위에 상기 전극을 결착시킨 후, 드라이 존에서 110에서 5분, 150에서 5분을 가열건조처리하고 도전성 접착층 1와 전극층 200를 형성하였다.The formation of the conductive adhesive layer on the current collector and the integration of the electrodes are first performed by applying the above-mentioned conductive adhesive on the surface of the carbon sheet, which is a current collector for CDI electrodes, using a comma direct coater, and then binding the electrodes thereon, followed by a dry zone. At 110 to 5 minutes and 150 to 5 minutes were heat-dried to form the conductive adhesive layer 1 and the electrode layer 200.
상기에서 얻어진 일체화된 전극의 균일성을 유지하기 위해 다시 프레스를 가하였다.
The press was applied again to maintain the uniformity of the integrated electrodes obtained above.
전극의 도막 박리시험
Coating film peeling test of electrode
상기 실시 예 1에서 제조된 전극을 90로 24시간 건조한 후, 전극 표면위에 점착 테이프(3M(주) Scotch 멘딩 테이프)를 붙이고 나서 1 무게의 고무롤러를 1주 왕복시켜, 피막과 점착 테이프를 압착시킨다. 압착한 점착 테이프를 일정 속도로 벗겨, 피막이 집전체인 카본 시트(sheet)로부터 박리한 경우를 , 박리하지 않은 경우를 로서 판정했다.
After drying the electrode prepared in Example 1 at 90 for 24 hours, attaching a pressure-sensitive adhesive tape (3M Scotch Mending Tape) on the electrode surface and then reciprocating 1 weight rubber roller for 1 week to compress the film and the adhesive tape Let's do it. The case where the crimped adhesive tape was peeled off at a constant speed and the film peeled from the carbon sheet which is the current collector was not peeled was determined as.
전극의 전기저항 측정시험
Electrical resistance measurement test of electrode
상기 실시 예 1에서 제조된 전극의 전기저항 측정은 전극의 두께 방향의 저항값으로서 13mm로 구멍을 뚫은 전극을 은판상에 놓고, 도막면에 11mm의 은봉을 놓아 500gf의 하중을 걸은 상태로 은판과 은봉사이의 저항값을 측정하였다.
The electrical resistance measurement of the electrode manufactured in Example 1 was carried out by placing the electrode punched at 13 mm as a resistance value in the thickness direction of the electrode on a silver plate, and placing a 11 mm silver bar on the coating film surface under a load of 500 gf. The resistance value between silver bars was measured.
실시예Example
2 내지 5 : 도전성 접착제를 이용한 전극의 제조 2 to 5: Preparation of Electrode Using Conductive Adhesive
하기 표 1의 배합으로 도전성 접착제를 제조한 것 이외에는 실시예 1과 동일하게 하여 전극의 도막 박리시험 및 전기저항을 측정(시험예 3 내지 6)하였고, 그 결과를 표 2에 기재하였다.
A coating film peeling test and an electrical resistance of the electrode were measured (Test Examples 3 to 6) in the same manner as in Example 1, except that the conductive adhesive was prepared by the formulation of Table 1 below, and the results are shown in Table 2.
비교예Comparative example
1 내지 3 1 to 3
비교예 1 내지 2는 하기 표 1의 배합으로 도전성 접착제를 제조한 것 이외에는 실시예 1과 동일하게 하여 전극의 도막 박리시험 및 전기저항을 측정하였고, 그 결과를 표 2에 기재하였다.Comparative Examples 1 to 2 were prepared in the same manner as in Example 1 except that the conductive adhesive was prepared in the formulation of Table 1, and the coating film peeling test and the electrical resistance of the electrode were measured, and the results are shown in Table 2.
비교예 3은 도전성 접착제 없이 전극을 제조하여 전극의 도막 박리시험 및 전기저항을 측정하였고, 그 결과를 표 2에 기재하였다.In Comparative Example 3, an electrode was prepared without a conductive adhesive, and the coating film peeling test and the electrical resistance of the electrode were measured, and the results are shown in Table 2.
(전극의 도막 박리시험 : 피막이 집전체인 카본 sheet로부터 박리한 경우를 ×, 박리하지 않은 경우를 ○로 함. (Film peeling test of electrode: The case where a film peeled from the carbon sheet which is an electrical power collector is x, and the case where it is not peeled is set as (circle).
전극의 전기저항 : ◎은 비교예 3보다 전기저항이 20%이상 작을 때, ○은 비교예 3보다 전기저항이 10% 이상, 20% 미만 작을 때, ×는 비교예 3과 전기 저항이 동등 이하일 때로 함.) Electrical resistance of the electrode: ◎ is less than 20% or less than Comparative Example 3, ○ is less than or less than 10% and less than 20%, and x is less than or equal to Comparative Example 3 Sometimes.)
상기 표 2의 결과에서 알 수 있듯이, 본 발명에 의한 도전성 접착제를 도포한 전극을 사용하면 전극재의 박리가 방지되고 또한 전기저항을 줄일 수 있는 전극을 얻을 수 있다.As can be seen from the results of Table 2, when the electrode coated with the conductive adhesive according to the present invention is used, it is possible to obtain an electrode which can prevent the peeling of the electrode material and reduce the electrical resistance.
Claims (4)
수용성 키토산의 결착제 5 ~ 10wt%와,
유기산 또는 그 유도체의 가교제 5 ~ 10wt%와,
카본블랙의 도전재 2 ~ 15wt%의 혼합으로 조성된 것임을 특징으로 하는 CDI 전극용 도전성 접착제.
70-85 wt% of dispersion medium of deionized water,
5-10 wt% binder of water-soluble chitosan,
5 to 10 wt% of a crosslinking agent of an organic acid or a derivative thereof,
A conductive adhesive for CDI electrodes, characterized in that the composition is composed of a mixture of carbon black conductive material 2 ~ 15wt%.
수용성 키토산은 탈아세트화도가 40~60%, 분자량이 30,000~60,000인을 특징으로 하는 CDI 전극용 도전성 접착제.The method according to claim 1,
The water-soluble chitosan has a deacetization degree of 40 to 60% and a molecular weight of 30,000 to 60,000 conductive adhesive for CDI electrodes.
상기 도전성 접착제를 카본 시트(sheet) 표면에 도포하고, 그 위에 전극재를 결착시킨 후, 가열건조하여 건조두께 0.2 ~ 50의 도전성 접착제층을 이루어 전극재와의 일체화를 이루는 단계와,
전극의 균질성을 향상시키기 위해 프레스하는 프레싱 단계로 이루어진 것임을 특징으로 하는 CDI 전극용 도전성 접착제를 이용한 전극제조방법.Preparing a conductive adhesive by adding 70 to 85 wt% of a deionized water dispersion medium to 5 to 10 wt% of a water-soluble chitosan binder, 5 to 10 wt% of a crosslinking agent of an organic acid or a derivative thereof, and 2 to 15 wt% of a conductive material of carbon black. Wow,
Applying the conductive adhesive to the surface of the carbon sheet, binding the electrode material thereon, and heating and drying to form a conductive adhesive layer having a dry thickness of 0.2 to 50 to form an integration with the electrode material;
Electrode manufacturing method using a conductive adhesive for CDI electrode, characterized in that consisting of a pressing step to improve the homogeneity of the electrode.
전극재는 10의 크기를 갖는 활성탄 960g과, 바인더로서 PTFE solution(고형분 60%) 40g의 혼합물을 알코올과 혼합하여 페이스트 믹서로 교반 혼합한 다음, 롤 프레스로 일정한 두께로 압연하는 것을 특징으로 하는 CDI 전극용 도전성 접착제를 이용한 전극제조방법.
The method according to claim 3,
The electrode material is a CDI electrode characterized in that a mixture of 960 g of activated carbon having a size of 10 and 40 g of a PTFE solution (60% solids) as a binder is mixed with alcohol, stirred and mixed with a paste mixer, and then rolled to a predetermined thickness with a roll press. Electrode manufacturing method using a conductive adhesive for use.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101701317B1 (en) | 2016-04-01 | 2017-02-03 | (주) 퓨리켐 | Electro-conductive adhesive using graphene and preparation of electrode using the same |
| CN114920336A (en) * | 2022-03-15 | 2022-08-19 | 中国船舶重工集团公司第七一八研究所 | Preparation method of capacitive deionization electrode |
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| KR101701317B1 (en) | 2016-04-01 | 2017-02-03 | (주) 퓨리켐 | Electro-conductive adhesive using graphene and preparation of electrode using the same |
| CN114920336A (en) * | 2022-03-15 | 2022-08-19 | 中国船舶重工集团公司第七一八研究所 | Preparation method of capacitive deionization electrode |
| CN114920336B (en) * | 2022-03-15 | 2023-11-07 | 中国船舶重工集团公司第七一八研究所 | Preparation method of capacitor deionized electrode |
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