KR20140064582A - Side light emitting led package, lighting array module, and fabrication method therof - Google Patents

Abstract

The present invention relates to a side-emitting LED package, an illumination array module using the same, and a method of manufacturing the same. The method includes the steps of: forming a substrate including N LED package substrates; A second step of placing N LED chips on the upper surface of the N LED packages, respectively; The first conductive pattern of the LED package substrate and the first conductive type electrode exposed on the upper surface of the LED chip are electrically connected to each other to electrically connect the second conductive pattern of the LED package substrate and the second conductive pattern exposed on the upper surface of the LED chip, A third step of electrically connecting the electrodes; A fourth step of forming a fluorescent layer on the front surface of the substrate so that the upper surface of the substrate and the side surface and the upper surface of the LED chip are included; A fifth step of cutting the substrate by N LED package substrate units to form N side light emitting LED packages; And a first connection pad electrically connected to the first conductive pattern of the side-emitting LED package and a second connection pad electrically connected to the second conductive pattern of the side-emitting LED package are electrically connected to connection electrodes of the light- And arranging the plurality of side-emission LED packages on the light-emitting array substrate in such a manner as to be spaced apart from each other.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a side light emitting LED package, a light emitting array module including the light emitting LED package,

The present invention relates to a side-emitting LED package, a lighting array module including the same, and a method of manufacturing a mimet. And more particularly to an LED package used for forming a light array module using a side light emitting LED package having a wide light directing angle characteristic so as to slim the height of the light emitting device or to provide uniform surface light or line light A light emitting diode (LED) module including the same, and a method of manufacturing the same.

LED (Light Emitting Diode) is replacing existing lighting devices such as incandescent lamps, fluorescent lamps, etc. because of advantages such as low power, high brightness, long life and environment friendly. An LED backlight unit of a flat light source or a flat light source such as a planar light source or a circular light source uses a plurality of LED package arrays mounted on an illumination substrate.

U.S. Patent No. 8,177,391 entitled " TUBE-TYPE OR CHANNEL-TYPE LED LIGHTING APPARATUS " discloses an optical source lighting apparatus using a conventional LED package. Conventional lighting devices are manufactured using a conventional LED package comprising LED chips, lead frames, reflectors, moldings, and the like. According to the LED package, light emitted through the side surface of the LED chip is refracted by the reflector constituting the body portion and is emitted to the upper surface of the LED package. Accordingly, there is an effect that the luminance of the upper surface of the LED package is increased due to refraction of the side light of the reflector.

However, according to this embodiment, since the side light emission of the LED package is suppressed, a uniformity of the light is lowered due to a hot spot in which the light source point is seen bright in the light module, and the LED package has a narrow light- It is necessary to arrange the LED package more densely for uniform light emission. Therefore, the manufacturing cost of the lighting module is increased, the manufacturing process is complicated, and the power consumption is increased. Further, in order to secure the light uniformity, the distance between the transparent cover of the lighting module and the diffusion layer of the direct-type LED backlight unit must be spaced apart from each other. As a result, the overall height of the lighting module or backlight unit is increased, There is a problem that it does not meet the trend of the apparatus and the tendency of the interior.

U.S. Patent No. 8,177,391 entitled " TUBE-TYPE OR CHANNEL-TYPE LED LIGHTING APPARATUS "

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and it is an object of the present invention to provide a side-emitting LED package, a lighting array module including the same, and a method of manufacturing the same by utilizing a wide light directing angle of a side- It is an object of the present invention to reduce the number of LED packages used in a lighting device or a backlight unit, or to reduce the height of a lighting device or a backlight unit to provide a slim appearance.

The side light emitting LED package, the light emitting array module including the same, and the method of manufacturing the same according to the embodiment of the present invention are formed such that the entire LED package area is 150% to 300% of the area of the LED chip, Another object is to increase the light directing angle by increasing the light transmission probability of light.

The LED package according to an embodiment of the present invention, the lighting array module including the LED package, and the method of manufacturing the same may further include a light emitting layer formed on the side surface of the LED package, It is a further object to increase the light directing angle by increasing the transmission probability.

Finally, the LED package according to the embodiment of the present invention, the illumination array module including the LED package, and the method of manufacturing the same may further include an extension portion extending to the other side of the first conductive pattern formed on one side of the LED package substrate Another object is to improve the process efficiency of the wire bonding process.

In order to achieve the above object, the present invention provides a method of manufacturing an illumination array module, comprising: a first step of forming a substrate including N LED package substrates; A second step of placing N LED chips on the upper surface of the N LED packages, respectively; The first conductive pattern of the LED package substrate and the first conductive type electrode exposed on the upper surface of the LED chip are electrically connected to each other to electrically connect the second conductive pattern of the LED package substrate and the second conductive pattern exposed on the upper surface of the LED chip, A third step of electrically connecting the electrodes; A fourth step of forming a fluorescent layer on the front surface of the substrate so that the upper surface of the substrate and the side surface and the upper surface of the LED chip are included; A fifth step of cutting the substrate by N LED package substrate units to form N side light emitting LED packages; And a first connection pad electrically connected to the first conductive pattern of the side-emitting LED package and a second connection pad electrically connected to the second conductive pattern of the side-emitting LED package are electrically connected to connection electrodes of the light- And arranging the plurality of side-emission LED packages on the light-emitting array substrate in such a manner as to be spaced apart from each other.

In the method of manufacturing an LED array module according to an embodiment of the present invention, the LED package substrate is formed in an area of 150% to 300% of the upper surface area of the LED chip in the first step.

In the method of manufacturing an illumination array module according to an embodiment of the present invention, in the fourth step, the fluorescent layer is formed at a maximum height of 200% to 600% of the height of the LED chip.

The first conductive pattern is located on one side of the upper surface of the LED package substrate and the second conductive pattern is located on the upper side of the upper surface of the LED package substrate according to the embodiment of the present invention, Wherein the first conductive pattern is formed on the other side of the LED package substrate, and the LED package substrate is formed such that a part of the first conductive pattern includes an extension extending to the other side of the upper surface of the LED package substrate, And the LED chip is mounted on the first conductive type electrode. In the third step, the extended portion and the first conductive type electrode are connected by wire bonding, and the second conductive type pattern and the second conductive type electrode are connected by wire bonding. do.

In the method of manufacturing an LED array module according to an embodiment of the present invention, the first step may include forming the first conductive pattern in an area of 40% to 60% of the upper surface area of the LED package substrate, The second conductive pattern is formed in an area of 20% or less of the area of the LED package substrate, the first connection pad is formed in an area of 50% to 70% of the bottom surface area of the LED package substrate, To 30% by area of the first connection pad.

In the method of manufacturing an illumination array module according to an embodiment of the present invention, the first step further includes forming a third conductive pattern on the other side of the upper surface of the LED package substrate, And the bottom surface of the Zener diode are electrically connected to each other. In the third step, the upper surface of the Zener diode and the first conductive pattern are electrically connected to each other.

A method of manufacturing a side-emitting LED package according to the present invention includes: a first step of forming a substrate including N LED package substrates; A second step of placing N LED chips on the upper surface of the N LED packages, respectively; The first conductive pattern of the LED package substrate and the first conductive type electrode exposed on the upper surface of the LED chip are electrically connected to each other to electrically connect the second conductive pattern of the LED package substrate and the second conductive pattern exposed on the upper surface of the LED chip, A third step of electrically connecting the electrodes; A fourth step of forming a fluorescent layer on the front surface of the substrate so that the upper surface of the substrate and the side surface and the upper surface of the LED chip are included; And a fifth step of cutting the substrate by N LED package substrate units to form N side light emitting LED packages.

In the method of manufacturing a side-emitting LED package according to an embodiment of the present invention, the first step is to form the LED package substrate with an area of 150% to 300% of the upper surface area of the LED chip.

In the method of manufacturing a side-emitting LED package according to an embodiment of the present invention, the fourth step is to form the fluorescent layer with a maximum height of 200% to 600% of the height of the LED chip.

A light emitting array module according to the present invention comprises: a side light emitting LED package; And a light emitting array substrate electrically connected to the side light emitting LED package and mounting the side light emitting LED package, wherein the side light emitting LED package has a main light emitting surface, a first conductive electrode, An LED chip on which an electrode is formed; A first conductive pattern electrically connected to the first conductive type electrode and a second conductive pattern electrically connected to the second conductive type electrode are formed on an upper surface of the LED chip, 1 conductive pattern and electrically connected to the light array substrate, and a second connection pad electrically connected to the second conductive pattern and electrically connected to the light array substrate are formed, And an LED package substrate having a side surface exposed to the outside; And a fluorescent layer including an upper surface of the LED package substrate, an upper surface of the LED chip, and a side surface of the LED chip on the inner side, the upper surface and the side surface being exposed to the outside, .

The LED package substrate according to an embodiment of the present invention is characterized in that the LED package substrate has an area of 150% to 300% of the upper surface area of the LED chip.

In the illumination array module according to an embodiment of the present invention, the fluorescent layer has a maximum height of 200% to 600% of the height of the LED chip.

In the LED array substrate according to an embodiment of the present invention, the first conductive pattern is located on one side of the upper surface, the second conductive pattern is located on the other side of the upper surface, The LED chip is mounted on the first conductive pattern, the first conductive type electrode is connected to the extended portion by wire bonding, the second conductive type electrode is connected to the second conductive type electrode by wire bonding, Type electrode is connected to the second conductive pattern by wire bonding.

The first conductive pattern may have an area of 40% to 60% of the upper surface area of the LED package substrate, and the second conductive pattern may have a top surface area of the LED package substrate The first connection pad has an area of 50% to 70% of the bottom surface area of the LED package substrate, and the second connection pad has an area of 20% or less of the bottom surface area of the LED package substrate, 30%. ≪ / RTI >

The LED array substrate may further include a third conductive layer on the other surface of the upper surface, the third conductive layer being electrically connected to the bottom surface of the Zener diode. The light emitting diode array module according to the present invention may further include a Zener diode, And a top surface of the Zener diode is electrically connected to the first conductive pattern.

A side-emitting LED package according to the present invention includes: an LED chip having a main emission surface, a first conductive-type electrode, and a second conductive-type electrode formed on an upper surface thereof; A first conductive pattern electrically connected to the first conductive type electrode and a second conductive pattern electrically connected to the second conductive type electrode are formed on an upper surface of the LED chip, 1 conductive pattern and a second connection pad electrically connected to the second conductive pattern are formed, and the bottom and side surfaces of the LED package substrate are exposed to the outside; And a fluorescent layer including an upper surface of the LED package substrate, an upper surface of the LED chip, and a side surface of the LED chip on the inner side, the upper surface and the side surface being exposed to the outside, .

In the LED package according to the embodiment of the present invention, the LED package substrate has an area of 150% to 300% of the upper surface area of the LED chip.

In the side light emitting LED package according to the embodiment of the present invention, the fluorescent layer has a maximum height of 200% to 600% of the height of the LED chip.

The side light emitting LED package, the light emitting array module including the same, and the manufacturing method thereof according to the present invention can be used for a lighting device or a backlight unit by using a wide light directing angle of a side light emitting LED package without a reflector. And to provide a slim appearance by lowering the height of the lighting device or the backlight unit.

The side light emitting LED package, the light emitting array module including the same, and the method of manufacturing the same according to the embodiment of the present invention are formed such that the entire LED package area is 150% to 300% of the area of the LED chip, Another object is to increase the light directing angle by increasing the light transmission probability of light.

The LED package according to an embodiment of the present invention, the lighting array module including the LED package, and the method of manufacturing the same may further include a light emitting layer formed on the side surface of the LED package, It is a further object to increase the light directing angle by increasing the transmission probability.

Finally, the LED package according to the embodiment of the present invention, the illumination array module including the LED package, and the method of manufacturing the same may further include an extension portion extending to the other side of the first conductive pattern formed on one side of the LED package substrate Another object is to improve the process efficiency of the wire bonding process.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a top view of a substrate of a first stage of a method of manufacturing a light array according to an embodiment of the present invention.
2 is a top view of an LED package substrate in a first step of a method of manufacturing a light array according to an embodiment of the present invention.
3 is a process diagram showing an upper surface of a substrate in a first step of a method of manufacturing a light array according to an embodiment of the present invention;
4 is a bottom view of an LED package substrate in a first step of a method of manufacturing a light array according to an embodiment of the present invention.
5 is a view showing an upper surface of a substrate and an LED chip in a second step of a method of manufacturing a light array according to an embodiment of the present invention.
6 is a top view of an LED package substrate and an LED chip in a second step of the method of manufacturing a light array according to an embodiment of the present invention.
7 is a top view of a substrate and an LED chip in a third step of the method of manufacturing a light array according to an embodiment of the present invention.
9 is a view showing a top surface, an LED chip, and a fluorescent layer of an LED package substrate in a fourth step of the method for manufacturing a light array according to the embodiment of the present invention.
10 is a top view of a fluorescent layer of a fourth step of the method for manufacturing a light array according to an embodiment of the present invention.
11 is a view showing a top surface, an LED chip, and a fluorescent layer of an LED package substrate in a fifth step of the method for manufacturing a light array according to the embodiment of the present invention.
12 is a longitudinal sectional view of a side light emitting LED package of a fifth step of the method of manufacturing a light array according to the embodiment of the present invention.
13 is a top view and side view light emitting LED package of a lighting array substrate of a sixth step of the method of manufacturing a light array according to an embodiment of the present invention.
14 is a longitudinal sectional view of a side-emitting LED package and a light-emitting array substrate of a sixth step of the method for manufacturing a light-emitting array according to the embodiment of the present invention.
15 is a process diagram showing a method of manufacturing a light array according to an embodiment of the present invention.
16 is a top view of a substrate on which a plurality of LED package substrates are arranged according to an embodiment of the present invention.
17 is a side view of a substrate on which a plurality of LED package substrates are arranged according to an embodiment of the present invention.
18 is a longitudinal sectional view of a lighting device using a conventional LED package.
19 is a longitudinal sectional view of a lighting apparatus using a side-emitting LED package according to an embodiment of the present invention.
20 is a longitudinal sectional view of a lighting apparatus using a side-emitting LED package according to another embodiment of the present invention.
21 is a graph showing a change in the light directing angle with an increase in the thickness of the transparent layer.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a preferred embodiment of an LED lighting apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings. In this process, the thicknesses of the lines and the sizes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation.

In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout this specification.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, Embodiments that include components replaceable as equivalents in the elements may be included within the scope of the present invention.

Hereinafter, the present invention will be described with reference to the drawings.

15 shows a method of manufacturing a light array module according to the present invention, and Figs. 1 to 14 show the result produced in each step.

First, a first step (S10) of forming a substrate including N LED package substrates 130 as shown in FIG. 1 showing an upper surface of the substrate and a bottom surface of the substrate is performed. The substrate is cut into each LED package substrate 130 through a dicing process in a fifth step S5 described later. The LED package substrate 130 may be a substrate that forms a certain electrical pattern like a normal printed circuit board.

2 shows an upper surface of the LED package substrate 130. Fig. As shown in the figure, the LED package substrate 130 includes a first conductive pattern 131b and a second conductive pattern 131a on an upper surface thereof. Preferably, the first conductive pattern 131b is formed larger than the second conductive pattern 131a so that the LED chip can be mounted later. In this case, the polarities of the LED chips 110 to which the conductive patterns 131a and 131b are connected can be easily distinguished from each other.

FIG. 16 shows a top view of a substrate on which a plurality of LED package substrates 130 are arranged according to an embodiment of the present invention, and FIG. 17 shows a bottom view thereof. More preferably, the first conductive pattern 131b is formed on one side of the LED package substrate 130, and the second conductive pattern 131a is formed on the other side opposite to the one side. 8, one side may have an area of about 50% to 70% from the left end of the LED package substrate 130, and the other side may have an area of about 10% from the right end of the LED package substrate 130, To about 30%. The first conductive pattern 131b may further include an extension extending to the other side of the upper surface of the LED package substrate 130 to facilitate an electrode connection process in a third step S30 described later.

The first conductive pattern 131b is formed in an area of 40% to 60% of the upper surface area of the LED package substrate 130 and the second conductive pattern 131a is formed in an area of the other surface of the upper surface of the LED package substrate 130 It is preferable that the area is 20% or less.

In the first step S10, an electrostatic discharge (ESD), a spark EFT (Electric Fast Transient) generated in the switch, a lighting surge in the air It is preferable to further form a third conductive pattern 131c for mounting the Zener diode 140 used for preventing the introduction of the Zener diode 140,

Fig. 4 shows the bottom surface of the LED package substrate 130. Fig. As shown in the figure, the LED package substrate 130 exposes the first connection pad 132b and the second connection pad 132a on the bottom surface thereof. The connection pads 132a and 132b perform the function of connecting to the illumination array substrate 200 through conductive adhesive means such as solder. The first connection pad 132b is connected to the first conductive pattern 131a through the conductive via 133 passing through the LED package substrate 130 and the second connection pad 132a is also connected to the second conductive pattern 131a through the conductive via, And may be connected to the conductive pattern 131b.

Meanwhile, as shown in FIG. 4, the area of the first connection pad 132b is preferably larger than the area of the second connection pad 132a. In this case, the polarities of the LED chips 110 to which the connection pads 132a and 132b are connected can be easily distinguished from each other.

The first connection pad 132b is formed to have an area of 50% to 70% of the bottom surface area of the LED package substrate 130 and the second connection pad 132a is formed to have an area of 10% to 30% %.

Next, as shown in FIGS. 5 to 6, a second step S20 of mounting N LED chips 110 on the N LED package substrates 130 is performed. The LED chip 110 of the present invention has a lateral surface on which a first conductive type electrode of a main light emitting surface, an n-type electrode or a p-type electrode, and a second conductive type electrode of a p- LED chip 110 is used. Since the LED chip 110 is not necessarily placed on the conductive patterns 131a and 131b because conductive electrodes are not formed on the bottom surface of the chip, heat can be emitted by contact when the LED chip 110 is placed on the metal pattern. 110 may be mounted on the first conductive pattern 131b as shown in FIG.

In the embodiment including the third conductive pattern 131c, it is preferable to mount the Zener diode so that the third conductive pattern 131c and the bottom surface of the Zener diode 140 are electrically connected to each other in the second step S20.

Next, as shown in FIGS. 7 to 8, the first conductive pattern 131b of the LED package substrate 130 is electrically connected to the first conductive type electrode exposed on the upper surface of the LED chip 110, A third step S30 of electrically connecting the second conductive pattern 131a of the package substrate 130 to the second conductive type electrode exposed on the upper surface of the LED chip 110 is performed.

At this time, the conductive patterns 131a and 131b and the conductive electrodes may be electrically connected through a wire bonding process. In the embodiment including the Zener diode 140, it is preferable that the third step S30 electrically connects the upper surface of the Zener diode 140 and the first conductive pattern 131b.

Next, as shown in FIGS. 9 to 10, a fourth step (S40) of forming the fluorescent layer 120 so that the upper surface of the substrate and the side surface and the upper surface of the LED chip 110 are included on the front surface of the substrate . The fluorescent layer 120 may be formed of, for example, a transparent resin layer containing a fluorescent material. The fourth step S40 may be performed by applying, printing, spraying, or depositing the fluorescent layer 120.

The fluorescent layer 120 may be formed to have a flat upper surface as shown in FIG. 9, or may be formed so that the height of the fluorescent layer 120 is constant, that is, the portion where the LED chip 110 is placed protrudes convexly .

The height of the fluorescent layer 120 is related to the light directing angle of the side-emitting LED package 100 of the present invention. 21 is a graph showing changes in the light directing angle depending on the thickness of the transparent layer such as the fluorescent layer 120 or the light transmitting substrate attached to the light emitting surface of the LED chip 120. [ It can be seen that as the thickness of the transparent layer increases to a certain thickness, the light directing angle increases. This is because, if the height of the fluorescent layer 120 is increased, the probability that the light incident on the side surface in the fluorescent layer 120 is greater than the threshold value increases, and the light emission through the side increases.

Therefore, in the fourth step S40, it is preferable to form the fluorescent layer 120 at a maximum height of 200% to 600% of the height of the LED chip 110. [ If the fluorescent layer 120 is formed with a height of 600% or more, the amount of light absorbed in the fluorescent layer becomes larger than the increase in the probability of light transmission to the side, so that the luminance of the side- .

Also, as the area of the cross section of the fluorescent layer 120 is wider than the area of the cross section of the LED chip 110, the probability of light transmission through the side increases as well. For this purpose, it is preferable that the LED package substrate 130 is formed in an area of 150% to 300% of the upper surface area of the LED chip 110 in the first step S10.

Next, as shown in FIGS. 11 to 12, the substrate is cut in units of N LED package substrates 130 to perform a fifth step (S50) of forming N side-emitting LED packages 100. FIG. Since a plurality of LED packages 100 are formed in a large amount through the dicing process, productivity can be increased as compared with a conventional LED package in which an LED chip, a lead frame, and a reflector are individually assembled. In the fifth step S5, the side light emitting LED package 100 of the present invention is manufactured.

Lastly, as shown in FIGS. 13 to 14, the first connection pad 132b electrically connected to the first conductive pattern 131b of the side-emitting LED package 100 and the second connection pad 132b electrically connected to the second conductive pattern 131b of the side- A plurality of side-emitting LED packages 100 are electrically connected to the connection electrode of the illumination array substrate 200 by electrically connecting the second connection pad 132a electrically connected to the conductive pattern 131a to the connection electrodes of the illumination array substrate 200. [ (S60) in which the light array module is mounted so as to be spaced apart from each other.

Hereinafter, the side-emitting LED package 100 and the illumination array module according to the present invention will be described.

First, a side-emitting LED package 100 according to the present invention includes an LED chip 110, an LED package substrate 130, and a fluorescent layer 120 as shown in FIG. The LED chip 110 has a main emission surface, a first conductive type electrode, and a second conductive type electrode on an upper surface thereof.

The LED package substrate 130 includes an LED chip 110 mounted on an upper surface thereof, a first conductive pattern 131b electrically connected to the first conductive-type electrode on the upper surface thereof, and a second conductive pattern 131b electrically connected to the second conductive- A conductive pattern 131a is formed and a first connection pad 132b electrically connected to the first conductive pattern 131b and a second connection pad 132a electrically connected to the second conductive pattern 131a are formed on the bottom surface And the bottom and side surfaces of the LED package substrate 130 are exposed to the outside.

The fluorescent layer 120 includes the upper surface of the LED package substrate 130, the upper surface of the LED chip 110 and the side surface of the LED chip 110 on the inner side and has the same area as that of the LED package substrate 130, And the upper surface and the side surface are exposed to the outside.

The illumination array module according to the present invention includes the above-described side-emitting LED package 100 and the illumination array substrate 200. The illumination array substrate 200 may be a substrate of a linear light source illumination device or a plane light source illumination device or a substrate of a backlight unit. The light emitting array substrate 200 is electrically connected to the side emitting LED package 100 through the first connecting pad 132b and the second connecting pad 132a and functions to mount the side emitting LED package 100 .

The LED package substrate 130 may be configured to have an area of 150% to 300% of the upper surface area of the LED chip 110 in order to increase the light directing angle, And a maximum height of 200% to 600% of the height.

8, the first conductive pattern 131b is located on one side of the upper surface of the LED package substrate 130, the second conductive pattern 131a is located on the other side of the upper surface of the LED package substrate 130, The LED chip 110 is mounted on the first conductive pattern 131b and the first conductive type electrode is connected to the extended portion by wire bonding, The second conductive electrode is preferably connected to the second conductive pattern 131a by wire bonding.

The first conductive pattern 131b has an area of 80% or more of the area of one side of the upper surface of the LED package substrate 130 and the second conductive pattern 131a has an area of the other side of the upper surface of the LED package substrate 130 The first connection pad 132b has an area of at least 80% of the area of one side of the bottom surface of the LED package substrate 130 and the second connection pad 132a has an area of 10% to 30% And an area of 20% or more and 60% or less of the area of the other side of the bottom surface of the LED package substrate 130.

8, the LED array substrate 130 includes a Zener diode 140 (not shown) on the other side of the upper surface, and a Zener diode 140 The upper surface of the Zener diode 140 may be electrically connected to the first conductive pattern 131b by wire bonding or the like.

18 to 20 are views for explaining the effect of the side-emitting LED package according to the present invention. 18 shows a cross section of a conventional illumination array module using a conventional LED package 10 having a narrow light directing angle a including a reflector, and Figs. 19 to 20 are cross- Sectional view of an illumination array module of the present invention using an LED package 100 having a light directing angle b.

Assuming that the pitch between the LED package 10 of the conventional illumination array module is P1 and the height from the illumination array substrate 200 to the transparent cover 300 on the upper side is h1, It is possible to secure a wider pitch P2 than the case where the array module has the same height as the height h1 from the illumination array substrate 200 to the transparent cover 300 on the upper side. Accordingly, there is an effect that the number of the side-emission LED packages 100 constituting the light array module can be reduced.

When the illumination array module of the present invention has the pitch P1 between the LED packages 10 of the conventional illumination array module, the height h2 from the light source array substrate 200 to the transparent cover 300 at the upper portion is reduced . Therefore, the height of the illumination array module can be reduced.

100: side emitting LED package 110: LED chip
120: fluorescent layer 130: LED package substrate
200: illumination array substrate 300: transparent cover

Claims (18)

A first step of forming a substrate including N LED package substrates;
A second step of placing N LED chips on the upper surface of the N LED packages, respectively;
The first conductive pattern of the LED package substrate and the first conductive type electrode exposed on the upper surface of the LED chip are electrically connected to each other to electrically connect the second conductive pattern of the LED package substrate and the second conductive pattern exposed on the upper surface of the LED chip, A third step of electrically connecting the electrodes;
A fourth step of forming a fluorescent layer on the front surface of the substrate so that the upper surface of the substrate and the side surface and the upper surface of the LED chip are included;
A fifth step of cutting the substrate by N LED package substrate units to form N side light emitting LED packages; And
A first connection pad electrically connected to the first conductive pattern of the side-emitting LED package and a second connection pad electrically connected to the second conductive pattern of the side-emitting LED package are electrically connected to connection electrodes of the illumination array substrate And a sixth step of placing the plurality of side-emitting LED packages on the light-emitting array substrate in a spaced-apart relation to each other.
The method according to claim 1,
Wherein the first step forms the LED package substrate with an area of 150% to 300% of the upper surface area of the LED chip.
The method according to claim 1,
Wherein the fourth step forms the fluorescent layer with a maximum height of 200% to 600% of the height of the LED chip.
The method according to claim 1,
Wherein the first conductive pattern is located on one side of the upper surface of the LED package substrate and the second conductive pattern is located on the other side of the upper surface of the LED package substrate, The LED package substrate is formed to include an extension extending to the other side of the upper surface of the package substrate,
The second step may include mounting the LED chip on the first conductive pattern,
Wherein the third step connects the extension portion and the first conductive type electrode by wire bonding and connects the second conductive type pattern and the second conductive type electrode by wire bonding. .
5. The method of claim 4,
The first step may include forming the first conductive pattern in an area of 40% to 60% of the upper surface area of the LED package substrate, forming the second conductive pattern in an area of 20% , Forming the first connection pad in an area of 50% to 70% of the bottom surface area of the LED package substrate, and forming the second connection pad in an area of 10% to 30% of the bottom surface area of the LED package substrate Wherein the light emitting array module comprises a plurality of light emitting diodes.
5. The method of claim 4,
The first step further includes forming a third conductive pattern on the other side of the upper surface of the LED package substrate,
The second step further includes placing the Zener diode so that the bottom surface of the Zener diode is electrically connected to the third conductive pattern,
Wherein the third step electrically connects the upper surface of the Zener diode and the first conductive pattern.
A first step of forming a substrate including N LED package substrates;
A second step of placing N LED chips on the upper surface of the N LED packages, respectively;
The first conductive pattern of the LED package substrate and the first conductive type electrode exposed on the upper surface of the LED chip are electrically connected to each other to electrically connect the second conductive pattern of the LED package substrate and the second conductive pattern exposed on the upper surface of the LED chip, A third step of electrically connecting the electrodes;
A fourth step of forming a fluorescent layer on the front surface of the substrate so that the upper surface of the substrate and the side surface and the upper surface of the LED chip are included; And
And cutting the substrate in units of N LED package substrates to form N side light emitting LED packages.
8. The method of claim 7,
Wherein the first step forms the LED package substrate with an area of 150% to 300% of the upper surface area of the LED chip.
8. The method of claim 7,
Wherein the fourth step forms the fluorescent layer with a maximum height of 200% to 600% of the height of the LED chip.
Side-emitting LED package; And
And a light emitting array substrate electrically connected to the side light emitting LED package and mounting the side light emitting LED package,
The side-emitting LED package includes:
An LED chip having a main emission surface, a first conductive type electrode and a second conductive type electrode formed on an upper surface thereof;
A first conductive pattern electrically connected to the first conductive type electrode and a second conductive pattern electrically connected to the second conductive type electrode are formed on an upper surface of the LED chip, 1 conductive pattern and electrically connected to the light array substrate, and a second connection pad electrically connected to the second conductive pattern and electrically connected to the light array substrate are formed, And an LED package substrate having a side surface exposed to the outside; And
And a fluorescent layer including an upper surface of the LED package substrate, an upper surface of the LED chip, and a side surface of the LED chip on the inner side and having an area equal to an area of the LED package substrate and an upper surface and a side surface exposed to the outside ≪ / RTI >
11. The method of claim 10,
Wherein the LED package substrate has an area of 150% to 300% of a top surface area of the LED chip.
11. The method of claim 10,
Wherein the fluorescent layer has a maximum height of 200% to 600% of the height of the LED chip.
11. The method of claim 10,
Wherein the first conductive pattern is located on one side of the upper surface of the LED package substrate, the second conductive pattern is located on the other side of the upper surface of the LED package substrate,
Wherein the first conductive pattern includes an extension extending to the other side,
Wherein the LED chip is mounted on the first conductive pattern,
Wherein the first conductive type electrode is connected to the extended portion by wire bonding,
Wherein the second conductive type electrode is connected to the second conductive pattern by wire bonding.
14. The method of claim 13,
Wherein the first conductive pattern has an area of 40% to 60% of the upper surface area of the LED package substrate,
Wherein the second conductive pattern has an area of 20% or less of the upper surface area of the LED package substrate,
Wherein the first connection pad has an area of 50% to 70% of the bottom surface area of the LED package substrate,
Wherein the second connection pad has an area of 10% to 30% of the bottom surface area of the LED package substrate.
14. The method of claim 13,
Wherein the illumination array module further comprises a zener diode,
The LED package substrate further includes a third conductive pattern electrically connected to a bottom surface of the Zener diode on the other surface of the upper surface,
And an upper surface of the Zener diode is electrically connected to the first conductive pattern.
An LED chip having a main emission surface, a first conductive type electrode and a second conductive type electrode formed on an upper surface thereof;
A first conductive pattern electrically connected to the first conductive type electrode and a second conductive pattern electrically connected to the second conductive type electrode are formed on an upper surface of the LED chip, 1 conductive pattern and a second connection pad electrically connected to the second conductive pattern are formed, and the bottom and side surfaces of the LED package substrate are exposed to the outside; And
And a fluorescent layer including an upper surface of the LED package substrate, an upper surface of the LED chip, and a side surface of the LED chip on the inner side and having an area equal to an area of the LED package substrate and an upper surface and a side surface exposed to the outside Side LED package.
17. The method of claim 16,
Wherein the LED package substrate has an area of 150% to 300% of a top surface area of the LED chip.
17. The method of claim 16,
Wherein the fluorescent layer has a maximum height of 200% to 600% of the height of the LED chip.

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