KR20150054295A - Scratch test apparatus and adhesion measurement methods of thin film using the same - Google Patents

Abstract

A scratch test apparatus is disclosed. According to an aspect of the present invention, there is provided a plasma display panel comprising: a substrate support for supporting a substrate on which a thin film is formed; A stylus spaced from an upper portion of the substrate support and forming a scratch on the thin film by relative movement with respect to the substrate support and gradually increasing a vertical load for pressing the thin film during relative movement; A first electrode disposed on one side of the relative movement path of the stylus and electrically connected to the thin film; A second electrode disposed on the other side of the relative movement path of the stylus and electrically connected to the thin film; And a measuring unit for detecting a critical vertical load of the stylus at a time point at which peeling occurs between the substrate and the thin film by measuring an electrical parameter between the first electrode and the second electrode in real time during the relative movement of the stylus A scratch test apparatus is provided.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a scratch test apparatus,

The present invention relates to a scratch test apparatus and a method for measuring adhesion of a thin film using the same.

A scratch test apparatus is used to measure the adhesion between the substrate and the thin film formed on the substrate.

The scratch test apparatus horizontally moves the substrate while increasing the vertical load applied to the probe in a state in which the probe is in contact with the thin film. The adhesive force between the substrate and the thin film can be detected indirectly by measuring the vertical load applied to the probe at the time when the thin film is peeled from the substrate.

Here, the time when the thin film is peeled off from the substrate can be confirmed by observing the damaged portion of the thin film through an optical microscope or the like. For example, when the thickness of the thin film is reduced and the radius of curvature of the probe tip is reduced, there is a limit to the observation through the optical microscope, and a scanning electron microscope (SEM, scanning electron microscope) or a three-dimensional observation through a 3D-profiler.

The background art of the present invention is disclosed in Korean Utility Model Publication No. 20-2012-0003478 (2012.05.18, fixed jig for scratch test).

It is an object of the present invention to provide a scratch test apparatus capable of quickly detecting the adhesion of a very thin film without using a scanning electron microscope or a three-dimensional measuring instrument, and a method for measuring the adhesion of a thin film using the same.

According to an aspect of the present invention, there is provided a plasma display panel comprising: a substrate support for supporting a substrate on which a thin film is formed; A stylus spaced from an upper portion of the substrate support and forming a scratch on the thin film by relative movement with respect to the substrate support and gradually increasing a vertical load for pressing the thin film during relative movement; A first electrode disposed on one side of the relative movement path of the stylus and electrically connected to the thin film; A second electrode disposed on the other side of the relative movement path of the stylus and electrically connected to the thin film; And a measuring unit for detecting a critical vertical load of the stylus at a time point at which peeling occurs between the substrate and the thin film by measuring an electrical parameter between the first electrode and the second electrode in real time during the relative movement of the stylus A scratch test apparatus is provided.

The measuring unit may detect the vertical load at which the stylus presses the thin film at the time when the electrical parameter is discontinuously changed to the critical vertical load.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, comprising: providing a substrate on which a thin film is formed; Disposing the substrate on an upper surface of the substrate support; Disposing a stylus on top of the substrate support to contact the thin film; Disposing a first electrode and a second electrode on both sides of the anticipated movement path of the stylus, the first electrode and the second electrode being electrically connected to the thin film; Gradually increasing the vertical load at which the stylus presses the thin film during relative movement while transferring the substrate support or the stylus to cause relative movement of the stylus; Measuring in real time electrical parameters between the first electrode and the second electrode during relative movement of the stylus; And a step of detecting a critical vertical load of the stylus at a time point at which peeling occurs between the substrate and the thin film based on the change in the electrical parameter.

The critical vertical load may be detected as a vertical load at which the stylus presses the thin film at a time when the electrical parameter is discontinuously changed.

The thin film may be made of a conductive thin film, and the electrical parameter may be electrical resistance.

The thin film may be made of a non-conductive thin film, and the electrical parameter may be a capacitance.

According to embodiments of the present invention, by adding a first electrode, a second electrode, a measuring unit, and the like to an existing scratch test apparatus, the peeling point between the substrate and the thin film can be measured in real time without using a scanning electron microscope or a three- Can be detected. As a result, it is possible to reduce the time and cost required for measuring the adhesive force of the thin film, and the existing scratch test apparatus can be utilized.

1 is a view showing a scratch test apparatus according to an embodiment of the present invention.
2 is a side view of a scratch test apparatus according to an embodiment of the present invention.
3 is a view illustrating a method of measuring the adhesion of a thin film according to another embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present invention, the term "comprises" or "having ", etc. is intended to specify that there is a feature, number, step, operation, element, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a scratch test apparatus according to the present invention and a method for measuring an adhesive force of a thin film using the same will be described in detail with reference to the accompanying drawings. In the following description, And the description thereof will be omitted.

FIG. 1 is a view showing a scratch test apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of a scratch test apparatus according to an embodiment of the present invention.

1 and 2, a scratch test apparatus according to an embodiment of the present invention includes a substrate support 100, a stylus 110, a first electrode 120, a second electrode 130, and a measurement unit 140 ).

The substrate support 100 supports the substrate 10 to be scratch tested.

Specifically, the substrate 10 is disposed on the upper surface of the substrate supporting part 100, and the substrate 10 can be fixed to the substrate supporting part 100 by using a clamping device provided on the substrate supporting part 100. A thin film 20 is formed on one surface of the substrate 10. The scratch test is performed to measure the adhesive force between the substrate 10 and the thin film 20.

The stylus 110 is spaced apart from the upper portion of the substrate support 100.

The lower end of the stylus 110 may have a predetermined radius of curvature and contact the thin film 20 on the substrate 10 supported by the substrate support 100.

The stylus 110 or the substrate support 100 may be horizontally conveyed by a drive device. As a result, the stylus 110 can relatively move horizontally relative to the substrate support 100, and can form a scratch 30 on the thin film 20 that contacts the lower end of the stylus 110. The relative movement direction of the stylus 110 is indicated by an arrow in the horizontal direction in Fig.

The driving device for horizontally transporting the stylus 110 or the substrate supporting part 100 can utilize the device used in the conventional scratch testing device as it is.

The stylus 110 applies a vertical load to the thin film 20 during relative movement.

To this end, it is possible to further include a pressing device for pressing the stylus 110 downward. The pressurizing device can be controlled so that the vertical load at which the stylus 110 presses the thin film 20 gradually increases during the relative movement of the stylus 110. [ As a result, only the scratches are formed on the thin film 20 in a section where the vertical load of the stylus 110 is smaller than a certain value, that is, the critical vertical load. However, when the critical vertical load is reached, A phenomenon occurs.

The pressing device for pressing down the stylus 110 can utilize the device used in the conventional scratch testing device as it is.

The first electrode 120 and the second electrode 130 are disposed on the thin film 20.

The first electrode 120 is disposed on one side of the relative movement path of the stylus 110.

The second electrode 130 is disposed on the other side of the relative movement path of the stylus 110, that is, on the side opposite to the first electrode 120.

The measuring unit 140 can detect the vertical load applied to the stylus 110, that is, the critical vertical load, at the time when the substrate 10 peels between the thin films 20.

For this purpose, the measuring unit 140 may measure any or all of the electrical parameters, such as electrical resistance and capacitance, between the first electrode 120 and the second electrode 130 during the relative movement of the stylus 110, . It can be seen that peeling occurs between the substrate 10 and the thin film 20 at the time when the electrical parameter is discontinuously changed. For example, when the thin film 20 is made of a conductive material, if peeling occurs between the substrate 10 and the thin film 20, a part of the thin film between the first electrode 120 and the second electrode 130 The electrical resistance between the first electrode 120 and the second electrode 130 is discontinuously increased. In this case, the substrate 20 may be made of a nonconductive material, unlike the thin film 10 which is conductive. On the other hand, if the thin film 20 is made of a nonconductive material, if peeling occurs between the substrate 10 and the thin film 20, a part of the thin film that connects the first electrode 120 and the second electrode 130 The capacitance between the first electrode 120 and the second electrode 130 is discontinuously reduced. In this case, the substrate 20 may be made of a conductive material, unlike the non-conductive thin film 10. When the peeling point between the substrate 10 and the thin film 20 is detected, the vertical load at which the stylus 110 presses the thin film 20 at the peeling point can be detected as a critical vertical load. The method of calculating the adhesive force between the substrate 10 and the thin film 20 at the critical vertical load of the stylus 110 is a known technique and will not be described in detail.

3 is a view illustrating a method of measuring the adhesion of a thin film according to another embodiment of the present invention.

Referring to FIG. 3, the method for measuring adhesion of a thin film according to another embodiment of the present invention includes steps of providing a substrate S100, placing a substrate S110, placing a stylus S120, (S140) of transferring a substrate support or a stylus (S140), measuring electrical parameters in real time (S150), and detecting a critical vertical load of the stylus (S160) do.

First, a substrate 10 on which a thin film 20 is formed on one surface is provided (S100).

The substrate 10 may be made of a non-conductive material when the thin film 20 is made of a conductive material. Conversely, the substrate 10 may be made of a conductive material when the thin film 20 is made of a non-conductive material.

Next, the substrate 10 is placed on the upper surface of the substrate supporting unit 100 (S110).

The substrate 10 is supported by the substrate support 100, and the thin film 20 is exposed upward. The substrate 10 may be fixed to the substrate supporting part 100 by a clamping device or the like provided on the substrate supporting part 100.

Next, the stylus 110 is placed on the upper portion of the substrate supporting unit 100 (S120).

At this time, the lower end of the stylus 110 is disposed in contact with the thin film 20 on the substrate 10 supported by the substrate supporting portion 100.

Next, the first electrode 120 and the second electrode 130 are disposed on both sides of the anticipated movement path of the stylus 110 (S130).

The first electrode 120 and the second electrode 130 are installed to be electrically connected to the thin film 20. Specifically, the first electrode 120 is disposed on one side of the anticipated movement path of the stylus 110, and the second electrode 130 is disposed on the other side of the anticipated movement path of the stylus 110, One electrode (120).

Next, the substrate supporting unit 100 or the stylus 110 is horizontally conveyed (S140).

The stylus 110 can relatively move in the horizontal direction with respect to the substrate supporting part 100 by the horizontal transfer of the stylus 110 or the substrate supporting part 100 and the thin film 20 contacting the lower end of the stylus 110 The scratches 30 can be formed.

The stylus 110 applies a vertical load to the thin film 20 during relative movement.

The vertical load at which the stylus 110 presses the thin film 20 can be controlled to gradually increase during the relative movement of the stylus 110. [ As a result, only the scratches are formed on the thin film 20 in a section where the vertical load of the stylus 110 is smaller than a certain value, that is, the critical vertical load. However, when the critical vertical load is reached, A phenomenon occurs.

Next, electrical parameters between the first electrode 120 and the second electrode 130 are measured in real time during the relative movement of the stylus 110 (S150).

The electrical resistance and capacitance can be measured simultaneously, or the electrical resistance or capacitance can be measured with electrical parameters. For example, when the thin film 20 is made of a conductive material, only electrical resistance can be measured. Conversely, when the thin film 20 is made of a nonconductive material, only the capacitance can be measured.

The electrical parameters remain almost constant in the section where the vertical load of the stylus 110 is smaller than the critical vertical load, that is, in the section where only the scratch is formed in the thin film 20, but the vertical load of the stylus 110 reaches the critical vertical load It is possible to measure the electrical parameter discontinuously increasing or decreasing in the section where the peeling phenomenon occurs between the substrate 10 and the thin film 20.

Next, the critical vertical load of the stylus 110 at the point of time of peeling between the substrate 10 and the thin film 20 is detected based on the change of the electrical parameter (S160).

As described above, it can be measured that the electrical parameter changes discontinuously at the time when the peeling phenomenon occurs between the substrate 10 and the thin film 20. [

As a result, the vertical load at which the stylus 110 presses the thin film 20 at the time of peeling can be detected as a critical vertical load. A method of calculating the adhesive strength between the substrate 10 and the thin film 20 at the critical vertical load of the stylus 110 is a known technique and will not be described in detail.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims and their equivalents. And such changes are, of course, within the scope of the claims.

10: substrate
20: Thin film
30: Scratch
100:
110: Stylus
120: first electrode
130: second electrode
140:

Claims (8)

A substrate support for supporting a substrate on which a thin film is formed;
A stylus spaced from an upper portion of the substrate support and forming a scratch on the thin film by relative movement with respect to the substrate support and gradually increasing a vertical load for pressing the thin film during relative movement;
A first electrode disposed on one side of the relative movement path of the stylus and electrically connected to the thin film;
A second electrode disposed on the other side of the relative movement path of the stylus and electrically connected to the thin film; And
And a measuring unit for detecting a critical vertical load of the stylus at a time point at which peeling occurs between the substrate and the thin film by measuring an electrical parameter between the first electrode and the second electrode in real time during the relative movement of the stylus Scratch test apparatus.
The method according to claim 1,
Wherein the measuring unit detects the vertical load at which the stylus presses the thin film at the time when the electrical parameter is discontinuously changed to the critical vertical load.
The method according to claim 1,
The thin film is made of a conductive thin film,
Wherein the electrical parameter is an electrical resistance.
The method according to claim 1,
Wherein the thin film is made of a nonconductive thin film,
Wherein the electrical parameter is a capacitance.
Providing a substrate on which a thin film is formed;
Disposing the substrate on an upper surface of the substrate support;
Disposing a stylus on top of the substrate support to contact the thin film;
Disposing a first electrode and a second electrode on both sides of the anticipated movement path of the stylus, the first electrode and the second electrode being electrically connected to the thin film;
Gradually increasing the vertical load at which the stylus presses the thin film during relative movement while transferring the substrate support or the stylus to cause relative movement of the stylus;
Measuring in real time electrical parameters between the first electrode and the second electrode during relative movement of the stylus; And
And measuring a critical vertical load of the stylus at a time point at which peeling occurs between the substrate and the thin film based on the change in the electrical parameter.
6. The method of claim 5,
Wherein the critical vertical load is detected as a vertical load at which the stylus presses the thin film at a time when the electrical parameter is discontinuously changed.
6. The method of claim 5,
The thin film is made of a conductive thin film,
Wherein the electrical parameter is an electrical resistance. ≪ RTI ID = 0.0 > 11. < / RTI >
6. The method of claim 5,
Wherein the thin film is made of a nonconductive thin film,
Wherein the electrical parameter is an electric capacity. ≪ RTI ID = 0.0 > 11. < / RTI >

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