KR20160058059A - 레이저 발진 기구 - Google Patents
레이저 발진 기구 Download PDFInfo
- Publication number
- KR20160058059A KR20160058059A KR1020150159830A KR20150159830A KR20160058059A KR 20160058059 A KR20160058059 A KR 20160058059A KR 1020150159830 A KR1020150159830 A KR 1020150159830A KR 20150159830 A KR20150159830 A KR 20150159830A KR 20160058059 A KR20160058059 A KR 20160058059A
- Authority
- KR
- South Korea
- Prior art keywords
- laser beam
- optical path
- acousto
- pulsed laser
- oscillator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
- G02F1/33—Acousto-optical deflection devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/10007—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating in optical amplifiers
- H01S3/10023—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating in optical amplifiers by functional association of additional optical elements, e.g. filters, gratings, reflectors
- H01S3/1003—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating in optical amplifiers by functional association of additional optical elements, e.g. filters, gratings, reflectors tunable optical elements, e.g. acousto-optic filters, tunable gratings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1814—Diffraction gratings structurally combined with one or more further optical elements, e.g. lenses, mirrors, prisms or other diffraction gratings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/106—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity
- H01S3/1068—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using an acousto-optical device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Electromagnetism (AREA)
- Laser Beam Processing (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Lasers (AREA)
Abstract
[해결수단] 레이저 발진 기구로서, 펄스 레이저 광선을 발진하는 펄스 레이저 발진기와, 펄스 레이저 발진기가 발진한 펄스 레이저 광선의 광로의 각도를 변경하는 광로 변경 수단을 포함한다. 광로 변경 수단은, 펄스 레이저 발진기가 발진한 레이저 광선의 광로를 유효 영역에서 변경하는 음향 광학 소자를 이용한 음향 광학 편향 수단과, 음향 광학 편향 수단의 음향 광학 소자에 의해 광로의 각도가 변경된 펄스 레이저 광선 중 배제하고자 하는 펄스 레이저 광선을 유효 영역으로부터 굴절하여 배제하는 체적 회절 격자에 의해 구성되어 있다.
Description
도 2는 레이저 발진 기구를 장비한 레이저 광선 조사 수단의 블록 구성도.
3 : 척 테이블 기구
36 : 척 테이블
37 : X축 방향 이동 수단
38 : Y축 방향 이동 수단
4 : 레이저 광선 조사 유닛
5 : 레이저 광선 조사 수단
50 : 레이저 발진 기구
51 : 펄스 레이저 광선 발진기
52 : 광로 변경 수단
53 : 음향 광학 편향 수단
531 : 음향 광학 소자(AOD)
54 : 체적 회절 격자(VBG)
55 : 레이저 광선 흡수 수단
56 : 집광기
562 : 텔리센트릭 fθ 렌즈
6 : 촬상 수단
7 : 제어 수단
Claims (1)
- 레이저 발진 기구에 있어서,
펄스 레이저 광선을 발진하는 펄스 레이저 발진기; 및
상기 펄스 레이저 발진기가 발진한 펄스 레이저 광선의 광로의 각도를 변경하는 광로 변경 수단
을 구비하고,
상기 광로 변경 수단은,
상기 펄스 레이저 발진기가 발진한 펄스 레이저 광선의 광로를 유효 영역에서 변경하는 음향 광학 소자를 포함하는 음향 광학 편향 수단; 및
상기 음향 광학 소자에 의해 광로의 각도가 변경된 펄스 레이저 광선 중 배제하고자 하는 펄스 레이저 광선을 상기 유효 영역으로부터 굴절하여 배제하는 체적 회절 격자
를 포함하는 것을 특징으로 하는, 레이저 발진 기구.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2014-231419 | 2014-11-14 | ||
| JP2014231419A JP2016096241A (ja) | 2014-11-14 | 2014-11-14 | レーザー発振機構 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20160058059A true KR20160058059A (ko) | 2016-05-24 |
Family
ID=55855673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150159830A Ceased KR20160058059A (ko) | 2014-11-14 | 2015-11-13 | 레이저 발진 기구 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20160139488A1 (ko) |
| JP (1) | JP2016096241A (ko) |
| KR (1) | KR20160058059A (ko) |
| CN (1) | CN105598581A (ko) |
| DE (1) | DE102015222440A1 (ko) |
| TW (1) | TW201629610A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180104565A (ko) * | 2017-03-13 | 2018-09-21 | 가부시기가이샤 디스코 | 레이저 가공 장치 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11813697B1 (en) * | 2023-04-07 | 2023-11-14 | Intraaction Corp | Laser methods of fabrication of clothing |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54150147A (en) * | 1978-05-17 | 1979-11-26 | Canon Inc | Light attenuator |
| WO1993025387A1 (en) * | 1992-06-11 | 1993-12-23 | Zed Instruments Ltd. | Engraving head |
| JP4009114B2 (ja) * | 2002-02-06 | 2007-11-14 | 株式会社リコー | レーザ光学装置 |
| JP4917382B2 (ja) * | 2006-08-09 | 2012-04-18 | 株式会社ディスコ | レーザー光線照射装置およびレーザー加工機 |
| JP2008126306A (ja) * | 2006-11-24 | 2008-06-05 | Sumitomo Heavy Ind Ltd | レーザ加工装置、及び、レーザ加工方法 |
| JP5010978B2 (ja) | 2007-05-22 | 2012-08-29 | 株式会社ディスコ | レーザー加工装置 |
| JP4847435B2 (ja) * | 2007-12-11 | 2011-12-28 | 住友重機械工業株式会社 | レーザ加工装置、及び、レーザ加工方法 |
| TWI523720B (zh) * | 2009-05-28 | 2016-03-01 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| JP5833359B2 (ja) * | 2011-07-01 | 2015-12-16 | 株式会社ディスコ | レーザー光線照射装置 |
| DE112012002844T5 (de) * | 2011-07-05 | 2014-04-24 | Electronic Scientific Industries, Inc. | Verfahren zur Laserbearbeitung mit einem thermisch stabilisierten akustooptischen Strahlablenker und thermisch stabilisiertes Hochgeschwindigkeits-Laserbearbeitungssystem |
| JP5964604B2 (ja) * | 2012-02-09 | 2016-08-03 | 株式会社ディスコ | レーザー加工装置 |
-
2014
- 2014-11-14 JP JP2014231419A patent/JP2016096241A/ja active Pending
-
2015
- 2015-10-13 TW TW104133534A patent/TW201629610A/zh unknown
- 2015-11-05 US US14/933,240 patent/US20160139488A1/en not_active Abandoned
- 2015-11-11 CN CN201510770100.7A patent/CN105598581A/zh active Pending
- 2015-11-13 KR KR1020150159830A patent/KR20160058059A/ko not_active Ceased
- 2015-11-13 DE DE102015222440.6A patent/DE102015222440A1/de active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180104565A (ko) * | 2017-03-13 | 2018-09-21 | 가부시기가이샤 디스코 | 레이저 가공 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105598581A (zh) | 2016-05-25 |
| JP2016096241A (ja) | 2016-05-26 |
| DE102015222440A1 (de) | 2016-05-19 |
| US20160139488A1 (en) | 2016-05-19 |
| TW201629610A (zh) | 2016-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5912293B2 (ja) | レーザー加工装置 | |
| CN103128441B (zh) | 激光加工装置 | |
| US9656347B2 (en) | Laser processing method for forming a laser processed hole in a work piece | |
| KR20160065766A (ko) | 레이저 가공 장치 | |
| KR101953918B1 (ko) | 레이저 가공 장치 | |
| KR102662458B1 (ko) | 레이저 가공 장치 | |
| KR20150050357A (ko) | 레이저 가공 장치 | |
| KR20160040097A (ko) | 레이저 가공 장치 | |
| US9802270B2 (en) | Laser machining apparatus | |
| JP2014104484A (ja) | レーザー加工装置 | |
| KR20150116400A (ko) | 요철 검출 장치 | |
| KR20180119124A (ko) | 레이저 가공 방법 | |
| KR20130135061A (ko) | 레이저 가공 장치 | |
| KR20160042383A (ko) | 웨이퍼의 가공 방법 | |
| KR20150146411A (ko) | 레이저 가공 장치 | |
| JP2016107330A (ja) | レーザー加工装置およびウエーハの加工方法 | |
| KR101886357B1 (ko) | 레이저 광선의 스폿 형상 검출 방법 및 스폿 형상 검출 장치 | |
| TWI610350B (zh) | 改質層形成方法 | |
| JP6433264B2 (ja) | 透過レーザービームの検出方法 | |
| KR20160058059A (ko) | 레이저 발진 기구 | |
| JP6430790B2 (ja) | レーザー加工装置 | |
| JP6552948B2 (ja) | ウエーハの加工方法、及び加工装置 | |
| JP6510829B2 (ja) | レーザー加工装置 | |
| JP6487184B2 (ja) | レーザー発振機構 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20151113 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20191114 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20151113 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20200922 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20210311 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20200922 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |