KR20170091620A - Hybrid heat transfer system - Google Patents

Abstract

According to one aspect, a hybrid heat transfer system includes a first thermally conductive path configured to passively pass heat between a load having a load temperature (T _L ) and a surrounding environment having an ambient temperature (T _A ) A second thermally-conductive path configured to actively transmit heat in the second path, the second path including a heat pump.

Description

[0001] HYBRID HEAT TRANSFER SYSTEM [0002]

This application claims priority from U.S. Provisional Application No. 62 / 088,362, filed December 5, 2014, entitled "High Efficiency Hybrid Heat Removal System", the entirety of which is incorporated herein by reference.

FIELD OF THE INVENTION [0002] The field of the invention relates generally to heat removal systems, and more particularly to hybrid heat transfer systems.

Concerns about limited resources and the environment have greatly increased the demand for energy conservation. This led to the development of energy efficient devices. For example, current energy-efficient refrigerators use nearly 40% less energy than models over 15 years ago. The ability to further improve the efficiency of energy-efficient refrigerators is limited by the need for a variety of performance. For example, a consumer needs a refrigerator that operates over a wide temperature range and adapts to severe changes while maintaining accurate temperature control.

Conventional refrigeration technology uses passive or active cooling technology. As used herein, the term "passive " refers to heat transfer when used in connection with heating or cooling, for example, without requiring additional energy through natural processes such as conduction, convection, radiation, and the like. As used herein, the term "active" when used in connection with heating or cooling means that additional energy (e. G., Through the use of a power consuming device such as a compressor, heat pump, Peltier junctions, For example, electricity) to occur. As such, an active cooling system is a system that consumes energy to cool something, unlike passive cooling, which does not consume energy.

The most common type of energy efficient refrigerator uses a vapor compression system. In such a system, mechanical components consume energy to actively carry heat. These components may include a compressor, a condenser, a thermal expansion valve, an evaporator, piping and thermostats that circulate the working fluid (e.g., refrigerant). The components circulate the refrigerant undergoing a forced phase change to transfer heat from the cooling chamber to the external environment. Non-universal refrigeration systems include thermoelectric cooling systems. In such a system, the heat pump consumes energy from a passive subsystem that receives heat from the cooling chamber to actively carry heat to another passive subsystem that rejects heat to the external environment.

Because the refrigeration system is generally highly insulated, there is no thermally conductive pathway that can transfer heat from the cooling chamber to the outside environment with only passive transfer. For this reason, this cooling system has no means to reject heat from the cooling chamber if the active component fails.

This problem also plagues active systems designed to maintain the internal chamber at a set temperature, regardless of the temperature of the external environment: if the active component fails, it can transfer heat to heat or cool the inner chamber as needed There is no thermally conductive path. Also, the absence of an alternative passive path means that external environmental conditions can not be utilized to reduce power consumption. For example, if the chamber needs to be warmed up slightly and the outside environment is warmer than the chamber, the chamber may be warmed up through passive heat transfer instead of through an active device due to the presence of an alternative passive path, Eliminate the need to consume (and pay for) the energy that the active device would use. The same applies to chambers that need to be slightly cooled if the external environment is colder than the chamber: passive path transfers heat from the chamber to the external environment without the need to consume additional energy to operate the heat pump, compressor, .

Thus, there is a need for a heat transfer system and method that provides higher energy efficiency at lower cost while maintaining a variety of performances.

A system and method for a hybrid heat transfer system is disclosed.

According to one aspect, a hybrid heat transfer system includes a first thermally conductive path configured to passively pass heat between a load having a load temperature (T _L ) and a surrounding environment having an ambient temperature (T _A ) A second thermally-conductive path configured to actively transmit heat in the second path, the second path including a heat pump.

According to one aspect, when the heat pump is in the activated or deactivated state and the heat pump is in the activated state, heat is actively delivered through the second thermally conductive path, and when the heat pump is in the inactive state, And is not actively transmitted through the second thermally conductive path.

According to one aspect, when the heat pump is inactive, the heat is passively delivered through the second thermally conductive path.

According to one aspect, each of the first and second paths includes its own separate heat exchange component for transferring heat to or from the load. According to one aspect, the first and second paths share a common heat exchange component for transferring heat to or from the load.

According to one aspect, each of the first and second paths includes its own separate heat exchange component for transferring heat to or from the ambient environment. According to one aspect, the first and second paths share a common heat exchange component for transferring heat to or from the ambient environment.

According to one aspect, the first thermally conductive path includes a thermal diode in series between the load and the ambient environment. According to one aspect, a thermal diode allows heat transfer from the load to the environment and blocks heat transfer from the ambient environment to the load. According to one aspect, the thermal diode comprises a thermal siphon.

According to one aspect, the second thermally conductive path includes a thermal diode in series between the load and the ambient environment. According to one aspect, the thermal diode is in series between the load and the heat pump.

According to one aspect, the second thermally conductive path includes a thermal capacitor in series between the load and the ambient environment. According to one aspect, the second thermally conductive path includes a thermal capacitor in series between the load and the heat pump. According to one aspect, the thermal capacitor comprises a phase change material and / or a thermal mass.

According to one aspect, the second thermally conductive path includes a thermal diode, a thermal capacitor and a heat pump in series between the load and the ambient environment. According to one aspect, the second thermally conductive path includes a thermal diode and a thermal capacitor in series between the load and the heat pump.

According to one aspect, the first thermally conductive path also includes a heat pump.

According to one aspect, a hybrid heat transfer system includes a thermally conductive path for transferring heat from a load having a load temperature (T _L ) to a surrounding environment having an ambient temperature (T _A ), the thermally conductive path comprising a storage temperature T _S , a heat pump having an active state in which heat is actively delivered by a heat pump and an inactive state in which heat is not actively delivered by a heat pump, and a thermal diode, And are connected in series between the surrounding environments.

According to one aspect, the thermal capacitor comprises a phase change material and / or a thermal mass.

According to one aspect, the first side of the thermal capacitor contacts the load, the first side of the heat pump contacts the second side of the thermal capacitor, the first side of the thermal diode contacts the second side of the heat pump, Lt; / RTI > transfers heat to the surrounding environment.

According to one aspect, a hybrid heat transfer system includes a first component for active heating and / or cooling of a load, the operation of the first component being controlled by at least one control input, and at least one And a control system configured to control operation of the first component via a control input.

According to one aspect, a control system has at least one temperature sensor and hardware, receives temperature information from at least one temperature sensor, processes the information according to an algorithm to determine a desired operation of the first component, And a controller configured to control operation of the first component.

According to one aspect, the controller controls the operation of the first component through activation and switching circuitry between the controller and the first component.

According to another aspect, there is provided a method of operating a semiconductor device comprising: a first thermally conductive path for passively transferring heat between a load having a load temperature (T _L ) and a surrounding environment having an ambient temperature (T _A ) A method for controlling a hybrid heat transfer system comprising a second thermally conductive path for transferring heat and a second path comprising a heat pump, the method comprising monitoring the values of T _L and T _A. If T _L is determined to be greater than the first threshold T _LH , then if T _A is greater than or equal to T _L , the heat pump is activated to actively transfer heat from the load to the environment through the second path ; However, if T _A is less than T _L , then the step of deactivating the heat pump is such that the heat is not actively transferred from the load to the environment through the second path (e.g., Lt; / RTI > to the surrounding environment). If T _L is determined to be less than the second threshold T _LL , then if T _A is less than or equal to T _L , the heat pump is activated to actively transfer heat from the ambient environment to the load through the second path ; However, if T _A is greater than T _L , then the step of deactivating the heat pump is such that the heat is not actively delivered from the ambient environment to the load through the second path (e.g., Lt; / RTI > to the load). T _LL ? T _L ? T _LH , it does not change the current operating state (activation or deactivation) of the heat pump.

The methods and systems described herein provide improved efficiency at lower cost while improving variety of performance, such as operating at wide temperature ranges and cooling rates, while maintaining accurate control of temperature.

Those skilled in the art will understand the scope of the invention and will realize additional aspects thereof after reading the following detailed description of the preferred embodiments with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate several aspects of the disclosure and, together with the description, serve to explain the principles of the disclosure.
1A illustrates an exemplary structure of a hybrid heat transfer system according to an embodiment of the present invention, wherein the system includes first and second thermally conductive paths for transferring heat between a load and an ambient environment, And a heat pump.
1B shows an orthogonal view of an exemplary hybrid heat transfer system in accordance with an embodiment of the present invention in which the first path is in the upwind from the second path so that the heat from the active second path is the performance of the passive first path Lt; / RTI >
FIG. 1C illustrates a functional description of the system of FIG. 1A according to one embodiment of the present invention.
Figure 1D shows a flow diagram of an exemplary method for a hybrid heat transfer system in accordance with an embodiment of the present invention.
2A and 2B respectively illustrate an exemplary structure and a functional description of a hybrid heat transfer system according to another embodiment of the present invention, wherein the first and second thermally conductive paths are common heat exchange for transferring heat to or from the load Share.
2C and 2D respectively illustrate an exemplary structure and a functional description of a hybrid heat transfer system according to another embodiment of the present invention, wherein the first and second thermally conductive paths are used to transfer heat from or to a surrounding environment Sharing a common heat exchanger.
3A and 3B respectively illustrate an exemplary structure and a functional description of a hybrid heat transfer system according to another embodiment of the present invention, wherein the first thermally conductive path is thermally connected to the load through a thermal diode.
4A and 4B respectively show an exemplary structure and a functional description of a hybrid heat transfer system according to another embodiment of the present invention in which the first thermally conductive path is thermally connected to the load through a thermal diode, The two paths share a common heat exchanger for transferring heat to or from the ambient environment.
Figures 5A and 5B illustrate an exemplary structure and functional description of a hybrid heat transfer system, respectively, according to another embodiment of the present invention, wherein the second thermally conductive path is thermally coupled to the load through a thermal diode.
Figures 6A and 6B illustrate an exemplary structure and functional description of a hybrid heat transfer system, respectively, according to another embodiment of the present invention, wherein the second thermally conductive path is thermally coupled to the load through a thermal capacitor.
Figures 7A and 7B illustrate an exemplary structure and functional description of a hybrid heat transfer system, respectively, in accordance with another embodiment of the present invention, wherein the second thermally conductive path is thermally coupled to the load through a thermal diode and a thermal capacitor.
8A and 8B illustrate an exemplary structure and functional description of a hybrid heat transfer system, respectively, according to another embodiment of the present invention, wherein the second thermally conductive path is thermally connected to the load through a thermal diode and a thermal capacitor, The thermally conductive path also includes a heat pump.
9A and 9B illustrate an exemplary structure and functional description of a hybrid heat transfer system, respectively, in accordance with another embodiment of the present invention, wherein the thermally conductive path between the load and the ambient environment includes a series connected thermocouple, Lt; / RTI >
10 shows a block diagram of an exemplary hybrid heat transfer system according to another embodiment of the present invention.

A system and method for a hybrid heat transfer system is disclosed. The embodiments described below illustrate the information necessary for a person skilled in the art to carry out the embodiments and to explain the best modes for carrying out the embodiments. Upon reading the following description in light of the accompanying drawings, those skilled in the art will recognize the concepts of the present invention and will recognize applications of this concept not specifically covered herein. It is to be understood that these concepts and applications are within the scope of this disclosure and the appended claims.

It is to be understood that although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish the elements. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, unless the scope of the disclosure is beyond the scope of the present disclosure.

It is also to be understood that when an element is referred to as being "connected" or "coupled" to another element, the element may be directly connected to or coupled to another element, or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there is no intervening element.

It is also to be understood that the singular forms "a," an, "and" the "include plural forms unless the context clearly dictates otherwise. As used herein, the terms "comprises," "includes," "includes," and / or "including," when used in this specification, specify the presence of stated features, integers, Acts, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. Furthermore, the term "and / or" includes any and all combinations of one or more of the listed listed items.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is also to be understood that the terminology used herein should be interpreted as having meanings consistent with their meanings in the context of the present specification and the related art, and will not be construed as ideal or too formally, unless explicitly defined herein do.

The heat transfer path includes one or more components that can be thermally coupled in series to provide thermal flow along the path. For example, the heat can be removed from the enclosure (e.g., refrigerator cabinet) and subsequently moved along the heat transfer path for release to the external environment (i.e., ambient environment). The heat transfer path may be part of the " accept side "and / or the" reject side "of the heat removal system and / or may be thermally coupled thereto. The receiving side receives heat from the heat load (e. G., Removes heat from the load). The rejection side rejects the column for the external / environment.

The heat transfer path may be " active "and / or" passive "depending on whether the heat transfer path provides active and / or passive heat flow. For example, the component (s) of the heat transfer path can cause the heat transfer path to provide "active" heat transfer when consuming energy. On the other hand, the same heat transfer path can provide "passive" heat transfer when the same component (s) do not consume energy. Thus, the distinction between an active heat transfer path and a passive heat transfer path depends on whether a significant amount of heat can be actively and / or passively transmitted by the path. More specifically, the heat transfer path may include at least one active heat exchange component and at least one passive component. However, whether the heat transfer path is an "active heat transfer path" or a "passive heat transfer path" depends on whether the heat transfer path is configured to actively and / or passively transfer a significant amount of heat.

The active heat transfer path includes at least one component that causes heat transfer by consuming energy. Thus, when at least one component consumes energy, the active heat transfer path carries a significant amount of heat. Such components are generally referred to herein as "active heat exchange components ". Examples of active heat exchange components include steam compressors, Stirling coolers, thermoelectric devices, and heat pumps such as any structure, device, and / or material that conducts or regulates heat by consuming energy. Thus, when at least one of the active heat exchange components consumes energy, the active heat transfer path carries a significant amount of heat.

The passive heat transfer path includes one or more passive components that enhance the efficiency of the natural cooling process without energy consumption. Examples of passive components include heat sinks, heat siphons, heat pipes, heat exchangers, phase-change materials, or structures, devices, and / or materials that rely on natural heat dissipation or conditioning processes without energy consumption. Thus, a passive heat transfer path delivers a significant amount of heat without consuming energy.

Thus, a heat transfer path comprising an active heat exchange component is an active heat transfer path while consuming energy in order to actively transfer heat, and the active heat transfer path generates a significant amount of heat while the active heat exchange component does not consume energy If passive, it can be a passive heat transfer path. Conversely, a passive heat transfer path may include an active heat exchange component that does not consume energy while the passive heat transfer path passively transfers heat of significant heat.

Embodiments disclosed herein for a heat removal system utilize a combination of active and / or passive components to form one or more active and / or passive heat transfer paths. This combination achieves one or more of high efficiency, wide temperature range, cooling rate, accurate temperature control and low cost.

Before continuing with the description of the embodiments of the present disclosure, it is advantageous to define some terms as follows:

As used herein, "component" refers to a portion or element of a larger overall. The components may comprise any device, material and / or system. For example, the components of the heat transfer path are part or elements of the heat transfer path. "Path" is formed of a plurality of components connected in series configured to provide a direction for heat transfer.

As used herein, the term "active heat exchange" refers to the operation of any component that actively moves heat by consuming energy. Heat is transferred from one location (i.e., "source") of the lower temperature path to another location (i.e., "sink") of the higher temperature path. An example of an active heat exchange component is a heat pump. A heat pump only transfers a significant amount of heat when consuming energy. In some embodiments, but not exclusively, the heat pump is a solid state heat pump that includes one or more thermoelectric modules, and each thermoelectric module includes a plurality of thermoelectric devices (e.g., U.S. Patent No. 8,216,871, entitled " Method for Manufacturing Thin Film Thermoelectric Modules "). Other examples of heat pumps include vapor compression heat pumps and Stirling cycle heat pumps. Active heat exchange components can be modeled similar to current sources in electrical circuits that actively drive current because they actively move heat.

As used herein, the term "passive component" refers to a component that passively moves or modulates heat without consuming energy. The heat can be naturally received, transmitted and rejected by the passive component as a result of the temperature difference across the passive component. Examples of passive components include heat sink / heat exchangers, thermal siphons, heat pipes, phase-change materials (PCMs), and the like.

1A illustrates an exemplary structure of a hybrid heat transfer system according to one embodiment of the present invention, wherein the system includes first and second thermally conductive paths for transferring heat between a load and a surrounding environment, Includes a heat pump.

1A, a hybrid heat transfer system 10, also referred to herein as "system 10 ", includes a first thermally conductive path 12, also referred to herein as" first path 12 " ) And a thermally conductive path 14, also referred to herein as a "second path 14 ", both of which are connected to a load 16 having a load temperature T _L and an ambient temperature T _A , And the ambient environment 18 having a < / RTI > Examples of loads include, but are not limited to, electrical or electronic circuits, printed circuit boards (PCBs), electrical machines, environmental control spaces such as refrigerators, storage units, homes and office buildings and the like. The first path 12 is configured to pass heat manually. The second thermally conductive path 14 is configured to actively transfer heat and includes a heat pump 20 for this purpose.

In the embodiment shown in FIG. 1A, the first path 12 is for transferring heat to and from the heat exchanger 22 and ambient environment 18 for transferring heat to or from the load 16, And a heat exchanger (24). The second path 14 also includes a heat exchanger 28 for transferring heat to or from the heat exchanger 26 and ambient environment 18 for transferring heat to or from the load 16 . In this illustrated example, the heat exchangers 22, 24, 26, and 28 are pin metal heat exchangers / heat sinks, but are not so limited. Other types of heat exchangers / sinks may be used. Examples of heat exchangers include, but are not limited to, air-cooled heat exchangers, water-cooled heat exchangers, and the like.

In one embodiment, the heat pump 20 is operatively connected to an activated state in which heat is actively transferred between the load 16 and the ambient environment 18, or an active state in which heat is actively transferred between the load 16 and the ambient environment 18. [ Lt; / RTI > For example, a controller or control system (not shown) may control the heat pump 20 such that the heat pump 20 is selectively controlled to an activated or deactivated state according to a desired control algorithm. In some embodiments, heat pump 20 can pass heat manually even when it is in an inactive state. In another embodiment, the heat pump 20 can prevent such heat transfer when it is in an inactive state, for example it acts as an insulation between the load 16 and the ambient environment 18. [

In the embodiment shown in FIG. 1A, the first path 12 is separated from the second path 14 by a gap. The gap separates the paths from the second path 14 to the first path 12 and back to the enclosed environment through the heat exchanger 22 to prevent or at least dissipate heat leakage. In some embodiments, the gap may include an insulator to further prevent reverse-leakage. In some embodiments, as described below, the gaps may all be omitted.

In one embodiment, the load 16 may be located in its environment separated from the ambient environment 18. [ In the embodiment shown in FIG. 1A, for example, the load 16 may be located in a structure 30 that provides a local environment for the load 16. In one embodiment, the structure 30 may be a climate or temperature control space, such as an environmentally controlled enclosure, such as a refrigerator, a freezer, an IP (Ingress Protection) grade, and the like. Likewise, the heat exchangers 24, 28 may be located in or in a structure that provides additional conditions. For example, the heat exchangers 24, 28 may be located in a case, chassis, frame, or other environment that provides a continuous flow of air (or water) through the heat exchanger. Such an environment may provide additional benefits as described below with reference to Figure IB.

1B shows a perspective view of a hybrid heat transfer system 10 according to one embodiment of the present invention. 1B, each of the first path 12 and the second path 14, illustrated by the dashed arrows, each comprise a fin heat exchanger 24, 28, Can be benefited from the air flow 32 provided by one or more fans 34 that can be mounted within the enclosing structure 36 in the housing 36.

1B, the heat exchangers 22, 26 may be thermally-conductive plates (e.g., thermally conductive plates) that provide a thermal interface between, for example, the load 16 and the first and second paths 12, For example, a metal plate), but in alternative embodiments this structure may be absent. For example, the load 16 may be directly bonded to the heat exchanger 24 and the heat pump 20 via direct contact, for example, and held in place through clamps, bolts or other fasteners. The thermal paste may be present on the mating surface to more effectively perform heat transfer between these and other mated structures. Alternatively, the load 16 may be coupled to the heat exchanger either indirectly (e.g., via an intervening structure) or even remotely (e.g., by radiating heat across the air gap). Other interfacing methods are also contemplated.

1B, heat Q _C from the load 16 flows into the first path 12 through the heat exchanger 22 and flows through the heat exchanger 24 into the ambient environment 18, . The heat from the load 16 also flows into the second path 14 through the heat exchanger 26 and into the heat pump 20 which transfers heat to the heat exchanger 28 if active.

1B shows a configuration in which the heat exchanger 24 from the first path 12 is upwind from the heat exchanger 28 from the second path 14. [ The heat exchanger 28 will be hotter than the heat exchanger 24 because the active heat pump can deliver more heat than can be passively delivered; By placing the heat exchanger 28 in the downwind of the heat exchanger 24 the first path 12 will be less affected by the heat generated by the second path 14 and thus the heat exchanger 24 Would be more efficient than downwind from heat exchanger 28. [ That is, by arranging the heat exchanger 28 in the downwind from the heat exchanger 24, the heat leakage from the second path 14 to the first path 12 is alleviated.

For example, the operation of an exemplary hybrid heat transfer system, such as the system shown in Figs. 1A and 1B, may be described using a graphical representation similar to an electrical schematic. This type of representation is referred to herein as a thermal circuit diagram. For example, a structure that passively conducts thermal energy is similar to a resistor, and is therefore referred to herein as a thermal resistor. As used herein, the term "thermal resistor" refers to a component that passively receives heat from a high temperature environment and rejects the heat to a low temperature environment. An example of a thermal resistor includes a heat exchanger. The heat exchanger typically transfers heat to the fluid medium. The fluid medium is often air, but may also be water or a refrigerant. Thermal resistance is a characteristic of a particular heat exchanger. As such, the heat exchanger can be modeled similar to a resistor in an electrical circuit.

The structure that conducts heat only in one direction is similar to a diode and is referred to as a thermal diode in this specification. As used herein, the term "thermal diode" refers to a component that causes heat to preferentially passively flow in one direction of the path. Conversely, the thermal diode prevents heat from leaking in a direction opposite to the desired direction of the path. Examples of thermal diodes include thermal siphons. Thermal siphons use passive two-phase heat exchange to transport heat based on natural convection. The thermal siphon uses buoyancy and gravity and / or centripetal force to transport heat between the evaporator and the condenser through the working fluid without a mechanical pump. In particular, as the working fluid is heated in the evaporator, the heated working fluid (e.g., gas) naturally rises to the condenser through the thermal siphon through buoyancy due to the reduced density of the heated working fluid. When the working fluid is cooled in the condenser, the cooled working fluid (e.g., liquid) naturally descends through the thermal siphon through the gravity and / or centripetal force to the evaporator due to the increased density of the cooled working fluid.

Unlike a heat pipe that includes a wicking medium that induces a capillary force that facilitates movement of the working fluid for heat transfer, the thermal siphon does not rely on the capillary force to move the working fluid. As a result, it allows heat flow from the evaporator to the condenser region and prevents heat from leaking back to the evaporator. As such, the thermal siphon can be modeled similar to a diode in an electrical circuit.

The structure for storing thermal energy or lack of thermal energy (e.g., as in the case of a PCM in the frozen state) is similar to a capacitor, and is therefore referred to herein as a thermal capacitor. As used herein, the term "thermal capacitor " refers to a component that passively stores heat. An example of a thermal capacitor is PCM. PCM is a material that changes from one phase to another at a specific temperature. As a result, PCM can passively store and emit large amounts of heat. Heat is absorbed when the material changes from a higher energy state (e. G., From solid to liquid) and releases heat when the material changes from a lower energy state (e. G., From liquid to solid). As such, the PCM can be modeled similar to a capacitor in an electrical circuit.

The structure that actively conducts thermal energy is similar to a current source, and is therefore referred to herein as a heat source. It should be appreciated that the heat source may operate to provide heat, may operate to remove heat, or may be configured to perform either.

Thus, the thermal system can be represented to produce an equivalent symbol, i.e., a thermal circuit schematic, used in the electrical circuit schematic. An example of a thermal circuit schematic for the embodiment shown in FIG. 1A is shown in FIG. 1C.

1C illustrates a functional description of the system 10 of FIG. 1A according to one embodiment of the present invention. 1C, the system 10 includes a first path 12 from a load 16 having a load temperature T _L to a surrounding environment 18 having an ambient temperature T _A , second path is 14, the column shown in the column circuit schematic diagram showing the flow of the (Q _C) through. In the first path 12, the heat exchanger 22 is represented by a thermal resistor R _{th, L 1} and the heat exchanger 24 is represented by a thermal resistor R _{th, A 1} . In the second path, the heat exchanger 26 is represented by a thermal resistor R _{th, L 2} , the heat exchanger 28 is represented by a thermal resistor R _th, Is expressed. In one embodiment, the heat pump 20 may be a thermoelectric (TEC) device capable of providing power, as shown by the arrow P _TEC in Fig. 1C.

The structure represented by the schematic circuit diagram shown in FIG. 1C may not have the same overall temperature, but may have a different temperature at different locations. In the embodiment shown in FIG. 1C, the node labeled T _L indicates thermal contact with the load 16 having a load temperature T _L ; _A node indicated by T represents the thermal contact with the environment (18) having an ambient temperature (T _A). The differently indicated nodes represent locations in the first or second path 12 and 14 where the temperature at each location may be different from T _L or T _A. 1C, for example, T _LA is the temperature at a point in the first path 12 between the load 16 and the ambient environment 18, T _LHP is the temperature at the load 16 Is the temperature at one point in the second path 14 between the heat pumps 20 and T _HPA is the temperature at one point in the second path 14 between the heat pump 20 and the ambient environment 18 . An example of the operation of the system 10 will now be illustrated using Fig. 1d.

1D illustrates a flow diagram of an exemplary method for a hybrid heat transfer system (e.g., hybrid heat transfer system 10 of FIG. 1A or 1B) in accordance with an embodiment of the present invention. 1D illustrates the concept that the hybrid heat transfer system 10 may operate in various modes and these modes may be selected or entered based on the trigger condition. This method will be described with reference to FIG.

In the embodiment shown in FIG. 1D, one or more temperatures, such as T _L and T _A (and optionally other temperatures such as T ₁ , T _2, etc.), are monitored (step 100). As will be described in greater detail below, the detection of a particular trigger condition may cause the system to enter an active cooling mode, a passive cooling (or heating) mode, or an active heating mode.

For illustrative purposes only, in the embodiment shown in FIG. 1d, the load 16 is assumed to have a desired operating range of temperature from the load cold (T _LL ) to the load high (T _LH ). In this example, T _LL <T _LH , and T _LL <T _L <T _LH is preferable.

In this embodiment, the process will exhibit a T _L is that this is to be a cooling test whether higher than T _LH (step 102), which load (16), in which case the process than T _A T _L It is checked whether it is small (step 104). If so, passive cooling may be sufficient to lower T _L , so that active cooling is turned off (or remains off) (step 106), and the process returns to step 100. In step (104), T _A is greater than T _L, passive cooling is because it requires that the T _A is less than T _L with respect to heat transferred to the surroundings (18) from the load 16, there is a need for active cooling. In this case, active cooling is turned on (or remains on) (step 108), and the process returns to step 100.

In this embodiment, if T _L is not higher than the upper limit (T _LH ) in step 102, the process checks whether T _L is lower than the lower limit (T _LL ) (step 110) , In which case the process checks whether T _A is greater than T _L (step 112). If so, it may be sufficient to raise T _L only by manual heating, so that active heating is turned off (or remains off) (step 114) and the process returns to step 100. If T _A is less than T _L in step 112, passive heating requires active heating since T _A requires greater than T _L. In this case, active heating is turned on (or remains on) (step 116), and the process returns to step 100.

In this embodiment, if T _L is not less than T _LL at step 110, the load 16 is within the desired temperature range and therefore the process does not cause any change before returning to step 100 (step 118 )). In one embodiment, "no change" means that the system maintains whatever mode is currently in operation (e.g., active cooling, passive cooling, active heating or manual heating). For example, the system detects the need for active cooling (that is, after the process moves to step 104 from step 102, go to step 106), the active cooling at a predetermined time subsequent T _L (I.e., the process moves from step 102 to step 110 to step 118) to a point between T _LL and T _LH . It may be necessary to continue operating in active cooling mode to maintain T _L within the desired temperature range.

1D shows an embodiment in which the second path 14 can be actively cooled as well as actively heated. For example, in one embodiment, the operation of the heat pump 20 can be reversed, i. E., By reversing the direction of current flow through the heat pump 20, for example. In this embodiment, the heat pump 20 can be used to warm up the load 16. Alternatively, other devices, such as, for example, resistive heaters, may be used to provide heat to the load 16 and / or to supplement the operation of the heat pump 20. In alternate embodiments, heat pump 20 may operate in only one direction, for example, to actively cool. In these embodiments, steps 110, 112, 114, and 116 may be omitted. Likewise, it will be appreciated that the process illustrated in FIG. 1D may include additional steps not shown.

Generally, FIG. 1d illustrates the principle that in some embodiments the first path 12 and the second path 14 provide a parallel thermal flow path to remove Qc at temperature T _L. In some embodiments, the operation of system 10 is a function of the difference between the temperature of T _A and the temperature of any node upstream of heat exchanger 24, 28. The temperature difference between T _LHP and T _A can determine whether the heat pump 20 is activated to remove Q c from the second path 14. For example, if T _LHP is below T _A , the heat pump 20 may be activated to remove Q c through the second path 14. If T _LHP is greater than T _A , the heat pump 20 can be deactivated and Q c passively flows through the first path 12 due to natural dissipation caused by the temperature difference. Thus, the first path 12 can reduce cost and improve energy efficiency and / or the second path 14 can provide operation over a wide temperature range. However, the operation of the system 10 is not limited thereto.

In some embodiments, heat pump 20 may be activated while T _LHP is greater T _A to provide rapid cooling. In other words, the heat pump 20 can be activated even if T _LHP is a larger T _A when abrupt cooling is needed. In some embodiments, the first path 12 may only be used as a backup path when the second path 14 fails. Thus, the system 10 can provide cost-effective operation to improve efficiency and performance over systems using only active or passive cooling technology.

The method shown in FIG. 1D is illustrative and not limiting. For example, not a single value of T _LH but a pair of temperature thresholds designed to provide a form of hysteresis, such as a different upper limit depending on whether T _L is currently rising (T _LHR ) or falling (T _LHF ) Lt; / RTI &gt; In one embodiment, T _LHR is some higher than T _LHF , so that if T _L rises, heat pump 20 will not turn on to cool load 16 until T _L is greater than T _LHR , And when T _L falls, heat pump 20 does not turn off until T _L is less than T _LHF . This can result in energy savings compared to enabling the heat pump 20 to enable or disable active cooling based on a single threshold value T _LH .

2A and 2B respectively illustrate an exemplary structure and a functional description of a hybrid heat transfer system according to another embodiment of the present invention, wherein the first and second thermally conductive paths are common heat exchange for transferring heat to or from the load (Also referred to as a "shared" heat exchanger). In the embodiment shown in FIG. 2A, the first thermally conductive path 12 and the second thermally conductive path 14 are thermally coupled to the load 16 via a common heat exchanger 38. The description of the elements 18, 20, 24, 28, T _LA , T _LHP , and T _HPA is identical to FIG. 1A and will not be repeated here.

Referring now to FIG. 2B, the system 10 includes a first path 12 and a second path 14 extending from a load 16 having a load temperature T _L to a surrounding environment T _A having an ambient temperature T _A , Is shown schematically as a thermal circuit showing the flow of heat (Q _C ) The common heat exchanger 38 is represented by a thermal resistor R _{th, L.} The description of elements 20, 24, 28, P _TEC , T _LA , T _LHP and T _HPA is the same as FIG. 1C and will not be repeated here.

2C and 2D respectively illustrate an exemplary structure and a functional description of a hybrid heat transfer system according to another embodiment of the present invention, wherein the first and second thermally conductive paths are used to transfer heat from or to a surrounding environment Sharing a common heat exchanger. In the embodiment shown in FIG. 2C, the first path 12 and the second path 14 share the common heat exchanger 38 as well as the common heat exchanger 40. The description of the elements 16, 18, 20 and 30 is the same as in Fig. 1A and will not be repeated here.

Referring now to FIG. 2d, the system 10 is shown to be capable of receiving ambient temperature T _A (not shown) from a load 16 (not shown) having a load temperature T _L through a first path 12 and a second path 14 ) environment 18 having a (shown as a sequence circuit diagram illustrating the flow of not shown) in the column (Q _C). The common heat exchanger 38 is represented by a thermal resistor R _{th, L} and the common heat exchanger 40 is represented by a thermal resistor R _{th, A.} The elements 20, P _TEC , T _LHP, and T _HPA are the same as in FIG. 1C and will not be repeated here.

Figures 3A and 3B illustrate an exemplary structure and functional description of a hybrid heat transfer system, respectively, in accordance with another embodiment of the present invention, wherein the first thermally conductive path is thermally coupled to the load in series via a thermal diode. In the embodiment shown in FIG. 3A, the thermal diode 42 connects the common heat exchanger 38 to the heat exchanger 24 of the first path 12. The description of elements 16, 18, 20, 28 and 30 is the same as described above and will not be repeated here.

The characteristics of a thermal diode are that they pass heat efficiently in one direction. In some embodiments, the thermal diode 42 is a thermal siphon. A common thermal siphon is a tube that contains a coolant that changes from a liquid state to a gaseous state in the presence of heat. In operation, when the coolant is heated, the generated gas rises through the tube by buoyancy to the cooler region of the tube, where it condenses into liquid and flows back to the hotter region of the tube through gravity. A change in state from liquid to gas extracts heat, and condensation from gas to liquid releases the heat. In this manner, heat is extracted from one end of the thermal siphon (e.g., at the load end) and discharged at the other end of the thermal siphon (e.g., into the ambient environment). In other words, the thermal siphon is a passive (in this example, connected to the heat exchanger 24) condenser region of the thermal siphon from the evaporator region of the thermal siphon (in this example connected to the common heat exchanger 38) Provides two-phase heat transfer.

The presence of the thermal diode 42 may allow efficient flow of heat from the load 16 to the ambient environment 18 through the first path 12 but not in the opposite direction, T _A is higher than the load temperature T _L , the load 16 is protected from receiving undesired heat through the first path 12. A further advantage of this configuration is that the heat exchanger 24 of the first path 12 can be moved from the heat exchanger 28 of the second path 14, which can become very hot during the active operation of the heat pump 20, Can be located or placed apart from the distance. Separating the heat exchanger 24 a little distance from the heat exchanger 28 may thermally isolate the heat exchanger 24 from the heat exchanger 28 so that any The heat is not likely to affect the environment (e.g., through convection) proximate heat exchanger 24 itself (e.g., through conduction or radiation of heat) or heat exchanger 24.

In one embodiment, one or more thermal siphons may be connected in series between the common heat exchanger 38 and the heat exchanger 24. The evaporator region of the thermal siphon may be thermally coupled to the common heat exchanger 38 and the condenser region of the thermal siphon may be coupled to a separate heat exchanger 24. [ As such, the thermal siphon acts as a thermal diode such that a thermal diode coupled with any thermal insulation prevents reverse leakage of heat from the external environment into the enclosed environment 30.

Referring now to FIG. 3B, the system 10 is shown as being powered from a load 16 (not shown) having a load temperature T _L to an ambient environment 18 (not shown) having an ambient temperature T _A (Not shown) of the heat Q _C through the first path 12 and the second path 14, as shown in FIG. _TDA is the temperature at one point in the path 12 between the thermal diode 42 and the ambient environment 18. The description of elements 20, 24, 28, 38, P _TEC , T _LHP, and T _HPA is as described above and will not be repeated here. In the embodiment shown in FIG. 3B, it can be seen that the first path 12 includes a thermal diode 42.

Figures 4A and 4B illustrate an exemplary structure and functional description of a hybrid heat transfer system, respectively, in accordance with another embodiment of the present invention, wherein the first thermally conductive path is thermally coupled to the load through a thermal diode, The second path shares a common heat exchanger for transferring heat to or from the surrounding environment. The embodiment of the system 10 shown in Figure 4A can be considered as a variation of the system 10 shown in Figure 3A and the first path 12 and the second path 14 can be regarded as a common heat exchanger 40 ). Elements 16, 18, 20, 30, 38 and 42 are the same as previously described and will not be repeated here.

Referring now to FIG. 4B, the system 10 includes a first path 12 and a second path 14 from a load having a load temperature T _L to a surrounding environment having an ambient temperature T _A , Q _C , &lt; / RTI &gt; The first path 12 comprises a thermal diode 42 and the second path 14 comprises a heat pump 20. [ A common peripheral-side heat exchange is denoted by a thermal resistor (R _{th, A} ). The description of elements 38, 40, P _TEC , T _LHP, and T _HPA is the same as previously described and will not be repeated here.

The embodiment shown in Figures 3A, 3B, 4A, and 4B and described above includes a thermal diode in the first thermally conductive path 12. In an alternative embodiment, a thermal diode may be included in the second thermally conductive path 14, as shown in Figs. 5A and 5B.

5A and 5B illustrate an exemplary structure and functional description of a hybrid heat transfer system 10 according to another embodiment of the present invention, respectively, and the second thermally conductive path 14 includes a thermal diode 42, 16). The embodiment shown in Figure 5a can be considered as a variation of the system 10 shown in Figure 2a and the second path 14 can be viewed as a series of heat between the common heat exchanger 38 and the heat pump 20 And a diode (42). The description of elements 16, 18, 24, 28 and 30 is the same as described above and will not be repeated here.

In this configuration, the heat pump 20 may actively draw heat away from the top of the thermal diode 42. For example, if the thermal diode 42 is a thermal siphon, the heat pump 20 may cool the top of the thermal diode 42 to promote condensation of the gas collected there, thereby increasing the performance of the thermal diode 42 have.

5b, the system 10 includes a first path 12 from a load 16 (not shown) having a load temperature T _L to a surrounding environment 18 having an ambient temperature T _A , And the flow of heat (Q _C ) through the second path (14). In this embodiment, the second path 14 comprises a thermal diode 42 and a heat pump 20 in series. T _LD is the temperature of the point in the second path 14 between the load 16 and the thermal diode 42. T _DHP is the temperature of the point in the second path 14 between the thermal diode 42 and the heat pump 20. The description of elements 24, 28, 38, P _TEC , T _HPA and T _LA is the same as described previously and will not be repeated here.

The following embodiments illustrate a configuration including a thermal capacitor. Examples of thermal capacitors include, but are not limited to, devices containing or containing phase change materials and / or thermal mass. For example, a thermal capacitor may include a water reservoir that can be actively cooled until the water becomes ice, which is then used to passively cool (or at least absorb heat from) the load 16 do. Likewise, the thermal capacitor can be used to passively heat (or at least provide heat to) the load 16 after being actively heated. The thermal capacitor may be just a component with a large thermal mass used to absorb heat from the load or to provide heat to the load.

6A and 6B respectively illustrate an exemplary structure and functional description of a hybrid heat transfer system 10 according to another embodiment of the present invention and the second thermally conductive path 14 is thermally connected to the load through a thermal capacitor do. The embodiment shown in Figure 6a can be considered as a variation of the system 10 shown in Figure 2a and the second path 14 can be viewed as a series of heat between the common heat exchanger 38 and the heat pump 20 A capacitor 44 is included. The thermal capacitor 44 is a PCM in some embodiments. In the cooling application, the thermal capacitor 44 is charged by the heat pump 20 so that the thermal capacitor 44 stores a lack of thermal energy (e. G., The PCM is frozen). In heating applications, however, the thermal capacitor 44 is charged by a heat pump 20 (which is configured to heat rather than cool) so that the thermal capacitor 44 stores thermal energy (e.g., Liquid state). The description of elements 12, 16, 18, 24, 28 and 30 is the same as described above and will not be repeated here.

In one embodiment, when the heat pump 20 consumes energy, heat is extracted from the thermal capacitor 44. As a result, the heat pump 20 charges the thermal capacitor 44. After the thermal capacitor 44 is fully charged, the heat pump 20 can continue to extract heat from the thermal capacitor 44 at the same rate as the thermal capacitor 44 removes heat from the load.

When the heat pump 20 does not consume energy, the thermal capacitor 44 can manually remove heat from the load until the thermal capacitor 44 is completely discharged. The thermal capacitor 44 can be recharged when the heat pump 20 again consumes energy. Thus, the thermal capacitor 44 allows the second path 14 to actively or passively remove heat.

In some embodiments, the thermal capacitor 44 acts as a clamp to regulate the temperature of the load 16. For example, the thermal capacitor 44 may comprise a PCM. As the PCM absorbs heat, the state can be changed (e.g. from solid to liquid, from liquid to gas, or from solid to gas), whilst the temperature of PCM - and load 16 - Clamped. On the other hand, the first path 12 provides a safe heat flow path from the common heat exchanger 38 to the ambient environment 18 when the load 16 overwhelms the thermal capacitor 44.

Referring now to FIG. 6B, the system 10 includes a first path 12 and a second path 14 through a second path 14 from a load having a load temperature T _L to a surrounding environment having an ambient temperature T _A Q _C , &lt; / RTI &gt; In this embodiment, the second path 14 comprises a thermal capacitor 44 in series with a heat pump 20. T _LC is the temperature at the point in the second path 14 between the load 16 and the thermal capacitor 44. T _CHP is the temperature at the point in the second path 14 between the thermal capacitor 44 and the heat pump 20. The elements 24, 28, 38, P _TEC , T _HPA and T _LA are the same as described above and will not be repeated here.

The presence of thermal capacitor 44 in system 10 has several potential advantages. One of these advantages is that the thermal capacitor 44 can be "charged" (i.e., actively cooled or heated to a target temperature, for example) by operating the heat pump 20 in an active state when external power is available, The thermal capacitor 44 may cool or heat the load 16, for example, under conditions where external power is not available or the heat pump 20 is otherwise deactivated. This capability is useful in scenarios where, for example, a package containing food or other items needs to be transported to a remote location: before shipping, by heat pump 20 plugged into a wall outlet or otherwise connected to an external power source The capacitor 44 can be actively charged (cooled). Once the thermal capacitor 44 is fully charged, the heat pump 20 is disconnected from the external power source and the currently cooled package is transported. The thermal capacitor 44 can continue to hold the package contents in an acceptable cold state while the package is in transit and can not be connected to a power source.

Another advantage of including the thermal capacitor 44 is that in an environment where external power is continuously available, the utility generally charges an additional charge for the power consumed during the peak demand period. In this scenario, the system 10 including the thermal capacitor 44 is configured to charge the thermal capacitor 44 later (and possibly also to actively cool the load 16) during the night or other low- Power can be configured to be used to avoid having to pay a higher charge that is charged for the peak demand period. The thermal capacitor 44 may be used to cool the load 16 during (at least a portion of) the peak time. In addition, utilities often charge businesses for peak peak power usage. The use of the thermal capacitor 44 allows the business to determine the amount of time (or possibly the time the multiple heat pumps 20 of the system 10 are active) that the heat pump 20 is active to reduce the total peak power usage, . In this way, businesses can significantly reduce power costs.

7A and 7B illustrate an exemplary structure and functional description of a hybrid heat transfer system 10 according to another embodiment of the present invention, respectively, and a second thermally conductive path 14 is shown between a thermal diode 42 and a thermal capacitor 44 to the load 16. The embodiment shown in Figure 7A can be considered as a variation of the system shown in Figure 5A and the second path 14 includes a thermal capacitor 44 in series between the thermal diode 42 and the heat exchanger 28, . &Lt; / RTI &gt; The description of the elements 12, 16, 18, 24, 30, and 38 is the same as described above and therefore will not be repeated here.

Referring now to FIG. 7B, the system 10 is shown as being powered from a load 16 (not shown) having a load temperature T _L to a surrounding environment 18 (not shown) having an ambient temperature T _A one path is shown as 12 and the second heat flow circuit schematic diagram showing the heat (Q _C) via the path 14. In this embodiment, the second path 14 includes a thermal diode 42 and a thermal capacitor 44 in series with a heat pump 20. T _LD is the temperature at the point in the second path 14 between the load 16 and the thermal diode 42. T _DC is the temperature at the point in the second path 14 between the thermal diode 42 and the thermal capacitor 44. The elements 24, 28, 38, P _TEC , T _LA , T _CHP, and T _HPA are the same as described above and will not be repeated here. The temperature T _LD at the load side of the thermal diode 42 may be different from the temperature T _DC at the peripheral side of the thermal diode 42. [ Likewise, the temperature T _DC at the load side of the thermal capacitor 44 may be different from the temperature T _CHP at the opposite side of the thermal capacitor 44.

The presence of thermal capacitor 44 may provide some or all of the advantages described above. For example, the heat pump 20 may actively charge the thermal capacitor 44, so that heat from the load 16, even when the heat pump 20 is not activated or inoperable due to unavailability of external power, The efficiency of the thermal diode 42 to be extracted can be increased.

8A and 8B illustrate an exemplary structure and functional description of a hybrid heat transfer system 10 in accordance with another embodiment of the present invention and a second thermally conductive path 14 includes a thermal diode 42 and a thermal capacitor 44 to the load 16, and the first thermally conductive path 12 also includes a heat pump 20. The embodiment shown in FIG. 8A can be considered as a variation of the system 10 shown in FIG. 7A, with the difference that the previous passive first path 12 now includes its own heat pump 46. The description of elements 12, 16, 18, 20, 24, 28, 30, 38, 42 and 44 is the same as described above and will not be repeated here.

Referring now to FIG. 8B, the system 10 is shown as being powered from a load 16 (not shown) having a load temperature T _L to a surrounding environment 18 (not shown) having an ambient temperature T _A one path is shown as 12 and the second heat flow circuit schematic diagram showing the heat (Q _C) via the path 14. In this embodiment, the first path 12 also includes a heat pump 46. T _CHP2 is the temperature at the point in the second path 14 between the thermal capacitor 44 and the heat pump 20. T _HP2 is the temperature at the point in the second path 14 between the heat pump 20 and the ambient environment 18. [ T _LHP1 is the temperature at the point in the first path 12 between the load 16 and the heat pump 46. T _HP1A is the temperature at the point in the first path 12 between the heat pump 46 and the ambient environment 18. The temperature T _LHP1 at the load side of the heat pump 46 may be different from the temperature T _HP1A . In the embodiment shown in Figure 8b, each of the two heat pumps 20 and 46 can be controlled independently of the others; The power provided to the heat pump 46 is shown by the arrow P _TEC1 and the power provided by the heat pump 20 is shown by the arrow P _TEC2 . The description of elements 20, 24, 28, 38, 42, and 44 is the same as described earlier and will not be repeated here.

9A and 9B illustrate an exemplary structure and functional description of a hybrid heat transfer system 48, also referred to as "system 48, " respectively, in accordance with another embodiment of the present invention, The thermal conductive path 50, also referred to as the "path 50" between the substrate 16 and the surrounding environment 18 includes a thermal capacitor 44, a heat pump 20 and a thermal diode 42 connected in series. 9A, the system 48 includes a thermally conductive path 50 between a load 16 having a load temperature T _L and a surrounding environment 18 having an ambient temperature T _A And the path 50 includes a thermal capacitor 44, a heat pump 20, and a thermal diode 42. [ 9A, the heat exchanger 26 provides a thermal interface between the load 16 and the path 50, and the heat exchanger 28 provides a heat interface between the path 50 and the surrounding environment 18. In the embodiment shown in FIG. Provides a thermal interface.

Referring to Figure 9b, the system 48 has a load 16 having a load temperature (T _L) environment (18) having an ambient temperature (T _A) from a (not shown) (not shown) to the heat-conductive Is shown as a thermal circuit schematic showing the flow of heat (Q _C ) through path (50). 9B, the heat exchanger 26 is represented by a thermal resistor R _{th, L} and the heat exchanger 28 is represented by a thermal resistor R _{th, A.} The path 50 also includes a thermal capacitor 44, a heat pump 46, and a thermal diode 42. T _HPD is the temperature at the point on the path 50 between the heat pump 20 and the thermal diode 42. _TDA is the temperature at the point on the path 50 between the thermal diode 42 and the ambient environment 18. The description of elements 20, 24, 28, 38, 42, 44, P _TEC , T _LC and T _CHP is the same as described above and will not be repeated here. The temperature T _CHP at the load side of the heat pump 46 may be different from the temperature T _HPD .

Figure 10 shows a block diagram of an exemplary hybrid heat transfer system 52, also referred to herein as "system 52, " in accordance with another embodiment of the present invention. 10, the system 52 includes an active heating and / or cooling component 54 and a control system 56, also referred to herein as "active components 54 ". In some embodiments, the system 52 may optionally include passive heating and / or cooling components 58, also referred to herein as "passive components 58 ". 10, the control system 56 includes one or more temperature sensors 60 that provide temperature data and, optionally, other types of data to the controller 62. In one embodiment, In one embodiment, controller 62 may be implemented as one or more Central Processing Units (CPUs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs), etc., or any combination thereof, And processes the data provided by the sensor 60. The controller 62 controls the operation of the active component 54 through the activation and switching circuit 64. The system 52 may optionally include a computer memory 66 for storing computer programs and / or data.

In one embodiment, for example, the control system 56 may be configured as described above and in FIG. 1d to determine whether one or more active components 54 are to be changed from active to inactive or vice versa The illustrated process can be implemented.

In one embodiment, for example, the system 52 includes both an active component 54 and a passive component 58. In such an embodiment, the passive component 58 may passively pass heat continuously and the system 52 may be configured to pass passive components (such as when the ambient environment 18 is warmer than the target load temperature T _L ) 58 activate the active component 54 only if it can not deliver sufficient heat. In another embodiment, the passive component 58 serves as a backup system for transferring heat if the active component 54 does not operate due to a lack of external power or a component failure.

In one embodiment, when executed by at least one processor, a computer program is provided that includes instructions for causing at least one processor to perform the functions of the controller 62 in accordance with any of the embodiments described herein do. In one embodiment, a carrier is provided that includes the computer program product described above. The carrier is one of an electronic signal, an optical signal, a wireless signal, or a computer-readable storage medium (e.g., non-transitory computer readable medium such as computer memory 66).

It should also be noted that the above-described embodiments are not limited to these. For example, the system may add or omit any component, and may arrange the components in any order to form any number of paths without departing from the scope of the present invention.

As described above, some embodiments of the present invention include a heat removal system that utilizes a plurality of components to form one or more heat transfer paths. The plurality of components may include active components and passive components. In some embodiments, the hybrid heat removal system includes a plurality of components forming a plurality of heat transfer paths including at least one active heat transfer path and at least one passive heat transfer path. The active heat transfer path includes an active heat exchange component and is configured to provide active heat removal from the load when the active heat exchange component is operating. The passive heat transfer path is configured to provide passive heat removal from the load. The passive heat transfer path is parallel to the active heat transfer path.

Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the scope of the concepts disclosed herein and the claims which follow.

Claims (30)

In the hybrid heat transfer system,
_A first thermally conductive path configured to passively transfer heat between a load having a load temperature (T _L ) and a surrounding environment having an ambient temperature (T _A ); And
A second thermally conductive path configured to actively transfer heat between the load and the ambient environment, the second path including a heat pump. The method according to claim 1,
The heat pump is in an activated or deactivated state;
When the heat pump is in the activated state, heat is actively transferred through the second thermally conductive path;
When the heat pump is in the inactive state, the heat is not actively delivered through the second thermally conductive path. 2. The hybrid heat transfer system of claim 1, wherein each of the first and second paths includes its own separate heat exchange component for transferring heat to or from the load. 4. The hybrid heat transfer system of claim 3, wherein each of the first and second paths includes its own separate heat exchange component for transferring heat to or from the ambient environment. 2. The hybrid heat transfer system of claim 1, wherein the first and second paths share a common heat exchange component for transferring heat to or from the load. 6. The hybrid heat transfer system of claim 5, wherein each of the first and second paths includes its own separate heat exchange component for transferring heat to or from the ambient environment. 7. The hybrid heat transfer system of claim 6, wherein the first thermally conductive path comprises a thermal diode in series between the load and the ambient environment. 7. The hybrid heat transfer system of claim 6, wherein the second thermally conductive path comprises a thermal diode in series between the load and the heat pump. 7. The hybrid heat transfer system of claim 6, wherein the second thermally conductive path comprises a thermal capacitor in series between the load and the heat pump. 7. The hybrid heat transfer system of claim 6, wherein the second thermally conductive path comprises a thermal diode and a thermal capacitor in series between the load and the heat pump. 11. The hybrid heat transfer system of claim 10, wherein the first thermally conductive path comprises a second heat pump. 6. The hybrid heat transfer system of claim 5, wherein the first and second paths share a common heat exchange component for transferring heat to or from the ambient environment. 13. The hybrid heat transfer system of claim 12, wherein the first thermally conductive path comprises a thermal diode in series between the load and the ambient environment. 2. The hybrid heat transfer system of claim 1, wherein the first and second paths share a common heat exchange component for transferring heat to or from the ambient environment. 2. The hybrid heat transfer system of claim 1, wherein each of the first and second paths includes its own separate heat exchange component for transferring heat to or from the ambient environment. 2. The hybrid heat transfer system of claim 1, wherein the first thermally conductive path comprises a thermal diode in series between the load and the ambient environment. 17. The hybrid heat transfer system of claim 16, wherein the thermal diode comprises a thermal siphon. 2. The hybrid heat transfer system of claim 1, wherein the second thermally conductive path comprises a thermal diode in series between the load and the ambient environment. 19. The hybrid heat transfer system of claim 18, wherein the thermal diode is in series between the load and the heat pump. 2. The hybrid heat transfer system of claim 1, wherein the second thermally conductive path comprises a thermal capacitor in series between the load and the ambient environment. 21. The hybrid heat transfer system of claim 20, wherein the thermal capacitor comprises a phase change material and / or a thermal mass. 2. The hybrid heat transfer system of claim 1, wherein the second thermally conductive path comprises a thermal diode, a thermal capacitor and a heat pump in series between the load and the ambient environment. In the hybrid heat transfer system,
And a thermally conductive path for transferring heat from a load having a load temperature (T _L ) to an environment having an ambient temperature (T _A )
The thermally conductive path
Heat capacitor having a storage temperature (T _S);
A heat pump having an activated state in which heat is actively transferred by a heat pump, and an inactive state in which heat is not actively transferred by a heat pump; And
Comprising a thermal diode,
These are connected in series between the load and the surrounding environment. 24. The hybrid heat transfer system of claim 23, wherein the thermal capacitor comprises a phase change material and / or a thermal mass. 24. The method of claim 23, wherein the first side of the thermal capacitor contacts the load, the first side of the heat pump contacts the second side of the thermal capacitor, the first side of the thermal diode contacts the second side of the heat pump, The second side of the diode transfers heat to the environment. In the hybrid heat transfer system,
A first component for active heating and / or cooling of the load, the operation of the first component being controlled by at least one control input; And
And a control system configured to control operation of the first component via at least one control input in accordance with an algorithm. 27. The hybrid heat transfer system of claim 26, further comprising a second component for passive heating and / or cooling of the load. 27. The system of claim 26, wherein the control system
At least one temperature sensor; And
And a controller configured to receive temperature information from at least one temperature sensor and to process the information according to an algorithm to determine a desired operation of the first component and to control operation of the first component, Heat transfer system. 29. The hybrid heat transfer system of claim 28, wherein the controller controls activation of the first component through activation and switching circuitry between the controller and the first component. _A first thermally conductive path for passively transferring heat between a load having a load temperature T _L and a surrounding environment having an ambient temperature T _A and a second thermally conductive path for actively transferring heat between the load and the ambient environment And a second path comprising a heat pump, wherein the second path comprises a heat pump,
Monitoring values of T _L and T _A ;
If it is determined that T _L is greater than the first threshold (T _LH ):
Activating the heat pump such that heat is actively transferred from the load to the environment through the second thermally conductive path if T _A is determined to be greater than or equal to T _L ; And
Deactivating the heat pump such that heat is not actively transferred from the load to the environment through the second thermally conductive path if T _A is determined to be less than T _L ;
If T _L is determined to be less than the second threshold T _LL ,
Activating the heat pump such that heat is actively transferred from the ambient environment to the load through the second path if T _A is determined to be less than or equal to T _L ; And
Deactivating the heat pump such that heat is not actively transferred from the ambient environment to the load through the second path if T _A is determined to be greater than T _L ; And
And if it is determined that T _LL &lt; = T _L &lt; = T _LH , then the current operating state of the heat pump is not changed.

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