KR20250007702A - Texturizing a surface without bead blasting - Google Patents

Abstract

A system for providing a texture to a surface of a component for use in a semiconductor processing chamber is provided. The system includes an enclosure including a processing region; a support disposed in the processing region; a photonic light source for generating a stream of photons; an optical module operably coupled to the photonic light source; and a lens. The optical module includes a beam modulator for generating a beam of photons from the stream of photons generated from the photonic light source; and a beam scanner for scanning the beam of photons across the surface of the component. The lens receives the beam of photons from the beam scanner and is used to distribute the beam of photons across the surface of the component at a wavelength ranging from about 345 nm to about 1100 nm to form a plurality of features on the component.

Description

TEXTURIZING A SURFACE WITHOUT BEAD BLASTING

[0001] Embodiments of the present disclosure generally relate to methods, systems, and apparatus for texturizing a surface of a component for use in a semiconductor processing chamber.

[0002] As integrated circuit devices continue to be fabricated in ever-shrinking dimensions, the fabrication of these devices becomes more susceptible to yield reductions due to contamination. As a result, the fabrication of integrated circuit devices, particularly those having smaller physical sizes, requires contamination control to a greater degree than previously considered necessary.

[0003] Contamination of integrated circuit devices can arise from sources such as undesirable stray particles impinging on the substrate during thin film deposition, etching, or other semiconductor fabrication processes. Typically, the fabrication of integrated circuit devices involves the use of chambers, including but not limited to physical vapor deposition (PVD) sputtering chambers, chemical vapor deposition (CVD) chambers, and plasma etch chambers. During the deposition and etching processes, materials often condense from the gas phase onto various internal surfaces of the chamber and surfaces of chamber components disposed within the chamber. When the materials condense from the gas phase, the materials form solid masses on the chamber and component surfaces. This condensed foreign matter accumulates on the surfaces and is prone to detaching or flake off from the surfaces during or between wafer process sequences. This detached foreign matter can impinge on the wafer and contaminate the devices formed on the wafer. Contaminated devices frequently have to be discarded, thereby reducing the manufacturing yield of the process.

[0004] In order to prevent detachment of the formed foreign matter, a specific surface texture may be provided on the inner surfaces of the chamber and the surfaces of chamber components arranged within the chamber. The surface texture is configured so that the foreign matter formed on these surfaces has improved adhesion to the surface, thereby reducing the possibility of the foreign matter detaching and contaminating the wafer. A key parameter of the surface texture is surface roughness.

[0005] One common texturizing process is bead blasting. In the bead blasting process, solid blasting beads are propelled toward the surface to be textured. One way to propell the solid blasting beads toward the surface to be textured is by means of a pressurized gas. The solid blasting beads are made of suitable materials, such as aluminum oxide, glass, silica, or hard plastics. Depending on the desired surface roughness, the blasting beads can be of various sizes and shapes.

[0006] However, controlling the uniformity and repeatability of the bead blasting process can be difficult. Moreover, during the bead blasting process, the surface being textured can become sharp and jagged, and thus, the tips of the surface can break off and fall off due to the impact of the solid blasting beads, introducing a source of contamination. Additionally, the blasting beads can become entrapped or embedded within the surface during the bead blasting process. For example, if the surface being textured includes small through-holes of varying width (e.g., a gas distribution showerhead), the blasting beads can become entrapped within the through-holes. In such a situation, the blasting beads not only prevent the through-holes from functioning as gas passages, but also introduce a potential source of contamination to the wafer.

[0007] An electromagnetic beam may also be used to texturize the chamber surface. Using an electromagnetic beam to texturize the chamber surface may overcome some of the problems identified above associated with bead blasting. However, the electromagnetic beam must be operated under a vacuum to prevent scattering. Scattering can occur when electrons within the electromagnetic beam interact with air or other gas molecules. As a result, the electromagnetic beam must be operated within a vacuum chamber. The need for a vacuum chamber limits the size of the components that can be texturized, since the components must be able to fit within the vacuum chamber. Furthermore, the capital costs associated with operating the electromagnetic beam are significantly higher than those associated with the bead blasting process. For example, the need for a vacuum chamber increases the costs associated with texturizing a surface using an electromagnetic beam.

[0008] Therefore, there is a need for an improved texturizing process that overcomes the problems associated with bead blasting while avoiding the capital costs and size constraints associated with the use of electromagnetic beams.

[0009] One embodiment of the present disclosure relates to a method for providing texture to a surface of a component for use in a semiconductor processing chamber. The method comprises the steps of: directing a beam of photons through ambient air or nitrogen toward a surface of the component; and scanning the beam of photons across a first region of the surface of the component to form a plurality of features on the surface within the first region, wherein the formed features are depressions, protuberances, or a combination thereof.

[0010] Another implementation of the present disclosure relates to a method for providing texture to a surface of a component for use in a semiconductor processing chamber. The method comprises the steps of: directing a beam of photons toward a surface of the component in an atmosphere having a pressure substantially equal to atmospheric pressure; and scanning the beam of photons across a first region of the surface of the component to form a plurality of features on the surface within the first region, wherein the formed features are depressions, protrusions, or a combination thereof.

[0011] Another embodiment of the present disclosure is a component for use in a semiconductor processing chamber. The component includes a plurality of features on a surface within a first region, wherein the features formed are depressions, protrusions, or a combination thereof. The features are formed by scanning a beam of photons across the surface of the component.

[0012] Another embodiment of the present disclosure is a system for providing a texture to a surface of a component for use in a semiconductor processing chamber. The system comprises an enclosure comprising a processing region; a support disposed in the processing region and comprising a support surface; a photonic source for generating a stream of photons; an optical module operably coupled to the photonic source for receiving the stream of photons from the photonic source; and a lens. The optical module comprises a beam modulator for generating a beam of photons from the stream of photons generated from the photonic source; and a beam scanner for scanning the beam of photons across the surface of the component. The lens is used to receive the beam of photons from the beam scanner and to distribute the beam of photons across the surface of the component at a wavelength ranging from about 345 nm to about 1100 nm to form a plurality of features on the component.

[0013] Another embodiment of the present disclosure is a method for providing texture to a surface of a component for use in a semiconductor processing chamber. The method comprises the steps of: generating a stream of photons; shaping the stream of photons into a beam; scanning the beam of photons through a processing region comprising a gas concentration of ambient air or nitrogen at a pressure substantially equal to atmospheric pressure toward a surface of the component; and distributing the beam of photons across the surface of the component to form a plurality of features on the surface of the component.

[0014] Additionally, another embodiment of the present disclosure is a system for providing texture to a surface of a component for use in a semiconductor processing chamber. The system comprises an enclosure comprising a processing region maintained in a Class 1 environment having a pressure substantially equal to atmospheric pressure; a support disposed in the processing region, the support comprising a support surface; a photonic source for generating a stream of photons; an optical module operably coupled to the photonic source for receiving the stream of photons from the photonic source; and a lens. The optical module comprises a beam modulator for generating a beam of photons from the stream of photons generated from the photonic source; and a beam scanner for scanning the beam of photons across the surface of the component. The lens is disposed in the processing region for receiving the beam of photons from the beam scanner and distributing the beam of photons across the surface of the component at a wavelength ranging from about 345 nm to about 1100 nm to form a plurality of features on the component.

[0015] So that the above-described features of the present disclosure may be understood in detail, a more specific description of the present disclosure, briefly summarized above, may be had by reference to implementations, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only exemplary implementations and therefore should not be considered limiting the scope of the present disclosure.
[0016] Figure 1 illustrates a schematic diagram of a laser machine and a support system according to the present disclosure.
[0017] FIG. 2 illustrates an alternative schematic diagram of a laser machine and support system according to the present disclosure.
[0018] FIG. 3 illustrates a plan view of a gas distribution showerhead according to the present disclosure, with the area to be texturized being marked by boundary lines.
[0019] FIG. 4 illustrates a process sequence for a method of operating a laser machine and a support system according to the present disclosure.
[0020] Figures 5 and 6 illustrate surface morphologies of repeating random shapes, which surface morphologies are generated by a laser machine according to the present disclosure. Figure 5 illustrates a perspective view illustrating the surface morphology, and Figure 6 illustrates a plan view illustrating the surface morphology.
[0021] Figures 7 and 8 illustrate surface morphologies in the form of repeating waves, which surface morphologies are generated by a laser machine according to the present disclosure. Figure 7 illustrates a perspective view illustrating the surface morphology, and Figure 8 illustrates a plan view and a side view illustrating the surface morphology.
[0022] Figures 9 and 10 illustrate a surface morphology in the form of a repeating square, which surface morphology is generated by a laser machine according to the present disclosure. Figure 9 illustrates a perspective view illustrating the surface morphology, and Figure 10 illustrates a plan view and a side view illustrating the surface morphology.
[0023] FIG. 11 illustrates a schematic diagram of a laser machine and a laser device according to the present disclosure.
[0024] FIG. 12 illustrates an alternative schematic diagram of a laser machine and laser device according to the present disclosure.
[0025] FIG. 13 illustrates a graphical representation comparing results of textured components using a bead blasting process and a process according to the present disclosure.
[0026] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements common to the drawings. It is contemplated that elements and features of one implementation may be beneficially incorporated into other implementations without further description.
[0027] The patent or application file shall contain at least one drawing in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.

[0028] The implementations described herein utilize a beam of photons generated by a laser to perform a texturizing process on the surface of a component for use in a semiconductor processing chamber. The beam of photons is directed to the surface of the component and scanned across an area of the surface to form a plurality of features. The features formed on the surface include depressions, protrusions, and/or combinations thereof. The beam of photons can be reduced in intensity, defocused, and/or scanned at a particular translational speed to form the desired surface morphology.

[0029] Figure 1 illustrates a schematic diagram of a laser machine (100) and a support system (102) that may be used to texturize a surface (103) of a component (104). The component (104) may be, for example, a gas distribution showerhead, a chamber wall, or an electrostatic chuck. The laser machine (100) includes a power supply (106), a controller (108), and a laser device (116). The laser device (116) outputs a beam of photons (112). The controller (108) may include a modulator and/or a scanner to modulate and scan the beam of photons (112). The laser machine may further include a pulse supply unit to pulse the beam of photons (112). Pulsing the beam of photons (112) may help minimize the amount of heat applied to the surface (103) of the component (104). Additionally, pulsing the beam of photons (112) may help reduce problems arising as a result of the reflectivity of the surface (103) of the component (104). Embodiments disclosed herein may be utilized to texturize the surface (103) of the component (104) to have an arithmetic mean roughness profile (Ra) of from about 60 μin to about 360 μin.

[0030] The component (104) may include a material, such as a metal or metal alloy, a ceramic material, a polymeric material, a composite material, or combinations thereof. In one implementation, the component (104) includes a material selected from the group consisting of steel, stainless steel, tantalum, tungsten, titanium, copper, aluminum, nickel, gold, silver, aluminum oxide, aluminum nitride, silicon, silicon nitride, silicon oxide, silicon carbide, sapphire (Al ₂ O ₃ ), silicon nitride, yttria, yttrium oxide, and combinations thereof. In one implementation, the component (104) comprises metal alloys, such as austenitic-type stainless steels, iron-nickel-chromium alloys (e.g., Inconel ^™ alloys), nickel-chromium-molybdenum-tungsten alloys (e.g., Hastelloy ^™ ), copper-zinc alloys, chromium copper alloys (e.g., 5% or 10% Cr with balance Cu), and the like. In another implementation, the component comprises quartz. The component (104) may also comprise polymers, such as polyimide (Vespel ^™ ), polyetheretherketone (PEEK), polyarylate (Ardel ^™ ), and the like. In another implementation, the component (104) may include materials such as gold, silver, aluminum silicon, germanium, germanium silicon, boron nitride, aluminum oxide, aluminum nitride, silicon, silicon nitride, silicon oxide, silicon carbide, yttria, yttrium oxide, non-polymers, and combinations thereof.

[0031] The support system (102) can be positioned downstream of the laser machine (100). The support system (102) includes a support (122) similar to a substrate support in one or more embodiments for supporting the component (104). The support system (102) and the laser machine (100) are positioned relative to each other such that a beam of photons (112) output by the laser device (116) is directed toward the surface (103) of the component (104). In one implementation of the present disclosure illustrated in FIG. 1, the laser machine (100) can further include actuating means (124) for adjusting the position of the output of the laser device (116). In such an implementation, the support (122) may be held fixed and the actuating means (124) may adjust the position of the output of the laser device (116), thereby causing a beam of photons (112) output by the laser device (116) to be scanned across the surface (103). In an alternative implementation of the present disclosure illustrated in FIG. 2, the support system (102) may include actuating means (124) for moving the support (122). In such an implementation, the output of the laser device (116) may be held fixed and the actuating means (124) may adjust the position of the support (122), thereby causing a beam of photons (112) output by the laser device (116) to be scanned across the surface (103). The actuating means (124) for adjusting the position of either the laser device (116) or the support (122) may include, for example, an X-Y stage, an extension arm, and/or a rotating shaft capable of translational and/or rotational movement.

[0032] The controller (108) may be coupled to the laser device (116) in a manner that allows the controller to control various parameters associated with the beam of photons (112) output by the laser device (116). In particular, the controller (108) may be coupled to the laser device (116) to control at least the following parameters associated with the beam of photons (112): wavelength, pulse width, repetition rate, translation speed, power level, and beam size. By controlling these various parameters associated with the beam of photons (112), the controller (108) may dictate the surface morphology formed on the surface (103) of the component (104). It should be understood that “translation speed” includes implementations where the beam of photons (112) is translated and the component (104) is stationary, and implementations where the beam of photons (112) is translated and the component is stationary. As illustrated in FIG. 2, the controller (108) may also be connected to the support system (102) in such a way that the controller can control an actuating means (124) connected to the support (122). Alternatively, a secondary controller may be connected to the support system (102) to control the actuating means (124) connected to the support (122).

[0033] The controller (108) may be any type of general-purpose computer processor (CPU) that may be used in an industrial setting. The computer may utilize any suitable memory, such as random access memory, read-only memory, a floppy disk drive, a hard disk, or any other form of digital storage, local or remote. Various support circuits may be coupled to the CPU to support the processor in a conventional manner. If desired, software routines may be stored in memory, or may be executed by a second CPU located remotely. The software routines, when executed, transform the general-purpose computer into a specific process computer that controls the operation of the chamber process to be performed. Alternatively, the implementations described herein may be implemented in hardware, as an application-specific integrated circuit or other type of hardware implementation, or may be implemented in a combination of software and hardware.

[0034] The laser device (116) of the laser machine (100) may have a power output in the range of about 3 W to about 30 W. Alternatively, the laser machine may have a power output in the range of about 1 W to about 150 W. The laser device (116) may also be capable of pulsing the beam of photons (112) and varying parameters associated with the beam of photons (112) (e.g., wavelength, pulse width, pulse frequency, repetition rate, travel speed, power level, and beam size), as discussed further below. The laser device (116) of the laser machine (100) may be a commercially available laser. An example of a commercially available laser machine that may be in accordance with the present disclosure is the IPG YLPP laser from Spectral Physics Quanta-Ray Laser.

[0035] The laser machine (100) and support system (102) do not require a vacuum environment to perform the texturizing process, because the output of the laser device (116) is a beam of photons (112). Therefore, the output of the laser device (116) is different from conventional electromagnetic beam generation systems in which electron beams are used to perform the texturizing process. Electromagnetic beam systems typically require a vacuum environment (e.g., a vacuum chamber) due to the interaction and scattering of electrons with surrounding gas atoms, and thus, a vacuum environment is required to maintain precise control of the electron beam. As discussed above, the requirement of a vacuum environment imposes physical constraints on the size of components that can be texturized using the electromagnetic beam system, because the components must be able to fit within the vacuum chamber. In addition, the requirement of a vacuum environment increases the complexity of the electromagnetic system, because the vacuum chamber must include special equipment (e.g., pumps, sensors, seals). As a result, electromagnetic beam systems have significantly higher capital costs than would be incurred when using the laser machine (100) and support system (102) discussed in the present disclosure to perform the texturizing process.

[0036] Therefore, the laser machine (100) and the support system (102) can be used in an ambient air environment where the air through which the beam of photons (112) passes is approximately 78% nitrogen and approximately 21% oxygen. However, in some situations, it may be desirable to position the laser machine (100) and the support system (102) in an oxygen-depleted environment. In such situations, the laser machine (100) and the support system (102) can be positioned in a chamber where nitrogen gas is used instead of ambient air. Since no vacuum is required, the pressure within the chamber can be maintained at atmospheric pressure. It should be understood that “atmospheric pressure” can vary from location to location. In some embodiments, the pressure within the area where the component (104) is placed during processing may not be controlled.

[0037] Figure 4 illustrates a process sequence (200) for a method of operating a laser machine (100) and a support system (102), the process sequence (200) starting at 201 and ending at 209. In box (202), a component (104) is positioned on a support (122). In box (204), a first region (126) is defined on a surface (103) of the component (104). As illustrated in Figure 3, where the component (104) is a gas distribution showerhead (133) having a plurality of through-holes (135), the first region (126) has a first outer boundary (127) defining outer boundaries of the first region. The first outer boundary (127) defines a first surface area. A ratio of the first surface area to the second surface area of the component (104) can be at least 0.6. The second surface area of the component (104) is defined by the second outer boundary (132) of the surface (103) to be textured. Accordingly, the first surface area positioned within the second surface area can be at least 60% of the second surface area. It should be understood that the sizes of the first and second surface areas will vary depending on the shape and size of the component (104) to be textured. Alternatively, the ratio of the first surface area to the second surface area can be greater than 0.7, 0.8, and/or 0.9.

[0038] In box (206), the laser machine (100) is powered via a power supply (106) such that the laser device (116) outputs a beam of photons (112). As discussed above, the controller (108) of the laser machine (100) can vary parameters associated with the beam of photons (112) depending on the desired texture on the surface (103). In one implementation, the beam of photons (112) can have a wavelength in a range of about 345 nm to about 1100 nm. In another implementation, the beam of photons can have a wavelength in the ultraviolet range (about 170 nm to about 400 nm). In yet another implementation, the beam of photons can have a wavelength in the infrared range (about 700 nm to about 1.1 mm). A beam of photons (112) output by the laser device (116) is directed toward a surface (103) of a component (104) at a position within the first region (126). The beam of photons (112) can have a beam diameter in the range of about 7 μm to about 75 μm at the surface (103) of the component (104). Alternatively, the beam of photons (112) can have a beam diameter in the range of about 2.5 μm to about 100 μm at the surface (103) of the component (104). In one implementation, the working distance traveled by the beam of photons (112) is in the range of about 50 millimeters to about 1,000 millimeters. In another implementation, the working distance traveled by the beam of photons (112) is in the range of about 200 millimeters to about 350 millimeters. Since the laser device (116) of the laser machine (100) can have a power output in the range of about 1 W to about 150 W, the beam of photons (112) can have a pulse power in the range of about 10x10 ^-6 J to about 400x10 ^-6 J. The beam of photons (112) can have a pulse width in the range of about 10 ps to about 30 ns. Additionally, the beam of photons (112) can have a pulse repetition rate in one embodiment in the range of about 10 KHz to about 200 KHz, and more specifically, in another embodiment in the range of about 10 KHz to about 3 MHz. The controller (108) can be used to control the pulse width and/or pulse repetition rate of the laser device (116).

[0039] In the box (208), a beam of photons (112) is scanned across a first region (126) of the surface (103), thereby forming a plurality of features on the surface. The beam of photons (112) may be scanned across the first region (126) of the surface (103) at a travel speed ranging from about 0.1 m/s to about 30 m/s, for example, while the beam of photons (112) is pulsed from a laser device (116). As can be seen in FIGS. 5 to 10, the features formed as a result of the beam of photons (112) being scanned across the first region (126) of the surface (103) include depressions, protrusions, or a combination thereof. The controller (108) can be programmed to vary certain parameters associated with the beam of photons (112) as the beam of photons (112) is scanned across the first region (126). For example, the controller (108) can pulse the beam of photons (112) while the beam of photons (112) is scanned across the first region (126). In one implementation, the controller (108) can control the laser device (116) to have a pulse width in the range of about 0.2 ns to about 100 ns. In one embodiment, the controller (108) can control the laser device (116) to have a pulse width in the range of about 400 fs to about 200 ns.

[0040] In this way, the laser machine (100) can be used to form the entire surface morphology for the first region.

*

*[0041] Depending on the situation, the laser machine (100) can be used to form three different types of surface morphologies for the first region (126). As shown in FIGS. 5 and 6, the first surface morphology is a repeating random shape, wherein the repeating random shape generates a combination of protrusions and depressions. It should be understood that the plurality of protrusions can have, for example, a flat surface and a convex surface. In FIGS. 5 and 6, the maximum height change from the lowest depression to the highest protrusion is in the range of about 4,000 nm to about 4,500 nm. Since the surface morphology is a repeating random shape, the protrusions and depressions do not form periodic waves.

[0042] The repeating pattern can be achieved by synchronizing the pulse frequency and scan rate. As the pulsed laser and substrate move relative to each other, the laser emits radiation that impacts the substrate surface at repeating intervals, creating a repeating pattern. The exact shape of the repeating pattern can be adjusted by adjusting the temporal profile of the laser pulses relative to the scan rate. If a laser pulse having a very fast power ramp time relative to the scan rate is used, the repeating pattern will tend to be a substantially rectangular profile because the substrate does not translate very far during the ramp-up or ramp-down. If the ramp time is very short relative to the pulse duration, the repeating pattern will also tend to be a substantially rectangular profile because the temporal profile of the laser pulse is substantially flat. If the scan rate is low relative to the pulse duration or ramp time, the repeating pattern will also tend to be a substantially rectangular profile because the photons transmitted by each laser pulse are concentrated on a smaller area of the substrate. Increasing the ramp time and/or scan rate relative to the pulse duration will produce more rounded or tapered corners of the features being formed. By coupling a waveform generator to the laser power supply, the laser pulses themselves can also be modulated. In this way, the pulses can be produced with more tapered ramp rates, and even sinusoidal temporal profiles. These actions will produce features that tend to have a wave-like shape. The feature pitch is determined by the relationship between the scan rate and the pulse frequency. Thus, the feature pitch can be independently adjusted by adjusting the pulse frequency, which will be limited at the high end by the pulse duration.

[0043] An example of the repeating random shape Ra illustrated in FIGS. 5 and 6 is about 60 μin when the power output of the laser machine (100) is 30 W, the component (104) is aluminum, and the beam diameter is about 7 μm. It should be understood that the Ra value will vary depending on various variables associated with the power output of the laser machine (100) and the beam of photons (112). The repeating random shape achieved using the laser machine (100) can have a surface morphology and Ra value similar to that achieved using the bead blasting process, except that some of the problems inherent in the bead blasting process are avoided due to the use of the laser machine (100). For example, if the component (104) is a gas distribution showerhead (133) (as schematically illustrated in FIG. 3 ), there will be a plurality of tapered through-holes (135). As discussed above, the bead blasting process involves blasting multiple beads at high velocity onto the surface to be textured. As a result, there is an inherent lack of control and precision associated with the bead blasting process.

[0044] The beads used in the bead blasting process may also be captured or embedded within the through-holes (135). Additionally, the beads may strike the corners or edges of the through-holes (135) to undesirably alter the profile of the through-holes rather than texturizing the surface (103). Using the laser machine (100) to texturize the gas distribution showerhead (133) with a repeating random shape surface morphology will not alter the boundary profile of the through-holes (135) within the showerhead (133) as significantly due to the higher precision that can be achieved through this texturing process. The laser machine (100) can texturize the surface (103) within the first region (126) such that the repeating random shape continues to repeat within the first outer boundaries (127).

[0045] As shown in FIGS. 7 and 8, the second surface morphology is a repeating wave shape, wherein the repeating wave shape generates a combination of protrusions and depressions. It should be appreciated that the plurality of protrusions may have, for example, a generally convex surface. In FIGS. 7 and 8, the maximum height change from the lowest depression to the highest protrusion is in the range of about 4,000 nm to about 4,500 nm. Since the surface morphology is a repeating wave shape, the protrusions and depressions form a periodic profile in which each of the plurality of protrusions is a generally convex and pointed portion. The periodic profile associated with the repeating wave shape is repeated throughout the first region (126) of the surface (103) along both the x-axis of the surface and the y-axis of the surface.

[0046] An example of an arithmetic mean of the roughness profile (Ra) of the repeating wave shape shown in FIGS. 7 and 8 is about 108 μin when the power output of the laser machine (100) is 30 W, the component (104) is aluminum, and the beam diameter is about 7 μm. It should be understood that the Ra value will vary depending on various variables associated with the power output of the laser machine (100) and the beam of photons (112). Unlike the repeating random shape, the repeating wave shape is different from the surface morphology typically achieved using a bead blasting process. The laser machine (100) can texturize the surface (103) within the first region (126) such that the repeating wave shape continues to repeat within the first outer boundaries (127).

[0047] As shown in FIGS. 9 and 10, the third surface morphology is a repeating square shape, wherein the repeating square shape generates a combination of protrusions and depressions. It should be appreciated that the plurality of protrusions may have, for example, a substantially flat surface. In FIGS. 9 and 10, the maximum height change from the lowest depression to the highest protrusion is in the range of about 4,000 nm to about 4,500 nm. Since the surface morphology is a repeating square shape, the protrusions and depressions form a periodic profile in which each of the plurality of protrusions is a substantially flat portion. The periodic profile associated with the repeating square shape is repeated throughout the first region (126) of the surface (103) along both the x-axis of the surface and the y-axis of the surface.

[0048] An example of an arithmetic mean of the roughness profile (Ra) of the repeating square shape illustrated in FIGS. 9 and 10 is about 357 μin when the power output of the laser machine (100) is 30 W, the component (104) is aluminum, and the beam diameter is about 25 μm. It should be understood that the Ra value will vary depending on various variables associated with the power output of the laser machine (100) and the beam (112) of photons. The repeating square shape may be particularly applicable when the component (104) is an electrostatic chuck. As best seen in FIG. 9, the protrusions and depressions within the repeating square shape create a plurality of passages. The plurality of passages allow gas to pass through the passages under a silicon wafer, for example, which is placed on top of the electrostatic chuck during wafer processing.

[0049] A subsequent polishing process may be performed after the texturizing process to help planarize the top surfaces of the protrusions, thereby helping to adhere the silicon wafer to the electrostatic chuck during wafer processing. The portion of the component (104) that is not planarized during the polishing process will retain a surface roughness, thereby helping to prevent detachment of condensed foreign matter within the multiple passages during wafer processing. The laser machine (100) may texturize the surface (103) within the first region (126) such that the repeating square shape continues to repeat within the first outer boundaries (127).

[0050] Another advantage associated with the use of the laser machine (100) is that the surface (103) of the component (104) to be textured does not need to undergo a fine pre-cleaning process prior to the process box (202). Instead, only a rough pre-cleaning process is required to degrease the surface (103) of the component (104). This is unlike an electromagnetic beam system where a fine pre-cleaning process is typically required due to the highly reactive nature of the electron beam.

[0051] Another advantage associated with the use of the laser machine (100) to texturize the surface (103) of the component (104) is that there is no additional step of pumping down the pressure within the vacuum chamber, as would be the case with an electromagnetic beam system after the box (202). As discussed above, the electromagnetic beam system operates within a vacuum environment, and thus requires that the pressure of the environment be pumped down. Although the laser machine (100) and the support system (102) can be positioned within the chamber for the purpose of creating an oxygen-depleted environment, the environmental pressure does not need to be pumped down. Since this pumping down step is eliminated, the time required to texturize the surface (103) of the component (104) using the laser machine (100) is shorter than the time required to texturize the surface of the component using an electron beam. This helps to increase the throughput associated with texturizing the surface of the components using the laser machine (100) as compared to texturizing the surface of the components using an electromagnetic beam system. The throughput associated with the laser machine (100) is also greater than that associated with using an electromagnetic beam system because the travel speed at which the electron beam can be scanned across the surface to form the plurality of features is significantly slower than the travel speed at which the beam of photons (112) can be scanned across the surface. For example, the travel speed of the electron beam, when texturizing the surface, is in the range of about 0.02 M/s to about 0.03 M/s. As discussed above, the travel speed of the beam of photons (112), when texturizing the surface, is in the range of about 0.1 M/s to about 300 M/s.

[0052] Another advantage associated with texturing the surface (103) of the component (104) using a beam of photons (112) output by the laser device (116) is that texturing the surface (103) of the component (104) using a beam of photons (112) output by the laser device (116) can result in a cleaner process than, for example, using bead blasting or electron beams. Depending on the wavelength of the beam of photons (112), the material of the surface (103) toward which the beam of photons is directed can primarily receive optical radiation or thermal energy to modify the surface. The optical radiation melts the surface (103) of the component (104) at the location where the beam of photons is directed, thereby creating a molten material or slag that, when re-solidified, creates a depression or protrusion. Since the kinetic energy associated with the molten material can be minimized, there is less chance of the molten material being knocked off the remaining surface (103) and redeposited at some other location. This reduces the amount of redeposition that might otherwise occur. Conversely, when using an electron beam system, the component being texturized is often embedded with electrons that interact with the electron beam, generating significant energy, thereby knocking at least a portion of the molten material off the remaining surface, thereby increasing the chance of redeposition. As a result, texturizing a surface using a beam of photons (112) can result in a cleaner process than texturizing a surface using an electron beam.

[0053] It should be noted that the beam (112) of photons delivered to the surface (103) of the component (104) by the laser device (116) is not intended to cause significant or noticeable distortion (e.g., melting, warping, cracking, etc.) of the component (104). Significant or noticeable distortion of the component (104) may be generally defined as a state in which the component (104) is not usable for its intended purpose due to the application of the texturizing process.

[0054] Figures 11 and 12 illustrate schematics of laser machines (100) that may be used to texturize a surface (103) of a component (104). In particular, Figures 11 and 12 illustrate different arrangements, parts, and elements for the laser machine (100) and/or the laser device (116). As illustrated in Figure 11, the laser machine (100) may have a vertical orientation relative to the component (104), or as illustrated in Figure 12, the laser device (116) may have a horizontal orientation relative to the component (104). As discussed above, the component (104) is used in a semiconductor processing chamber. The component (104) may be, for example, a gas distribution showerhead, a shield, a chamber liner, a cover ring, a clamp ring, a substrate support pedestal, and/or an electrostatic chuck. Therefore, after being texturized by the laser machine (100), the component (104) is used as a component of a semiconductor processing chamber, where semiconductors such as wafers are processed within the semiconductor processing chamber.

[0055] As discussed above, the laser device (116) is used to output a beam of photons. The laser device (116) in FIGS. 11 and 12 is illustrated as including a light source (142), such as a photon light source, an optical module (144), and a lens (146), each of which are operably coupled to one another. However, in other embodiments, while the laser device (116) is illustrated as including a light source (142), an optical module (144), and a lens (146), the present disclosure is not so limited. For example, in one or more other embodiments, without departing from the scope of the present disclosure, the power supply (106) and/or the controller (108) illustrated in FIGS. 1 and 2 may additionally or alternatively include a light source (142), an optical module (144), and/or a lens (146).

[0056] The optical source (142) is used to generate a source of light, and in particular, a stream of photons in the present embodiment. An optical module (144) operably coupled to the optical source (142) receives a stream of photons from the optical source (142) and shapes, directs, or otherwise modulates the stream of photons from the optical source (142). The optical module (144) includes a beam modulator and a beam scanner, the beam scanner being positioned downstream from the beam modulator (with respect to the optical source (142)). The beam modulator receives a stream of photons from the optical source (142) and generates a beam of photons from the stream of photons. For example, the beam modulator can be used to generate a beam of photons having a single focus by shaping the stream of photons from the optical source (142). The beam scanner receives a beam of photons from the beam modulator and is used to scan the beam of photons across a surface (103) of the component (104). Thus, beam scanners are used to move, deflect, and otherwise control the direction of a beam of photons, for example through the use of electromechanical actuators.

[0057] The lens (146) is used to receive a beam of photons from the optical module (144), and more specifically from the beam scanner, and to distribute the beam of photons across the surface (103) of the component (104). Since the beam modulator of the optical module (144) is used to focus a stream of photons into a single focused beam of photons, the lens (146) is used to defocus and distribute the beam of photons equally across a predetermined area or region. For example, the lens (146) can be used to distribute the beam of photons across an area of about 355 mm ² . The beam of photons distributed across the surface (103) of the component (104) is used to form one or more textured features on the surface (103) of the component (104), such as depressions and/or protrusions on the surface (103) of the component (104).

[0058] The laser device (116) is used to control the power, speed, frequency, direction, distribution, and/or pulse(s) of a beam of photons emitted from the laser device (116) and scanned across the surface (103) of the component (104). For example, the light source (142) and/or the optical module (144) may be used to pulse the beam of photons while the beam of photons is scanned across the surface (103) of the component (104). Additionally, the beam scanner of the optical module (144) may be used to direct or scan the beam of photons across the surface (103) of the component (104) in one or more predetermined patterns. In one embodiment, the beam scanner may be used to scan the beam of photons using a line-by-line pattern, a sparrow pattern, and/or a random pattern. The Sparrow pattern operates in a radial pattern as opposed to a line-by-line pattern by scanning a beam of photons in an out-to-in or in-to-out pattern about the middle or central region of the surface (103) of the component (104).

[0059] The laser device (116) is also used to distribute and scan a beam of photons vertically or horizontally from the lens (146) toward the surface (103) of the component (104). A support (122) including a support surface (190) is shown to be used with the laser machine (100), and the component (104) is positioned between the lens (146) and the support (122). The support surface (190) is used to support the component (104) on the support (122), and accordingly, the component (104) is positioned on the support surface (190) of the support (122) in the arrangement shown in FIG. 11, where the beam of photons is distributed vertically toward the surface (103) of the component (104). The support surface (190) of the support (122) is used as a barrier behind the component (104) in the arrangement illustrated in FIG. 12 where the beam of photons is distributed horizontally towards the surface (103) of the component (104). An advantage of the horizontal arrangement illustrated in FIG. 12 is that gravity can be used to pull material from the surface (103) of the component (104), for example when the material is melted. This can result in a cleaner process than if the material were to be redeposited or formed on the surface.

[0060] Still referring to FIGS. 11 and 12, a clean enclosure (150) or clean compartment is included for use with the laser machine (100). The clean enclosure (150) typically includes a processing area (151) with a support (122) disposed in the processing area (151). For example, the component (104) is positioned within the clean enclosure (150) during the texturizing process, wherein the processing area (151) of the clean enclosure (150) includes a filtration system capable of maintaining the processing area as a Class 1 environment according to classification parameters from ISO 14644-1. Additionally, the support (122), and at least a portion of the laser device (116), such as the lens (146), are positioned within the clean enclosure (150). Since the laser machine (100) is used within a non-pressurized (e.g., atmospheric) environment, the pressure within the clean enclosure (150) may be substantially equal to or approximately atmospheric pressure, or the pressure may be uncontrolled. Alternatively and/or additionally, the clean enclosure (150) may be purged with an inert gas (e.g., N ₂ ) to remove oxygen, water, and/or other process contaminants. Additionally, a conveyor may be used to introduce the components (104) into the clean enclosure (150) and onto the support (122), and/or the conveyor may be used to remove the components (104) from the support (122) and out of the clean enclosure (150). For example, in such an embodiment, the support (122) may include a conveyor. Alternatively, a separate robotic arm or similar mechanism may be used to facilitate removing components (104) from the conveyor and/or placing components (104) on the conveyor.

[0061] FIG. 13 depicts a graphical representation comparing average elemental results for components textured using a bead blasting process (302), components textured using a laser process (304) according to embodiments described herein, and components used in a semiconductor processing chamber, generally within a specification (306) required for the components. The x-axis provides the different elements (e.g., trace metals) tested in each of the components, and the y-axis provides the amount of the elements found on the surface of the component in units of atoms/cm ² . As shown, the components textured using the laser process (304) generally had fewer elements or trace metals than those required by the specification (306), and also generally had fewer elements or trace metals than those textured using the bead blasting process (302). For example, since the beads used in the bead blasting process (302) typically contain sodium (Na), the amount of sodium in the components textured using the laser process (304) is significantly reduced as opposed to the bead blasting process (302). Although the components textured using the laser process (304) may typically have a higher amount of magnesium (Mg), these components may be subsequently cleaned using diluted acid and high purity water (e.g., high temperature deionized water) to remove the excess magnesium. Thus, the components textured using the laser process (304) produce higher yields, such as about 95%, during subsequent semiconductor processing as compared to components textured using the bead blasting process (302), which may be expected to be about 50%.

[0062] While the foregoing is directed to implementations of the present disclosure, other and additional implementations of the present disclosure may be devised without departing from the basic scope of the present disclosure, and the scope of the present disclosure is determined by the following claims.

Claims (15)

A system for providing texture to the surface of a component for use in a semiconductor processing chamber,
An enclosure containing a processing area;
A support member disposed in the above processing area and including a support surface;
A photon light source for generating a stream of photons;
An optical module operably coupled to the photon source for receiving a stream of photons from the photon source, the optical module comprising:
a beam modulator for generating a beam of photons from the stream of photons generated from the photon light source, and
A beam scanner for scanning a beam of photons across the surface of the component.
including ―; and
A lens for receiving the beam of photons from the beam scanner and distributing the beam of photons across the surface of the component with a wavelength ranging from about 345 nm to about 1100 nm to form a plurality of features on the component.
Including,
A system for providing texture to the surface of a component for use in a semiconductor processing chamber. In the first paragraph,
The above lens is configured to distribute the beam of photons horizontally toward the surface of the component,
A system for providing texture to the surface of a component for use in a semiconductor processing chamber. In the first paragraph,
The lens is configured to distribute the beam of photons perpendicularly toward the surface of the component.
A system for providing texture to the surface of a component for use in a semiconductor processing chamber. In the first paragraph,
The above component is positioned between the lens and the support,
The above processing area is maintained as a Class 1 environment, and the support surface of the support and the lens are positioned within the Class 1 environment,
The above processing zone contains a pressure substantially equal to atmospheric pressure,
The system further comprises a conveyor for introducing the component into the Class 1 environment or removing the component from the Class 1 environment.
A system for providing texture to the surface of a component for use in a semiconductor processing chamber. In the first paragraph,
The beam scanner is configured to scan the beam of photons across the surface of the component using a line-by-line pattern or a sparrow pattern.
A system for providing texture to the surface of a component for use in a semiconductor processing chamber. In the first paragraph,
The optical module is configured to pulse the beam of photons while scanning the beam of photons across the surface of the component.
A system for providing texture to the surface of a component for use in a semiconductor processing chamber. In Article 6,
The beam of photons above is,
Beam diameter in the range of about 7 μm to about 100 μm;
Pulse width in the range of about 10 ps to about 30 ns; and
Pulse repetition rate in the range of about 10 KHz to about 200 KHz
Including,
A system for providing texture to the surface of a component for use in a semiconductor processing chamber. In the first paragraph,
The formed features include depressions, protuberances, or combinations thereof.
A system for providing texture to the surface of a component for use in a semiconductor processing chamber. A method for providing texture to the surface of a component for use in a semiconductor processing chamber,
Step of generating a stream of photons;
A step of shaping the stream of photons into a beam;
scanning a beam of photons toward the surface of said component through a processing zone containing a gas concentration of ambient air or nitrogen at a pressure substantially equal to atmospheric pressure; and
A step of distributing a beam of photons across a surface of the component to form a plurality of features on the surface of the component.
Including,
A method for providing texture to the surface of a component for use in a semiconductor processing chamber. In Article 9,
Further comprising the step of assembling the above component and the semiconductor processing chamber, and processing the semiconductor within the semiconductor processing chamber.
A method for providing texture to the surface of a component for use in a semiconductor processing chamber. In Article 9,
Further comprising the step of positioning said component within an enclosure maintained as a Class 1 environment;
The positioning step comprises using a conveyor to transport the component into the Class 1 environment.
A method for providing texture to the surface of a component for use in a semiconductor processing chamber. In Article 9,
The distributing step comprises distributing the beam of photons horizontally toward the surface of the component.
A method for providing texture to the surface of a component for use in a semiconductor processing chamber. In Article 9,
further comprising the step of pulsing the beam of photons while scanning the beam of photons across the surface of the component;
The beam of photons comprises a wavelength ranging from about 345 nm to about 1100 nm, and the formed features comprise depressions, protrusions, or combinations thereof.
A method for providing texture to the surface of a component for use in a semiconductor processing chamber. A system for providing texture to the surface of a component for use in a semiconductor processing chamber,
An enclosure containing a processing area maintained as a Class 1 environment having a pressure substantially equal to atmospheric pressure;
A support member disposed in the above processing area and including a support surface;
A photon light source for generating a stream of photons;
An optical module operably coupled to the photon source for receiving a stream of photons from the photon source, the optical module comprising:
a beam modulator for generating a beam of photons from the stream of photons generated from the photon light source, and
A beam scanner for scanning a beam of photons across the surface of the component.
including ―; and
A lens disposed in the processing region to receive the beam of photons from the beam scanner and distribute the beam of photons across the surface of the component with a wavelength ranging from about 345 nm to about 1100 nm to form a plurality of features on the component.
Including,
A system for providing texture to the surface of a component for use in a semiconductor processing chamber. In Article 14,
The above lens is configured to distribute the beam of photons horizontally toward the surface of the component,
A system for providing texture to the surface of a component for use in a semiconductor processing chamber.