KR20250056537A - Opener unit for test board socket and test handler - Google Patents

Abstract

The present invention relates to an opener unit for a test board socket capable of opening a latch of the socket so that a semiconductor device for a performance test can be mounted on a test board, and a test handler including the same, the opener unit including a body that is formed long in the longitudinal direction so that it can be formed in an overall rectangular parallelepiped shape, and in which a through slot portion penetrating the upper and lower portions is formed long in the longitudinal direction, an opener portion formed along the through slot portion on one surface of the body and opening the latches of the sockets so that semiconductor devices can be mounted in the sockets of a test board, and a variable elastic portion that is elastically formed between the body and the opener portion so that the shock generated when the opener portion opens the latch is attenuated by an elastic force, and the elastic force can be variably adjusted.

Description

{Opener unit for test board socket and test handler}

The present invention relates to an opener unit for a test board socket and a test handler, and more particularly, to an opener unit for a test board socket capable of opening a latch of a socket so that a semiconductor device for performance testing can be mounted on a test board, and a test handler including the same.

A semiconductor device is one type of electronic component having a structure in which chips are connected to a substrate. For example, a semiconductor device may include a memory device such as a DRAM or SRAM.

These semiconductor devices are manufactured based on a wafer made of a thin single-crystal substrate made of silicon. More specifically, semiconductor devices are manufactured by performing a fab process for forming a plurality of chips on which circuit patterns are patterned on a wafer, a bonding process for electrically connecting each of the chips formed in the fab process, and a molding process for protecting the chips connected to the substrate from the outside. Semiconductor devices manufactured in this manner undergo a separate test process to test their electrical performance.

In general, a test process for testing the electrical performance of semiconductor devices is conducted through a test device that performs tests on semiconductor devices and a test handler that handles the semiconductor devices to connect them to the test device.

In this test process, before/after a test for electrical performance is performed on a test device, an opener unit that opens latches of the sockets can press the sockets to pick and place semiconductor devices in order to mount the semiconductor devices in the sockets of the test board. Here, the opener unit is a tool whose size changes according to the size of the semiconductor device or the pitch information of the tester, and can be replaced and used according to the size of the semiconductor devices to be tested.

However, the opener unit for the conventional test board socket and the test handler including the same have a damping function that reduces the shock generated when the opener part opens the latch that fixes the semiconductor element by the elasticity of the spring by embedding a plate spring or a coil spring inside the opener part that opens the latch of the test board socket, and prevents the device from bouncing due to this. However, since the elasticity of the built-in plate spring or coil spring is fixedly formed at the maximum value of the spring of the test board, the density of the socket formed on the test board is low, so that when a small number of springs are formed, the force of the counterpart is significantly low compared to the elasticity of the opener part, and thus there is a problem that the opener unit cannot function as a damper. In addition, due to this, there was a problem that disassembly and assembly of the entire opener unit is necessary to change the elasticity of the opener unit.

The present invention is intended to solve various problems including the above-described problems, and the purpose of the present invention is to provide an opener unit and a test handler for a test board socket, which can effectively reduce the shock generated when the opener part opens the latch that fixes a semiconductor device by the elasticity of the spring, and prevent the device from jumping due to this by incorporating a variable elastic part capable of controlling elasticity into the inside of an opener part that opens a latch of a test board socket, thereby appropriately controlling the elasticity according to the density of a socket formed on a test board, thereby responding to various force values of the test board. However, these tasks are exemplary and the scope of the present invention is not limited thereby.

According to one embodiment of the present invention, an opener unit for a test board socket is provided. The opener unit for the test board socket may include: a body formed to be long in the longitudinal direction so as to be formed in an overall rectangular parallelepiped shape, and having a through slot portion extending upward and downwardly formed to be long in the longitudinal direction; an opener portion formed along the through slot portion on one surface of the body and opening a latch of the sockets of the test board so that semiconductor devices can be mounted in the sockets; and a variable elastic portion formed elastically between the body and the opener portion to attenuate a shock generated when the opener portion opens the latch by an elastic force, and the elastic force can be variably adjusted.

According to one embodiment of the present invention, the body may have a mounting groove formed on one surface on which the opener part is mounted so as to extend along the through slot portion so that at least a portion of the opener part can be formed in a form embedded in the interior of the body.

According to one embodiment of the present invention, the opener portion may be arranged in a row along the seating groove portion to open the latch of the socket while at least a portion of the opener portion is inserted into the socket so that the semiconductor element can be seated in the correct position of the socket, and to guide the semiconductor element mounted in the socket.

According to one embodiment of the present invention, the variable elastic member may be formed between the upper surface of each opener of the opener member and the seating surface of the seating groove member.

According to one embodiment of the present invention, the variable elastic member may include a damper whose elastic force can be variably adjusted by hydraulic pressure of a fluid filled therein or pneumatic pressure of air.

According to one embodiment of the present invention, the variable elastic member may include an O-ring whose elastic force can be variably adjusted by adjusting the hydraulic pressure of the fluid or the pneumatic pressure of the air filled therein.

According to one embodiment of the present invention, the variable elastic member may include an air tube whose elastic force can be variably adjusted by hydraulic pressure of a fluid filled therein or pneumatic pressure of air.

According to one embodiment of the present invention, the variable elastic member may include a spring screw whose elastic force can be variably adjusted by adjusting the compression length of a coil compression spring inserted therein.

According to one embodiment of the present invention, the body may include a cover plate that closes at least a portion of the open lower portion of the mounting groove portion so as to prevent the opener portion from being separated from the mounting groove portion having an open lower portion.

According to another embodiment of the present invention, a test handler is provided. The test handler includes: a loading module into which semiconductor devices are loaded; a board waiting section in which at least one test board having a plurality of sockets formed therein waits; a mounting module which picks up the semiconductor devices between a test board waiting in the board waiting section and the loading module and mounts them in the sockets; a test buffer section through which the test board is transferred from the board waiting section and between the test board and a test device for testing the performance of the semiconductor devices; and an unloading module through which the test board on which the semiconductor devices for which the performance test has been completed is unloaded from the test buffer section; and the mounting module includes: a pickup unit which picks up the semiconductor devices between the loading module and the test board and mounts them in the sockets; And the pick-up unit comprises an opener unit coupled to each socket so as to open the latches of the sockets when the semiconductor devices are mounted in the sockets, and which guides the mounting position of each of the semiconductor devices; wherein the opener unit comprises: a body formed long in the longitudinal direction so as to be formed in an overall rectangular parallelepiped shape, and having a through slot portion extending upward and downward formed long in the longitudinal direction; an opener portion formed along the through slot portion on one surface of the body and opening the latches of the sockets so that the semiconductor devices can be mounted in the sockets of the test board; and a variable elastic portion formed elastically between the body and the opener portion so as to attenuate, by elastic force, a shock generated when the opener portion opens the latch, and the elastic force can be variably adjusted.

According to one embodiment of the present invention as described above, a variable elastic part capable of controlling elasticity is built into the inside of an opener part that opens a latch of a test board socket, so that the elasticity can be appropriately adjusted according to the density of a socket formed on a test board without disassembling and assembling the opener unit, thereby effectively reducing the shock generated when the opener part opens a latch that fixes a semiconductor device by the elasticity of the spring in response to various force values of the test board, and implementing an opener unit and test handler for a test board socket having the effect of preventing the device from jumping due to this. Of course, the scope of the present invention is not limited by such effects.

FIG. 1 is a cross-sectional diagram schematically illustrating a test handler according to one embodiment of the present invention.
FIG. 2 is a perspective view and a cross-sectional view schematically illustrating an opener unit included in the test handler of FIG. 1.
FIGS. 3 to 7 are cross-sectional views showing various embodiments of a variable elastic member that elastically supports an opener portion in an opener unit.

Hereinafter, various preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art, and the following embodiments can be modified in various different forms, and the scope of the present invention is not limited to the following embodiments. Rather, these embodiments are provided to more faithfully and completely convey the idea of the present invention to those skilled in the art. In addition, the thickness and size of each layer in the drawings are exaggerated for convenience and clarity of explanation.

Hereinafter, embodiments of the present invention will be described with reference to drawings that schematically illustrate ideal embodiments of the present invention. In the drawings, for example, variations in the shapes depicted may be expected depending on manufacturing techniques and/or tolerances. Accordingly, embodiments of the present invention should not be construed as being limited to the specific shapes of the regions depicted in this specification, but should include, for example, variations in shapes resulting from manufacturing.

FIG. 1 is a cross-sectional view schematically showing a test handler (1000) according to one embodiment of the present invention, FIG. 2 is a perspective view and a cross-sectional view schematically showing an opener unit (420) included in the test handler (1000) of FIG. 1, and FIGS. 3 to 7 are cross-sectional views showing various embodiments of a variable elastic member (30) that elastically supports an opener portion (20) in the opener unit (420).

As illustrated in FIG. 1, a test handler (1000) according to one embodiment of the present invention may largely include a stacker (100), a loading module (200), a board standby unit (300), a mounting module (400), a test buffer unit (500), and an unloading module (600).

As shown in Fig. 1, a plurality of semiconductor devices (SD) can be loaded onto the stacker (100). These semiconductor devices (SD) can be loaded onto the stacker (100) while being mounted on a customer tray (CT).

In addition, the stacker (100) can be divided into a first zone (a) in which customer trays (CTs) loaded with semiconductor devices (SDs) to be subjected to electrical performance tests through a test device (1) to be described later are loaded, a second zone (b) in which customer trays (CTs) that become empty as semiconductor devices (SDs) are loaded from the first zone (a) into a loading module (200) to be described later are loaded, and a third zone (c) in which customer trays (CTs) unloaded with semiconductor devices (SDs) that have completed performance tests from an unloading module (600) to be described later are loaded.

As shown in Fig. 1, semiconductor devices (SD) can be loaded into the loading module (200). The loading module (200) can include a loader unit (210), a DC test unit (220), a good loading unit (230), and a bad loading unit (240).

The loader unit (210) may be placed adjacent to the first section (a) of the stacker (100). Semiconductor devices (SD) may be loaded into the loader unit (210) from the stacker (100). Accordingly, a plurality of loading loading units (212) on which semiconductor devices (SD) are loaded may be placed in the loader unit (210). At this time, the loading module (200) may include a scan unit (250) installed on the loading loading units (212) to identify the semiconductor devices (SD) loaded into the loading loading units (212).

Information (size information and pitch information) of semiconductor elements (SD) acquired from the scan unit (250) is transmitted to all configurations of the subsequent process, and can be displayed on a display device showing the operation of the test handler (1000) so that the operator can check it. Accordingly, errors that may occur in the process as the size or pitch of the semiconductor elements (SD) changes can be prevented.

The DC test section (220) is arranged adjacent to the loader section (210) and can receive semiconductor elements (SD) from the loading and stacking sections (212). In the DC test section (220), the direct current characteristics of the semiconductor elements (SD) can be tested.

Accordingly, the loading module (200) may further include a first transfer unit (260) for transferring semiconductor devices (SD) between the loader unit (210) and the DC test unit (220). The first transfer unit (260) may include a transfer rail (262) connecting the loader unit (210) and the DC test unit (220) and a loading picker (not shown) for picking up semiconductor devices (SD) from the loader unit (210) and transferring them to the DC test unit (220) while moving along the transfer rail (262). At this time, the loading picker may be configured to pick up multiple devices in one row at once for process efficiency.

The good product loading unit (230) is arranged adjacent to the DC test unit (220) so that good semiconductor devices (SD) tested in the DC test unit (220) can be loaded. At this time, the good product loading unit (230) can be arranged on an extension of the transport rail (262) so that the semiconductor devices (SD) tested in the DC test unit (220) can be transported by the first transport unit (260).

In addition, the loading module (200) may further include a second transfer unit (270) that transfers the quality loading units (230) in a direction perpendicular to the transfer direction of the first transfer unit (260) so that the quality loading units (230) can be separately loaded by the first transfer unit (260) onto a plurality of quality loading units (230).

The defective loading unit (240) is arranged adjacent to the DC test unit (220) so that defective semiconductor devices (SD) tested in the DC test unit (220) can be loaded. At this time, the defective loading unit (240) can be arranged on an extension of the transport rail (262) so that the semiconductor devices (SD) tested in the DC test unit (220) can be transported by the first transport unit (260). This defective loading unit (240) can be arranged along the direction in which the third transport unit (280), which is formed in a direction perpendicular to the first transport unit (260), transports the defective loading unit (240).

As illustrated in FIG. 1, the board standby unit (300) can hold at least one test board (TB) having a plurality of sockets formed therein. The board standby unit (300) can be positioned adjacent to the loading module (200). For example, the board standby unit (300) can be positioned adjacent to the quality loading units (230) that are transferred to a position away from the loader unit (210) and the DC test unit (220) by the second transfer unit (270).

As illustrated in FIG. 1, the mounting module (400) can pick up semiconductor devices (SD) between a test board (TB) waiting in the board standby section (300) and a loading module (200) and mount them in the sockets.

For example, the mounting module (400) may largely include a pickup unit (410) and at least one opener unit (420).

The pickup unit (410) can pick up semiconductor devices (SD) from the good product loading units (230) and mount them in the sockets of the test board (TB). The pickup unit (410) can include a mounting picker (412) and a mounting transport unit (414).

More specifically, the mounting picker (412) can actually pick up the semiconductor elements (SD) through a vacuum suction method or the like. At this time, the mounting picker (412) can be configured to pick up the number of semiconductor elements (SD) equal to the number of sockets in one row of the test board (TB) at once for process efficiency. In addition, the mounting picker (412) can be configured to pick up all semiconductor elements (SD) of different sizes and pitches loaded on the good product loading units (230).

The mounting transport unit (414) can transport the mounting picker (412) between the good product loading units (230) and the test board (TB) to position the semiconductor devices (SD) picked up by the mounting picker (412) at positions corresponding to the sockets of the test board (TB).

As shown in FIGS. 1 and 2, the opener unit (420) is coupled to each socket so that the pick-up unit (410) opens the latches of the sockets when the semiconductor devices (SD) are mounted in the sockets, and can guide the mounting position of each of the semiconductor devices (SD).

For example, the opener unit (420) can open a latch that fixes the semiconductor element (SD) by the elastic force of a spring by applying pressure to the socket when coupled to an area where the semiconductor element (SD) of the socket is mounted, and when separated from the socket, the latch can return to its original position by the elastic force of the spring to fix the semiconductor element (SD). At the same time, the opener unit (420) can guide a semiconductor element (SD) mounted while coupled to the socket so that the semiconductor element (SD) can be mounted at an accurate position in the socket.

Here, the number of the plurality of sockets formed on the test board (TB) may vary greatly depending on the number or specifications of the semiconductor devices (SB) on which the inspection process is performed. Accordingly, the opener unit (420) opens the latch formed on the plurality of sockets and fixes the semiconductor devices (SB) by spring elasticity, and the elasticity for attenuating the shock generated during opening may also be required differently for each test board (TB).

For example, the elastic force of the opener unit (420) may be preferably set appropriately according to the density (number) of the plurality of sockets formed on the test board (TB) so as to open the latch by pressing it with a value greater than the spring values of the latches formed on the plurality of sockets, but not by pressing it with an excessively large value so as to act as a damper by the elastic force.

To this end, as shown in FIGS. 2 and 3, the opener unit (420) can be configured to largely include a body (10), an opener portion (20), and a variable elastic portion (30).

The body (10) is formed to be long in the longitudinal direction so that it can be formed as a rectangular solid shape overall, and a through slot portion (11) penetrating the upper and lower parts can be formed to be long in the longitudinal direction.

For example, the body (10) may be a kind of frame structure having appropriate strength and durability that can sufficiently support the opener portion (20) and the variable elastic portion (30) to be described later. For example, the body (10) may be a frame structure formed by welding or connecting an integral injection-molded structure, a casting, or variously shaped plates, wires, pipes, vertical members, horizontal members, and inclined members. However, the body (10) is not necessarily limited to those of FIGS. 2 and 3, and members of various shapes that can support the above-described components may be applied.

In addition, as shown in FIGS. 2 and 3, the opener portion (20) is formed along the through slot portion (11) on one side of the body (10) and can open the latches of the sockets so that semiconductor elements (SD) can be mounted in the sockets of the test board (TB).

More specifically, the body (10) is formed with a mounting groove (12) extending along a through slot (11) on the lower surface where the opener part (20) is mounted so that at least a portion of the opener part (20) can be formed in a form in which the opener part (20) is embedded into the interior of the body (10), and the opener part (20) can have a plurality of openers (21) arranged in a row along the mounting groove (12) so that the semiconductor element (SD) can be mounted in the correct position of the socket while opening the latch of the socket at the same time.

At this time, the body (10) may include a cover plate (13) that closes at least a portion of the open lower portion of the mounting groove portion (12) so as to prevent the plurality of openers (21) of the opener portion (20) from being separated from the mounting groove portion (12) whose lower portion is open.

In addition, as shown in FIG. 3, a variable elastic member (30) is formed elastically between the body (10) and the opener member (20), so that the opener member (20) can attenuate the shock generated when opening the latch by elastic force, and the elastic force can be configured to be variably adjusted.

For example, the variable elastic member (30) can be formed between the upper surface of each opener (21) of the opener member (20) and the mounting surface of the mounting groove (12) of the body (10).

These variable elastic members (30) can be applied with a wide variety of elastic members whose elasticity can be variably adjusted and which can act as dampers.

For example, as shown in FIG. 4, the variable elastic member (30) may include a diaphragm-type damper (31).

Accordingly, the elastic force of the variable elastic member (30) that elastically supports each opener (21) of the opener member (20) can be variably adjusted by adjusting the hydraulic pressure of the fluid or the pneumatic pressure of the air filled inside the diaphragm-type damper (31).

Additionally, as illustrated in FIG. 5, the variable elastic member (30) may include a hollow O-ring (32) with an empty interior.

Accordingly, the elastic force of the variable elastic part (30) that elastically supports each opener (21) of the opener part (20) can be variably adjusted by adjusting the hydraulic pressure of the fluid or the pneumatic pressure of the air filled inside the O-ring (32).

Additionally, as shown in Fig. 6, the variable elastic member (30) may include a hollow air tube (33) with an empty interior.

Accordingly, the elastic force of the variable elastic member (30) that elastically supports each opener (21) of the opener member (20) can be variably adjusted by adjusting the hydraulic pressure of the fluid or the pneumatic pressure of the air filled inside the air tube (33).

In addition, as illustrated in FIG. 7, the variable elastic member (30) may include a spring screw (34) whose elastic force can be variably adjusted by adjusting the compression length of a coil compression spring (S) inserted therein.

For example, a spring screw (34) has a coil compression spring (S) inserted into a body having a male screw thread formed therein, and a nut (N) that is screw-connected to the body by having a female screw thread formed on the inner surface thereof supports the lower end of the coil compression spring (S), so that the compression length of the coil compression spring (S) formed between the head of the spring screw (34) and the nut (N) can be adjusted according to the position adjustment of the nut (N).

Accordingly, the elastic force for elastically supporting each opener (21) of the opener part (20) can be variably adjusted by adjusting the compression length of the compression spring (S) by adjusting the position of the nut (N) screwed into the body of the spring screw (34) (rotating the nut (N) clockwise or counterclockwise).

In addition, any member whose elasticity can be variably adjusted can be used as the variable elastic member (30).

In addition, although the opener unit (420) of the mounting module (400) in this embodiment is shown as being formed in one line on the test board (TB) (see FIG. 1), it may be formed in a very diverse number, such as two lines, three lines, or four lines, on the test board (TB) for an efficient test process.

Again, as illustrated in FIG. 1, in the test handler (1000), the test buffer section (500) may be placed adjacent to the board standby section (300). A test board (TB) on which semiconductor devices (SD) are mounted may be transferred from the board standby section (300) to the test buffer section (500) by the mounting module (400).

The test buffer unit (500) can transfer a test board (TB) on which semiconductor devices (SD) to be tested are mounted to a test device (1) for testing the performance of semiconductor devices (SD), or can receive a test board (TB) on which semiconductor devices (SD) that have completed testing are mounted from the test device (1). At this time, the test device (1) may include a plurality of test units (not shown) that can be tested for an efficient test process.

As illustrated in FIG. 1, the unloading module (600) may be arranged adjacent to the test buffer section (500). For example, the unloading module (600) may be arranged in a parallel structure with the loading module (200) and the board standby section (300) with the test buffer section (500) in between for efficiency in terms of spatial design of the test handler (1000). A test board (TB) on which semiconductor devices (SD) that have completed performance testing are mounted from the test buffer section (500) may be transferred to the unloading module (600).

More specifically, the unloading module (600) may include at least one unloading buffer unit (700), a second mounting module (800), a selection unit (900), and an unloader unit (950).

The unloading buffer unit (700) may include a plurality of semiconductor devices (SD) that are unloaded from the test board (TB) in the test buffer unit (500) according to their types. Here, as the semiconductor devices (SD) are unloaded into the unloading buffer units (700), the empty test board (TB) is transferred to the board standby unit (300) so that other semiconductor devices (SD) can be mounted through the mounting module (400).

The second mounting module (800) can pick up semiconductor devices (SD) from the test board (TB) between the test board (TB) and the unloading buffer units (700) and transfer them to the unloading buffer units (700) by classifying them according to type. The second mounting module (800) includes a configuration similar to the mounting module (400). Accordingly, the second mounting module (800) can include a second pickup unit (810) and a second opener unit (820).

The second pickup unit (810) may include a second mounting picker (812) that actually picks up semiconductor devices (SD), and third and fourth mounting transport units (814, 816) that are connected to the second mounting picker (812) and transport the second mounting picker (812) along the row and column directions, respectively.

In addition, the second opener unit (820) can be coupled to the test board (TB) to open the latches of each of the sockets. Here, the configuration of the second opener unit (820) can be the same as the opener unit (420) included in the mounting module (400) described above. Therefore, a detailed description is omitted.

In addition, the sorting unit (900) may be placed adjacent to the unloading buffer units (700). In the sorting unit (900), semiconductor devices (SD) may be sorted from the unloading buffer units (700) according to the test results and unloaded by grade.

Accordingly, the unloading module (600) may further include a sorting transport unit (960) that transports semiconductor devices (SD) between the unloading buffer units (700) and the sorting units (900). Similar to the mounting module (400) and the second mounting module (800), the sorting transport unit (960) may include an unloading picker (962) that picks up semiconductor devices (SD) and a sorting transport unit (964) that is connected to the unloading picker (962) and transports the unloading picker (962) to the sorting unit (900).

In addition, the unloader unit (950) may be placed between the sorting unit (900) and the third section (c) of the stacker (100). In the unloader unit (950), a plurality of unloading loading units (952) on which semiconductor devices (SD) sorted in the sorting unit (900) are loaded may be placed. At this time, the process of unloading the semiconductor devices (SD) into the unloader unit (950) may be continuously performed by the sorting transport unit (960).

Thereafter, the semiconductor devices (SD) unloaded in the unloader section (950) can be unloaded according to type and grade to the third section (c) of the stacker (100). The semiconductor devices (SD) unloaded in the third section (c) of the stacker (100) can undergo different subsequent processes according to the classification.

Therefore, according to the opener unit (420) for a test board socket according to various embodiments of the present invention and the test handler (1000) including the same, a variable elastic part (30) capable of adjusting elasticity is built into the inside of the opener part (20) that opens the latch of the socket of the test board (TB), so that the elasticity can be appropriately adjusted according to the density of the sockets formed on the test board (TB) without disassembling and assembling the opener unit (420), thereby effectively reducing the shock generated when the opener part (20) opens the latches that fix the semiconductor device (SB) by the elasticity of the spring in response to various force values (spring values of the latches) of the test board (TB), and preventing the device from bouncing due to this.

Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical idea of the appended claims.

1: Test device
10: Body
11: Through slot section
12: Settlement Home
13: Cover plate
20: Opener section
21: Revenge Opener
30: Variable elasticity
31: Damper
32: O-ring
33: Air Tube
34: Spring Screw
100: Stacker
200: Loading module
210: Loader
212: Loading Loading Section
220: DC Test Section
230: Goods loading section
240: Bad loading area
250: Scan section
260: 1st transfer section
262: Transport rail
270: Second Transfer Section
280: Third Transfer Section
300: Board waiting area
400: Mounting Module
410: Pickup Unit
412: Real Picker
414: Field transport unit
420: Opener Unit
500: Test buffer section
600: Unloading module
700: Unloading buffer
800: 2nd floor module
810: 2nd Pickup Unit
812: 2nd floor picker
814: Third Room Transfer Unit
816: 4th floor transfer unit
820: 2nd opener unit
900: Selection Department
950: Unloader
952: Unloading Loading Section
960: Selective Transport Unit
962: Unloading Picker
964: Selective Transport Unit
1000: Test Handler
SD: semiconductor device
CT: Customer Tray
TB: Test Board
S: Coil compression spring
N: Nut

Claims (10)

A body formed long in the longitudinal direction so that it can be formed into an overall rectangular solid shape, and having a through slot portion that penetrates the upper and lower parts formed long in the longitudinal direction;
An opener portion formed along the through-slot portion on one side of the body and opening the latches of the sockets so that semiconductor devices can be mounted in the sockets of the test board; and
A variable elastic portion formed elastically between the body and the opener portion, the elastic force attenuating shock generated when the opener portion opens the latch, and the elastic force being variably adjustable;
An opener unit for a test board socket, comprising: In paragraph 1,
The above body,
An opener unit for a test board socket, wherein a mounting groove is formed on one surface on which the opener part is mounted so as to extend along the through slot portion so that at least a portion of the opener part can be formed in a form embedded in the interior of the body. In the second paragraph,
The above opener part,
An opener unit for a test board socket, wherein a plurality of openers are arranged in a row along the seating groove to guide the semiconductor device mounted in the socket while opening the latch of the socket so that at least a portion of the semiconductor device can be seated in the correct position of the socket. In the third paragraph,
The above variable elastic part is,
An opener unit for a test board socket, formed between the upper surface of each opener of the above opener section and the mounting surface of the above mounting groove section. In paragraph 4,
The above variable elastic part is,
A damper whose elastic force can be variably adjusted by hydraulic pressure of a fluid filled inside or pneumatic pressure of air;
An opener unit for a test board socket, comprising: In paragraph 4,
The above variable elastic part is,
An O-ring whose elasticity can be variably adjusted by hydraulic pressure of a fluid filled inside or pneumatic pressure of air;
An opener unit for a test board socket, comprising: In paragraph 4,
The above variable elastic part is,
An air tube whose elasticity can be variably adjusted by hydraulic pressure or pneumatic pressure control of the fluid filled inside;
An opener unit for a test board socket, comprising: In paragraph 4,
The above variable elastic part is,
A spring screw, the elastic force of which can be variably adjusted by adjusting the compression length of a coil compression spring inserted inside;
An opener unit for a test board socket, comprising: In the second paragraph,
The above body,
A cover plate that closes at least a portion of the open lower portion of the mounting groove to prevent the opener portion from being separated from the mounting groove with the lower portion open;
An opener unit for a test board socket, comprising: A loading module into which semiconductor devices are loaded;
A board waiting area in which at least one test board having multiple sockets formed thereon waits;
A mounting module that picks up the semiconductor devices between the test board waiting in the board waiting section and the loading module and mounts them in the sockets;
A test buffer section in which the test board is transferred from the above board waiting section and transferred between the test board and a test device for testing the performance of the semiconductor devices; and
An unloading module for unloading the test board on which the semiconductor devices for which the performance test has been completed are mounted from the test buffer section;
The above mounting module is,
A pickup unit that picks up the semiconductor devices between the loading module and the test board and mounts them in the sockets; and
The above pickup unit comprises an opener unit coupled to each socket to open the latches of the sockets when the semiconductor elements are mounted in the sockets, and guides the mounting position of each of the semiconductor elements;
The above opener unit,
A body formed long in the longitudinal direction so that it can be formed into an overall rectangular solid shape, and having a through slot portion that penetrates the upper and lower parts formed long in the longitudinal direction;
An opener portion formed along the through-slot portion on one side of the body and opening the latches of the sockets so that the semiconductor devices can be mounted in the sockets of the test board; and
A variable elastic portion formed elastically between the body and the opener portion, the elastic force attenuating shock generated when the opener portion opens the latch, and the elastic force being variably adjustable;
A test handler that contains .

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