KR20250089262A - Apparatus including balun circuit in wireless communication system - Google Patents

Abstract

The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate than a 4G communication system such as LTE. In the wireless communication system, an electronic device may include a radio frequency integrated circuit (RFIC), a front-end module (FEM) electrically connected to the RFIC, and at least one antenna. The FEM may include a differential power amplifier (PA) and a first balun circuit, and the first balun circuit may include a first coil and a second coil connected to the differential PA, and a third coil electromagnetically connected to each of the first coil and the second coil, and transmitting first RF signals received from the first coil and the second coil to the at least one antenna. The third coil may be electrically connected to ground.

Description

{APPARATUS INCLUDING BALUN CIRCUIT IN WIRELESS COMMUNICATION SYSTEM}

The present disclosure relates to a wireless communication system (or, mobile communication system). Specifically, the present disclosure relates to a device including a balun circuit in a wireless communication system.

Looking back at the development process over the generations of wireless communication, technologies have been developed primarily for human-targeted services such as voice, multimedia, and data. After the commercialization of the 5G (5th Generation) communication system, it is expected that connected devices, which are increasing explosively, will be connected to the communication network. Examples of objects connected to the network include vehicles, robots, drones, home appliances, displays, smart sensors installed in various infrastructures, construction equipment, and factory equipment. Mobile devices are expected to evolve into various form factors such as augmented reality glasses, virtual reality headsets, and holographic devices. In the 6G (6th Generation) era, efforts are being made to develop an improved 6G communication system in order to connect hundreds of billions of devices and objects and provide various services. For this reason, the 6G communication system is called a system beyond 5G.

The maximum transmission speed in the 6G communication system, which is expected to be realized around 2030, is tera (i.e., 1,000 giga) bps (bits per second), and the wireless delay time is 100 microseconds (μsec). In other words, the transmission speed in the 6G communication system is 50 times faster than that of the 5G communication system, and the wireless delay time is reduced to one-tenth.

To achieve such high data rates and ultra-low latency, 6G communication systems are being considered for implementation in the terahertz (THz) band (e.g., from 95 gigahertz (GHz) to 3 terahertz (THz) band). Compared to the millimeter wave (mmWave) band introduced in 5G, the terahertz band is expected to have more serious path loss and atmospheric absorption phenomena, and thus the importance of technologies that can guarantee signal reach, or coverage, is expected to increase. Key technologies to ensure coverage include RF (Radio Frequency) components, antennas, new waveforms that are better than OFDM (Orthogonal Frequency Division Multiplexing) in terms of coverage, beamforming, and multiple antenna transmission technologies such as massive Multiple-Input and Multiple-Output (MIMO), Full Dimensional MIMO (FD-MIMO), array antennas, and large scale antennas. In addition, new technologies such as metamaterial-based lenses and antennas, high-dimensional spatial multiplexing technology using Orbital Angular Momentum (OAM), and Reconfigurable Intelligent Surfaces (RIS) are being discussed to improve the coverage of terahertz band signals.

In addition, in order to improve frequency efficiency and system network, 6G communication systems are being developed with full duplex technology that utilizes the same frequency resources at the same time for uplink and downlink, network technology that comprehensively utilizes satellites and HAPS (High-Altitude Platform Stations), network structure innovation technology that supports mobile base stations and enables optimization and automation of network operation, dynamic spectrum sharing technology through collision avoidance based on spectrum usage prediction, AI-based communication technology that utilizes AI (Artificial Intelligence) from the design stage and internalizes end-to-end AI support functions to realize system optimization, and next-generation distributed computing technology that realizes services with complexity that exceeds the limits of terminal computing capabilities by utilizing ultra-high-performance communication and computing resources (Mobile Edge Computing (MEC), cloud, etc.). In addition, efforts are being made to further strengthen connectivity between devices, further optimize networks, promote softwareization of network entities, and increase the openness of wireless communications by designing new protocols to be used in 6G communication systems, implementing hardware-based security environments, developing mechanisms for safe use of data, and developing technologies for maintaining privacy.

These research and developments in 6G communication systems are expected to enable the next hyper-connected experience through the hyper-connectivity of 6G communication systems that include not only connections between things but also connections between people and things. Specifically, 6G communication systems are expected to enable the provision of services such as truly immersive eXtended Reality (XR), high-fidelity mobile holograms, and digital replicas. In addition, services such as remote surgery, industrial automation, and emergency response through enhanced security and reliability will be provided through 6G communication systems, which will be applied in various fields such as industry, medicine, automobiles, and home appliances.

As beamforming technology is introduced in 5G (or new radio (NR)), electronic devices must be able to transmit signals with a high peak to average power ratio (PAPR). To output a high PAPR at the designed resonant frequency while improving power consumption, electronic devices may include a differential power amplifier (PA).

Meanwhile, when the balun circuit for the differential PA is implemented with two transmission lines (e.g., Marchand balun), the transmission line must have a length of 1/4 wavelength of the designed resonant frequency, so the size of the balun circuit can be relatively large, and it can be difficult to place it in the FEM (front-end module) due to its size.

According to one embodiment, in a wireless communication system, an electronic device may include a radio frequency integrated circuit (RFIC), a front-end module (FEM) electrically connected to the RFIC, and at least one antenna. The FEM may include a differential power amplifier (PA) and a first balun circuit, and the first balun circuit may include a first coil and a second coil connected to the differential PA, and a third coil electromagnetically connected to each of the first coil and the second coil, and transmitting first RF signals received from the first coil and the second coil to the at least one antenna. The third coil may be electrically connected to ground.

According to one embodiment, in a wireless communication system, an electronic device may include a first printed circuit board, an RFIC disposed on the first printed circuit board, an FEM disposed on the first printed circuit board and electrically connected to the RFIC, and at least one antenna. The FEM may include a differential PA and a first balun circuit, and the first balun circuit may include a first coil and a second coil connected to the differential PA, and a third coil electromagnetically connected to each of the first coil and the second coil, and transmitting first RF signals received from the first coil and the second coil to the at least one antenna. The third coil may be electrically connected to ground.

In one embodiment, the electronic device can reduce or minimize the size of a balun circuit coupled to the differential PA.

According to one embodiment, the coupling coefficient of the balun can be improved.

According to one embodiment, loss of RF signals can be reduced or minimized through a balun circuit including a plurality of coils connected to a differential PA.

In one embodiment, power consumption of the differential PA can be improved.

In addition, various effects may be provided directly or indirectly through the present disclosure.

FIG. 1 illustrates a wireless communication system according to one embodiment of the present disclosure.
FIG. 2 illustrates exemplary configurations of an electronic device according to one embodiment.
FIG. 3 is a drawing illustrating an exemplary configuration of an electronic device according to one embodiment.
FIG. 4 is a diagram illustrating a differential PA and a first balun circuit according to one embodiment.
FIG. 5 is a drawing illustrating a first coil, a second coil, and a third coil included in a first balun circuit according to one embodiment.
FIG. 6 is a diagram for explaining the quality factor, inductance, turns ratio and coupling coefficient when including a first coil and a second coil according to one embodiment.
FIG. 7 is a diagram for comparing insertion loss in a case where a first balun circuit according to one embodiment includes a first coil and a second coil and in a case where it includes only a first coil.
FIG. 8 is a diagram illustrating a second balun circuit including a fourth coil, a fifth coil, and a sixth coil according to one embodiment.
FIG. 9 is a diagram illustrating a first balun circuit including a fourth coil according to one embodiment.
FIG. 10 is a diagram illustrating a first balun circuit including a first coil, a third coil, and a fourth coil according to one embodiment.
FIG. 11 is a diagram illustrating a first balun circuit including a first coil, a second coil, a third coil, and a fifth coil according to one embodiment.
FIG. 12 is a drawing illustrating a first balun circuit including a first wire according to one embodiment.
FIG. 13 is a diagram illustrating a first balun circuit including a sixth coil according to one embodiment.
FIG. 14 is a diagram illustrating a first balun circuit including a first coil, a third coil, a fourth coil, and a seventh coil according to one embodiment.
In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

Hereinafter, various embodiments of the present invention will be described with reference to the attached drawings. However, this is not intended to limit the present invention to specific embodiments, but should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of the present invention.

FIG. 1 illustrates a wireless communication system according to one embodiment of the present disclosure.

FIG. 1 illustrates a base station (110), a terminal (120), and a terminal (130) as some of the nodes that utilize a wireless channel in a wireless communication system. FIG. 1 illustrates only one base station, but other base stations identical to or similar to the base station (110) may be further included.

The base station (110) is a network infrastructure that provides wireless access to terminals (120, 130). The base station (110) has coverage defined as a certain geographical area based on the distance over which a signal can be transmitted. In addition to the base station, the base station (110) may be referred to as an 'access point (AP)', 'eNodeB (eNB)', '5th generation node', 'wireless point', 'transmission/reception point (TRP)' or other terms having equivalent technical meanings.

Each of the terminal (120) and the terminal (130) is a device used by a user and performs communication with the base station (110) via a wireless channel. In some cases, at least one of the terminal (120) and the terminal (130) may be operated without the involvement of the user. That is, at least one of the terminal (120) and the terminal (130) is a device that performs machine type communication (MTC) and may not be carried by the user. Each of the terminal (120) and the terminal (130) may be referred to as a terminal, or other terms having equivalent technical meanings, such as 'user equipment (UE),' 'mobile station,' 'subscriber station,' 'customer premises equipment (CPE),' 'remote terminal,' 'wireless terminal,' 'electronic device,' or 'user device.'

The base station (110), the terminal (120), and the terminal (130) can transmit and receive wireless signals in a millimeter wave (mmWave) band (e.g., 28 GHz, 30 GHz, 38 GHz, 60 GHz). At this time, in order to improve channel gain, the base station (110), the terminal (120), and the terminal (130) can perform beamforming. Here, the beamforming can include transmission beamforming and reception beamforming. That is, the base station (110), the terminal (120), and the terminal (130) can provide directionality to a transmission signal or a reception signal. To this end, the base station (110) and the terminals (120, 130) can select serving beams (112, 113, 121, 131) through a beam search or beam management procedure. After serving beams (112, 113, 121, 131) are selected, subsequent communication can be performed through resources that are in a QCL (quasi co-located) relationship with the resources that transmitted the serving beams (112, 113, 121, 131).

FIG. 2 illustrates exemplary configurations of an electronic device according to one embodiment.

Referring to FIG. 2, an exemplary functional configuration of an electronic device (210) according to one embodiment is illustrated. The electronic device (210) may include an antenna unit (211), a filter unit (212), an RF (radio frequency) processing unit (213), and/or a control unit (214).

According to one embodiment, the antenna unit (211) may include a plurality of antennas (or antenna elements). The antenna performs functions for transmitting and receiving signals through a wireless channel. The antenna may include a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). The antenna may radiate an up-converted signal on a wireless channel or acquire a signal radiated by another device. Each antenna may be referred to as an antenna element or an antenna element. In some embodiments, the antenna unit (211) may include an antenna array (e.g., a sub array) in which a plurality of antenna elements form an array. The antenna unit (211) may be electrically connected to the filter unit (212) through RF signal lines. The antenna unit (211) may be mounted on a PCB including a plurality of antenna elements. The PCB may include a plurality of RF signal lines connecting each antenna element and a filter of the filter unit (212). These RF signal lines may be referred to as a feeding network. The antenna unit (211) may provide a received signal to the filter unit (212) or may radiate a signal provided from the filter unit (212) into the air. An antenna having a structure according to an embodiment of the present disclosure may be included in the antenna unit (211).

The antenna unit (211) according to various embodiments may include at least one antenna module having a dual polarization antenna. The dual polarization antenna may be, for example, a cross-pole (x-pol) antenna. The dual polarization antenna may include two antenna elements corresponding to different polarizations. For example, the dual polarization antenna may include a first antenna element having a polarization of +45° and a second antenna element having a polarization of -45°. Of course, the polarization may be formed as other orthogonal polarizations other than +45° and -45°. Each antenna element may be connected to a feeding line and electrically connected to a filter unit (212), an RF processing unit (213), and a control unit (214) described below.

According to one embodiment, the dual polarization antenna may be a patch antenna (or a microstrip antenna). Since the dual polarization antenna has a form of a patch antenna, it may be easily implemented and integrated into an array antenna. Two signals having different polarizations may be input to each antenna port. Each antenna port corresponds to an antenna element. In order to achieve high efficiency, it is required to optimize the relationship between the co-pol characteristics and the cross-pol characteristics between the two signals having different polarizations. In the dual polarization antenna, the co-pol characteristics represent characteristics for a specific polarization component, and the cross-pol characteristics represent characteristics for a different polarization component from the specific polarization component.

An antenna (e.g., an antenna element, a sub array, an antenna array) of an antenna device including a separate PCB according to an embodiment of the present disclosure may be included in an antenna section (211). For example, a first conductive member or a first conductive member and a second conductive member of an antenna device according to an embodiment of the present disclosure may mean an antenna element and may be included in the antenna section (211) of FIG. 2.

The filter unit (212) can perform filtering to transmit a signal of a desired frequency. The filter unit (212) can perform a function to selectively identify a frequency by forming a resonance. In some embodiments, the filter unit (212) can form a resonance through a cavity that structurally includes a dielectric. In addition, in some embodiments, the filter unit (212) can form a resonance through elements that form inductance or capacitance. In addition, in some embodiments, the filter unit (212) can include an elastic filter such as a bulk acoustic wave (BAW) filter or a surface acoustic wave (SAW) filter. The filter unit (212) can include at least one of a band pass filter, a low pass filter, a high pass filter, or a band reject filter. That is, the filter unit (212) may include RF circuits for obtaining a signal of a frequency band for transmission or a frequency band for reception. The filter unit (212) according to various embodiments may electrically connect the antenna unit (211) and the RF processing unit (213).

The RF processing unit (213) may include a plurality of RF paths. The RF path may be a unit of a path through which a signal received through an antenna or a signal radiated through an antenna passes. At least one RF path may be referred to as an RF chain. The RF chain may include a plurality of RF components. The RF components may include an amplifier, a mixer, an oscillator, a DAC, an ADC, etc. For example, the RF processing unit (213) may include an up converter that up-converts a base band digital transmission signal to a transmission frequency, and a digital-to-analog converter (DAC) that converts the up-converted digital transmission signal to an analog RF transmission signal. The up converter and the DAC form a part of the transmission path. The transmission path may further include a power amplifier (PA) or a coupler (or combiner). Also, for example, the RF processing unit (213) may include an analog-to-digital converter (ADC) that converts an analog RF reception signal into a digital reception signal and a down converter that converts a digital reception signal into a baseband digital reception signal. The ADC and the down converter form part of a receiving path. The receiving path may further include a low-noise amplifier (LNA) or a coupler (or divider). The RF components of the RF processing unit may be implemented on a PCB. The antennas and the RF components of the RF processing unit may be implemented on the PCB, and filters may be repeatedly connected between the PCBs to form a plurality of layers.

The RFIC (radio frequency integrated circuit) and package board (PKG) of the antenna device including the separate PCB according to one embodiment of the present disclosure may be included in the RF processing unit (213) of FIG. 2. That is, the RF processing unit (213) may include an RFIC (radio frequency integrated circuit) as an RF component for mmWave. As described above in the present disclosure, the RFIC may be formed as an RFIC chip combined with a package board and coupled to the first PCB, or the RFIC may be directly coupled by the first PCB.

The control unit (214) can control the overall operations of the electronic device (210). The control unit (214) can include various modules for performing communication. The control unit (214) can include at least one processor, such as a modem. The control unit (214) can include modules for digital signal processing. For example, the control unit (214) can include a modem. When transmitting data, the control unit (214) generates complex symbols by encoding and modulating a transmission bit stream. In addition, for example, when receiving data, the control unit (214) restores a reception bit stream by demodulating and decoding a baseband signal. The control unit (214) can perform functions of a protocol stack required by a communication standard.

FIG. 3 is a drawing illustrating an exemplary configuration of an electronic device according to one embodiment.

Referring to FIG. 3, an electronic device (301) according to one embodiment may include at least one processor (310), at least one transceiver (320), and/or at least one antenna (330).

The electronic device (301) of the present disclosure may be at least one of the base station (110), the terminal (120), or the terminal (130) of FIG. 1.

In one embodiment, at least one processor (310) may include at least one communication processor. In one embodiment, at least one processor (310) may be electrically connected to at least one transceiver (320) and may generate or process a signal (e.g., a baseband signal).

For example, at least one processor (310) may transmit a signal (e.g., a baseband signal) to at least one transceiver (320) or receive a signal (e.g., a baseband signal) from at least one transceiver (320).

In one embodiment, at least one transceiver (320) can be electrically connected to at least one antenna (330). In one embodiment, at least one transceiver (320) can upconvert an intermediate (IF) signal transmitted from at least one processor (310) to a radio frequency (RF) signal and transmit the RF signal to at least one antenna (330).

As another example, at least one transceiver (320) can receive an RF signal from at least one antenna (330), down-convert the RF signal to an IF signal, and transmit the IF signal to at least one processor (310).

According to one embodiment, at least one transceiver (320) may include at least one transmitter and/or at least one receiver. For example, at least one transceiver (320) may include a first transceiver including a first transmitter and a first receiver, and at least one transceiver (320) may include a second transceiver including a first transmitter.

According to one embodiment, at least one transceiver (320) can process, transmit, and/or receive RF signals of different frequency bands. For example, the first transceiver and the second transceiver included in the at least one transceiver (320) can each process RF signals of a first frequency band.

For example, a first transceiver included in at least one transceiver (320) may process an RF signal of a first frequency band, and a second transceiver may process an RF signal of a second frequency band. In one example, the second frequency band may partially overlap with the first frequency band.

According to one embodiment, the at least one antenna (330) may include various types of antennas. For example, the at least one antenna (330) may include a patch antenna, a dipole antenna, a monopole antenna, a slit antenna, a laser direct structuring (LDS) antenna, and/or an inverted-F antenna (IFA).

For example, at least one antenna (330) may include an antenna for transmitting and/or receiving a signal in a mmWave frequency band. For example, at least one antenna (330) may include a plurality of antenna elements (e.g., a patch antenna), and the plurality of antenna elements may form an array. The plurality of antenna elements forming the array may transmit and/or receive a signal in a mmWave frequency band.

The term at least one processor (310) in the present disclosure may be replaced with another term referring to a configuration for data processing. For example, the term at least one processor may be replaced with a controller or a computing device.

In the present disclosure, at least one transceiver (320) may include a radio frequency integrated circuit (RFIC) and/or an intermediate frequency integrated circuit (IFIC). For example, although FIG. 3 illustrates that at least one transceiver (320) includes an RFIC and an IFIC, this is merely an example and at least one transceiver (320) may correspond to an RFIC. As another example, at least one transceiver (320) may correspond to an IFIC.

FIG. 4 is a diagram illustrating a differential PA and a first balun circuit according to one embodiment.

Referring to FIG. 4, an electronic device (301) according to one embodiment may include a CP (communication processor) (410), a conductive member (470), at least one transceiver (320), and/or at least one antenna (330).

According to one embodiment, at least one transceiver (320) may include an IFIC (420), an RFIC (430), and/or a front end module (FEM) (440).

In one embodiment, the CP (410) can be electrically connected to the IFIC (420) and/or the RFIC (430). For example, the CP (410) can be electrically connected to the IFIC (420) through the first conductive member (471), and the CP (410) can be electrically connected to the RFIC (430) through the second conductive member (472).

In one embodiment, the IFIC (420) and the RFIC (430) may be electrically connected through a third conductive member (473).

According to one embodiment, the CP (410) can generate BB (baseband) signals and transmit or forward the BB signals to at least one transceiver (320). The at least one transceiver (320) can upconvert the forwarded BB signals into RF signals.

For example, CP (410) may transmit BB signals to RFIC (430), and RFIC (430) may convert the BB signals into RF signals in a first frequency band (e.g., FR1 band). In one example, FR1 band may be referred to as a frequency band below 7.125 GHz.

For example, CP (410) can transmit BB signals to IFIC (420), and IFIC (420) can upconvert the BB signals to IF (intermediate frequency) signals. IFIC (420) can transmit IF signals to RFIC (430), and RFIC (430) can convert the transmitted IF signals to RF signals of a second frequency band (e.g., FR2 band). In one example, FR2 band can be referred to as a frequency band of 24.25 GHz or higher. As another example, CP (410) can transmit BB signals to IFIC (420), and IFIC (420) can upconvert the BB signals to IF signals. The IFIC (420) can transmit IF signals to the RFIC (430), and the RFIC (430) can convert the transmitted IF signals into RF signals of a third frequency band (e.g., FR3 band). In one example, the FR3 band can be referred to as a frequency band including 10 GHz.

According to one embodiment, the CP (410) may be included in at least one processor (310) of FIG. 3. For example, the at least one processor (310) may include an application processor (AP) and/or a communication processor (CP).

In one embodiment, the IFIC (420) and/or the RFIC (430) may include a mixer for frequency conversion. For example, the IFIC (420) may include at least one mixer for converting BB signals received from the CP (410). For example, the RFIC (430) may include mixers for converting BB signals received from the CP (410) into RF signals and/or mixers for converting IF signals received from the IFIC (420) into RF signals.

According to one embodiment, the conductive member (470) can include a first conductive member (471), a second conductive member (472), a third conductive member (473), a fourth conductive member (474), a fifth conductive member (475), a sixth conductive member (476), a seventh conductive member (477), an eighth conductive member (478), and/or a ninth conductive member (479). For example, the conductive member (470) can include a conductive line or a conductive via formed in a printed circuit board. For example, the conductive member (470) can include a coaxial cable, a C-clip, a pogo-pin, a flexible RF cable (FRC), and/or a flexible printed circuit board (FPCB).

In one embodiment, the FEM (440) may include a differential PA (450), a first balun circuit (460) connected to the differential PA (450), a switching circuit (490) and/or a low noise amplifier (LNA) (494). As another example, the FEM (440) may include at least one phase shifter.

In one embodiment, the first balun circuit (460) may include a first coil (461), a second coil (462), and/or a third coil (463). For example, the first coil (461) may be electrically connected to the differential PA (450) via a fifth conductive member (475). For example, the second coil (462) may be electrically connected to the differential PA (450) via a sixth conductive member (476). In one example, the first coil (461) and the second coil (462) may be coils for transmitting RF signals received from the differential PA (450) to the second coil (462).

For example, the third coil (463) can be electrically connected to at least one antenna (330) via a switch circuit (490). The third coil (463) can be electromagnetically connected to the first coil (461) and/or the second coil (462). In one example, the third coil (463) can be a coil that receives RF signals from the first coil (461) and the second coil (462). As another example, the third coil (463) can be coupled to the first coil (461) and/or the second coil (462).

According to one embodiment, the third coil (463) may be electrically connected to the first ground (464).

According to one embodiment, each of the first coil (461), the second coil (462), and the third coil (463) may be included in a layer of a substrate, a printed circuit board, and/or a flexible printed circuit board (FPCB). For example, the electronic device (301) may include a first printed circuit board, and the first printed circuit board may include a plurality of layers. The first coil (461) may be disposed in a first layer among the plurality of layers, the third coil (463) may be disposed in a second layer below the first layer, and the second coil (462) may be disposed in a third layer below the second layer.

According to one embodiment, the differential PA (450) may include a first PA (451), a second PA (452), and/or a second balun circuit (480). For example, the first PA (451) may amplify and output RF signals having a first phase. For example, the second PA (452) may amplify and output RF signals having a second phase different from the first phase. In one example, the RF signals having the first phase and the RF signals having the second phase output from the first PA (451) may be overlapped and combined.

For example, the second balun circuit (480) can be connected to the RFIC (430) through the fourth conductive member (474), and can transmit or transfer RF signals transmitted from the RFIC (430) to the first PA (451) and the second PA (452). For example, the second balun circuit (480) can convert a balanced signal received from the RFIC (430) into unbalanced signals, and can transmit the converted unbalanced signals to the differential PA (450). For example, the second balun circuit (480) can convert an RF signal (e.g., a balanced signal) having a first phase received from the RFIC (430) into an RF signal having a first phase (e.g., about 180 degrees) and an RF signal having a second phase (e.g., about 0 degrees). The second balun circuit (480) can transmit an RF signal having a first phase to the first PA (451) and can transmit an RF signal having a second phase to the second PA (452).

For example, the second balun circuit (480) may include a fourth coil (484) and/or a fifth coil (485). The fourth coil (484) may be electrically connected to the RFIC (430) via the fourth conductive member (474) and may be electrically connected to the second ground (486). The fifth coil (485) may be electrically connected to the first PA (451) and the second PA (452). In one example, the fourth coil (484) may be electromagnetically connected to the fifth coil (485), and the fourth coil (484) may transmit an RF signal received from the RFIC (430) to the fifth coil (485). The fifth coil (485) can convert the received RF signal into an RF signal having a first phase and an RF signal having a second phase, respectively, and input the RF signal having the first phase into the first PA (451) and input the RF signal having the second phase into the second PA (452).

For example, the second phase may differ from the first phase by about 180 degrees. As another example, the second phase may differ from the first phase by about 90 degrees.

According to one embodiment, the switch circuit (490) can be electrically connected to the first balun circuit (460), the LNA (494), and/or the at least one antenna (330). For example, the switch circuit (490) can control the at least one antenna (330) to be selectively connected to the first balun circuit (460) or the LNA (494). For example, the switch circuit (490) can control the at least one antenna (330) to be selectively connected to the first balun circuit (460) or the LNA (494) through control of the RFIC (430) and/or the CP (410). For example, the switch circuit (490) can control at least one antenna (330) to be selectively connected to a transmit path (e.g., a path including a differential PA (450) and a first balun circuit (460)) or a receive path (e.g., a path including an LNA (494)) within the transceiver (320).

For example, the switch circuit (490) may include a first terminal (491), a second terminal (492), and/or a third terminal (493). The first terminal (491) may be electrically connected to a third coil (463) of the first balun circuit (460), and the second terminal (492) may be electrically connected to an LNA (494). The third terminal (493) may be electrically connected to at least one antenna (330). In one example, the switch circuit (490) may electrically connect the third terminal (493) to the first terminal (491) or to the second terminal (492), and may electrically connect at least one antenna (330) to the first balun circuit (460) or to the LNA (494).

For example, the switch circuit (490) can be electrically connected to at least one antenna (330) through the seventh conductive member (477) and can be electrically connected to the LNA (494) through the eighth conductive member (478).

For example, the switch circuit (490) may be a single pole double through (SPDT) switch. However, the type of the switch circuit (490) is not limited thereto, and the switch circuit (490) may correspond to various types of switches. For example, the electronic device (301) may include PAs and/or LNAs distinct from the differential PA (450) and LNA (494) within the transceiver (320), and the switch circuit (490) may be electrically connected to the PAs and/or LNAs.

According to one embodiment, the LNA (494) can amplify RF signals received from at least one antenna (330) and transmit or forward the amplified RF signals to the RFIC (430). For example, the LNA (494) can be electrically connected to the at least one antenna (330) through the switch circuit (490) and the eighth conductive member (478), and can receive RF signals from the at least one antenna (330). For example, the LNA (494) can be electrically connected to the RFIC (430) through the ninth conductive member (479), and can transmit the amplified RF signals to the RFIC (430) through the ninth conductive member (479).

According to one embodiment, the first balun circuit (460) can reduce or minimize signal loss by transmitting RF signals to the third coil (463) using the first coil (461) and the second coil (462).

For example, the first coil (461) can be electrically connected to the first PA (451) through the fifth conductive member (475) and can be electrically connected to the second PA (452) through the sixth conductive member (476). The second coil (462) can be electrically connected to the first node (466) of the fifth conductive member (475) and can be electrically connected to the first PA (451) through the fifth conductive member (475). The second coil (462) can be electrically connected to the second node (467) of the sixth conductive member (476) and can be electrically connected to the second PA (452) through the sixth conductive member (476).

In this case, the first coil (461) and the second coil (462) can each receive RF signals having a first phase from the first PA (451). When RF signals (e.g., AC (alternate current)) having substantially the same phase are applied to the first coil (461) and the second coil (462), magnetic fields can be formed in substantially the same direction in the first coil (461) and the second coil (462).

Since magnetic fields are formed in substantially the same direction in each of the first coil (461) and the second coil (462), a relatively strong current can be formed in the third coil (463) compared to the case where one of the first coil (461) and the second coil (462) is not present, and as a result, the third coil (463) can receive the first RF signal from the first coil (461) and the second coil (462) while reducing signal loss.

According to one embodiment, the electronic device (301) can minimize or reduce loss of RF signals transmitted from the differential PA (450) to at least one antenna (330) by including a first balun circuit (460) including a first coil (461) and a second coil (462). For example, when the first balun circuit (460) includes only one of the first coil (461) and the second coil (462), a relatively weak AC current can be formed in the third coil (463) since the strength of the first magnetic field formed by the first coil (461) is relatively small. On the other hand, when the first balun circuit (460) according to one embodiment includes a first coil (461) and a second coil (462), and the first coil (461) and the second coil (462) receive RF signals having substantially the same phase from the differential PA (450), the first magnetic field by the first coil (461) and the second magnetic field by the second coil (462) may be relatively strong. Accordingly, a relatively strong AC current may be formed in the third coil (463), and the loss of the RF signal may be reduced or minimized.

[Table 1] shows the power loss due to the signal loss occurring in the first balun circuit (460) connected to the differential PA, the power value at the antenna (e.g., Pin,a) compared to the input power, the power loss in the MMU (massive multi-input multi-output unit) in the case of 512 channels, and the power loss value in the MMU in the case of 1024 channels.

Signal loss (or balun loss) Power loss (%) Pin,a(mW) MMU power loss (512 channels) MMU power loss (1024 channels) 0.1 dB 2.3 977 11.78 W 23.55 W 0.2 dB 4.5 955 23.04 W 46.08 W 0.3 dB 6.7 933 34.30 W 68.61 W 0.4 dB 8.8 912 45.06 W 90.11 W 0.5 dB 10.9 891 55.81 W 111.62 W

Referring to [Table 1], it is confirmed that when the loss in the first balun circuit (460) is reduced by 0.1 dB, the power loss is reduced by about 2.3%. In addition, when the loss in the first balun circuit (460) is reduced by 0.1 dB, it is confirmed that when designing an MMU having a channel number of 512 or 1024, the power loss is reduced by about 11.78 W and 23.55 W, respectively.

As a result, it is confirmed that the electronic device (301) can reduce or prevent a significant amount of power loss by including the first balun circuit (460) with the first coil (461) and the second coil (462).

According to one embodiment, the RFIC (430) and the FEM (440) may be disposed on the same printed circuit board or on different printed circuit boards. For example, the electronic device (301) may include a first printed circuit board and a second printed circuit board. The CP (410), the IFIC (420), and the RFIC (430) may be disposed on the first printed circuit board, and the FEM (440) may be disposed on the second printed circuit board. In this case, the RFIC (430) on the first printed circuit board and the FEM (440) on the second printed circuit board may be electrically connected via a fourth conductive member (e.g., a coaxial cable, an FPCB, or a flexible RF cable (FRC)). As another example, the electronic device (301) may include a first printed circuit board, and a CP (410), an IFIC (420), an RFIC (430), and an FEM (440) may be arranged on the first printed circuit board. In this case, the RFIC (430) and the FEM (440) may be electrically connected through a fourth conductive member (e.g., a conductive line formed on the first printed circuit board).

According to one embodiment, the first coil (461), the second coil (462) and/or the third coil (463) may include inductors, and the first coil (461), the second coil (462) and/or the third coil (463) may be elements for impedance matching.

According to one embodiment, a first balun circuit (480) including a plurality of coils (e.g., a first coil (461), a second coil (462), and a third coil (463)) can be applied to various communication schemes. For example, the first balun circuit (480) can be applied to long-term evolution (LTE), new radio (NR) (or, 5G) and/or 6G communication schemes.

For example, the 6G communication of the present disclosure may be performed in an Upper Mid-band band from about 7 GHz to about 24 GHz and/or a Terahertz (THz) band (e.g., a band from 95 Gigahertz (GHz) to 3 Terahertz (3 THz)). However, the numerical limitation on the frequency range of the 6G communication is only an example and the present disclosure is not limited thereto.

Although the differential PA (450) is described in the present disclosure as including a first PA (451), a second PA (452), and a second balun circuit (480), this is only an example. For example, the differential PA (450) may include only the first PA (451) and the second PA (452), and the second balun circuit (480) may have a configuration distinct from the differential PA (450).

In this disclosure, RFIC (430) and FEM (440) are described as separate configurations, but this is only an example. For example, RFIC (430) may also be described as a concept including FEM (440). In this case, it may be described that RF signals are transmitted from a mixer included in RFIC (430) to FEM (440).

Although the present disclosure describes the FEM (440) as including the switch circuit (490), this is only an example. For example, the FEM (440) may not include the switch circuit (490), and the switch circuit (490) may be a distinct configuration from the FEM (440). As another example, the FEM (440) may not include the switch circuit (490), and the FEM (440) may be electrically connected directly to at least one antenna (330) without going through the switch circuit (490).

The term balun circuit in the present disclosure may be replaced with the term balun module, balun transformer, transformer circuit, circuit for converting an unbalanced AC signal into a balanced AC signal, circuit for converting a balanced AC signal into an unbalanced AC signal, or circuit for changing a single-ended signal into a differential signal. As another example, the term balun circuit may be replaced with the term circuit including coils, or circuit including inductors for impedance matching.

The term coil in the present disclosure may be replaced with the terms spiral inductor, inductor, or lumped element. For example, the first coil (461) may be referred to as a first spiral inductor. For example, the first coil (461) may be referred to as a first inductor.

The term PA in the present disclosure may be replaced with the term PAM (power amplifier module) or PA circuit.

The term conductive member in the present disclosure may be replaced with the terms conductive line, conductive path, and conductive connecting member. In addition, the first conductive member (471) to the eighth conductive member (478) may be a conductive line or a conductive via implemented on a printed circuit board, and may be a flexible printed circuit board (FPCB), a C-clip, a pogo-pin, and/or a flexible RF cable (FRC).

FIG. 5 is a drawing illustrating a first coil, a second coil, and a third coil included in a first balun circuit according to one embodiment.

Referring to FIG. 5, a first balun circuit (460) according to an embodiment may include a first coil (461), a second coil (462), and/or a third coil (463). For example, the third coil (463) may be positioned between the first coil (461) and the second coil (462). For example, the first coil (461) may be positioned in a first direction (e.g., +z direction) with respect to the third coil (463), and the third coil (463) may be positioned in a first direction (e.g., +z direction) with respect to the second coil (462). For example, the second coil (462), the third coil (463), and the first coil (461) may be sequentially stacked from below.

In one embodiment, the first coil (461) may include a first portion (511) including a first end (501) and a second portion (512) including a second end (502). For example, the first portion (511) of the first coil (461) may be electrically connected to a first PA (451), and the second portion (512) of the first coil (461) may be electrically connected to a second PA (452). For example, the first portion (511) and the second portion (512) of the first coil (461) may be electrically connected via a third connecting member (523). For another example, the first portion (511) and the second portion (512) may be electrically connected via a third connecting member (523) and a fourth connecting member (524).

According to one embodiment, the second coil (462) may include a third portion (513) including a third end (503) and a fourth portion (514) including a fourth end (504). For example, the third portion (513) of the second coil (462) may be electrically connected to the first PA (451), and the fourth portion (514) of the second coil (462) may be electrically connected to the second PA (452). The third portion (513) and the fourth portion (514) of the second coil (462) may be electrically connected via a fourth connecting member (524).

In one embodiment, the second coil (462) can be electrically connected to the first coil (461). For example, the third end (503) of the second coil (462) can be electrically connected to the first end (501) of the first coil (461) via the first connecting member (521). The fourth end (504) of the second coil (462) can be electrically connected to the second end (502) of the first coil (461) via the second connecting member (522).

In one embodiment, the second coil (462) may receive RF signals received from the differential PA (450) as the second coil (462) is electrically connected to the first coil (461). For example, the second coil (462) may be electrically connected to the first coil (461) and may receive RF signals having a first phase from the first PA (451). For example, the second coil (462) may be electrically connected to the first coil (461) and may receive RF signals having a second phase from the second PA (452).

In one embodiment, the third coil (463) may include a fifth end (505) and a sixth end (506). For example, the fifth end (505) of the third coil (463) may be electrically connected to the first ground (464). For example, the sixth end (506) of the third coil (463) may be electrically connected to at least one antenna (330). In one example, the sixth end (506) of the third coil (463) may be electrically connected to at least one antenna (330) via a switch circuit (490), or may be electrically connected to at least one antenna (330) without the switch circuit (490).

According to one embodiment, the first coil (461), the second coil (462) and the third coil (463) may have a spiral shape.

In one embodiment, the second coil (462) can be formed along the first coil (461). For example, the third portion (513) of the second coil (462) can be formed along the first portion (511) of the first coil (461), and the fourth portion (514) of the second coil (462) can be formed along the second portion (512) of the first coil (461). For example, the third portion (513) can be formed to correspond to the first portion (511), and the fourth portion (514) can be formed to correspond to the second portion (512). For example, the third portion (513) can overlap the first portion (511) when viewed in a first direction (e.g., the +z direction), and the fourth portion (514) can overlap the second portion (512) when viewed in the first direction. For another example, the first coil (461) and the second coil (462) may have substantially the same shape.

In one embodiment, the first coil (461) and the second coil (462) can have substantially the same electrical length. For example, the first coil (461) and the second coil (462) can have substantially the same physical length, and consequently can have substantially the same electrical length. For another example, the first coil (461) and the second coil (462) can have substantially the same electrical length even though the physical lengths are different.

According to one embodiment, the third coil (463) can be formed along the first coil (461) and/or the second coil (462). For example, the third coil (463) can be formed to correspond to the first coil (461). For example, the third coil (463) can be formed to correspond to the second coil (462). For example, the third coil (463) can overlap at least a portion of the first coil (461) when viewed in a first direction. For example, the third coil (463) can overlap at least a portion of the second coil (462) when viewed in the first direction.

According to one embodiment, the differential PA (350) can apply RF signals having a first phase to the first coil (461), and the RF signals applied to the first coil (461) can be transmitted along the first portion (511) and the second portion (512) of the first coil (461). For example, the first PA (451) can transmit first signals of the first phase to the first end (501) of the first coil (461), and the first AC current (531) corresponding to the first signals transmitted to the first end (501) of the first coil (461) can flow in a clockwise direction. That is, the first AC current (531) corresponding to the first signals can flow from the first end (501) to the second end (502). In one example, the clockwise direction may be the reference when looking at the first coil (461) in a second direction (e.g., the -z direction).

According to one embodiment, the differential PA (350) can apply RF signals having a first phase to the second coil (462), and the second RF signals applied to the second coil (462) can be transmitted along the third portion (513) and the fourth portion (514) of the second coil (462). For example, the first PA (451) can transmit second signals of the first phase to the third end (503) of the first coil (461), and the second AC current (532) corresponding to the second signals transmitted to the third end (503) of the second coil (462) can flow in a clockwise direction. That is, the second AC current (532) corresponding to the second signals can flow from the third end (503) to the fourth end (504). In one example, the clockwise direction may be the reference when looking at the first coil (461) in a second direction (e.g., the -z direction).

According to one embodiment, a first AC current (531) may flow in a clockwise direction through the first coil (461), and a second AC current (532) may flow in a clockwise direction through the second coil (462). That is, the first AC current (531) and the second AC current (532) may flow in substantially the same direction (e.g., clockwise when viewed in the -z direction) through the first coil (461) and the second coil (462), respectively.

According to one embodiment, a first magnetic field (541) may be formed based on a first AC current (531), and a second magnetic field (542) may be formed based on a second AC current (532). For example, since the directions in which the first AC current (531) and the second AC current (532) flow are substantially the same, the directions of the first magnetic field (541) and the second magnetic field (542) may also be substantially the same. For example, the first magnetic field (541) may be formed as a magnetic field in a second direction (e.g., -z direction) based on the first center (591) of the first coil (461). For example, the second magnetic field (542) may be formed as a magnetic field in a second direction (e.g., -z direction) based on the second center (592) of the second coil (462).

According to one embodiment, since the first magnetic field (541) and the second magnetic field (542) are formed in substantially the same direction, the first magnetic field (541) and the second magnetic field (542) may overlap with respect to the third coil (543). Accordingly, the third coil (463) may receive relatively many first RF signals. That is, since the first magnetic field (541) and the second magnetic field (542) act to overlap with respect to the third coil (543), a relatively high induced current (533) may be formed in the third coil (463).

For example, when both the first coil (461) and the second coil (462) are present, the third coil (463) can receive a relatively high-strength magnetic force compared to when one of the first coil (461) and the second coil (462) is omitted. As a high-strength magnetic force is applied to the third coil (463), the strength of the induced current (533) formed in the third coil (463) based on the magnetic force can be applied. As a result, when both the first coil (461) and the second coil (462) are present, a relatively strong induced current (533) can be formed in the third coil (463) compared to when one of the first coil (461) and the second coil (462) is omitted.

Since the induced current (533) substantially corresponds to the first RF signal formed in the third coil (463), the third coil (463) can receive the first RF signals from the first coil (461) and the second coil (462) with relatively low loss due to the presence of both the first coil (461) and the second coil (462).

As a result, the electronic device (301) can transmit RF signals from the differential PA (350) to at least one antenna (330) while reducing or minimizing loss of RF signals output from the differential PA (350).

According to one embodiment, each of the coils included in the first balun circuit (460) may be included in a layer of the first printed circuit board (550). For example, the electronic device (301) may include the first printed circuit board (550), and the FEM (440) may be disposed on the first printed circuit board (550). In this case, the first printed circuit board (550) may include a plurality of non-conductive layers, and the first coil (461) of the first balun circuit (460) may be disposed within a first layer (L1) of the plurality of non-conductive layers. The third coil (463) of the first balun circuit (460) may be disposed within a second layer (L2) of the plurality of non-conductive layers, and the second coil (462) may be disposed within a third layer (L3) of the plurality of non-conductive layers. In one example, a first layer (L1) may be positioned in a first direction (e.g., +z direction) of a second layer (L2), a second layer (L2) may be positioned in a first direction (e.g., +z direction) of a third layer (L3), and a third layer (L3) may be positioned in a first direction (e.g., +z direction) of a fourth layer (L4).

According to one embodiment, other configurations may be arranged within the plurality of non-conductive layers of the first printed circuit board (550) together with the plurality of coils. For example, a fifth conductive member (475) (e.g., a conductive line or via) may be arranged in the first layer (L1) to electrically connect the first coil (461) and the first PA (451). A sixth conductive member (476) (e.g., a conductive line or via) may be arranged in the first layer (L1) to electrically connect the first coil (461) and the second PA (452). For example, a first connection member (521), a second connection member (522), and/or a third connection member (523) may be arranged in the second layer (L2) together with a third coil (463). For example, a fifth connecting member (525) may be placed together with a second coil (462) in the third layer (L3).

Additionally, a fourth connecting member (524) may be placed in the fourth layer (L4).

In one embodiment, the size of the coils, the turn trace width, the turn spacing and/or the angle of the fourth connecting member (524) can be determined such that the first connecting member (521), the second connecting member (522) and/or the third connecting member (523) do not contact the coils. For example, the first connecting member (521), the second connecting member (522) and/or the third connecting member (523) can be conductive vias.

In the present disclosure, each of the first coil (461) and the second coil (462) may be referred to as a primary coil that transmits RF signals output from the differential PA (450). The third coil (463) may be referred to as a secondary coil that receives RF signals transmitted from the first coil (461) and the second coil (462). For example, the first coil (461) may be a first primary coil, the second coil (462) may be a second primary coil, and the third coil (463) may be a secondary coil.

In FIG. 5 of the present disclosure, the RF signals output from the first PA (451) have been described as reference, but this is only an example. The second PA (452) may also be electrically connected to the first coil (461) and the second coil (462) to transmit RF signals having a second phase to each of the first coil (461) and the second coil (462). In this case, the RF signals having the second phase may be overlapped with the RF signals having the first phase. Since the second phase and the first phase are based on the time when they are output from the first PA (451) and the second PA (452), the RF signals having the first phase and the RF signals having the second phase may be overlapped and combined in the first coil (461) and the second coil (462).

FIG. 6 is a diagram for explaining the quality factor, inductance, turns ratio and coupling coefficient when including a first coil and a second coil according to one embodiment.

Referring to FIG. 6, Q value graphs (600) of the first coil (461) according to one embodiment may include a first graph (601) and a second graph (602). The first graph (601) is a graph showing the Q value of the first coil (461) according to frequency in the case where the first balun circuit (460) includes the first coil (461) and the second coil (462). The second graph (602) is a graph showing the Q value of the first coil (461) according to frequency in the case where the first balun circuit (460) includes only the first coil (461).

According to one embodiment, [Mathematical Formula 1] is an equation for Q, which is a quality factor.

[Mathematical Formula 1]

Q = (reactance)/(resistance value)

Comparing the first graph (601) and the second graph (602), substantially the same Q value is shown in both the case where the first balun circuit (460) includes the first coil (461) and the second coil (462) and the case where the first balun circuit (460) includes only the first coil (461). That is, it is confirmed that no performance degradation of the first coil (461) occurs even when the first balun circuit (460) includes the first coil (461) and the second coil (462).

According to one embodiment, the L value graphs (610) of the first coil (461) may include a third graph (613) and a fourth graph (614). The third graph (613) is a graph showing an inductance value of the first coil (461) according to frequency when the first balun circuit (460) includes the first coil (461) and the second coil (462). The fourth graph (614) is a graph showing an inductance value of the first coil (461) according to frequency when the first balun circuit (460) includes only the first coil (461).

Comparing the third graph (613) and the fourth graph (614), substantially the same inductance values are shown in both the case where the first balun circuit (460) includes the first coil (461) and the second coil (462) and the case where the first balun circuit (460) includes only the first coil (461). That is, it is confirmed that no performance degradation of the first coil (461) occurs even when the first balun circuit (460) includes the first coil (461) and the second coil (462).

According to one embodiment, the turn ratio graphs (620) may include a fifth graph (625) and a sixth graph (626). The fifth graph (625) is a graph that plots the turns ratio, which is the ratio of the number of turns of the inductor around the third coil (463) to the number of turns of the inductor around both the first coil (461) and the second coil (462), as a function of frequency. The sixth graph (626) is a graph that plots the turns ratio, which is the ratio of the number of turns of the inductor around the third coil (463) to the number of turns of the inductor around the first coil (461), as a function of frequency.

Comparing the fifth graph (625) and the sixth graph (626), it is confirmed that the fifth graph (625) shows a relatively higher turn ratio value with respect to the sixth graph (626).

According to one embodiment, the Q value graphs (630) of the third coil (463) may include a seventh graph (637) and an eighth graph (638). The seventh graph (637) is a graph showing the Q value of the third coil (463) according to frequency in the case where the first balun circuit (460) includes the first coil (461) and the second coil (462). The eighth graph (638) is a graph showing the Q value of the third coil (463) according to frequency in the case where the first balun circuit (460) includes only the first coil (461).

Comparing the seventh graph (637) and the eighth graph (638), substantially the same Q value is shown in both the case where the first balun circuit (460) includes the first coil (461) and the second coil (462) and the case where the first balun circuit (460) includes only the first coil (461). That is, it is confirmed that no performance degradation of the third coil (463) occurs even when the first balun circuit (460) includes the first coil (461) and the second coil (462).

According to one embodiment, the L value graphs (640) of the third coil (463) may include a ninth graph (639) and a tenth graph (660). The ninth graph (639) is a graph showing an inductance value of the third coil (463) according to frequency when the first balun circuit (460) includes the first coil (461) and the second coil (462). The tenth graph (660) is a graph showing an inductance value of the third coil (463) according to frequency when the first balun circuit (460) includes only the first coil (461).

Comparing the 9th graph (639) and the 10th graph (660), substantially the same inductance values are shown in both the case where the first balun circuit (460) includes the first coil (461) and the second coil (462) and the case where the first balun circuit (460) includes only the first coil (461). That is, it is confirmed that no performance degradation of the third coil (463) occurs even when the first balun circuit (460) includes the first coil (461) and the second coil (462).

According to one embodiment, the coupling coefficient graphs (650) may include an eleventh graph (651) and a twelfth graph (652). The eleventh graph (651) is a graph showing a coupling coefficient between the first coil (461), the second coil (462), and the third coil (463) according to frequency when the first balun circuit (460) includes the first coil (461) and the second coil (462). The twelfth graph (652) is a graph showing a coupling coefficient between the first coil (461) and the third coil (463) according to frequency when the first balun circuit (460) includes only the first coil (461).

Comparing the 11th graph (651) and the 12th graph (652), the 11th graph (651) shows a relatively higher coupling coefficient value than the 12th graph (652). Therefore, it is confirmed that the electro-mechanical coupling between the coils is relatively better when the first balun circuit (460) includes the first coil (461) and the second coil (462) than when the first balun circuit (460) includes only one coil (e.g., the first coil (461)).

As a result, since the first balun circuit (460) includes the first coil (461) and the second coil (462), the electronic device (301) can reduce or minimize the loss of RF signals transmitted from the first coil (461) and the second coil (462) to the third coil (463).

FIG. 7 is a diagram for comparing insertion loss (IL) in a case where a first balun circuit according to one embodiment includes a first coil and a second coil and in a case where it includes only a first coil.

Referring to FIG. 7, a first graph (711) according to one embodiment is a graph showing insertion loss according to frequency when the first balun circuit (460) includes only the first coil (461). A second graph (712) is a graph showing insertion loss according to frequency when the first balun circuit (460) includes the first coil (461) and the second coil (462).

Comparing the first graph (711) and the second graph (712), the second graph (712) shows a relatively lower insertion loss value in the frequency band of about 699 to about 915 MHz than the first graph (711). For example, at a frequency of about 799 MHz, the first graph (711) shows an insertion loss value of about 0.52 dB, while the second graph (712) shows an insertion loss value of about 0.39 dB.

As a result, the electronic device (301) can reduce insertion loss by about 0.13 dB compared to the case where the first balun circuit (460) includes only the first coil (461) since it includes both the first coil (461) and the second coil (462). Accordingly, the electronic device (301) can transmit the amplified RF signal to at least one antenna (330) while reducing the loss of the RF signal amplified by the differential PA (450). For example, the electronic device (301) can secure power saving of about 2.95%.

[Table 2] describes the Q values, coupling coefficient (K), insertion loss (IL), and/or FoM values at about 799 MHz for case 1 where the first balun circuit (460) includes only the first coil (461) and case 2 where the first balun circuit (460) includes the first coil (461) and the second coil (462), respectively. For example, Qpri is the Q value of the first coil (461), Qsec is the Q value of the third coil (463), and FoM can be Qpri x Qsec x K. The size can be the size of the first balun circuit (460).

Qpri Qsec K IL (dB) FoM Size Case 1 23.9 30.6 0.79 0.52 456.4 1330x1347 um^2 Case 2 27.7 22.1 0.84 0.39 431.9 1330x1347 um^2

Referring to [Table 2], it is confirmed that the electronic device (301) can secure a relatively high coupling coefficient value and a relatively low insertion loss value in case 2 compared to case 1. That is, the electronic device (301) can secure an improved coupling coefficient and insertion loss value under the same size of the first balun circuit (460) (e.g., 1330x1347 um^2).

FIG. 8 is a diagram illustrating a second balun circuit including a fourth coil, a fifth coil, and a sixth coil according to one embodiment.

Referring to FIG. 8, a second balun circuit (810) according to an embodiment may include a fourth coil (814), a fifth coil (815), and a sixth coil (816). For example, the second balun circuit (810) may include a fourth coil (814) connected to an RFIC (430). For example, the second balun circuit (810) may include a fifth coil (815) and a sixth coil (816) electromagnetically connected to the fourth coil (814) and transmitting RF signals received from the fourth coil (814) to a first PA (451) and a second PA (452) of a differential PA (450).

In the embodiment of FIG. 8 of the present disclosure, the second balun circuit (480) of the embodiment of FIG. 4 may be replaced with a second balun circuit (810). For example, the second balun circuit (480) of FIG. 4 may include a fourth coil (484) and a fifth coil (485), whereas the second balun circuit (810) of FIG. 8 may include a fourth coil (814), a fifth coil (815), and a sixth coil (816).

According to one embodiment, the fourth coil (814) may be electrically connected to the RFIC (430) and the second ground (486). For example, one end of the fourth coil (814) may be electrically connected to the RFIC (430) through the fourth conductive member (474), and the other end of the fourth coil (814) may be electrically connected to the second ground (486).

According to one embodiment, the fifth coil (815) can be electrically connected to the first PA (451) via the tenth conductive member (821), and the fifth coil (815) can be electrically connected to the second PA (452) via the eleventh conductive member (822).

In one embodiment, the sixth coil (816) can be electrically connected to the third node (833) of the tenth conductive member (821), and as the sixth coil (816) is connected to the third node (833), the sixth coil (816) can be electrically connected to the first PA (451) through the tenth conductive member (821). The sixth coil (816) can be electrically connected to the fourth node (834) of the eleventh conductive member (822), and the sixth coil (816) can be electrically connected to the second PA (452) through the eleventh conductive member (822).

In one embodiment, the RFIC (430) can transmit third RF signals to the fourth coil (814). For example, the RFIC (430) can transmit the third RF signals to the fourth coil (814) via the fourth conductive member (474).

According to one embodiment, the fifth coil (815) and the sixth coil (816) may receive third RF signals from the fourth coil (814). For example, currents corresponding to the third RF signals may flow in the fourth coil (814). In this case, a fourth magnetic field may be formed based on the currents corresponding to the third RF signals. An induced current may be formed in each of the fifth coil (815) and the sixth coil (816) based on the fourth magnetic field. For example, a first induced current (e.g., AC) may be formed in the fifth coil (815) based on the fourth magnetic field, and a second induced current (e.g., AC) may be formed in the sixth coil (816) based on the fourth magnetic field. The first induced current and the second induced current may substantially correspond to the third RF signals.

According to one embodiment, since the second balun circuit (810) includes the fifth coil (815) and the sixth coil (816), the third RF signals can be transmitted from the RFIC (430) to the differential PA (450) with relatively low loss. For example, when the second balun circuit (810) includes only the fifth coil (815), an induced current is formed only in the fifth coil (815), whereas when the second balun circuit (810) includes the fifth coil (815) and the sixth coil (816), a first induced current and a second induced current can be formed in the fifth coil (815) and the sixth coil (816), respectively. As a result, when the second balun circuit (810) includes the fifth coil (815) and the sixth coil (816), third RF signals having relatively strong intensities can be formed in the fifth coil (815) and the sixth coil (816).

In FIG. 8 of the present disclosure, the fourth coil (814), the fifth coil (815), and the sixth coil (816) of the second balun circuit (810) may correspond to the first coil (461), the fourth coil (910), and the third coil (463) of FIG. 10, which will be described in order. However, this is only an example, and the present disclosure is not limited thereto.

FIG. 9 is a diagram illustrating a first balun circuit including a fourth coil according to one embodiment.

Referring to FIG. 9, a first balun circuit (460) according to one embodiment may include a first coil (461), a second coil (462), a third coil (463), and/or a fourth coil (910).

In the embodiment of FIG. 9 of the present disclosure, compared to the embodiment of FIG. 4, the first balun circuit (460) may further include a fourth coil (910).

According to one embodiment, the fourth coil (910) may be positioned in a first direction (e.g., +z direction) with respect to the first coil (461). For example, the first coil (461) may be placed between the fourth coil (910) and the third coil (463). For example, the second coil (462), the third coil (463), the first coil (461), and the fourth coil (910) may be stacked in that order from the bottom. In one example, the first direction (e.g., +z direction) may be a direction from the third coil (463) toward the first coil (461). In one example, the first direction (e.g., +z direction) may be a direction perpendicular to a layer in which the first coil (461) is placed.

According to one embodiment, the fourth coil (910) may be formed to correspond to the third coil (463). For example, the fourth coil (910) may have substantially the same shape as the third coil (463). For example, the fourth coil (910) may at least partially overlap the third coil (463) when viewed in a first direction (e.g., +z direction).

According to one embodiment, the fourth coil (910) may be placed in a fifth layer (L0) among the plurality of non-conductive layers. For example, the fifth layer (L0) may be a layer positioned in a first direction (e.g., +z direction) with respect to the first layer (L1).

According to one embodiment, the fourth coil (910) may include a seventh end (911) and an eighth end (912). The seventh end (911) of the fourth coil (910) may be electrically connected to the fifth end (505) of the third coil (463). For example, the seventh end (911) may be electrically connected to the fifth end (505) via a fifth connecting member (921).

In one embodiment, the seventh end (911) of the fourth coil (910) may be electrically connected to the fifth end (505) of the third coil (463). For example, the eighth end (912) may be electrically connected to the sixth end (506) via the sixth connecting member (922).

According to one embodiment, the fourth coil (910) may be electrically connected to the first ground (464) through the third coil (463). For example, the seventh terminal (911) of the fourth coil (910) may be electrically connected to the fifth terminal (505) of the third coil (463). Since the third coil (463) is electrically connected to the first ground (464) at the fifth terminal (505), as a result, the fourth coil (910) may be electrically connected to the first ground (464) through the third coil (463).

In one embodiment, the fourth coil (910) can have substantially the same electrical length as the third coil (463). For example, the fourth coil (910) and the third coil (463) can have substantially the same physical length and can have substantially the same electrical length. Since the fourth coil (910) and the third coil (463) have substantially the same electrical length, the fourth coil (910) and the third coil (463) can output RF signals having substantially the same phase.

According to one embodiment, a first magnetic field (541) and a second magnetic field (542) may be formed in the first coil (461) and the second coil (462), respectively, and induced currents based on the first magnetic field (541) and the second magnetic field (542) may be formed in the third coil (463) and the fourth coil (910), respectively. For example, a first induced current may be formed in the third coil (463), and a second induced current may be formed in the fourth coil (910). In this case, the first induced current (e.g., AC) and the second induced current (e.g., AC) may flow in the same direction (e.g., counterclockwise when viewed in the -z direction). In one example, first RF signals (931) corresponding to the first induced current and second RF signals (932) corresponding to the second induced current may have substantially the same phase. First RF signals (931) corresponding to the first induced current and second RF signals (932) corresponding to the second induced current can be combined and transmitted to at least one antenna (330).

FIG. 10 is a diagram illustrating a first balun circuit including a first coil, a third coil, and a fourth coil according to one embodiment.

Referring to FIG. 10, a first balun circuit (460) according to one embodiment may include a first coil (461), a third coil (463), and/or a fourth coil (910).

In the embodiment of FIG. 10 of the present disclosure, compared to the embodiment of FIG. 9, the first balun circuit (460) may not include the second coil (462). For example, in the embodiment of FIG. 9, the first balun circuit (460) may include the first coil (461), the second coil (462), the third coil (463), and the fourth coil (910). On the other hand, in FIG. 10, the first balun circuit (460) may include the first coil (461), the third coil (463), and the fourth coil (910). That is, the second coil (462) may not be included in the first balun circuit (460).

According to one embodiment, the first balun circuit (460) can reduce or minimize loss of RF signals transmitted from the differential PA (450) by receiving RF signals through a plurality of coils (e.g., the third coil (463) and the fourth coil (910)).

FIG. 11 is a diagram illustrating a first balun circuit including a first coil, a second coil, a third coil, and a fifth coil according to one embodiment.

Referring to FIG. 11, a first balun circuit (460) according to one embodiment may include a first coil (461), a second coil (462), a third coil (463), and/or a fifth coil (1150).

In the embodiment of FIG. 11 of the present disclosure, compared to the embodiment of FIG. 4, the first balun circuit (460) may further include a fifth coil (1150).

According to one embodiment, the fifth coil (1150) may be positioned in a first direction (e.g., +z direction) with respect to the second coil (462). For example, the fifth coil (1150) may be positioned between the second coil (462) and the third coil (463). For example, the fifth coil (1150) may be positioned in a second direction (e.g., -z direction) with respect to the third coil (463). For example, the second coil (462), the fifth coil (1150), the third coil (463), and the first coil (461) may be stacked in this order from below. In one example, the first direction (e.g., +z direction) may be referenced as a direction from the second coil (462) toward the first coil (461).

According to one embodiment, the fifth coil (1150) may include a ninth end (1151) and a tenth end (1152). The ninth end (1151) of the fifth coil (1150) may be electrically connected to the fifth end (505) of the third coil (463). The tenth end (1152) of the fifth coil (1150) may be electrically connected to the sixth end (506) of the third coil (463).

According to one embodiment, the fifth coil (1150) may be electrically connected to the first ground (464) at the ninth stage (1151), and the third coil (463) may be electrically connected to the first ground (464) through the fifth coil (1150).

According to one embodiment, the first balun circuit (460) may include a first additional connecting member (1131) and a second additional connecting member (1132). For example, as the fifth coil (1150) is disposed between the second coil (462) and the third coil (463), the first balun circuit (460) may include the first additional connecting member (1131) and the second additional connecting member (1132) to connect the first connecting member (521) and the second connecting member (522) to the first coil (461). For example, the first end (501) of the first coil (461) may be electrically connected to the third end (503) of the second coil (462) via the first additional connecting member (1131) and the first connecting member (521). For example, the second end (502) of the first coil (461) can be electrically connected to the fourth end (504) via the second additional connecting member (1132) and the second connecting member (522).

According to one embodiment, the first balun circuit (460) may include a third additional connecting member (1133) and a fourth additional connecting member (1134). For example, when the fifth coil (1150) is positioned between the second coil (462) and the third coil (463), the first balun circuit (460) may include a third additional connecting member (1133) and a fourth additional connecting member (1134) for connecting the third connecting member (523) to the first coil (461).

According to one embodiment, the fifth coil (1150) can be formed to correspond to the third coil (463). For example, the fifth coil (1150) can have substantially the same shape as the third coil (463). For example, the fifth coil (1150) can at least partially overlap the third coil (463) when viewed in a first direction (e.g., +z direction).

According to one embodiment, the fifth coil (1150) may be disposed within a sixth layer (L6) among the plurality of non-conductive layers. For example, the sixth layer (L6) may be a layer positioned in a second direction (e.g., -z direction) with respect to the second layer (L2). For example, the sixth layer (L6) may be positioned between the second layer (L2) and the fourth layer (L4).

In one embodiment, the fifth coil (1150) can have substantially the same electrical length as the third coil (463). For example, the fifth coil (1150) and the third coil (463) can have substantially the same physical length and can have substantially the same electrical length. Since the fifth coil (1150) and the third coil (463) have substantially the same electrical length, the fifth coil (1150) and the third coil (463) can output RF signals having substantially the same phase.

According to one embodiment, a first magnetic field (541) and a second magnetic field (542) may be formed in the first coil (461) and the second coil (462), respectively, and induced currents based on the first magnetic field (5410) and the second magnetic field (543) may be formed in the third coil (463) and the fifth coil (1150), respectively. For example, a first induced current may be formed in the third coil (463), and a third induced current may be formed in the fifth coil (1150). In this case, the first induced current (e.g., AC) and the third induced current (e.g., AC) may flow in the same direction (e.g., counterclockwise when viewed in the -z direction). In one example, first RF signals (1121) corresponding to the first induced current and second RF signals (1122) corresponding to the third induced current may have substantially the same phase. The first RF corresponding to the first induced current The signals (1121) and the second RF signals (1122) corresponding to the second induced current can be combined and transmitted to at least one antenna (330).

FIG. 12 is a drawing illustrating a first balun circuit including a first wire according to one embodiment.

Referring to FIG. 12, a first balun circuit (460) according to one embodiment may include a first wire (1210). For example, the first wire (1210) may electrically connect a first portion (511) and a second portion (512) of a first coil (461).

In the embodiment of FIG. 12 of the present disclosure, compared to the embodiment of FIG. 11, the first balun circuit (460) may include a first wire (1210) instead of the fourth connecting member (524). For example, in the embodiment of FIG. 11, the fourth connecting member (524) may electrically connect the third portion (513) and the fourth portion (514) of the second coil (462). The third portion (513) may be electrically connected to the first portion (511) through the third connecting member (523) and the third additional connecting member (1133), and the fourth portion (514) may be electrically connected to the second portion (512) through the third connecting member (523) and the fourth additional connecting member (1134). As a result, the first portion (511) can be electrically connected to the second portion (512) via the third connecting member (523), the third additional connecting member (1133), the third portion (513), the fourth connecting member (524), the fourth portion (514) and the fourth additional connecting member (1134).

On the other hand, in the embodiment of FIG. 12, the first balun circuit (460) may not include the fourth connecting member (524) and may include the first wire (1210). The first portion (511) and the second portion (512) may be electrically connected through the first wire (1210). In this case, the third portion (513) may be electrically connected to the first portion (511) through the third connecting member (523) and the third additional connecting member (1133), and the fourth portion (514) may be electrically connected to the second portion (512) through the third connecting member (523) and the fourth additional connecting member (1134). As a result, the third portion (513) can be electrically connected to the fourth portion (514) through the third additional connecting member (1133), the third connecting member (523), the first portion (511), the first wire (1210), the second portion (512) and the fourth additional connecting member (1134).

According to one embodiment, when the first part (511) and the second part (512) are connected via the first wire (1210), the first balun circuit (460) may not include the fourth connecting member (524). When the first balun circuit (460) does not include the fourth connecting member (524), a separate layer (e.g., the fourth layer (L4)) for the fourth connecting member (524) may not be required. As a result, the first balun circuit (460) can reduce the size of the first balun circuit (460) in the vertical direction (e.g., the z-axis direction).

According to one embodiment, the method of connecting the first part (511) and the second part (512) via the first wire (1210) may be referred to as a wire bonding method.

In FIG. 12 of the present disclosure, it has been described that the first part (511) and the second part (512) are electrically connected through the first wire (1210), and the third part (513) and the fourth part (514) are connected through the first wire (1210), but this is only an example. For example, the first balun circuit (460) may include the first wire (1210) and the second wire. The first wire (1210) may electrically connect the first part (511) and the second part (512) of the first coil (461), and the second wire may electrically connect the third part (513) and the fourth part (514) of the second coil (462). That is, the third part (513) and the fourth part (514) can be electrically connected through a separate wire (e.g., the second wire) rather than the first wire (1210).

FIG. 13 is a diagram illustrating a first balun circuit including a sixth coil according to one embodiment.

Referring to FIG. 13, a first balun circuit (460) according to one embodiment may include a first coil (461), a second coil (462), a third coil (463), and/or a sixth coil (1310).

In the embodiment of FIG. 13 of the present disclosure, compared to the embodiment of FIG. 4, the first balun circuit (460) may further include a sixth coil (1310). For example, while in FIG. 4 the first balun circuit (460) includes only a first coil (461), a second coil (462), and a third coil (463), in FIG. 13 the first balun circuit (460) may include a first coil (461), a second coil (462), a third coil (463), and a sixth coil (1310).

According to one embodiment, the sixth coil (1310) may be positioned in a second direction (e.g., -z direction) with respect to the second coil (462). For example, the sixth coil (1310), the second coil (462), the third coil (463), and the first coil (461) may be stacked in this order from below.

According to one embodiment, the sixth coil (1310) may include an eleventh end (1311) and a twelfth end (1312). The eleventh end (1311) of the sixth coil (1310) may be electrically connected to the fifth end (505) of the third coil (463). The twelfth end (1312) of the sixth coil (1310) may be electrically connected to the sixth end (506) of the third coil (463).

In one embodiment, the sixth coil (1310) may be electrically connected to the first ground (464) at the eleventh end (1311). The third coil (463) may be electrically connected to the first ground (464) via the sixth coil (1310). For example, the third coil (463) may be electrically connected to the sixth coil (1310) at the fifth end (505), and the sixth coil (1310) may be electrically connected to the first ground (464) at the eleventh end (1311).

According to one embodiment, the sixth coil (1310) may be formed to correspond to the third coil (463). For example, the sixth coil (1310) may have substantially the same shape as the third coil (463). For example, the sixth coil (1310) may at least partially overlap with the third coil (463) when viewed in a first direction (e.g., +z direction).

According to one embodiment, the sixth coil (1310) may be positioned within a seventh layer (L7) among the plurality of non-conductive layers. For example, the seventh layer (L7) may be a layer positioned in a second direction (e.g., -z direction) with respect to the third layer (L3).

In one embodiment, the sixth coil (1310) can have substantially the same electrical length as the third coil (463). For example, the sixth coil (1310) and the third coil (463) can have substantially the same physical length and can have substantially the same electrical length. Since the sixth coil (1310) and the third coil (463) have substantially the same electrical length, the sixth coil (1310) and the third coil (463) can output RF signals having substantially the same phase when RF signals are applied.

According to one embodiment, a first magnetic field (541) and a second magnetic field (542) may be formed in the first coil (461) and the second coil (462), respectively, and induced currents based on the first magnetic field (541) and the second magnetic field (542) may be formed in the third coil (463) and the sixth coil (1310), respectively. For example, a first induced current may be formed in the third coil (463), and a fourth induced current may be formed in the sixth coil (1301). In this case, the first induced current (e.g., AC) and the fourth induced current (e.g., AC) may flow in the same direction (e.g., counterclockwise when viewed in the -z direction). In one example, first RF signals (1331) corresponding to the first induced current and second RF signals (1332) corresponding to the fourth induced current may have substantially the same phase. First RF signals (1311) corresponding to the first induced current and second RF signals (1332) corresponding to the fourth induced current can be combined and transmitted to at least one antenna (330).

FIG. 14 is a diagram illustrating a first balun circuit including a first coil, a third coil, a fourth coil, and a seventh coil according to one embodiment.

Referring to FIG. 14, a first balun circuit (460) according to one embodiment may include a first coil (461), a third coil (463), a fourth coil (910), and/or a seventh coil (1410).

In the embodiment of FIG. 14 of the present disclosure, compared to the embodiment of FIG. 10, the first balun circuit (460) may further include a seventh coil (1410).

According to one embodiment, the seventh coil (1410) may be arranged in a first direction (e.g., +z direction) with respect to the third coil (463). For example, the seventh coil (1410) may be arranged between the first coil (461) and the third coil (463). For example, the third coil (463), the seventh coil (1410), the first coil (461), and the fourth coil (910) may be stacked in this order from below.

According to one embodiment, the seventh coil (1410) may include a thirteenth section (1401) and a fourteenth section (1402). The seventh coil (1410) may include a seventh portion (1411) including the thirteenth section (1401) and an eighth portion (1412) including the fourteenth section (1402).

According to one embodiment, the seventh coil (1410) may be formed to correspond to the first coil (461). For example, the seventh coil (1150) may have substantially the same shape as the first coil (461). For example, the seventh coil (1410) may at least partially overlap the first coil (461) when viewed in a first direction (e.g., +z direction).

According to one embodiment, the seventh coil (1410) may be disposed within an eighth layer (L8) among a plurality of non-conductive layers. For example, the eighth layer (L8) may be a layer positioned in a first direction (e.g., +z direction) with respect to the second layer (L2). For example, the sixth layer (L6) may be positioned between the first layer (L1) and the second layer (L2).

In one embodiment, the seventh portion (1411) of the seventh coil (1410) can be electrically connected to the eighth portion (1412). For example, the seventh portion (1411) can be electrically connected to the eighth portion (1412) via an additional connecting member (1420).

According to one embodiment, RF signals applied by the first PA (451) to the first coil (461) can be transmitted to at least one antenna (330) along the first portion (511) and the second portion (512). That is, RF signals applied by the first PA (451) to the first coil (461) can be transmitted from the first end (501) to the second end (502).

According to one embodiment, the first portion (511) of the first coil (461) can be electrically connected to the second portion (512). For example, the first portion (511) can be electrically connected to the second portion (512) via the additional connecting member (1420). For example, the first portion (511) can be electrically connected to the seventh portion (1411), and the second portion (512) can be electrically connected to the eighth portion (1412). Since the seventh portion (1411) and the eighth portion (1412) are electrically connected via the additional connecting member (1420), the first portion (511) can be electrically connected to the second portion (512) via the additional connecting member (1420).

In one embodiment, the seventh coil (1410) can be electrically connected to the first coil (461). For example, the thirteenth end (1401) of the seventh coil (1410) can be electrically connected to the first end (501) of the first coil (461). For example, the fourteenth end (1402) of the seventh coil (1410) can be electrically connected to the second end (502) of the first coil (461).

According to one embodiment, RF signals applied by the first PA (451) to the seventh coil (1410) can be transmitted to at least one antenna (330) along the seventh portion (1411) and the eighth portion (1412). That is, RF signals applied by the first PA (451) to the seventh coil (1410) can be transmitted from the 13th end (1401) to the 14th end (1402).

In one embodiment, the seventh coil (1410) can have substantially the same electrical length as the first coil (461). For example, the seventh coil (1410) and the first coil (461) can have substantially the same physical length and can have substantially the same electrical length. Since the seventh coil (1410) and the first coil (461) have substantially the same electrical length, when the first PA (451) and/or the second PA (452) apply RF signals having the same phase to the seventh coil (1410) and the first coil (461), an alternating current having substantially the same phase can flow through the seventh coil (1410) and the first coil (461).

According to one embodiment, in a wireless communication system, an electronic device may include a radio frequency integrated circuit (RFIC), a front-end module (FEM) electrically connected to the RFIC, and at least one antenna. The FEM may include a differential power amplifier (PA) and a first balun circuit, and the first balun circuit may include a first coil and a second coil connected to the differential PA, and a third coil electromagnetically connected to each of the first coil and the second coil, and transmitting first RF signals received from the first coil and the second coil to the at least one antenna. The third coil may be electrically connected to ground.

According to one embodiment, the differential PA includes a first PA outputting RF signals of a first phase and a second PA outputting RF signals of a second phase, wherein a first end of the first coil can be electrically connected to the first PA, a second end of the first coil can be electrically connected to the second PA, a third end of the second coil can be electrically connected to the first PA, and a fourth end of the second coil can be electrically connected to the second PA.

According to one embodiment, the electronic device further includes a first connecting member connecting the first end of the first coil to the third end of the second coil, and a second connecting member connecting the second end of the first coil to the fourth end of the second coil, wherein the third end of the second coil can be connected to the first PA through the first connecting member, and the fourth end can be connected to the second PA through the second connecting member.

In one embodiment, the first coil may include a first portion comprising a first end, and a second portion spaced apart from the first portion and comprising a second end, and the second coil may include a third portion comprising a third end, and a fourth portion spaced apart from the third portion and comprising a fourth end.

According to one embodiment, the printed circuit board further includes a first layer on which the first balun circuit is arranged, a second layer on which the second coil is arranged, and a third layer located between the first layer and the second layer and on which the third coil is arranged.

According to one embodiment, the electronic device further includes a third connecting member disposed in a third layer together with the third coil and a fourth connecting member disposed in a fourth layer below the second layer, wherein the first portion and the second portion of the first coil can be connected through the third connecting member, and the third portion and the fourth portion of the second coil can be connected through the fourth connecting member.

According to one embodiment, the electronic device includes a first wire disposed in the first layer and a second wire disposed in the second layer, wherein the first portion and the second portion of the first coil disposed in the first layer are connected via the first wire, and the third portion and the fourth portion of the second coil disposed in the second layer are connected via the second wire.

According to one embodiment, the differential PA applies a first RF signal of a first phase to the first terminal of the first coil, and applies a second RF signal of the first phase to the third terminal of the second coil, wherein the first RF signal is transmitted to the second terminal of the first coil, and the second RF signal has the same phase as the first RF signal and can be transmitted to the fourth terminal of the second coil.

According to one embodiment, when the first RF signal of the first phase is applied to the first terminal of the first coil and the second RF signal of the first phase is applied to the third terminal of the second coil, both the first magnetic field formed by the first coil and the second magnetic field formed by the second coil can have the first direction.

According to one embodiment, the third coil includes a fifth end connected to the ground and a sixth end connected to the at least one antenna, and an RF signal induced in the third coil by the first magnetic field formed by the second coil and the second magnetic field formed by the third coil can be transmitted from the fifth end to the sixth end.

According to one embodiment, the third coil is disposed between the first coil and the second coil, the second coil is disposed between the third coil and the ground, and the electronic device further includes a fifth connecting member, the fifth connecting member being capable of connecting the fifth end of the third coil and the ground through a space surrounded by the second coil.

According to one embodiment, the first balun circuit further includes a fourth coil electromagnetically connected to the first coil and the second coil respectively, and transmitting second RF signals received from the first coil and the second coil to the at least one antenna, wherein the fourth coil is electrically connected to the ground, and the first RF signals and the second RF signals can be coupled.

In one embodiment, the FEM further includes a second balun circuit, the second balun circuit including a fourth coil connected to the RFIC, and a fifth coil and a sixth coil electromagnetically connected to the fourth coil and transmitting third RF signals received from the fourth coil to the differential PA, the fourth coil being electrically connected to the ground, and the first RF signals may be signals amplified by the differential PA of the third RF signals received from the fourth coil.

According to one embodiment, a third magnetic field may be formed in the fourth coil based on the third RF signals, and currents in the same direction may be formed in the fifth coil and the sixth coil based on the third magnetic field.

In one embodiment, the RFIC includes a mixer for converting an intermediate (IF) signal or a baseband (BB) signal into the first RF signals, and the FEM may be disposed on a printed circuit board together with the RFIC and electrically connected thereto or disposed on a different printed circuit board from the RFIC and electrically connected thereto via a connecting member.

According to one embodiment, in a wireless communication system, an electronic device may include a first printed circuit board, a radio frequency integrated circuit (RFIC) disposed on the first printed circuit board, a front-end module (FEM) disposed on the first printed circuit board and electrically connected to the RFIC, and at least one antenna. The FEM may include a differential power amplifier (PA) and a first balun circuit, and the first balun circuit may include a first coil and a second coil connected to the differential PA, and a third coil electromagnetically connected to each of the first coil and the second coil, and transmitting first RF signals received from the first coil and the second coil to the at least one antenna. The third coil may be electrically connected to ground.

According to one embodiment, the differential PA includes a first PA outputting RF signals of a first phase and a second PA outputting RF signals of a second phase, wherein a first end of the first coil may be electrically connected to the first PA, a second end of the first coil may be electrically connected to the second PA, a third end of the second coil may be electrically connected to the first PA, and a fourth end of the second coil may be electrically connected to the second PA.

According to one embodiment, the electronic device further includes a first connecting member connecting the first end of the first coil to the third end of the second coil, and a second connecting member connecting the second end of the first coil to the fourth end of the second coil, wherein the third end of the second coil can be connected to the first PA through the first connecting member, and the fourth end can be connected to the second PA through the second connecting member.

According to one embodiment, the first coil may include a first portion including a first end, and a second portion spaced apart from the first portion and including a second end, and the second coil may include a third portion including a third end, and a fourth portion spaced apart from the third portion and including a fourth end.

In one embodiment, the FEM further includes a second printed circuit board on which the first balun circuit is arranged, the second printed circuit board may include a first layer on which the first coil is arranged, a second layer on which the second coil is arranged, and a third layer located between the first layer and the second layer and on which the third coil is arranged.

Meanwhile, the present specification and drawings have disclosed preferred embodiments of the present invention, and although specific terms have been used, they have been used only in a general sense to easily explain the technical contents of the present invention and to help understand the invention, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modified examples based on the technical idea of the present invention can be implemented in addition to the embodiments disclosed herein.

Claims (20)

In an electronic device in a wireless communication system,
radio frequency integrated circuit (RFIC);
A front-end module (FEM) electrically connected to the above RFIC; and
comprising at least one antenna,
The above FEM includes a differential PA (power amplifier) and a first balun circuit,
The first balun circuit is:
First coil and second coil connected to the above differential PA; and
A third coil is electromagnetically connected to each of the first coil and the second coil, and transmits first RF signals received from the first coil and the second coil to the at least one antenna,
An electronic device wherein the third coil is electrically connected to ground. In claim 1,
The above differential PA includes a first PA outputting RF signals of a first phase and a second PA outputting RF signals of a second phase,
The first end of the first coil is electrically connected to the first PA, and the second end of the first coil is electrically connected to the second PA.
An electronic device, wherein a third end of the second coil is electrically connected to the first PA and a fourth end of the second coil is electrically connected to the second PA. In claim 2,
A first connecting member connecting the first end of the first coil and the third end of the second coil; and
Further comprising a second connecting member connecting the second end of the first coil and the fourth end of the second coil,
An electronic device, wherein the third end of the second coil is connected to the first PA through the first connecting member, and the fourth end is connected to the second PA through the second connecting member. In claim 1,
The first coil comprises a first portion including a first end, and a second portion spaced apart from the first portion and including a second end,
An electronic device, wherein the second coil comprises a third portion including a third terminal, and a fourth portion spaced apart from the third portion and including a fourth terminal. In claim 4,
Further comprising a printed circuit board on which the first balun circuit is arranged;
An electronic device, wherein the printed circuit board includes a first layer on which the first coil is arranged, a second layer on which the second coil is arranged, and a third layer located between the first layer and the second layer and on which the third coil is arranged. In claim 5,
a third connecting member arranged in the third layer together with the third coil; and
Further comprising a fourth connecting member arranged in a fourth layer below the second layer;
The first part and the second part of the first coil are connected through the third connecting member,
An electronic device, wherein the third portion and the fourth portion of the second coil are connected through the fourth connecting member. In claim 5,
a first wire arranged in the first layer; and
comprising a second wire arranged in the second layer;
The first part and the second part of the first coil arranged in the first layer are connected through the first wire,
An electronic device, wherein the third portion and the fourth portion of the second coil arranged in the second layer are connected through the second wire. In claim 4,
The above differential PA is:
Applying a first RF signal of a first phase to the first terminal of the first coil,
Applying the second RF signal of the first phase to the third terminal of the second coil,
The above first RF signal is transmitted to the second terminal of the first coil,
An electronic device wherein the second RF signal has the same phase as the first RF signal and is transmitted to the fourth terminal of the second coil. In claim 8,
An electronic device, wherein a first magnetic field formed by the first coil and a second magnetic field formed by the second coil both have a first direction when the first RF signal of the first phase is applied to the first terminal of the first coil and the second RF signal of the first phase is applied to the third terminal of the second coil. In claim 1,
The third coil comprises a fifth end connected to the ground and a sixth end connected to the at least one antenna,
An electronic device in which an RF signal induced in the third coil by the first magnetic field formed by the second coil and the second magnetic field formed by the third coil is transmitted from the fifth terminal to the sixth terminal. In claim 10,
The third coil is positioned between the first coil and the second coil,
The second coil is placed between the third coil and the ground,
The electronic device further comprises a fifth connecting member,
An electronic device wherein the fifth connecting member connects the fifth terminal of the third coil and the ground through a space surrounded by the second coil. In claim 1,
The first balun circuit further includes a fourth coil, each of which is electromagnetically connected to the first coil and the second coil, and which transmits second RF signals received from the first coil and the second coil to the at least one antenna,
The above fourth coil is electrically connected to the ground,
An electronic device, wherein the first RF signals and the second RF signals are combined. In claim 1,
The above FEM further comprises a second balun circuit,
The above second balun circuit:
a fourth coil connected to the above RFIC; and
A fifth coil and a sixth coil are electromagnetically connected to the fourth coil and transmit third RF signals received from the fourth coil to the differential PA.
The above fourth coil is electrically connected to the ground,
An electronic device wherein the first RF signals are signals amplified by the differential PA from the third RF signals received from the fourth coil. In claim 13,
Based on the third RF signals, a third magnetic field is formed in the fourth coil,
An electronic device in which currents in the same direction are formed in the fifth coil and the sixth coil based on the third magnetic field. In claim 1,
The RFIC includes a mixer for converting an IF (intermediate) signal or a BB (baseband) signal into the first RF signals,
An electronic device wherein the FEM is electrically connected to the RFIC by being placed on a printed circuit board together with the RFIC or electrically connected to the RFIC by being placed on a different printed circuit board through a connecting member. In an electronic device in a wireless communication system,
First printed circuit board;
A radio frequency integrated circuit (RFIC) disposed on the first printed circuit board;
A front-end module (FEM) disposed on the first printed circuit board and electrically connected to the RFIC; and
comprising at least one antenna,
The above FEM includes a differential PA (power amplifier) and a first balun circuit,
The first balun circuit is:
First coil and second coil connected to the above differential PA; and
A third coil is electromagnetically connected to each of the first coil and the second coil, and transmits first RF signals received from the first coil and the second coil to the at least one antenna,
An electronic device wherein the third coil is electrically connected to ground. In claim 16,
The above differential PA includes a first PA outputting RF signals of a first phase and a second PA outputting RF signals of a second phase,
The first end of the first coil is electrically connected to the first PA, and the second end of the first coil is electrically connected to the second PA.
An electronic device, wherein a third end of the second coil is electrically connected to the first PA and a fourth end of the second coil is electrically connected to the second PA. In claim 17,
A first connecting member connecting the first end of the first coil and the third end of the second coil; and
Further comprising a second connecting member connecting the second end of the first coil and the fourth end of the second coil,
An electronic device, wherein the third end of the second coil is connected to the first PA through the first connecting member, and the fourth end is connected to the second PA through the second connecting member. In claim 16,
The first coil comprises a first portion including a first end, and a second portion spaced apart from the first portion and including a second end,
An electronic device, wherein the second coil comprises a third portion including a third terminal, and a fourth portion spaced apart from the third portion and including a fourth terminal. In claim 16,
The above FEM further comprises a second printed circuit board on which the first balun circuit is arranged,
An electronic device, wherein the second printed circuit board includes a first layer on which the first coil is arranged, a second layer on which the second coil is arranged, and a third layer located between the first layer and the second layer and on which the third coil is arranged.

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