KR20250136840A - Integrated heating and insulation system - Google Patents

Abstract

Representative embodiments of the device and technology provide an exemplary protective insulation system including a heating element. The protective insulation system may include a substrate layer and a protective layer over the substrate layer. The protective insulation system is lightweight and can be installed with minimal manpower and equipment.

Description

Integrated heating and insulation system

Protective insulation is installed on pipes, tanks, and related connectors, valves, and components in diverse locations and environments around the world. Many industries, including manufacturing, petroleum, food, and mining, rely on insulation not only to protect their equipment but also to maintain desired thermal conditions. Protective insulation must withstand external factors for as long as possible, providing not only protection but also optimal performance.

This Summary is provided to briefly introduce some concepts that are further explained in the Detailed Description below. This Summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of any claimed subject matter.

Briefly and at a high level, this disclosure describes, among other things, protective insulation that includes thermal and protective barriers for elements, including integrated heating systems. Existing solutions often provide separate insulation, often placed on separately installed heating wires or thermal tapes, that wrap around pipes, tanks, connectors, valves, etc. Integrated solutions are not only faster and easier to install, but also significantly more time- and cost-effective for troubleshooting and repairing integrated systems.

In various embodiments, the protective insulation comprises a substrate layer covered with a protective layer. In various alternative embodiments, the protective insulation may comprise multiple protective layers and/or various combinations of substrate layers and protective layers—which may also be combined with other layers. For example, in various embodiments, as described in more detail below, one or more heat-generating layers may be combined with the substrate and protective layer(s).

In various examples, the substrate layer comprises a lightweight foam material (such as polyisocyanurate) having a density between 1 and 10 pounds per cubic foot, but in some embodiments may have a density of less than 1 and greater than 60 pounds per cubic foot. The protective layer may comprise a polyurea material that can be sprayed on in a liquid state and cured into a solid state. The protective layer adheres to the inner and/or outer surfaces of the substrate layer. The protective layer may be sprayed or otherwise coated onto the surface(s) of the substrate layer after the substrate layer has been formed. Alternatively, the protective layer may be applied to the inner surface of a mold, and the substrate layer may then be deposited onto the mold such that, once cured, the protective layer adheres to the outer surface of the substrate layer. One or more additional protective layers may be applied to the inner surface of the formed substrate layer.

The substrate layer may have a single structure or may be comprised of multiple parts or panels assembled together. In alternative embodiments, the thickness of the substrate layer is non-uniform across the length and/or width of the substrate layer. For example, the substrate layer may be thicker at the top or bottom than at the side portions of the substrate layer (or vice versa). The panels (if applicable) may have the same or different thicknesses. In other words, the panels may be uniform or non-uniform in thickness.

In various embodiments, at least the substrate layer is injection molded, allowing the substrate layer to have a variety of desired shapes and physical dimensions to suit various applications.

A detailed description is provided with reference to the attached drawings. In the drawings, the leftmost digit of a reference number indicates the drawing in which the reference number first appears. The use of the same reference number in different drawings indicates similar or identical items.
For the purposes of this discussion, the devices and systems illustrated in the drawings are depicted as having a number of components. As described herein, various implementations of the devices and/or systems may include fewer components and remain within the scope of the present disclosure. Alternatively, other implementations of the devices and/or systems may include additional components, or various combinations of the described components, and remain within the scope of the present disclosure. The shapes and/or dimensions depicted in the examples in the drawings are for illustrative purposes only, and unless otherwise specified, other shapes and/or dimensions may be used and remain within the scope of the present disclosure.
Figures 1 and 2 illustrate perspective and end views, respectively, of an exemplary heating and insulation system according to one embodiment.
FIG. 3 illustrates an exemplary heating element according to one embodiment.
FIG. 4 illustrates a cutaway view of an exemplary heating and insulation system section including chained heating elements, according to one embodiment.
Figure 5 is an illustration of an exemplary heating element according to another embodiment.
FIG. 6 illustrates a cutaway view of an exemplary heating and insulation system section including integrated heating element(s), according to one embodiment.
FIG. 7 illustrates an exemplary heating and insulation system section configured for a straight pipe application, according to one embodiment.
Figures 8 and 9 illustrate exemplary installations of a heating and insulation system for a pipe component, according to one embodiment.
FIGS. 10 through 12 illustrate side, detail and cross-sectional views of an exemplary heating and insulation system including an integrated electrical connector, according to one embodiment.
FIGS. 13 and 14 illustrate perspective and side views of an exemplary heating and insulation system, including a control box, according to one embodiment.
FIG. 15 illustrates a side view of an exemplary electrical connection of a heating and insulation system, including an electrical connector, according to one embodiment.
FIG. 16 illustrates a perspective view of a molded section of an exemplary heating and insulation system, according to one embodiment.
FIGS. 17 and 18 illustrate right and left cross-sectional side views of the molded section of FIG. 16, according to one embodiment.
FIG. 19 illustrates a perspective view of a molded section of an exemplary heating and insulation system, according to one embodiment.
FIGS. 20 and 21 illustrate right and left cross-sectional side views of the molded section of FIG. 19, according to one embodiment.
FIG. 22 is a flowchart illustrating an exemplary process for forming a heating and insulation system according to one embodiment.

outline

Typically, external insulation applied to pipes, fittings, valves, tanks, etc., is provided in the form of separate sheets or blankets that are fixed to the desired surface and are then often covered with a protective layer or shield. The insulation sheets or blankets may be flexible thermal materials, and the protective layer may be metal, composite, plastic, etc. In some cases, it is desirable to maintain the pipes, fittings, valves, tanks, etc., at a specific temperature. This may be to ensure optimal system performance, to maintain the temperature range of materials stored or transported in the system, to protect the system from damage due to extreme temperatures, or for other reasons. In such cases, it may be desirable to also add a heating source to the pipes, fittings, valves, tanks, etc.

Typically, pipes, fittings, valves, tanks, etc. are wrapped with electrical heating tape or wire designed for heating, and then insulation material is wrapped over the tape or wire. Once the insulation is secured, a protective layer is installed over the insulation. This technique of applying multiple layers has several drawbacks. For example, if the heating tape or wire fails, a reverse process is required to remove the protective layer, then apply the insulation material to repair or replace the tape or wire. Troubleshooting the system to isolate the failed section can also be cumbersome, often requiring a reverse process to identify the faulty section. Alternatively, the multi-step installation process is time-consuming and labor-intensive, and there may be associated costs for maintenance, troubleshooting, and repairs, as well as the initial installation. Long-term costs can also be significant if a sub-pipe, fitting, valve, tank, etc. leaks or fails, or if any part of the multi-layer system fails.

Various aspects described herein may be commercialized as individual components and/or prepackaged kits. For example, an insulation/heating kit may include insulation sections (e.g., straight sections, elbows, valve covers, etc.) with pre-installed heating elements and electrical connectors integrated into the insulation sections. Various aspects described herein may also be modular. For example, insulation sections may be easily attached and electrical connections may be run from section to section. Various sections may also be quickly and easily installed into existing infrastructure.

This discussion of exemplary advantages is illustrative only and is not intended to be limiting. Based on the present disclosure, it should be understood that additional advantages are provided by the embodiments described herein. Exemplary embodiments of the present invention are described herein with reference to the drawings, wherein like elements are depicted by like reference numerals.

Exemplary heating and insulation systems

Representative embodiments of the devices and technologies disclosed herein provide an efficient and cost-effective heating and insulation solution comprising a single-step installation process. Disclosed herein is an integrated heating and insulation system (100) comprising protective insulation (104) with an integrated heating element (102). The protective insulation (104) comprises an insulating substrate (106), which may further comprise a protective layer (108) surrounding all or a portion of the substrate (106). In various embodiments, the novel system (100) is significantly easier and more cost-effective to install and maintain, and has improved weather resistance and longevity.

Referring to FIGS. 1 through 21 , an exemplary embodiment of the disclosed system (100) comprises a protective insulation (104) comprising an insulating substrate layer (106) covered with at least one protective layer (108). The insulating substrate layer (106) is generally formed to have a shape that matches the desired application (such as a pipe, tank, associated components, etc.). A heating element (102) is incorporated into the substrate layer (106) and/or one or more protective layers (108), such that installing the protective insulation (104) to the protected item also installs the heating element (102) to the item. Electrical connections to the heating element (102) may also be incorporated into the substrate layer (106) or the protective layer (108). While the drawings and description illustrate and discuss a pipe/tank system as an application of the exemplary protection system (100), this is not intended to be limiting. The system (100) comprising any or all of the relevant components discussed herein may be applied to any other component or system desired to be protected and temperature controlled. In various embodiments, the components of the system (100) may have various shapes, sizes, textures, and the like, and remain within the scope of the present disclosure.

The substrate layer (106) is a lightweight thermal insulation material, such as a foam, that can take any desired shape, and the protective layer (108) is a polymer, such as polyurea. The thickness and density of the substrate layer (106) and/or the protective layer (108) may vary based on the individual components to be protected and/or temperature controlled. For example, the thickness of the substrate layer (106) may in some cases range from less than 1" to more than 12" thick.

For example, in some applications, a 2-inch layer of foam (such as polyisocyanurate) having a density of 2 to 6 pounds per cubic foot may be utilized on the substrate (106). Foams of other thicknesses and densities may also be used, including foams having a density of less than 1 to more than 60 pounds per cubic foot. Closed cell foams having a density of 2 to more than 10 pounds per cubic foot may also be used. The foam may be molded or formed into a shape and size (particularly an internal shape and size) that closely matches the component to be protected for optimized thermal protection/control.

The substrate layer (106) may be a monolithic structure or may be constructed of multiple components joined together in a modular fashion. For example, a monolithic or modular structure may be provided by molding the form into a desired shape for the application (such as the shape of a connecting elbow or tee). The substrate layer (106) includes an inner surface (107) and an outer surface (109), which define the thickness of the substrate layer (106). The thickness of the substrate layer (106) may be constant along the length and width of the substrate (106), or may vary in thickness. Once formed, a protective layer (108) may then be applied to the outer surface (109) of the substrate layer (106), such as by spraying the protective layer (108). In some cases, more than one protective layer (108) may be applied to the inner surface (107) of the substrate (106).

The protective layer (108) may be composed of pure polyurea or a hybrid polyurea to provide excellent durability, weather resistance, and longevity. Even a thin protective layer (108) provides abrasion resistance and adds strength to the substrate layer (106), as well as protection from radiation, oxidation, moisture, and other environmental factors. In some cases, various polymers or other synthetic or natural materials may also be used in one or more of the protective layers. Any one or a combination of these materials may be used in the protective layer (108) or multiple protective layers (108).

The protective layer (108) is typically adhered to the outer surface (109) of the substrate (106), but may also be adhered to the inner surface (107). For example, the materials mentioned above may be available as sprayable (or otherwise applicable) liquids and thus may be applied to the substrate layer (106) by spraying (or brushing, etc.). Other materials are also within the scope of the present invention. The combination of the lightweight substrate (106) and the protective layer (108) provides the advantages described herein, and other advantages will be recognized by those skilled in the art. In installation environments where additional protection is not required, the outer surface protective layer (108) may be optional or omitted.

Referring to FIGS. 1 and 2, some examples of arrangements of a heating and insulation system (100) are illustrated. For example, referring to FIG. 1, one or more heating elements (102) may be bonded to an interior surface (107) of a substrate (106), may be secured to an interior surface (107) of the substrate (106), or may be molded or embedded in the substrate (106) (typically at the interior surface (107)). This allows the heating elements (102) to be proximate the components to be heated. Alternatively, the heating elements (102) may be bonded to an exterior surface (109) of the substrate (106), and optionally may have one or more protective layers (108) over the heating element(s) (102). The heating element (102) may be adhered to the surface of the substrate (106) (or the protective layer (108)) using one or a combination of various adhesives, epoxies, coatings, and the like. For example, the protective layer (108) may be used as an adhesive between the substrate (106) and the heating element (102), as well as over the heating element (102) while positioned over the substrate (106). Additionally, any of a variety of fasteners (e.g., hardware, mechanical fasteners, adhesive components, friction components, etc.) may be used to secure the heating element (102) to the substrate (106) or the protective layer (108). One or more protective layers (108) may be applied over the heating element (102), if desired.

Also referring to FIG. 2, in various embodiments, the heating elements (102) may be disposed between multiple layers of protective layers (108), if desired. For example, a first one or more protective layers (108a) may be disposed over part or all of the interior surface (107) of the substrate (106). The heating elements (102) may be bonded or secured to the first protective layer (108), and additional one or more protective layers (108b) may be applied over part or all of the first protective layer (108a) as well as the heating elements (102). This seals the heating elements (102) within a protective envelope, thereby protecting the heating elements (102) from environmental conditions. If desired, one or more additional layers of the protective layers (108) may be applied, or one or more layers of the protective layers (108) may be omitted. In alternative implementations, the substrate (106) may be minimized or omitted. For example, the heating element (102) may have a thin layer of substrate (106) included in the combination, or alternatively may be sandwiched between two protective layers (108) (multiple layers of protective layers (108)) without the substrate (106).

In another example, the heating element (102) is embedded in a surface (inner surface (107) or outer surface (109)) of the substrate (106). For example, the heating element (102) may be molded into the surface of the substrate (106) while the substrate (106) is being formed. Alternatively, the heating element (102) may be molded into the surface of the substrate (106) while the substrate (106) is being cured or after the substrate (106) is being formed. For example, the heating element (102) may be embedded in a soft, uncured substrate (106), positioned within a recess carved into a cured substrate (106), positioned on the surface of the substrate (106), etc. In some examples, the heating element (102) may be positioned on the inner surface (107) and the outer surface (109) of the substrate (106).

In one example, the heating element (102) may not be embedded in the material of the substrate (106) itself, but may be positioned between the substrate (106) and the component to be heated. For example, one or more electrical connectors, components, or other fasteners may be integrated into or embedded in the material of the substrate (106), with the heating element (102) being permanently or removably coupled to the electrical connector, component, or other fastener. In this example, the heating element (102) may be integrated into the substrate (106) via a connector, component, fastener, or the like.

Referring to FIGS. 3 through 6, the heating element (102) may take many forms, as desired for the application. As illustrated in FIG. 3, the heating element (102) may include one or more sheets of conductive ink (110) (having a desired resistance/impedance) bonded to a power and ground conductor (112). The conductor (112) may be a flat copper strip (or other conductive material) bonded to the conductive ink sheet (110) or embedded/integrated into the substrate (106) or protective layer (108). This provides a flat profile heating element (102) that fits snugly within the insulating substrate (106) and contacts or is in close proximity to the component to be heated. In various examples, the heating element (102) includes a resistive portion or resistive medium, such as, for example, a conductive ink (110), and a conductive portion or conductive medium, such as, for example, a conductor (112) or other trace, bus, or the like.

In one example, conductive ink (110) is printed on a plastic sheet. Copper conductors (112) (or other conductive material) are placed on opposite edges of the printed ink (110). A second plastic sheet is placed over the ink (110) and the conductors (112) and the plastic sheet can be fused to each other. The conductive strips (112) can be accessed for power by allowing portions of the conductive strips (112) to extend beyond the plastic sheet, or by forming openings in the plastic sheet over each conductive strip (112) (either two openings in the same sheet or one for each).

Alternatively, the conductive ink (110) may be printed or embedded on the surface of the substrate (106) or the protective layer (108). For example, the conductive ink (110) may be disposed on either surface of the substrate (106) and/or on either surface of the protective layer (108) - or in multiple layers of the substrate (106) and/or the protective layer (108) (e.g., 3D printed). Conductors (112) may be positioned at both edges of the ink (110) to make contact with the ink (110), and a poly layer (or the like) may be bonded over the ink (110) and the conductor (112). The poly layer may include the material of the protective layer (108), if desired. Alternatively, the conductor (112) may be attached or embedded in the surface of the substrate (106) and/or the surface of the protective layer (108) when the initial contact is made or when the system (100) is assembled.

The conductive ink (110) can be formed according to an existing solution, and the composition of the ink can be changed to obtain a desired resistance value and thus a desired wattage per foot of the heating element (102). For example, the proportions of the constituent ingredients can be adjusted to control the heating capability.

An indicator, such as an LED, may be coupled in parallel with the ink (110) sheet to indicate proper installation and operation. A plug, connector, or other connecting device may be bonded to the conductive strip (112) to couple it to power and ground, or to couple it to another heating element (102). For example, as shown in the cross-sectional view of FIG. 4, multiple heating elements (102) may be coupled together in series or parallel to heat a larger surface area. A bus conductor (402) may run along the length of a section of the heating and insulation system (100) and connect power and ground conductors (112) together within the section. The bus conductor (402) may be accessible to the exterior of the substrate (106) for connection to a power source. Additional conductors (404) for power, ground, signals, etc. may also run along the length of a section of the system (100), or may run portions through the section and be coupled using conductive couplers (406), etc. In some cases, the conductive couplers (406) may be accessible externally to the section of the system (100) to provide power to the section or group of sections, or to access data and signal components. Additionally, each end of a section of the system (100) may include a section coupler (408) to electrically couple multiple sections together. The section coupler (408) may be embedded in the substrate (106), or may be electrically coupled (or electrically continuous) to the bus conductor (402), the additional conductor (404), and/or the conductive coupler (406), such that signals and/or power may propagate through multiple sections of the system (100).

As illustrated in FIG. 5, the heating element (102) may have other configurations, such as an arrangement of resistive conductors (502) coupled to power and ground conductors (504). The resistive conductors (502) may be insulated or non-insulated conductive (e.g., metal and/or other conductive material) wires or elements having a predetermined resistance and a given cross-section or profile (e.g., circular, stranded, flat, etc.) and may be arranged for heat distribution as desired. In the examples of FIGS. 5 and 6, the resistive conductors (502) comprise a resistive portion of the heating element (102) and are coupled within a circuit to the power and ground conductors (504) (e.g., the conductive portion of the heating element (102). In some cases, the resistance of the resistive conductors (502) may be adjusted as desired for a desired heat output (e.g., using additional resistive components in series or parallel with the resistive conductors (502). The power and ground conductor (504) is coupled to a power source, such as an electrical outlet or supply. In some cases, the power and ground conductor (504) is coupled to the power source via an electrical plug (506).

In various examples, the resistive conductor (502) is bonded to a flexible or semi-flexible backing (508) for ease of handling. The backing (508) may then be disposed on an inner surface (107) or an outer surface (109) of the substrate (106) (with or without a protective layer (108) between the substrate (106) and the heating element (102). This provides a flat profile of the heating element (102) that fits within the insulating substrate (106) and will contact or be in proximity to the component to be heated. The resistive conductor (502) may be bonded to the backing (508) using an adhesive, multiple fasteners, or other means. In one case, the resistive conductor (502) may be stitched to the backing (508), or the like. When the heating element (102) is placed on the substrate (106) (with or without the support (508)), the heating element (102) may be coated with one or more protective layers (108) if desired.

Alternatively, the resistive conductor (502) may be disposed directly on the inner surface (107) or the outer surface (109) of the substrate (106). For example, one or more protective layers (108) may be applied to the substrate (106). The resistive conductor (502) may be disposed within the protective layer (108). The one or more protective layers (108) may be applied over the resistive conductor (502), the support (508), if present, and a portion or all of the surface of the substrate (106) to seal the resistive conductor (502) to the substrate (106). Power and ground conductors (504) may be routed through openings in the substrate (106) or seams between sections of the substrate (106).

Indicators, such as LEDs, may be coupled in parallel with the resistive conductor (502) to indicate proper installation and operation. Cables, connectors, or other connecting devices may be bonded to the support (508) and used to couple the heating elements (102) to other heating elements (102). For example, as shown in the cross-sectional view of FIG. 6, multiple heating elements (102) may be coupled together in series or parallel to heat a larger surface area. A bus conductor (402) may run the length of a section of the heating and insulation system (100) and connect power and ground conductors (504) together within the section. Additional conductors (404) for power, ground, signal, etc. may also be run the length of the section of the system (100), may be installed midway through the section, and may be coupled using conductive couplers (406), etc. In some cases, the conductive coupler (406) may have access to the exterior of a section of the system (100) to supply power to a section or group of sections. For example, each end of a section of the system (100) may include a section coupler (408) for joining multiple sections together. FIG. 7 illustrates a perspective view of a straight section of an exemplary heating and insulation system (100). An exemplary integrated heating element (102) is depicted within protective insulation (104) and may be in contact with an item to be heated and insulated (e.g., a straight section of pipe).

Figures 8 and 9 illustrate two perspective views of exemplary applications of a heating and insulation system (100). The system (100) may be applied in multiple segments and may be custom manufactured to fit the component(s) to be insulated and heated. A connection (802) protrudes from the outer protective layer (108) or the substrate (106) and is coupled to the heating element (102) to supply energy to the heating element(s) (102). The connection (802) may include a power cable and/or plug, a data cable and/or plug, or the like. The connection (802) may be an assembly plug (e.g., such as plug (506) or other user-friendly plug), so that installation may be performed without the need for an electrician. The power requirement of the heating and insulation system (100) may be nominal 110 to 220 V, or other voltages may also be used if desired. At these voltages, 8 to 10 AWG conductors may be used to supply the system (100). Other sized conductors may be used for current draw if desired.

A variety of connectors may be used to couple power cables, data cables, etc., between sections (1010) of the system (100) and to power, data receiving components, etc., within the system (100) (i.e., components of the system (100) such as the heating element (102). Referring to FIGS. 10-15 , some connectors (1000) may be positioned in grooves (1002) or pockets (1004) along the outer surface (109) of a substrate (106) or a protective layer (108) (not shown). For example, the connectors (1000) may be embedded in an insulating substrate (106) or a protective layer (108) to provide some degree of insulation and/or protection. Connectors (1000) positioned at the ends of substrate sections (1010) may be joined together when positioning the inter-section sections (1010). For example, a male connector (1000) at the end of one section (1010) can be coupled to a female connector (1000) at the end of the next section (1010). The connector (1000) may be constructed and designed to be waterproof, as well as rated for outdoor use in harsh environments. The wire (1008) that couples the connector (1000) to the heating element (102) may also be installed in a groove (1002) or pocket (1004), or may be embedded within the substrate (106) or protective layer (108) (as illustrated in FIGS. 17-18 and 20-21). In various examples, the combination of protective insulation (104), heating element(s) (102), and wires, connectors, components, etc. (e.g., system (100)) may all be coated with one or more protective layers (108).

Referring to FIGS. 13-15 , in various implementations, the connector (1000) may also include other mating components in addition to a bus bar (1502). For example, the bus bar (1502) may be positioned within a groove (1002) or a pocket (1004), or may be embedded in the protective layer (108) or the substrate (106). The bus bar (1502) may include holes configured to connect conductors (1008) in two sections (1010) arranged end-to-end. The bus bar (1502) may be joined using screws, bolts, rivets, and other hardware. The control enclosure (1302) may also be integrated on or within the outer surface (109) of the section (1010) (the substrate (106) or the protective layer (108)). A control enclosure (1302) may be used to house a temperature control device or indicator, and may include sensors, probes, or other instrumentation. The control enclosure (1302) may be coupled to a connector (1000) and/or conductors (1008) (e.g., including power and/or data conductors) for power and/or data distribution/transmission to the enclosed components and instrumentation.

In various embodiments, the section (1010) can be molded to have a shape, size, and configuration suitable for various predetermined applications. In other words, the section (1010) (e.g., the substrate layer (106)) can be molded to have a shape, size, and configuration that closely matches the shape, size, and configuration of the component to be enclosed or surrounded by the protective insulation (104). In particular, the inner surface (107) of the section (1010) can closely match the outer surface of the component to be enclosed and protected. For example, the exemplary molded section (1010a) in FIG. 16 can be applied to cover a valve, and the exemplary molded section (1010b) in FIG. 19 can be applied to cover a 90-degree elbow. The two examples illustrated in FIGS. 16 and 19, while molded to serve two predetermined applications, are merely two examples of a variety of exemplary molded sections (1010), each with a potentially unique shape, size, and configuration. In other words, the molded sections (1010) can be completely customized to meet unique specifications. Unique customizations include custom support infrastructure embedded within each section (1010) to support the heating element(s) (102) and for control, data, power, etc. As illustrated in FIGS. 16-19 , the molded sections (1010) can include wires (1602) (or other conductors, data lines, control lines, optical fibers, shielding, ground planes, etc.) and cable management components (1604) (e.g., bands, clamps, couplers, looms, etc.) embedded within or between layers of the substrate (106) and/or protective layers (108), as well as couplers (1606) and connectors. In some cases, communication components (e.g., transmitters and/or receivers, modems, repeaters, amplifiers, global positioning satellite (GPS) components, etc.), sensors, instrumentation, etc., may also be included within the section (1010). Embedding the aforementioned components may provide protection from the elements and easy access within and from the exterior surface (109) (e.g., using a connector (1608)). As mentioned above, a coupler (408) at the end of the section (1010) may be joined by modularly joining the end-to-end sections (1010).

Representative process

FIG. 22 illustrates an exemplary process (2200) for implementing a technique and/or device related to providing a protective heating and insulation system (e.g., system (100)), according to various embodiments. The system includes protective insulation formed of at least one or two layers (e.g., protective insulation (104)) and at least one heating element (e.g., heating element (102)). The exemplary process (2200) is described with reference to FIGS. 1 through 21.

The order in which the processes are described is not intended to be construed as limiting, and any number of the described process blocks may be combined in any order to implement the process or alternative processes. Additionally, individual blocks may be deleted from the process without departing from the spirit and scope of the subject matter described herein. Furthermore, the process may be implemented using any suitable hardware, software, firmware, or any combination thereof without departing from the scope of the subject matter described herein.

At block (2202), the process includes providing a protective insulation system comprising an insulating substrate layer (e.g., substrate layer (106)) having a predetermined thickness and a predetermined density, the substrate layer having an outer surface and an inner surface defining a thickness of the substrate layer.

At block (2204), the process includes bonding or attaching a first heating element (e.g., heating element (102)) to an outer surface or an inner surface of a substrate layer, or embedding the first heating element within the substrate layer. The first heating element may be bonded, secured, or embedded in the substrate layer prior to installation of the substrate around the component to be protected/heated. In an embodiment, the process includes applying a first protective polymer layer (e.g., protective layer (108)) to the substrate and the first heating element. In another embodiment, the process includes applying a second protective polymer layer between the substrate and the first heating element. For example, the second protective layer may be applied to all or a portion of the substrate prior to bonding or securing the first heating element to the inner surface or the outer surface of the substrate.

In an embodiment, the process includes forming a substrate layer such that its inner surface conforms to the component to be encapsulated within the substrate layer. For example, the substrate layer may be formed such that its inner surface closely conforms to the shape and size of a straight pipe, an elbow pipe, a valve, a tank, etc. For example, the heating element is integrated into the substrate layer during its fabrication. This allows the heating element to be installed onto the component so that it is encapsulated within the substrate layer as the substrate layer is installed onto the component (a one-step installation process). Thus, the integration of the heating element (and its associated infrastructure) into the substrate layer reduces the technical skills required for installation, including the need for an electrical engineer.

In an embodiment, the process comprises placing one or more electrical conductors within a substrate or within a groove or within a pocket within the substrate and coupling the one or more electrical conductors to a first heating element.

In various embodiments, multiple substrates may be modularly joined together to cover a long pipe or something that may have angles and bends, and may also have valves, etc. The molded sections of the substrates may be modularly joined both physically and electrically, so that each section of the pipe (or other component to be protected) is covered by the substrate, and the heating element within each of the substrate sections is electrically powered by a continuous path. In an embodiment, the process includes coupling one or more electrical conductors of a first substrate to one or more electrical conductors of a second substrate and a second heating element integrated with the second substrate, via a first coupler embedded in the first substrate and a second coupler embedded in the second substrate. The coupler may have electrical connection features as well as physical connection features for one or more electrical connections. The one or more electrical connections may include power, ground, data, signal, communication, etc.

The embodiments of this disclosure have been described as illustrative, not limiting. Alternative embodiments will become apparent to those skilled in the art without departing from the scope of this disclosure. Skilled artisans may develop alternative means of implementing the aforementioned improvements without departing from the scope of this disclosure.

Certain features and sub-combinations are useful and may be used without reference to other features and sub-combinations and are considered within the scope of the claims. It is not necessary for all steps listed in the various figures to be performed in the specific order described.

conclusion

Although the embodiments of the present disclosure have been described in language specific to structural features and/or methodological acts, it should be understood that the embodiments are not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as representative forms of implementing the claims.

Claims (26)

As a protective insulating system (100),
An insulating substrate layer (106) having a predetermined thickness and a predetermined density, said substrate layer (106) having an outer surface (109) and an inner surface (107) defining a thickness of said substrate layer (106); and
A protective insulation system comprising a first heating element (102) bonded or bonded to the outer surface (109) or the inner surface (107) of the substrate layer (106) or embedded within the substrate layer (106). A protective insulation system according to claim 1, further comprising one or more additional heating elements electrically connected in series or parallel with the first heating element. A protective insulation system, further comprising a protective layer (108) surrounding the substrate layer in the first paragraph. A protective insulation system in accordance with claim 3, wherein the protective layer is adhered to the outer surface of the substrate layer. A protective insulation system in accordance with claim 3, wherein the protective layer is adhered to the inner surface of the substrate layer. A protective insulation system in accordance with claim 3, wherein the protective layer comprises a polyurea material that can be sprayed in a liquid state and cured in a solid state. A protective insulation system, further comprising a first protective polymer layer (108a) coating at least a portion of the inner surface of the substrate, in the first aspect. A protective insulation system in accordance with claim 7, wherein the first heating element is bonded or attached to the first protective polymer layer. A protective insulation system in accordance with claim 8, wherein the first heating element is coated with a second protective polymer layer (108b). A protective insulation system, wherein the first heating element is coated with a protective polymer layer (108) in the first embodiment. A protective insulation system, further comprising one or more electrical connectors (1000) embedded in the substrate layer, in the first aspect. A protective insulation system, further comprising one or more electrical connectors (1000) positioned within a groove (1002) or pocket (1004) of the substrate layer, in the first aspect. A protective insulation system, in accordance with claim 1, further comprising one or more electrical conductors (402, 404) embedded in the substrate layer. A protective insulation system, further comprising one or more electrical conductors (402, 404) arranged within a groove (1002) or pocket (1004) of the substrate layer, in the first aspect. A protective insulation system in accordance with claim 1, wherein the substrate layer comprises a light-weight foam material having a density of between 1 and 10 pounds per cubic foot. As a protective insulation system,
An insulating foam substrate (106) having a predetermined thickness and a predetermined density, said substrate (106) having an outer surface (109) and an inner surface (107) defining the thickness of said substrate (106);
a first heating element (102) integrated with the outer surface (109) or the inner surface (107) of the substrate (106); and
A protective insulation system comprising a protective polymer layer (108) coating the substrate (106) and the first heating element (102). A protective insulation system, further comprising one or more electrical conductors (112, 402, 404) arranged within the substrate (106) and configured to have access to the exterior of the substrate, in accordance with claim 16. A protective insulation system, further comprising one or more electrical connectors (402, 404) disposed within the substrate or within a groove or pocket of the substrate, in accordance with claim 16. A protective insulation system in accordance with claim 16, wherein the first heating element is bonded or attached to the substrate. A protective insulation system in accordance with claim 16, wherein the first heating element is embedded within the substrate. As a method,
A step of providing a protective insulation system (100) comprising an insulating substrate layer (106) having a predetermined thickness and a predetermined density, said substrate layer (106) having an outer surface (109) and an inner surface (107) defining a thickness of said substrate layer (106); and
A method comprising the step of bonding or attaching a first heating element (102) to the outer surface (109) or the inner surface (107) of the substrate layer (106) or embedding the first heating element (102) within the substrate layer (106). A method according to claim 21, further comprising the step of forming the substrate layer so that the inner surface conforms to the component to be wrapped within the substrate layer. A method according to claim 21, further comprising the step of applying a first protective polymer layer (108b) over the substrate and the first heating element. A method according to claim 23, further comprising the step of applying a second protective polymer layer (108a) between the substrate and the first heating element. A method according to claim 21, further comprising the steps of: arranging one or more electrical conductors (402, 404) within the substrate or within a groove (1002) or pocket (1004) of the substrate; and coupling the one or more electrical conductors to the first heating element. A method according to claim 25, wherein the substrate is a first substrate, and further comprising the steps of providing a second substrate and coupling one or more electrical conductors of the first substrate to one or more electrical conductors of the second substrate and a second heating element integrated with the second substrate via a first coupler (408) embedded in the first substrate and a second coupler (408) embedded in the second substrate.