[go: up one dir, main page]

KR910017913A - 금속 인쇄된 세라믹 팩키지의 제조방법 - Google Patents

금속 인쇄된 세라믹 팩키지의 제조방법 Download PDF

Info

Publication number
KR910017913A
KR910017913A KR1019900004318A KR900004318A KR910017913A KR 910017913 A KR910017913 A KR 910017913A KR 1019900004318 A KR1019900004318 A KR 1019900004318A KR 900004318 A KR900004318 A KR 900004318A KR 910017913 A KR910017913 A KR 910017913A
Authority
KR
South Korea
Prior art keywords
metal
manufacturing
ceramic package
printed
printed ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019900004318A
Other languages
English (en)
Other versions
KR920002589B1 (ko
Inventor
정태영
Original Assignee
한형수
삼성코닝 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한형수, 삼성코닝 주식회사 filed Critical 한형수
Priority to KR1019900004318A priority Critical patent/KR920002589B1/ko
Priority to US07/553,634 priority patent/US5114642A/en
Priority to JP2224119A priority patent/JPH03283452A/ja
Publication of KR910017913A publication Critical patent/KR910017913A/ko
Application granted granted Critical
Publication of KR920002589B1 publication Critical patent/KR920002589B1/ko
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5133—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal with a composition mainly composed of one or more of the refractory metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Powder Metallurgy (AREA)

Abstract

내용 없음

Description

금속 인쇄된 세라믹 팩키지의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 세라믹 패키지의 소결온도에 따른 표면저항의 변화를 나타낸 그래프.

Claims (5)

  1. 세라믹 그린시트상에 금속 인쇄하여 세라믹과 동시 소성으로 금속 인쇄된 세라믹 패키지를 제조하는데 있어서, 미세한 금속 분말과 굵은 금속 분말의 혼합 분말을 산소분압 및 이슬점을 조절하면서 예비열처리함으로써 페이스트화하여 인쇄한 후 세라믹과 동시 소성하는 것을 특징으로 하는 금속 인쇄된 세라믹 팩키지의 제조방법.
  2. 제1항에 있어서, 상기 미세한 금속분말의 입경이 0.5~1.5㎛이고 상기 굵은 금속 분말의 입경이 2~5㎛인 것을 특징으로 하는 금속 인쇄 세라믹 팩키지의 제조방법.
  3. 제1항에 있어서, 상기 산소의 분압 조절범위가 10-9~10-50atm인 것을 특징으로 하는 금속 인쇄 세라믹 팩키지의 제조방법.
  4. 제1항에 있어서, 상기 예비열처리 온도범위가 100℃~1400℃인 것을 특징으로 하는 금속 인쇄 세라믹 팩키지의 제조방법.
  5. 제4항에 있어서, 상기 예비열처리 온도가 약 800℃인 것을 특징으로 하는 금속 인쇄 세라믹 팩키지의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900004318A 1990-03-30 1990-03-30 금속 인쇄된 세라믹 팩키지의 제조방법 Expired KR920002589B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019900004318A KR920002589B1 (ko) 1990-03-30 1990-03-30 금속 인쇄된 세라믹 팩키지의 제조방법
US07/553,634 US5114642A (en) 1990-03-30 1990-07-18 Process for producing a metal-screened ceramic package
JP2224119A JPH03283452A (ja) 1990-03-30 1990-08-24 金属印刷を施したセラミックパッケージの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900004318A KR920002589B1 (ko) 1990-03-30 1990-03-30 금속 인쇄된 세라믹 팩키지의 제조방법

Publications (2)

Publication Number Publication Date
KR910017913A true KR910017913A (ko) 1991-11-05
KR920002589B1 KR920002589B1 (ko) 1992-03-30

Family

ID=19297507

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900004318A Expired KR920002589B1 (ko) 1990-03-30 1990-03-30 금속 인쇄된 세라믹 팩키지의 제조방법

Country Status (3)

Country Link
US (1) US5114642A (ko)
JP (1) JPH03283452A (ko)
KR (1) KR920002589B1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753972A (en) * 1993-10-08 1998-05-19 Stratedge Corporation Microelectronics package
US5736783A (en) * 1993-10-08 1998-04-07 Stratedge Corporation. High frequency microelectronics package
US5465008A (en) * 1993-10-08 1995-11-07 Stratedge Corporation Ceramic microelectronics package
US5783113A (en) * 1997-03-27 1998-07-21 International Business Machines Corporation Conductive paste for large greensheet screening including high thixotropic agent content
US6117367A (en) * 1998-02-09 2000-09-12 International Business Machines Corporation Pastes for improved substrate dimensional control
US6217821B1 (en) * 1999-06-02 2001-04-17 E. I. Du Pont De Nemours And Company Method of forming distortion-free circuits
US7056468B2 (en) * 2000-06-15 2006-06-06 Paratek Microwave, Inc. Method for producing low-loss tunable ceramic composites with improved breakdown strengths
US6737179B2 (en) 2000-06-16 2004-05-18 Paratek Microwave, Inc. Electronically tunable dielectric composite thick films and methods of making same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US4109377A (en) * 1976-02-03 1978-08-29 International Business Machines Corporation Method for preparing a multilayer ceramic
US4234367A (en) * 1979-03-23 1980-11-18 International Business Machines Corporation Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
JPS59995A (ja) * 1982-06-16 1984-01-06 富士通株式会社 銅導体多層構造体の製造方法
US4971738A (en) * 1988-07-18 1990-11-20 International Business Machines Corporation Enhanced removal of carbon from ceramic substrate laminates

Also Published As

Publication number Publication date
KR920002589B1 (ko) 1992-03-30
US5114642A (en) 1992-05-19
JPH03283452A (ja) 1991-12-13

Similar Documents

Publication Publication Date Title
ES2071788T3 (es) Composiciones en pasta mejoradas.
KR830010213A (ko) 다이아몬드 소결체의 제조방법
KR900003914A (ko) 낮은 유전 상수 조성물
KR910017913A (ko) 금속 인쇄된 세라믹 팩키지의 제조방법
US4243710A (en) Thermoplastic electrode ink for the manufacture of ceramic multi-layer capacitor
KR910000576A (ko) 소성 패턴 시트 및 소성 패턴의 형성방법
JPS5689984A (en) Thermal transfer recording ink sheet
EP0351450A3 (en) Radiowave absorber and its manufacturing process
KR830006781A (ko) 후막(厚膜)저항회로
KR880010448A (ko) 후막 전자 물질
KR880011829A (ko) 초전도 세라믹스의 제조방법
EP0172764A3 (en) Ceramic sintered body
KR970009481A (ko) 다층 세라믹 회로 기판의 제조방법
KR920000661A (ko) 세라믹 다층 팩키지의 제조방법
Bose et al. Some applications of CVD coated microencapsulated powders
JPS5512327A (en) Method of fabricating heat pipe wick
KR890016331A (ko) 적외선 방사 세라믹재 버너노즐의 제조방법
Walder et al. Industrial Production and Application of High Porosity Metal Felts
JPS5296909A (en) Production of sintered product
JPS55158549A (en) Production of sensor
Adams et al. Optimized Atmospheres for Sintering Brass
JPS6453402A (en) Manufacture of oxide superconducting coil
KR900014277A (ko) 고효율의 원적외선 방사 세라믹스 분말체의 제조방법
JPS54149565A (en) Manufacture of heater for electron tube
Garg et al. Effects of source of powder and atmosphere composition on sintering of bronze components

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

FPAY Annual fee payment

Payment date: 20041231

Year of fee payment: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20060331

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20060331

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000