KR950006648Y1 - Catch cup cover of spin coating apparatus - Google Patents

Abstract

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Description

Spin catch cup cover for semiconductor manufacturing

1 is a cross-sectional view of a conventional spin section

2 is a cross-sectional view of the spin portion of the present invention

3 is a partially cutaway perspective view of the spin catch plate of the present invention

* Explanation of symbols for main parts of the drawings

1: Catch Cup 7: Catch Cup Cover

110: auxiliary cup 111: drain hole

The present invention is a device for applying a photoresist to a semiconductor wafer, in which a certain amount of photoresist is sprayed onto the wafer on a vacuum chuck from the nozzle, and then the sprinkled photoresist is contaminated onto the wafer when the spin chuck rotates at high speed. The present invention relates to a spin cup cover for semiconductor manufacturing, in which a dunk is integrally formed on the catch cup cover to prevent contamination of various components due to photoresist leakage during purging for all preconditions.

In general, SVG coater equipment for coating photoresist on wafer during semiconductor manufacturing is used for loader, HMDS oven, chill plate, spin part, hot plate oven, and unloader. (UNLOADER). The loader stores the wafers, takes them out one by one, and delivers them to the HMOS oven. The HMOS oven spreads the HMDS solution on the wafer and raises the temperature so that the photoresist spreads well on the wafer.

The cooling plate cools the wafer having a raised temperature to an ambient temperature (23 ° C.). The spin portion applies a photoresist on the wafer, which is then sprayed on the wafer and then rotated at high speed to adjust the photoresist to spread on the wafer with a constant thickness. The heating plate oven is usually heated to about 100 ℃ to cure the photosensitive liquid, the unloader is to store the wafer cured photosensitive liquid. At this time, as the nozzle for dispensing the photosensitive liquid in the spin portion is divided into two types of kcal. The two nozzles allow the use of chemicals with different properties. Therefore, the operator first selects the desired specification on the equipment and purges the nozzle of the selected specification. In other words, before applying the photoresist to the wafer, the chemicals in the photoresist supply line are stagnated out of the nozzle. This process is pushed out of the nozzle several times in order to make PREDISPENSE or in the presence of particles in the photoresist (PARTICLE).

This can be done in several cases, such as chemical dispensing, for example when a chemical is changed due to a change in the specifications on the equipment, or when the filter is cleaned by replacing the filter at PM. To do this, the catch cup (including the catch cup cover) receives the chemicals that are pushed out of the photoresist and other nozzles and discharges them out of the equipment. The catch cups that play this role are divided into two types: one dunker and one catch cup.

At this time, the dunker receives photoresist and chemicals and drains them out of the equipment. The catch cup fixes the wafer and is covered with the catch cup cover to facilitate the injection of the photoresist and prevents the discharge of foreign substances to the outside due to internal cleaning.

For example, as shown in the first diagram, the spin portion 10 is rotated by the motor 2 in the center of the catch cup 1, and a spin chuck 4 is installed to suck the wafer 3 in the air. The rinse nozzle 5 is provided at the catch cup 1 portion below the spin chuck 4.

The catch cup cover 7 having a hole 6 through which the wafer 3 is allowed to enter and exit the catch cup 1 is installed, and the catch cup cover 7 is provided with a dunker 8 located therein, and the dumper 8 ) And the catch cup 1 is connected to the drain port 9, the discharge port (9 ') is provided next to the drain port (9).

The dispensing arm 12 moved by the dispensing bar 11 is adhered to an arbitrary portion of the catch cup cover 7, and the dispensing arm 12 is provided with two nozzles 13.

To explain the operation, when the wafer 3 arrives at the spin section 10 and is positioned on the spin chuck 4, the wafer is held by using a vacuum (not shown in the vacuum generating means). In this state, the dispensing arm 12 moves from the original position to the center position and then sprays the photosensitive liquid onto the wafer 3 through the nozzle 13. Next, since the photosensitive liquid (Chemical) is little by little in the nozzle 13 of the dispense arm 12, the photosensitive liquid falls into the dunker 8 and exits to the drain hole 9 line when it is warped to the portion of the dunker 8. After the high speed of rotation through the motor (2) in order to make the photosensitive liquid to a certain thickness, the wafer 3 is transferred to the next heating plate oven.

In this case, since the photoresist is generally high in viscosity over 20 CP (Centi Poise), it hardens within an hour in the dunker (8) portion, and if so hardened, the next photoresist is difficult to be discharged to the drain hole (9), and also a preliminary dispense Also during the initial preparation operation of dispensing the photoresist 20 times from the dunker 8 part before turning the wafer 3), it also hardens after a period of time by the discharged photoresist and is removed separately during the next process. There is inconvenience. In other words, splash back or photoresist solution leakage may cause wafer contamination and various component failures, resulting in problems such as wafer processing reprocessing and component replacement.

Specifically, if the fixed position of the dunker 8 is unstable and does not match the drain 9 line (the figure shows that the dunker 8 and the drain 9 are integrated but are actually separated) Apart from the drain (9) line, photoresist and other chemicals can flow elsewhere to contaminate the equipment, as well as damage the wires and tubing, causing problems. In addition, after a certain period of time, the worker cleans the catch cup (1) and the dunker (8), but after careful cleaning in the process of returning to the original position occurs a number of problems as described above.

In addition, as a countermeasure against this, pre-work cleaning and sample wafers can be checked whether or not a splashback phenomenon has occurred. However, the checking time and accurate judgment of the operator are required, resulting in a lot of human time and economic loss.

The present invention is to solve this problem, by forming a secondary cup integrally formed in the catch cup cover to remove the solution leakage of the photoresist during the purge for the pre-condition before the photoresist coating in the semiconductor manufacturing spin portion, and directly discharged, It is characterized in that the operator can remove the inspection before cleaning and sample wafer.

That is, the catch cup cover is provided in the catch cup, the spin portion for semiconductor manufacturing in which a separate dunker is connected to the drain hole of the catch cup, and the auxiliary cup is formed integrally with the catch cup cover at the position of the catch, and the catch cup under the auxiliary cup A drain hole is formed in the cover portion.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the same parts as in the related art will be denoted by the same reference numerals, and redundant description thereof will be omitted. 2 is a cross-sectional view of a state of use of the present invention, in which the catch cup cover 7 is installed in the catch cup 1, and a spin portion for manufacturing a semiconductor in which a separate dunker 8 is connected to the drain hole 9 of the catch cup 1. In the construction, the auxiliary cup 110 is integrally formed with the catch cup cover 7 at the position of the dunker 8, and the drain cup 111 is formed at the catch cup cover 7 portion of the lower portion of the auxiliary cup 110. It is done.

When using this, the wafer 3 is placed on the spin chuck 4, the dispense arm 12 is moved to the dotted line position in FIG. 2, and the photosensitive liquid is sprayed onto the wafer 3. Subsequently, the dispensing arm 12 is returned to the solid line position, the photosensitive liquid on the wafer 3 is uniformly applied by the rotation of the motor 2, and then the wafer 3 is transferred to the heating plate oven of the next step.

In this case, even when the dispensing arm 12 is replaced, even if the photosensitive liquid buried in the nozzle 13 falls into the auxiliary cup 110, it flows directly into the catch cup 1 through the drain hole 111 and the wafer 3. After discharge, the air is cleaned by the rinse nozzle 5 to be easily discharged into the drain 9 or the discharge port 9 'so that the inside of the catch cup 1 is always kept clean.

This is because the drain port 9 is directly connected to the bottom of the catch cup 1, the drain port 9 line is shorter than the drain port line 9 by the outer dumper 8, so that the discharge time is shortened so that there is no blockage.

As shown in FIG. 3, the catch cup cover 7 has an auxiliary cup 110 integrated therein, and a portion of the catch cup cover 7 below the auxiliary cup 110 passes through the auxiliary cup 110. The cylinder 111 is formed, and when the photoresist is sprayed, the photoresist which falls when it is returned to its original position, for preliminary dispensing, or when the particle is present in the photoresist is sprayed several times with the nozzle 13 to drain the auxiliary cup 110 ( 111, the auxiliary cup 110 is integrally formed on the catch cup cover 7 to prevent contamination of the photosensitive liquid leakage due to the change of position, and the drain hole 9 is integral to the catch cup 1. Since the catch cup cover 7 is opened and repositioned, there is no need to specifically align the drain hole 9.

As described above, the present invention can maintain the correct position of the auxiliary cup integrally with the catch cup cover, so that the photoresist can be accurately received by dropping the photoresist, thereby preventing damage to various parts due to photoresist leakage, and inside the catch cup. Cleaning can be done perfectly and there are few errors, thus eliminating the need for inspecting samples with lots and chambers, which reduces labor.

Claims (2)

The catch cup cover 7 is provided in the catch cup 1, and in forming a spin part for manufacturing a semiconductor in which a separate dunker 8 of the drain hole 9 of the catch cup 1 is connected, the auxiliary part is provided at the position of the dunker 8. The cup 110 is integrally formed with the catch cup cover 7, and the catch cup cover 7 portion below the auxiliary cup 110 is formed by forming a drain hole 111 penetrating the auxiliary cup 110. Spin portion catch cup cover for semiconductor manufacturing. 2. The spin cup catch cup cover for semiconductor manufacturing according to claim 1, wherein a vertically formed inner circumferential wall (6 ') is provided at an inner circumference of the catch cup cover (7).